U.S. patent application number 12/781341 was filed with the patent office on 2010-09-02 for lithographic apparatus, device manufacturing method and a substrate.
This patent application is currently assigned to ASML Netherlands B.V.. Invention is credited to Marcel Mathijs Theodore Marie DIERICHS, Johannes Catharinus Hubertus MULKENS, Bob STREEFKERK.
Application Number | 20100221660 12/781341 |
Document ID | / |
Family ID | 38003396 |
Filed Date | 2010-09-02 |
United States Patent
Application |
20100221660 |
Kind Code |
A1 |
DIERICHS; Marcel Mathijs Theodore
Marie ; et al. |
September 2, 2010 |
LITHOGRAPHIC APPARATUS, DEVICE MANUFACTURING METHOD AND A
SUBSTRATE
Abstract
A substrate is provided with a coating of material which is
substantially transparent to the wavelength of the projection beam.
The coating may be thicker than the wavelength of the projection
beam and have a refractive index of the coating such that the
wavelength of the projection beam is shortened as it passes through
it. This allows the imaging of smaller features on the substrate.
Alternatively, the coating may be used with a liquid supply system
and act to keep bubbles away from a radiation sensitive layer of
the substrate.
Inventors: |
DIERICHS; Marcel Mathijs Theodore
Marie; (Venlo, NL) ; MULKENS; Johannes Catharinus
Hubertus; (Waalre, NL) ; STREEFKERK; Bob;
(Tilburg, NL) |
Correspondence
Address: |
PILLSBURY WINTHROP SHAW PITTMAN, LLP
P.O. BOX 10500
MCLEAN
VA
22102
US
|
Assignee: |
ASML Netherlands B.V.
Veldhoven
NL
|
Family ID: |
38003396 |
Appl. No.: |
12/781341 |
Filed: |
May 17, 2010 |
Related U.S. Patent Documents
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Application
Number |
Filing Date |
Patent Number |
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11642912 |
Dec 21, 2006 |
7746445 |
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12781341 |
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10898674 |
Jul 26, 2004 |
7175968 |
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11642912 |
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10775326 |
Feb 11, 2004 |
7326522 |
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10898674 |
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Current U.S.
Class: |
430/270.1 ;
430/322 |
Current CPC
Class: |
G03F 7/70958 20130101;
G03F 7/70341 20130101 |
Class at
Publication: |
430/270.1 ;
430/322 |
International
Class: |
G03F 7/004 20060101
G03F007/004; G03F 7/20 20060101 G03F007/20 |
Foreign Application Data
Date |
Code |
Application Number |
Jul 28, 2003 |
EP |
03254723.4 |
Claims
1.-20. (canceled)
21. A device manufacturing method, comprising projecting a
patterned beam of radiation through a liquid onto a target portion
of a substrate, a surface of the substrate having a contact angle
with the liquid of less than or equal 70.degree..
22. The method of claim 21, wherein the contact angle is in the
range of from 50 to 70.degree..
23. The method of claim 21, wherein the substrate has a resist and
the surface of the substrate is a surface above the resist.
24. The method of claim 21, wherein the substrate has a resist and
a topcoat having the contact angle is provided on the resist.
25. The method of claim 24, wherein the topcoat comprises a
fluorinated polymer in an amount sufficient to provide the contact
angle.
26. The method of claim 24, wherein the topcoat is insoluble in the
liquid.
27. The method of claim 24, wherein the topcoat prevents bubbles
sticking to a resist layer or a resist stack provided on the
substrate.
28. A substrate for use in liquid immersion lithography, the
substrate having a resist provided on a surface thereof and having
a contact angle to the liquid of less than 70.degree..
29. The substrate of claim 28, wherein the contact angle is in the
range of 50 to 70.degree..
30. The substrate of claim 28, wherein the substrate has a resist
and the surface of the substrate is a surface above the resist.
31. The substrate of claim 28, wherein the substrate has a resist
and a topcoat having the contact angle is provided on the
resist.
32. The substrate of claim 31, wherein the topcoat comprises a
fluorinated polymer in an amount sufficient to provide the contact
angle.
33. The substrate of claim 31, wherein the topcoat is insoluble in
the liquid.
34. A device manufacturing method comprising: providing a liquid
between a projection system of a lithographic projection apparatus
and a substrate, the substrate comprising a non-radiation sensitive
material being at least partially transparent to radiation, being
of a different material than the liquid, and being provided over a
part of a radiation sensitive layer of the substrate; and
projecting a patterned beam of radiation, through the liquid, onto
a target portion of the substrate using the projection system.
35. The method according to claim 34, wherein the non-radiation
sensitive material has a thickness, the radiation has a wavelength
and the thickness is greater than the wavelength.
36. The method according to claim 34, wherein the non-radiation
sensitive material has a thickness of at least 5 .mu.m.
37. The method according to claim 34, wherein the non-radiation
sensitive material has a thickness that is at least 10 .mu.m or at
least 20 .mu.m.
38. The method according to claim 34, wherein the non-radiation
sensitive material has a first refractive index, the liquid has a
second refractive index, and the first refractive index is within
0.2 of the second refractive index.
39. The method according to claim 38, wherein the first refractive
index is one of within 0.1 of and substantially the same as the
second refractive index.
40. The method according to claim 34, wherein the non-radiation
sensitive material has a refractive index in the range of 1.0 to
1.9.
41. The method according to claim 34, wherein the non-radiation
sensitive material is substantially insoluble in and unreactive
with the liquid.
42. The method according to claim 34, wherein a further protective
material is present between the radiation sensitive layer and the
non-radiation sensitive material.
43. The method according to claim 34, wherein the non-radiation
sensitive material is of a thickness effective to substantially
reduce the effect of bubbles in the liquid, of particles in the
liquid, or both on the quality of the patterned beam impinging on
the radiation sensitive layer.
44. The method according to claim 34, further comprising at least
partly coating the radiation sensitive layer of the substrate with
the non-radiation sensitive material.
45. A device manufacturing method comprising: providing a liquid,
between a projection system of a lithographic projection apparatus
and a substrate, to a non-radiation sensitive material on the
substrate, the non-radiation sensitive material, which is at least
partially transparent to radiation, provided over at least a part
of a radiation sensitive layer of the substrate and having a
thickness effective to substantially reduce the effect of bubbles
in the liquid, of particles in the liquid, or both on the quality
of a patterned beam impinging on the radiation sensitive layer; and
projecting a patterned beam of radiation, through the liquid, onto
a target portion of the substrate using the projection system.
Description
[0001] This application is a continuation application of co-pending
U.S. patent application Ser. No. 10/898,674, filed Jul. 26, 2004,
which is a continuation-in-part of co-pending U.S. patent
application Ser. No. 10/775,326, filed Feb. 11, 2004, and which
claims priority from European Patent Application No. EP 03254723.4,
filed Jul. 28, 2003, each of the foregoing applications
incorporated herein in their entirety by reference.
FIELD
[0002] The present invention relates to a lithographic apparatus, a
device manufacturing method and a substrate.
BACKGROUND
[0003] A lithographic apparatus is a machine that applies a desired
pattern onto a target portion of a substrate. Lithographic
apparatus can be used, for example, in the manufacture of
integrated circuits (ICs). In that circumstance, a patterning
device, such as a mask, may be used to generate a circuit pattern
corresponding to an individual layer of the IC, and this pattern
can be imaged onto a target portion (e.g. comprising part of, one
or several dies) on a substrate (e.g. a silicon wafer) that has a
layer of radiation-sensitive material (resist). In general, a
single substrate will contain a network of adjacent target portions
that are successively exposed. Known lithographic apparatus include
so-called steppers, in which each target portion is irradiated by
exposing an entire pattern onto the target portion at one time, and
so-called scanners, in which each target portion is irradiated by
scanning the pattern through the projection beam in a given
direction (the "scanning"-direction) while synchronously scanning
the substrate parallel or anti-parallel to this direction.
[0004] It has been proposed to immerse at least a portion of a
substrate in a lithographic projection apparatus in a liquid having
a relatively high refractive index, e.g. water, so as to fill a
space between an element of the projection system and the
substrate. The point of this is to enable imaging of smaller
features since the exposure radiation will have a shorter
wavelength in the liquid. (The effect of the liquid may also be
regarded as increasing the effective NA of the lithographic
projection apparatus and also increasing the depth of focus.) Other
immersion liquids have been proposed, including water with solid
particles (e.g. quartz) suspended therein.
[0005] However, submersing a substrate or a substrate and substrate
table in a bath of liquid (see for example United States patent
U.S. Pat. No. 4,509,852, hereby incorporated in its entirety by
reference) means that there may be a large body of liquid that must
be accelerated during a scanning exposure. This may require
additional or more powerful motors and turbulence in the liquid may
lead to undesirable and unpredictable effects.
[0006] One of the solutions proposed is for a liquid supply system
to provide liquid on only a localized area of the substrate and in
between a final element of the projection system and the substrate
(the substrate generally has a larger surface area than the final
element of the projection system). One way which has been proposed
to arrange for this is disclosed in PCT patent application WO
99/49504, hereby incorporated in its entirety by reference. As
illustrated in FIGS. 2 and 3, liquid is supplied by at least one
inlet IN onto the substrate, preferably along the direction of
movement of the substrate relative to the final element, and is
removed by at least one outlet OUT after having passed under the
projection system. That is, as the substrate is scanned beneath the
element in a -X direction, liquid is supplied at the +X side of the
element and taken up at the -X side. FIG. 2 shows the arrangement
schematically in which liquid is supplied via inlet IN and is taken
up on the other side of the element by outlet OUT which is
connected to a low pressure source. In the illustration of FIG. 2
the liquid is supplied along the direction of movement of the
substrate relative to the final element, though this does not need
to be the case. Various orientations and numbers of in- and
out-lets positioned around the final element are possible, one
example is illustrated in FIG. 3 in which four sets of an inlet
with an outlet on either side are provided in a regular pattern
around the final element.
SUMMARY
[0007] A difficulty in immersion lithography is the complexity of
the arrangement to supply liquid to the space between the final
element of the projection system and the substrate as well as the
measures that must be taken to ensure that other parts of the
apparatus can accommodate the presence of a significant amount of
liquid.
[0008] Accordingly, it would be advantageous, for example, to
reduce the complexity of an immersion lithography apparatus.
[0009] According to an aspect, there is provided a lithographic
projection apparatus arranged to transfer a pattern to a
radiation-sensitive layer of a substrate using a beam of radiation
having an exposure wavelength, comprising a coater arranged to at
least partially coat the substrate with a layer of
non-radiation-sensitive coating material which is at least
partially transparent to radiation of the exposure wavelength,
wherein the layer of non-radiation-sensitive coating material is
positioned before the layer of radiation-sensitive material in the
path of the beam of radiation, and wherein the coater applies the
layer of non-radiation-sensitive coating material to a thickness
which is greater than the exposure wavelength.
[0010] When radiation from a projection system passes through the
coating its wavelength may be reduced. This allows the imaging of
smaller features on the substrate. (It may also he seen as
increasing the effective numerical aperture of the system, or
increasing the depth of field.) There may be no need to provide a
complex liquid supply system, as with previously proposed apparatus
because the coating simulates the effect of at least partly filling
a space between the surface of the substrate and the final element
of the projection lens with a liquid.
[0011] In an embodiment, the coater is further arranged to at least
partially coat the substrate with a protective material configured
to protect the layer of radiation-sensitive material prior to
coating the substrate with the non-radiation-sensitive coating
material. The protective layer protects the radiation-sensitive
material from contaminants present in the environment of the
apparatus.
[0012] In an embodiment, the coater is further arranged to at least
partially cover the non-radiation-sensitive coating material with
an evaporation prevention material configured to prevent the
coating from evaporating.
[0013] According to a further aspect, there is provided a device
manufacturing method comprising projecting a patterned beam of
radiation having an exposure wavelength onto a target portion of a
substrate that is at least partially covered by a layer of
radiation-sensitive material, wherein a layer of
non-radiation-sensitive coating material which is at least partly
transparent to radiation of the exposure wavelength is applied to
the target portion, the layer of non-radiation-sensitive coating
material being positioned before the layer of radiation-sensitive
material in the path of the patterned beam of radiation, and the
layer of non-radiation-sensitive coating material having a
thickness which is greater than the exposure wavelength.
[0014] Thus, it may be possible to reduce the wavelength of the
radiation simply by applying a coating to the substrate. The method
does not add much complexity to the previously known methods, so it
may be implemented cheaply.
[0015] In an embodiment, the method further comprises at least
partially applying a layer of protective material, configured to
protect the layer of radiation-sensitive material, to the substrate
prior to applying the layer of non-radiation-sensitive coating
material.
[0016] In an embodiment, the method further comprises at least
partially applying a layer of evaporation prevention material,
configured to prevent the non-radiation-sensitive coating material
from evaporating, onto the layer of non-radiation-sensitive coating
material.
[0017] According to a further aspect, there is provided a substrate
for use in a lithographic projection apparatus, the substrate being
at least partially covered by a layer of radiation sensitive
material which is sensitive to a beam of radiation having an
exposure wavelength, and the substrate being at least partially
coated with a layer of non-radiation-sensitive coating material
which is at least partially transparent to radiation of the
exposure wavelength and has a thickness which is greater than the
exposure wavelength, wherein the layer of non-radiation-sensitive
material is positioned before the layer of radiation-sensitive
material in the path of the beam of radiation.
[0018] In an embodiment, the substrate is further at least
partially coated with a layer of protective material configured to
protect the layer of radiation-sensitive material, the layer of
protective material positioned between the radiation-sensitive
material and the non-radiation-sensitive coating material.
[0019] In an embodiment, the substrate is further at least
partially coated with a layer of evaporation prevention material on
the layer of non-radiation-sensitive coating material, the
evaporation prevention material configured to prevent the
non-radiation sensitive coating material from evaporating
[0020] In an embodiment, coating material has a refractive index in
the range of 1.0 to 1.9. If the refractive index is in this range,
the coating will be effective to reduce the wavelength of the beam
of radiation passing though it.
[0021] In an embodiment, the coating material is substantially
water. Water has a refractive index of 1.44 and so is a good
material to use as the coating. It also has an advantage that it is
not hazardous and can easily be applied and removed as
required.
[0022] A further difficulty in immersion lithography may be the
existence of bubbles and/or particles in the liquid. This is a
particular problem during scanning of a substrate with respect to
the projection system. In this circumstance it is possible that
bubbles and/or particles become attached to the substrate surface.
These bubbles and/or particles can disrupt the patterned beam so
that the quality of the substrate produced may be reduced.
[0023] Accordingly, it would be advantageous, for example, to
reduce the effect of bubbles and/or particles in liquid on the
quality of the product.
[0024] According to an aspect, there is provided a device
manufacturing method comprising: [0025] providing a liquid between
a projection system of a lithographic projection apparatus and a
substrate, the substrate comprising a non-radiation sensitive
material being at least partially transparent to radiation, being
of a different material than the liquid, and being provided over at
a part of a radiation sensitive layer of the substrate; and [0026]
projecting a patterned beam of radiation, through the liquid, onto
a target portion of the substrate using the projection system.
[0027] Bubbles on the surface of a substrate in contact with liquid
may be kept far away enough from the radiation sensitive material
on the substrate so that their effect on the patterned beam is less
than if the bubbles were closer to the radiation sensitive
material. If the non-radiation sensitive material is made of
sufficient thickness, it is possible that bubbles on the interface
between the liquid and the non-radiation sensitive material will
only introduce stray light and not seriously affect the quality of
the imaged substrate. The above may also work on the same principle
for particles which are present in the liquid, as well as, or
instead of, bubbles.
[0028] In an embodiment, the non-radiation sensitive material has a
thickness, the radiation has a wavelength and the thickness is
greater than the wavelength. In this way, when the radiation from a
projection system passes through the non-radiation sensitive
material its wavelength may be reduced. This may allow the imaging
of smaller features on the substrate.
[0029] In an embodiment, the non-radiation sensitive material has a
thickness of at least 5 .mu.m. In embodiments, the thickness may be
at least 10 .mu.m or at least 20 .mu.m. At these thicknesses, the
effects on imaging of the bubbles and/or particles may be
dramatically reduced. Also, at these thicknesses it may be possible
to provide liquid between a surface of the non-radiation sensitive
material and a projection system which is effective to reduce the
wavelength of the beam while aiming to reduce the effects of
bubbles and/or particles on imaging quality.
[0030] In an embodiment, the non-radiation sensitive material has a
first refractive index, the liquid has a second refractive index,
and the first refractive index is at least as large as the second
refractive index. Thus, the effect of the non-radiation sensitive
material may be not to increase the wavelength of the beam.
[0031] According to a further aspect, there is provided a substrate
for use in a lithographic projection apparatus, the substrate being
at least partly covered by a radiation sensitive layer, the
radiation sensitive layer being at least partly covered with a
non-radiation sensitive material which is at least partly
transparent to the radiation and being of a different material than
a liquid through which a patterned beam of radiation of the
lithographic projection apparatus is projected onto a target
portion of the substrate.
[0032] This substrate may be used in the method(s) described
herein.
[0033] According to a further aspect, there is provided a device
manufacturing method comprising: [0034] providing a liquid, between
a projection system of a lithographic projection apparatus and a
substrate, to a non-radiation sensitive material on the substrate,
the non-radiation sensitive material, which is at least partially
transparent to radiation, provided over at least a part of a
radiation sensitive layer of the substrate and having a thickness
effective to substantially reduce the effect of bubbles in the
liquid, particles in the liquid, or both on the quality of a
patterned beam impinging on the radiation sensitive layer; and
[0035] projecting a patterned beam of radiation, through the
liquid, onto a target portion of the substrate using the projection
system.
BRIEF DESCRIPTION OF THE DRAWINGS
[0036] Embodiments of the invention will now be described, by way
of example only, with reference to the accompanying schematic
drawings in which corresponding reference symbols indicate
corresponding parts, and in which:
[0037] FIG. 1 depicts a lithographic apparatus according to an
embodiment of the invention;
[0038] FIG. 2 illustrates, in cross-section, a liquid supply system
for use with an embodiment of the invention;
[0039] FIG. 3 illustrates the liquid supply system of FIG. 2 in
plan;
[0040] FIG. 4 depicts another liquid supply system for use with an
embodiment of the invention;
[0041] FIG. 5 depicts a substrate with a coating according to a
first embodiment of the invention;
[0042] FIG. 6 depicts a substrate with a coating according to a
second embodiment of the invention;
[0043] FIG. 7 depicts a liquid supply system of an embodiment of
the invention;
[0044] FIG. 8 illustrates a substrate according to an embodiment of
the present invention; and
[0045] FIGS. 9 and 10 illustrate a conventional substrate and a
substrate according to an embodiment of the invention respectively
under a projection system during imaging.
DETAILED DESCRIPTION
[0046] FIG. 1 schematically depicts a lithographic apparatus
according to a particular embodiment of the invention. The
apparatus comprises: [0047] an illumination system (illuminator) IL
for providing a projection beam PB of radiation (e.g. UV
radiation). [0048] a first support structure (e.g. a mask table) MT
for supporting a patterning device (e.g. a mask) MA and connected
to a first positioning device PM for accurately positioning the
patterning device with respect to item PL; [0049] a substrate table
(e.g. a wafer table) WT for holding a substrate (e.g. a
resist-coated wafer) W and connected to a second positioning device
PW for accurately positioning the substrate with respect to item
PL; and [0050] a projection system (e.g. a refractive projection
lens system) PL for imaging a pattern imparted to the projection
beam PB by patterning device MA onto a target portion C (e.g.
comprising one or more dies) of the substrate W.
[0051] As here depicted, the apparatus is of a transmissive type
(e.g. employing a transmissive mask). Alternatively, the apparatus
may be of a reflective type (e.g. employing a programmable mirror
array of a type as referred to above).
[0052] The illuminator IL receives a beam of radiation from a
radiation source SO. The source and the lithographic apparatus may
be separate entities, for example when the source is an excimer
laser. In such cases, the source is not considered to form part of
the lithographic apparatus and the radiation beam is passed from
the source SO to the illuminator IL with the aid of a beam delivery
system BD comprising, for example, suitable directing mirrors
and/or a beam expander. In other cases the source may be integral
part of the apparatus, for example when the source is a mercury
lamp. The source SO and the illuminator IL, together with the beam
delivery system BD if required, may be referred to as a radiation
system.
[0053] The illuminator IL may comprise an adjusting device AM for
adjusting the angular intensity distribution of the beam.
Generally, at least the outer and/or inner radial extent (commonly
referred to as .sigma.-outer and .sigma.-inner, respectively) of
the intensity distribution in a pupil plane of the illuminator can
be adjusted. In addition, the illuminator IL generally comprises
various other components, such as an integrator IN and a condenser
CO. The illuminator provides a conditioned beam of radiation,
referred to as the projection beam PB, having a desired uniformity
and intensity distribution in its cross-section.
[0054] The projection beam PB is incident on the mask MA, which is
held on the mask table MT. Having traversed the mask MA, the
projection beam PB passes through the projection system PL, which
focuses the beam onto a target portion C of the substrate W. With
the aid of the second positioning device PW and position sensor IF
(e.g. an interferometric device), the substrate table WT can be
moved accurately, e.g. so as to position different target portions
C in the path of the beam PB. Similarly, the first positioning
device PM and another position sensor (which is not explicitly
depicted in FIG. 1) can be used to accurately position the mask MA
with respect to the path of the beam PB, e.g. after mechanical
retrieval from a mask library, or during a scan. In general,
movement of the object tables MT and WT will be realized with the
aid of a long-stroke module (coarse positioning) and a short-stroke
module (fine positioning), which form part of the positioning
device PM and PW. However, in the case of a stepper (as opposed to
a scanner) the mask table MT may be connected to a short stroke
actuator only, or may be fixed. Mask MA and substrate W may be
aligned using mask alignment marks M1, M2 and substrate alignment
marks P1, P2.
[0055] The depicted apparatus can be used in the following
modes:
[0056] 1. In step mode, the mask table MT and the substrate table
WT are kept essentially stationary, while an entire pattern
imparted to the projection beam is projected onto a target portion
C at one time (i.e. a single static exposure). The substrate table
WT is then shifted in the X and/or Y direction so that a different
target portion C can be exposed. In step mode, the maximum size of
the exposure field limits the size of the target portion C imaged
in a single static exposure.
[0057] 2. In scan mode, the mask table MT and the substrate table
WT are scanned synchronously while a pattern imparted to the
projection beam is projected onto a target portion C (i.e. a single
dynamic exposure). The velocity and direction of the substrate
table WT relative to the mask table MT is determined by the
(de-)magnification and image reversal characteristics of the
projection system PL. In scan mode, the maximum size of the
exposure field limits the width (in the non-scanning direction) of
the target portion in a single dynamic exposure, whereas the length
of the scanning motion determines the height (in the scanning
direction) of the target portion.
[0058] 3. In another mode, the mask table MT is kept essentially
stationary holding a programmable patterning device, and the
substrate table WT is moved or scanned while a pattern imparted to
the projection beam is projected onto a target portion C. In this
mode, generally a pulsed radiation source is employed and the
programmable patterning device is updated as required after each
movement of the substrate table WT or in between successive
radiation pulses during a scan. This mode of operation can be
readily applied to maskless lithography that utilizes a
programmable patterning device, such as a programmable mirror array
of a type as referred to above.
[0059] Combinations and/or variations on the above described modes
of use or entirely different modes of use may also be employed.
[0060] FIG. 5 depicts a substrate W ready for processing in the
apparatus. A layer of resist 2 is present on top of the surface of
the substrate. A layer 3 of protective material is present above
the resist to protect it from contaminants. This layer 3 of
protective material is thin, less than one wavelength of the
radiation of the projection beam. In this embodiment, it is
approximately 50 nm thick. A coating 4 (or top coat) is applied by
a coating system (described in more detail below) on top of the
protective layer 3. This can be done at any time after the
protective layer is applied until the substrate enters the
projection area of the lithographic apparatus. The coating 4 is
non-photosensitive and is at least partially transparent to
radiation of the wavelength of the projection beam. In an
embodiment, the coating transmits as much of the radiation of the
projection beam as possible. The coating 4 can also act as a
chemical barrier for environmental contaminants, in that case the
protective layer 3 is not needed.
[0061] The coating 4 can be liquid or solid, in this embodiment the
coating comprises distilled water. Water is easy to apply and
remove from the surface of the substrate W and does not pose a
chemical hazard. However, other materials are also suitable.
Examples of liquids which can be used include liquids suitable for
immersing the substrate. Examples of solids which can be used
include the base polymer of photoresists that are transparent but
not photosensitive, for example acetal systems or polyvinylphenol
(PVP).
[0062] The coating 4 has a thickness t at least as thick as the
wavelength of the beam, but may be thicker if required. This
minimum thickness ensures that the coating is effective to reduce
the wavelength of the radiation passing through it. Thus the
thickness should be, for example, at least 365, 248, 193, 157 or
126 nm depending on the wavelength of the projection beam. It may
also be thicker, corresponding to any multiple of a wavelength
greater than 1. A limit on the thickness will be imposed by the
clearance between the substrate and the final element of the
projection system. Thus a maximum thickness of the coating 2 may be
1 mm or greater depending on the construction of the apparatus. For
example, when water is used as the coating 4, a thicker coating can
be applied to allow for evaporation and ensure that surface tension
effects do not cause the coating to gather together into
droplets.
[0063] When the substrate according to an embodiment of the present
invention is used in a lithographic apparatus, the presence of the
coating 4 simulates the effect of filling the area between the
surface of the substrate and the final element of the projection
system with liquid. The beam passes through the coating 4 prior to
impinging on the resist 2. When the beam enters the coating 4 its
wavelength is reduced. For this effect to occur the refractive
index of the coating should be between that of air (1.0) and the
resist (approximately 1.7). In an embodiment, the refractive index
is around 1.4. Water, with a refractive index of 1.44, is
particularly suitable for use as the coating. The protective layer
3 has no effect on the wavelength of the projection beam because
its thickness is smaller than the wavelength.
[0064] Thus, advantages of immersing the substrate are achieved
without a complex liquid supply system. Furthermore, it is possible
to apply the one or more embodiments of the invention to an
existing apparatus without substantial change in its construction,
for example only a minor change to the handling of the substrate
may be required.
[0065] A second embodiment of the present invention is depicted in
FIG. 6. The construction of this embodiment is the same as for the
first embodiment save as described below.
[0066] In this embodiment, an evaporation prevention layer 5 is
applied on top of the coating 4. This evaporation prevention layer
5 is a liquid, for example an oil, which has a boiling point higher
than the boiling point of the coating 4. Thus, evaporation of the
coating 4 is prevented by the presence of the layer 5. The layer 5
is at least partially transparent to the projection beam and, in an
embodiment, transmits substantially all the radiation of the
beam.
[0067] Evaporation of the coating 4 is therefore prevented,
allowing its thickness to be more accurately controlled. (There
will not be a reduction in the thickness of the coating 4 over time
because the evaporation prevention layer 5 prevents it
evaporating.)
[0068] Another liquid supply system which has been proposed is to
provide the liquid supply system with a seal member which extends
along at least a part of a boundary of the space between the final
element of the projection system and the substrate table. The seal
member is substantially stationary relative to the projection
system in the XY plane though there may be some relative movement
in the Z direction (in the direction of the optical axis). A seal
is formed between the seal member and the surface of the substrate.
In an embodiment, the seal is a contactless seal such as a gas
seal. Such a system with a gas seal is disclosed in U.S. patent
application Ser. No. 10/705,783, hereby incorporated in its
entirety by reference.
[0069] FIG. 7 depicts a liquid supply system, or reservoir, to
provide liquid to a space between the final element of the
projection system PL and the substrate W. Other liquid supply
systems, such as those described herein, may be used in this
embodiment of the invention.
[0070] The reservoir 10 forms a contactless seal to the substrate
around the image field of the projection system so that liquid is
confined to fill a space between the substrate surface and the
final element of the projection system. The reservoir is formed by
a seal member 12 positioned below and surrounding the final element
of the projection system PL. Liquid is brought into the space below
the projection system and within the seal member 12. The seal
member 12 extends a little above the final element of the
projection system and the liquid level rises above the final
element so that a buffer of liquid is provided. The seal member 12
has an inner periphery that at the upper end preferably closely
conforms to the shape of the projection system or the final element
thereof and may, be round. At the bottom, the inner periphery
closely conforms to the shape of the image field, e.g., rectangular
though this need not be the case.
[0071] The liquid is confined in the reservoir by a gas seal 16
between the bottom of the seal member 12 and the surface of the
substrate W. The gas seal is formed by gas, e.g. air or synthetic
air but preferably N.sub.2 or another inert gas, provided under
pressure via inlet 15 to the gap between seal member 12 and
substrate and extracted via first outlet 14. The overpressure on
the gas inlet 15, vacuum level on the first outlet 14 and geometry
of the gap are arranged so that there is a high-velocity gas flow
inwards that confines the liquid.
[0072] FIG. 8 depicts a substrate W according to a third embodiment
of the invention ready for processing in a lithographic apparatus.
A layer of radiation sensitive material 22 (i.e. the so called
"resist") is present on top of a surface of the substrate W. The
radiation sensitive material 22 is approximately 200 nm thick. A
layer 23 of protective material is present above the radiation
sensitive material 22 to protect it from contaminants. This
protective material is thin. In an embodiment, the thickness is
less than one wavelength of the radiation of the projection beam.
For example, the layer 23 of protective material may be
approximately 80 nm thick.
[0073] A top coating 24 is provided above (e.g., applied to) the
layer of protective material 23. The top coating or layer 24 is of
a material not sensitive to radiation at the wavelength of the
projection beam PB and is at least partially transparent to the
radiation of the wavelength of the projection beam PB. In an
embodiment, it is different to and immiscible with the immersion
liquid. The top coating 24 is, in an embodiment, attached to the
substrate W and may be solid. In an embodiment, the top coating 24
transmits at least 80% of the radiation of the projection beam. In
an embodiment, the top coating 24 may transmit at least 90% or at
least 95% of the radiation of the projection beam. In an
embodiment, the top coating 24 is also not reactive with the
immersion liquid provided by the liquid supply system such as those
illustrated in FIG. 2 and 3, 4 or 7. At a wavelength of 193 nm,
water may be a suitable liquid for use as an immersion liquid.
[0074] FIGS. 9 and 10 illustrate how an embodiment of the present
invention functions. In FIG. 9, the substrate W is a standard
substrate covered, at least in part, with immersion liquid during
imaging. FIG. 10 illustrates a substrate according to an embodiment
of the invention during imaging. As can be seen in FIG. 9, bubbles
and/or particles 25 in the immersion liquid in a conventional
substrate are only 80 nm away (i.e., the thickness of the
protective layer 3) from the radiation sensitive layer 22. In this
instance, any bubbles and/or particles on the surface of the
substrate can seriously affect the imaging quality, for example, by
being within the depth of focus. In contrast, as can seen from FIG.
10, the top coating 24 keeps any bubbles and/or particles in the
immersion liquid at least a distance t from the radiation sensitive
layer 22. Thus, the effect of the bubbles and/or particles on the
imaging quality can be considerably reduced (for example, by having
the bubbles and/or particles out of focus) without making the
lithographic projection apparatus any more complex. In an
embodiment, the top coating 24 is hydrophilic, e.g. with a contact
angle in the range of from 50 to 70 degrees, to inhibit bubble
forming as well as helping any bubbles that do form out of
focus.
[0075] In an embodiment, it is desired that the top coating 24 has
a refractive index substantially the same as that of the immersion
liquid, perhaps within 0.2 or 0.1 of that of the immersion liquid.
In this way, optical effects such as those resulting from
variations in thickness of the coating 24 can be ignored. Thus, in
an embodiment, the top coating 24 has a refractive index greater
than that of air, in an embodiment as much as that of the immersion
liquid if not more. In an embodiment, the non-radiation sensitive
material has a refractive index in the range of 1 to 1.9.
[0076] In an embodiment, the top coating 24 is much thicker than
the wavelength of the projection beam. A thickness to bubble and/or
particle diameter ratio should be as close as possible to or larger
than 10 to 1. The maximum expected bubble and/or particle size is 1
.mu.m so for best performance the thickness of the top coating 24
should be at least 10 .mu.m. In an embodiment, the thickness may be
at least 20 .mu.m or at least 30 .mu.m and up to 100 .mu.m above
which the coating may become harder to provide and cost
prohibitive.
[0077] In an embodiment, the non-radiation sensitive material is
substantially insoluble and unreactive in the immersion liquid. If
this is not the case, embodiments of the invention will still work
but it may be necessary to take dissolution of the top coating 24
into account during imaging of the substrate. In an embodiment, the
top coating 24 can be removed with solvents which are typically
used with resist processing.
[0078] The top coating 24 may be a layer of water with an
anti-evaporation coating or similar to the (conventional) layer 23
of protective material which is a water based gel (conventionally
known as a top coat). Polymers or plastics may be suitable.
[0079] It will be apparent that the function of the layer 23 of
protective material and the top coating 24 can be performed by one
and the same layer applied at the same time with the thicknesses
and properties as described above (i.e. an embodiment of the
invention can be regarded as a `thick` top coat).
[0080] In an embodiment, the top coating is hydrophobic, e.g.
having a contact angle in the range of from 90 to 120 degrees, in
which case it helps prevent leakage of immersion fluid from the
reservoir 10.
[0081] Any one or more of the foregoing coatings and/or layers
(including the resist, the protective layer, the evaporation
prevention layer, etc.) may be applied to the substrate W using a
coating system. Any now or hereafter known coater may be suitable
for this purpose. Referring to FIG. 1, an example embodiment of a
coater 36 is depicted. The coater comprises a spindle 30 that holds
the substrate W. A spout 32 provides a coating 34 to the substrate
W. The coating 34 may comprise any one or more of the foregoing
coatings and/or layers. The spindle 30 rotates around an axis
perpendicular to the primary surface of the substrate W so that the
coating 34 can be evenly spread over the rotating substrate W by
centrifugal force. The coater 36 may be a coater already provided
in or specially added to a track, may be a coater provided in a
substrate handler associated with a lithographic projection
apparatus, and/or may be a coater separately provided to apply the
coatings and/or layers discussed herein. The coater 36 may be
controlled by appropriate software to provide the relevant
thickness(es) of the coating(s)/layer(s).
[0082] A further immersion lithography solution with a localized
liquid supply system is shown in FIG. 4. Liquid is supplied by two
groove inlets IN on either side of the projection system PL and is
removed by a plurality of discrete outlets OUT arranged radially
outwardly of the inlets IN. The inlets IN and OUT can be arranged
in a plate with a hole in its center and through which the
projection beam is projected. Liquid is supplied by one groove
inlet IN on one side of the projection system PL and removed by a
plurality of discrete outlets OUT on the other side of the
projection system PL, causing a flow of a thin film of liquid
between the projection system PL and the substrate W. The choice of
which combination of inlet IN and outlets OUT to use can depend on
the direction of movement of the substrate W (the other combination
of inlet IN and outlets OUT being inactive).
[0083] Other types of liquid supply systems are clearly possible
including those with different arrangements of inlets and outlets
and also those which are asymmetric.
[0084] Although specific reference may be made in this text to the
use of lithographic apparatus in the manufacture of ICs, it should
be understood that the lithographic apparatus described herein may
have other applications, such as the manufacture of integrated
optical systems, guidance and detection patterns for magnetic
domain memories, flat-panel displays, liquid-crystal displays
(LCDs), thin-film magnetic heads, etc. The skilled artisan will
appreciate that, in the context of such alternative applications,
any use of the terms "wafer" or "die" herein may be considered as
synonymous with the more general terms "substrate" or "target
portion", respectively. The substrate referred to herein may be
processed, before or after exposure, in for example a track (a tool
that typically applies a layer of resist to a substrate and
develops the exposed resist), a metrology tool and/or an inspection
tool. Where applicable, the disclosure herein may be applied to
such and other substrate processing tools. Further, the substrate
may he processed more than once, for example in order to create a
multi-layer IC, so that the term substrate used herein may also
refer to a substrate that already contains multiple processed
layers.
[0085] Although specific reference may have been made above to the
use of embodiments of the invention in the context of optical
lithography, it will be appreciated that the invention may be used
in other applications, for example imprint lithography, and where
the context allows, is not limited to optical lithography. In
imprint lithography a topography in a patterning device defines the
pattern created on a substrate. The topography of the patterning
device may be pressed into a layer of resist supplied to the
substrate whereupon the resist is cured by applying electromagnetic
radiation, heat, pressure or a combination thereof. The patterning
device is moved out of the resist leaving a pattern in it after the
resist is cured.
[0086] The terms "radiation" and "beam" used herein encompass all
types of electromagnetic radiation, including ultraviolet (UV)
radiation (e.g. having a wavelength of or about 365, 248, 193, 157
or 126 nm).
[0087] The term "lens", where the context allows, may refer to any
one or combination of various types of optical components,
including refractive, reflective, magnetic, electromagnetic and
electrostatic optical components.
[0088] While specific embodiments of the invention have been
described above, it will be appreciated that the invention may be
practiced otherwise than as described. For example, the present
invention can be applied to any immersion lithography apparatus, in
particular, but not exclusively, those types mentioned above. Thus,
the descriptions above are intended to be illustrative, not
limiting. It will be apparent to one skilled in the art that
modifications may be made to the invention as described without
departing from the scope of the claims set out below.
* * * * *