ASAI; Motoo

Patent Applications and Registrations

Patent applications and USPTO patent grants for ASAI; Motoo.The latest application filed is for "printed circuit board".

Company Profile

1.116.73

ASAI; Motoo - Ibi-gun JP
Asai; Motoo - Gifu N/A JP
Asai; Motoo - Ibu-gun JP
Asai; Motoo - Ogaki JP
Asai; Motoo - Ini-gun JP

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Printed Circuit Board App 20150250056 - INAGAKI; Yasushi ; et al.	2015-09-03
Printed circuit board Grant 9,060,446 - Inagaki , et al. June 16, 2	2015-06-16
Multilayer printed wiring board with filled viahole structure Grant 8,987,603 - Shirai , et al. March 24, 2	2015-03-24
Printed circuit board and method of manufacturing printed circuit board Grant 8,842,440 - Inagaki , et al. September 23, 2	2014-09-23
Printed circuit board and method of manufacturing printed circuit board Grant 8,830,691 - Inagaki , et al. September 9, 2	2014-09-09
Printed Circuit Board App 20140247572 - INAGAKI; Yasushi ; et al.	2014-09-04
Multi-layer printed circuit board and method of manufacturing multi-layer printed circuit board Grant 8,822,828 - Asai , et al. September 2, 2	2014-09-02
Multi-layer printed circuit board and method of manufacturing multi-layer printed circuit board Grant 8,822,830 - Asai , et al. September 2, 2	2014-09-02
Method of manufacturing multi-layer printed circuit board Grant 8,782,882 - Asai , et al. July 22, 2	2014-07-22
Printed circuit board Grant 8,780,573 - Inagaki , et al. July 15, 2	2014-07-15
Method of manufacturing printed wiring board Grant 8,763,241 - Inagaki , et al. July 1, 2	2014-07-01
Method of manufacturing multi-layer printed circuit board Grant 8,745,863 - Asai , et al. June 10, 2	2014-06-10
Printed circuit board Grant 8,717,772 - Inagaki , et al. May 6, 2	2014-05-06
Printed Circuit Board And Method Of Manufacturing Printed Circuit Board App 20130286615 - Inagaki; Yasushi ; et al.	2013-10-31
Printed wiring board and method for producing the same Grant 8,533,943 - En , et al. September 17, 2	2013-09-17
Circuit board for mounting electronic parts Grant RE44,251 - Asai , et al. June 4, 2	2013-06-04
Printed Circuit Board App 20130107482 - INAGAKI; Yasushi ; et al.	2013-05-02
Printed circuit board Grant 8,331,102 - Inagaki , et al. December 11, 2	2012-12-11
Multi-layer printed circuit board and method of manufacturing multi-layer printed circuit board Grant 8,288,665 - Asai , et al. October 16, 2	2012-10-16
Multi-layer printed circuit board and method of manufacturing multilayer printed circuit board Grant 8,288,664 - Asai , et al. October 16, 2	2012-10-16
Multi-layer printed circuit board and method of manufacturing multilayer printed circuit board Grant 8,283,573 - Asai , et al. October 9, 2	2012-10-09
Multilayer printed circuit board Grant 8,249,402 - Asai , et al. August 21, 2	2012-08-21
Multilayer printed circuit board Grant 8,238,700 - Asai , et al. August 7, 2	2012-08-07
Multi-layer Printed Circuit Board And Method Of Manufacturing Multi-layer Printed Circuit Board App 20120186867 - ASAI; Motoo ; et al.	2012-07-26
Printed wiring board and method for manufacturing the same Grant RE43,509 - Asai , et al. July 17, 2	2012-07-17
Multilayer Printed Wiring Board With Filled Viahole Structure App 20120103680 - SHIRAI; Seiji ; et al.	2012-05-03
Substrate for mounting IC chip, manufacturing method of substrate for mounting IC chip, device for optical communication, and manufacturing method of device for optical communication Grant 8,120,040 - Asai , et al. February 21, 2	2012-02-21
Printed circuit board Grant 8,116,091 - Inagaki , et al. February 14, 2	2012-02-14
Multilayer printed wiring board with filled viahole structure Grant 8,115,111 - Shirai , et al. February 14, 2	2012-02-14
Printed circuit board Grant 8,107,253 - Inagaki , et al. January 31, 2	2012-01-31
Printed Circuit Board And Method Of Manufacturing Printed Circuit Board App 20120006469 - INAGAKI; YASUSHI ; et al.	2012-01-12
Printed wiring board and method for producing the same Grant 8,093,507 - En , et al. January 10, 2	2012-01-10
Substrate for mounting IC chip Grant 8,076,782 - Asai , et al. December 13, 2	2011-12-13
Multi-layer Printed Circuit Board And Method Of Manufacturing Multi-layer Printed Circuit Board App 20110252641 - ASAI; Motoo ; et al.	2011-10-20
Multi-layer Printed Circuit Board And Method Of Manufacturing Multi-layer Printed Circuit Board App 20110253306 - Asai; Motoo ; et al.	2011-10-20
Printed wiring board and method for producing the same Grant 8,030,577 - En , et al. October 4, 2	2011-10-04
Interlayer insulating layer for printed wiring board, printed wiring board and method for manufacturing same Grant 8,021,748 - Asai , et al. September 20, 2	2011-09-20
Method of manufacturing a printed wiring board Grant 8,020,291 - En , et al. September 20, 2	2011-09-20
Printed circuit board Grant 8,018,045 - En , et al. September 13, 2	2011-09-13
Method for producing a printed wiring board Grant 8,006,377 - En , et al. August 30, 2	2011-08-30
Multi-layer Printed Circuit Board And Method Of Manufacturing Multi-layer Printed Circuit Board App 20110192637 - ASAI; Motoo ; et al.	2011-08-11
Printed wiring board and method for producing the same Grant 7,994,433 - En , et al. August 9, 2	2011-08-09
Printed circuit board Grant 7,995,352 - Inagaki , et al. August 9, 2	2011-08-09
Optical path converting member, multilayer print circuit board, and device for optical communication Grant 7,995,880 - Kodama , et al. August 9, 2	2011-08-09
Multi-layer printed circuit board and method of manufacturing multi-layer printed circuit board Grant 7,985,930 - Asai , et al. July 26, 2	2011-07-26
Printed circuit board Grant 7,978,478 - Inagaki , et al. July 12, 2	2011-07-12
Multilayered printed circuit board Grant 7,916,492 - Zhong , et al. March 29, 2	2011-03-29
Multilayered printed circuit board, solder resist composition, and semiconductor device Grant 7,910,836 - Zhong , et al. March 22, 2	2011-03-22
Optical element, package substrate and device for optical communication Grant 7,907,801 - Kodama , et al. March 15, 2	2011-03-15
Multi-layer Printed Circuit Board And Method Of Manufacturing Multi-layer Printed Circuit Board App 20110036626 - ASAI; Motoo ; et al.	2011-02-17
Multi-layer Printed Circuit Board And Method Of Manufacturing Multi-layer Printed Circuit Board App 20110024164 - ASAI; Motoo ; et al.	2011-02-03
Printed circuit board Grant 7,881,069 - Inagaki , et al. February 1, 2	2011-02-01
Printed circuit board Grant 7,864,543 - Inagaki , et al. January 4, 2	2011-01-04
Printed circuit board Grant 7,864,542 - Inagaki , et al. January 4, 2	2011-01-04
Printed Circuit Board And Method Of Manufacturing Printed Circuit Board App 20100328915 - INAGAKI; Yasushi ; et al.	2010-12-30
Printed circuit board Grant 7,855,894 - Inagaki , et al. December 21, 2	2010-12-21
Optical Path Converting Member, Multilayer Print Circuit Board, And Device For Optical Communication App 20100303406 - KODAMA; Hiroaki ; et al.	2010-12-02
Optical path converting member, multilayer print circuit board, and device for optical communication Grant 7,801,398 - Kodama , et al. September 21, 2	2010-09-21
Substrate For Mounting Ic Chip, Manufacturing Method Of Substrate For Mounting Ic Chip, Device For Optical Communication, And Manufacturing Method Of Device For Optical Communication App 20100232744 - ASAI; Motoo ; et al.	2010-09-16
Printed Circuit Board And Method Of Manufacturing Printed Circuit Board App 20100226108 - INAGAKI; Yasushi ; et al.	2010-09-09
Multilayer Printed Circuit Board App 20100195954 - ASAI; Motoo ; et al.	2010-08-05
Process for producing multi-layer printed wiring board Grant 7,761,984 - Hiramatsu , et al. July 27, 2	2010-07-27
Optical path converting member, multilayer print circuit board, and device for optical communication Grant 7,764,860 - Kodama , et al. July 27, 2	2010-07-27
Multilayered Printed Circuit Board App 20100163288 - Zhong; Hui ; et al.	2010-07-01
Multilayer printed wiring board with filled viahole structure Grant 7,737,366 - Shirai , et al. June 15, 2	2010-06-15
Multilayer Printed Circuit Board App 20100135611 - ASAI; MOTOO ; et al.	2010-06-03
Photoelectric circuit board and device for optical communication Grant 7,729,570 - Yamada , et al. June 1, 2	2010-06-01
Multi-layer Printed Circuit Board And Method Of Manufacturing Multilayer Printed Circuit Board App 20100122840 - ASAI; Motoo ; et al.	2010-05-20
Printed Circuit Board App 20100118502 - INAGAKI; Yasushi ; et al.	2010-05-13
Method for manufacturing printed wiring board Grant 7,712,212 - Asai , et al. May 11, 2	2010-05-11
Optical path converting member, multilayer print circuit board, and device for optical communication Grant 7,715,666 - Kodama , et al. May 11, 2	2010-05-11
Multilayer Printed Wiring Board With Filled Viahole Structure App 20100101852 - Shirai; Seiji ; et al.	2010-04-29
Package substrate Grant RE41,242 - Asai , et al. April 20, 2	2010-04-20
Substrate for mounting IC chip, multilayered printed circuit board, and device for optical communication Grant 7,693,382 - Asai April 6, 2	2010-04-06
Printed Circuit Board And Method Of Manufacturing Printed Circuit Board App 20100014261 - INAGAKI; Yasushi ; et al.	2010-01-21
Package substrate Grant RE41,051 - Asai , et al. December 22, 2	2009-12-22
Multilayer printed wiring board with filled viahole structure Grant 7,622,183 - Shirai , et al. November 24, 2	2009-11-24
Printed wiring board and method for manufacturing the same Grant 7,615,162 - Asai , et al. November 10, 2	2009-11-10
Multilayer printed wiring board and its manufacturing method, and resin composition for filling through-hole Grant RE40,947 - Asai , et al. October 27, 2	2009-10-27
Printed Wiring Board And Method For Producing The Same App 20090205857 - EN; Honchin ; et al.	2009-08-20
Printed Wiring Board And Method For Producing The Same App 20090188708 - EN; Honchin ; et al.	2009-07-30
Printed Wiring Board And Method For Producing The Same App 20090183904 - EN; Honchin ; et al.	2009-07-23
Printed wiring board and method for producing the same Grant 7,535,095 - En , et al. May 19, 2	2009-05-19
Substrate for mounting IC chip, substrate for motherboard, device for optical communication, manufacturing method of substrate for mounting IC chip, and manufacturing method of substrate for motherboard Grant 7,526,152 - Asai , et al. April 28, 2	2009-04-28
Printed Wiring Board And Method For Producing The Same App 20090090003 - En; Honchin ; et al.	2009-04-09
Printed wiring board having a roughened surface formed on a metal layer, and method for producing the same Grant 7,504,719 - En , et al. March 17, 2	2009-03-17
Multi-layer Printed Wiring Board Including An Alighment Mark As An Index For A Position Of Via Holes App 20090025216 - HIRAMATSU; Yasuji ; et al.	2009-01-29
Multilayer Printed Circuit Board App 20090016671 - Asai; Motoo ; et al.	2009-01-15
Optical Path Converting Member, Multilayer Print Circuit Board, And Device For Optical Communication App 20080310793 - KODAMA; Hiroaki ; et al.	2008-12-18
Optical Path Converting Member, Multilayer Print Circuit Board, And Device For Optical Communication App 20080308311 - KODAMA; Hiroaki ; et al.	2008-12-18
Printed Wiring Board And Method For Producing The Same App 20080289176 - EN; Honchin ; et al.	2008-11-27
Printed Wiring Board And Method For Producing The Same App 20080292852 - EN; Honchin ; et al.	2008-11-27
Printed Wiring Board And Method For Producing The Same App 20080289864 - EN; Honchin ; et al.	2008-11-27
Photoelectric Circuit Board And Device For Optical Communication App 20080285910 - YAMADA; Kazuhito ; et al.	2008-11-20
Multi-layer Printed Circuit Board And Method Of Manufacturing Multilayer Printed Circuit Board App 20080277148 - Asai; Motoo ; et al.	2008-11-13
Multilayer Printed Wiring Board With Filled Viahole Structure App 20080264686 - SHIRAI; Seiji ; et al.	2008-10-30
Substrate for mounting IC chip, substrate for motherboard, device for optical communication, manufacturing method of substrate for mounting IC chip, and manufacturing method of substrate for motherboard Grant 7,437,030 - Asai , et al. October 14, 2	2008-10-14
Optical Element, Package Substrate And Device For Optical Communication App 20080170819 - Kodama; Hiroaki ; et al.	2008-07-17
Printed Circuit Board And Method Of Manufacturing Printed Ciruit Board App 20080169120 - Inagaki; Yasushi ; et al.	2008-07-17
Printed Circuit Board And Method For Manufacturing Printed Circuit Board App 20080158841 - INAGAKI; Yasushi ; et al.	2008-07-03
Printed Circuit Board And Method For Manufacturing Printed Circuit Board App 20080158838 - INAGAKI; Yasushi ; et al.	2008-07-03
Multilayer printed wiring board with filled viahole structure Grant 7,390,974 - Shirai , et al. June 24, 2	2008-06-24
Printed Circuit Board And Method Of Manufacturing Printed Circuit Board App 20080144298 - Inagaki; Yasushi ; et al.	2008-06-19
Printed Circuit Board And Method Of Manufacturing Printed Circuit Board App 20080142255 - Inagaki; Yasushi ; et al.	2008-06-19
Printed wiring board and method for manufacturing the same Grant 7,388,159 - Asai June 17, 2	2008-06-17
Printed wiring board and method for manufacturing the same Grant 7,385,146 - Asai , et al. June 10, 2	2008-06-10
Substrate For Mounting Ic Chip, Substrate For Motherboard, Device For Optical Communication , Manufacturing Method Of Substrate For Mounting Ic Chip, And Manufacturing Method Of Substrate For Motherboard App 20080118199 - Asai; Motoo ; et al.	2008-05-22
Multi-layer printed wiring board including an alignment mark as an index for a position of via holes Grant 7,375,289 - Hiramatsu , et al. May 20, 2	2008-05-20
Printed wiring board and method for manufacturing the same Grant 7,361,849 - Asai , et al. April 22, 2	2008-04-22
Printed circuit board and method of manufacturing printed circuit board Grant 7,342,803 - Inagaki , et al. March 11, 2	2008-03-11
Printed Circuit Board And Method For Manufacturing Printed Circuit Board App 20080055872 - INAGAKI; Yasushi ; et al.	2008-03-06
Multilayered printed circuit board, solder resist composition, multilayered printed circuit board manufacturing method, and semiconductor device App 20080041615 - ZHONG; Hui ; et al.	2008-02-21
Interlayer Dielectric Layer For Printed Wiring Board, Printed Wiring Board, And Method Of Producing The Same App 20080023815 - ASAI; Motoo ; et al.	2008-01-31
Interlayer Dielectric Layer For Printed Wiring Board, Printed Wiring Board, And Method Of Producing The Same App 20080014336 - ASAI; Motoo ; et al.	2008-01-17
Optical Path Converting Member, Multilayer Print Circuit Board, And Device For Optical Communication App 20070297729 - KODAMA; Hiroaki ; et al.	2007-12-27
Printed circuit board and method for manufacturing printed circuit board Grant 7,307,852 - Inagaki , et al. December 11, 2	2007-12-11
Printed Circuit Board And Method Of Manufacturing Printed Ciruit Board App 20070258225 - Inagaki; Yasushi ; et al.	2007-11-08
Multilayer Printed Circuit Board App 20070223935 - ASAI; Motoo ; et al.	2007-09-27
Printed wiring board and method for manufacturing the same App 20070062729 - Asai; Motoo ; et al.	2007-03-22
Printed wiring board and method for manufacturing the same App 20070062724 - Asai; Motoo ; et al.	2007-03-22
Printed wiring board and method for manufacturing the same App 20070056767 - Asai; Motoo	2007-03-15
Printed wiring board and method for manufacturing the same App 20070051694 - Asai; Motoo ; et al.	2007-03-08
Printed wiring board and method for manufacturing the same App 20070051695 - Asai; Motoo ; et al.	2007-03-08
Interlayer insulating layer for printed wiring board, printed wiring board and method for manufacturing same App 20070013049 - Asai; Motoo ; et al.	2007-01-18
Substrate for mounting IC chip, substrate for motherboard, device for optical communication, manufacturing method of substrate for mounting IC chip, and manufacturing method of substrate for motherboard App 20060263003 - Asai; Motoo ; et al.	2006-11-23
Process for producing a multi-layer printed wiring board Grant 7,127,812 - Hiramatsu , et al. October 31, 2	2006-10-31
Multilayer printed wiring board with filled viahole structure App 20060159885 - Shirai; Seiji ; et al.	2006-07-20
Multilayer printed wiring board having filled-via structure Grant 7,071,424 - Shirai , et al. July 4, 2	2006-07-04
Substrate for mounting IC chip, multilayerd printed circuit board, and device for optical communication Grant 7,070,207 - Asai July 4, 2	2006-07-04
Ic chip mounting substrate, ic chip mounting substrate manufacturing method, optical communication device, and optical communication device manufacturing method App 20060012967 - Asai; Motoo ; et al.	2006-01-19
Printed wiring board and method for producing the same App 20050258522 - En, Honchin ; et al.	2005-11-24
Substrate for mounting IC chip, multilayered printed circuit board, and device for optical communication App 20050185880 - Asai, Motoo	2005-08-25
Printed circuit board and method for manufacturing printed circuit board App 20050157478 - Inagaki, Yasushi ; et al.	2005-07-21
Multilayer printed wiring board with filled viahole structure App 20050100720 - Shirai, Seiji ; et al.	2005-05-12
Printing wiring board and method of producing the same and capacitor to be contained in printed wiring board Grant 6,876,554 - Inagaki , et al. April 5, 2	2005-04-05
Multi-layer printed circuit board and method of manufacturing multi-layer printed circuit board App 20050039948 - Asai, Motoo ; et al.	2005-02-24
Printed wiring board and method for manufacturing the same Grant 6,835,895 - Asai , et al. December 28, 2	2004-12-28
Multilayer printed circuit board Grant 6,831,234 - Asai , et al. December 14, 2	2004-12-14
Multilayer printed wiring board and method of manufacturing multilayer printed wiring board Grant 6,828,510 - Asai , et al. December 7, 2	2004-12-07
Substrate for mounting IC chip, multilayered printed circuit board, and device for optical communication App 20040212030 - Asai, Motoo	2004-10-28
Printed circuit board and method of manufacturing printed circuit board App 20040160751 - Inagaki, Yasushi ; et al.	2004-08-19
Multilayer printed-circuit board and method of manufacture Grant 6,762,921 - Asai , et al. July 13, 2	2004-07-13
Printed wiring board and method of producing the same Grant 6,724,638 - Inagaki , et al. April 20, 2	2004-04-20
Process for producing a multi-layer printed wiring board App 20030192182 - Hiramatsu, Yasuji ; et al.	2003-10-16
Method of manufacturing multilayer printed wiring board Grant 6,609,297 - Hiramatsu , et al. August 26, 2	2003-08-26
Metal film bonded body, bonding agent layer and bonding agent Grant 6,607,825 - Wang , et al. August 19, 2	2003-08-19
Multilayer printed-circuit board and semiconductor device Grant 6,534,723 - Asai , et al. March 18, 2	2003-03-18
Multilayer printed circuit boards Grant 6,525,275 - Asai February 25, 2	2003-02-25
Package substrate Grant 6,490,170 - Asai , et al. December 3, 2	2002-12-03
Package substrate Grant 6,487,088 - Asai , et al. November 26, 2	2002-11-26
Package substrate Grant 6,411,519 - Asai , et al. June 25, 2	2002-06-25
Package substrate Grant 6,392,898 - Asai , et al. May 21, 2	2002-05-21
Circuit board for mounting electronic parts Grant 6,384,344 - Asai , et al. May 7, 2	2002-05-07
Multilayer printed wiring board and its production process, resin composition for filling through-hole Grant 6,376,052 - Asai , et al. April 23, 2	2002-04-23
Multilayer printed wiring board and its manufacturing method, and resin composition for filling through-hole Grant 6,376,049 - Asai , et al. April 23, 2	2002-04-23
Multilayer printed wiring board Grant 6,365,843 - Shirai , et al. April 2, 2	2002-04-02
Package substrate App 20010054513 - Asai, Motoo ; et al.	2001-12-27
Package substrate App 20010055203 - Asai, Motoo ; et al.	2001-12-27
Package substrate App 20010037896 - Asai, Motoo ; et al.	2001-11-08
Package substrate App 20010038531 - Asai, Motoo ; et al.	2001-11-08
Printed circuit boards Grant 6,303,880 - Asai , et al. October 16, 2	2001-10-16
Printed circuit boards Grant 6,291,778 - Asai , et al. September 18, 2	2001-09-18
Adhesive for electroless plating, feedstock composition for preparing adhesive for electroless plating, and printed wiring board Grant 6,261,671 - Asai , et al. July 17, 2	2001-07-17
Adhesive for electroless plating, raw material composition for preparing adhesive for electroless plating and printed wiring board Grant 6,248,428 - Asai , et al. June 19, 2	2001-06-19
Solder resist composition and printed circuit boards Grant 6,217,987 - Ono , et al. April 17, 2	2001-04-17
Multilayer printed circuit board, method of producing multilayer printed circuit board and resin filler Grant 6,217,988 - Yasue , et al. April 17, 2	2001-04-17
Pretreating solution for electroless plating, electroless plating bath and electroless plating process Grant 6,174,353 - Yuan , et al. January 16, 2	2001-01-16
Resin composites and method for producing the same Grant 6,124,408 - Wang , et al. September 26, 2	2000-09-26
Multilayer printed circuit board, method of producing multilayer printed circuit board and resin filler Grant 6,010,768 - Yasue , et al. January 4, 2	2000-01-04
Adhesive for printed circuit board Grant 5,741,575 - Asai , et al. April 21, 1	1998-04-21
Adhesive for printed circuit board Grant 5,688,583 - Asai , et al. November 18, 1	1997-11-18
Resin compositions and printed circuit boards using the same Grant 5,589,250 - Asai , et al. December 31, 1	1996-12-31
Adhesives, adhesive layers for electroless plating and printed circuit boards Grant 5,519,177 - Wang , et al. May 21, 1	1996-05-21
Adhesive comprising cured amino resin powder for printed circuit board Grant 5,447,996 - Asai , et al. September 5, 1	1995-09-05
Epoxy/amino powder resin adhesive for printed circuit board Grant 5,344,893 - Asai , et al. September 6, 1	1994-09-06
Leadframe semiconductor-mounting substrate having a roughened adhesive conductor circuit substrate and method of producing the same Grant 5,175,060 - Enomoto , et al. December 29, 1	1992-12-29
Adhesive for electroless plating, printed circuit boards and method of producing the same Grant 5,055,321 - Enomoto , et al. October 8, 1	1991-10-08