U.S. patent application number 12/697508 was filed with the patent office on 2010-06-03 for integrated circuit probing apparatus having a temperature-adjusting mechanism.
This patent application is currently assigned to STAR TECHNOLOGIES INC.. Invention is credited to CHOON LEONG LOU, LI MIN WANG.
Application Number | 20100134130 12/697508 |
Document ID | / |
Family ID | 39112778 |
Filed Date | 2010-06-03 |
United States Patent
Application |
20100134130 |
Kind Code |
A1 |
LOU; CHOON LEONG ; et
al. |
June 3, 2010 |
INTEGRATED CIRCUIT PROBING APPARATUS HAVING A TEMPERATURE-ADJUSTING
MECHANISM
Abstract
A probing apparatus for integrated circuit devices comprises a
probe card, a probe holder for holding the probe card, a test head
and a temperature-adjusting mechanism. The probe card comprises at
least one probe capable of forming an electrical connection with
the integrated circuit device facing a first surface of the probe
card, and the temperature-adjusting mechanism can be positioned
on/above a second surface of the probe card. The
temperature-adjusting mechanism can be positioned inside the probe
card, inside the probe holder or on the probe holder. The test head
comprises a plurality of pins configured to form electrical
connections with connecting sites of the probe card and test and
measurement units and apparatus. The temperature-adjusting
mechanism can be positioned on or inside the test head. The
temperature-adjusting mechanism comprises a flow line having at
least one inlet and a plurality of outlets, and the outlets can be
positioned on the second surface of the probe card.
Inventors: |
LOU; CHOON LEONG; (HSINCHU
CITY, TW) ; WANG; LI MIN; (HSINCHU CITY, TW) |
Correspondence
Address: |
WPAT, PC;INTELLECTUAL PROPERTY ATTORNEYS
2030 MAIN STREET, SUITE 1300
IRVINE
CA
92614
US
|
Assignee: |
STAR TECHNOLOGIES INC.
HSINCHU CITY
TW
|
Family ID: |
39112778 |
Appl. No.: |
12/697508 |
Filed: |
February 1, 2010 |
Related U.S. Patent Documents
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Application
Number |
Filing Date |
Patent Number |
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|
12239060 |
Sep 26, 2008 |
|
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12697508 |
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|
12046818 |
Mar 12, 2008 |
7616018 |
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12239060 |
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|
11609558 |
Dec 12, 2006 |
7576553 |
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12046818 |
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Current U.S.
Class: |
324/756.03 ;
324/750.28 |
Current CPC
Class: |
G01R 31/2891 20130101;
G01R 1/07342 20130101; G01R 1/44 20130101; G01R 31/2874
20130101 |
Class at
Publication: |
324/760 |
International
Class: |
G01R 31/02 20060101
G01R031/02 |
Claims
1. An integrated circuit probing apparatus, comprising: a circuit
board having a first surface and a second surface; at least one
probe positioned on the circuit board, the probe being configured
to electrically contact an integrated circuit device facing the
first surface; a holder configured to receive the circuit board
therein, wherein the holder is substantially L-shaped in
cross-section to hold the first surface of the circuit board and
does not cover the second surface of the circuit board; and a
temperature-adjusting mechanism positioned in the holder or on the
holder.
2. The integrated circuit probing apparatus of claim 1, wherein the
temperature-adjusting mechanism is a flow line positioned in the
holder.
3. The integrated circuit probing apparatus of claim 2, wherein the
flow line permits a fluid to flow therein, and the fluid is gas,
liquid or the combination thereof.
4. The integrated circuit probing apparatus of claim 2, wherein the
flow line includes at least one fluid inlet and a plurality of
fluid outlets.
5. The integrated circuit probing apparatus of claim 2, wherein the
temperature-adjusting mechanism is a guiding tube positioned on the
holder, and the guiding tube includes at least one fluid inlet and
a plurality of fluid outlets.
6. The integrated circuit probing apparatus of claim 1, further
comprising a test head including a plurality of test measurement
units configured to form electrical connections with a plurality of
connecting sites on the second surface of the circuit board.
7. The integrated circuit probing apparatus of claim 1, wherein the
temperature-adjusting mechanism includes fluid outlets facing the
test measurement units of the test head and configured to ensure
that the test head and the test measurement units are performing
the electrical measurements of the integrated circuit device under
a specified operation temperature.
Description
[0001] This present application is a continuation application of
U.S. patent application Ser. No. 12/239,060, filed on Sep. 26,
2008, which is a divisional application of U.S. patent application
Ser. No. 12/046,818, filed on Mar. 12, 2008, which is a
continuation application of U.S. patent application Ser. No.
11/609,558, filed on Dec. 12, 2006. The contents of those
applications are incorporated herein by reference in their
entirety.
BACKGROUND OF THE INVENTION
[0002] (A) Field of the Invention
[0003] The present invention relates to an integrated circuit
probing apparatus having a temperature-adjusting mechanism, and
more particularly, to an integrated circuit probing apparatus
having a temperature-adjusting mechanism to transfer heat into or
out of the testing environment by pressurized fluid.
[0004] (B) Description of the Related Art
[0005] FIG. 1 and FIG. 2 illustrate a probe card 10 used for
testing electrical properties of an integrated circuit device 36
according to the prior art. The probe card 10 comprises a circuit
board 12, a circular supporter 14 positioned on the circuit board
12, and a plurality of probes 16 positioned on the circular
supporter 14 by epoxy resin 24. The probes 16 are electrically
connected to conductive wires 18 on the back surface of the circuit
board 12 via channels 20 inside the circuit board 12.
[0006] Referring to FIG. 2, a semiconductor wafer 30 is positioned
on a wafer chuck 32 with a heater 34. The wafer chuck 32 will rise
during testing so that the tip of the probe 16 can contact a pad 38
of integrated circuit devices 36 of the semiconductor wafer 30.
During the testing processes, such as the reliability test of the
integrated circuit device 36, the heater 34 heats the semiconductor
wafer 30, and heat is transmitted to the test environment where the
probe card 10 is positioned by thermal radiation or by thermal
conduction through the tip of the probe 16, i.e., the temperature
of the test environment increases. The increasing temperature
causes the physical or material properties of parts or mechanisms
in the test environment to change, for example the thermal
expansion property causes the material to strain. As a result, the
increasing temperature may interrupt the testing or influence the
accuracy of the test. In addition, the heat transfer into or out of
a test head above the circuit board 12 may also influence the
temperature range at which the test instruments or parts within the
test head to give results of lower accuracy due to test being
carried out in a temperature outside the specification of the test
units.
SUMMARY OF THE INVENTION
[0007] One aspect of the present invention provides an integrated
circuit probing apparatus having a temperature-adjusting mechanism
to transfer heat into or out of the testing environment by
pressurized fluid.
[0008] An integrated circuit probing apparatus according to this
aspect of the present invention comprises a probe card having a
circuit board, a holder configured to support the probe card, a
test head and a temperature-adjusting mechanism. The probe card
includes at least one probe positioned on the circuit board, the
probe can form an electrical connection with an integrated circuit
device facing a first surface of the circuit board, and the
temperature-adjusting mechanism can be optionally positioned on a
second surface of the circuit board. In addition, the
temperature-adjusting mechanism can also be optionally positioned
inside the circuit board, inside the holder or on the holder. The
test head includes a plurality of pins capable of forming
electrical connections with a plurality of connecting sites on the
second surface of the circuit board and test instruments or
circuitry within the test head for performing the measurements of
electrical properties of the device under tests. The
temperature-adjusting mechanism can be optionally positioned inside
the test head or on the test head. The temperature-adjusting
mechanism includes at least one flow line having at least one fluid
inlet and a plurality of fluid outlets, the fluid inlet can be
positioned on the second surface of the circuit board, and the
fluid is gas, liquid or the combination thereof.
[0009] Compared to the prior art, the present invention allows the
flow of the pressurized fluid in the flow line to adjust the
temperature of the test environment. Consequently, the temperature
of the test environment where the integrated circuit probing
apparatus is positioned can be kept within the range in which the
material of the integrated circuit probing apparatus can optimally
perform. In addition, variations in the physical or material
properties of the test and measurement units, parts and mechanisms
of the integrated circuit probing apparatus can be reduced to a
minimum by controlling the temperature of the pressurized fluid and
the flow rate of the pressurized fluid to decrease the temperature
variation of the test environment.
BRIEF DESCRIPTION OF THE DRAWINGS
[0010] The objectives and advantages of the present invention will
become apparent upon reading the following description and upon
reference to the accompanying drawings in which:
[0011] FIG. 1 and FIG. 2 illustrate a probe card used for testing
electrical properties of an integrated circuit device according to
the prior art;
[0012] FIG. 3 and FIG. 4 illustrate an integrated circuit probing
apparatus according to the first embodiment of the present
invention;
[0013] FIG. 5 illustrates an integrated circuit probing apparatus
according to the second embodiment of the present invention;
[0014] FIG. 6 and FIG. 7 illustrate an integrated circuit probing
apparatus according the third embodiment of the present
invention
[0015] FIG. 8 illustrates an integrated circuit probing apparatus
according to the fourth embodiment of the present invention;
[0016] FIG. 9 illustrates an integrated circuit probing apparatus
according to the fifth embodiment of the present invention; and
[0017] FIG. 10 illustrates an integrated circuit probing apparatus
according to the sixth embodiment of the present invention.
DETAILED DESCRIPTION OF THE INVENTION
[0018] FIG. 3 and FIG. 4 illustrate an integrated circuit probing
apparatus 50 according to the first embodiment of the present
invention. The integrated circuit probing apparatus 50 comprises a
probe card 10, a temperature-adjusting mechanism 66 configured to
adjust the temperature of the test environment, a holder 64
configured to receive the probe card 10 therein, and a test head
60. The probe card 10 includes a circuit board 12 and a plurality
of probes 16 positioned on the circuit board 12. The circuit board
has a first surface 12A and a second surface 12B, and the probe 16
can form an electrical connection with an integrated circuit device
30 facing a first surface 12A of the circuit board 12. The test
head 60 includes a plurality of pogo pins, connection pins, test
interfaces and test measurement units 62 capable of forming
electrical connections and measurements with a plurality of
connecting sites 28 on the second surface 12B of the circuit board
12.
[0019] The temperature-adjusting mechanism 66 comprises a support
52 such as a cover positioned on the second surface 12B of the
circuit board 12 and a flow line 54 positioned on the supporter 52.
Preferably, the flow line can be a guiding tube having at least one
fluid inlet and a plurality of fluid outlets facing the outer edge
of the circuit board 12. The flow line permits a fluid to flow
therein, and the fluid can be gas, liquid or the combination
thereof. For example, the fluid can be cooled dry air, nitrogen or
the combination of cooled dry air and nitrogen for cooling the test
environment. In addition, the fluid can be heated air for
increasing the temperature of cold temperature environment to
prevent condensation on the test head 60 and pogo pins 62.
[0020] The temperature-adjusting mechanism 66 permits a pressurized
fluid to flow therein via the fluid inlet 58 in a controlled manner
such that the temperature of the test environment can be kept
within a predetermined range in which the material of the
integrated circuit probing apparatus 50 can optimally perform.
Variations in the physical or material properties of the integrated
circuit probing apparatus 50 can be reduced to a minimum by
controlling the temperature of the pressurized fluid and the flow
rate of the pressurized fluid in order to decrease the temperature
variation of the test environment.
[0021] The accuracy of the test data of the integrated circuit are
determined by the test equipment operating under pre-specified
range of working temperature. The temperature-adjusting mechanism
66 is also used to ensure that the test head 60 and pogo pins 62
are performing the electrical measurements of integrated circuit
under the specified operation temperature.
[0022] FIG. 5 illustrates an integrated circuit probing apparatus
50' according to the second embodiment of the present invention.
Compared to the integrated circuit probing apparatus 50 in FIG. 4
having the flow line 54 on the supporter 52 on the second surface
12B, the integrated circuit probing apparatus 50' in FIG. 5
positions its flow line 54', serving as the temperature-adjusting
mechanism, on the second surface 12B. The flow line 54' has a
plurality of fluid outlets 56 facing the outer edge of the circuit
board 12, and the fluid outlets 56 are preferably facing the pins
62 of the test head.
[0023] FIG. 6 and FIG. 7 illustrate an integrated circuit probing
apparatus 70 according to the third embodiment of the present
invention. Compared to the integrated circuit probing apparatus 50
and 50' in FIG. 4 and FIG. 5 having the flow line 54 and 54'
substantially on the second surface 12B, the integrated circuit
probing apparatus 70 in FIG. 7 positions its flow line 80, serving
as the temperature-adjusting mechanism, inside the circuit board
12. The circuit board 12 includes a plurality of laminates 72, 74
and 76, and the flow line 80 is positioned in one of the laminates
72, 74 and 76, for example the laminate 74. The flow line 80
includes a plurality of openings 82 facing the second surface 12B
of the circuit board 12, and the openings 82 can serve as fluid
inlets or fluid outlets.
[0024] FIG. 8 illustrates an integrated circuit probing apparatus
90 according to the fourth embodiment of the present invention.
Compared to the integrated circuit probing apparatus 50, 50' and 70
in FIG. 4, FIG. 5 and FIG. 7 having the flow line 54, 54' and 80 on
the second surface 12B or inside the circuit board 12, the
integrated circuit probing apparatus 90 in FIG. 8 positions its
flow line 92, serving as the temperature-adjusting mechanism,
inside the holder 64. The flow line 92 has a fluid inlet 96 and a
plurality of fluid outlets 94, and the fluid outlets 94 may face
the pins 62 of the test head 60 or the first surface 12A of the
circuit board 12.
[0025] FIG. 9 illustrates an integrated circuit probing apparatus
100 according to the fifth embodiment of the present invention.
Compared to the integrated circuit probing apparatus 90 in FIG. 8
having the flow line 92 in the holder 64, the integrated circuit
probing apparatus 100 in FIG. 9 positions its flow line 102,
serving as the temperature-adjusting mechanism, on the holder 64.
The flow line 102 has a plurality of openings 104, which can be
used as fluid inlets or fluid outlets. In one embodiment of the
present invention, the holder 64 is substantially L-shaped in
cross-section to hold the first surface 12A of the circuit board 12
and does not cover the second surface 12B of the circuit board 12
such that the test head 60 including the test measurement units 62
can form electrical connections with the connecting sites 28 on the
second surface 12B of the circuit board 12.
[0026] FIG. 10 illustrates an integrated circuit probing apparatus
110 according to the sixth embodiment of the present invention.
Compared to the aforementioned integrated circuit probing apparatus
having the flow line on the circuit board 12 or the holder 64, the
integrated circuit probing apparatus 110 in FIG. 10 positions its
flow line 112, serving as the temperature-adjusting mechanism,
outside the test head 60. The flow line 112 has a plurality of
openings 114, which can be used as fluid inlets or fluid outlets.
In addition, the flow line 112 can also be positioned inside the
test head 60.
[0027] Compared to the prior art, the present invention allows the
flowing of the pressurized fluid in the flow line to adjust the
temperature of the test environment. Consequently, the temperature
of the test environment where the integrated circuit probing
apparatus is positioned can be kept within the range in which the
material of the integrated circuit probing apparatus and the test
units of test head can optimally perform. In addition, variations
in the physical or material properties of the integrated circuit
probing apparatus can be reduced to the minimum by controlling the
temperature of the pressurized fluid and the flow rate of the
pressurized fluid to decrease the temperature variation of the test
environment.
[0028] The above-described embodiments of the present invention are
intended to be illustrative only. Numerous alternative embodiments
may be devised by those skilled in the art without departing from
the scope of the following claims.
* * * * *