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Patent applications and USPTO patent grants for Toyoda; Yukihiko.The latest application filed is for "multilayer printed wiring board".
Patent | Date |
---|---|
Multilayer printed wiring board Grant 9,040,843 - Toyoda , et al. May 26, 2 | 2015-05-26 |
Printed wiring board and method for producing the same Grant 8,533,943 - En , et al. September 17, 2 | 2013-09-17 |
Multilayer Printed Wiring Board App 20130008701 - TOYODA; Yukihiko ;   et al. | 2013-01-10 |
Multilayer printed wiring board Grant 8,324,512 - Toyoda , et al. December 4, 2 | 2012-12-04 |
Printed wiring board and method for producing the same Grant 8,093,507 - En , et al. January 10, 2 | 2012-01-10 |
Multilayer printed wiring board Grant 8,030,579 - Toyoda , et al. October 4, 2 | 2011-10-04 |
Printed wiring board and method for producing the same Grant 8,030,577 - En , et al. October 4, 2 | 2011-10-04 |
Method of manufacturing a printed wiring board Grant 8,020,291 - En , et al. September 20, 2 | 2011-09-20 |
Printed circuit board Grant 8,018,045 - En , et al. September 13, 2 | 2011-09-13 |
Method for producing a printed wiring board Grant 8,006,377 - En , et al. August 30, 2 | 2011-08-30 |
Printed wiring board and method for producing the same Grant 7,994,433 - En , et al. August 9, 2 | 2011-08-09 |
Multilayer Printed Wiring Board App 20110108311 - TOYODA; Yukihiko ;   et al. | 2011-05-12 |
Multilayered printed circuit board Grant 7,916,492 - Zhong , et al. March 29, 2 | 2011-03-29 |
Multilayered printed circuit board, solder resist composition, and semiconductor device Grant 7,910,836 - Zhong , et al. March 22, 2 | 2011-03-22 |
Multilayered Printed Circuit Board App 20100163288 - Zhong; Hui ;   et al. | 2010-07-01 |
Printed Wiring Board And Method For Producing The Same App 20090205857 - EN; Honchin ;   et al. | 2009-08-20 |
Printed Wiring Board And Method For Producing The Same App 20090188708 - EN; Honchin ;   et al. | 2009-07-30 |
Printed Wiring Board And Method For Producing The Same App 20090183904 - EN; Honchin ;   et al. | 2009-07-23 |
Printed wiring board and method for producing the same Grant 7,535,095 - En , et al. May 19, 2 | 2009-05-19 |
Printed Wiring Board And Method For Producing The Same App 20090090003 - En; Honchin ;   et al. | 2009-04-09 |
Printed wiring board having a roughened surface formed on a metal layer, and method for producing the same Grant 7,504,719 - En , et al. March 17, 2 | 2009-03-17 |
Printed Wiring Board And Method For Producing The Same App 20080289176 - EN; Honchin ;   et al. | 2008-11-27 |
Printed Wiring Board And Method For Producing The Same App 20080289864 - EN; Honchin ;   et al. | 2008-11-27 |
Printed Wiring Board And Method For Producing The Same App 20080292852 - EN; Honchin ;   et al. | 2008-11-27 |
Multilayer Printed Wiring Board App 20080190658 - TOYODA; Yukihiko ;   et al. | 2008-08-14 |
Multilayer printed wiring board Grant 7,371,974 - Toyoda , et al. May 13, 2 | 2008-05-13 |
Multilayered printed circuit board, solder resist composition, multilayered printed circuit board manufacturing method, and semiconductor device App 20080041615 - ZHONG; Hui ;   et al. | 2008-02-21 |
Printed wiring board and method for producing the same App 20050258522 - En, Honchin ;   et al. | 2005-11-24 |
Multilayered printed wiring board App 20030178229 - Toyoda, Yukihiko ;   et al. | 2003-09-25 |
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