U.S. patent application number 12/824793 was filed with the patent office on 2010-10-21 for semiconductor manufacturing apparatus and pattern formation method.
This patent application is currently assigned to Panasonic Coporation. Invention is credited to Masayuki Endo, Masaru Sasago.
Application Number | 20100265477 12/824793 |
Document ID | / |
Family ID | 35094478 |
Filed Date | 2010-10-21 |
United States Patent
Application |
20100265477 |
Kind Code |
A1 |
Endo; Masayuki ; et
al. |
October 21, 2010 |
SEMICONDUCTOR MANUFACTURING APPARATUS AND PATTERN FORMATION
METHOD
Abstract
In a pattern formation method employing immersion lithography,
after a resist film is formed on a wafer, pattern exposure is
performed by selectively irradiating the resist film with exposing
light with a liquid including an unsaturated aliphatic acid, such
as sunflower oil or olive oil including oleic acid, provided on the
resist film. After the pattern exposure, the resist film is
developed so as to form a resist pattern made of the resist
film.
Inventors: |
Endo; Masayuki; (Osaka,
JP) ; Sasago; Masaru; (Osaka, JP) |
Correspondence
Address: |
MCDERMOTT WILL & EMERY LLP
600 13TH STREET, NW
WASHINGTON
DC
20005-3096
US
|
Assignee: |
Panasonic Coporation
Osaka
JP
|
Family ID: |
35094478 |
Appl. No.: |
12/824793 |
Filed: |
June 28, 2010 |
Related U.S. Patent Documents
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Application
Number |
Filing Date |
Patent Number |
|
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11143667 |
Jun 3, 2005 |
7771918 |
|
|
12824793 |
|
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Current U.S.
Class: |
355/30 |
Current CPC
Class: |
G03F 7/70891 20130101;
G03F 7/2041 20130101; G03F 7/70341 20130101 |
Class at
Publication: |
355/30 |
International
Class: |
G03B 27/52 20060101
G03B027/52 |
Foreign Application Data
Date |
Code |
Application Number |
Jun 9, 2004 |
JP |
2004-171589 |
Claims
1-16. (canceled)
17. A semiconductor manufacturing apparatus comprising: an exposure
unit for performing pattern exposure with a liquid provided between
a resist film and an exposure lens; a liquid supplying section for
supplying said liquid onto said resist film; a liquid discharging
section for discharging said liquid provided on said resist film
from said resist film; a temperature measuring unit for measuring a
temperature of said liquid and an atmosphere temperature of said
exposure unit; an air conditioning unit for adjusting said
atmosphere temperature; and a temperature control unit for
controlling said air conditioning unit on the basis of said
temperature of said liquid and said atmosphere temperature measured
by said temperature measuring unit in such a manner that said
atmosphere temperature is lower than said temperature of said
liquid.
18. The semiconductor manufacturing apparatus of claim 17, wherein
said exposure unit and said air conditioning unit are provided
within one chamber.
19. A semiconductor manufacturing apparatus comprising: a wafer
holding section; an exposure unit for performing pattern exposure
with a liquid provided between a resist film formed on said wafer
and an exposure lens; a liquid supplying section for supplying said
liquid onto said resist film; a liquid discharging section for
discharging said liquid provided on said resist film from said
resist film; a temperature measuring unit for measuring a
temperature of said liquid and a temperature of said wafer holding
section; and a cooling section for cooling said wafer holding
section.
20. The semiconductor manufacturing apparatus of claim 19, further
comprising a temperature control unit for controlling a temperature
of said cooling section on the basis of said temperature of said
liquid and said temperature of said wafer holding section measured
by said temperature measuring unit.
21. The semiconductor manufacturing apparatus of claim 17, wherein
said liquid is water or perfluoropolyether.
22. The semiconductor manufacturing apparatus of claim 19, wherein
said liquid is water or perfluoropolyether.
23. The semiconductor manufacturing apparatus of claim 17, wherein
a light source of said exposure unit is KrF excimer laser, Xe2
laser, ArF excimer laser, F2 laser, KrAr laser or Ar2 laser.
24. The semiconductor manufacturing apparatus of claim 19, wherein
a light source of said exposure unit is KrF excimer laser, Xe2
laser, ArF excimer laser, F2 laser, KrAr laser or Ar2 laser.
25. (canceled)
Description
CROSS-REFERENCE TO RELATED APPLICATIONS
[0001] This application claims priority under 35 U.S.C. .sctn.119
on Patent Application No. 2004-171589 filed in Japan on Jun. 9,
2004, the entire contents of which are hereby incorporated by
reference.
BACKGROUND OF THE INVENTION
[0002] The present invention relates to a semiconductor
manufacturing apparatus for use in fabrication process or the like
for semiconductor devices and a pattern formation method using the
same.
[0003] In accordance with the increased degree of integration of
semiconductor integrated circuits and downsizing of semiconductor
devices, there are increasing demands for further rapid development
of lithography technique. Currently, pattern formation is carried
out through photolithography using exposing light of a mercury
lamp, KrF excimer laser, ArF excimer laser or the like, and use of
F.sub.2 laser lasing at a shorter wavelength is being examined.
However, since there remain a large number of problems in exposure
systems and resist materials, photolithography using exposing light
of a shorter wavelength has not been put to practical use.
[0004] In these circumstances, immersion lithography has been
recently proposed for realizing further refinement of patterns by
using conventional exposing light (for example, see M. Switkes and
M. Rothschild, "Immersion lithography at 157 nm", J. Vac. Sci.
Technol., Vol. B19, p. 2353 (2001)).
[0005] In the immersion lithography, a region in an exposure system
sandwiched between a projection lens and a resist film formed on a
wafer is filled with a liquid having a refractive index n (whereas
n>1) and therefore, the NA (numerical aperture) of the exposure
system has a value nNA. As a result, the resolution of the resist
film can be improved.
[0006] Now, a conventional pattern formation method employing the
immersion lithography will be described with reference to FIGS. 6A
through 6D.
[0007] First, a positive chemically amplified resist material
having the following composition is prepared:
[0008] Base polymer:
poly((norbornene-5-methylene-t-butylcarboxylate) (50 mol %)-(maleic
anhydride) (50 mol %)) . . . 2 g
[0009] Acid generator: triphenylsulfonium nonaflate . . . 0.06
g
[0010] Quencher: triethanolamine . . . 0.002 g
[0011] Solvent: propylene glycol monomethyl ether acetate . . . 20
g
[0012] Next, as shown in FIG. 6A, the aforementioned chemically
amplified resist material is applied on a substrate 1 so as to form
a resist film 2 with a thickness of 0.35 .mu.m.
[0013] Then, as shown in FIG. 6B, with a liquid (water) 3 whose
temperature is room temperature of, for example, approximately
23.degree. C. provided between the resist film 2 and a projection
lens 5, pattern exposure is carried out by irradiating the resist
film 2 with exposing light 4 of ArF excimer laser with NA of 0.68
through a mask.
[0014] After the pattern exposure, as shown in FIG. 6C, the resist
film 2 is baked with a hot plate at a temperature of 105.degree. C.
for 60 seconds, and the resultant resist film is developed with a
tetramethylammonium hydroxide developer. In this manner, a resist
pattern 2a made of an unexposed portion of the resist film 2 is
formed as shown in FIG. 6D.
SUMMARY OF THE INVENTION
[0015] As shown in FIG. 6D, however, the resist pattern 2a formed
by the conventional pattern formation method employing the
immersion lithography is in a defective shape.
[0016] The present inventors have variously examined the reason why
the resist pattern formed by the conventional immersion lithography
is in a defective shape, resulting in finding the following: The
immersion liquid 3 evaporates during the exposure, and hence, an
air space is formed between the liquid 3 and the projection lens 5.
This air space varies the refractive index of the liquid 3, so that
given resolution cannot be attained. As a result, the resist
pattern is formed in a defective shape.
[0017] Accordingly, when the exposure is performed through the
immersion liquid partially evaporated, the resist pattern is formed
in a defective shape, and when the resist pattern in such a
defective shape is used for etching, a pattern obtained from an
etched film is also in a defective shape. As a result, the
productivity and yield of fabrication process for semiconductor
devices are lowered.
[0018] In consideration of the aforementioned conventional problem,
an object of the invention is forming a resist pattern in a good
shape through the immersion lithography.
[0019] In order to achieve the object, in a pattern formation
method employing the immersion lithography according to the
invention, a liquid having a composition minimally evaporating is
used as the immersion liquid, or the immersion liquid is provided
in an atmosphere in which it minimally evaporates during exposure.
Also, in a semiconductor manufacturing apparatus according to the
invention, pattern exposure is carried out in an atmosphere in
which the immersion liquid minimally evaporates during
exposure.
[0020] Specifically, the first pattern formation method of this
invention includes the steps of forming a resist film on a
substrate; performing pattern exposure by selectively irradiating
the resist film with exposing light with a liquid including an
unsaturated aliphatic acid provided on the resist film; and forming
a resist pattern by developing the resist film after the pattern
exposure.
[0021] In the first pattern formation method, the immersion liquid
minimally evaporates owing to the unsaturated aliphatic acid
included therein. Therefore, abnormality of the refractive index or
the like otherwise caused by the evaporation of the immersion
liquid during exposure can be prevented, and the liquid keep a
desired refractive index (exposure characteristic) during the
exposure. As a result, the resist pattern can be formed in a good
shape through the immersion lithography.
[0022] The present inventors have found that an unsaturated
aliphatic acid has a high moisture retention function because it is
highly lipidic. This moisture retention function is attained by a
function derived from a double or triple bond of carbons in the
unsaturated aliphatic acid or a function derived from a carboxylic
acid group. The double or triple bond of carbons is, in a molecule
bonded through a single bond, in a state where electrons are
partially collected between carbon atoms in particular. Also, a
double bond between carbon and oxygen included in a carboxylic acid
group is a double bond with oxygen having higher electronegativity
than carbon, and hence attracts more electrons than a double bond
of carbons, and therefore, it is in a state with high ionicity. As
a result, an interaction is easily caused even with a molecule or a
substituent having low ionicity, and an interaction is particularly
easily caused with a hydroxyl group included in the immersion
liquid. Accordingly, the unsaturated aliphatic acid has a high
moisture retention function and can suppress the evaporation of the
immersion liquid.
[0023] The unsaturated aliphatic acid preferably has a structure in
which the double or triple bond of carbons and a carbonyl group
derived from carboxylic acid are comparatively close to each other.
When the unsaturated aliphatic acid has such a structure in which
the double or triple bond and the carbonyl group are close to each
other, plenty of electrons present in the bond therebetween can be
shared as shown in Chemical Formula I below. Therefore, the state
with ionicity is made more stable, so as to increase the moisture
retention function.
##STR00001##
[0024] The second pattern formation method of this invention
includes the steps of forming a resist film on a substrate;
performing pattern exposure by selectively irradiating the resist
film with exposing light with a liquid provided on the resist film;
and forming a resist pattern by developing the resist film after
the pattern exposure, and a temperature of an exposure atmosphere
is lower than a temperature of the liquid in the step of performing
pattern exposure.
[0025] In the second pattern formation method, since the
temperature of the exposure atmosphere is lower than that of the
liquid in the step of performing pattern exposure, the saturated
vapor pressure (the maximum vapor pressure) of the exposure
atmosphere is lowered. Therefore, the immersion liquid minimally
evaporates, and hence, the abnormality of the refractive index or
the like otherwise caused by the evaporation of the immersion
liquid during the exposure can be prevented, so as to keep a
desired refractive index. As a result, the resist pattern can be
formed in a good shape through the immersion lithography.
[0026] The third pattern formation method of this invention
includes the steps of forming a resist film on a substrate;
performing pattern exposure by selectively irradiating the resist
film with exposing light with a liquid provided on the resist film
and with the substrate cooled; and forming a resist pattern by
developing the resist film after the pattern exposure.
[0027] In the third pattern formation method, since the pattern
exposure is performed with the liquid provided on the resist film
and with the substrate cooled, the liquid thus cooled minimally
evaporates. Therefore, the abnormality of the refractive index or
the like otherwise caused by the evaporation of the immersion
liquid during the exposure can be prevented, so as to keep a
desired refractive index. As a result, the resist pattern can be
formed in a good shape through the immersion lithography.
[0028] In the first pattern formation method, the unsaturated
aliphatic acid may be oleic acid
(CH.sub.3--(CH.sub.2).sub.7--CH.dbd.CH--(CH.sub.2).sub.7--COOH).
[0029] In this case, the oleic acid can be olive oil, safflower
oil, sunflower oil or canola oil. The content of the unsaturated
aliphatic acid in the liquid can be not less than 0.01 wt % and not
more than 5 wt %, which does not limit the invention.
[0030] In the second pattern formation method, the temperature of
the exposure atmosphere is preferably higher than 0.degree. C. and
lower than 23.degree. C.
[0031] In the third pattern formation method, a temperature of the
cooled substrate is preferably lower than a temperature of an
exposure atmosphere.
[0032] In this case, the temperature of the exposure atmosphere is
preferably higher than 0.degree. C. and lower than 23.degree.
C.
[0033] In each of the first through third pattern formation
methods, the liquid can be water or perfluoropolyether.
[0034] Furthermore, in each of the first through third pattern
formation methods, the immersion liquid may include an additive.
For example, in the case where cesium sulfate (CsSO.sub.4) or ethyl
alcohol (C.sub.2H.sub.5OH) is used as an additive for increasing
the refractive index of the liquid, if the additive included in the
liquid evaporates or volatiles, the variation in the refractive
index may more harmfully affect the exposure characteristic, and
therefore, the present invention is extremely effective in such a
case.
[0035] The first semiconductor manufacturing apparatus of this
invention includes an exposure unit for performing pattern exposure
with a liquid provided between a resist film and an exposure lens;
a liquid supplying section for supplying the liquid onto the resist
film; a liquid discharging section for discharging the liquid
provided on the resist film from the resist film; a temperature
measuring unit for measuring a temperature of the liquid and an
atmosphere temperature of the exposure unit; an air conditioning
unit for adjusting the atmosphere temperature; and a temperature
control unit for controlling the air conditioning unit on the basis
of the temperature of the liquid and the atmosphere temperature
measured by the temperature measuring unit in such a manner that
the atmosphere temperature is lower than the temperature of the
liquid.
[0036] In the first semiconductor manufacturing apparatus, since
the saturated vapor pressure of the exposure atmosphere is lowered,
the immersion liquid minimally evaporates. Therefore, the
abnormality of the refractive index or the like otherwise caused by
the evaporation of the immersion liquid during the exposure can be
prevented, so as to keep a desired refractive index. As a result,
the resist pattern can be formed in a good shape through the
immersion lithography.
[0037] In the first semiconductor manufacturing apparatus, the
exposure unit and the air conditioning unit are preferably provided
within one chamber.
[0038] The second semiconductor manufacturing apparatus of this
invention includes a wafer holding section; an exposure unit for
performing pattern exposure with a liquid provided between a resist
film formed on the wafer and an exposure lens; a liquid supplying
section for supplying the liquid onto the resist film; a liquid
discharging section for discharging the liquid provided on the
resist film from the resist film; a temperature measuring unit for
measuring a temperature of the liquid and a temperature of the
wafer holding section; and a cooling section for cooling the wafer
holding section.
[0039] In the second semiconductor manufacturing apparatus, since
the immersion liquid is cooled through the wafer holding section
cooled by the cooling section, the cooled liquid minimally
evaporates. Therefore, the abnormality of the refractive index or
the like otherwise caused by the evaporation of the immersion
liquid during the exposure can be prevented, so as to keep a
desired refractive index. As a result, the resist pattern can be
formed in a good shape through the immersion lithography.
[0040] The second semiconductor manufacturing apparatus preferably
further includes a temperature control unit for controlling a
temperature of the cooling section on the basis of the temperature
of the liquid and the temperature of the wafer holding section
measured by the temperature measuring unit.
[0041] In the first or second semiconductor manufacturing
apparatus, the liquid may be water or perfluoropolyether.
[0042] In each of the first through third pattern formation methods
and the first and second semiconductor manufacturing apparatuses, a
light source of the exposure unit can be KrF excimer laser,
Xe.sub.2 laser, ArF excimer laser, F.sub.2 laser, KrAr laser or
Ar.sub.2 laser.
BRIEF DESCRIPTION OF THE DRAWINGS
[0043] FIGS. 1A, 1B, 1C and 1D are cross-sectional views for
showing procedures in a pattern formation method according to
Embodiment 1 of the invention;
[0044] FIG. 2 is a schematic cross-sectional view of a principal
part of a semiconductor manufacturing apparatus according to
Embodiment 2 of the invention;
[0045] FIGS. 3A, 3B, 3C and 3D are cross-sectional views for
showing procedures in a pattern formation method according to
Embodiment 2 of the invention;
[0046] FIG. 4 is a schematic cross-sectional view of a principal
part of a semiconductor manufacturing apparatus according to
Embodiment 3 of the invention;
[0047] FIGS. 5A, 5B, 5C and 5D are cross-sectional views for
showing procedures in a pattern formation method according to
Embodiment 3 of the invention; and
[0048] FIGS. 6A, 6B, 6C and 6D are cross-sectional views for
showing procedures in a conventional pattern formation method.
DETAILED DESCRIPTION OF THE INVENTION
Embodiment 1
[0049] Now, a pattern formation method according to Embodiment 1 of
the invention will be described with reference to FIGS. 1A through
1D.
[0050] First, a positive chemically amplified resist material
having the following composition is prepared:
[0051] Base polymer:
poly((norbornene-5-methylene-t-butylcarboxylate) (50 mol %)-(maleic
anhydride) (50 mol %)) . . . 2 g
[0052] Acid generator: triphenylsulfonium nonaflate . . . 0.06
g
[0053] Quencher: triethanolamine . . . 0.002 g
[0054] Solvent: propylene glycol monomethyl ether acetate . . . 20
g
[0055] Next, as shown in FIG. 1A, the aforementioned chemically
amplified resist material is applied on a wafer 101 so as to form a
resist film 102 with a thickness of 0.35 .mu.m.
[0056] Then, as shown in FIG. 1B, a liquid 103 that contains 1 wt %
of sunflower oil including oleic acid, that is, an unsaturated
aliphatic acid, is provided between the resist film 102 and a
projection lens 105. Under this condition, pattern exposure is
carried out by irradiating the resist film 102 through a mask (not
shown) with exposing light 104 of ArF excimer laser with NA of
0.68. At this point, the temperature of the liquid 103 is set to
room temperature of, for example, approximately 23.degree. C.
[0057] After the pattern exposure, as shown in FIG. 1C, the resist
film 102 is baked with a hot plate at a temperature of 105.degree.
C. for 60 seconds, and thereafter, the resultant resist film 102 is
developed with a 2.38 wt % tetramethylammonium hydroxide developer.
In this manner, a resist pattern 102a made of an unexposed portion
of the resist film 102 and having a line width of 0.09 .mu.m is
formed in a good shape as shown in FIG. 1D.
[0058] In this manner, in the pattern formation method of
Embodiment 1, the sunflower oil including oleic acid, that is, an
unsaturated aliphatic acid, is contained in the immersion liquid
103, and therefore, the liquid 103 minimally evaporates owing to
the moisture retention function of the unsaturated aliphatic acid.
Therefore, no air space is formed in the liquid 103 provided
between the resist film 102 and the projection lens 105.
Accordingly, abnormality of the refractive index or the like of the
liquid 103 otherwise caused by an air space can be avoided, and
hence, the liquid 103 can keep a desired exposure characteristic.
As a result, the resist pattern can be formed in a good shape
through the immersion lithography.
[0059] As the oleic acid corresponding to the unsaturated aliphatic
acid, olive oil, safflower oil, canola oil or the like can be used
instead of the sunflower oil. The content of the unsaturated
aliphatic acid in the liquid 103 may be not less than 0.01 wt % and
not more than 5 wt %, which does not limit the invention.
Embodiment 2
[0060] A semiconductor manufacturing apparatus and a pattern
formation method using the same according to Embodiment 2 of the
invention will now be described with reference to the accompanying
drawings.
[0061] FIG. 2 schematically shows the cross-sectional structure of
a principal part of the semiconductor manufacturing apparatus
according to Embodiment 2 of the invention. As shown in FIG. 2, the
semiconductor manufacturing apparatus 10A of Embodiment 2 includes,
within a chamber 11, an exposure unit 30 for exposing a desired
design pattern on a resist film, an air conditioning unit 40 for
adjusting the temperature within the chamber 11, and a temperature
monitor 50 for measuring the temperature of the exposure unit 30
such as the temperature of an immersion liquid and the temperature
of the exposure atmosphere.
[0062] A temperature control unit 60 for controlling the air
conditioning unit 40 on the basis of the temperature of the
exposure unit 30, namely, the atmosphere temperature within the
chamber 11 and the temperature of the immersion liquid 25, sent
from the temperature monitor 50 is provided outside the chamber
11.
[0063] The exposure unit 30 includes a movable stage 31 for holding
a wafer 20 having a resist film (not shown) on a top surface
thereof, a projection lens (exposure lens) 32 disposed above the
wafer 20 held on the movable stage 31, a liquid supplying section
33 for supplying the immersion liquid 25 to a region between the
resist film and the projection lens 32, and a liquid discharging
section 34 for discharging the liquid 25 from above the resist film
after the exposure. It is noted that an illumination optical system
including a light source for exposing light and a mask (reticle)
having a desired design pattern generally provided above the
projection lens 32 are omitted in FIG. 2.
[0064] The temperature monitor 50 measures a temperature at a first
measurement point 51 for obtaining the temperature of the exposure
atmosphere in the exposure unit 30 and a temperature at a second
measurement point 52 for obtaining the temperature of the liquid 25
provided between the wafer 20 and the projection lens 32, and sends
temperature data thus obtained to the temperature control unit
60.
[0065] The temperature control unit 60 controls the operation of
the air conditioning unit 40 on the basis of the received
temperature data, so that when the temperature of the exposure
atmosphere obtained at the first measurement point 51 (i.e., the
temperature within the chamber 11) is higher than the temperature
of the immersion liquid 25 obtained at the second measurement point
52, the temperature within the chamber 11 can become lower than the
temperature of the liquid 25.
[0066] In this manner, in the semiconductor manufacturing apparatus
10A of Embodiment 2, the temperature of the exposure atmosphere
within the chamber 11 can be controlled to be lower than the
immersion liquid 25 during the exposure. It is noted that the
atmosphere temperature is preferably higher than 0.degree. C. and
not higher than 23.degree. C.
[0067] Accordingly, when the temperature of the exposure atmosphere
is lower than the temperature of the liquid 25, the saturated vapor
pressure of the liquid 25 is lowered and the liquid 25 can be
indirectly cooled. Therefore, evaporation of the liquid 25 can be
suppressed during the exposure, and hence, no air space is formed
in the liquid 25 provided between the wafer 20 and the projection
lens 32. As a result, the abnormality of the refractive index or
the like otherwise caused in the liquid 25 can be avoided, so that
the immersion liquid 25 can keep a desired exposure
characteristic.
[0068] Furthermore, since the temperature within the chamber 11 is
adjusted through the temperature control unit 60 by both the air
conditioning unit 40 and the temperature monitor 50, the
temperature of the immersion liquid 25 can be prevented from
largely varying during the exposure. As a result, the variation of
the refractive index of the liquid 25 caused by the temperature
change can be also suppressed, and hence, variation in the exposure
accuracy caused among a plurality of shots can be reduced. In
general, the principal surface of the wafer 20 is divided into a
plurality of exposure regions, and the respective divided exposure
regions are successively irradiated with exposing light. The
irradiation with the exposing light thus performed on each exposure
region is designated as one shot.
[0069] Although the second measurement point 52 is set for
measuring the temperature of the immersion liquid 25 provided
between the resist film and the projection lens 32 in Embodiment 2,
the temperature in the vicinity of the liquid 25, namely, the
ambient temperature of the liquid 25, may be measured at the second
measurement point 52.
[0070] Also, the evaporation of the liquid 25 can be further
suppressed by adding an unsaturated aliphatic acid of oleic acid or
the like to the liquid 25 in the same manner as in Embodiment
1.
[0071] (Pattern Formation Method)
[0072] Now, a pattern formation method using the semiconductor
manufacturing apparatus having the aforementioned structure will be
described with reference to FIGS. 3A through 3D.
[0073] First, a positive chemically amplified resist material
having the following composition is prepared:
[0074] Base polymer:
poly((norbornene-5-methylene-t-butylcarboxylate) (50 mol %)-(maleic
anhydride) (50 mol %)) . . . 2 g
[0075] Acid generator: triphenylsulfonium nonaflate . . . 0.06
g
[0076] Quencher: triethanolamine . . . 0.002 g
[0077] Solvent: propylene glycol monomethyl ether acetate . . . 20
g
[0078] Next, as shown in FIG. 3A, the aforementioned chemically
amplified resist material is applied on a wafer 20 so as to form a
resist film 21 with a thickness of 0.35 .mu.m.
[0079] Then, the wafer 20 having the resist film 21 thereon is held
on the movable stage 31 of the exposure unit 30 of the
semiconductor manufacturing apparatus 10A shown in FIG. 2, and
subsequently, as shown in FIG. 3B, a liquid 25 whose temperature is
set to room temperature of approximately 23.degree. C. is provided
between the resist film 21 and the projection lens 32. At this
point, the temperature control unit 60 of FIG. 2 controls the air
conditioning unit 40 on the basis of the temperature data of the
liquid 25 obtained at the second measurement point 52, so that the
temperature of the exposure atmosphere, namely, the temperature
data obtained at the first measurement point 51, can be 15.degree.
C. Under this condition, pattern exposure is carried out by
irradiating the resist film 21 through a mask (not shown) with
exposing light 35 of ArF excimer laser with NA of 0.68.
[0080] After the pattern exposure, as shown in FIG. 3C, the resist
film 21 is baked with a hot plate at a temperature of 105.degree.
C. for 60 seconds, and thereafter, the resultant resist film 21 is
developed with a 2.38 wt % tetramethylammonium hydroxide developer.
In this manner, a resist pattern 21a made of an unexposed portion
of the resist film 21 and having a line width of 0.09 .mu.m is
formed in a good shape as shown in FIG. 4D.
[0081] In this manner, in the pattern formation method of
Embodiment 2, the temperature within the chamber 11, namely, the
temperature of the exposure atmosphere, is set to be lower than the
temperature of the liquid 25 during the exposure. Therefore, the
liquid 25 minimally evaporates, and hence, no air space is formed
in the liquid 25 provided between the resist film 21 and the
projection lens 32. Accordingly, the abnormality of the refractive
index or the like otherwise caused in the liquid 25 by an air space
can be avoided, so that the liquid 25 can keep a desired exposure
characteristic. As a result, the resist pattern 21a can be formed
in a good shape through the immersion lithography.
Embodiment 3
[0082] A semiconductor manufacturing apparatus and a pattern
formation method using the same according to Embodiment 3 of the
invention will now be described with reference to the accompanying
drawings.
[0083] FIG. 4 schematically shows the cross-sectional structure of
a principal part of the semiconductor manufacturing apparatus
according to Embodiment 3 of the invention. In FIG. 4, like
reference numerals are used to refer to like elements shown in FIG.
2 so as to omit the description. As shown in FIG. 4, the
semiconductor manufacturing apparatus 10B of Embodiment 3 includes,
below a movable stage 31 of an exposure unit 30 within a chamber
11, a cooling section 36 capable of cooling the movable stage
31.
[0084] A temperature monitor 50 measures a temperature of a liquid
25 present in a liquid supplying section 33 of the exposure unit 30
at a first measurement point 53 and a temperature of the liquid 25
provided between a wafer 20 and a projection lens 32 at a second
measurement point 54, and sends temperature data thus obtained to a
temperature control unit 60.
[0085] The temperature control unit 60 of Embodiment 3 is provided
within the chamber 11 and controls the temperature of the cooling
section 36 on the basis of the temperature of the liquid 25 present
in the liquid supplying section 33 and the temperature of the
liquid 25 provided on the wafer 20 that are sent from the
temperature monitor 50. The temperature control unit 60 may be
provided inside or outside the chamber 11.
[0086] The temperature control unit 60 cools the cooling section 36
on the basis of the received temperature data, so that when the
temperature of the immersion liquid 25 obtained at the second
measurement point 54 is higher than the temperature of the liquid
before the supply obtained at the first measurement point 53, the
temperature of the liquid 25 provided on the wafer 20 can become
equivalent to or lower than the temperature of the liquid 25 before
the supply. Accordingly, the liquid 25 provided on the wafer 20 is
indirectly cooled through the movable stage 31 by the cooling
section 36 thus cooled.
[0087] In a specific example of the structure of the cooling
section 36, at least one refrigerant pipe capable of allowing a
refrigerant to flow therein is disposed below the movable stage 31.
When the refrigerant is thus circulated below the movable stage 31,
the liquid 25 can be indirectly cooled through the movable stage
31, the wafer 20 and the resist film.
[0088] In this manner, in the semiconductor manufacturing apparatus
10B of Embodiment 3, it is possible to suppress, during the
exposure, the temperature increase of the immersion liquid 25
provided on the wafer 20 caused by light energy of the exposing
light and kinetic energy generated in moving from the liquid
supplying section 33 to a liquid discharging section 34.
[0089] Accordingly, since the temperature of the immersion liquid
25 provided on the wafer 20 can be appropriately controlled, the
evaporation of the liquid 25 provided on the wafer 20 during the
exposure can be suppressed. Also, since the temperature of the
liquid 25 is adjusted through the temperature control unit 60 by
both the temperature monitor 50 and the cooling section 36, the
temperature of the liquid 25 can be prevented from largely varying
during the exposure. As a result, the variation of the refractive
index of the liquid 25 caused by the temperature change can be also
suppressed, and therefore, the variation in the exposure accuracy
among a plurality of shots can be reduced.
[0090] Although the second measurement point 54 is set for
measuring the temperature of the immersion liquid 25 provided
between the resist film and the projection lens 32 in Embodiment 3,
the temperature in the vicinity of the liquid 25, namely, the
ambient temperature of the liquid 25, may be measured at the second
measurement point 54.
[0091] Also, the evaporation of the liquid 25 can be further
suppressed by adding an unsaturated aliphatic acid of oleic acid or
the like to the liquid 25 in the same manner as in Embodiment
1.
[0092] Furthermore, the semiconductor manufacturing apparatus 10B
of Embodiment 3 does not always need the chamber 11.
[0093] (Pattern Formation Method)
[0094] Now, a pattern formation method using the semiconductor
manufacturing apparatus having the aforementioned structure will be
described with reference to FIGS. 5A through 5D.
[0095] First, a positive chemically amplified resist material
having the following composition is prepared:
[0096] Base polymer:
poly((norbornene-5-methylene-t-butylcarboxylate) (50 mol %)-(maleic
anhydride) (50 mol %)) . . . 2 g
[0097] Acid generator: triphenylsulfonium nonaflate . . . 0.06
g
[0098] Quencher: triethanolamine . . . 0.002 g
[0099] Solvent: propylene glycol monomethyl ether acetate . . . 20
g
[0100] Next, as shown in FIG. 5A, the aforementioned chemically
amplified resist material is applied on a wafer 20 so as to form a
resist film 21 with a thickness of 0.35 .mu.m.
[0101] Then, the wafer 20 having the resist film 21 thereon is held
on the movable stage 31 of the exposure unit 30 of the
semiconductor manufacturing apparatus 10B shown in FIG. 4, and
subsequently, as shown in FIG. 5B, a liquid 25 whose temperature is
room temperature of approximately 23.degree. C. is provided from
the liquid supplying section 33 of FIG. 4 to a region between the
resist film 21 and the projection lens 32. At this point, the
temperature control unit 60 of FIG. 4 controls the cooling section
36 on the basis of the temperature data of the liquid 25 provided
on the resist film 21 obtained at the second measurement point 54,
so that the temperature of the movable stage 31 can be 13.degree.
C. Under this condition, pattern exposure is carried out by
irradiating the resist film 21 through a mask (not shown) with
exposing light 35 of ArF excimer laser with NA of 0.68.
[0102] After the pattern exposure, as shown in FIG. 5C, the resist
film 21 is baked with a hot plate at a temperature of 105.degree.
C. for 60 seconds, and thereafter, the resultant resist film 21 is
developed with a 2.38 wt % tetramethylammonium hydroxide developer.
In this manner, a resist pattern 21a made of an unexposed portion
of the resist film 21 and having a line width of 0.09 .mu.m is
formed in a good shape as shown in FIG. 5D.
[0103] In this manner, in the pattern formation method of
Embodiment 3, the temperature of the movable stage 31 is set to be
lower than the temperature of the immersion liquid 25 during the
exposure. Therefore, the liquid 25 minimally evaporates, and hence,
no air space is formed in the liquid 25 provided between the resist
film 21 and the projection lens 32. Accordingly, the abnormality of
the refractive index or the like otherwise caused in the liquid 25
by an air space can be avoided, so that the liquid 25 can keep a
desired exposure characteristic. As a result, the resist pattern
21a can be formed in a good shape through the immersion
lithography.
[0104] Although the immersion liquid is water in each of
Embodiments 1 through 3, it may be perfluoropolyether instead of
water.
[0105] Moreover, in each of Embodiments 1 through 3, the light
source for the pattern exposure is not limited to ArF excimer laser
but may be KrF excimer laser, F.sub.2 laser, Xe.sub.2 laser,
Ar.sub.2 laser or ArKr laser.
[0106] Furthermore, in each of Embodiments 1 through 3, a resist
film to be subjected to the pattern exposure is not limited to a
positive resist but may be a negative resist, and needless to say,
it is not limited to a chemically amplified resist.
[0107] As described so far, according to the semiconductor
manufacturing apparatus and the pattern formation method using the
same of this invention, since an immersion liquid provided on a
resist film can be prevented from evaporating during exposure,
pattern failures derived from the evaporation can be prevented, so
that a resist pattern can be formed in a good shape. Accordingly,
the present invention is useful as a pattern formation method or
the like for use in fabrication process or the like for
semiconductor devices.
* * * * *