U.S. patent application number 12/685190 was filed with the patent office on 2010-07-01 for multilayered printed circuit board.
This patent application is currently assigned to IBIDEN CO., LTD. Invention is credited to Motoo Asai, Yoshitaka Ono, Koji Sekine, Kenichi Shimada, Yukihiko Toyoda, Dongdong Wang, Hui Zhong.
Application Number | 20100163288 12/685190 |
Document ID | / |
Family ID | 27529834 |
Filed Date | 2010-07-01 |
United States Patent
Application |
20100163288 |
Kind Code |
A1 |
Zhong; Hui ; et al. |
July 1, 2010 |
MULTILAYERED PRINTED CIRCUIT BOARD
Abstract
The present invention is to provide a multilayered printed
circuit board free from cracks attributed to thermal expansion
difference between a solder resist layer and another part and a
multilayered printed circuit board of the present invention
comprises a conductor circuit and a resin insulating layer serially
formed on a substrate in an alternate fashion and in repetition and
a solder resist layer formed as an outermost layer, and the solder
resist layer contains an inorganic filler.
Inventors: |
Zhong; Hui; (Ibi-gun,
JP) ; Shimada; Kenichi; ( Ibi-gun, JP) ;
Toyoda; Yukihiko; ( Ibi-gun, JP) ; Asai; Motoo;
( Ibi-gun, JP) ; Wang; Dongdong; ( Ibi-gun,
JP) ; Sekine; Koji; ( Ibi-gun, JP) ; Ono;
Yoshitaka; ( Ibi-gun, JP) |
Correspondence
Address: |
OBLON, SPIVAK, MCCLELLAND MAIER & NEUSTADT, L.L.P.
1940 DUKE STREET
ALEXANDRIA
VA
22314
US
|
Assignee: |
IBIDEN CO., LTD
Ogaki-shi
JP
|
Family ID: |
27529834 |
Appl. No.: |
12/685190 |
Filed: |
January 11, 2010 |
Related U.S. Patent Documents
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Application
Number |
Filing Date |
Patent Number |
|
|
10049270 |
Jun 27, 2002 |
|
|
|
PCT/JP00/05044 |
Jul 28, 2000 |
|
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12685190 |
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Current U.S.
Class: |
174/258 |
Current CPC
Class: |
H01L 2924/15312
20130101; H05K 3/4602 20130101; H05K 3/285 20130101; H01L
2924/15311 20130101 |
Class at
Publication: |
174/258 |
International
Class: |
H05K 1/03 20060101
H05K001/03 |
Foreign Application Data
Date |
Code |
Application Number |
Aug 12, 1999 |
JP |
11/228852 |
Aug 17, 1999 |
JP |
11/230875 |
Sep 21, 1999 |
JP |
11/266932 |
Sep 22, 1999 |
JP |
11/269320 |
Apr 4, 2000 |
JP |
2000-102769 |
Claims
1. A multilayered printed circuit board comprising: a conductor
circuit and a resin insulating layer serially formed on a substrate
in an alternate fashion and in repetition; and a solder resist
layer formed as an outermost layer, wherein said solder resist
layer is comprising a polyolefin type resin.
2. The multilayered printed circuit board according to claim 1,
wherein said solder resist layer has a dielectric constant of 3.0
or lower at 1 GHz.
3. The multilayered printed circuit board according to claim 1,
wherein said solder resist layer has a dielectric loss tangent of
0.01 or lower at 1 GHz.
4. The multilayered printed circuit board according to claim 1,
wherein said solder resist layer is comprising a cycloolefin type
resin.
5. The multilayered printed circuit board according to claim 4,
wherein said cycloolefin type resin is a homopolymer or a copolymer
of a monomer comprising 2-norbornene, 5-ethylidene-2-norbornene or
their derivatives.
6. The multilayered printed circuit board according to claim 4,
wherein said cycloolefin type resin is a thermosetting cycloolefin
type resin.
7. The multilayered printed circuit board according to claim 1,
wherein said resin insulting layer is comprising a polyolefin type
resin or a polyphenylene type resin.
Description
CROSS REFERENCE TO RELATED APPLICATIONS
[0001] This application is a divisional of U.S. application Ser.
No. 10/049,270, filed on Jun. 27, 2002, which is a National Stage
entry under 35 U.S.C. .sctn.371 of International Application No.
PCT/JP00/05044, filed on Jul. 28, 2000, the entire contents of each
of which is hereby incorporated by reference. This application is
further based on and claims the benefit of priority from the prior
Japanese Patent Application Nos. 11-228852 filed on Aug. 12, 1999,
11-230875 filed on Aug. 17, 1999, 11-266932 filed on Sep. 21, 1999,
11-269320 filed on Sep. 22, 1999 and 2000-102769 filed on Apr. 4,
2000.
FIELD OF THE INVENTION
[0002] The present invention relates to a multilayered printed
circuit board, a method for manufacturing the multilayered printed
circuit board, a solder resist composition, and a semiconductor
device.
BACKGROUND OF THE INVENTION
[0003] A multilayered printed circuit board so-called a
multilayered built-up circuit substrate is manufactured by a
semi-additive method and the like and produced by reciprocally
layering conductor circuits of copper and the like and interlaminar
resin insulating layers on a resin substrate reinforced with a 0.5
to 1.5 mm-thick glass cloth so-called a core. The interlaminar
connection of the conductor circuits through the interlaminar resin
insulating layers of the multilayered printed circuit board is
performed by a via hole.
[0004] Conventionally, the built-up multilayered printed circuit
board has been manufactured by a method, for example, disclosed in
Japanese H09-130050 A.
[0005] That is, at first, a through hole is formed in a
copper-laminated laminate board hearing a copper foil and
successively, the substrate is subjected to electroless copper
plating treatment to form copper plating treatment to form a
plated-through hole. Next, a conductor circuit is formed by etching
the surface of the substrate in a conductor pattern and then the
surface of the conductor circuit is roughened by electroless
plating or etching and the like. Continuously, a resin insulating
layer is formed on the conductor circuit having a roughened surface
and then subjected to exposure and development treatment to form an
opening part for a via-hole and after that, the interlaminar resin
insulating layer is formed by UV curing and main curing.
[0006] Further, after the interlaminar resin insulating layer is
subjected to roughening treatment by an acid or an oxidizing agent,
a thin electroless plating film is formed and, then after a plating
resist is formed on the electroless plating film, the thin
electroless plating film is thickened by electroplating and after
the plating resist is parted, etching is carried out to form a
conductor circuit connected with a under-level conductor circuit
through the via-hole.
[0007] After repeating these steps, finally a solder resist layer
for protecting the conductor circuit is formed and the parts
exposing the conductor circuit for connection with electronic
parts, e.g. an IC chip, or a mother board and the like, are plated
and then a solder bump is formed by printing a solder paste to
complete the manufacture of a built-up multilayered printed circuit
board.
[0008] A multilayered printed circuit board manufactured in such a
manner is subjected to reflowing treatment after an IC chip is
mounted thereon as to connect the solder bump to pads of the IC
chip, and then, an under-fill (a resin layer) under the IC chip and
a sealing layer of a resin or the like are formed on the IC chip to
complete manufacture of a semiconductor device comprising the IC
chip mounted thereon.
[0009] In the semiconductor device manufactured in such a manner,
generally, a respective layer has different thermal expansion
coefficients (linear expansion coefficients) attributed to the
materials thereof. That is, the linear expansion coefficients of
the IC chip, the under-fill and the interlaminar resin insulating
layers are generally 20.times.10.sup.-6/K or lower, whereas the
solder resist layer has the linear expansion coefficient as high as
60.times.10.sup.-6/K to 80.times.10.sup.-6/K because resins to be
used are different and because of other reasons, and at highest,
some have the linear expansion coefficient exceeding
100.times.10.sup.-6/K.
[0010] When a semiconductor device having such a constitution is
operated, the IC chip radiates heat and the generated heat is
transmitted through the under-fill to the solder resist layer, the
interlaminar resin insulating layers and the like. Hence, these
layers are thermally expanded owing to the temperature
increase.
[0011] On this occation, since the IC chip and the under-fill have
very close linear expansion coefficients and since their degree of
expansion owing to the temperature increase are very close, no
significant stress which is attributed to the difference of their
thermal expansion coefficients is generated. On the other hand,
since the difference of the linear expansion coefficient between
the under-fill or the interlaminar resin insulating layer and the
solder resist layer sandwitched by those is large, the degrees of
expansion owing to the temperature increase differ considerably.
Hence, considerable stress is generated to the solder resist layer
and, in some cases, cracks take place in the solder resist layer,
or the solder resist layer is peeled from the under-fill or the
interlaminar resin insulating layer.
[0012] Such cracking and peeling even take place with the heat at
the time of forming the solder bump. Also, cracking occurs more
easily in a heat cycle test and in a reliability test under a high
temperature and a high humidity, in which the multilayered printed
circuit board is tried in severe condition.
[0013] If cracks are once formed in the solder resist layer, the
insulation between the conductor circuit under the solder resist
layer and the solder bump cannot be retained, thus to result in a
degradation of the high insulating property and the
reliability.
[0014] Further, since a mixture of an epoxy resin, an acrylic resin
and the like is used for the interlaminar resin insulating Layer in
a conventional multilayered printed circuit board manufactured by
the above described method, the dielectric constant and the
dielectric loss tangent are high in a GHz band and, in this case,
if a LSI chip and the like using high frequency signals in the GHz
band are mounted on this, signal delay and signal error sometimes
occur attributed to the high dielectric constant of the
interlaminar resin insulating layer.
[0015] Hence, in order to solve the above mentioned problems,
proposed is a multilayered printed circuit board in which a
polyolefin type resin, a polyphenylene ether resin, a fluororesin
and the like having low dielectric constants are used for the
interlaminar resin insulating layer.
[0016] In such a multilayered printed circuit board, the problem of
generation of signal delay and signal error can be solved to some
extent since most part of conductor circuits are formed in the
interlaminar resin insulating layers.
[0017] However, as the frequency of the IC chip tends to be
increased to a higher frequency, the density of the circuits in the
IC chip is increased and the circuit pitches are narrowed,
consequently, it is required to narrow the intervals of pads for
outer terminals of a printed circuit board which is to be connected
with the IC chip and also the number of the pad for the outer
terminals per unit surface area is increased to lead to a high
density thereof.
[0018] Therefore, if the dielectric constant and the dielectric
loss tangent of a solder resist layer are high, it sometimes occurs
a problem that signal delay and the like: in the bumps for the
outer terminals of the solder resist layer; and in the
inter-circuits are caused attributed to electromagnetic
inter-reaction among circuits and the high dielectric property of
the insulating layers existing in the surrounding of the
circuits.
[0019] Further, even in the case that a multilayered printed
circuit board for which a polyphenylene ether resin with a low
dielectric loss tangent and a low dielectric constant and which
does not induce easily the signal delay and signal error just as
described above is used for the interlaminar resin insulating
layers, such an effect is offset if the dielectric constant of a
solder resist layer is high, therefore, signal delay and signal
error sometimes take place.
[0020] Further, in a conventional manufacture of a multilayered
printed circuit board, a solder resist layer is formed by using a
paste-like fluid as a solder resist composition which is containing
thermosetting resins such as a novolak type epoxy resin
(meth)acrylate, an imidazole curing agent, a bifunctional
(meth)acrylic acid ester monomer, a (meth)acrylic acid ester
polymer with a molecular weight of 500 to 5000, thermosetting resin
comprising a bisphenol type epoxy resin and the like,
photosensitive monomers such as polyvalent acrylic monomers, and
glycol ether type solvents and by applying and curing the
fluid.
[0021] A multilayered printed circuit board comprising such a
solder resist layer is to be used with electronic parts such as an
IC chip being mounted thereon. Hence, the multilayered printed
circuit board is desired to be durable even if the IC chip fires
owing to a variety of causes. Practically, it is desired for the
multilayered printed circuit board to clear the judgment standard
of UL94 of a UL test standard and to clear especially the judgment
standard of combustion time in 94V-0.
[0022] Further, while satisfying the above described flame
retardancy, the multilayered printed circuit board is required to
keep the openability of holes of the resin insulating layers or the
solder resist layer without deterioration, as compared with those
of an existing multilayered printed circuit board, at the time of
forming an opening of a via-hole and an opening for a solder pad.
It is moreover required to keep the adhesion strength between the
resin insulating layers and the like and the conductor circuits
without deterioration. Furthermore, the multilayered printed
circuit board is required to keep its performance without
deterioration at the time of a reliability test.
[0023] However, the multilayered printed circuit board comprising a
solder resist layer formed by using a conventional solder resist
composition has not been satisfactory in terms of flame
retardancy.
SUMMARY OF THE INVENTION
[0024] The present invention is developed to solve the above
described problems and an objective of the present invention is to
provide a multilayered printed circuit board free from cracks
attributed to thermal expansion difference between a solder resist
layer and another part during the manufacturing process of the
multilayered printed circuit board or after an IC chip is mounted
on the multilayered printed circuit board, to provide a solder
resist composition to be used for the manufacture of the
multilayered printed circuit board, and to provide a method for
manufacturing a multilayered printed circuit board using said
solder resist composition.
[0025] Further, another objective of the present invention is to
provide a multilayered printed circuit board and a semiconductor
device which have a solder resist layer with which signal delay and
signal error do not easily take place even if high frequency
signals in the GHz band are used.
[0026] Further, the other purpose of the prevent invention is to
provide a multilayered printed circuit board having a solder resist
layer having excellent flame retardancy, high adhesion strength to
a conductor circuit, and an opening with desired shapes.
[0027] A first invention of a first group of the present invention
is a multilayered printed circuit board comprising a conductor
circuit and a resin insulating layer serially formed on a substrate
in an alternate fashion and in repetition and a solder resist layer
formed as an outermost layer, wherein the foregoing solder resist
layer contains an inorganic filler.
[0028] Further, a second invention of the first group of the
present invention is a solder resist composition to be used for
manufacturing the multilayered printed circuit board of the first
invention of the first group of the present invention, wherein an
inorganic filler is mixed with a paste containing a resin for a
solder resist layer.
[0029] A third invention of the first group of the present
invention is a method for manufacturing a multilayered printed
circuit board comprising a conductor circuit and a resin insulating
layer serially formed on a substrate in an alternate fashion and in
repetition and a solder resist layer formed as an outermost layer,
wherein the foregoing solder resist composition is used.
[0030] A first invention of a second group of the present invention
is a multilayered printed circuit board comprising a conductor
circuit and a resin insulating layer serially formed on a substrate
in an alternate fashion and in repetition and a solder resist layer
formed as an outermost layer, wherein the foregoing solder resist
layer contains an elastomer component.
[0031] A second invention of the second group of the present
invention is a solder resist composition to be used for
manufacturing the multilayered printed circuit board of the first
invention of the second group of the present invention, wherein an
elastomer component is mixed with a paste containing a resin for a
solder resist layer.
[0032] A third invention of the second group of the present
invention is a method for manufacturing a multilayered printed
circuit board comprising a conductor circuit and a resin insulating
layer serially formed on a substrate in an alternate fashion and in
repetition and a solder resist layer as an uppermost layer, wherein
the foregoing solder resist composition of the second invention of
the second group of the present invention is used.
[0033] A first invention of a third group of the present invention
is a multilayered printed circuit board comprising a conductor
circuit and a resin insulating layer serially formed on a substrate
in an alternate fashion and in repetition and a solder resist layer
formed as an outermost layer, wherein the foregoing solder resist
layer has a dielectric constant of 3.0 or lower at 1 GHz.
[0034] A second invention of the third group of the present
invention is a multilayered printed circuit board comprising a
conductor circuit and a resin insulating layer serially formed on a
substrate in an alternate fashion and in repetition and a solder
resist layer formed as an outermost layer, wherein the foregoing
solder resist layer is comprising a polyolefin type resin.
[0035] A third invention of the third group of the present
invention is a semiconductor device comprising:
[0036] a multilayered printed circuit board wherein a conductor
circuit and a resin insulating layer are serially formed on a
substrate in an alternate fashion and in repetition, and a solder
resist layer having a solder bump is formed as an uppermost layer;
and
[0037] an IC chip connected with the foregoing multilayered printed
circuit board through the solder bump,
[0038] wherein the foregoing solder resist layer is comprising a
polyolefin type resin and the foregoing resin insulating layer is
comprising a polyolefin type resin, a polyphenylene type resin or a
fluoro type resin.
[0039] A first invention of a fourth group of the present invention
is a multilayered printed circuit board comprising a conductor
circuit and a resin insulating layer serially formed on a substrate
in an alternate fashion and in repetition and a solder resist layer
formed as an outermost layer, wherein the foregoing solder resist
layer has a dielectric loss tangent of 0.01 or lower at 1 GHz.
[0040] A second invention of the fourth group of the present
invention is a multilayered printed circuit board comprising a
conductor circuit and a resin insulating layer serially formed on a
substrate in an alternate fashion and in repetition and a solder
resist layer formed as an outermost layer, wherein the foregoing
solder resist layer is comprising a polyphenylene ether resin.
[0041] A third invention of the fourth group of the present
invention is a semiconductor device comprising:
[0042] a multilayered printed circuit board wherein a conductor
circuit and a resin insulating layer are serially formed on a
substrate in an alternate fashion and in repetition, and a solder
resist layer having a solder bump as an uppermost layer; and
[0043] an IC chip connected with the foregoing multilayered printed
circuit board through the solder bump,
[0044] wherein the foregoing solder resist layer is comprising a
polyphenylene ether resin and the foregoing resin insulating layer
is comprising a polyphenylene ether resin, a polyolefin type resin
or a fluoro type resin.
[0045] A fifth group of the present invention is a multilayered
printed circuit board comprising a conductor circuit and a resin
insulating layer serially formed on a substrate in an alternate
fashion and in repetition and a solder resist layer formed as an
outermost layer, wherein the foregoing solder resist layer contains
a P atom-containing epoxy resin.
BRIEF DESCRIPTION OF DRAWINGS
[0046] FIGS. 1 (a) to (d) are cross-section figures showing a part
of a manufacturing processes of a multilayered printed circuit
board of the present invention.
[0047] FIGS. 2 (a) to (d) are cross-section figures showing a part
of a manufacturing processes of a multilayered printed circuit
board of the present invention.
[0048] FIGS. 3 (a) to (d) are cross-section figures showing a part
of a manufacturing processes of a multilayered printed circuit
board of the present invention.
[0049] FIGS. 4 (a) to (c) are cross-section figures showing a part
of a manufacturing processes of a multilayered printed circuit
board of the present invention.
[0050] FIGS. 5 (a) to (c) are cross-section figures showing a part
of a manufacturing processes of a multilayered printed circuit
board of the present invention.
[0051] FIGS. 6 (a) to (d) are cross-section figures showing a part
of a manufacturing processes of a multilayered printed circuit
board of the present invention.
[0052] FIGS. 7 (a) to (d) are cross-section figures showing a part
of a manufacturing processes of a multilayered printed circuit
board of the present invention.
[0053] FIGS. 8 (a) to (d) are cross-section figures showing a part
of a manufacturing processes of a multilayered printed circuit
board of the present invention.
[0054] FIGS. 9 (a) to (c) are cross-section figures showing a part
of a manufacturing processes of a multilayered printed circuit
board of the present invention.
[0055] FIGS. 10 (a) to (c) are cross-section figures showing a part
of a manufacturing processes of a multilayered printed circuit
board of the present invention.
[0056] FIGS. 11 (a) to (d) are cross-section figures showing a part
of a manufacturing processes of a multilayered printed circuit
board of the present invention.
[0057] FIGS. 12 (a) to (d) are cross-section figures showing a part
of a manufacturing processes of a multilayered printed circuit
board of the present invention.
[0058] FIGS. 13 (a) to (c) are cross-section figures showing a part
of a manufacturing processes of a multilayered printed circuit
board of the present invention.
[0059] FIGS. 14 (a) to (c) are cross-section figures showing a part
of a manufacturing processes of a multilayered printed circuit
board of the present invention.
[0060] FIGS. 15 (a) and (b) are cross-section figures showing a
part of a manufacturing processes of a multilayered printed circuit
board of the present invention.
[0061] FIGS. 16 (a) to (d) are cross-section figures showing a part
of a manufacturing processes of a multilayered printed circuit
board of the present invention.
[0062] FIGS. 17 (a) to (d) are cross-section figures showing a part
of a manufacturing processes of a multilayered printed circuit
board of the present invention.
[0063] FIGS. 18 (a) to (d) are cross-section figures showing a part
of a manufacturing processes of a multilayered printed circuit
board of the present invention.
[0064] FIGS. 19 (a) to (c) are cross-section figures showing a part
of a manufacturing processes of a multilayered printed circuit
board of the present invention.
[0065] FIGS. 20 (a) and (b) are cross-section figures showing a
part of a manufacturing processes of a multilayered printed circuit
board of the present invention.
[0066] FIGS. 21 (a) to (c) are cross-section figures showing a part
of a manufacturing processes of a multilayered printed circuit
board of the present invention.
[0067] FIGS. 22 (a) to (d) are cross-section figures showing a part
of a manufacturing processes of a multilayered printed circuit
board of the present invention.
[0068] FIGS. 23 (a) to (d) are cross-section figures showing a part
of a manufacturing processes of a multilayered printed circuit
board of the present invention.
[0069] FIGS. 24 (a) to (c) are cross-section figures showing a part
of a manufacturing processes of a multilayered printed circuit
board of the present invention.
[0070] FIGS. 25 (a) to (c) are cross-section figures showing a part
of a manufacturing processes of a multilayered printed circuit
board of the present invention.
[0071] FIGS. 26 (a) to (c) are cross-section figures showing a part
of a manufacturing processes of a multilayered printed circuit
board of the present invention.
[0072] FIGS. 27 (a) to (d) are cross-section figures showing a part
of a manufacturing processes of a multilayered printed circuit
board of the present invention.
[0073] FIGS. 28 (a) to (d) are cross-section figures showing a part
of a manufacturing processes of a multilayered printed circuit
board of the present invention.
[0074] FIGS. 29 (a) to (d) are cross-section figures showing a part
of a manufacturing processes of a multilayered printed circuit
board of the present invention.
[0075] FIGS. 30 (a) to (c) are cross-section figures showing a part
of a manufacturing processes of a multilayered printed circuit
board of the present invention.
[0076] FIGS. 31 (a) to (c) are cross-section figures showing a part
of a manufacturing processes of a multilayered printed circuit
board of the present invention.
[0077] FIGS. 32 (a) to (d) are cross-section figures showing a part
of a manufacturing processes of a multilayered printed circuit
board of the present invention.
[0078] FIGS. 33 (a) to (d) are cross-section figures showing a part
of a manufacturing processes of a multilayered printed circuit
board of the present invention.
[0079] FIGS. 34 (a) to (d) are cross-section figures showing a part
of a manufacturing processes of a multilayered printed circuit
board of the present invention.
[0080] FIGS. 35 (a) to (c) are cross-section figures showing a part
of a manufacturing processes of a multilayered printed circuit
board of the present invention.
[0081] FIGS. 36 (a) and (b) are cross-section figures showing a
part of a manufacturing processes of a multilayered printed circuit
board of the present invention.
DESCRIPTION OF SYMBOLS
[0082] 1 a substrate [0083] 2a, 2b a layer of a resin composition
for roughened-surface formation [0084] 2 an interlaminar resin
insulating layer [0085] 4 an under-level conductor circuit [0086]
4a a roughened surface [0087] 5 an upper level conductor circuit
[0088] 6 an opening part for a via-hole [0089] 7 a via-hole [0090]
8 a copper foil [0091] 9 a through hole [0092] 9a a roughened
surface [0093] 10 a resin filler [0094] 11 a roughened layer [0095]
12 an electroless plating layer [0096] 13 an electroplating layer
[0097] 14 a solder resist layer [0098] 15 a nickel plating film
[0099] 16 a gold plating film [0100] 17 a solder bump [0101] 19 a
solder [0102] 20 a pin
DETAILED DESCRIPTION OF THE INVENTION
[0103] At first, the first group of the present invention will be
described in details.
[0104] The first invention of a first group of the present
invention is a multilayered printed circuit board comprising a
conductor circuit and a resin insulating layer serially formed on a
substrate in an alternate fashion and in repetition and a solder
resist layer formed as an outermost layer, wherein the foregoing
solder resist layer contains an inorganic filler.
[0105] In the multilayered printed circuit board of the first
invention of the first group of the present invention, since the
solder resist layer contains the inorganic filler, the foregoing
solder resist layer has a lowered thermal expansion coefficient
attributed to the inorganic filler. Hence, linear expansion
coefficient difference with the interlaminar resin insulating layer
and an under-fill existing in the surroundings becomes small.
Consequently, cracking in the solder resist layer and peeling of
the solder resist layer from other layers can be prevented during a
manufacturing process of the multilayered printed circuit board and
after electronic parts such as an IC chip are mounted on the
multilayered printed circuit board.
[0106] That is, since the foregoing inorganic filler has a low
linear expansion coefficient as compared with that of a resin
composing the solder resist layer, when the solder resist layer is
expanded by the heat and a relatively high inner stress is caused
in the solder resist layer attributed to the difference of the
linear expansion coefficient with the under-fill or the
interlaminar resin insulating layer, it works as to moderate the
stress. In such a manner, the inner stress in the solder resist
layer can be moderated by the inorganic filler, so that generation
of cracking and peeling in the solder resist layer can be
prevented.
[0107] The foregoing inorganic filler is not specifically limited
and examples are an aluminum compound, a calcium compound, a
potassium compound, a magnesium compound, a silicon compound and
the like. These compounds may be used solely or as a mixture of two
or more of them.
[0108] As the foregoing aluminum compound, examples are alumina,
aluminum hydroxide and the like and as the foregoing calcium
compound, examples are calcium carbonate, calcium hydroxide and the
like.
[0109] As the foregoing potassium compound, examples are potassium
carbonate and the like and as the foregoing magnesium compound,
examples are magnesia, dolomite, a basic magnesium carbonate and
the like and as the foregoing silicon compound, examples are
silica, a zeolite and the like.
[0110] Although the shape of the foregoing inorganic filler is not
specifically limited, for example, available are a spherical shape,
an elliptically spherical shape, a polygonal shape and the like.
Among them, the spherical shape and the elliptically spherical
shape are preferable since cracking easily takes place if it has a
sharp tip.
[0111] The size of the foregoing inorganic filler is preferably
within a range from 0.1 to 5.0 .mu.m for the length of the longest
part (or the diameter). In case of being shorter than 0.1 .mu.m, it
is difficult to moderate the inner stress generated at the time
when the solder resist layer is thermally expanded and to control
the thermal expansion coefficient. In case of being longer than 5.0
.mu.m, the solder resist layer itself becomes stiff and fragile,
and further at the time of photocuring or thermosetting process,
the inorganic filler inhibits the reaction between the resins and
consequently, cracking is easily caused. From such points of view,
the inorganic filler is more preferably to be transparent.
[0112] In case of adding SiO.sub.2 as the foregoing inorganic
filler, the mixing ratio of the filler is preferably within a range
from 3 to 50% by weight. In case of the ratio thereof being less
than 3% by weight, the thermal expansion coefficient of the solder
resist layer is sometimes not sufficiently decreased and on the
other hand, in case of the ratio thereof being more than 50% by
weight, the resolution is lowered and the opening part sometimes
becomes abnormal. More preferably, it is within a range from 5 to
40% by weight.
[0113] The content of the inorganic filler in the solder resist
layer is more preferably 5 to 40% by weight. By using the inorganic
filler within the forgoing range, the linear expansion coefficient
of the solder resist layer can effectively be lowered and the
stress to be generated by the thermal expansion can effectively be
moderated.
[0114] That is because the linear expansion coefficient of the
resins or the resin complex composing the solder resist layer,
which is generally as high as 60.times.10.sup.-6 to
80.times.10.sup.-6/K, can be lowered to about 40.times.10.sup.-6 to
50.times.10/K by adding the foregoing inorganic filler to the
layer.
[0115] Further, the solder resist layer is preferable to be mixed
with a resin of an elastomer. The elastomer itself is excellent in
the flexibility and the resilient elasticity, so that even if
receiving the stress, the elastomer can absorb the stress or
moderate the stress to prevent cracking and peeling. Also, by
forming an island-in-sea structure, the cracking and peeling
attributed to the stress can be prevented. Incidentally, the
island-in-sea structure means the state that the elastomer
component exists like islands dispersed in the sea of the solder
resist composition other than the elastomer component.
[0116] As the foregoing elastomer, usable are natural rubber,
synthetic rubber, thermoplastic resins, thermosetting resins and
the like. The one especially capable of sufficiently moderating the
stress is an elastomer of a thermosetting resin.
[0117] As the foregoing elastomer of the thermosetting resin,
examples are an polyester type elastomer, a styrene type elastomer,
a vinyl chloride type elastomer, a fluoro type elastomer, an amide
type elastomer, an olefinic elastomer and the like.
[0118] The solder resist layer composing the first invention of the
first group of the present invention may further contain, for
example, a thermosetting resin, a thermoplastic resin, a complex of
a thermosetting resin and a thermoplastic resin other than the
foregoing inorganic filler and elastomer. As such a resin layer,
examples are: those formed by polymerizing and curing compositions
comprising novolak type epoxy resin (meth)acrylate, a bifunctional
(meth)acrylic acid ester monomer, a (meth)acrylic acid ester
polymer with a molecular weight of 500 to 5000, a thermosetting
resin comprising a bisphenol type epoxy resin, and photosensitive
monomers such as polyvalent acrylic monomers; and the like.
[0119] The foregoing bifunctional (meth)acrylic acid ester monomer
is not specifically limited, and examples are esters of acrylic
acid or methacrylic acid with a variety of diols. Products
available on the market are R-604, PM2, PM21 and the like produced
by Nippon Kayaku Co., Ltd.
[0120] As the foregoing novolak type epoxy resin (meth)acrylate,
examples are epoxy resins produced by reaction of glycidyl ether of
phenol novolak and cresol novolak with acrylic acid or methacrylic
acid. Incidentally, a method for manufacturing such a multilayered
printed circuit board will be described somewhere later.
[0121] Next, a solder resist composition of the second invention of
the first group of the present invention will be described
below.
[0122] The solder resist composition of the second invention of the
first group of the present invention is a solder resist composition
to be employed for manufacturing the multilayered printed circuit
board of the first invention of the first group of the present
invention, wherein an inorganic filler is mixed with a paste
containing a resin for solder resist a layer.
[0123] As the inorganic filler, the foregoing ones can be used. The
adding ratio of the filler is preferable to be 5 to 20% by weight
in the formed solder resist layer.
[0124] The solder resist composition of the second invention of the
first group of the present invention is preferably a paste-like
fluid containing, other than the foregoing inorganic filler, the
foregoing novolak type epoxy resin (meth)acrylate, an imidazole
curing agent, a bifunctional (meth)acrylic acid ester monomer, a
(meth)acrylic acid ester polymer with a molecular weight of 500 to
5000, a thermosetting resin comprising a bisphenol type epoxy resin
and the like, photosensitive monomers such as polyvalent acrylic
monomers, and glycol ether type solvents, and the viscosity thereof
is preferable to be controlled at 1 to 10 Pas at 25.degree. C.
[0125] Although the foregoing imidazole curing agent is not
specifically limited, it is preferable to use an imidazole curing
agent in the liquid-state at 25.degree. C. That is because if it is
a powder, uniform mixing and kneading is difficult and if in the
liquid phase, uniform mixing and kneading is easily carried
out.
[0126] Examples of such a liquid-phase imidazole curing agent are
1-benzyl-2-methylimidazole (1B2MZ, made by Shikoku Chemicals
Corp.), 1-cyanoethyl-2-ethyl-4-methylimidazole (2E4MZ-CN, made by
Shikoku Chemicals Corp.), 4-methyl-2-ethylimidazole (2E4MZ, made by
Shikoku Chemicals Corp.) and the like.
[0127] As the foregoing glycol ether type solvents, preferable are
those having chemical structure defined with the following general
formula [1] and practically, it is more preferable to use at least
one selected from diethylene glycol dimethyl ether (DMDG) and
triethylene glycol dimethyl ether (DMTG). Because these solvents
can completely dissolve benzophenon, Michler's ketone, and
ethylaminobenzophenone, which are polymerization initiators, by
increasing the temperature by 30 to 50.degree. C.
CH.sub.3O--(CH.sub.2CH.sub.2O).sub.n--CH.sub.3 [1]
(wherein the reference character n represents an integer of 1 to
5)
[0128] At the time of forming the solder resist layer using such a
solder resist component, at first a paste having the foregoing
composition is applied to a substrate, on which a plurality of
conductor circuits and a plurality of interlaminar resin insulating
layers are formed and a conductor circuit is formed on the
uppermost layer by the steps to be described somewhere later: by a
roll coater method or the like and then dried; or the solder resist
composition is formed into a film and the film is pressure-stuck to
the substrate with above mentioned structure. After that, an
opening part for a solder bump is formed at points in a solder
resist layer corresponding to the prescribed positions of the
under-level conductor circuit and, if necessary, curing treatment
is carried out to form a solder resist layer.
[0129] The method for manufacturing a multilayered printed circuit
board of the third invention of the first group of the present
invention is a method for manufacturing a multilayered printed
circuit board comprising a conductor circuit and a resin insulating
layer serially formed on a substrate in an alternate fashion and in
repetition and a solder resist layer formed as an outermost layer,
wherein the foregoing solder resist composition of the second
invention of the first group of the present invention is used.
[0130] The method for manufacturing a multilayered printed circuit
board of the third invention of the first group of the present
invention will be described along the processes in order.
[0131] (1) In the foregoing method for manufacturing a multilayered
printed circuit board of the present invention, at first a
substrate comprising an insulating substrate bearing a conductor
circuit formed on the surface is produced.
[0132] As the foregoing insulating substrate, a resin substrate is
desirable. Practically usable are, for example, a glass epoxy
substrate, a polyester substrate, a polyimide substrate, a
bismaleimide-triazine resin substrate, a thermosetting
polyphenylene ether substrate, a fluororesin substrate, a ceramic
substrate, a copper-laminated laminate board, an RCC substrate and
the like.
[0133] At that time, a through hole may be formed in the insulating
substrate. In this case, the through hole is preferably formed
using a drill or laser beam of 100 to 300 .mu.m diameter.
[0134] (2) Next, after electroless plating is carried out, an
etching resist with a conductor circuit pattern is formed on the
substrate and etched to form a conductor circuit. Copper plating is
desirable for the electroless plating. Further, in case of forming
a through hole for a plated-through hole in the insulating
substrate, the side walls of the a through hole for a
plated-through hole may simultaneously be plated by the electroless
plating to form the plated-through hole to electrically connect the
conductor circuits on both sides of the substrate.
[0135] Further, after the electroless plating, generally, the
surface of the electroless plating layer and, in the case that the
plated-through hole is formed, the inner wall of the plated-through
hole are subjected to the roughening treatment. The roughening
treatment method includes, for example, a blackening
(oxidation)-reduction treatment, a spraying treatment with an
aqueous mixed solution of an organic acid and a cupric complex, a
Cu--Ni--P acicular alloy plating and the like.
[0136] Practical methods for the foregoing blackening
(oxidation)-reduction treatment are, for example, those for
carrying out blackening treatment using an aqueous solution
containing NaOH (10 g/l), NaClO.sub.2 (40 g/l), and
Na.sub.3PO.sub.4 (6 g/l) as a blackening bath (an oxidizing bath)
and reducing treatment using an aqueous solution containing NaOH
(10 g/l) and NaBH.sub.4 (6 g/l) as a reducing bath.
[0137] Regarding the aqueous mixed solution containing the organic
acid and the cupric complex to be used for the foregoing spraying
treatment, examples of the organic acid are formic acid, acetic
acid, propionic acid, butyric acid, valeric acid, caproic acid,
acrylic acid, crotonic acid, oxalic acid, malonic acid, succinic
acid, glutaric acid, maleic acid, benzoic acid, glycollic acid,
lactic acid, malic acid, sulfamic acid, and the like.
[0138] They may be used solely or as a mixture of two or more of
them. In the foregoing mixed solution, the content of the foregoing
organic acid is preferably 0.1 to 30% by weight. Because the
solubility of the oxidized copper can be maintained and the
catalytic stability can be assured.
[0139] As the foregoing cupric complex, cupric complexes with
azoles are preferable. The cupric complexes with azoles work as
oxidizing agent to oxidize the metal copper and the like. Examples
of the azoles are diazole, triazole, tetrazole and the like. Among
them, especially desirable are imidazole, 2-methylimidazole,
2-ethylimidazole, 2-ethyl-4-methylimidazole, 2-phenylimidazole,
2-undecylimidazole. In the foregoing etching solution, the content
of the foregoing cupric complex is preferably 1 to 15% by weight.
That is because the solubility and the stability are kept excellent
and also a noble metal such as Pd composing a catalyst core can be
dissolved.
[0140] An example of the practical method for the foregoing plating
treatment is a method for carrying out an electroless plating in an
electroless plating bath containing copper sulfate (1 to 40 g/l),
nickel sulfate (0.1 to 6.0 g/l), citric acid (10 to 20 g/l), sodium
hypophosphite (10 to 100 g/l), boric acid (10 to 40 g/l), and a
surfactant (Surfynol 465, made by Nisshin Chemical Industry Co.,
Ltd.) (0.01 to 10 g/l) at pH 9 or the like.
[0141] In the case where the plated-through hole is formed in that
process, the plated-through hole are filled with a resin filler.
Further, based on necessity, recessed parts of the surface of the
insulating substrate where no under-level conductor circuit is
formed are also filled with the resin filler and after that the
insulating substrate surface may be leveled by polishing.
[0142] In the case where the plated-through hole is filled with the
resin filler, the resin filler is dried at 100.degree. C. for 20
minutes and then cured.
[0143] The curing is preferably carried out at a temperature
between 50.degree. C. and 250.degree. C. The curing conditions may
be, for example, heating at 100.degree. C. for 1 hour and then at
150.degree. C. for 1 hour. Based on necessity, curing may be
carried out step by step by changing the temperature from a lower
level to a higher level.
[0144] Further, in the case where the surface of the conductor
circuit is leveled by polishing, if necessary, the roughening
treatment for the under-level conductor circuit may be carried out.
As the roughening treatment, applicable are, for example, a
blackening (oxidation)-reduction treatment, a spraying treatment
with an aqueous mixed solution of an organic acid and a cupric
complex, a Cu--Ni--P alloy plating and the like.
[0145] (3) Next, a layer of a resin composition is formed on the
substrate on which the conductor circuit is formed, and in the
layer of the resin composition, an opening part for a via-hole and,
if necessary, a through hole is formed to form an interlaminar
resin insulating layer.
[0146] As a material for the foregoing interlaminar resin
insulating layer, examples are a resin composition for
roughened-surface formation, a polyphenyl ether resin, a polyolefin
type resin, a fluororesin, a thermoplastic elastomer and the
like.
[0147] The foregoing layer of the resin composition may be formed
by applying an un-cured resin or thermally pressure-laminating an
un-cured resin film. Further, an un-cured resin film with a metal
layer of such as a copper foil or the like formed on one side may
be laminated.
[0148] As the foregoing resin composition for the roughened-surface
formation, usable is, for example, a dispersion in which a particle
soluble in an acid or an oxidizing agent (hereinafter referred to
as a soluble particle) dispersed in a resin hardly soluble in an
acid or an oxidizing agent (hereinafter referred to as a hardly
soluble resin).
[0149] Incidentally, for the sake of convenience, the foregoing
terms, hardly soluble and soluble, mean that those dissolved at a
relatively high dissolution speed are defined soluble and those at
a relatively low dissolution speed are defined hardly soluble when
they are soaked in the same solution for the same time.
[0150] Examples of the foregoing soluble particle are a resin
particle soluble in an acid or an oxidizing agent (hereinafter
referred to as a soluble resin particle), an inorganic particle
soluble in an acid or an oxidizing agent (hereinafter referred to
as a soluble inorganic particle), and a metal particle soluble in
an acid or an oxidizing agent (hereinafter referred to as a soluble
metal particle). These soluble particles may be used solely or two
or more of them in combination.
[0151] The shape (particle diameter and the like) of the foregoing
soluble particle are not specifically limited, however the
following are preferable; (a) a soluble particle with the average
particle diameter of 10 .mu.m or smaller, (b) an agglomerated
particle formed by agglomerating a soluble particle which has the
average particle diameter of 2 .mu.m or smaller, (c) a mixture of a
soluble particle with the average particle diameter of 2 to 10
.mu.m and a soluble particle with the average particle diameter of
2 .mu.m or smaller, (d) a pseudo-particle formed by sticking at
least one of a heat resistant resin powder or an inorganic powder
with the average particle diameter of 2 .mu.m or smaller to the
surface of a soluble particle with the average particle diameter of
2 to 10 .mu.m, (e) a mixture of a soluble particle with the average
particle diameter of 0.1 to 0.8 .mu.m and a soluble particle with
the average particle diameter larger than 0.8 .mu.m and smaller
than 2 .mu.m, and (f) a soluble particle with the average particle
diameter of 0.1 to 1.0 .mu.m. Because these are capable of forming
further complicated anchors.
[0152] Examples of the soluble resin particle are those comprising
a thermosetting resin, a thermoplastic resin, and the like and any
can be used without restriction as long as they have higher
dissolution speed than the foregoing hardly soluble resin when they
are immersed in a solution comprising an acid or an oxidizing
agent.
[0153] Practical examples of the foregoing soluble resin particle
are those comprising an epoxy resin, a phenol resin, a polyimide
resin, a polyphenylene resin, a polyolefin resin, a fluororesin, an
amino resin (a melamine resin, an urea resin, a guanamine resin)
and the like and the soluble resin particle may be of one of these
resins or of a mixture of two or more of the resins.
[0154] Further, as the foregoing soluble resin particle, a resin
particle comprising rubber can be employed. As the foregoing
rubber, examples are polybutadiene rubber, a variety of modified
polybutadiene rubber such as an epoxy-modified, an
urethane-modified, a (meth)acrylonitrile-modified ones, a
(meth)acrylonitrile-butadiene rubber containing carboxyl group and
the like. By using such a rubber, the soluble resin particle
becomes easy to be dissolved in an acid or an oxidizing agent. That
is, at the time when the soluble resin particle is dissolved using
an acid, it can be dissolved in an acid other than a strong acid.
Also, at the time when the soluble resin particle is dissolved
using an oxidizing agent, it can be dissolved even in a permanganic
acid with a relatively weak oxidizing ability. Further, in case of
using a chromic acid, dissolution can be carried out in a low
concentration. Hence, no acid and no oxidizing agent remain on the
resin surface. Also, at the time when a catalyst such as palladium
chloride and the like is supplyied after roughened-surface
formation, as described later, such a case where no catalyst is
supplied or that the catalyst is oxidized can be avoided.
[0155] As the foregoing soluble inorganic particle, examples are
particles of at least one member selected from the group consisting
of an aluminum compound, a calcium compound, a potassium compound,
a magnesium compound, a silicon compound and the like.
[0156] As the foregoing aluminum compound, examples are alumina,
aluminum hydroxide and the like and as the foregoing calcium
compound, examples are calcium carbonate, calcium hydroxide and the
like. As the foregoing potassium compound, examples are potassium
carbonate and the like and as the foregoing magnesium compound,
examples are magnesia, dolomite, a basic magnesium carbonate and
the like and as the foregoing silicon compound, examples are
silica, a zeolite and the like. These compounds may be used solely
or two or more of them in combination.
[0157] As the foregoing soluble metal particle, examples are
particles of at least one of metals selected from the group
consisting of copper, nickel, iron, zinc, lead, gold, silver,
aluminum, magnesium, calcium, and silicon. Further, these soluble
metal particles may be coated with a resin and the like on the
surface in order to reliably keep the high insulating property.
[0158] In case of mixing two or more of the foregoing soluble
particles to be used, the combination of two types of the soluble
particles to be mixed is preferably a combination of a resin
particle and an inorganic particle. Because both have low
conductivity enough to reliably keep the high insulating property
of a resin film, are easy to arrange the thermal expansion between
a hardly soluble resin and them, and thus cause no crack in an
interlaminar resin insulating layer formed by using the resin film
and no peeling between an interlaminar resin insulating layer and a
conductor circuit.
[0159] The foregoing hardly soluble resin is not specifically
restricted as long as it can retain the roughened surface shape at
the time of forming a roughened surface on an interlaminar resin
insulating layer using an acid or an oxidizing agent and examples
are a thermosetting resin, a thermoplastic resin, a complex of them
and the like. Further, a photosensitive resin obtained by providing
these resins with photosensitivity may be used.
[0160] Among them, those containing a thermosetting resin are
preferable. Because, attributed to them, the shape of the roughened
surface can be maintained even by immersing in a plating solution
or various heating treatments.
[0161] As the foregoing thermosetting resin, examples are an epoxy
resin, a phenol resin, a polyimide resin and the like.
[0162] Further, as the photosensitized resin, those produced by
acrylic reaction of methacrylic acid or acrylic acid with a
thermosetting group are examples. Especially, acrylated epoxy resin
are preferable. Among them, epoxy resins having 2 or more of epoxy
groups in one molecule are preferable. That is because they are not
only able to form the foregoing roughened surface but also
excellent in heat resistance, so that the concentration of the
stress upon the metal layer can be avoided and the metal layer is
not peeled easily even in heat cycle conditions.
[0163] Examples of the foregoing epoxy resins are a cresol novolak
type epoxy resin, a bisphenol A type epoxy resin, a bisphenol F
type epoxy resin, a phenol novolak type epoxy resin, an alkylphenol
novolak type epoxy resin, a biphenol F type epoxy resin, a
naphthalene type epoxy resin, a dicyclopentadiene type epoxy resin,
epoxy compounds of condensates of phenols and aromatic aldehydes
having phenolic hydroxyl groups, triglycidyl isocyanurate, an
alicyclic epoxy resin and the like. They may be used solely or two
or more of them in combination. Heat resistance is therefore made
high.
[0164] Examples of the foregoing thermoplastic resin are a
polyether sulfone (PES), a polysulfone (PSF), a polyphenylene
sulfone (PPS), a polyphenylene sulfide (PPES), a polyphenylene
ether (PPE), a polyether imide (PI), a phenoxy resin, a fluororesin
and the like.
[0165] The mixing ratio of the foregoing thermosetting resin and
thermoplastic resin is preferably the thermosetting resin/the
thermoplastic resin=(95/5) to (50/50). Because with the ratio, a
high rigidity value can surely be obtained without deteriorating
the heat resistance.
[0166] The mixing ratio of the foregoing soluble particle by weight
is preferably 5 to 50% by weight, more preferably 10 to 40% by
weight, on the bases of solid content of the hardly soluble
resin.
[0167] In case of using an un-cured resin film to form the
foregoing interlaminar resin insulating layer, the soluble particle
is preferable to be evenly dispersed in the foregoing hardly
soluble resin in the foregoing film. Because a roughened surface
with uniform roughness can be formed and a high adhesion strength
to a metal layer of a conductor circuit to be formed can reliably
be obtained even if a via-hole and a plated-through hole are formed
in the resin film. Further, a resin film containing the soluble
particle only in the surface layer part where the roughened surface
is to be formed may be used. Consequently, since the parts other
than the surface layer part of the resin film are not exposed to an
acid or an oxidizing agent, the high insulating property between
neighboring conductor circuits through the interlaminar resin
insulating layer can reliably be maintained.
[0168] The mixing ratio of the soluble particle dispersed in the
hardly soluble resin particle in the foregoing resin film is
preferably 3 to 40% by weight. If the mixing ratio of the soluble
particle is less than 3% by weight, a roughened surface with a
desired roughness is sometimes not formed and if the mixing ratio
is more than 40% by weight, the resin film is dissolved even to a
deep depth when the soluble particle is dissolved with an acid or
an oxidizing agent. Hence, it sometimes leads to short circuit
since the high insulating property cannot be maintained between
neighboring conductor circuits through the interlaminar resin
insulating layer formed using the foregoing resin film.
[0169] The foregoing resin film may further contain a curing agent,
a solvent, and other components based on necessity, other than the
foregoing soluble particle and the hardly soluble resin.
[0170] The foregoing polyphenylene ether resin is not particularly
restricted and the examples are polyphenylene oxide (PPO),
polyphenylene ether (PPE) and the like.
[0171] The foregoing polyolefin type resin is, for example,
polyethylene, polypropylene, polyisobutylene, polybutadiene,
polyisoprene, a cycloolefin type resin, copolymers of these resins
and the like.
[0172] Among them, the cycloolefin type resin is preferable since
it has a low dielectric constant and dielectric loss tangent, does
not easily cause the signal delay and signal error even in case of
using high frequency signals in a GHz band and further is excellent
in the mechanical characteristics such as rigidity.
[0173] As the cycloolefin type resin, preferable are homopolymers
or copolymers of monomers such as 2-norbornene,
5-ethylidene-2-norbornene or their derivatives. As the foregoing
derivatives, examples are those obtained by bonding amino group and
maleic anhydride residue or maleic acid-modified ones, those are
for cross-linking formation, with cycloolefins such as the
foregoing 2-norbornene and the like.
[0174] As monomers used for the case of forming the foregoing
copolymers, examples are ethylene, propylene and the like.
[0175] The foregoing cycloolefin type resin may be a mixture of two
or more of the foregoing resins and also may contain a resin other
than the cycloolefin type resin.
[0176] In the case where the foregoing cycloolefin type resin is a
copolymer, it may be a block copolymer or a random copolymer.
[0177] Further, the foregoing cycloolefin type resin is preferably
a thermosetting cycloolefin type resin. Because the rigidity and
the mechanical characteristics are improved by cross-linking by
heating.
[0178] The glass transition temperature (Tg) of the foregoing
cycloolefin type resin is preferably 130 to 200.degree. C.
[0179] The foregoing cycloolefin type resin may be used in form of
an already formed resin sheet (film) or in state of an un-cured
solution containing monomers or polymers with low and defined
molecular weight dispersed in a solvent such as xylene, cyclohexane
and the like.
[0180] Further, in case of using a resin sheet, so-called RCC
(RESIN COATED COPPER) may be used.
[0181] The foregoing cycloolefin type resin may contain no filler
or the like and may contain a flame retardant such as aluminum
hydroxide, magnesium hydroxide, a phosphoric acid ester and the
like.
[0182] Examples of the foregoing fluorocarbon resin are
ethyl/tetrafluoroethylene copolymer resin (ETFE),
polychlorotrifluoroethylene (PCTFE), and the like.
[0183] The foregoing thermoplastic elastomer resin is not
particularly restricted and for example, a styrene type
thermoplastic elastomer, an olefin type thermoplastic elastomer,
urethane type thermoplastic elastomer, polyester type thermoplastic
elastomer, a polyamide type thermoplastic elastomer,
1,2-polybutadiene type thermoplastic elastomer, a vinyl chloride
type thermoplastic elastomer, a fluoro type thermoplastic elastomer
and the like. Among them, the olefin type thermoplastic elastomer
and the fluoro type thermoplastic elastomer are desirable in terms
of electric properties.
[0184] In case of forming the interlaminar resin insulating layer
by laminating the foregoing resin film, it is preferable to form
the interlaminar resin insulating layer using a vacuum laminator or
the like by pressure-laminating a resin film at 60 to 120.degree.
C. and 0.2 to 1.0 MPa and then thermally curing the resin film.
[0185] Incidentally, the thermal curing may be carried out after
formation of the opening part for a via-hole and the through
hole.
[0186] After the foregoing layer of the resin composition is
formed, the opening part for the via-hole and, if necessary, the
through hole are formed to form the interlaminar resin insulating
layer.
[0187] The foregoing opening part for the via-hole is formed by
laser treatment and the like. In case that a layer of the resin
composition is formed, the opening part for the via-hole may be
formed by exposure and development treatment. The laser beam to be
used in that case may be, for example, carbon dioxide gas
(CO.sub.2) laser, ultraviolet laser, excimer laser and the like and
among them, excimer laser and the carbon dioxide gas laser of short
pulses are preferable.
[0188] That is because the excimer laser, as described somewhere
later, is capable of forming a large number of opening parts for
via-holes at once using a mask or the like having through holes in
the parts where the opening parts for via-holes are to be formed.
That is also because the carbon dioxide gas laser of short pulses
is capable of forming the opening part for a via-hole with little
resin residue in the opening part and causes small damage on the
resin in the peripheries of the opening part.
[0189] Further, regarding excimer laser, a hologram method excimer
laser is preferable to be used. The hologram-method excimer laser
is a manner of radiating laser to an object through a hologram, a
condenser, a laser mask, a transfer lens, and the like. By
employing the method, a large number of opening parts can
efficiently be formed in the layer of the resin composition by one
time radiation.
[0190] In case of using the carbon dioxide gas laser, the intervals
of the pulses are preferably 10.sup.-4 to 10.sup.-8. Also, the
duration of the radiation of the laser for forming the opening part
is preferably 10 to 500.mu. second.
[0191] The through hole of the mask having the through hole in the
part corresponding to the part where the opening part for a
via-hole are to be formed is required to be truly round in order to
make the spot shape of the laser beam true round and the diameter
of the foregoing through hole is preferably 0.1 to 2 mm.
[0192] By radiating laser beam through the optical system lenses
and the mask, a large number of opening parts for a via-hole can be
formed at one time. Because laser beam can simultaneously be
radiated to a plurality of parts with the same intensity and with
the same radiation intensity by using the optical system lens and
the mask.
[0193] When the opening part is formed by laser beam, especially by
carbon dioxide gas laser, it is preferable to carry out de-smear
treatment. The foregoing de-smear treatment can be carried out
using an oxidizing agent of an aqueous solution of chromic acid,
permanganate, and the like. Further, the treatment may be carried
out by oxygen plasma, mixed plasma of CF.sub.4 and oxygen, corona
discharge and the like. The surface modification can also be
carried out by radiating ultraviolet ray using a low pressure
merqury lamp.
[0194] In case of forming through hole in the substrate in which
the resin layer is formed, the through hole is formed using a
drill, laser beam, and the like of 50 to 300 .mu.m diameter.
[0195] (4) Next, the surface of the interlaminar resin insulating
layer including the inner wall of the opening part for a via-hole
and the inner wall of the through hole, in the case where the
through hole is formed by the foregoing processes, are
surface-roughened by an acid or an oxidizing agent.
[0196] Examples of the foregoing acid are sulfuric acid, nitric
acid, hydrochloric acid, phosphoric acid, formic acid, and the like
and examples of the foregoing oxidizing agent are chromic acid,
chromic acid mixture, permanganate such as sodium permanganate, and
the like.
[0197] After that, neutralization of the inside of the opening part
for a via-hole and of the through hole is carried out using an
aqueous alkaline solution or the like if the roughened surface is
formed using an acid, and using a neutralization solution if the
roughened surface is formed using the oxidizing agent. The acid and
the oxidizing agent are removed by the operation to cause no effect
on the next process. Incidentally, the average roughness Rz of the
roughened surface formed in the process is preferably 0.1 to 5
.mu.m.
[0198] (5) Next, if necessary, a catalyst is supplied to the formed
roughened surface. The foregoing catalyst is, for example,
palladium chloride or the like.
[0199] In this case, in order to reliably supply the catalyst,
drying treatment such as treatment with oxygen, nitrogen or other
plasma, corona discharge treatment, and the like is carried out to
remove the residue of the acid or the oxidizing agent and modify
the surface of the interlaminar resin insulating layer, so that the
catalyst can surely be supplied and the adhesion strength of an
electroless plating layer to the interlaminar resin insulating
layer can be improved and especially significant effect can be
achieved on the bottom faces of the opening part for a
via-hole.
[0200] (6) Then, based on necessity, a thin film conductor layer
comprising tin, zinc, copper, nickel, cobalt, thallium, lead and
the like is formed on the formed interlaminar resin insulating
layer by electroless plating, sputtering and the like. The
foregoing thin film conductor layer may be single or layered in two
or more layers.
[0201] Among them, the thin film conductor layer is preferably
comprising copper, copper with nickel, and the like from a
viewpoint of the electric characteristics and the economical
advantage.
[0202] Further, in case of forming the through hole by the
foregoing process (3), the thin film conductor layer comprising a
metal may be formed also on the inner wall face of the through hole
in the process (3) to form the plated-through hole.
[0203] In case of forming the plated-through hole in the foregoing
process (6), the following treatment process is preferable to be
carried out. That is, the electroless plating layer surface and the
plated-through hole inner walls are subjected to the
surface-roughening treatment by blackening (oxidation)-reduction
treatment, a spraying treatment with an aqueous mixed solution of
an organic acid and a cupric complex, a Cu--Ni--P acicular alloy
plating and the like. After that, the plated-through hole is filled
with a resin filler and then surface layer parts and the
electroless plating layer surface are leveled by a polishing
treatment method such as buffing.
[0204] Further, the electroless plating is carried out to form an
electroless plating layer on the already formed thin film conductor
layer comprising a metal and the surface layer parts of the resin
filler, so that a cover plating layer is formed on the
plated-through hole.
[0205] (7) Next, a plating resist is formed on some of the
foregoing interlaminar resin insulating layer using a dry film and
after that, electroplating is carried out using the foregoing thin
film conductor layer as a lead to form an electroplating layer on
the non plating resist formed area.
[0206] Copper plating is preferable to be employed for the
foregoing electroplating.
[0207] At that time, the opening part for a via-hole may be filled
with the electroplating to form a filled via structure or the
opening part for a via-hole may be filled with a conductive paste
and then coated with a covering plating layer to form a filled via
structure. The formation of the filled via structure makes it
possible to form a via-hole immediate above a via-hole.
[0208] (8) After the electroplating layer is formed, the plating
resist is parted and the thin film conductor layer of a metal
existing under the plating resist is removed by etching to form an
independent conductor circuit. Copper plating is preferable to be
employed for the foregoing electroplating layer.
[0209] The etching solutions usable are, for example, an aqueous
sulfuric acid-hydrogen peroxide solution, an aqueous persulfuric
acid salt solution of such as ammonium persulfate, sodium
persulfate, potassium persulfate, and the like, an aqueous solution
of ferric chloride, cupric chloride, hydrochloric acid, nitric
acid, hot diluted sulfuric acid and the like. Further,
simultaneously with the etching of the conductor circuit,
surface-roughening may be carried out using an etching solution
containing the foregoing cupric complex and an organic acid.
[0210] Further, if necessary, the catalyst on the interlaminar
resin insulating layer may be removed using an acid or an oxidizing
agent. Since a metal such as palladium used as a catalyst goes away
by removing the catalyst, the electric characteristic deterioration
can be prevented.
[0211] (9) After that, if necessary, the processes (3) to (8) are
repeated and if the conductor circuit of the outermost layer is
required to be roughened, the conductor circuit having the
roughened surface is formed by the foregoing surface-roughening
treatment method.
[0212] (10) Next, the foregoing solder resist layer is formed on
the substrate on which the conductor circuit of the outermost
layer.
[0213] The foregoing solder resist layer is formed by applying the
foregoing solder resist composition by a roll coater method or by,
firstly, forming a resin film of the foregoing solder resist
composition and then thermally pressure bonding the resin film and
after that, carrying out opening treatment by exposure and
development treatment or laser treatment and further curing
treatment.
[0214] (11) Next, a corrosion resistant metal layer of Ni, Au and
the like is formed in the opening part of the solder resist layer
by plating, sputtering, evaporating, or the like and after that, a
solder bump is formed by printing a solder paste on the IC chip
connection face and solder balls and pins are installed in the
outside substrate connection face to complete the manufacture of
the multilayered printed circuit board. Incidentally, the
installation of the solder balls and pins is carried out by
employing a conventionally well-known method.
[0215] Incidentally, in order to carry out the letter printing
process for forming product identification letters and to modify
the solder resist layer, treatment with oxygen or carbon
tetrachloride plasma may properly be carried out.
[0216] Although the above described method is a semi-additive
method, a full-additive method may also be employed.
[0217] Through those manufacturing processes, a multilayered
printed circuit board of the first invention of the first group of
the present invention can be manufactured.
[0218] Hereinafter, the invention of the second group will be
described.
[0219] The first invention of the second group of the present
invention is a multilayered printed circuit board comprising a
conductor circuit and a resin insulating layer serially formed on a
substrate in an alternate fashion and in repetition and a solder
resist layer formed as an outermost layer, wherein the foregoing
solder resist layer contains an elastomer component.
[0220] In the multilayered printed circuit board of the first
invention of the second group of the present invention, since the
solder resist layer contains the elastomer component, the foregoing
solder resist layer is enabled to absorb or moderate the stress
because of the flexibility and the resilient elasticity of the
elastomer, hence, even when the stress is applied to the solder
resist layer, cracking in the solder resist layer and peeling of
the solder resist layer from other layers can be prevented, because
of the flexibility and the resilient elasticity of the elastomer,
during the manufacturing process of the multilayered printed
circuit board and after electronic parts such as an IC chip are
mounted on the multilayered printed circuit board and further even
if cracking takes place, the cracks are prevented from becoming
wide and big.
[0221] As the elastomer component to be use for the first invention
of the second group of the present invention, examples usable are
natural rubber, synthetic rubber, thermoplastic resins,
thermosetting resins and the like. The one especially capable of
sufficiently absorbing and moderating the stress is an elastomer
comprising a thermosetting resin. These elastomer components may be
used solely or in combination of two or more of them.
[0222] As the foregoing elastomer of the thermosetting resin,
examples are an polyester type elastomer, a styrene type elastomer,
a vinyl chloride type elastomer, a fluoro type elastomer, an amide
type elastomer, an olefinic elastomer and the like.
[0223] Although the shape of the foregoing elastomer component is
not particularly restricted, a spherical shape, an elliptically
spherical shape, and the like are preferable since such a shape has
an excellent effect to absorb and moderate the stress.
[0224] Although the size of the foregoing elastomer component is
not particularly restricted, the length (or the diameter) of the
longest part of the size of the foregoing inorganic filler is
preferably within a range from 0.5 to 1.5 .mu.m. That is because in
case of being shorter than 0.5 .mu.m, it becomes hard to absorb or
moderate the stress to result in easy formation of cracks and in
case of being longer than 1.5 .mu.m, the degree of the resolution
is lowered.
[0225] In the multilayered printed circuit board of the present
invention, the foregoing elastomer component is desirably in
micro-phase separated state as to form an island-in-sea structure
after curing of the foregoing solder resist layer. That is because
the dispersion of the elastomer component in such a state is most
optimum to absorb or moderate the stress by the elastomer component
to the highest extent.
[0226] The content of the elastomer component in the foregoing
solder resist layer is desirably 1 to 20% by weight. If the
foregoing content is less than 1% by weight, it becomes hard to
moderate and absorb the stress to result in easy generation of
cracking and if it is higher than 20% by weight, the degree of
resolution is lowered.
[0227] The foregoing solder resist layer is preferable to be mixed
with an inorganic filler other than the foregoing elastomer
component. As the same reason as described in the description of
the multilayered printed circuit board of the first invention of
the first group of the present invention, that is because the
linear expansion coefficient of the solder resist layer and that of
the other layers (the interlaminar resin insulating layers and the
like) can be well balanced so that generation of peeling and
cracking attributed to the difference of the linear expansion
coefficients can more efficiently be prevented.
[0228] The foregoing inorganic filler is not particularly
restricted and examples are an aluminum compound, a calcium
compound, a potassium compound, a magnesium compound, a silicon
compound and the like. More practically, the examples are the same
ones used for the multilayered printed circuit board of the first
invention of the first group of the present invention. These
compounds may be used solely or in combination of two or more of
them.
[0229] The content of the inorganic filler in the foregoing solder
resist layer is preferably 5 to 20% by weight. By using the
inorganic filler in the foregoing content, the linear expansion
coefficient of the solder resist layer can efficiently be lowered
to significantly suppress generation of the stress owing to the
thermal expansion.
[0230] The solder resist layer composing the multilayered printed
circuit board of the first invention of the second group of the
present invention may further contain a thermosetting resin, a
thermoplastic resin, a complex of the thermosetting resin and the
thermoplastic resin and the like other than the foregoing inorganic
filler and the elastomer component, and their examples are the same
as those contained in the solder resist layer constituting the
multilayered printed circuit board of the first invention of the
first group of the present invention.
[0231] Hereinafter, a solder resist composition of the second
invention of the second group of the present invention will be
described.
[0232] The solder resist composition of the second invention of the
second group of the present invention is characterized by mixing an
elastomer component in a paste containing a resin for a solder
resist layer.
[0233] As the foregoing elastomer component, those described above
can be employed. The content of the component is preferably to be 5
to 10% by weight in the solder resist composition.
[0234] The solder resist composition of the second invention of the
second group of the present invention is preferably to be a paste
type fluid containing the foregoing novolak type epoxy resin
(meth)acrylate, an imidazole curing agent, a bifunctional
(meth)acrylic acid ester monomer, a (meth)acrylic acid ester
polymer with a molecular weight of 500 to 5000, thermosetting
resins comprising a bisphenol type epoxy resin and the like,
photosensitive monomers such as polyvalent acrylic monomers, and
glycol ether type solvents, other than the foregoing elastomer
component and inorganic filler, and the viscosity of the paste is
preferably adjusted to be 1 to 10 Pas at 25.degree. C.
[0235] Examples of the foregoing imidazole curing agent and the
forgoing glycol ether type solvents are those same as described
above for the solder resist composition of the second invention of
the first group of the present invention.
[0236] At the time of forming a solder resist layer using such a
solder resist composition, at first a substrate on which conductor
circuits and interlaminar resin insulating layers are formed in a
plurality of layers and a conductor circuit is formed in the
uppermost layer is produced and then the paste having the foregoing
composition is applied by a roll coater method or the like and
dried. After that, an opening part for a solder bump is formed at
the point of a solder resist layer corresponding to the prescribed
positions of the under-level conductor circuit and if necessary,
curing treatment is carried out to form a solder resist layer.
[0237] The method for manufacturing a multilayered printed circuit
board of the third invention of the second group of the present
invention is a method for manufacturing a multilayered printed
circuit board comprising a conductor circuit and a resin insulating
layer serially formed on a substrate in an alternate fashion and in
repetition and a solder resist layer formed as an outermost layer,
wherein the foregoing solder resist composition of the second
invention of the second group of the present invention is used.
[0238] In the method for manufacturing a multilayered printed
circuit board of the third invention of the second group of the
present invention, at first a substrate comprising a conductor
circuit in the outermost layer is produced in the same manner as
the manufacturing processes (1) to (9) of the method for
manufacturing the multilayered printed circuit board of the third
invention of the first group of the present invention.
[0239] Then, a solder resist layer is formed by the foregoing
method using the solder resist composition of the second invention
of the second group of the present invention, that is, by applying
the solder resist composition or by thermally-laminating a film of
the solder resist composition and then carrying out opening
treatment by exposure and development treatment and further curing
treatment.
[0240] Further, a multilayered printed circuit board can be
manufactured in the same manner as described in the manufacturing
processes (10) and (11) in the method for manufacturing the
multilayered printed circuit board of the first invention of the
second group of the present invention.
[0241] Hereinafter, a multilayered printed circuit board of the
third group of the present invention will be described.
[0242] The first invention of the third group of the present
invention is a multilayered printed circuit board comprising a
conductor circuit and a resin insulating layer serially formed on a
substrate in an alternate fashion and in repetition and a solder
resist layer formed as an outermost layer, wherein the foregoing
solder resist layer has a dielectric constant of 3.0 or lower at 1
GHz.
[0243] In such a multilayered printed circuit board of the first
invention of the third group of the present invention, since the
dielectric constant of the foregoing solder resist layer is 3.0 at
highest, even if high frequency signals in the GHz band are used,
signal errors attributed to signal transmission delay and
transmission loss of the signals occurring in the solder resist
layer can be prevented.
[0244] Further, in case of using a solder resist layer with a low
dielectric loss tangent, in addition to the foregoing
characteristics, the signal errors attributed to signal
transmission loss and the like of the signals occurring in the
solder resist layer can be prevented regardless of the number of
the pads of the outer terminals even if the distances between
neighboring solder bumps are narrowed.
[0245] Furthermore, in the foregoing multilayered printed circuit
board, in case that using a polyolefin type resin or a
polyphenylene type resin is used for the interlaminar resin
insulating layer, the difference of the thermal expansion
coefficients between the solder resist layer and the interlaminar
resin insulating layer is made small, so that generation of
cracking and peeling can be prevented.
[0246] In the multilayered printed circuit board of the first
invention of the third group of the present invention, the
dielectric constant of the solder resist layer at 1 GHz is 3.0 or
lower. Attributed to such a low dielectric constant, signal errors
attributed to signal transmission delay and transmission loss of
the signals can be prevented. The foregoing dielectric constant is
preferably 2.4 to 2.7.
[0247] In the multilayered printed circuit board of the first
invention of the third group of the present invention, the
dielectric loss tangent of the solder resist layer at 1 GHz is 0.01
or lower. By employing such a low dielectric loss tangent, signal
errors attributed to signal transmission delay and transmission
loss of the signals can be prevented.
[0248] The solder resist layer having the foregoing low dielectric
constant and low dielectric loss tangent in the multilayered
printed circuit board of the first invention of the third group of
the present invention is preferable to contain at least one member
selected from the group consisting of a polyolefin type resin, a
polyphenylene ether, and a fluorotype resin.
[0249] Examples of the polyolefin type resin are polyethylene,
polypropylene, polyisobutylene, polybutadiene, polyisoprene, a
cycloolefin type resin, copolymers of these resins and the
like.
[0250] Available as a product of the foregoing polyolefin type
resin sold in a market, is 1592 (trade name) made by Sumitomo 3M
Ltd. Also, available as products of the foregoing thermoplastic
polyolefin type resin with 200.degree. C. or higher melting point
and sold in a market are trade name, TPX (melting point of
240.degree. C.), made by Mitsui Petrochemical Industries Ltd. and
trade name, SPS (melting point of 270.degree. C.), made by Idemitsu
Petrochemical Co., Ltd. and the like.
[0251] Among them, cycloolefin type resin is preferable since it
has a low dielectric constant and dielectric loss tangent, does not
easily cause the signal delay and signal error even in case of
using high frequency signals in a GHz band and further is excellent
in the mechanical characteristics such as rigidity.
[0252] As the cycloolefin type resin, preferable are homopolymers
or copolymers of monomers such as 2-norbornene,
5-ethylidene-2-norbornene, and their derivatives. As the foregoing
derivatives, examples are those obtained by bonding amino group and
maleic anhydride residue, those are for cross-linking formation,
with cycloolefins such as the foregoing 2-norbornene or maleic
acid-modified cycloolefins and the like.
[0253] As monomers used for the case of forming the foregoing
copolymers, examples are ethylene, propylene and the like.
[0254] The foregoing cycloolefin type resin may be a mixture of two
or more of the foregoing resins and also may contain a resin other
than the cycloolefin type resin.
[0255] In the case where the foregoing cycloolefin type resin is a
copolymer, it may be a block copolymer or a random copolymer.
[0256] Further, the foregoing cycloolefin type resin is preferably
a thermosetting type cycloolefin type resin. Because the rigidity
and the mechanical characteristics are improved by cross-linking by
heating.
[0257] The glass transition temperature (Tg) of the foregoing
cycloolefin type resin is preferably 130 to 200.degree. C.
[0258] The foregoing cycloolefin type resin may be used in form of
an already formed resin sheet (film) or in state of an un-cured
solution containing monomers or polymers thereof with low and
certain molecular weight dispersed in a solvent such as xylene,
cyclohexane and the like.
[0259] Further, in case of using a resin sheet, so-called RCC
(RESIN COATED COPPER) may be used.
[0260] The foregoing cycloolefin type resin may contain no filler
or the like and may contain a flame retardant such as aluminum
hydroxide, magnesium hydroxide, a phosphoric acid ester and the
like.
[0261] The olefin type resin to be used for the foregoing solder
resist layer is generally transparent.
[0262] For that, if such polyolefin type resin is used as it is for
the solder resist layer, there is a probability that an inner
conductor circuit or target mark can be erroneously read out at the
time of mounting it, or cutting it in fragments, so that it is
preferable for the polyolefin type resin to be used for formation
of a solder resist layer to be colored in green or dark blue color.
In such a manner, the alignment marks of an inner layer and the
surface layer of a multilayered printed circuit board can be
discriminated.
[0263] Preferable as the resin composing the interlaminar resin
insulating layer of the multilayered printed circuit board of the
first invention of the third group of the present invention are a
polyolefin type resin, a polyphenylene type resin (PPE, PPO, etc.),
a fluorotype resin and the like.
[0264] Examples of the olefin type resin are the foregoing
polyethylene, polypropylene, and the like and examples of the
foregoing fluorotype resin are ethyl/tetrafluoroethylene copolymer
resin (ETFE), polychlorotrifluoroethylene (PCTFE), and the
like.
[0265] By using such resins, the dielectric constant and the
dielectric loss tangent of the multilayered printed circuit board
as a whole can be lowered and signal delay and signal errors do not
take place easily even in case of using high frequency signals in
the GHz band. Further, since the thermal expansion coefficient of
the resin to be used for the foregoing resin insulating layer is
not so much different from the thermal expansion coefficient of the
polyolefin type resin or the like to be used of the solder resist
layer, peeling and cracking do not easily take place.
[0266] The second invention of the third group of the present
invention is a multilayered printed circuit board comprising a
conductor circuit and a resin insulating layer serially formed on a
substrate in an alternate fashion and in repetition and a solder
resist layer formed as an outermost layer, wherein the foregoing
solder resist layer is comprising a polyolefin type resin.
[0267] In such a multilayered printed circuit board of the second
invention of the third group of the present invention, since the
polyolefin type resin is used for the foregoing solder resist
layer, even if high frequency signals in the GHz band are used,
signal errors attributed to signal transmission delay and
transmission loss of the signals occurring in the solder resist
layer can be prevented.
[0268] Further, in case that a solder resist layer with a low
dielectric constant is used, even if high frequency signals in the
GHz band are used, signal errors attributed to signal transmission
delay and transmission loss of the signals occurring in the solder
resist layer can be further prevented.
[0269] Further, in case of using a solder resist layer with a low
dielectric loss tangent, in addition to the foregoing
characteristics, the signal errors attributed to signal
transmission loss and the like of the signals occurring in the
solder resist layer can be prevented regardless of the number of
pads even if the distance between neighboring solder bumps are
narrowed.
[0270] Furthermore, in the foregoing multilayered printed circuit
board, in case that a polyolefin type resin or a polyphenylene type
resin is used for the interlaminar resin insulating layer, the
difference of the thermal expansion coefficients between the solder
resist layer and the interlaminar resin insulating layer is made
small, so that generation of cracking and peeling can be
prevented.
[0271] In the multilayered printed circuit board of the second
invention of the third group of the present invention, although the
polyolefin type resin to be used for the solder resist layer is not
particularly restricted, it is preferable to use those having the
dielectric constant of 3.0 or lower at 1 GHz. By using such a resin
with the specified low dielectric constant, signal errors
attributed to signal transmission delay and transmission loss of
the signals can be prevented. The foregoing dielectric constant is
preferably 2.4 to 2.7.
[0272] In the multilayered printed circuit board of the second
invention of the third group of the present invention, the
dielectric loss tangent of the polyolefin type resin to be used for
the solder resist layer is preferably is 0.01 or lower at 1 GHz. By
using such a resin with such a low dielectric loss tangent, signal
errors attributed to signal transmission delay and transmission
loss of the signals can be prevented.
[0273] Examples of the foregoing polyolefin type resin are
polyethylene, polypropylene, polyisobutylene, polybutadiene,
polyisoprene, a cycloolefin type resin, copolymers of these resins
and the like.
[0274] Products of the foregoing polyolefin type resin sold
available in a market are the same as those exemplified in the
first invention of the third group of the present invention.
[0275] Among them, cycloolefin type resin is preferable since: it
has a low dielectric constant and dielectric loss tangent; it does
not easily cause the signal delay and signal error even in case of
using high frequency signals in a GHz band; and further it is
excellent in the mechanical characteristics such as rigidity.
[0276] As the cycloolefin type resin, examples are those same as
exemplified in the first invention of the third group of the
present invention.
[0277] The resin composing the interlaminar resin insulating layer
of the multilayered printed circuit board of the second invention
of the third group of the present invention is preferable to be the
same as that used in the first invention of the third group of the
present invention.
[0278] By using such resins, the dielectric constant and the
dielectric loss tangent of the multilayered printed circuit board
as a whole can be lowered as the same in the case of the
multilayered printed circuit board of the first invention of the
third group of the present invention and signal delay and signal
errors do not easily take place even in case of using high
frequency signals in the GHz band. Further, since the thermal
expansion coefficient of the resin to be used for the foregoing
resin insulating layer is not so much different from the thermal
expansion coefficient of the polyolefin type resin and the like to
be used of the solder resist layer, peeling and cracking do not
easily take place.
[0279] Next, a method for manufacturing the multilayered printed
circuit board of the third group of the present invention will be
described. The multilayered printed circuit boards of the first and
the second inventions of the third group of the present invention
can be manufactured in the same method as the method for
manufacturing the multilayered printed circuit board of the third
invention of the first group of the present invention except that
the solder resist composition containing the forgoing resin (a
polyolefin type resin and the like) is used.
[0280] Further, in the method for manufacturing the multilayered
printed circuit boards of the first and the second inventions of
the third group of the present invention, an opening is preferably
formed using laser at the time of forming the solder resist layer
having the opening part. That is because the polyolefin type resin
or the like are suitable for forming the opening by laser
treatment.
[0281] Incidentally, as described above, a polyolefin type resin, a
polyphenylene type resin, or a fluorotype resin are preferable to
be employed in the manufacture of the multilayered printed circuit
boards of the first and the second inventions of the third group of
the present invention. Further, in case of forming an interlaminar
resin insulating layer using such a material, it is preferable to
form an opening part for a via-hole using laser.
[0282] Hereinafter, a semiconductor device of the third invention
of the third group of the present invention will be described.
[0283] The third invention of the third group of the present
invention is a semiconductor device comprising:
[0284] a multilayered printed circuit board wherein a conductor
circuit and a resin insulating layer are serially formed on a
substrate in an alternate fashion and in repetition and a solder
resist layer having a solder bump is formed as an uppermost layer;
and an IC chip connected with the foregoing multilayered printed
circuit board through the solder bump,
[0285] wherein the foregoing solder resist layer is comprising a
polyolefin type resin and the foregoing resin insulating layer is
comprising a polyolefin type resin, a polyphenylene type resin or a
fluororesin.
[0286] Examples of the polyolefin type resin to be employed for the
solder resist layer of the semiconductor device of third invention
of the third group of the present invention are those same as the
polyolefin type resin used for the multilayered printed circuit
board of the first invention of the third group of the present
invention. The foregoing polyolefin resin is preferably a
cycloolefin type resin. Because it has a low dielectric constant
and a low dielectric loss tangent and is excellent in mechanical
characteristics.
[0287] The resin insulating layer of the semiconductor device of
third invention of the third group of the present invention is
comprising a polyolefin type resin, a polyphenylene type resin, or
a fluoro type resin. By using such a resin, the dielectric constant
and the dielectric loss tangent of the entire multilayered printed
circuit board are lowered and the signal delay and the signal
errors do not easily take place even if high frequency signals in
the GHz band are used. Further, since the thermal expansion
coefficient of the resin used for the foregoing resin insulating
layer is not so much different from the thermal expansion
coefficient of the polyolefin type resin to be used for the solder
resist layer, peeling and cracking do not easily take place.
[0288] At the time of manufacturing the semiconductor device of
third invention of the third group of the present invention, after
the multilayered printed circuit board having a solder bump is
manufactured, an IC chip is mounted on the prescribed position of
the solder resist layer having the solder bump and the IC chip and
the circuit of the printed circuit board are connected by re-flow
of the solder by heating. Successively, an under-fill is filled in
the printed circuit board with which the IC chip is connected, and
thus sealing with a resin is carried out to complete the
manufacture of the semiconductor device.
[0289] In the semiconductor device of third invention of the third
group of the present invention, even if the frequency of the IC
chip is in a signal region of a high frequency of 1 GHz or higher,
no signal error attributed to signal transmission delay and
transmission loss of signals takes place.
[0290] Hereinafter, the present invention of the fourth group will
be described.
[0291] The first invention of the fourth group of the present
invention is a multilayered printed circuit board comprising a
conductor circuit and a resin insulating layer serially formed on a
substrate in an alternate fashion and in repetition and a solder
resist layer formed as an outermost layer, wherein the foregoing
solder resist layer has a dielectric loss tangent of 0.01 or lower
at 1 GHz.
[0292] In the multilayered printed circuit board of the first
invention of the fourth group of the present invention, since the
electric loss tangent of the foregoing solder resist layer at 1 GHz
is 0.01 or lower, the signal errors attributed to signal
transmission delay and transmission loss of the signals occurring
in the solder resist layer can be prevented.
[0293] Further, in the case where both of the dielectric loss
tangent and the dielectric constant of the foregoing solder resist
layer are low, in addition to the foregoing characteristics, the
signal errors attributed to signal transmission loss and the like
of the signals occurring in the solder resist layer can be
prevented regardless of the number of the pads of the outer
terminals even if the distances between neighboring solder bumps
are narrowed.
[0294] The solder resist layer of the multilayered printed circuit
board of the first invention of the fourth group of the present
invention has a dielectric loss tangent of 0.01 or lower at 1 GHz.
By using a solder resist layer with such a low dielectric loss
tangent, the foregoing signal errors attributed to signal
transmission loss and the like of the signals occurring in the
solder resist layer can be prevented. A desirable dielectric loss
tangent is 0.001 or lower.
[0295] Further, the dielectric constant of the foregoing solder
resist layer at 1 GHz is preferably 3.0 or lower. By employing the
solder resist layer having both low dielectric loss tangent and low
dielectric constant, the signal errors attributed to signal
transmission loss and the like of the signals occurring in the
solder resist layer can further reliably be prevented.
[0296] In the multilayered printed circuit board of the first
invention of the fourth group of the present invention, the
forgoing solder resist layer having a low dielectric loss tangent
and a low dielectric constant is preferably a layer containing at
least one of the group consisting of a polyphenylene ether resin, a
polyolefin type resin, and a fluoro type resin.
[0297] As the foregoing polyphenylene ether resin, examples are the
same as those exemplified as the polyphenylene ether to be used for
the multilayered printed circuit board of the second invention of
the fourth group of the present invention to be described somewhere
later.
[0298] Further, as the foregoing polyolefin resin, examples are the
same as those exemplified as the polyolefin resin to be used for a
solder resist layer of the multilayered printed circuit board of
the first invention of the third group of the present
invention.
[0299] As the foregoing fluorotype resin, examples are
ethyl/tetrafluoroethylene copolymer resin (ETFE),
polychlorotrifluoroethylene (PCTFE), and the like.
[0300] Examples of the resin to be used for the resin insulating
layer of the multilayered printed circuit board of the present
invention are a polyphenylene ether resin, a polyolefin type resin,
and a fluorotype resin.
[0301] As the foregoing polyphenylene ether resin, examples are the
same as those exemplified as the polyphenylene ether resin to be
used for the solder resist layer of the second invention of the
fourth group of the present invention to be described somewhere
later.
[0302] As the foregoing polyolefin resin and fluorotype resin,
examples are the same as those to be used for the foregoing solder
resist layer.
[0303] By using such resins, the dielectric loss tangent and the
dielectric constant of the entire body of the multilayered printed
circuit board can be lowered and thus signal delay and signal
errors do not easily takes place even in case of using high
frequency signals in the GHz band. In addition to that, especially
in case of using a polyphenylene resin for both of the interlaminar
resin insulating layer and the solder resist layer, generation of
cracking and peeling can further reliably be prevented owing to
little difference of the thermal expansion coefficients of the
solder resist layer and the interlaminar resin insulating
layer.
[0304] The second invention of the fourth group of the present
invention is a multilayered printed circuit board comprising a
conductor circuit and a resin insulating layer serially formed on a
substrate in an alternate fashion and in repetition and a solder
resist layer formed as an outermost layer, wherein the foregoing
solder resist layer is comprising a polyphenylene ether resin.
[0305] In the multilayered printed circuit board of the second
invention of the fourth group of the present invention, since the
polyphenylene resin is used for the foregoing solder resist layer,
signal errors attributed to signal transmission delay and
transmission loss of the signals occurring in the solder resist
layer can be prevented even if high frequency signals in the GHz
band are used.
[0306] Further, in case of employing a solder resist layer with a
low dielectric loss tangent, signal errors attributed to signal
transmission delay and transmission loss of the signals occurring
in the solder resist layer can be prevented even if high frequency
signals in the GHz band are used.
[0307] Further, in case of employing a solder resist layer with a
low dielectric constant, in addition to the foregoing
characteristics, signal errors attributed to signal transmission
delay and transmission loss of the signals occurring in the solder
resist layer can be prevented regardless of the number of the pads
of the outer terminals even if the distances between neighboring
solder bumps are narrowed.
[0308] Further, in case of using a polyphenylene ether resin for
the interlaminar resin insulating layer in the foregoing
multilayered printed circuit board, since the difference of the
thermal expansion coefficients between the solder resist layer and
the interlaminar resin insulating layer is made small, generation
of cracking and peeling can be prevented.
[0309] In the multilayered printed circuit board of second
invention of the fourth group of the present invention, the
polyphenylene ether resin to be used for the solder resist layer is
not particularly restricted and usable examples are a thermoplastic
polyphenylene ether resin having a repeating monomer unit having
the following chemical formula [2], a thermosetting polyphenylene
ether resin having a repeating monomer unit having the following
chemical formula [3] and the like:
##STR00001##
(wherein, the reference character n represents an integer of 2 or
higher)
##STR00002##
(wherein, the reference character m represents an integer of 2 or
higher; R.sup.1, R.sup.2 separately represent methylene, ethylene,
or --CH.sub.2--O--CH.sub.2-- and both may be the same or
dissimilar.).
[0310] The thermoplastic polyphenylene ether resin having the
repeating monomer unit of the foregoing chemical formula [2] has
the structure that methyl groups are bonded to the benzen ring,
however the polyphenylene ether resin usable for the present
invention may be derivatives obtained by substituting the methyl
group with other alkyl group such as ethyl group or by substituting
hydrogen of the methyl group with fluorine.
[0311] These polyphenylene ether resins may be used solely or in
combination of two or more of them.
[0312] Among these polyphenylene ether resins, the thermosetting
polyphenylene ether resin having the chemical formula [3] is
preferable from a viewpoint that the rigidity and the mechanical
characteristics are improved by heating.
[0313] Further, the foregoing polyphenylene ether resin is
preferable to have a dielectric loss tangent of 0.01 or lower and a
dielectric constant of 3.0 or lower at 1 GHz.
[0314] The representative ones of the foregoing polyphenylene ether
resin (including the thermosetting polyphenylene ether resin) have:
a dielectric constant as low as 2.45 to 2.50 (1 MHz); and a
dielectric loss tangent of (0.7.times.10.sup.-3) to
(1.0.times.10.sup.-3) (1 MHz), which are both low and within the
foregoing ranges. They also have a glass transition temperature
about 210 to 250.degree. C., a water absorption rate as low as
0.05% or less and thus they are suitable to be employed for the
solder resist layer.
[0315] By using the polyphenylene ether resin having the foregoing
dielectric constant and dielectric loss tangent, even if high
frequency signals in the GHz band are used, signal errors
attributed to signal transmission delay and transmission loss can
be prevented.
[0316] The polyphenylene ether resin may be used in form of an
already formed resin sheet (film) or in state of an un-cured
solution containing monomers or polymers thereof with low and
defined molecular weight dispersed in an aromatic hydrocarbon type
solvent such as xylene, toluene, cyclohexane and the like.
[0317] Further, in case of using the resin sheet, so-called RCC
(RESIN COATED COPPER) may be used.
[0318] The resin to be used for the solder resist layer may be
solely comprising the foregoing polyphenylene ether resin or may be
mixed with other components unless they do not deteriorate the low
dielectric constant and dielectric loss tangent.
[0319] Examples of the resin used for the resin insulating layer of
the multilayered printed circuit board of second invention of the
fourth group of the present invention are a polyphenylene ether
resin, a polyolefin type resin, or a fluoro type resin and the
like. As the polyphenylene ether resin, examples are the same as
those of the polyphenylene ether resin used for the foregoing
solder resist layer. Further as the foregoing polyolefin type resin
and fluoro type resin, examples are the same as those to be used in
the first invention of the fourth group of the present
invention.
[0320] Among them, the polyphenylene ether resin is preferable.
[0321] By using the polyphenylene ether resin as an insulating
resin, both of the dielectric loss tangent and the dielectric
constant of the entire multilayered printed circuit board are
lowered and the signal delay and the signal errors does not easily
take place even if high frequency signals in the GHz band are used.
Further, since the thermal expansion coefficient of the resin used
for the resin insulating layer is not so much different from the
thermal expansion coefficient of the solder resist layer, peeling
and cracking can further reliably be prevented.
[0322] Hereinafter, description will be given of a method for
manufacturing a multilayered printed circuit board of the fourth
group of the present invention.
[0323] The multilayered printed circuit boards of the first and the
second inventions of the fourth group of the present invention can
be manufactured by the same method for manufacturing the
multilayered printed circuit board of the third invention of the
first group of the present invention except that the solder resist
composition contains the foregoing resins (polyphenylene ether
resin). Further, in manufacture of the multilayered printed circuit
boards of the first and the second inventions of the fourth group
of the present invention, it is preferable to form an opening part
using laser at the time of forming a solder resist layer having the
opening part. That is because the polyphenylene ether resin and the
like are suitable for forming an opening for a via hole by laser
treatment.
[0324] Incidentally, in manufacture of the multilayered printed
circuit boards of the first and the second inventions of the fourth
group of the present invention, as described above, it is
preferable to use a polyphenylene ether resin, a polyolefin type
resin, or a fluorotype resin for the materials of interlaminar
resin insulating layer. Further, an opening part for a via-hole are
preferably formed by using laser in case of forming the
interlaminar resin insulating layer using such materials.
[0325] Hereinafter, description will be given of a semiconductor
device of the third invention of the fourth group of the present
invention.
[0326] The third invention of the fourth group of the present
invention is a semiconductor device comprising:
[0327] a multilayered printed circuit board wherein a conductor
circuit and a resin insulating layer are serially formed on a
substrate in an alternate fashion and in repetition and a solder
resist layer having a solder bump is formed as an uppermost layer;
and an IC chip connected with the foregoing multilayered printed
circuit board through the solder bump,
[0328] wherein the foregoing solder resist layer is comprising a
polyphenylene ether resin and the foregoing resin insulating layer
is comprising a polyphenylene ether resin, a polyolefin type resin,
or a fluoro type resin.
[0329] As the polyphenylene type resin to be used for the solder
resist layer of the semiconductor device of the third invention of
the fourth group of the present invention, examples are the same as
the polyphenylene ether resin to be used for the first invention of
the fourth group of the present invention. As the foregoing
polyphenylene ether resin, a thermosetting type polyphenylene ether
resin is preferable because it has a low dielectric constant and a
low dielectric loss tangent and excellent mechanical
characteristics.
[0330] The resin insulating layer of the semiconductor device of
the third invention of the fourth group of the present invention
are comprising a polyphenylene ether resin, a polyolefin type
resin, or a fluoro type resin. By using such a resin, the
dielectric constant and the dielectric loss tangent of the entire
multilayered printed circuit board are lowered and the signal delay
and the signal errors do not easily take place even if high
frequency signals in the GHz band are used. Further, since the
thermal expansion coefficient of the resin used for the foregoing
resin insulating layer is not so much different from the thermal
expansion coefficient of the polyphenylene type resin to be used
for the solder resist layer, peeling and cracking do not easily
take place.
[0331] At the time of manufacturing the semiconductor device of the
third invention of the fourth group of the present invention, after
the multilayered printed circuit board having a solder bump is
manufactured by the above mentioned method, an IC chip is mounted
on prescribed positions of the solder resist layer having the
solder bump, the solder is heated for reflow to connect the
circuits of the printed circuit board and the IC chip.
Successively, the resultant printed circuit board connected with
the IC chip is filled with an under-fill (a resin layer) and
sealing with a resin is carried out to complete manufacture of a
semiconductor device.
[0332] In the semiconductor device of the third invention of the
fourth group of the present invention, even if high frequency
signals in the GHz band are used for the frequency of an IC chip,
signal errors attributed to signal transmission delay and
transmission loss of the signals are not generated.
[0333] Next, the present invention of the fifth group will be
explained.
[0334] The present invention of the fifth group is a multilayered
printed circuit board comprising a conductor circuit and a resin
insulating layer serially formed on a substrate in an alternate
fashion and in repetition and a solder resist layer formed as an
outermost layer, wherein the foregoing solder resist layer contains
a P atom-containing epoxy resin.
[0335] In the multilayered printed circuit board of the fifth group
of the present invention, since the solder resist layer contains a
P atom-containing epoxy resin, the multilayered printed circuit
board is provided with excellent flame retardancy due to its
existence. That is because even if the resin starts burning at the
time of ignition, the burning can be stopped at the points of P
atoms since the solder resist layer contains a P atom-containing
epoxy resin.
[0336] Further, since the solder resist layer formed on the
multilayered printed circuit board of the fifth group of the
present invention is formed by using an epoxy resin excellent in
the close adhesion strength as a raw material, the adhesion
strength between the solder resist layer and the conductor circuit
is high.
[0337] Further, as raw materials for the foregoing solder resist
layer, other than the foregoing P atom-containing epoxy resin,
commonly used ones or the like are used so that an opening part
with desired shapes is formed in the foregoing solder resist layer
by exposure and development treatment and the like.
[0338] In the multilayered printed circuit board of the fifth group
of the present invention, the solder resist layer contains the P
atom-containing epoxy resin.
[0339] As the foregoing P atom-containing epoxy resin, although
there is no particular restriction as long as epoxy resins contain
phosphorus, however an epoxy resin having phosphoric acid residue
is preferable and an epoxy resin having phosphoric acid ester bond
is further preferable.
[0340] Specifically, an epoxy resin containing divalent phosphoric
acid residues and having epoxy groups in both terminals, and an
epoxy resin having a monovalent phosphoric acid residue in one
terminal and an epoxy group in the other terminal are
preferable.
[0341] As the foregoing epoxy resin containing divalent phosphoric
acid residues and having epoxy groups in both terminals, examples
are P atom-containing epoxy resins having the following general
formula [4]
(wherein X.sup.1, X.sup.2 respectively represent 0 or a single
bond.)
##STR00003##
In the case where X.sup.1 and/or X.sup.2 is O (oxygen), the P
atom-containing epoxy resin having the foregoing general formula
[4] has phosphoric acid ester bonds.
[0342] In the epoxy resins having the foregoing general formula
[4], compounds having the following chemical formula [6]:
##STR00004##
: are bonded to the phosphoric acid residue and the compounds
bonded with the foregoing phosphoric acid residue may be compounds,
for example, having the following chemical formula [7]:
##STR00005##
: or the compounds bonded to the phosphoric acid residue may be
dissimilar to one another.
[0343] Further, as the epoxy resin having a monovalent phosphoric
acid residue in one terminal and an epoxy group in the other
terminal, examples are P atom-containing epoxy resins having the
following general formula [5]:
##STR00006##
: (wherein X.sup.3 represents O or a single bond; and R represents
an alkyl of 2 to 8 carbons).
[0344] In the case where X.sup.3 is O (oxygen), the P
atom-containing epoxy resins having the foregoing general formula
[5] have phosphoric acid ester bond.
[0345] In the epoxy resins defined with the foregoing general
formula [5], the compounds bonded with the foregoing phosphoric
acid residue may be compounds defined with the chemical formula [7]
which has epoxy groups in the terminals.
[0346] Further, examples of the foregoing alkyl group are ethyl
group, propyl group; isopropyl group, butyl group, sec-butyl group,
tert-butyl group, and the like and among them, butyl group is
preferable.
[0347] The content of the foregoing P atom-containing epoxy resin
in the solder resist layer is preferably 0.1 to 70% by weight. If
it is less than 0.1% by weight, the multilayered printed circuit
board is sometimes not provided with the flame retardancy and on
the other hand, if it is more than 70% by weight, the flame
retardancy is not so much improved.
[0348] The solder resist layer is preferable to contain a silicon
compound, an aluminum compound, a magnesium compound and the like
as an inorganic filler. Practical examples of these compounds are
the same as the inorganic fillers usable for the multilayered
printed circuit board of the first invention of the first group of
the present invention.
[0349] These compounds may be contained solely or two or more of
them may be contained.
[0350] If these compounds are contained in the solder resist layer,
as described in the description of multilayered printed circuit
board of the first invention of the first group of the present
invention, the stress generated in the solder resist layer is
easily moderated and as a result, cracking in the solder resist
layer and peeling from the conductor circuits do not easily take
place.
[0351] The particle diameter of the foregoing inorganic filler is
desirably 0.1 to 5.0 .mu.m. If the foregoing particle diameter is
smaller than 0.1 .mu.m, the stress generated in the solder resist
layer is not so effectively moderated and on the other hand, if
bigger than 5.0 .mu.m, the curing property of the layer of the
solder resist composition is sometimes badly affected and further
the openability of holes is sometimes badly affected at the time of
forming the opening part for the solder pad in the layer of the
solder resist composition.
[0352] The shape of the foregoing inorganic filler is not
particularly restricted and, for example, it may be spherical,
elliptically spherical, crushed, polygonal shape and the like.
[0353] Among them, the spherical shape is desirable since with the
shape, the inorganic filler can easily moderate the stress
generated in the solder resist layer and does not easily form
projected parts in the surface of the solder resist layer.
[0354] The content of the inorganic filler in the foregoing solder
resist layer is preferably 0.1 to 15% by weight.
[0355] If the foregoing content of solder resist layer is lower
than 0.1% by weight, the effect of moderating the stress generated
in the solder resist layer is scarce and if higher than 15% by
weight, an adversely effect on the curing property of the layer of
the solder resist composition is sometimes caused and also an
adversely effect on the openability of holes is sometimes caused at
the time of forming an opening for a solder pad in the layer of the
solder resist layer.
[0356] The solder resist layer composing the multilayered printed
circuit board of the fifth group of the present invention may
further contain, for example, a thermosetting resin, a
thermoplastic resin, a complex of a thermosetting resin and a
thermoplastic resin, other than the foregoing P atom-containing
epoxy resin and the inorganic filler. As such a resin layer,
examples are: those formed by polymerizing and curing the
composition containing a novolak type epoxy resin (meth)acrylate, a
bifunctional (meth)acrylic acid ester monomer, a (meth)acrylic acid
ester polymer with a molecular weight of 500 to 5000, thermosetting
resins comprising a bisphenol type epoxy resin and photosensitive
monomers such as polyvalent acrylic monomers; and the like, as the
same as those to be used for the multilayered printed circuit board
of the first invention of the first group of the present
invention.
[0357] Applicable of the method for forming a layer of such a
solder resist composition is; a method comprising steps of
preparing un-cured solder resist composition containing the
foregoing P atom-containing epoxy resin and applying the
composition by an roll coater or the like; or a method comprising
steps of forming a resin film of the un-cured solder resist
composition and then thermally laminating the resin film.
[0358] Further, in case that the foregoing inorganic filler is
contained in the solder resist layer, the foregoing inorganic
filler is preferable to be added after being dispersed in a solvent
such as methyl ethyl ketone and the like, at the time of producing
the foregoing solder resist composition.
[0359] That is because the inorganic filler can evenly be dispersed
in the solder resist layer without being agglomerated.
[0360] The foregoing solder resist composition is preferably a
paste-like fluid containing a novolak type epoxy resin
(meth)acrylate, an imidazole curing agent, a bifunctional
(meth)acrylic acid ester monomer, a (meth)acrylic acid ester
polymer with a molecular weight of 500 to 5000, thermosetting
resins comprising a bisphenol type epoxy resin and the like,
photosensitive monomers such as polyvalent acrylic monomers and the
like, and glycol ether type solvents and the like, other than the
inorganic filler, phosphorus and phosphorus compound. Further, the
viscosity thereof is preferably adjusted to be 1 to 10 Pas at
25.degree. C.
[0361] Examples of the foregoing imidazole curing agent and the
foregoing glycol ether type solvent are the same as those to be
used for the solder resist composition of the second invention of
the first group of the present invention and the like.
[0362] The solder resist layer with such a constitution is
excellent in the flame retardancy owing to the addition of the
foregoing P atom-containing epoxy resin, so that the multilayered
printed circuit board formed with the solder resist layer can
satisfy the judgment standard of UL94 (a flame retardancy test of a
polymer material) of a UL test standard and especially to satisfy
the judgment standard of combustion time in 94V-0.
[0363] The multilayered printed circuit board of the fifth group of
the present invention can be manufactured in the same manner as the
method for manufacturing the multilayered printed circuit board of
the first group of the present invention except that the solder
resist composition containing the P atom-containing epoxy resin is
employed. Incidentally, in the manufacture of the multilayered
printed circuit board of the multilayered printed circuit board of
the fifth group of the present invention, the resin to be used for
forming the resin insulating layer preferably contains the
foregoing P atom-containing epoxy resin. The flame retardancy of
the multilayered printed circuit board is further improved owing to
the existence of the P atom-containing epoxy resin not only in the
solder resist layer but also the resin insulating layers.
BEST MODE FOR CARRYING OUT THE INVENTION
[0364] The first to fifth groups of the present invention will be
described further in details below.
Example 1
A. Preparation of a Resin Composition for Roughened-Surface
Formation for an Upper Layer
[0365] (i) A mixture composition was produced by blending 35 parts
by weight of a resin solution produced by dissolving a cresol
novolak type epoxy resin acrylated in 25% (made by Nippon Kayaku
Co., Ltd.: molecular weight 2,500) of 80 wt. % concentration in
diethylene glycol dimethyl ether (DMDG), 3.15 parts by weight of a
photosensitive monomer (made by Toagosei Chemical Industry Co.,
Ltd.: Aronix M 315), 0.5 parts by weight of a defoaming agent (made
by San Nopco Ltd.: S-65), and 3.6 parts by weight of
N-methylpyrrolidone (NMP) in a container and mixing and stirring
them.
[0366] (ii) Another mixture composition was produced by blending 12
parts by weight of polyether sulfone (PES), 7.2 parts by weight of
an epoxy resin particle (made by Sanyo Chemical Industries, Ltd.:
Polymerpol) with the average particle size of 1.0 .mu.m and 3.09
parts by weight of the particle with the average particle size of
0.5 .mu.m in another container and mixing and stirring the mixture
and then further adding 30 parts by weight of NMP and mixing and
stirring the resultant mixture by a bead mill.
[0367] (iii) A mixture composition was produced by blending 2 parts
by weight of an imidazole curing agent (made by Shikoku Chemicals
Corp.: 2E4MZ-CN), 2 parts by weight of a photopolymerization
initiator (made by Chiba Specialty Chemicals Corp.: Irgacure
1-907), 0.2 parts by weight of a photosensitizer (made by Nippon
Kayaku Co., Ltd.: DETX-S) and 1.5 parts by weight of NMP in further
another container and mixing and stirring the mixture.
[0368] A resin composition for roughened-surface formation for an
upper layer was produced by mixing the mixture compositions
produced as (i), (ii) and (iii).
B. Preparation of a Resin Composition for Roughened-Surface
Formation for an Under Layer
[0369] (i) A mixture composition was produced by blending 35 parts
by weight of a resin solution produced by dissolving 80 wt. % of a
cresol novolak type epoxy resin acrylated in 25% (made by Nippon
Kayaku Co., Ltd.: molecular weight 2,500) in diethylene glycol
dimethyl ether (DMDG), 4 parts by weight of a photosensitive
monomer (made by Toagosei Chemical Industry Co., Ltd.: Aronix M
315), 0.5 parts by weight of a defoaming agent (made by San Nopco
Ltd.: S-65), and 3.6 parts by weight of N-methylpyrrolidone (NMP)
in a container and mixing and stirring them.
[0370] (ii) Another mixture composition was produced by blending 12
parts by weight of polyether sulfone (PES) and 14.49 parts by
weight of an epoxy resin particle (made by Sanyo Chemical
Industries, Ltd.: Polymerpol) with the average particle size of 0.5
.mu.m in another container, mixing and stirring the mixture, and
then further adding 30 parts by weight of NMP and mixing and
stirring the resultant mixture by a bead mill.
[0371] (iii) A mixture composition was produced by blending 2 parts
by weight of an imidazole curing agent (made by Shikoku Chemicals
Corp.: 2E4MZ-CN), 2 parts by weight of a photopolymerization
initiator (made by Chiba Specialty Chemicals Corp.: Irgacure
1-907), 0.2 parts by weight of a photosensitizer (made by Nippon
Kayaku Co., Ltd.: DETX-S) and 1.5 parts by weight of NMP in further
another container and mixing and stirring the mixture.
[0372] A resin composition for roughened-surface formation for an
under layer was produced by mixing the mixture compositions
produced as (i), (ii) and (iii).
C. Preparation of a Resin Filler
[0373] (i) A resin filler with the viscosity of 40 to 50 Pas at
23.+-.1.degree. C. was produced by blending 100 parts by weight of
a bisphenol F type epoxy monomer (made by Yuka Shell Epoxy Co.:
molecular weight 310: YL 983U), 170 parts by weight of a SiO.sub.2
spherical particle (made by Admatechs Co., Ltd.: CRS 1101-CE)
coated with a silane coupling agent on the surface and having the
average particle size of 1.6 .mu.m and the diameter of the maximum
particle of 15 .mu.m or smaller and 1.5 parts by weight of a
levelling agent (made by San Nopco Ltd.: Perenol S4) in a container
and mixing and stirring the mixture.
[0374] Incidentally, 6.5 parts by weight of an imidazole curing
agent (made by Shikoku Chemicals Corp.: 2E4MZ-CN) was used as a
curing agent.
D. A Method for Manufacturing a Multilayer Printed Circuit
Board
[0375] (1) A copper-laminated laminate plate composed of a
substrate 1 which is made of a 1 mm-thick glass epoxy resin or BT
(bismaleimide triazine) resin with a 18 .mu.m-thick copper foil 8
laminated on both sides of the substrate 1 was used as a starting
material (reference to FIG. 1(a)). At first, the copper-laminated
laminate plate was drilled to form a through hole, subjected to
electroless plating treatment and then etching treatment in a
pattern to form an under-level conductor circuit 4 in both sides of
the substrate 1 and a plated-through hole 9.
[0376] (2) After the resultant substrate in which the
plated-through hole 9 and the under-level conductor circuits 4 are
formed was washed with water and dried, the substrate was blackened
in a blackening bath (an oxidizing bath) containing an aqueous
solution containing NaOH (10 g/L), NaClO.sub.2 (40 g/L) and
Na.sub.3PO.sub.4 (6 g/L) and reduced in a reducing bath containing
NaOH (10 g/L) an NaBH.sub.4 (6 g/L) to form roughened faces 4a, 9a
on the entire surfaces of the under-level conductor circuits 4
including the plated-through hole 9 (reference to FIG. 1 (b)).
[0377] (3) After the resin filler was produced as described in the
foregoing description C, the resin filler 10 was applied to one
side of the substrate by a roll coater to fill the space between
the under-level conductor circuits 4 and inside the plated-through
holes 9 and heated and dried. After that, the space between the
under-level conductor circuits 4 and inside the plated-through
holes 9 on the other side were filled with the resin filler 10 in
the same manner and heated and dried (reference to FIG. 1 (c)).
[0378] (4) One side of the resultant substrate already subjected to
the above described treatment (3) was subjected to polishing to
polish the layer of the resin filler 10 formed in the outer
peripheries of the conductor circuits and the upper part of the
resin filler 10 formed in the non conductor circuit formed area by
a belt sander polishing using # 600 belt polishing paper (made by
Sankyo Chemical Engineering Co) and then subjected to buffing to
remove the scars formed by the foregoing belt sander polishing. A
series of such polishing steps were carried out for the other side
in the same manner.
[0379] Incidentally, if necessary, etching might be carried out
before and after the polishing to level a land 9a of the though
hole 9 and the roughened faces 4a formed in the under-level
conductor circuits 4.
[0380] After that, heating treatment at 100.degree. C. for 1 hour
and successively at 150.degree. C. for 1 hour was carried out to
completely cure the layer of the resin filler.
[0381] In such a way, the surface layer part of the resin filler 10
formed in the plated-through hole 9 and in the non conductor
circuit formed area and the surfaces of the under-level conductor
circuits 4 were leveled to obtain an insulating substrate where the
resin filler 10 and the side faces 4a of the under-level conductor
circuits 4 were firmly stuck to each other through the roughened
faces, and the inner wall face 9a of the plated-through hole 9 and
the resin filler 10 were firmly stuck to each other through the
roughened faces (reference to FIG. 1 (d)).
[0382] (5) Next, the insulating substrate on which conductor
circuits were formed by the foregoing process was degreased with an
alkaline substance and soft-etched and then treated with a catalyst
solution containing palladium chloride and an organic acid to
supply Pd catalyst and activate the catalyst.
[0383] Next, the substrate was immersed in an electroless copper
plating bath of an aqueous solution at pH 9 containing copper
sulfate (3.9.times.10.sup.-2 mol/l), nickel sulfate
(3.8.times.10.sup.-3 mol/l), sodium citrate (7.8.times.10.sup.-3
mol/l), sodium hypophosphite (2.3.times.10.sup.-1 mol/l), a
surfactant (made by Nisshin Chemical Industry Co., Ltd.; Surfynol
465) (1.0 g/l) and shaken in vertical and transverse directions
once every four seconds, starting from 1 minute after the
immersion, to form roughened layers 11 of an acicular alloy of
Cu--Ni--P on the under-level conductor circuits and the surfaces of
the lands of the plated-through holes (reference to FIG. 2
(a)).
[0384] (6) Further, the surfaces of the roughened layers were
subjected to Cu--Sn replacement reaction by being immersed in a tin
replacement plating solution at pH 1.2 and 35.degree. C. containing
tin borofluoride (0.1 mol/l) and thiourea (1.0 mol/l) for 10
minutes to form 0.3 .mu.m-thick Sn layers on the surfaces of the
roughened layers. Incidentally, the Sn layers were not illustrated
in Figs.
[0385] (7) To both sides of the substrate, the resin composition
for roughened-surface formation (viscosity: 1.5 Pas) for an
underlayer described in the foregoing description B was applied by
a roll coater within 24 hours after its preparation and then was
left for 20 minutes in horizontal state and dried at 60.degree. C.
for 30 minutes. After that, the resin composition for
roughened-surface formation (viscosity: 7 Pas) for an upper layer
described in the foregoing description A was applied using a roll
coater within 24 hours after its preparation and then left for 20
minutes in horizontal state in the same manner and dried at
60.degree. C. for 30 minutes to form the layers of resin
composition for roughened-surface formation 2a, 2b with thickness
of 35 .mu.m (reference FIG. 2 (b)).
[0386] (8) After a photomask film printed with black circles with
the diameter of 85 .mu.m was closely stuck to both sides of the
resultant substrate on which the layers of resin composition for
roughened-surface formation were formed as described in (7) the
substrate was exposed to light of 500 mJ/cm.sup.2 intensity by an
ultra high pressure mercury lamp and then subjected to spray
development with a DMDG solution. After that, further the obtained
substrate was exposed to light of 3000 mJ/cm.sup.2 intensity by an
ultra high pressure mercury lamp, heated at 100.degree. C. for 1
hour, at 120.degree. C. for 1 hour, and at 150.degree. C. for 3
hours to form a resin insulating layer with the thickness of 35
.mu.m and having opening parts 6 for via-holes with the diameter of
85 .mu.m and a high size precision corresponding to the circle of
the photomask film (reference FIG. 2(c)). Incidentally, the tin
plating layers were partly exposed in the opening parts to be
via-holes.
[0387] (9) The obtained substrate formed with the opening parts 6
for via-holes was immersed in an aqueous chromic acid solution
(7500 g/L) for 19 minutes to dissolve and remove the epoxy resin
particle existing on the surface of the interlaminar resin
insulating layer and roughen the surface to obtain a roughened
face. After that, the substrate was immersed in a neutralization
solution (made by a Shiplay Co., Inc.) and washed with water
(reference FIG. 2 (d)).
[0388] Further, a palladium catalyst (made by Atotech Co.) was
supplied to the surface of the substrate treated by the surface
roughening treatment to stick the catalyst nuclei to the surface of
the interlaminar resin insulating layer and to the inner wall face
of the opening part for via-holes.
[0389] (10) Next, the substrate was immersed in an electroless
copper plating solution of the following composition to form an
electroless copper plating film 12 with the thickness of 0.6 to 1.2
.mu.m on the entire roughened surface (reference FIG. 3 (a)):
[Electroless Plating Solution]
TABLE-US-00001 [0390] EDTA 0.08 mol/l copper sulfate 0.03 mol/l
HCHO 0.05 mol/l NaOH 0.05 mol/l .alpha.,.alpha.'-bipyridyl 80 mg/l
PEG (polyethylene glycol) 0.10 g/l
[Electroless Plating Condition]
[0391] For 20 minutes at 65.degree. C. of solution temperature.
[0392] (11) A photosensitive dry film sold in the market was stuck
to the electroless copper plating films 12 and a mask was mounted
thereon and exposure was carried out at 100 mJ/cm.sup.2 and
development treatment with an aqueous 0.8% sodium carbonate
solution was carried out to form 15 .mu.m-thick plating resist 3
(reference to FIG. 3 (b)).
[0393] (12) Next, electrolytic copper plating on the area where
resist is not formed was carried out in the following conditions to
form 15 .mu.m-thick electrolytic copper plating films 13 (reference
to FIG. 3 (c)).
[Electroplating Solution]
TABLE-US-00002 [0394] sulfuric acid 2.24 mol/l copper sulfate 0.26
mol/l an additive (Cupracid HL; by Atotech Japan CO.) 19.5
mol/l
[Electroless Plating Condition]
TABLE-US-00003 [0395] current density 1 A/dm.sup.2 duration 65
minutes temperature 22 .+-. 2.degree. C.
[0396] (13) After the plating resist was separated and removed with
an aqueous 5% KOH solution, the electroless plating films used to
be under the plating resist were dissolved and removed by etching
with a mixed solution of sulfuric acid and hydrogen peroxide to
form independent upper layer conductor circuits 5 (including
via-holes 7) (reference to FIG. 3 (d)).
[0397] (14) The resultant substrate in which the conductor circuits
were formed was subjected to the same treatment as described in the
step (5) to form the 2 .mu.m-thick roughened alloy layers 11
composed of Cu--Ni--P on the surfaces of the conductor circuits
(reference to FIG. 4 (a)).
[0398] (15) Successively, the foregoing steps (6) to (14) were
repeated to form further upper layer conductor circuits (reference
to FIG. 4 (b) to FIG. 5 (b)).
[0399] (16) Next, a solder resist resin composition with the
viscosity of 2.0 Pas at 25.degree. C. was obtained by blending
46.67 parts by weight of photosensitivity provided oligomer
(molecular weight: 4000) which was a cresol novolak type epoxy
resin (made by Nippon Kayaku Co., Ltd.) whose 50% of epoxy group
was acrylated and which was dissolved in 60 wt. % concentration in
diethylene glycol methyl ether (DMDG), 15 parts by weight of a
bisphenol A type epoxy resin (made by Yuka Shell Epoxy Co.: Epikote
1001) dissolved in 80 wt % concentration in methyl ethyl ketone,
1.6 parts by weight of an imidazole curing agent (made by Shikoku
Chemicals Corp.: 2E4MZ-CN), 3 parts by weight of a polyfunctional
acrylic monomer, which is a photosensitive monomer, (made by Nippon
Kayaku Co., Ltd.: R 604), 1.5 parts by weight of also a polyvalent
acrylic monomer (made by Kyoei Chemical Co., Ltd.: DPE 6A), 12.0
part by weight of an elliptically spherical alumina particle with
1.0 .mu.m average particle diameter of the longest part as an
inorganic filler and 0.71 parts by weight of a dispersion type
defoaming agent (made by San Nopco Ltd.: S-65) in a container and
mixing and stirring the obtained mixture and further adding 2.0
parts by weight of benzophenone (made by Kanto Chemical Co., Inc.)
as a photopolymerization initiator to the obtained mixture
composition and 0.2 parts by weight of Michler's ketone (made by
Kanto Chemical Co., Inc.) as a photosensitizer.
[0400] Incidentally, the viscosity measurement was carried out by a
B-type viscometer (DVL-B type; by Tokyo Instruments Co. Ltd.),
using a rotor No. 4 for 60 rpm and a rotor No. 3 for 6 rpm.
[0401] (17) Next, the foregoing solder resist composition was
applied in 20 .mu.m thickness on both sides of the multilayer
circuit substrate and dried at 70.degree. C. for 20 minutes and
70.degree. C. for 30 minutes and after that, a 5 mm-thick photomask
drawing a pattern corresponding to the opening part of the solder
resist was closely stuck to the solder resist layers and exposure
by ultraviolet rays of 1000 mJ/cm.sup.2 and development treatment
by the DMTG solution were successively carried out to form opening
parts with 200 .mu.m diameter.
[0402] Further, the resultant solder resist layer was cured by
heating in conditions: at 80.degree. C. for 1 hour, at 100.degree.
C. for 1 hour, at 120.degree. C. for 1 hour, and at 150.degree. C.
for 3 hours to form a solder resist layer 14 (an insulating organic
resin layer) with the thickness of 20 .mu.m and having openings
corresponding to parts for solder pads.
[0403] (18) Next, the substrate bearing the solder resist layer (an
insulating organic resin layer) 14 was immersed for 20 minutes in
an electroless nickel plating solution at pH 4.5 containing nickel
chloride (2.3.times.10.sup.-1 mol/L), sodium hypophosphite
(2.8.times.10.sup.-1 mol/L), and sodium citrate
(1.6.times.10.sup.-1 mol/L) to form a nickel plating layer 15 in
the opening part with the thickness of 5 .mu.m. Further, the
resultant substrate was immersed for 7.5 minutes at 80.degree. C.
in an electroless plating solution containing potassium cyanoaurate
(7.6.times.10.sup.-1 mol/L), ammonium chloride (1.9.times.10.sup.-1
mol/L), sodium citrate (1.2.times.10.sup.-1 mol/L) and sodium
hypophosphite (1.7.times.10.sup.-1 mol/L) to form a gold plating
layer 16 on the nickel plating layer 15 with the thickness of 0.03
.mu.m.
[0404] (19) After that, a solder paste was printed in the openings
of the solder resist layer 14 and subjected to reflow at
200.degree. C. to form solder bumps 17 and to manufacture a
multilayer printed circuit board having solder bumps 17 (reference
to FIG. 5 (c)).
Example 2
A. Preparation of a Resin Composition for Roughened-Surface
Formation for an Upper Layer and an Under Layer and Preparation of
the Resin Filler were Carried Out in the Same Manner as Described
in the Example 1
B. Method for Manufacturing a Multilayered Printed Circuit
Board
[0405] (1) A copper-laminated laminate plate composed of a
substrate 1 which is made of a 1.0 mm-thick glass epoxy resin or BT
(bismaleimide triazine) resin with a 18 .mu.m-thick copper foil 8
laminated on both sides of the substrate 1 was used as a starting
material (reference to FIG. 6(a)). At first, the copper-laminated
laminate plate was drilled to form a through hole, subjected to
electroless plating treatment and then etching treatment in a
pattern to form an under-level conductor circuit 4 in both sides of
the substrate 1 and a plated-through hole 9.
[0406] (2) After the resultant substrate in which the
plated-through hole 9 and the under-level conductor circuits 4 are
formed was washed with water and dried, the substrate was then
subjected to blackening treatment in a blackening bath (an
oxidizing bath) of an aqueous solution containing NaOH (10 g/l),
NaClO.sub.2 (40 g/l), and Na.sub.3PO.sub.4 (6 g/l) and reducing
treatment in a reducing bath containing an aqueous solution
containing NaOH (10 g/l) and NaBH, (6 g/l) to form roughened
surfaces 4a, 9a on the entire surfaces of the under-level conductor
circuits 4 including the plated-through holes 9 (reference to FIG.
6 (b)).
[0407] (3) After the foregoing resin filler was produced, layers of
the resin filler 10 were formed in the plated-through holes 9, the
non conductor circuit formed area and the outer rim area of the
conductor circuit 4 in one side of the substrate 1 within 24 hours
after preparation of the resin filler by the following method.
[0408] That is, at first the resin filler was squeezed into the
through holes using a squeegee and then dried at 100.degree. C. for
20 minutes. Next, a mask having opening parts in the portions
corresponding to the non conductor circuit formed area was put on
the substrate and layers of the resin filler 10 were formed in
recessed parts, which was corresponding to the nonconductor circuit
formed area, using a squeegee and dried at 100.degree. C. for 20
minutes (reference to FIG. 6 (c)).
[0409] (4) The one side of the substrate for which the foregoing
step (3) was just finished was polished by a belt sander polishing
using 4600 belt polishing paper (made by Sankyo Chemical
Engineering Co.) as to leave no resin filler 10 on the surface of
the inner layer copper pattern 4 and on the land surfaces of the
plated-through holes 9 and then buffed to eliminate the scars
formed by the foregoing belt sander polishing. Such a series of
steps were also carried out for the other side of the
substrate.
[0410] After that, heating treatment was carried out at 100.degree.
C. for 1 hour, at 120.degree. C. for 3 hours, at 150.degree. C. for
1 hour, and 180.degree. C. for 7 hours to cure the resin filler
10.
[0411] In such a manner, the surface layer parts of the resin
filler 10 formed in the plated-through holes 9 and in the
non-conductor circuit formed area and the surfaces of the
under-level conductor circuits 4 were leveled to obtain an
insulating substrate (reference to FIG. 6 (d)) where the resin
filler 10 and the side faces 4a of the under-level conductor
circuits 4 were firmly stuck to each other through the roughened
surfaces, and the inner wall faces 9a of the plated-through holes 9
and the resin filler 10 were firmly stuck to each other by the
roughened surfaces.
[0412] (5) Next, the foregoing substrate was washed with water,
degreased by an acid, and then soft-etched and after that an
etching solution was sprayed to both sides of the substrate to etch
the surfaces of the under-level conductor circuits 4 and land
surfaces and the inner walls of the plated-through holes 9 to form
the roughened surfaces 4a, 9a in the entire surfaces of the
under-level conductor circuits 4 (reference to FIG. 7 (a)). The
etching solution used was an etching solution (made by Meck Co.;
Meck etch bond) composed of 10 part by weight of imidazole-Cu(II)
complex, 7 part by weight of glycoric acid, and 5 part by weight of
potassium chloride.
[0413] (6) The resin composition (viscosity 1.5 Pas) for
roughened-surface formation for an under layer was applied to both
sides of the substrate by a roll coater within 24 hours after
production of the composition and then, after being kept still
horizontally for 20 minutes drying was carried out at 60.degree. C.
for 30 minutes. After that, the resin composition (viscosity 7 Pas)
for roughened-surface formation for an upper layer was applied to
the substrate by a roll coater within 24 hours after production of
the composition, and then after being kept still horizontally for
20 minutes, drying was carried out at 60.degree. C. for 30 minutes
to form 35 .mu.m-thick layers 2a, 2b of the resin composition for
roughened-surface formation (reference to FIG. 7 (b)).
[0414] (7) Photomask films drawing black circles of 85 .mu.m in
diameter of a light shielding ink were closely stuck to both sides
of the substrate 1 on which the layers 2a, 2b of the resin
compositions for the roughened-surface formation were formed as
described in the foregoing step (6) and the substrate was exposed
to light in 3000 mJ/cm.sup.2 intensity of an ultra high pressure
mercury lamp and then subjected to heating treatment at 100.degree.
C. for 1 hour, at 120.degree. C. for 1 hour, and at 150.degree. C.
for 3 hours to form 35 .mu.m-thick interlaminar resin insulating
layers 2 having opening parts 6 for via-holes of 85 .mu.m in
diameter with excellent size precision corresponding to the
photomask films (reference to FIG. 7 (c)). Incidentally, the tin
plating layers were partly exposed in the opening parts to be
via-holes.
[0415] (8) The substrate in the which opening parts 6 for via-holes
were formed was immersed in an aqueous chromic acid for 19 minutes
to dissolve and remove the epoxy resin particles existing on the
surfaces of the interlaminar resin insulating layers 2 and roughen
the surfaces of the interlaminar resin insulating layers 2 to
obtain the roughened surfaces (depth of 6 .mu.m). After that, the
resultant substrate was immersed in a neutralization solution (made
by Shiplay Co., Inc.) and washed with water (reference to FIG. 7
(d)).
[0416] Further, a palladium catalyst (Atotech Japan CO.) was
supplied on the surface of the substrate subjected to the surface
roughening treatment to stick catalyst cores to the surfaces of the
interlaminar resin insulating layers 2 and the inner wall faces of
the opening parts 6 for via-holes.
[0417] (9) Next, the substrate was immersed in an electroless
copper plating solution with the following composition to form
electroless copper plating films 12 of 0.6 to 1.2 .mu.m thickness
on the entire roughened surface (reference to FIG. 8 (a)).
[Electroless Plating Solution]
TABLE-US-00004 [0418] NiSO.sub.4 0.003 mol/l tartaric acid 0.200
mol/l copper sulfate 0.030 mol/l HCHO 0.050 mol/l NaOH 0.100 mol/l
.alpha.,.alpha.'-bipyridyl 40 mg/l PEG (polyethylene glycol) 0.10
g/l
[Electroless Plating Condition]
[0419] For 40 minutes at 65.degree. C. of solution temperature.
[0420] (10) A photosensitive dry film sold on the market was
thermally stuck to the electrolytic copper plating film 12, a mask
was put thereon, exposure was carried out at 100 mJ/cm.sup.2, and
development treatment was carried out with an aqueous solution of
0.8% sodium carbonate to form an etching resist 3 with the
thickness of 15 .mu.m (reference to FIG. 8 (b)).
[0421] (11) Next, electrolytic copper plating was carried out in
the following conditions to form 15 .mu.m-thick electrolytic copper
plating films 13 (reference to FIG. 8 (c)).
[Electroplating Solution]
TABLE-US-00005 [0422] sulfuric acid 2.24 mol/l copper sulfate 0.26
mol/l an additive (Cupracid HL; by Atotech Japan CO.) 19.5
mol/l
[Electroless Plating Condition]
TABLE-US-00006 [0423] current density 1 A/dm.sup.2 duration 65
minutes temperature 22 .+-. 2.degree. C.
[0424] (12) After the plating resist 3 was separated and removed
with an aqueous 5% KOH solution, the electroless plating films 12
used to be under the plating resist 3 was dissolved and removed by
etching treatment with a mixed solution of sulfuric acid and
hydrogen peroxide to form independent conductor circuits 5
(including via-holes 7) comprising the electroless copper plating
films 12 and the electrolytic copper plating films 13 (reference to
FIG. 8 (d)).
[0425] (13) The foregoing steps (5) to (12) were repeated to form
further upper interlaminar resin insulating layers and conductor
circuits and obtain a multilayered printed circuit board.
Incidentally, no coating film was formed by replacement with Sn or
the like on the roughened surface layers (reference to FIG. 9 (a)
to FIG. 10 (b)).
[0426] (14) Next, a solder resist composition with the viscosity of
2.0 Pas at 25.degree. C. was obtained by blending 46.67 parts by
weight of photosensitivity provided oligomer (molecular weight:
4000) which was a cresol novolak type epoxy resin (made by Nippon
Kayaku Co., Ltd.) whose 50% of epoxy group was acrylated and which
was dissolved to be 60 wt. % concentration in diethylene glycol
methyl ether (DMDG), 15.0 parts by weight of a bisphenol A type
epoxy resin (made by Yuka Shell Epoxy Co.: Epikote 1001) dissolved
in 80 wt. % concentration in methyl ethyl ketone, 1.6 parts by
weight of an imidazole curing agent (made by Shikoku Chemicals
Corp.: 2E4MZ-CN), 3 parts by weight of a polyvalent acrylic
monomer, which is a photosensitive monomer, (made by Nippon Kayaku
Co., Ltd.: R 604), 1.5 parts by weight of also a polyvalent acrylic
monomer (made by Kyoei Chemical Co., Ltd.: DPE 6A), 10 parts by
weight of a spherical silica with the average particle diameter of
1.0 .mu.m as an inorganic filler and 0.71 parts by weight of a
dispersion type defoaming agent (made by San Nopco Ltd.: S-65) in a
container and mixing and stirring the obtained mixture and further
adding 2.0 parts by weight of benzophenone (made by Kanto Chemical
Co., Inc.) as a photopolymerization initiator to the obtained
mixture composition and 0.2 parts by weight of Michler's ketone
(made by Kanto Chemical Co., Inc.) as a photosensitizer.
[0427] Incidentally, the viscosity measurement was carried out by a
B-type viscometer (DVL-B type; by Tokyo Instruments Co. Ltd.),
using a rotor No. 4 for 60 rpm and a rotor No. 3 for 6 rpm.
[0428] (15) Next, the foregoing solder resist composition was
applied to both sides of the multilayer circuit substrate in 20
.mu.m thickness, dried at 70.degree. C. for 20 minutes and at
70.degree. C. for 30 minutes, exposed to UV rays of 1000
mJ/cm.sup.2 intensity while being closely covered with a 5 mm-thick
photomask drawing a pattern corresponding to the opening part of
the solder resist, and developed with a DMTG solution to form an
opening with the diameter of 200 .mu.m.
[0429] Further, the resultant solder resist layer was cured by
heating in conditions: at 80.degree. C. for 1 hour, at 100.degree.
C. for 1 hour, at 120.degree. C. for 1 hour, and at 150.degree. C.
for 3 hours to form a 20 .mu.m-thick solder resist layer 14 having
openings.
[0430] (16) After that, after the concentration of an etching
solution mainly containing sodium persulfate was adjusted to have
the etching rate of about 2 .mu.m per minute, the substrate
subjected to the foregoing steps was immersed in the etching
solution for 1 minute to get the surfaces having the average
roughness (Ra) of 1 .mu.m.
[0431] (17) Next, the substrate subjected to the foregoing roughing
treatment was immersed for 20 minutes in an electroless nickel
plating solution at pH 4.5 containing nickel chloride
(2.3.times.10.sup.-1 mol/L), sodium hypophosphite
(2.8.times.10.sup.-1 mol/L), and sodium citrate
(1.6.times.10.sup.-1 mol/L) to form a nickel plating layer 15 in
the opening part with the thickness of 5 .mu.m. Further, the
resultant substrate was immersed for 7.5 minutes at 80.degree. C.
in an electroless plating solution containing potassium cyanoaurate
(7.6.times.10.sup.-3 mol/L), ammonium chloride (1.9.times.10.sup.-1
mol/L), sodium citrate (1.2.times.10.sup.-1 mol/L) and sodium
hypophosphite (1.7.times.10.sup.-1 mol/L) to form a gold plating
layer 16 on the nickel plating layer 15 with the thickness of 0.03
.mu.m.
[0432] (18) After that, a solder paste was printed in the opening
of the solder resist layer 14 and subjected to reflow at
200.degree. C. to form solder bumps 17 and to manufacture a
multilayer printed circuit board having solder bumps 17 (reference
to FIG. 10 (c)).
Example 3
[0433] A multilayered printed circuit board was manufactured in the
same manner as the example 1 except that 7 parts by weight of
epoxy-terminated polybutadiene was further added as an elastomer in
the process of preparing the solder resist composition in the step
(16).
Example 4
[0434] A multilayered printed circuit board was manufactured in the
same manner as the example 2 except that 7 parts by weight of
epoxy-terminated polybutadiene was further added as an elastomer in
the process of preparing the solder resist composition in the step
(14).
Comparative Example 1
[0435] A multilayered printed circuit board was manufactured in the
same manner as the example 1 except that no inorganic filler was
added in the process of preparing the solder resist
composition.
Comparative Example 2
[0436] A multilayered printed circuit board was manufactured in the
same manner as the example 2 except that no inorganic filler was
added in the process of preparing the solder resist
composition.
[0437] The multilayered printed circuit boards obtained in the
foregoing examples 1 to 4 and comparative examples 1 to 2 were
subjected to a reliability test and then the parts of the solder
bumps were observed by a microscope. Incidentally, the reliability
test was carried out by keeping the multilayered printed circuit
boards under the conditions of 85% relative humidity and
130.degree. C. temperature for 300 hours.
[0438] Several parts of the solder resist layers were observed by a
microscope by cutting the multilayered printed circuit boards with
a cutter after the foregoing test.
[0439] Further, the multilayered printed circuit boards were
subjected to a heat cycle test and then those multilayered printed
circuit boards were cut by a cutter to observe whether cracking
took place in the solder resist layers or not. Incidentally, the
heat cycle test was carried out by repeating the cycle which keeps
the multilayered printed circuit boards in -65.degree. C.
atmosphere for 3 minutes and then in 130.degree. C. atmosphere for
3 minutes 2000 times.
[0440] As a result, neither cracking nor peeling was observed, also
neither any damage nor any break of the solder bumps was observed
in the multilayered printed circuit boards obtained by the examples
1 to 4, on the other hand cracking was found in the solder resist
layers in the multilayered printed circuit boards of the
comparative examples 1, 2 and damages of solder bumps were observed
after the reliability test.
[0441] Further, regarding the heat cycle test, no cracking was
observed in the multilayered printed circuit boards obtained by the
examples 1 to 4, whereas cracking was observed in the multilayered
printed circuit boards obtained by the comparative examples 1,
2.
Example 5
[0442] A multilayered printed circuit board was manufactured in the
same manner as the example 1 except that a solder resist
composition was prepared according to the following method.
Preparation of the Solder Resist Composition
[0443] (i) A mixture composition was produced by stirring and
mixing 46.67 parts by weight of photosensitivity-provided oligomer
(molecular weight: 4000) which was a cresol novolak type epoxy
resin (made by Nippon Kayaku Co., Ltd.) whose 50% of epoxy group
was acrylated and which was dissolved to be 60 wt. % concentration
in diethylene glycol methyl ether (DMDG), 3 parts by weight of a
polyfunctional acrylyk monomer, which was a photosensitive monomer,
(made by Nippon Kayaku Co., Ltd.; R604), 7 parts by weight of
epoxy-terminated polybutadiene, and 0.71 part by weight of a
defoaming agent (made by San Nopco Ltd.; trade name: S-65) in a
container.
[0444] (ii) An another mixture composition was produced by stirring
and mixing 15 part by weight of a bisphenol A type epoxy resin
(made by Yuka Shell Epoxy CO.; trade name: Epikote 1001) dissolved
to be 80% by weight concentration in methyl ethyl ketone and 1.5
part by weight of a polyvalent acrylic monomer (made by Kyoei
Chemical Co., Ltd.; trade name: DPE 6A), which was a photosensitive
monomer, in another container.
[0445] (iii) Further, another mixture composition was produced by
mixing and stirring 1.6 part by weight of an imidazole curing agent
(made by Shikoku Chemicals Corp.; 2E4MZ-CN), 2.0 part by weight of
benzophenon (made by Kanto Chemical Co., Inc.) as a
photopolymerization initiator and 0.2 part by weight of Micheler's
ketone (made by Kanto Chemical Co., Inc.) as a photosensitizer in
further another container.
[0446] The mixture compositions obtained in (i), (ii), and (iii)
were mixed to give a solder resist composition with 2.0 Pa
viscosity at 25.degree. C.
[0447] The viscosity measurement was carried out by a B-type
viscometer (DVL-B type; by Tokyo Instruments Co. Ltd.), using a
rotor No. 4 for 60 rpm and a rotor No. 3 for 6 rpm.
Example 6
[0448] A multilayered printed circuit board was manufactured in the
same manner as the example 2 except that the solder resist
composition prepared in the same manner as the example 5 was
used.
Example 7
[0449] A multilayered printed circuit board was manufactured in the
same manner as the example 2 except that a solder resist
composition prepared in the following method was used.
[0450] (i) A mixture composition was produced by stirring and
mixing 46.67 parts by weight of photosensitivity-provided oligomer
(molecular weight: 4000) which was a cresol novolak type epoxy
resin (made by Nippon Kayaku Co., Ltd.) whose 50% of epoxy group
was acrylated and which was dissolved to be 60 wt. % concentration
in diethylene glycol methyl ether (DMDG), 3 parts by weight of a
polyfunctional acrylic monomer, which was a photosensitive monomer,
(made by Nippon Kayaku Co., Ltd.; trade name: R604), 13.5 part by
weight of a spherical silica with the average particle diameter of
0.5 .mu.m, 7 part by weight of epoxy-terminated polybutadiene and
0.71 part by weight of a defoaming agent (made by San Nopco Ltd.;
trade name: S-65) in a container.
[0451] (ii) An another mixture composition was produced by stirring
and mixing 15 part by weight of a bisphenol A type epoxy resin
(made by Yuka Shell Epoxy CO.; trade name: Epikote 1001) dissolved
to be 80% by weight concentration in methyl ethyl ketone and 1.5
part by weight of a polyvalent acrylic monomer (made by Kyoei
Chemical Co., Ltd.; trade name: DPE 6A;), which was a
photosensitive monomer, in another container.
[0452] (iii) Further, another mixture composition was produced by
mixing and stirring 1.6 part by weight of an imidazole curing agent
(made by Shikoku Chemicals Corp.; 2E4MZ-CN), 2.0 part by weight of
benzophenon (made by Kanto Chemical Co., Inc.) as a
photopolymerization initiator and 0.2 part by weight of Micheler's
ketone (made by Kanto Chemical Co., Inc.) as a photosensitizer in
further another container.
[0453] The mixture compositions obtained in (i), (ii), and (iii)
were mixed to give a solder resist composition with 2.0 Pa
viscosity at 25.degree. C.
Example 8
[0454] A multilayered printed circuit board was manufactured in the
same manner as the example 6 except that the solder resist
composition prepared in the same manner as in the example 7 was
used.
Comparative Example 3
[0455] A multilayered printed circuit board was manufactured in the
same manner as the example 5 except that epoxy-terminated
polybutadiene was not added in the preparation of the solder resist
composition.
Comparative Example 4
[0456] A multilayered printed circuit board was manufactured in the
same manner as the example 6 except that epoxy-terminated
polybutadiene was not added in the preparation of the solder resist
composition.
[0457] The multilayered printed circuit boards obtained in the
foregoing examples 5 to 8 and comparative examples 3, 4 were
subjected to the same reliability test as that in the example 1 and
then several parts of the solder bump were observed by a
microscope.
[0458] After the foregoing reliability test, several parts of the
solder resist layers were observed by a microscope by cutting the
multilayered printed circuit boards with a cutter. Further, the
multilayered printed circuit boards were subjected to the same heat
cycle test as that in the example 1 and then those multilayered
printed circuit boards were cut by a cutter to observe whether
cracking took place in the solder resist layers or not.
[0459] As a result, although generation of cracking was slightly
observed in the multilayered printed circuit boards obtained in the
examples 5, 6, the cracking was not so significant to affect the
capabilities of the multilayered printed circuit boards. Also,
neither generation of peeling nor any damage and break were
observed. Further, in the multilayered printed circuit boards of
the examples 7, 8, no cracking was observed at all. Also, neither
peeling nor any damage and break of the solder bumps were observed.
On the other hand, cracks grown wide were found in the solder
resist layers after the reliability test in the multilayered
printed circuit boards of the comparative examples 3, 4 and also,
damages of solder bumps were observed.
[0460] Further, regarding the heat cycle test, slight cracking was
observed in the examples 1, 2, however it was not so significant to
affect the capability of the multilayered printed circuit boards.
No cracking was observed in the multilayered printed circuit boards
obtained by the examples 3, 4, whereas cracks grown wide were
observed in the multilayered printed circuit boards obtained by the
comparative examples 1, 2.
Example 9
A. Preparation of a Resin Filler
[0461] A resin filler was prepared in the same manner as example
1.
B. Manufacture of a Multilayered Printed Circuit Board
[0462] (1) A copper-laminated laminate plate composed of a
substrate 1 which was made of a 0.8 mm-thick glass epoxy resin or
BT (bismaleimide triazine) resin with a 18 .mu.m-thick copper foil
8 laminated on both sides of the substrate 1 was used as a starting
material (reference to FIG. 11 (a)). At first, the copper-laminated
laminate plate was subjected to drilling by a drill, plating resist
was formed, and then electroless copper plating was carried out for
the resultant substrate to form plated-through holes 9 and further
the copper foil was pattern-etched by an ordinary method to form
the inner layer copper patterns (under-level conductor circuits) 4
in both sides of the substrate.
[0463] (2) The substrate on which the under-level conductor
circuits 4 were formed was washed with water and dried and then an
etching solution was sprayed to both sides of the substrate to etch
the surfaces of the under-level conductor circuits and the land
surfaces of plated-through holes 9 to form roughened surface 4a, 9a
on the entire surfaces of the under-level conductor circuits 4
(reference to FIG. 11 (b)). As the etching solution, used was a
solution containing 10 part by weight of imidazole-Cu(II) complex,
7 part by weight of glycoric acid, 5 part by weight of potassium
chloride, and 78 part by weight of ion exchanged water.
[0464] (3) After the foregoing resin filler was produced, the resin
filler 10 was applied within 24 hours after preparation to both
sides of the substrate using a printing apparatus to fill the space
between the under-level conductor circuits 4 and fill the
plated-through holes 9, and then heated and dried. That is, through
the step, the space between the under-level conductor circuits 4
and the space in the plated-through holes 9 were filled with the
resin filler 10 (reference to FIG. 11 (c)).
[0465] (4) The one side of the substrate on which the foregoing
treatment (3) was finished was polished by a belt sander polishing
using the belt abrasive paper (made by Sankyo Rikagagu Co., Ltd.)
to leave no resin filler 10 on the surface of the under-level
conductor circuit 4 and the land surface of the plated-through
holes 10 and then buffed to eliminate the scars formed by the
foregoing belt sander polishing. Such a series of steps were also
carried out for the other side of the substrate. After that,
heating treatment was carried to completely cure the filled resin
filler 10 (reference to FIG. 11 (d)).
[0466] In such a manner, the surface layer parts of the resin
filler 10 filling the plated-through holes 9 and the like and the
roughened layer 4a on the upper surface of the under-level
conductor circuits 4 were leveled to obtain an insulating substrate
where the resin filler 10 and the side faces of the under-level
conductor circuits 4 were firmly stuck to each other through the
roughened surfaces 4a, and the inner wall faces of the
plated-through holes 9 and the resin filler 10 were firmly stuck to
each other by the roughened surfaces 9a.
[0467] (5) Next, 50 .mu.m-thick thermosetting type cycloolefin type
resin sheets were laminated on both sides of the insulating
substrate on which conductor circuits were formed by the foregoing
process by vacuum pressure bonding at 0.5 MPa pressure while the
temperature being increased up to 50 to 150.degree. C. to form
interlaminar resin insulating layers 2 of the cycloolefin type
resin (reference to FIG. 12 (a)). The degree of vacuum at the time
of the vacuum pressure bonding was 10 mmHg.
[0468] (6) Next, opening parts 6 for via-holes with the diameter of
80 .mu.m were formed in the interlaminar resin insulating layers 2
composed of the thermosetting type cycloolefin type resin using
excimer laser of 248 nm wavelength. (reference to FIG. 12 (b)).
After that, de-smear treatment was carried out using oxygen
plasma.
[0469] (7) Next, using SV-4540 produced by ULVAC Japan Co., Ltd.,
sputtering of a Ni target was carried out at 80.degree. C., 0.6 Pa
gas pressure, and at the power of 200 W for 5 minutes to form Ni
metal layers 12a on the surfaces of the interlaminar resin
insulating layers 2 (reference to FIG. 12 (c)). In this case, the
thickness of the formed Ni metal layers 12a was 0.1 .mu.m.
[0470] (8) Next, the substrate was immersed in an electroless
copper plating solution with the following composition to form
electroless copper plating films 12b of 0.6 to 1.2 .mu.m in
thickness on the entire roughened surface of the Ni metal layers
12a (reference to FIG. 12 (d)).
[Electroless Plating Solution]
TABLE-US-00007 [0471] EDTA 0.08 mol/l copper sulfate 0.03 mol/l
HCHO 0.05 mol/l NaOH 0.05 mol/l .alpha.,.alpha.'-bipyridyl 80 mg/l
PEG (polyethylene glycol) 0.10 g/l
[Electroless Plating Condition]
[0472] For 20 minutes at 65.degree. C. of solution temperature.
[0473] (9) To both sides of the substrate, photosensitive dry films
were stuck to the electroless copper plating films 12 by thermal
pressure bonding and photomasks were mounted thereon, and exposure
was carried out at 100 mJ/cm.sup.2 and development treatment with
an aqueous 0.8% sodium carbonate solution was carried out to form a
15 .mu.m-thick plating resist 3 pattern (reference to FIG. 13
(a)).
[0474] (10) Next, electroplating was carried out in the following
conditions to form 15 .mu.m-thick electrolytic copper plating films
13 (reference to FIG. 13 (b)). Incidentally, by the electroplating
films 13, the parts to be conductor circuits 5 in the process
described later were thickened, and the parts to be via-holes 7
were filled with plating. In addition, the additive used in the
electrolytic plating solution was Cupracid HL by Atotech Japan
CO.
[Electroplating Solution]
TABLE-US-00008 [0475] sulfuric acid 2.24 mol/l copper sulfate 0.26
mol/l an additive (Cupracid HL; by Atotech Japan CO.) 19.5
mol/l
[Electroless Plating Condition]
TABLE-US-00009 [0476] current density 1 A/dm.sup.2 duration 65
minutes temperature 22 .+-. 2.degree. C.
[0477] (11) After the plating resist 3 was separated and removed
with an aqueous 5% KOH solution, the electroless plating films used
to be under the plating resist 3 were dissolved and removed by
etching with a mixed solution of sulfuric acid and hydrogen
peroxide to form independent upper layer conductor circuits 5
(including the via-holes 7) (reference to FIG. 13 (c)).
[0478] (12) Successively, the foregoing steps (5) to (11) were
repeated to form further upper layer conductor circuits (reference
to FIG. 14 (a) to FIG. 15 (a)).
[0479] (13) Next, 20 .mu.m-thick thermosetting type polyolefin type
resin sheets (made by Sumitomo 3M Ltd.; trade name: 1592) were
laminated on both sides of the multilayered circuit substrate on
which upper layer conductor circuits were formed by vacuum pressure
bonding at 0.5 MPa pressure while the temperature being increased
up to 50 to 150.degree. C. to form solder resist layers 14 of the
polyolefin type resin. The degree of vacuum at the time of the
vacuum pressure bonding was 10 mmHg.
[0480] (14) Next, opening parts with the diameter of 200 .mu.m were
formed in the solder resist layers 14 composed of the thermosetting
type polyolefin type resin using excimer laser of 248 nm
wavelength. After that, de-smear treatment was carried out using
oxygen plasma to form solder resist layers (an organic resin
insulating layers) 14 with 20 .mu.m thickness having opening parts
in the solder pad parts.
[0481] (15) Next, the substrate in which the solder resist layers
(an organic resin insulating layers) 14 were formed was immersed in
an electroless nickel plating solution at pH 4.5 containing nickel
chloride (2.3.times.10.sup.--1 mol/l), sodium hypophosphite
(2.8.times.10.sup.-1 mol/l), and sodium citrate
(1.6.times.10.sup.-1 mol/l) for 20 minutes to form 5 .mu.m-thick
nickel plating layers 15 in the opening parts. Further, the
resultant substrate was immersed in an electroless plating solution
containing potassium cyanoaurate (7.6.times.10.sup.-3 mol/l),
ammonium chloride (1.9.times.10.sup.-1 mol/l), sodium citrate
(1.2.times.10.sup.-1 mol/l), and sodium hypophosphite
(1.7.times.10.sup.-1 mol/l) at 80.degree. C. for 7.5 minutes to
form 0.03 .mu.m-thick gold plating layers 16 on the nickel plating
layers 15.
[0482] (16) After that, a solder paste was printed on the opening
parts of the solder resist layers 14 and reflow of the paste was
carried out at 200.degree. C. to form solder bumps (solder body) 17
and to manufacture a multilayered printed circuit board having the
solder bumps 17 (reference to FIG. 15 (b)).
[0483] (17) Using some other part of the multilayered printed
circuit board, an IC chip bonding was carried out. That is, after
washing with fluxes, using a prescribed installation apparatus,
positioning of the solder bumps of the multilayered printed circuit
board with bumps formed in the IC chips was carried out using
target marks as standard and re-flow of the solder was carried out
to join the solder bumps of the multilayered printed circuit board
with the bumps of the IC chips. Then, washing with fluxes was
carried out and the gaps between the IC chips and the multilayered
printed circuit board was filled with under-fill to consequently
obtain a multilayered printed circuit board connected with IC
chips, that is, a semiconductor device.
Example 10
[0484] A multilayered printed circuit board was manufactured in the
same manner as the example 9 except that, in the process (13) of
example 9, a 20 .mu.m-thick thermosetting type cycloolefin type
resin sheet was used in place of the thermosetting type polyolefin
type resin sheet to form the solder resist layers comprising the
thermosetting type cycloolefin type resin and then a semiconductor
device was obtained by connecting IC chips to the obtained
multilayered printed circuit board.
Example 11
A. Resin Compositions for Roughened-Surface Formation for an Upper
Layer and an Under Layer and a Resin Filler were Prepared in the
Same Manner as Example 1
B. Method for Manufacturing a Multilayered Printed Circuit
Board
[0485] (1) A copper-laminated laminate plate composed of a
substrate which was made of a 0.8 mm-thick glass epoxy resin or BT
(bismaleimide triazine) resin with a 18 .mu.m-thick copper foil 8
laminated on both sides of the substrate 1 was used as a starting
material (reference to FIG. 16 (a)). At first, the copper-laminated
laminate plate was subjected to drilling by a drill and then
electroless plating and pattern-etching to form the under-level
conductor circuits 4 and plated-through holes 9 on both sides of
the substrate 1.
[0486] (2) The substrate on which the plated-through holes 9 and
the under-level conductor circuits 4 were formed was washed with
water and dried and then subjected to blackening treatment in a
blackening bath (an oxidizing bath) of an aqueous solution
containing NaOH (10 g/l), NaClO.sub.2 (40 g/l), and
Na.sub.3PO.sub.4 (6 g/l) and reducing treatment in a reducing bath
containing an aqueous solution containing NaOH (10 g/l) and
NaBH.sub.4 (6 g/l) to form roughened surfaces 4a, 9a on the entire
surfaces of the under-level conductor circuits 4 including the
plated-through holes 9 (reference to FIG. 16 (b)).
[0487] (3) After the foregoing resin filler was produced, the resin
filler 10 was applied to both sides of the substrate by a printing
apparatus to fill the space between the under-level conductor
circuits 4 and to fill the plated-through holes 9 within 24 hours
after preparation of the resin filler and then heated and dried.
That is, by the process, the space between the under-level
conductor circuits 4 and the plated-through holes 9 were filled
with the resin filler 10 (reference to FIG. 16 (c)).
[0488] (4) The one side of the substrate for which the foregoing
step (3) was finished was polished by a belt sander polishing using
the belt abrasive paper #600 (made by Sankyo Rikagagu Co., Ltd.) as
to leave no resin filler 10 on the surface of the inner layer
copper pattern 4 and on the land surfaces of the plated-through
holes 9 and then buffed to eliminate the scars formed by the
foregoing belt sander polishing. Such series of steps were also
carried out for the other side of the substrate.
[0489] After that, heating treatment was carried out at 100.degree.
C. for 1 hour, at 120.degree. C. for 3 hours, at 150.degree. C. for
1 hour, and 180.degree. C. for 7 hours to cure the resin filler
10.
[0490] In such a manner the surface layer parts of the resin filler
10 formed in the plated-through holes 9 and in the non-conductor
circuit formed area and the surfaces the under-level conductor
circuits 4 were leveled to obtain an insulating substrate
(reference to FIG. 16 (d)) where the resin filler 10 and the side
faces 4a of the under-level conductor circuits 4 were firmly stuck
to each other through the roughened surfaces, and the inner wall
faces 9a of the plated-through holes 9 and the resin filler 10 were
firmly stuck to each other by the roughened surface.
[0491] (5) Next, the foregoing substrate was washed with water,
degreased by an acid, and then soft-etched and after that an
etching solution was sprayed to both sides of the substrate to etch
the surfaces of the under-level conductor circuits 4 and land
surfaces and the inner walls of the plated-through holes 9 to form
the roughened surfaces 4a, 9a on the entire surfaces of the
under-level conductor circuits 4 (reference to FIG. 17 (a)). The
etching solution used was an etching solution (Meck etch bond; made
by Meck Co.) containing 10 part by weight of imidazole-Cu(II)
complex, 7 part by weight of glycoric acid, and 5 part by weight of
potassium chloride.
[0492] (6) The resin composition (viscosity 1.5 Pas) for
roughened-surface formation for an under layer was applied to both
sides of the substrate by a roll coater within 24 hours after
production of the composition and after being kept still
horizontally for 20 minutes, drying was carried out at 60.degree.
C. for 30 minutes. After that, the resin composition (viscosity 7
Pas) for roughened-surface formation for an upper layer was applied
to the substrate by a roll coater within 24 hours after production
of the composition and after being kept still horizontally for 20
minutes, drying was carried out at 60.degree. C. for 30 minutes to
form 35 .mu.m-thick layers 2a, 2b of the resin compositions for
roughened-surface formation (reference to FIG. 17 (b)).
[0493] (7) Photomasks drawing black circles of 85 .mu.m in diameter
of a light shielding ink were closely stuck to both sides of the
substrate on which the layers 2a, 2b of the resin compositions for
the roughened-surface formation were formed as described in the
foregoing step (6). Then, the substrate was exposed to light in
3000 mJ/cm.sup.2 intensity of an ultra high pressure mercury lamp
and then subjected to heating treatment at 100.degree. C. for 1
hour, at 120.degree. C. for 1 hour, and at 150.degree. C. for 3
hours to form 35 .mu.m-thick interlaminar resin insulating layers 2
having opening parts 6 for via-holes of diameter of 85 .mu.m with
excellent size precision corresponding to the photomask films
(reference to FIG. 17(c)). Incidentally, the tin plating layers
were partly exposed in the opening parts to be via-holes.
[0494] (8) The substrate in the which opening parts 6 for via-holes
were formed was immersed in an aqueous containing chromic acid for
19 minutes to dissolve and remove the epoxy resin particles
existing on the surfaces of the interlaminar resin insulating
layers 2 and roughen the surfaces of the interlaminar resin
insulating layers 2 to obtain the roughened surfaces (depth of 6
.mu.m). After that, the resultant substrate was immersed in a
neutralization solution (made by Shiplay Co., Inc.) and washed with
water (reference to FIG. 17 (d)).
[0495] Further, a palladium catalyst (Atotech Japan CO.) was
supplied on the surface of the substrate subjected to the surface
roughening treatment to stick catalyst cores to the surfaces of the
interlaminar resin insulating layers 2 and the inner wall faces of
the opening parts 6 for via-holes.
[0496] (9) Next, the substrate was immersed in an electroless
copper plating solution with the following composition to form
electroless copper plating films 12 of 0.6 to 1.2 .mu.m thickness
on the entire roughened surface (reference to FIG. 18 (a)).
[Electroless Plating Solution]
TABLE-US-00010 [0497] NiSO.sub.4 0.003 mol/l tartaric acid 0.200
mol/l copper sulfate 0.030 mol/l HCHO 0.050 mol/l NaOH 0.100 mol/l
.alpha.,.alpha.'-bipyridyl 40 mg/l PEG (polyethylene glycol) 0.10
g/l
[Electroless Plating Condition]
[0498] For 40 minutes at 35.degree. C. of solution temperature.
[0499] (10) A photosensitive dry film sold in the market was stuck
by thermal pressure bonding to the electroless copper plating films
12 and a mask was mounted thereon and exposure was carried out at
100 mJ/cm.sup.2 and development treatment with an aqueous 0.8%
sodium carbonate solution was carried out to form 15 .mu.m-thick
plating resist 3 (reference to FIG. 18 (b)).
[0500] (11) Next, electrolytic copper plating was carried out in
the following conditions to form 15 .mu.m-thick electrolytic copper
plating films 13 (reference to FIG. 18 (c)).
[Electroplating Solution]
TABLE-US-00011 [0501] sulfuric acid 2.24 mol/l copper sulfate 0.26
mol/l an additive (Cupracid HL; by Atotech Japan CO.) 19.5
mol/l
[Electroless Plating Condition]
TABLE-US-00012 [0502] current density 1 A/dm.sup.2 duration 65
minutes temperature 22 .+-. 2.degree. C.
[0503] (12) After the plating resist 3 was separated and removed
with an aqueous 5% KOH solution, the electroless plating films 12
used to be under the plating resist 3 was dissolved and removed by
etching with a mixed solution of sulfuric acid and hydrogen
peroxide to form independent conductor circuits 5 (including
via-holes 7) comprising the electroless copper plating films 12 and
the electrolytic copper plating films 13 (reference to FIG. 18
(d)).
[0504] (13) Successively the foregoing steps (5) to (12) were
repeated to form further upper interlaminar resin insulating layers
and conductor circuits and obtain a multilayered printed circuit
board (reference to FIG. 19 (a) to FIG. 20 (a)).
[0505] (14) Next, solder resist layers comprising a thermosetting
type cycloolefin resin were formed on both sides of the
multilayered circuit substrate, in which the upper layer conductor
circuits were formed, in the same manner as the example 2 and then
the same steps (14) to (16) of the example 9 were carried out to
manufacture a multilayered printed circuit board and to obtain a
multilayered printed circuit board (a semiconductor device)
connected with IC chips using the manufactured multilayered printed
circuit board.
Comparative Example 5
[0506] (1) A multilayered circuit board was obtained in the same
manner as the steps (1) to (13) of the example 11 (reference to
FIG. 21 (a)).
[0507] (2) Then, roughened surfaces were formed on the surfaces of
the conductor circuits 5 (including via-holes 7) by etching the
surfaces of the conductor circuits 5 (including via-holes 7) using
Meck etch bond produced by Meck Co. (reference to FIG. 21 (b)).
[0508] (3) Next, a solder resist resin composition (an organic
resin insulating material) with the viscosity of 2.0 Pas at
25.degree. C. was obtained by blending 46.67 parts by weight of
photosensitivity-provided oligomer (molecular weight: 4000) which
was a cresol novolak type epoxy resin (made by Nippon Kayaku Co.,
Ltd.) whose 50% of epoxy group was acrylated and which was
dissolved to be 60 wt. % concentration in diethylene glycol methyl
ether (DMDG), 15 parts by weight of a bisphenol A type epoxy resin
(made by Yuka Shell Epoxy Co.: Epikote 1001) dissolved in at 80 wt.
% concentration in methyl ethyl ketone, 1.6 parts by weight of an
imidazole curing agent (made by Shikoku Chemicals Corp.: 2E4MZ-CN),
3 parts by weight of a polyfunctional acrylic monomer, which is a
photosensitive monomer (made by Nippon Kayaku Co., Ltd.: R 604),
1.5 parts by weight of also a polyvalent acrylic monomer (made by
Kyoei Chemical Co., Ltd.: DPE 6A), and 0.71 parts by weight of a
dispersion type defoaming agent (made by San Nopco Ltd.: S-65) in a
container and mixing and stirring the obtained mixture and further
adding 2.0 parts by weight of benzophenone (made by Kanto Chemical
Co., Inc.) as a photopolymerization initiator to the obtained
mixture composition and 0.2 parts by weight of Michler's ketone
(made by Kanto Chemical Co., Inc.) as a photosensitizer.
[0509] Incidentally, the viscosity measurement was carried out by a
B-type viscometer (DVL-B type; by Tokyo Instruments Co. Ltd.),
using a rotor No. 4 for 60 rpm and a rotor No. 3 for 6 rpm.
[0510] (4) Next, the foregoing solder resist composition was
applied in 20 .mu.m thickness on both sides of the multilayer
circuit substrate and dried at 70.degree. C. for 20 minutes and
70.degree. C. for 30 minutes and after that, a 5 mm-thick photomask
drawing a pattern corresponding to the opening parts of the solder
resist was closely stuck to the solder resist layers. Exposure by
ultraviolet rays of 1000 mJ/cm.sup.2 and development treatment by
the DMTG solution were successively carried out to form opening
parts with 200 .mu.m diameter.
[0511] Further, the resultant solder resist layer was cured by
heating in conditions: at 80.degree. C. for 1 hour, at 100.degree.
C. for 1 hour, at 120.degree. C. for 1 hour, and at 150.degree. C.
for 3 hours to form a solder resist layer 14 (an insulating organic
resin layer) with the thickness of 20 .mu.m and having openings
corresponding to parts for solder pads.
[0512] (5) Next, the substrate formed with the solder resist layer
(an insulating organic resin layer) 14 was immersed for 20 minutes
in an electroless nickel plating solution at pH 4.5 containing
nickel chloride (2.3.times.10.sup.-1 mol/L), sodium hypophosphite
(2.8.times.10.sup.-1 mol/L), and sodium citrate
(1.6.times.10.sup.-1 mol/L) to form a nickel plating layer 15 with
the thickness of 5 .mu.m in the opening part. Further, the
resultant substrate was immersed for 7.5 minutes at 80.degree. C.
in an electroless plating solution containing potassium cyanoaurate
(7.6.times.10.sup.-3 mol/L), ammonium chloride (1.9.times.10.sup.-1
mol/L), sodium citrate (1.2.times.10.sup.-1 mol/L) and sodium
hypophosphite (1.7.times.10.sup.-1 mol/L) to form a gold plating
layer 16 on the nickel plating layer 15 with the thickness of 0.03
.mu.m.
[0513] (6) After that, a solder paste was printed in the openings
of the solder resist layer 14 and subjected to reflowing at
200.degree. C. to form solder bumps (solder body) 17 and to
manufacture a multilayer printed circuit board having solder bumps
17 (reference to FIG. 21 (c)).
[0514] After that, using the obtained multilayered printed circuit
board, a semiconductor device was obtained.
[0515] Regarding the multilayered printed circuit boards obtained
by the examples 9 to 11 and the comparative example 5, the
dielectric constants and the dielectric loss tangents were measured
and further whether signals delay and signal errors took place or
not were tested for the manufactured semiconductor devices. The
results were shown in the following Table 1.
TABLE-US-00013 TABLE 1 dielectric dielectric constant loss tangent
(.di-elect cons.) (tan .delta.) signal delay signal error example 9
2.9 0.01 not not generated generated example 2.7 0.004 not not 10
generated generated example 2.8 0.005 not not 11 generated
generated comparative 3.8 0.02 generated generated example 5
[0516] As being mace clear according to the results in the
foregoing Table 1, the dielectric constants and the dielectric loss
tangents of the entire bodies of the multilayered printed circuit
boards were low in case of the multilayered printed circuit boards
of the example 9 to 11 and signal delay and signal errors did not
at all take place in the semiconductor devices using these
multilayered printed circuit boards, whereas signal delay and
signal errors took place in the semiconductor device using the
multilayered printed circuit board of the comparative example
5.
Example 12
A. Preparation of a Resin Filler
[0517] A resin filler was prepared in the same manner as example
1.
B. Manufacture of a Multilayered Printed Circuit Board
[0518] (1) A copper-laminated laminate plate composed of a
substrate 1 which was made of a 0.8 mm-thick glass epoxy resin or
BT (bismaleimide triazine) resin with a 18 .mu.m-thick copper foil
8 laminated on both sides of the substrate 1 was used as a starting
material (reference to FIG. 22 (a)). At first, the copper-laminated
laminate plate was subjected to drilling by a drill, plating resist
was formed, and then electroless copper plating was carried out for
the resultant substrate to form plated-through holes 9 and further
the copper foil was pattern-etched by a conventional method to form
the inner layer copper patterns (under-level conductor circuits) 4
on both sides of the substrate.
[0519] (2) The substrate on which the under-level conductor
circuits 4 were formed was washed with water and dried and then an
etching solution was sprayed to both sides of the substrate to etch
the surfaces of the under-level conductor circuits and the land
surfaces and the inner walls of plated-through holes 9 to form
roughened surfaces 4a, 9a in the entire surfaces of the under-level
conductor circuits 4 (reference to FIG. 22 (b)) As the etching
solution, used was a solution containing 10 part by weight of
imidazole-Cu(II) complex, 7 part by weight of glycoric acid, 5 part
by weight of potassium chloride, and 78 part by weight of ion
exchanged water.
[0520] (3) After the foregoing resin filler was produced, the resin
filler 10 was applied within 24 hours after preparation to both
sides of the substrate using a printing apparatus to fill the space
between the under-level conductor circuits 4 and the plated-through
holes 9, and then heated and dried. That is, through the step, the
space between the under-level conductor circuits 4 and the
plated-through holes 9 were filled with the resin filler 10
(reference to FIG. 22 (c)).
[0521] (4) One side of the substrate on which the foregoing
treatment (3) was finished was polished by a belt sander polishing
using the belt abrasive paper (made by Sankyo Rikagagu Co., Ltd.)
to leave no resin filler 9 on the surface of the under-level
conductor circuit 4 and the land surface of the plated-through
holes 10 and then buffed to eliminate the scars formed by the
foregoing belt sander polishing. Such a series of steps were also
carried out for the other side of the substrate. After that heating
treatment was carried to completely cure the filled resin filler 10
(reference to FIG. 22 (d)).
[0522] In such a manner the surface layer parts of the resin filler
10 filling the plated-through holes 9 and the like and the
roughened layer 4a of the under-level conductor circuits 4 were
leveled to obtain a circuit substrate where the resin filler 10 and
the side faces of the under-level conductor circuits 4 were firmly
stuck to each other through the roughened surfaces 4a, and the
inner wall faces of the plated-through holes 9 and the resin filler
10 were firmly stuck to each other by the roughened surfaces
9a.
[0523] (5) Next, the foregoing substrate was washed with water,
degreased by an acid, and then soft-etched and after that an
etching solution was sprayed to both sides of the substrate to etch
the surfaces of the under-level conductor circuits 4, and land
surfaces and the inner walls of the plated-through holes 9 to form
the roughened surfaces 4a, 9a on the entire surfaces of the
under-level conductor circuits 4 (reference to FIG. 23 (a)). The
etching solution used was an etching solution (made by Meck Co.;
Meck etch bond) containing 10 part by weight of imidazole-Cu(II)
complex, 7 part by weight of glycoric acid, and 5 part by weight of
potassium chloride.
[0524] (6) Next, 50 .mu.m-thick thermosetting type polyphenylene
ether resin sheets having the foregoing chemical formula [3]
(wherein R.sup.1 represents --CH.sub.2--; and R.sup.2 represents
--CH.sub.2--O--CH.sub.2--) were laminated on both sides of the
substrate subjected to the forgoing steps by vacuum pressure
bonding at 0.5 MPa pressure while the temperature being increased
up to 50 to 150.degree. C., to form interlaminar resin insulating
layers 2 of the polyphenylene ether resin (reference to FIG. 23
(b)). The degree of vacuum at the time of the vacuum pressure
bonding was 10 mmHg.
[0525] (7) Next, opening parts 6 for via-holes with the diameter of
80 .mu.m were formed in the interlaminar resin insulating layers 2
comprising the thermosetting type polyphenylene ether resin using
excimer laser of 248 nm wavelength. (reference to FIG. 22 (c)).
After that, de-smear treatment was carried out using oxygen
plasma.
[0526] (8) Next, using SV-4540 produced by ULVAC Japan Co., Ltd.,
sputtering of a Ni target was carried out at 80.degree. C., 0.6 Pa
gas pressure, and at the power of 200 W for 5 minutes to form thin
film layers (Ni metal layers) 12 on the surfaces of the
interlaminar resin insulating layers 2 (reference to FIG. 23 (d)).
In this case, the thickness of the formed Ni metal layers was 0.1
.mu.m.
[0527] (9) Next, a photosensitive dry film sold in the market was
stuck by thermal pressure bonding on the thin film layers (the Ni
metal layers) 12 on both sides of the substrate for which the
foregoing treatment was finished and a photomask film was mounted
thereon and exposure was carried out at 100 mJ/cm.sup.2 and
development treatment was carried out with an aqueous 0.8% sodium
carbonate solution to form 15 .mu.m-thick plating resist 3
(reference to FIG. 24 (a)).
[0528] (10) Next, electroplating was carried out in the following
conditions to form 15 .mu.m-thick electrolytic plating films 13
(reference to FIG. 24 (b)). Incidentally, by the electroplating
films 13, the parts to be conductor circuits 5 in the process
described later was thickened and the parts to be via-holes 7 were
filled with plating. In addition, the additive used in the
electrolytic plating solution was Cupracid HL by Atotech Japan
CO.
[Electroplating Solution]
TABLE-US-00014 [0529] sulfuric acid 2.24 mol/l copper sulfate 0.26
mol/l an additive 19.5 mol/l
[Electroless Plating Condition]
TABLE-US-00015 [0530] current density 1 A/dm.sup.2 duration 65
minutes temperature 22 .+-. 2.degree. C.
[0531] (11) After the plating resist 3 was separated and removed
with an aqueous 5% KOH solution, the electroless plating films used
to be under the plating resist were dissolved and removed by
etching with a mixed, solution of sulfuric acid and hydrogen
peroxide to form independent upper layer conductor circuits 5
(including the via-holes 7) (reference to FIG. 24 (c)).
[0532] (12) Successively, the foregoing steps (5) to (11) were
repeated to form further upper layer conductor circuits (reference
to FIG. 25 (a) to FIG. 26 (b)).
[0533] (13) Next, 20 .mu.m-thick thermosetting type polyphenylene
ether resin sheets having the foregoing chemical formula [3]
(wherein R.sup.1 represents --CH.sub.2--CH.sub.2-- and R.sup.2
represents --CH.sub.2--O--CH.sub.2--) were laminated on both sides
of the multilayered circuit substrate on which upper layer
conductor circuits were formed, by vacuum pressure bonding at 0.5
MPa pressure while the temperature being increased up to 50 to
150.degree. C. to form solder resist layers 14 comprising the
polyphenylene ether resin. The degree of vacuum at the time of the
vacuum pressure bonding was 10 mmHg.
[0534] (14) Next, opening parts with the diameter of 200 .mu.m were
formed in the solder resist layers 14 comprising the thermosetting
type polyphenylene ether resin using excimer laser of 248 nm
wavelength. After that, de-smear treatment was carried out using
oxygen plasma to form solder resist layers (an organic resin
insulating layers) 14 with 20 .mu.m thickness having opening parts
in the solder pad parts.
[0535] (15) Next, the substrate in which the solder resist layers
(resin insulating layers) 14 were formed was immersed in an
electroless nickel plating solution at pH 4.5 containing nickel
chloride (2.3.times.10.sup.-1 mol/l), sodium hypophosphite
(2.8.times.10.sup.-1 mol/l), and sodium citrate
(1.6.times.10.sup.-1 mol/l) for 20 minutes to form 5 .mu.m-thick
nickel plating layers 15 in the opening parts. Further, the
resultant substrate was immersed in an electroless plating solution
containing potassium cyanoaurate (7.6.times.10.sup.-3 mol/l),
ammonium chloride (1.9.times.10.sup.-1 mol/l), sodium citrate
(1.2.times.10.sup.-1 mol/l), and sodium hypophosphite
(1.7.times.10.sup.-1 mol/l) at 80.degree. C. for 7.5 minutes to
form 0.03 .mu.m-thick gold plating layers 16 on the nickel plating
layers 15.
[0536] (16) After that, a solder paste was printed on the opening
parts of the solder resist layers 14 and reflow of the paste was
carried out at 200.degree. C. to form solder bumps (solder bodies)
17 and to manufacture a multilayered printed circuit board having
the solder bumps 17 (reference to FIG. 26 (c)).
[0537] (17) Using some other part of the multilayered printed
circuit board, an IC chip bonding was carried out. That is, after
washing with fluxes, using a prescribed installation apparatus,
positioning of the solder bumps of the multilayered printed circuit
board with bumps formed in the IC chips was carried out using
target marks as standard and re-flow of the solder was carried out
to join the solder bumps of the multilayered printed circuit board
with the bumps of the IC chips. Then, washing with fluxes was
carried out and the gaps between the IC chip and the multilayered
printed circuit board was filled with under-fill to consequently
obtain a multilayered printed circuit board connected with IC chips
(a semiconductor device).
Example 13
[0538] A multilayered printed circuit board was manufactured in the
same manner as the example 12 except that, in the step (6) of
example 12, a 20 .mu.m-thick thermosetting type cycloolefin type
resin sheet was used for forming the interlaminar resin insulating
layers comprising the thermosetting type cycloolefin resin in place
of the thermosetting polyphenylene ether resin, and using the
multilayered printed circuit board, a semiconductor device
connected with an IC chip was obtained.
Comparative Example 6
A. Preparation of the a Resin Composition for Roughened Surface
Formation for an Upper Layer
[0539] (i) A mixture composition was produced by stirring and
mixing 35 part by weight of a resin solution produced by dissolving
a cresol novolak type epoxy resin (molecular weight 2500; made by
Nippon Kayaku Co., Ltd.) acrylated in 25% in diethylene glycol
dimethyl ether (DMDG) to be in 80% by weight concentration, 3.15
part by weight of a photosensitive monomer (Aronix M315; made by
Toagosei Chemical Industry Co., Ltd.), 0.5 part by weight of a
defoaming agent (S-65; made by San Nopco Ltd.), and 3.6 part by
weight of N-methylpyrrolidone (NMP) in a container.
[0540] (ii) An another mixture composition was produced by stirring
and mixing 12 part by weight of a polyether sulfone (PES), 7.2 part
by weight of an epoxy resin particle with the average particle
diameter of 1.0 .mu.m (Polymerpol; made by Sanyo Chemical
Industries, Ltd.) and 3.09 part by weight of the epoxy resin
particle with the average particle diameter of 0.5 .mu.m in another
container and then further adding 30 part by weight of NMP to the
mixture and mixing and stirring the resultant mixture by a bead
mill.
[0541] (iii) Further, another mixture composition was produced by
mixing and stirring 2 part by weight of an imidazole curing agent
(made by Shikoku Chemicals Corp.; 2E4MZ-CN), 2 part by weight of a
photopolymerization initiator (made by Chiba Specialty Chemicals
Corp.; Irgacure I-907), 0.2 part by weight of a photosensitizing
agent (made by Nippon Kayaku Co., Ltd.; DETX-S), and 1.5 part by
weight of NMP in further another container.
[0542] The mixture compositions obtained in (i), (ii), and (iii)
were mixed to give a resin composition for the roughened-surface
formation.
B. Preparation of a Resin Composition for Roughened-Surface
Formation for an Under Layer
[0543] (i) A mixture composition was produced by stirring and
mixing 35 part by weight of a resin solution produced by dissolving
a cresol novolak type epoxy resin (molecular weight 2500; by Nippon
Kayaku Co., Ltd.) acrylated in 25% in diethylene glycol dimethyl
ether (DMDG) to be in 80% by weight, 4 part by weight of a
photosensitive monomer (Aronix M315; made by Toagosei Chemical
Industry Co., Ltd.), 0.5 part by weight of a defoaming agent (made
by San Nopco Ltd.; S-65), and 3.6 part by weight of
N-methylpyrrolidone (NMP) in a container.
[0544] (ii) An another mixture composition was produced by stirring
and mixing 12 part by weight of a polyether sulfone (PES), 14.49
part by weight of an epoxy resin particle with the average particle
diameter of 0.5 .mu.m (made by Sanyo Chemical Industries, Ltd.;
Polymerpol) in another container and then further adding 30 part by
weight of NMP to the mixture and mixing and stirring the resultant
mixture by a bead mill.
[0545] (iii) Further, another mixture composition was produced by
mixing and stirring 2 part by weight of an imidazole curing agent
(made by Shikoku Chemicals Corp.; 2E4MZ-CN), 2 part by weight of a
photopolymerization initiator (made by Chiba Specialty Chemicals
Corp.; Irgacure 1-907), 0.2 part by weight of a photosensitizing
agent (made by Nippon Kayaku Co., Ltd.; DETX-S), and 1.5 part by
weight of NMP in further another container.
[0546] The mixture compositions obtained in (i), (ii), and (iii)
were mixed to give a resin composition for the roughened-surface
formation.
C. Preparation of a Resin Filler
[0547] A resin filler was prepared in the same manner as the
example 1.
D. Manufacture of a Multilayered Printed Circuit Board
[0548] (1) A copper-laminated laminate plate composed of a
substrate 1 which was made of a 0.8 mm-thick glass epoxy resin or
BT (bismaleimide triazine) resin with a 18 .mu.m-thick copper foil
8 laminated on both sides of the substrate 1 was used as a starting
material (reference to FIG. 27 (a)). At first, the copper-laminated
laminate plate was subjected to drilling by a drill and then
electroless plating and pattern-etching to form the under-level
conductor circuits 4 and plated-through holes 9 in both sides of
the substrate 1.
[0549] (2) The substrate on which the plated-through holes 9 and
the under-level conductor circuits 4 were formed was washed with
water and dried and then subjected to blackening treatment in a
blackening bath (an oxidizing bath) of an aqueous solution
containing NaOH (10 g/l), NaClO.sub.2 (40 g/l), and
Na.sub.3PO.sub.4 (6 g/l) and reducing treatment in a reducing bath
of an aqueous solution containing NaOH (10 g/l) and NaBH, (6 g/l)
to form roughened surfaces 4a, 9a on the entire surfaces of the
under-level conductor circuits 4 including the plated-through holes
9 (reference to FIG. 27 (b)).
[0550] (3) After the resin filler was produced as described in the
foregoing description C, the resin filler 10 was applied to one
side of the substrate by a roll coater to fill the space between
the under-level conductor circuits 4 and inside the plated-through
holes 9 and heated and dried and after that, the space between the
under-level conductor circuits 4 in the other side and the
plated-through holes 9 were filled with the resin filler 10 in the
same manner and heated and dried (reference to FIG. 27 (c)).
[0551] (4) One side of the substrate on which the foregoing
treatment (3) was finished was polished to leave no resin filler 10
on the surfaces of the inner layer copper patterns 4 and the land
surfaces of the plated-through holes 9 by a belt sander polishing
using the belt abrasive paper #600 (made by Sankyo Rikagagu Co.,
Ltd.) and then buffed to eliminate the scars formed by the
foregoing belt sander polishing. Such a series of steps were also
carried out for the other side of the substrate.
[0552] After that, heating treatment was carried out at 100.degree.
C. for 1 hour, at 120.degree. C. for 3 hours, at 150.degree. C. for
1 hour and at 180.degree. C. for 7 hours to cure the layers of the
resin filler 10.
[0553] In such a manner the surface layer parts of the resin filler
10 formed in the plated-through holes 9 and the non-conductor
circuit formed area and the surfaces of the under-level conductor
circuits 4 were leveled to obtain an insulating substrate
(reference to FIG. 27 (d)) where the resin filler 10 and the side
faces 4a of the under-level conductor circuits 4 were firmly stuck
to each other through the roughened surfaces, and the inner wall
faces 9a of the plated-through holes 9 and the resin filler 10 were
firmly stuck to each other by the roughened surface.
[0554] (5) Next, the forging substrate was degreased with an acid
and soft-etched and after that an etching solution was sprayed to
both sides of the substrate to etch the surfaces of the under-level
conductor circuits 4 and land surfaces and the inner walls of the
plated-through holes 9 to form the roughened surfaces 4a, 9a on the
entire surfaces of the under-level conductor circuits 4 (reference
to FIG. 28 (a)). The etching solution used was an etching solution
(made by Meck Co.; Meck etch bond) containing 10 part by weight of
imidazole-Cu(II) complex, 7 part by weight of glycoric acid, and 5
part by weight of potassium chloride.
[0555] (6) The resin composition (viscosity 1.5 Pas) for
roughened-surface formation for an under layer was applied to both
sides of the substrate by a roll coater within 24 hours after
preparation of the composition, and after being kept still
horizontally for 20 minutes, drying was carried out at 60.degree.
C. for 30 minutes. After that, the resin composition (viscosity 7
Pas) for roughened-surface formation for an upper layer was applied
to the substrate by a roll coater within 24 hours after preparation
of the composition and after being kept still horizontally for 20
minutes, drying was carried out at 60.degree. C. for 30 minutes to
form 35 .mu.m-thick layers 2a, 2b of the resin composition for
roughened-surface formation (reference to FIG. 28 (b)).
[0556] (7) Photomasks drawing black circles of 85 .mu.m diameter of
a light shielding ink were closely stuck to both sides of the
substrate 1 on which the layers 2a, 2b of the resin compositions
for the roughened-surface formation were formed as described in the
foregoing step (6) and the substrate was exposed to light in 3000
mJ/cm.sup.2 intensity of an ultra high pressure mercury lamp and
then heated at 100.degree. C. for 1 hour, at 120.degree. C. for 1
hour, and at 150.degree. C. for 3 hours to form 35 .mu.m-thick
interlaminar resin insulating layers 2 having opening parts for
via-holes of 85 .mu.m in diameter with excellent size precision
corresponding to the photomask films (reference to FIG. 28 (c)).
Incidentally, the tinplating layers were partly exposed in the
opening parts to be via-holes.
[0557] (8) The substrate in the which opening parts for via-holes 6
were formed was immersed in an aqueous containing chromic acid for
19 minutes to dissolve and remove the epoxy resin particles
existing on the surfaces of the interlaminar resin insulating
layers 2 and roughen the surfaces to obtain the roughened surfaces
(depth of 6 .mu.m). After that, the resultant substrate was
immersed in a neutralization solution (made by Shiplay Co., Inc.)
and washed with water (reference to FIG. 28 (d)).
[0558] Further, a palladium catalyst (Atotech Japan CO.) was
supplied to stick catalyst cores to the surfaces of the
interlaminar resin insulating layers 2 and the inner wall faces of
the opening parts for via-holes 6.
[0559] (9) Next, the substrate was immersed in an electroless
copper plating solution with the following composition to form thin
film layers (electroless copper plating films) 12 of 0.6 to 1.2
.mu.m thickness on the entire roughened surface (reference to FIG.
29 (a)).
[Electroless Plating Solution]
TABLE-US-00016 [0560] NiSO.sub.4 0.003 mol/l tartaric acid 0.200
mol/l copper sulfate 0.030 mol/l HCHO 0.050 mol/l NaOH 0.100 mol/l
.alpha.,.alpha.'-bipyridyl 40 mg/l PEG (polyethylene glycol) 0.10
g/l
[Electroless Plating Condition]
[0561] For 40 minutes at 35.degree. C. of solution temperature.
[0562] (10) A photosensitive dry film sold in the market was stuck
to the thin film layers (electroless copper plating films) 12 by
thermal pressure bonding and a mask was mounted thereon and
exposure was carried out at 100 mJ/cm.sup.2 and development
treatment was carried out with an aqueous 0.8% sodium carbonate
solution to form 15 .mu.m-thick plating resist 3 (reference to FIG.
29 (b)).
[0563] (11) Next, electrolytic copper plating was carried out in
the following conditions to form 15 .mu.m-thick electrolytic copper
plating films 13 (reference to FIG. 29 (c)).
[Electroplating Solution]
TABLE-US-00017 [0564] sulfuric acid 2.24 mol/l copper sulfate 0.26
mol/l an additive (Cupracid HL; by Atotech Japan CO.) 19.5
mol/l
[Electroless plating Condition]
TABLE-US-00018 current density 1 A/dm.sup.2 duration 65 minutes
temperature 22 .+-. 2.degree. C.
[0565] (12) After the plating resist 3 was separated and removed
with an aqueous 5% KOH solution, the electroless plating films used
to be under the plating resist 3 were dissolved and removed by
etching with a mixed solution of sulfuric acid and hydrogen
peroxide to form conductor circuits 5 (including via-holes 7) with
18 .mu.m thickness composed of the thin film layers (electroless
copper plating layers) 12 and the electrolytic copper plating films
13 (reference to FIG. 29 (d)).
[0566] (13) Successively, the foregoing steps (5) to (12) were
repeated to form further upper interlaminar resin insulating layers
and upper layer conductor circuits to obtain a multilayered circuit
board (reference to FIG. 30 (a) to FIG. 31 (a)).
[0567] (14) Next, the surfaces of the conductor circuits 5
(including the via-holes 7) were etched using the same etching
solution as that used in the foregoing step (5) to form roughened
surfaces on the conductor circuits 5 (including the via-holes 7)
(reference to FIG. 31 (b)).
[0568] (15) Next, a solder resist composition (an organic resin
insulating material) with an adjusted viscosity of 2.0 Pas at
25.degree. C. was prepared by preparing a mixture composition by
stirring and mixing 46.67 parts by weight of
photosensitivity-provided oligomer (molecular weight: 4000) which
was a cresol novolak type epoxy resin (made by Nippon Kayaku Co.,
Ltd.) whose 50% of epoxy group was acrylated and which was
dissolved in diethylene glycol dimethyl ether (DMDG) to be 60% by
weight concentration, 15 part by weight of a bisphenol A type epoxy
resin (made by Yuka Shell Epoxy CO.; trade name: Epikote 1001)
dissolved to be 80% by weight concentration in methyl ethyl ketone,
1.6 part by weight of an imidazole curing agent (made by Shikoku
Chemicals Corp.; trade name: 2E4MZ-CN) 3 part by weight of a
polyfunctional acrylic monomer, which is a photosensitive monomer,
(made by Nippon Kayaku Co., Ltd.; trade name: R 604), 1.5 part by
weight of a polyvalent acrylic monomer (made by Kyoei Chemical Co.,
Ltd.; trade name: DPE 6A), and 0.71 part by weight of a dispersion
type defoaming agent (made by San Nopco Ltd.; trade name: S-65) and
adding 2.0 part by weight of benzophenone (made by Kanto Chemical
Co., Inc.) as a photopolymerization initiator and 0.2 part by
weight of Micheler's ketone (made by Kanto Chemical Co., Inc.) as a
photosensitizer to the mixture composition.
[0569] The viscosity measurement was carried out by a B-type
viscometer (DVL-B type; by Tokyo Instruments Co. Ltd.), using a
rotor No. 4 for 60 rpm and a rotor No. 3 for 6 rpm.
[0570] (16) Next, the foregoing solder resist composition was
applied in 20 .mu.m thickness on both sides of the multilayered
circuit substrate and dried at 70.degree. C. for 20 minutes and
70.degree. C. for 30 minutes and after that, a 5 mm-thick photomask
drawing a pattern corresponding to the opening part of the solder
resist was closely stuck to the solder resist layers and exposure
by ultraviolet rays of 1000 mJ/cm.sup.2 and development treatment
by the DMTG solution were successively carried out to form opening
parts with 200 .mu.m of diameter.
[0571] Further, the solder resist layers were cured by heating at
80.degree. C. for 1 hour, at 100.degree. C. for 1 hour, at
120.degree. C. for 1 hour and at 150.degree. C. for 3 hours to form
20 .mu.m-thick solder resist layers (organic resin insulating
layers) 14 having opening parts for solder pad parts.
[0572] (17) Next, the substrate in which the solder resist layers
(organic resin insulating layers) 14 were formed was immersed in an
electroless nickel plating solution at pH 4.5 containing nickel
chloride (2.3.times.10.sup.-1 mol/l), sodium hypophosphite
(2.8.times.10.sup.-1 mol/l), and sodium citrate
(1.6.times.10.sup.-1 mol/l) for 20 minutes to form 5 .mu.m-thick
nickel plating layers 15 in the opening parts. Further, the
resultant substrate was immersed in an electroless plating solution
containing potassium cyanoaurate (7.6.times.10.sup.-3 mol/l),
ammonium chloride (1.9.times.10.sup.-1 mol/l), sodium citrate
(1.2.times.10.sup.-1 mol/l), and sodium hypophosphite
(1.7.times.10.sup.-1 mol/l) at 80.degree. C. for 7.5 minutes to
form 0.03 .mu.m-thick gold plating layers 16 on the nickel plating
layers 15.
[0573] (18) After that, a solder paste was printed on the opening
parts of the solder resist layers 14 and reflow of the paste was
carried out at 200.degree. C. to form solder bumps (solder bodies)
17 and to manufacture a multilayered printed circuit board having
the solder bumps 17 (reference to FIG. 31 (c)).
[0574] After that, using the obtained multilayered printed circuit
board, a multilayered printed circuit board (a semiconductor
device) connected with IC chips was obtained.
[0575] Regarding the multilayered printed circuit boards obtained
by the examples 12, 13 and the comparative example 6, the
dielectric constants and the dielectric loss tangents were measured
and further whether signal delay and signal errors took place or
not were tested for the manufactured semiconductor devices. The
results were shown in the following Table 2.
TABLE-US-00019 TABLE 2 dielectric constant dielectric loss signal
(.di-elect cons.) tangent (tan .delta.) signal delay error example
2.6 0.0005 not not 12 generated generated example 2.8 0.0009 not
not 13 generated generated comparative 3.8 0.02 generated generated
example 6
[0576] As being mace clear according to the results in the
foregoing Table 2, the dielectric constants and the dielectric loss
tangents of the entire bodies of the multilayered printed circuit
boards were low in the multilayered printed circuit boards of the
examples 12, 13 and signal delay and signal errors did not at all
took place in the semiconductor devices using these multilayered
printed circuit boards, whereas signal delay and signal errors take
place in the semiconductor device using the multilayered printed
circuit board of the comparative example 6.
Example 14
A. Preparation of the a Resin Composition for Roughened-Surface
Formation for an Upper Layer
[0577] (1) A mixture composition was produced by stirring and
mixing 400 part by weight of a resin solution produced by
dissolving a cresol novolak type epoxy resin (molecular weight
2500; made by Nippon Kayaku Co., Ltd.) acrylated in 25% in
diethylene glycol dimethyl ether (DMDG) to be in 80% by weight
concentration, 60 part by weight of a photosensitive monomer (made
by Toagosei Chemical Industry Co., Ltd.; Aronix M325), 5 part by
weight of a defoaming agent (made by San Nopco Ltd.; S-65), and 35
part by weight of N-methylpyrrolidone (NMP) in a container.
[0578] (2) An another mixture composition was produced by stirring
and mixing 80 part by weight of a polyether sulfone (PES), 72 part
by weight of an epoxy resin particle with the average particle
diameter of 1.0 .mu.m (made by Sanyo Chemical Industries, Ltd.;
Polymerpol) and 31 part by weight of the epoxy resin particle with
the average particle diameter of 0.5 .mu.m in another container and
then further adding 257 part by weight of NMP to the mixture and
mixing and stirring the resultant mixture by a bead mill.
[0579] (3) Further, another mixture composition was produced by
mixing and stirring 20 part by weight of an imidazole curing agent
(made by Shikoku Chemicals Corp.; 2E4MZ-CN), 20 part by weight of a
photopolymerization initiator (benzophenone), 4 part by weight of a
photosensitizing agent (made by Chiba Specialty Chemicals Corp.;
EAB), and 16 part by weight of NMP in further another
container.
[0580] The mixture compositions obtained in (1), (2), and (3) were
mixed to give a resin composition for the roughened-surface
formation.
B. Preparation of a Resin Composition for Roughened-Surface
Formation for an Under Layer
[0581] (1) A mixture composition was produced by stirring and
mixing 400 part by weight of a resin solution produced by
dissolving a cresol novolak type epoxy resin (molecular weight
2500; made by Nippon Kayaku Co., Ltd.) acrylated in 25% in
diethylene glycol dimethyl ether (DMDG) to be in 80% by weight
concentration, 60 part by weight of a photosensitive monomer (made
by Toagosei Chemical Industry Co., Ltd.; Aronix M325), 5 part by
weight of a defoaming agent (made by San Nopco Ltd.; S-65), and 35
part by weight of N-methylpyrrolidone (NMP) in a container.
[0582] (2) An another mixture composition was produced by stirring
and mixing 80 part by weight of a polyether sulfone (PES), 145 part
by weight of an epoxy resin particle with the average particle
diameter of 0.5 .mu.m (made by Sanyo Chemical Industries, Ltd.;
Polymerpol) in another container and then further adding 285 part
by weight of NMP to the mixture and mixing and stirring the
resultant mixture by a bead mill.
[0583] (3) Further, another mixture composition was produced by
mixing and stirring 20 part by weight of an imidazole curing agent
(made by Shikoku Chemicals Corp.; 2E4MZ-CN), 20 part by weight of a
photopolymerization initiator (benzophenone), 4 part by weight of a
photosensitizing agent (made by Chiba Specialty Chemicals Corp.;
EAB) and 16 part by weight of NMP in further another container.
[0584] The mixture compositions obtained in (1), (2), and (3) were
mixed to give a resin composition for the roughened-surface
formation.
C. Preparation of a Resin Filler
[0585] A resin filler with the viscosity of 45 to 49 Pas at
23.+-.1.degree. C. was produced by mixing and stirring 100 part by
weight of a bisphenol F type epoxy monomer (molecular weight 310;
made by Yuka Shell Epoxy CO.; YL 983 U), 170 part by weight of a
SiO.sub.2 spherical particle (made by Admatechs Co., Ltd.; CRS
1101-CE) with the average particle diameter of 1.6 .mu.m and the
maximum particle diameter of 15 .mu.m or smaller and coated with a
silane coupling agent on the surface, and 1.5 part by weight of a
leveling agent (made by San Nopco Ltd.; Perenol S4) in a
container.
[0586] Incidentally, 6.5 part by weight of an imidazole curing
agent (made by Shikoku Chemicals Corp., 2E4MZ-CN) was used as a
curing agent.
D. Method for Manufacturing a Multilayered Printed Circuit
Board
[0587] (1) A copper-laminated laminate plate composed of a
substrate 1 which was made of a 0.8 mm-thick glass epoxy resin or
BT (bismaleimide triazine) resin with a 18 .mu.m-thick copper foil
8 laminated on both sides of the substrate 1 was used as a starting
material (reference to FIG. 6 (a)). At first, the copper-laminated
laminate plate was subjected to drilling by a drill and then
electroless plating and pattern-etching to form the under-level
conductor circuits 4 and plated-through holes 9 in both sides of
the substrate 1.
[0588] (2) The substrate on which the plated-through holes 9 and
the under-level conductor circuits 4 were formed was washed with
water and dried and then subjected to blackening treatment in a
blackening bath (an oxidizing bath) of an aqueous solution
containing NaOH (10 g/l), NaClO.sub.2 (40 g/l), and
Na.sub.3PO.sub.4 (6 g/l) and reducing treatment in a reducing bath
of an aqueous solution containing NaOH (19 g/l) and NaBH.sub.4 (5
g/l) to form roughened surfaces 4a, 9a on the entire surfaces of
the under-level conductor circuits 4 including the plated-through
holes 9 (reference to FIG. 6 (b)).
[0589] (3) After the resin filler was produced as described in the
foregoing description D, the layers of the resin filler 10 were
formed in the plated-through holes 9 and in the non conductor
circuit formed area and the outer rim area of the conductor circuit
4 on one side of the substrate 1.
[0590] That is, at first the resin filler was squeezed into the
through holes using a squeegee and then dried at 100.degree. C. for
20 minutes. Next, a mask having opening parts in the portions
corresponding to the non conductor circuit formed area was put on
the substrate and layers of the resin filler 10 were formed in
recessed parts, which corresponded to the non conductor circuit
formed area, using a squeegee and dried at 100.degree. C. for 20
minutes (reference to FIG. 6 (c)).
[0591] (4) The one side of the substrate for which the foregoing
step (3) was just finished was polished by a belt sander polishing
using the belt abrasive paper #600 (made by Sankyo Rikagagu Co.,
Ltd.) as to leave no resin filler 10 on the surface of the inner
layer copper pattern 4 and on the land surfaces of the
plated-through holes 9 and then buffed to eliminate the scars
formed by the foregoing belt sander polishing. Such a series of
steps were also carried out for the other side of the
substrate.
[0592] After that, heating treatment was carried out at 100.degree.
C. for 1 hour, at 120.degree. C. for 3 hours, at 150.degree. C. for
1 hour, and 180.degree. C. for 7 hours to cure the resin filler
10.
[0593] In such a manner, the layer portion close to the surface of
the resin filler 10 formed in the plated-through holes 9 and in the
non-conductor circuit formed area and the surfaces of the
under-level conductor circuits 4 were leveled to obtain an
insulating substrate (reference to FIG. 6 (d)) where the resin
filler 10 and the side faces 4a of the under-level conductor
circuits 4 were firmly stuck to each other through the roughened
surfaces, and the inner wall faces 9a of the plated-through holes 9
and the resin filler 10 were firmly stuck to each other by the
roughened surface. By these steps, the surfaces of the resin filler
10 and the surface of the under-level conductor circuits 4 were
made to be in the same planes.
[0594] (5) Next, the foregoing substrate was washed with water,
degreased by an acid, and then soft-etched and after that an
etching solution was sprayed to both sides of the substrate to etch
the surfaces of the under-level conductor circuits 4 and land
surfaces and the inner walls of the plated-through holes 9 to form
the roughened surfaces 4a, 9a on the entire surfaces of the
under-level conductor circuits 4 (reference to FIG. 7 (a)). The
etching solution used was an etching solution (made by Meck Co.;
Meck etch bond) containing 10 part by weight of imidazole-Cu(II)
complex, 7 part by weight of glycoric acid, and 5 part by weight of
potassium chloride.
[0595] (6) The resin composition (viscosity 1.5 Pas) for
roughened-surface formation according to foregoing B was applied to
both sides of the substrate by a roll coater, and after being kept
still horizontally for 20 minutes, the resin composition was dried
at 60.degree. C. for 30 minutes to form the resin layers 2a for
roughened-surface formation.
[0596] Further, after that, the resin composition (viscosity 7 Pas)
for roughened-surface formation according to forgoing A was applied
to the resin layers 2a for roughened-surface formation and after
being kept still horizontally for 20 minutes, the resin composition
was dried at 60.degree. C. for 30 minutes to form resin layers for
roughened-surface formation 2b, and finally obtained 35 .mu.m-thick
resin layers for roughened-surface formation (reference to FIG.
7(b)).
[0597] (7) Photomasks drawing black circles of 85 .mu.m diameter
were closely stuck to both sides of the substrate 1 on which the
layers of the resin compositions for the roughened-surface
formation were formed as described in the foregoing step (6) and
the substrate was exposed to light in 500 mJ/cm.sup.2 intensity by
an ultra high pressure mercury lamp and then subjected to spray
development with a DMDG solution. After that, the resultant
substrate was exposed to the light in 3000 mJ/cm.sup.2 intensity of
an ultra high pressure mercury lamp and then subjected to heating
treatment at 100.degree. C. for 1 hour, at 120.degree. C. for 1
hour, and at 150.degree. C. for 3 hours to form 35 .mu.m-thick
interlaminar resin insulating layers 2 having opening parts 6 for
via-holes of 85 .mu.m diameter with excellent size precision
corresponding to the photomask films (reference to FIG. 7(c)).
[0598] (8) The substrate in which the opening parts for via-holes 6
were formed was immersed in a solution containing 800 g/l of
chromic acid for 19 minutes at 70.degree. C. to dissolve and remove
the epoxy resin particles existing on the surfaces of the
interlaminar resin insulating layers 2 and roughen the surfaces of
the interlaminar resin insulating layers 2 to obtain the roughened
surfaces (depth of 3 .mu.m) (reference to FIG. 7 (d)).
[0599] (9) After that, the resultant substrate was immersed in a
neutralization solution (made by Shiplay Co., Inc.) and washed with
water.
[0600] Further, a palladium catalyst (Atotech Japan CO.) was
supplied to the surface of the substrate subjected to the surface
roughening treatment to stick catalyst cores to the surfaces of the
interlaminar resin insulating layers 2 and the inner wall faces of
the opening parts for via-holes 6.
[0601] (10) Next, the substrate was immersed in an electroless
copper plating solution with the following composition to form
electroless copper plating layers 12 of 0.8 .mu.m thickness on the
entire roughened surface (reference to FIG. 8 (a)).
[Electroless Plating Solution]
TABLE-US-00020 [0602] NiSO.sub.4 0.003 mol/l tartaric acid 0.200
mol/l copper sulfate 0.030 mol/l HCHO 0.050 mol/l NaOH 0.100 mol/l
.alpha.,.alpha.'-bipyridyl 40 mg/l PEG (polyethylene glycol) 0.10
g/l
[Electroless Plating Condition]
[0603] For 40 minutes at 35.degree. C. of solution temperature.
[0604] (11) A photosensitive dry film sold in the market was stuck
to the electroless copper plating layers 12 and a mask was mounted
thereon and exposure was carried out at 100 mJ/cm.sup.2 and
development treatment was carried out with an aqueous 0.8% sodium
carbonate solution to form 25 .mu.m-thick plating resist 3
(reference to FIG. 8 (b)).
[0605] (12) Next, after the substrate was washed with water at
50.degree. C., degreased, and washed with water at 25.degree. C.
and further with sulfuric acid, electrolytic copper plating was
carried out in the following conditions to form electrolytic copper
plating layers 13 (reference to FIG. 8 (c)).
[Electroplating Solution]
TABLE-US-00021 [0606] sulfuric acid 2.24 mol/l copper sulfate 0.26
mol/l an additive (Cupracid HL; by Atotech Japan CO.) 19.5
mol/l
[Electroless Plating Condition]
TABLE-US-00022 [0607] current density 1 A/dm.sup.2 duration 65
minutes temperature 22 .+-. 2.degree. C.
[0608] (13) After the plating resist 3 was separated and removed
with 5% KOH, the electroless plating layers 12 used to be under the
plating resist 3 was dissolved and removed by etching with a mixed
solution of sulfuric acid and hydrogen peroxide to form independent
conductor circuits 5 (including via-holes 7) (reference to FIG. 8
(d)).
[0609] (14) The foregoing steps (5) to (13) were repeated to form
further upper conductor circuits and obtain a multilayered printed
circuit board. (reference to FIG. 9 (a) to FIG. 10 (b)).
[0610] (15) Next, a solder resist composition containing a P
atom-containing epoxy resin was prepared by the following
method.
[0611] A solder resist composition with an adjusted viscosity of
1.4.+-.0.3 Pas at 25.degree. C. was prepared by preparing a mixture
composition by stirring and mixing 46.67 part by weight of a
photosensitivity-provided oligomer (molecular weight 4000), which
was a P atom-containing epoxy resin having the foregoing general
formula [4] (wherein X.sup.1 and X.sup.2 are 0 (oxygen)) of which
50% epoxy group was acrylated and dissolved in diethylene glycol
dimethyl ether (DMDG) to be in 60% by weight concentration, 6.67
part by weight of a bisphenol A type epoxy resin dissolved in
methyl ethyl ketone to be in 80% by weight concentration, 1.6 part
by weight of an imidazole curing agent (made by Shikoku Chemicals
Corp.; 2E4MZ-CN), 4.5 part by weight of a bifunctional acrylic
monomer (made by Nippon Kayaku Co., Ltd.; R 604), which was a
photosensitive monomer, 1.5 part by weight of also a polyvalent
acrylic monomer (made by Kyoei Chemical Co., Ltd.; DPE 6A), and
0.36 part by weight of a leveling agent (made by Kyoei Chemical
Co., Ltd.; Polyflow No. 75) composed of an acrylic acid ester
polymer in a container and adding 2.0 part by weight of
benzophenone (made by Kanto Chemical Co., Inc.) as a
photopolymerization initiator, 0.2 part by weight of Micheler's
ketone (made by Kanto Chemical Co., Inc.) as a photosensitizer and
0.6 part by weight of DMDG to the mixture composition.
[0612] The viscosity measurement was carried out by a B-type
viscometer (DVL-B type; by Tokyo Instruments Co. Ltd.), using a
rotor No. 4 for 60 rpm and a rotor No. 3 for 6 rpm.
[0613] (16) Next, the foregoing solder resist composition was
applied in 20 .mu.m thickness on both sides of the multilayered
circuit substrate and dried at 70.degree. C. for 20 minutes and
70.degree. C. for 20 minutes and after that, a 5 mm-thick photomask
drawing a pattern corresponding to the opening parts of the solder
resists were closely stuck to the solder resist layers and exposure
by ultraviolet rays of 900 mJ/cm.sup.2 and development treatment
with pure water were successively carried out to form opening parts
with 125 .mu.m diameter.
[0614] Further, the solder resist layers were cured by UV curing
treatment of 3000 mJ/cm.sup.2 and by heating at 80.degree. C. for 1
hour, at 100.degree. C. for 1 hour, at 120.degree. C. for 1 hour,
and at 150.degree. C. for 3 hours to form 25 .mu.m-thick solder
resist layers 14 having opening parts.
[0615] (17) After that, the substrate in which the solder resist
layers 14 were formed was immersed in an electroless nickel plating
solution at pH 5 containing nickel chloride (30 g/l), sodium
hypophosphite (10 g/l), and sodium citrate (10 g/l) for 20 minutes
to form 5 .mu.m-thick nickel plating layers 15 in the opening
parts. Further, the resultant substrate was immersed in an
electroless plating solution containing potassium cyanoaurate (2
g/l), ammonium chloride (75 g/l), sodium citrate (50 g/l), and
sodium hypophosphite (10 g/l) at 93.degree. C. for 23 seconds to
form 0.03 .mu.m-thick gold plating layers 16 on the nickel plating
layers 15.
[0616] (18) After that, a solder paste was printed on the opening
parts of the solder resist layers 14 and reflow of the paste was
carried out at 200.degree. C. to form bumps (solder bodies) 17 and
to manufacture a multilayered printed circuit board having the
solder bumps 17 (reference to FIG. 10 (c)).
Example 15
A. Production of a Resin Film for an Interlaminar Resin Insulating
Layer
[0617] An epoxy resin composition was prepared by dissolving 30
part by weight of bisphenol A type epoxy resin (epoxy equivalent
469; made by Yuka Shell Epoxy CO.; Epikote 1001), 40 part by weight
of cresol novolak type epoxy resin (Epichlon N-673; epoxy
equivalent 215; Dainippon Ink and Chemicals, Inc.), 30 part by
weight of triazine structure-containing phenol novolak resin
(Phenolite KA-7052; phenolic hydroxyl equivalent 120; Dainippon Ink
and Chemicals, Inc.) in 20 part by weight of ethylene glycol
acetate and 20 part by weight of solvent naphtha while heating and
stirring them, and then adding 15 part by weight of
epoxy-terminated polybutadiene rubber (made by Nagase Chemicals
Ltd.; Denalex R-45EPT), 1.5 part by weight of a pulverized product
of 2-phenyl-4,5-bis(hydroxymethyl)imidazole, 2 part by weight of a
finely pulverized silica, and 0.5 part by weight of a silicon type
defoaming agent to the resultant mixture.
[0618] The obtained epoxy resin composition was applied to a 38
.mu.m-thick PET film by a roll coater, the thickness thereof is
controlled to be 50 .mu.m after drying, and then dried at 80 to
120.degree. C. for 10 minutes to produce a resin film for an
interlaminar resin insulating layer.
B. Method for Manufacturing a Multilayered Printed Circuit
Board
[0619] (1) A copper-laminated laminate plate composed of a
substrate 1 which was made of a 1.0 mm-thick glass epoxy resin or
BT (bismaleimide triazine) resin with 18 .mu.m-thick copper foils 8
laminated on both sides of the substrate 1 was used as a starting
material (reference to FIG. 32 (a)). At first, the copper-laminated
laminate plate was pattern-etched to form the under-level conductor
circuits 4 on both sides of the substrate 1.
[0620] (2) The foregoing substrate was washed with water, degreased
by an acid, and then soft-etched and after that an etching solution
was sprayed to both sides of the substrate to etch the surfaces of
the under-level conductor circuits 4 to form the roughened surfaces
4a on the entire surfaces of the under-level conductor circuits 4
(reference to FIG. 32 (b)). The etching solution used was an
etching solution (made by Meck Co.; Meck etch bond) containing 10
part by weight of imidazole-Cu(II) complex, 7 part by weight of
glycoric acid, and 5 part by weight of potassium chloride.
[0621] (3) Resin films for interlaminar resin insulating layers
produced according to the description A, size of which is slightly
larger than the substrate, were mounted on both sides of the
substrate and temporarily pressure bonded at 0.4 MPa pressure and
80.degree. C. temperature for 10 seconds and cut and after that,
the films were stuck in the following conditions using a vacuum
laminator equipment to form interlaminar resin insulating layers 2
(reference to FIG. 32 (c)). That is, the resin films for
interlaminar resin insulating layers were mounted on the substrate
and actually pressure-bonded in conditions of the degree of vacuum
at 0.5 Torr, the pressure of 0.4 MPa, and the temperature of
80.degree. C. for pressure-bonding duration of 60 seconds and then
thermally cured at 170.degree. C. for 30 minutes.
[0622] (4) Opening parts for via-holes 6 with 80 .mu.m diameter
were formed in the interlaminar resin insulating layers 2 by
radiating CO.sub.2 gas laser of 10.4 .mu.m wavelength through a 1.2
mm-thick mask having through holes in conditions of the beam
diameter of 4.0 mm, the top hat mode, the pulse width of 8.0 .mu.s,
1.0 mm diameter of the through holes of the mask, and one shot.
[0623] Further, the substrate on which the interlaminar resin
insulating layers 2 were formed was drilled by a drill to form
through holes 18 (reference to FIG. 32 (d)).
[0624] (5) The substrate in which the opening parts for via-holes 6
and the through holes 18 were formed was immersed in a solution
containing 60 g/l of permanganic acid at 80.degree. C. for 10
minutes to dissolve and remove the epoxy resin particle existing on
the surfaces of the interlaminar resin insulating layers 2 and
roughen the surfaces of the interlaminar resin insulating layers 2
(reference to FIG. 33 (a)).
[0625] Further, a palladium catalyst (Atotech Japan CO.) was
supplied to the resultant substrate subjected to the
surface-roughening treatment (roughening depth 6 .mu.m) to stick
catalyst cores to the surfaces of the interlaminar resin insulating
layers 2, the surfaces of the through holes 18, and the inner wall
faces of the opening parts 6 for via-holes.
[0626] (6) Next, the substrate was immersed in an electroless
copper plating solution with the following composition to form
electroless copper plating films 12a of 0.6 to 3.0 .mu.m thickness
on the entire roughened surface (reference to FIG. 33 (b)).
[Electroless Plating Solution]
TABLE-US-00023 [0627] NiSO.sub.4 0.003 mol/l tartaric acid 0.200
mol/l copper sulfate 0.030 mol/l HCHO 0.050 mol/l NaOH 0.100 mol/l
.alpha.,.alpha.'-bipyridyl 40 mg/l PEG (polyethylene glycol) 0.10
g/l
[Electroless Plating Condition]
[0628] For 40 minutes at 35.degree. C. of solution temperature.
[0629] (7) The substrate on which the electroless plating films 12a
were formed was washed with water and dried and then subjected to
blackening treatment in a blackening bath (an oxidizing bath) of an
aqueous solution containing NaOH (10 g/l), NaClO.sub.2 (40 g/l),
and Na.sub.3PO.sub.4 (6 g/l) and reducing treatment in a reducing
bath of an aqueous solution containing NaOH (10 g/l) and NaBH.sub.4
(6 g/l) to form roughened surfaces on the entire surfaces of the
electroless plating films 12a.
[0630] (8) After the foregoing resin filler was prepared according
to the foregoing description B, the resin filler 10 was squeezed
into the plated-through holes 29 within 24 hours after preparation
of the resin filler as described below.
[0631] That is, the resin filler was squeezed into the
plated-through holes 29 using a squeegee and then dried at
100.degree. C. for 20 minutes.
[0632] On completion of the drying, buffing was carried out to
level the surfaces of the electroless plating films 12a and the
surface layer parts 10a of the resin filler. After that, heating
treatment was carried out at 100.degree. C. for 1 hour, at
120.degree. C. for 3 hours, at 150.degree. C. for 1 hour, and
180.degree. C. for 7 hours to cure the resin filler 10 (reference
to FIG. 33 (c)).
[0633] (9) A palladium catalyst (Atotech Japan CO.) was supplied on
the surface layer parts 10a of the resin filler to stick catalyst
cores to the surface layer parts 10a of the resin filler. Further,
an electroless plating was carried out in the same conditions as
those in the foregoing step (6) to further form electroless plating
films 12b of 0.6 to 3.0 .mu.m thickness on the electroless plating
films 12a formed in the foregoing step (6) and the surface layer
parts 10a of the resin filler (reference to FIG. 33 (d)). By the
process, cover plating layers were formed on the plated-through
holes 29.
[0634] (10) A photosensitive dry film sold in the market was stuck
to the electroless plating films 12b, then a mask was mounted
thereon, after that, exposure was carried out at 100 mJ/cm.sup.2,
and development treatment was carried out with an aqueous 0.8%
sodium carbonate solution to form 30 .mu.m-thick plating resist 3
(reference to FIG. 34 (a)).
[0635] (11) Next, the substrate was washed with water at 50.degree.
C. and degreased, washed again with water at 25.degree. C., and
further washed with sulfuric acid and then, electrolytic copper
plating was carried out in the following conditions to form 20
.mu.m-thick electrolytic copper plating films 13 (reference to FIG.
34 (b)).
[Electroplating Solution]
TABLE-US-00024 [0636] sulfuric acid 2.24 mol/l copper sulfate 0.26
mol/l an additive 19.5 mol/l (Cupracid HL; by Atotech Japan
CO.)
[Electroless plating condition]
TABLE-US-00025 current density 1 A/dm.sup.2 duration 65 minutes
temperature 22 .+-. 2.degree. C.
[0637] (12) After the plating resist 3 was separated and removed
with 5% NaOH, the electroless plating films 12a, 12b used to be
under the plating resist 3 were dissolved and removed by etching
with a mixed solution of sulfuric acid and hydrogen peroxide to
form conductor circuits 5 (including via-holes 7) with 18 .mu.m
thickness comprising the electroless copper plating layers 12 and
the electrolytic copper plating films 13 (reference to FIG. 34
(c)).
[0638] (13) The same treatment of the step (5) was carried out and
then roughened surface was formed by an etching solution containing
a cupric complex and an organic acid (reference to FIG. 34
(d)).
[0639] (14) The foregoing steps (6) to (13) were repeated to form
further upper layer conductor circuits and obtain a multilayered
circuit board (reference to FIG. 35 (a) to FIG. 36 (a)).
[0640] (15) Next, a solder resist composition containing a P
atom-containing epoxy resin was prepared by the following
method.
[0641] A solder resist composition with an adjusted viscosity of
1.4.+-.0.3 Pas at 25.degree. C. was prepared by preparing a mixture
composition by stirring and mixing 46.67 parts by weight of
photosensitivity-provided oligomer (molecular weight: 4000) which
was a cresol novolak type epoxy resin (made by Nippon Kayaku Co.,
Ltd.) whose 50% of epoxy group was acrylated and which was
dissolved to be 60 wt. % concentration in diethylene glycol methyl
ether (DMDG), 6.67 part by weight of a P atom-containing epoxy
resin having the foregoing general formula [4] (wherein X.sup.3
represents a single bond and R represents butyl group) dissolved in
methyl ethyl ketone to be in 80% by weight concentration, 1.6 part
by weight of an imidazole curing agent (made by Shikoku Chemicals
Corp.; 2E4MZ-CN), 4.5 part by weight of a bifunctional acrylic
monomer (made by Nippon Kayaku Co., Ltd.; R 604), which was a
photosensitive monomer, 1.5 part by weight of also a polyvalent
acrylic monomer (made by Kyoei Chemical Co., Ltd.; DPE 6A), and
0.36 part by weight of a leveling agent (Polyflow No. 75; Kyoei
Chemical Co., Ltd.) composed of an acrylic acid ester polymer in a
container and adding 2.0 part by weight of benzophenone (made by
Kanto Chemical Co., Inc.) as a photopolymerization initiator, 0.2
part by weight of Micheler's ketone (made by Kanto Chemical Co.,
Inc.) as a photosensitizer and 0.6 part by weight of DMDG to the
mixture composition.
[0642] (16) Next, the foregoing solder resist composition was
applied in 20 .mu.m thickness on both sides of the multilayered
circuit substrate and dried at 70.degree. C. for 20 minutes and
70.degree. C. for 20 minutes, and after that, a 5 mm-thick
photomask drawing a pattern corresponding to the opening part of
the solder resist was closely stuck to the solder resist layers and
exposure by ultraviolet rays of 900 mJ/cm.sup.2 and development
treatment with pure water were successively carried out to form
opening parts with 125 .mu.m diameter.
[0643] Further, the solder resist layers were cured by UV curing
treatment of 3000 mJ/cm.sup.2 and by heating at 80.degree. C. for 1
hour, at 100.degree. C. for 1 hour, at 120.degree. C. for 1 hour,
and at 150.degree. C. for 3 hours to form 25 .mu.m-thick solder
resist layers 14 having opening parts.
[0644] (17) After that, the substrate in which the solder resist
layers 14 were formed was immersed in an electroless nickel plating
solution at pH 4.5 containing nickel chloride (2.3.times.10.sup.-1
mol/l), sodium hypophosphite (2.8.times.10.sup.-1 mol/l), and
sodium citrate (1.6.times.10.sup.-1 mol/l) for 20 minutes to form 5
.mu.m-thick nickel plating layers 15 in the opening parts. Further,
the resultant substrate was immersed in an electroless gold plating
solution containing potassium cyanoaurate (7.6.times.10.sup.-3
mol/l), ammonium chloride (1.9.times.10.sup.-1 mol/l), sodium
citrate (1.2.times.10.sup.-1 mol/l), and sodium hypophosphite
(1.7.times.10.sup.-1 mol/l) at 80.degree. C. for 7.5 minutes to
form 0.03 .mu.m-thick gold plating layers 16 on the nickel plating
layers 15.
[0645] (18) After that, a solder paste containing tin-lead was
printed on the opening parts of the solder resist layer 14 on the
side of the substrate where IC chips were to be mounted and a
solder paste containing tin-antimony was printed on the opening
parts of the solder resist layer 14 on the other side of the
substrate, and pins were set on the latter solder paste, and after
that, reflow of the pastes was carried out at 200.degree. C. to
form solder bumps (solder bodies) 17 in the side where the IC chips
were to be mounted and to form PGA in the other side and thus
manufacture a multilayered printed circuit board (reference to FIG.
36 (b)).
Example 16
[0646] A multilayered printed circuit board was manufactured in the
same manner as the example 14 except that a solder resist
composition was prepared by additionally adding 10 part by weight
of a spherical silica with the average particle diameter of 1.0
.mu.m as an inorganic filler in the step (15) in the example
14.
Example 17
[0647] A multilayered printed circuit board was manufactured in the
same manner as the example 14 except that a solder resist
composition was prepared by additionally adding 10 part by weight
of a spherical silica with the average particle diameter of 1.0
.mu.m as an inorganic filler in the step (15) in the example
14.
Comparative Example 7
[0648] A multilayered printed circuit board was manufactured in the
same manner as the example 14 except that a solder resist resin
composition adjusted as to have a viscosity of 1.4.+-.0.3 Pas at
25.degree. C. was obtained by blending 46.67 parts by weight of
photosensitivity provided oligomer (molecular weight: 4000) which
was a cresol novolak type epoxy resin (made by Nippon Kayaku Co.,
Ltd.) whose 50% of epoxy group was acrylated and which was
dissolved in 60 wt. % concentration in diethylene glycol methyl
ether (DMDG), 6.67 parts by weight of a bisphenol A type epoxy
resin (made by Yuka Shell Epoxy Co.: Epikote 1001) dissolved to be
80 wt. % concentration in methyl ethyl ketone, 1.6 parts by weight
of an imidazole curing agent (made by Shikoku Chemicals Corp.:
2E4MZ-CN), 4.5 parts by weight of a bifunctional acrylic monomer,
which is a photosensitive monomer, (made by Nippon Kayaku Co.,
Ltd.: R 604), 1.5 parts by weight of also a polyvalent acrylic
monomer (made by Kyoei Chemical Co., Ltd.: DPE 6A), 0.36 part by
weight of a leveling agent (Polyflow No. 75; Kyoei Chemical Co.,
Ltd.) comprising an acrylic acid ester polymer in a container and
mixing and stirring the obtained mixture and further adding 2.0
parts by weight of benzophenone (made by Kanto Chemical Co., Inc.)
as a photopolymerization initiator to the obtained mixture
composition and 0.2 parts by weight of Michler's ketone (made by
Kanto Chemical Co., Inc.) as a photosensitizer and 0.6 part by
weight of DMDG to the mixture composition.
Comparative Example 8
[0649] A multilayered printed circuit board was manufactured in the
same manner as the example 15 except that a solder resist
composition the same as that in the comparative example 1 was
prepared.
[0650] Next, regarding the multilayered printed circuit boards
manufactured in the examples 14 to 17 and comparative examples 7,
8, the flame retardancy, the openability of holes, generation of
the peeling between a solder resist layer and a conductor circuit,
and generation of the cracking in a solder resist layer were
evaluated by the following methods and the results were shown in
Table 3.
Evaluation Method
(1) Evaluation of the Flame Retardancy
[0651] According to the standard of UL 94, multilayered printed
circuit boards were cut and subjected to a flame retardancy test by
a perpendicular method and evaluated based on the following
evaluation standard. Incidentally, the size of the testing specimen
was 12.7 mm.times.127 mm.times.the appointed thickness.
Evaluation Standard
[0652] .largecircle.: clear the judgment standard of 94V-0 X: not
clear the judgment standard of 94V-0
(2) Evaluation of the Openability of Holes
[0653] In examples 1 to 4 and comparative examples 1, 2, after an
opening part was formed in a solder resist layer and cured, the
shape of the opening part was observed by a microscope before a
plating layer was formed in the opening part and further, on
completion of the manufacture of a multilayered printed circuit
board, the part where a solder bump of the multilayered printed
circuit board was formed was cut and the cut cross-section was
observed by a microscope to observe the cross-section shape of the
opening part formed in the solder resist layer and evaluate the
shape based on the following evaluation standard.
Evaluation Standard
[0654] .largecircle.: The shape of the opening part observed in a
plain view was a desired one and resin was not left in the
conductor circuit surface exposed out the opening. X: The shape of
the opening part was gradually narrowed and resin was left on the
conductor circuit surface exposed out the opening, or opening part
was not opened.
(3) Observation of the Generation of the Peeling and Cracking
[0655] In the same manner as the foregoing (2), a multilayered
printed circuit board was cut and the cross-section was observed by
a microscope to observe whether peeling took place between a solder
resist layer and a conductor circuit or not and further whether
cracking took place in the solder resist layer.
[0656] Further, a heat cycle test was carried out by repeating the
cycle of keeping a multilayered printed circuit board in
-65.degree. C. environments for 3 minutes and in 130.degree. C.
environments for 3 minutes 1000 times and then in the same manner
as described above, whether peeling took place between a solder
resist layer and a conductor circuit or not was observed and
further whether cracking took place in the solder resist layer or
not was observed.
TABLE-US-00026 TABLE 3 comparative examples examples 14 15 16 17 7
8 flame retardancy .largecircle. .largecircle. .largecircle.
.largecircle. X X openability of .largecircle. .largecircle.
.largecircle. .largecircle. .largecircle. .largecircle. holes
generation of none none none none none none peeling or cracking
before a heat cycle test generation of none none none none none
none peeling or cracking after a heat cycle test
[0657] As being made clear in Table 3, the multilayered printed
circuit boards manufactured by the examples 14 to 17 satisfied the
judgment standard of 94V-0 in the test standard of UL 94.
[0658] Further, the solder resist layers formed in the multilayered
printed circuit boards had excellent openability of holes and were
free from cracking and peeling from the conductor circuits. On the
other hand, the multilayered printed circuit board manufactured by
the comparative examples 7, 8 did not satisfy the judgment standard
of 94V-0 owing to long combustioning duration and were inferior in
the flame retardancy.
INDUSTRIAL APPLICABILITY
[0659] As described above, according to a multilayered printed
circuit board of the first invention of the first group of the
present invention, since the foregoing solder resist layer of the
multilayered printed circuit board contains an inorganic filler,
the linear expansion coefficient is lowered to prevent generation
of cracking attributed to the difference of the thermal expansion
coefficient between the solder resist layer and other parts in the
manufacturing process of the printed circuit board and after the
electronic parts and the like such as an IC chip are mounted on the
printed circuit board and the like.
[0660] Further, according to a solder resist composition of the
second invention of the first group of the present invention, since
the solder resist composition contains an inorganic filler, a
solder resist layer containing the inorganic filler can be formed
in the printed circuit board by using the solder resist composition
and consequently no cracking and the like takes place attributed to
the difference of the thermal expansion coefficient between the
solder resist layer and other parts in the manufacturing process of
the printed circuit board and the like.
[0661] Further, according to a method for manufacturing a
multilayered printed circuit board of the third invention of the
first group of the present invention, a multilayered printed
circuit board of the first invention of the first group of the
present invention can desirably be manufactured.
[0662] Further, according to a multilayered printed circuit board
of the first invention of the second group of the present
invention, since the solder resist layer of the multilayered
printed circuit board contains an elastomer component, the stress
affecting the solder resist layer of the multilayered printed
circuit board can be absorbed and moderated and consequently,
cracking does not easily take place attributed to the difference of
the thermal expansion coefficient between the solder resist layer
and other parts, in the manufacturing process of the printed
circuit board and after the electronic parts of such as an IC chip
are mounted on the printed circuit board and even if cracking takes
place, the cracks do not grow big.
[0663] Further, according to a solder resist composition of the
second invention of the second group of the present invention,
since the solder resist composition contains an elastomer
component, a solder resist layer containing the elastomer component
can be formed in the printed circuit board by using the solder
resist composition and consequently, cracking does not easily take
place attributed to the difference of the thermal expansion
coefficient between the solder resist layer and other parts in the
manufacturing process of the printed circuit board and the like,
and even if cracking takes place, the cracks do not grow big.
[0664] Further, according to a method for manufacturing a
multilayered printed circuit board of the third invention of the
second group of the present invention, a multilayered printed
circuit board of the first invention of the second group of the
present invention can desirably be manufactured.
[0665] Further, since a multilayered printed circuit board of the
first invention of the third group of the present invention has a
dielectric constant of 3.0 or lower at 1 GHz, signal delay and
signal errors do not easily take place even if high frequency
signals in the GHz band are used.
[0666] Further, since a multilayered printed circuit board of the
second invention of the third group of the present invention
comprises a polyolefin type resin for the solder resist layer,
signal delay and signal errors do not easily take place even if
high frequency signals in the GHz band are used.
[0667] Further, since a semiconductor device of the third invention
of the third group of the present invention comprises a polyolefin
type resin for the solder resist layer and a polyolefin type resin
for the resin interlaminar insulating layers, the dielectric
constant and the dielectric loss tangent are low and consequently,
even in case of a semiconductor device on which an IC chip and the
like utilizing high frequency signals in the GHz band are mounted,
signal delay and signal errors do not easily take place.
[0668] In a multilayered printed circuit board of the first
invention of the fourth group of the present invention, since the
solder resist layer has a dielectric loss tangent of 0.01 or lower
at 1 GHz, signal delay and signal errors do not easily take place
even if high frequency signals in the GHz band are used.
[0669] Further, in a multilayered printed circuit board of the
second invention of the fourth group of the present invention,
since a polyphenylene ether resin is used for the solder resist
layer, signal delay and signal errors do not easily take place even
if high frequency signals in the GHz band are used.
[0670] Further, in a semiconductor device of the third invention of
the fourth group of the present invention, since a polyphenylene
ether resin is used for the solder resist layer and a polyphenylene
ether resin and the like is used for the resin interlaminar
insulating layers, the dielectric constant and the dielectric loss
tangent are low and consequently, even in case of a semiconductor
device on which an IC chip and the like utilizing high frequency
signals in the GHz band are mounted, signal delay and signal errors
do not easily take place.
[0671] A multilayered printed circuit board of the fifth group of
the present invention comprises a solder resist layer having
excellent flame retardancy, a high adhesion strength to a conductor
circuit and opening parts with a desired shape.
* * * * *