U.S. patent application number 12/615216 was filed with the patent office on 2010-05-27 for method and apparatus for linear pad conditioning.
This patent application is currently assigned to APPLIED MATERIALS, INC.. Invention is credited to Edward Golubovsky, Jagan Rangarajan, Alpay Yilmaz.
Application Number | 20100130107 12/615216 |
Document ID | / |
Family ID | 42196758 |
Filed Date | 2010-05-27 |
United States Patent
Application |
20100130107 |
Kind Code |
A1 |
Yilmaz; Alpay ; et
al. |
May 27, 2010 |
METHOD AND APPARATUS FOR LINEAR PAD CONDITIONING
Abstract
A method and apparatus for conditioning a polishing pad is
described. The apparatus includes a base coupled to a platform, a
first arm member having a first end coupled to the base, and a
second arm member having a first end pivotably coupled to a second
end of the first arm member and a conditioning disk coupled to a
second end opposite the first end. The method includes rotating a
polishing pad, urging a rotating conditioning disk against a
polishing surface of the polishing pad, and moving the conditioning
disk in a linear direction relative to the rotating polishing pad
to perform a conditioning process.
Inventors: |
Yilmaz; Alpay; (San Jose,
CA) ; Golubovsky; Edward; (San Jose, CA) ;
Rangarajan; Jagan; (Fremont, CA) |
Correspondence
Address: |
PATTERSON & SHERIDAN, LLP - - APPM/TX
3040 POST OAK BOULEVARD, SUITE 1500
HOUSTON
TX
77056
US
|
Assignee: |
APPLIED MATERIALS, INC.
Santa Clara
CA
|
Family ID: |
42196758 |
Appl. No.: |
12/615216 |
Filed: |
November 9, 2009 |
Related U.S. Patent Documents
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Application
Number |
Filing Date |
Patent Number |
|
|
61117536 |
Nov 24, 2008 |
|
|
|
Current U.S.
Class: |
451/56 ;
451/443 |
Current CPC
Class: |
B24B 53/017
20130101 |
Class at
Publication: |
451/56 ;
451/443 |
International
Class: |
B24B 53/02 20060101
B24B053/02 |
Claims
1. An apparatus for conditioning a polishing pad, comprising: a
base coupled to a platform; a first arm member having a first end
coupled to the base and an opposing second end; a second arm member
having a first end pivotably coupled to a second end of the first
arm member; and a conditioning disk coupled to a second end of the
second arm member opposite the first end of the first arm
member.
2. The apparatus of claim 1, wherein the conditioning disk is
coupled to a first actuator and a first transmission system
disposed on one or both of the first arm member and the second arm
member.
3. The apparatus of claim 1, wherein the conditioning disk is
coupled to a first actuator disposed on the second end of the
second arm member.
4. The apparatus of claim 1, wherein the base is coupled to a
rotary actuator adapted to move the base relative to the
platform.
5. The apparatus of claim 4, wherein the first arm member is
fixedly coupled to the base.
6. The apparatus of claim 4, wherein the actuator is a vertical
actuator providing vertical movement of the base relative to the
platform.
7. The apparatus of claim 1, wherein the first arm member and
second arm member are coupled to a first drive assembly comprising:
a motor having a first gear; a second gear coupled to the first end
of the second arm member; and a belt coupling the first gear and
the second gear.
8. The apparatus of claim 7, wherein the conditioning disk is
coupled to a second drive assembly.
9. The apparatus of claim 8, wherein the second drive assembly
includes a direct drive motor coupled to the conditioning disk.
10. The apparatus of claim 7, wherein the drive assembly
articulates the first arm member and second arm member in a linear
direction.
11. The apparatus of claim 10, wherein first arm member and second
arm member articulate in a vertical plane.
12. The apparatus of claim 10, wherein first arm member and second
arm member articulate in a horizontal plane.
13. A method of conditioning a polishing pad, comprising: rotating
a polishing pad; urging a rotating conditioning disk against a
polishing surface of the polishing pad; and moving the conditioning
disk in a linear direction relative to the rotating polishing pad
to perform a conditioning process.
14. The method of claim 13, wherein the linear direction comprises
a sweep pattern corresponding substantially to a radial dimension
of the polishing surface.
15. The method of claim 13, wherein the linear direction comprises
movement of the conditioning disk from a perimeter of the polishing
surface to near a center of the polishing surface.
16. The method of claim 13, wherein the condition disk is coupled
to an arm assembly moving in a horizontal direction during the
conditioning process.
17. The method of claim 13, wherein the condition disk is coupled
to an arm assembly moving in a vertical direction during the
conditioning process.
18. An apparatus for conditioning a polishing pad, comprising: a
base coupled to a platform; a first arm member coupled to the base;
a second arm member coupled to the first arm member; a conditioning
disk coupled to the second arm member opposite the base; and a
joint member coupled between the first arm member and the second
arm member, the joint member adapted to provide rotation of the
first arm member relative to the second arm member.
19. The apparatus of claim 18, further comprising: a first
transmission system coupled between the first arm member and the
second arm member; and a second transmission system coupled to the
conditioning disk.
20. The apparatus of claim 18, wherein the first arm member and
second arm member are coupled to a first drive assembly comprising:
a motor having a first gear; a second gear coupled to a first end
of the second arm member; and a belt coupling the first gear and
the second gear.
21. The apparatus of claim 20, further comprising: a second drive
assembly coupled to the conditioning disk.
22. The apparatus of claim 21, wherein the second drive assembly
comprises a direct drive motor.
23. The apparatus of claim 21, wherein the second drive assembly
comprises: a motor coupled to the conditioning disk by one or more
belts.
24. The apparatus of claim 19, wherein the first drive assembly
articulates the first arm member and second arm member in a linear
direction.
25. The apparatus of claim 24, wherein first arm member and second
arm member articulate in a vertical plane.
26. The apparatus of claim 24, wherein first arm member and second
arm member articulate in a horizontal plane.
Description
CROSS-REFERENCE TO RELATED APPLICATIONS
[0001] This application claims benefit of U.S. provisional patent
application Ser. No. 61/117,536, filed Nov. 24, 2008, which is
herein incorporated by reference.
BACKGROUND OF THE INVENTION
[0002] 1. Field of the Invention
[0003] Embodiments of the present invention generally relate to
polishing a substrate, such as a semiconductor wafer.
[0004] 2. Description of the Related Art
[0005] In the fabrication of integrated circuits and other
electronic devices on substrates, multiple layers of conductive,
semiconductive, and dielectric materials are deposited on or
removed from a feature side, i.e., a deposit receiving surface, of
a substrate. As layers of materials are sequentially deposited and
removed, the feature side of the substrate may become non-planar
and require planarization and/or polishing. Planarization and
polishing are procedures where previously deposited material is
removed from the feature side of the substrate to form a generally
even, planar or level surface.
[0006] Chemical mechanical polishing is one process commonly used
in the manufacture of high-density integrated circuits to planarize
or polish a layer of material deposited on a semiconductor wafer by
moving the feature side of the substrate in contact with a
polishing pad while in the presence of a polishing fluid. Material
is removed from the feature side of the substrate that is in
contact with the polishing surface through a combination of
chemical and mechanical activity.
[0007] Periodic conditioning of the polishing surface is required
to maintain a consistent roughness across the polishing surface to
facilitate enhanced material removal. The conditioning is typically
performed using a rotating conditioning disk that is urged against
the polishing surface. The conditioning disk is coupled to a
support member that moves the conditioning disk in a sweeping
pattern relative to the polishing surface. Providing a specific
and/or consistent sweep pattern across the polishing surfaces
creates challenges during conditioning that may result non-uniform
roughness of the polishing surface. The non-uniform roughness may
decrease material removal, which results in decreased
throughput.
[0008] Therefore, there is a need for a method and apparatus that
facilitates selective and/or consistent conditioning of the
polishing surface.
SUMMARY OF THE INVENTION
[0009] The present invention generally provides an apparatus and
method for conditioning a polishing pad using linear motion. In one
embodiment, an apparatus for conditioning a polishing pad is
described. The apparatus includes a base coupled to a platform, a
first arm member having a first end coupled to the base and an
opposing second end, a second arm member having a first end
pivotably coupled to a second end of the first arm member, and a
conditioning disk coupled to a second end of the second arm member
opposite the first end of the first arm member.
[0010] In another embodiment, a method of conditioning a polishing
pad is described. The method includes rotating a polishing pad,
urging a rotating conditioning disk against a polishing surface of
the polishing pad, and moving the conditioning disk in a linear
direction relative to the rotating polishing pad to perform a
conditioning process.
[0011] In another embodiment, an apparatus for conditioning a
polishing pad is described. The apparatus includes a base coupled
to a platform, a first arm member coupled to the base, a second arm
member coupled to the first arm member, a conditioning disk coupled
to the second arm member opposite the base, and a joint member
coupled between the first arm member and the second arm member, the
joint member adapted to provide rotation of the first arm member
relative to the second arm member.
BRIEF DESCRIPTION OF THE DRAWINGS
[0012] So that the manner in which the above recited features of
the present invention can be understood in detail, a more
particular description of the invention, briefly summarized above,
may be had by reference to embodiments, some of which are
illustrated in the appended drawings. It is to be noted, however,
that the appended drawings illustrate only typical embodiments of
this invention and are therefore not to be considered limiting of
its scope, for the invention may admit to other equally effective
embodiments.
[0013] FIG. 1 is a plan view of a polishing module.
[0014] FIG. 2 is a partial cross-sectional view of polishing module
of FIG. 1.
[0015] FIG. 3A shows one embodiment of a conditioning module.
[0016] FIG. 3B is a cross-sectional view of one embodiment of a
conditioning arm assembly.
[0017] FIG. 4A is a side view of a platen assembly showing one
embodiment of a conditioning arm assembly in a partially extended
position.
[0018] FIG. 4B is top view of the platen assembly shown in FIG.
4A.
[0019] FIG. 4C is a side view of the platen assembly of FIG. 4A
showing the conditioning arm assembly in a partially retracted
position.
[0020] FIG. 4D is a top view of the platen assembly shown in FIG.
4C.
[0021] FIG. 5A is a side view of a platen assembly showing another
embodiment of a conditioning arm assembly in a partially extended
position.
[0022] FIG. 5B is top view of the platen assembly shown in FIG.
5A.
[0023] FIG. 5C is a side view of the platen assembly of FIG. 5A
showing the conditioning arm assembly in a partially retracted
position.
[0024] FIG. 5D is a top view of the platen assembly shown in FIG.
5C.
[0025] To facilitate understanding, identical reference numerals
have been used, where possible, to designate identical elements
that are common to the figures. It is contemplated that elements
disclosed in one embodiment may be beneficially utilized on other
embodiments without specific recitation.
DETAILED DESCRIPTION
[0026] Embodiments of the present invention generally provide a
method and apparatus for conditioning a polishing surface of a
polishing pad. A conditioning device having a linearly extendable
arm configuration is described for use on a polishing pad having a
circular configuration. Although not shown, embodiments of the
conditioning device may be used on polishing pads having other
shapes, such as rectangular polishing pads or belt-type polishing
pads.
[0027] FIG. 1 is a plan view of a polishing module 100 for
processing one or more substrates, such as semiconductor wafers.
The polishing module 100 includes a platform 106 that at least
partially supports and houses a plurality of polishing stations
124. Each of the plurality of polishing stations 124 are adapted to
polish substrates that are retained in the one or more polishing
heads 126. The polishing stations 124 may be sized to interface
with the one or more polishing heads 126 simultaneously so that
polishing of one or a plurality of substrates may occur at a single
polishing station 124 at the same time. The polishing heads 126 are
coupled to a carriage 108 that is mounted to an overhead track 128.
The platform 106 also includes one or more load cups 122 adapted to
facilitate transfer of a substrate between the polishing heads 126
and a factory interface (not shown) or other device (not shown) by
a transfer robot. The load cups 122 generally facilitate transfer
between a robot 108 and each of the polishing heads 126.
[0028] The overhead track 128 allows each carriage 108 to be
selectively positioned around the polishing module 106. The
configuration of the overhead track 128 and carriages 108
facilitates positioning of the polishing heads 126 selectively over
the polishing stations 124 and the load cups 122. In the embodiment
depicted in FIGS. 1-2, the overhead track 128 has a circular
configuration (shown in phantom in FIG. 1) which allows the
carriages 108 retaining the polishing heads 126 to be selectively
rotated over and/or clear of the load cups 122 and the polishing
stations 124. It is contemplated that the overhead track 128 may
have other configurations including elliptical, oval, linear or
other suitable orientation.
[0029] Referring now primarily to FIG. 1, two polishing stations
124 are shown, located in opposite corners of the polishing module
106. Optionally, a third polishing station 124 (shown in phantom)
may be positioned in the corner of the polishing module 126
opposite the load cups 122. Alternatively or additionally, a second
pair of load cups 122 (also shown in phantom) may be located in the
corner of the polishing module 106 opposite the load cups 122 that
are positioned proximate the robot 108. Additional polishing
stations 124 may be integrated in the polishing module 106 in
systems having a larger footprint. In one embodiment, each
polishing station 124 may be a stand-alone unit adapted to couple
to the platform 106, other polishing stations 124, and/or a
facility floor. In this embodiment, the polishing module 100
includes a modular capability wherein polishing stations, load
cups, transfer devices or other equipment may be added or replaced
within the platform 106.
[0030] Each polishing station 124 generally includes a polishing
surface 130, a conditioning module 132 and a polishing fluid
delivery module 134. The polishing surface 130 is supported on a
platen assembly (not shown in FIG. 1) which rotates the polishing
surface 130 during processing. In one embodiment, the polishing
surface 130 is suitable for at least one of a chemical mechanical
polishing and/or an electrochemical mechanical polishing
process.
[0031] The polishing surface 130 is configured, in one embodiment,
to accommodate polishing of at least two substrates simultaneously
thereon. In such an embodiment, the polishing station 124 includes
two conditioning modules 132 and two polishing fluid delivery
modules 134 which condition and provide polishing fluid to the
region of the polishing surface 130 just prior to interfacing with
a respective substrate 170. Additionally, each of the polishing
fluid delivery modules 134 are positioned to provide independently
a predetermined distribution of polishing fluid on the polishing
surface 130 so that a specific distribution of polishing fluid is
respectively interfaced with each substrate during processing.
[0032] FIG. 2 shows a partial cross-sectional view of polishing
module 100 of FIG. 1. Specifically, the interface between the
overhead track 128 and the carriage 108 is shown. The overhead
track 128 is coupled to a support member 212 that is supported by a
frame member 204. The carriage 108 is utilized to position the
polishing head 126 over the load cups 122 (FIG. 1) or polishing
surface 130, to sweep the polishing head 126 across polishing
surface 130 during processing, or to position the polishing head
126 clear of the load cups 122 and polishing surface 130 for
maintenance of the polishing head 126, the load cups 122 or
polishing surface 130. The carriage 108 is controllably positioned
along the overhead track 128 by an actuator 205. The actuator 205
may be in the form of a gear motor, servo motor, linear motor,
sawyer motor or other motion control device suitable for accurately
positioning the carriage 108 on the track 128. In one embodiment,
each carriage 108 includes a linear motor that interfaces with a
magnetic track coupled to the track 128. The magnetic track
comprises magnets arranged in alternating polarity so that each
carriage 108 may be moved independently of the other carriages
coupled to the overhead track 128.
[0033] In one embodiment, the overhead track 128 is coupled to the
frame member 204 while the polishing stations 124 are coupled to a
polishing station platform 202. In this embodiment, each polishing
station 124 can be provided as a stand-alone unit or a plurality of
polishing stations 124 may be coupled together with the platform
202. In one embodiment, the polishing station platform 202 and
frame member 204 are coupled to a floor 200 of the facility without
being connected to each other. The decoupled polishing station
platform 202 and frame member 204 allows vibrations associated with
the movement of the carriages 108 to be substantially isolated from
the polishing surface 130, thereby minimizing potential impact to
polishing results. Moreover, utilization of the polishing station
platform 202 without a machine platform provides significant cost
savings over conventional designs.
[0034] The polishing head 126 is coupled to the carriage 108 by a
shaft 232. A motor 234 is coupled to the carriage 108 and is
arranged to controllably rotate the shaft 232, thereby rotating the
polishing head 126 and a substrate 201 disposed therein during
processing. At least one of the polishing head 126 or carriage 108
includes an actuator (not shown) for controlling the elevation of
the polishing head 126 relative to the polishing surface 130. In
one embodiment, the actuator allows the polishing head 126 to be
pressed against the polishing surface 130 at about 6 psi or less,
such as less than about 1.5 psi.
[0035] A platen assembly 200 supports a polishing pad 218 that may
be made entirely of a dielectric material or include conductive
material disposed in a dielectric material. The upper surface of
the pad 218 forms the polishing surface 130. The platen assembly
200 is supported on the polishing station platform 202 by one or
more bearings 214. The platen 216 is coupled by a shaft 206 to a
motor 208 that is utilized to rotate the platen assembly 200. The
motor 208 may be coupled by a bracket 210 to the polishing station
platform 202. In one embodiment, the motor 208 is a direct drive
motor. It is contemplated that other motors may be utilized to
rotate the shaft 206. In the embodiment depicted in FIG. 2, the
motor 208 is utilized to rotate the platen assembly 200 such that
the pad 218 retained thereon is rotated during processing while the
substrate 170 is retained against the polishing surface 130 by the
polishing head 126. It is contemplated, as shown in FIG. 1, that
the platen assembly 300 may be large enough to support a polishing
pad 218 which will accommodate polishing of at least two substrates
retained by different polishing heads 126. In one embodiment, the
dielectric polishing pad 218 is greater than 30 inches in diameter,
for example, between about 30 and about 52 inches, such as 42
inches. Even though the dielectric polishing pad 218 may be
utilized to polish two substrates simultaneously, the pad unit area
per number of substrate simultaneously polished thereon is much
greater than conventional single substrate pads, thereby allowing
the pad service life to be significantly extended, for example,
approaching about 2000 substrates per pad.
[0036] During processing or when otherwise desired, the
conditioning module 132 is activated to contact and condition the
polishing surface 130. Additionally, polishing fluid is delivered
through the polishing fluid delivery module 134 to the polishing
surface 130 during processing and/or conditioning. The distribution
of fluid provided by the polishing fluid delivery arm 132 may be
selected to control the distribution of polishing fluid across the
lateral surface of the polishing surface 130. It should be noted
that only one polishing head 126, conditioning module 132 and
polishing fluid delivery module 134 are depicted in FIG. 2 for the
sake of clarity.
[0037] FIG. 3A shows one embodiment of a conditioning module 132.
In this embodiment, the conditioning module 132 is coupled to the
polishing station platform 202. The conditioning module 132
includes a base 302 having a conditioning arm assembly 304 extended
therefrom in a cantilevered fashion. The distal end of the arm
assembly 304 supports a conditioning head 306. A conditioning disk
308 is removably attached to the conditioning head 306. In one
embodiment, a first motor or actuator 312 is provided to rotate the
arm assembly 304 over the polishing surface 130 during
conditioning, and to position the arm assembly 304 clear of the
polishing surface 130 when desired.
[0038] The conditioning arm assembly 304 includes at least two
articulatable arms or links, such as a first arm member 330A and a
second arm member 330B. The conditioning arm assembly 304 also
includes at least one pivot point or joint 332 coupling the first
and second arm member 330A, 330B providing relative movement
between the arm members 330A, 330B. A second motor 320 is utilized
to move the first arm member 330A relative to the second arm member
330B. The second motor 320 is coupled to a transmission system 325
that, in one embodiment, includes a shaft 322 (shown in phantom)
which is coupled to a drive member 309, which in turn are coupled
to one or more transmission members 326, which may be belts, wires,
or cables. In one embodiment, the transmission members 326, such as
belts are coupled to drive members 309 and the shaft 322 to
facilitate movement of the first arm member 330A relative to the
second arm member 330B such that angular changes are provided
between the first arm member 330A and the second arm member
330B.
[0039] Each of the drive members 309 may be a pulley or gear
adapted to transfer rotational or translation motion from one
element to another. The term "gear" as used herein is intended to
generally describe a component that is rotationally coupled to a
transmission member 326, such as a belt, teeth, wires, cables, and
is adapted to transmit motion from one element to another. In
general, a gear, as used herein, may be a conventional gear type
device or pulley type device, which may include but is not limited
to components such as, a spur gear, bevel gear, rack and/or pinion,
worm gear, a sheave, a timing pulley, and a v-belt pulley. The
joint 332 may be a revolute joint, a screw joint, or other joint
having one or more degrees of freedom.
[0040] In one embodiment, the elevation of the conditioning arm
assembly 304 may be controlled by a vertical actuator 318. In one
embodiment, the actuator 318 is coupled to a guide 314 that is
coupled to the base 302. The guide 314 may be positioned along a
rail 316 which is coupled to the polishing station platform 202 so
that the actuator 318 may control the elevation of the conditioning
arm assembly 304 and the conditioning head 306. A collar 324 is
provided to prevent liquid from passing between the base 302 and an
upper surface 310 of the polishing station platform 220.
[0041] FIG. 3B shows a cross-sectional view of one embodiment of a
conditioning arm assembly 304. In this embodiment, the conditioning
arm assembly 304 includes two transmission systems that may be used
together or separately. A first transmission system 325 includes a
first drive system 351A coupled to a second drive system 351B. The
first drive system 351A includes a first gear 352A coupled to a
shaft 353 extending from a first motor 356A. The first gear 352A is
coupled to a second gear 352B by a transmission member 354A, such
as a belt. The second gear 352B is coupled to a shaft 322 that is
coupled to a second drive system 351B. The second drive system
includes the third gear 352C and a fourth gear 352D which are
coupled by a second transmission member 354B, such as a belt. The
fourth gear 352D is fixedly coupled to a shaft 358 that extends
from the first arm member 330A and is fixedly coupled to the second
arm member 330B. Rotational movement from the first motor 356A is
transmitted to the shaft 358 to provide movement of the second arm
member 330B relative to the first arm member 330A.
[0042] In one aspect, the first transmission system 325 includes a
transmission ratio (e.g., ratio of diameters, ratio of the number
of gear teeth) of the first drive system 351A and second drive
system 351B that is designed to achieve a desired shape and
resolution of an actuation or extension path (e.g., element 450A
and/or 450B in FIG. 4A). The transmission ratio will be hereafter
defined as the driving element size to the driven element size, or
in this case, for example, the ratio of number of teeth of on third
gear 352C to the number of teeth on the fourth gear 352D.
Therefore, for example, where the first arm member 330A is rotated
270 degrees which causes the second arm member 330B to rotate 180
degrees equates to a 0.667 transmission ratio or alternately a 3:2
gear ratio. The term gear ratio is meant to denote that n.sub.1
number of turns of the first gear causes n.sub.2 number of turns of
the second gear, or an n.sub.1:n.sub.2 ratio. Therefore, a 3:2
ratio means that three turns of the first gear will cause two turns
of the second gear and thus the first gear must be about two thirds
the size of the second gear. In one aspect, the gear ratio of the
third gear 352C to the fourth gear 352D is between about 3:1 to
about 4:3, such as between about 2:1 and about 3:2.
[0043] In one embodiment, a second transmission system 360 is
provided on the conditioning arm assembly 304 that may be utilized
along with the first transmission system 325. In this embodiment,
the second transmission system 360 is configured to rotate the
conditioning head 306 about a center axis. The second transmission
system 360 includes a first gear 362A coupled to a second motor
356B by a shaft 361. The first gear 362A is coupled to a second
gear 362B and third gear 362C by a transmission member 363A.
Rotational movement from the second motor 356B is transmitted to
the second gear 362B and third gear 362C by the transmission member
363A. A second transmission member 363B is coupled between the
third gear 362C and a fourth gear 362D and fifth gear 362E to
transmit rotational movement from the second motor 356B to the
fifth gear 362E. A sixth gear 362F is rotationally coupled to the
fifth gear 362E by a third transmission member 363C. The sixth gear
362F is coupled to a shaft 364 that is coupled to the conditioning
head 306. Thus, rotational movement of the second motor 356B is
transmitted to the conditioning head 306 through the conditioning
arm assembly 304. While not shown, bearings and/or seals for each
of the gears and shafts may be provided. In one aspect, one or both
of the first motor 356A and second motor 356B is a stepper motor or
DC servomotor. A flexible sleeve or cover 350 may be coupled to the
conditioning arm assembly 304 at the joint 332 to contain any
particles that may be generated at the joint 332.
[0044] FIGS. 4A-4D are side and plan views of one embodiment of
conditioning arm assembly 404. FIGS. 4A and 4B show the
conditioning arm assembly 404 in a partially extended position and
FIGS. 4C and 4D show the conditioning arm assembly 404 in a
partially retracted position. In the embodiment shown in FIGS.
4A-4D, the conditioning arm assembly 404 may be configured
similarly to the embodiment of the conditioning arm assembly 304 of
FIGS. 3A and 3B, or include additional or alternative transmission
systems. In one embodiment, the conditioning arm assembly 404 may
include a first transmission system 325 as described in FIGS. 3A
and 3B and a second transmission system comprising a motor 415
coupled to the conditioning head 306 to rotate the conditioning
head 306.
[0045] In FIGS. 4A-4D, the conditioning arm assembly 404 includes
arm members 330A, 330B, a first joint 432A and a second joint 432B.
Each arm member 330A, 330B moves relative to the other in a
horizontal plane (X direction). The first joint 432A is proximate
the base 302 and may be either fixed to the base 302 to move the
first member with the base 302 or movably coupled to the base 302
such that the first arm member 330A moves at least rotationally
relative to the base 302. The second joint 432B is configured to
pivotally couple the first arm member 330A to the second arm member
330B. In one embodiment, the first joint 432A may be coupled to the
first transmission system 325 of FIG. 3B to move the first arm
member 330A and second arm member 330B. In another embodiment, the
first joint 432A may be coupled to an actuator 410, such as a
stepper motor or DC servomotor adapted to rotate the first arm
member 330A relative to the base 302 about axis A. Alternatively or
additionally, a joint actuator 420 may be coupled at the second
joint 432B to move the first arm member 330A relative to the second
arm member 330B about axis B. As another alternative, the
conditioning head 306 may be coupled to the motor 415 coupled to
the second arm member 330B. The motor 415 may be a direct drive
motor is adapted to provide rotational motion to the conditioning
head 306 along axis C.
[0046] FIG. 4B is a top view of the conditioning arm assembly 404
of FIG. 4A. In one embodiment, the conditioning arm assembly 404
provides a first sweep path 450A to condition the polishing surface
130. In this embodiment, the conditioning arm assembly 404 moves in
a radial direction across the polishing surface 130. The first
sweep path 450A may also include a linear directional component
such as substantial back and forth movement in the Y direction. The
conditioning head 306 moves across the polishing surface 130 from a
position near the center of the polishing surface 130 to a position
near an edge of the polishing surface 130 as shown in FIGS. 4C and
4D. Alternatively or additionally, the conditioning head 306 may be
actuated to move in a second sweep path 450B, such as an arcuate
path. For example, the conditioning head 306 may be moved in an
arcuate orientation by actuating the conditioning arm assembly 404
to move about at least one or both of axes A and B. During
conditioning, a downward pressure in a range between about 0.1
pound-force (lb-f) to about 10 lb-f, for example about 0.5 lb-f to
about 8 lb-f, such as between about 1.0 lb-f to about 3 lb-f may be
applied to conditioning head 306 having the conditioning disk
coupled thereto.
[0047] FIGS. 5A-5D are side and plan views of one embodiment of
conditioning arm assembly 504. FIGS. 5A and 5B show the
conditioning arm assembly 504 in a partially extended position and
FIGS. 5C and 5D show the conditioning arm assembly 504 in a
partially retracted position. In the embodiment shown in FIGS.
5A-5D, the conditioning arm assembly 504 may be configured
similarly to the embodiment of the conditioning arm assembly 304 of
FIGS. 3A and 3B, or include additional or alternative transmission
systems.
[0048] In FIGS. 5A-5D, the conditioning arm assembly 504 includes
arm members 330A, 330B, a first joint 532A and a second joint 532B.
Each arm member 330A, 330B moves relative to the other in a
vertical plane (Z direction).
[0049] The first arm member 330A is movably coupled by first joint
532A to the base 302 to rotate the first arm member 330A relative
to the base 302. The second joint 532B is configured to pivotally
couple the first arm member 330A to the second arm member 330B. In
one embodiment, the first joint 532A may be coupled to the first
transmission system 325 of FIG. 3B to move the first arm member
330A and second arm member 330B. In another embodiment, the first
joint 532A may be coupled to an actuator 410, such as a stepper
motor or DC servomotor adapted to rotate the first arm member 330A
relative to the base 302 about axis A'. Alternatively or
additionally, a joint actuator 520 may be coupled to the second
joint 532B to move the first arm member 330A relative to the second
arm member 330B about axis B'. A third joint 532C may be utilized
to couple the conditioning head 306 to the second arm member 330B.
The third joint 532C may be adapted to float or be configured as a
gimbal to allow rotational movement along axis C'. In one
embodiment, the conditioning head 306 may be coupled to a motor 415
to rotate the conditioning head 306. The motor 415 may be a direct
drive motor is adapted to provide rotational motion to the
conditioning head 306. The motor 415 may be coupled to a gear box
or transmission device (not shown) adapted to translate rotational
actuation from the motor 415 to the conditioning head 306, such as
a right angle gear box.
[0050] The embodiments of the conditioning arm assemblies 304, 404
and 504 as described above provide a more accurate and controllable
sweep pattern as compared to other conditioning apparatus. The
configuration of the conditioning arm assemblies 304, 404 and 504
use less space on a polishing module 100 which allows additional
space for polishing heads, fluid delivery modules and other
hardware used in or on the polishing module 100. For example, the
movement configurations of the first arm member 330A and the second
arm member 330B may be varied based on allocated space on the
polishing module 100. Factors such as height allowances, width
allowances, and other dimensional constraints between other
hardware disposed on the polishing module 100 may be considered and
the conditioning arm assemblies 304, 404 and 504 may be configured
accordingly.
[0051] Additionally, the configuration of the conditioning arm
assemblies 304, 404 and 504 provides alternative sweep patterns to
perform a conditioning process.
[0052] While the foregoing is directed to embodiments of the
present invention, other and further embodiments of the invention
may be devised without departing from the basic scope thereof, and
the scope thereof is determined by the claims that follow.
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