loadpatents
name:-0.019832849502563
name:-0.020737171173096
name:-0.0006251335144043
Toyoda; Yukihiko Patent Filings

Toyoda; Yukihiko

Patent Applications and Registrations

Patent applications and USPTO patent grants for Toyoda; Yukihiko.The latest application filed is for "multilayer printed wiring board".

Company Profile
0.17.14
  • Toyoda; Yukihiko - Ibi-gun N/A JP
  • Toyoda; Yukihiko - Gifu JP
*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.
Patent Activity
PatentDate
Multilayer printed wiring board
Grant 9,040,843 - Toyoda , et al. May 26, 2
2015-05-26
Printed wiring board and method for producing the same
Grant 8,533,943 - En , et al. September 17, 2
2013-09-17
Multilayer Printed Wiring Board
App 20130008701 - TOYODA; Yukihiko ;   et al.
2013-01-10
Multilayer printed wiring board
Grant 8,324,512 - Toyoda , et al. December 4, 2
2012-12-04
Printed wiring board and method for producing the same
Grant 8,093,507 - En , et al. January 10, 2
2012-01-10
Multilayer printed wiring board
Grant 8,030,579 - Toyoda , et al. October 4, 2
2011-10-04
Printed wiring board and method for producing the same
Grant 8,030,577 - En , et al. October 4, 2
2011-10-04
Method of manufacturing a printed wiring board
Grant 8,020,291 - En , et al. September 20, 2
2011-09-20
Printed circuit board
Grant 8,018,045 - En , et al. September 13, 2
2011-09-13
Method for producing a printed wiring board
Grant 8,006,377 - En , et al. August 30, 2
2011-08-30
Printed wiring board and method for producing the same
Grant 7,994,433 - En , et al. August 9, 2
2011-08-09
Multilayer Printed Wiring Board
App 20110108311 - TOYODA; Yukihiko ;   et al.
2011-05-12
Multilayered printed circuit board
Grant 7,916,492 - Zhong , et al. March 29, 2
2011-03-29
Multilayered printed circuit board, solder resist composition, and semiconductor device
Grant 7,910,836 - Zhong , et al. March 22, 2
2011-03-22
Multilayered Printed Circuit Board
App 20100163288 - Zhong; Hui ;   et al.
2010-07-01
Printed Wiring Board And Method For Producing The Same
App 20090205857 - EN; Honchin ;   et al.
2009-08-20
Printed Wiring Board And Method For Producing The Same
App 20090188708 - EN; Honchin ;   et al.
2009-07-30
Printed Wiring Board And Method For Producing The Same
App 20090183904 - EN; Honchin ;   et al.
2009-07-23
Printed wiring board and method for producing the same
Grant 7,535,095 - En , et al. May 19, 2
2009-05-19
Printed Wiring Board And Method For Producing The Same
App 20090090003 - En; Honchin ;   et al.
2009-04-09
Printed wiring board having a roughened surface formed on a metal layer, and method for producing the same
Grant 7,504,719 - En , et al. March 17, 2
2009-03-17
Printed Wiring Board And Method For Producing The Same
App 20080289176 - EN; Honchin ;   et al.
2008-11-27
Printed Wiring Board And Method For Producing The Same
App 20080289864 - EN; Honchin ;   et al.
2008-11-27
Printed Wiring Board And Method For Producing The Same
App 20080292852 - EN; Honchin ;   et al.
2008-11-27
Multilayer Printed Wiring Board
App 20080190658 - TOYODA; Yukihiko ;   et al.
2008-08-14
Multilayer printed wiring board
Grant 7,371,974 - Toyoda , et al. May 13, 2
2008-05-13
Multilayered printed circuit board, solder resist composition, multilayered printed circuit board manufacturing method, and semiconductor device
App 20080041615 - ZHONG; Hui ;   et al.
2008-02-21
Printed wiring board and method for producing the same
App 20050258522 - En, Honchin ;   et al.
2005-11-24
Multilayered printed wiring board
App 20030178229 - Toyoda, Yukihiko ;   et al.
2003-09-25

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