U.S. patent application number 12/258242 was filed with the patent office on 2010-04-29 for methods and apparatus for polishing an edge and/or notch of a substrate.
This patent application is currently assigned to Applied Materials, Inc.. Invention is credited to Paul D. Butterfield, Gary C. Ettinger, Sen-Hou Ko, Antoine P. Manens.
Application Number | 20100105299 12/258242 |
Document ID | / |
Family ID | 42117969 |
Filed Date | 2010-04-29 |
United States Patent
Application |
20100105299 |
Kind Code |
A1 |
Ettinger; Gary C. ; et
al. |
April 29, 2010 |
METHODS AND APPARATUS FOR POLISHING AN EDGE AND/OR NOTCH OF A
SUBSTRATE
Abstract
Apparatus and methods are provided to polish a substrate. In
some aspects, the invention includes a polishing head adapted to
apply a polishing tape against at least one of a substrate edge and
a notch in the substrate edge. The polishing head includes a
polisher coupled to the polishing head, wherein the polisher has a
hollow portion and is adapted to conform to a shape of at least one
of the substrate edge and the notch. Numerous other aspects are
provided.
Inventors: |
Ettinger; Gary C.;
(Cupertino, CA) ; Butterfield; Paul D.; (San Jose,
CA) ; Manens; Antoine P.; (Sunnyvale, CA) ;
Ko; Sen-Hou; (Sunnyvale, CA) |
Correspondence
Address: |
DUGAN & DUGAN, PC
245 Saw Mill River Road, Suite 309
Hawthorne
NY
10532
US
|
Assignee: |
Applied Materials, Inc.
Santa Clara
CA
|
Family ID: |
42117969 |
Appl. No.: |
12/258242 |
Filed: |
October 24, 2008 |
Current U.S.
Class: |
451/303 |
Current CPC
Class: |
B24B 21/002 20130101;
B24B 49/16 20130101; B24B 9/065 20130101 |
Class at
Publication: |
451/303 |
International
Class: |
B24B 21/00 20060101
B24B021/00 |
Claims
1. An apparatus for polishing a substrate comprising: a polishing
head adapted to apply a polishing tape against at least one of a
substrate edge and a notch in the substrate edge, including: a
polisher coupled to the polishing head, wherein the polisher has a
hollow portion and is adapted to conform to a shape of at least one
of the substrate edge and the notch.
2. The apparatus of claim of claim 1 wherein the polisher is
selectively inflatable.
3. The apparatus of claim 1 wherein the hollow portion is adapted
to retain a fluid.
4. The apparatus of claim 3 wherein the polisher further comprises
a port adapted to receive the fluid.
5. The apparatus of claim 4 wherein the fluid is compressed
air.
6. The apparatus of claim 1 wherein the polishing head is adapted
to pivot about at least one of the substrate edge and the
notch.
7. The apparatus of claim 1 wherein the polishing tape is adapted
to advance over the polisher during application of the polishing
tape to at least one of the substrate edge and the notch.
8. The apparatus of claim 1 wherein the polisher includes a notch
portion.
9. A system for polishing a substrate comprising: a substrate
support adapted to rotate a substrate; a polishing head adapted to
apply a polishing tape against at least one of a substrate edge and
a notch in the substrate edge, including: a polisher coupled to the
polishing head, wherein the polisher has a hollow portion and is
adapted to conform to a shape of at least one of the substrate edge
and the notch; and a controller adapted to operate the rotation of
the substrate and the polishing head.
10. The system of claim 9 wherein the controller is adapted to
incrementally advance the polishing tape to the polishing head.
11. The system of claim 9 wherein the hollow portion is adapted to
retain a fluid.
12. The system of claim 11 wherein the polisher further comprises a
port adapted to receive the fluid.
13. The system of claim 12 further comprising a sensor adapted to
sense a pressure applied by the fluid.
14. The system of claim 13 wherein the sensor is coupled to the
controller, and the controller is adapted to receive a signal from
the sensor indicative of the applied pressure.
15. The system of claim 11 wherein the controller is adapted to
adjust a pressure applied to at least one of the substrate edge and
notch by the fluid.
16. The system of claim 15 further comprising a valve, wherein the
valve is coupled to the polisher, and wherein the controller is
adapted to manipulate the valve to adjust the applied pressure.
17. The system of claim 15 wherein the controller is adapted to
increase the applied pressure by increasing the fluid retained in
the hollow portion.
18. The system of claim 9 wherein the polisher includes a notch
portion.
19. The system of claim 9 wherein the polishing head is adapted to
pivot about at least one of the substrate edge and the notch.
20. A method for polishing a substrate comprising: securing a
substrate on a support; pressing a polishing tape against at least
one of a substrate edge and a notch with a hollow polisher;
advancing the polishing tape as the polishing tape is pressed
against the notch; and monitoring the polishing process.
21. The method of claim 20 further comprising: inflating the hollow
polisher.
22. The method of claim 21 wherein monitoring the polishing process
further comprises: receiving a signal indicative of the pressure
applied by the inflated polisher.
23. The method of claim 22 further comprising: adjusting the
pressure based on the received signal.
24. The method of claim 23 wherein adjusting the pressure further
comprises one of: inflating the hollow polisher and deflating the
hollow polisher.
25. The method of claim 24 wherein inflating the hollow polishing
pad further comprises: flowing a fluid into the hollow polisher.
Description
CROSS-REFERENCE TO RELATED APPLICATIONS
[0001] The present application is related to the following
commonly-assigned, co-pending U.S. patent applications, each of
which is hereby incorporated herein by reference in its entirety
for all purposes:
[0002] U.S. patent application Ser. No. 12/124,137, filed May 20,
2008, entitled "METHODS AND APPARATUS FOR POLISHING A NOTCH OF A
SUBSTRATE USING A POLISHING PAD" (Attorney Docket No. 10674);
[0003] U.S. patent application Ser. No. ______, filed Oct. 24,
2008, entitled "METHODS AND APPARATUS FOR POLISHING A NOTCH OF A
SUBSTRATE" (Attorney Docket No. 10670/L);
[0004] U.S. patent application Ser. No. ______, filed Oct. 24,
2008, entitled "METHODS AND APPARATUS FOR POLISHING A NOTCH OF A
SUBSTRATE WITH A MANDREL" (Attorney Docket No. 10672/L); and
[0005] U.S. patent application Ser. No. ______, filed Oct. 24,
2008, entitled "METHODS AND APPARATUS FOR POLISHING A NOTCH OF A
SUBSTRATE WITH AN ABRASIVE CORD" (Attorney Docket No. 10673/L).
FIELD OF THE INVENTION
[0006] The present invention relates generally to substrate
processing, and more particularly to methods and apparatus for
cleaning an edge of a substrate, and/or a notch in an edge of the
substrate.
BACKGROUND OF THE INVENTION
[0007] During processing of substrates for electronic device
manufacturing, a film and/or flakes (`contaminants`) may be
deposited on the surface of the substrate. However, the presence of
the contaminants on portions of the substrate, including an edge
and/or a notch in the edge of the substrate, may be undesirable as
it may negatively affect device fabrication on the substrate.
Conventional systems, which contact a substrate edge and/or notch
with an abrasive film or tape to clean the substrate edge and/or
notch, may not be able to contact all parts of the substrate edge
and/or notch and therefore may not be able to thoroughly clean the
substrate edge and/or notch to remove the contaminants. The
inability to sufficiently clean the substrate may affect electronic
device manufacturing throughput. Accordingly improved methods and
apparatus for cleaning an edge and notch of a substrate are
desired.
SUMMARY OF THE INVENTION
[0008] In some aspects of the invention, an apparatus for polishing
a substrate is provided. The apparatus includes a polishing head
adapted to apply a polishing tape against at least one of a
substrate edge and a notch in the substrate edge. The polishing
head includes a polisher coupled to the polishing head, wherein the
polisher has a hollow portion and is adapted to conform to a shape
of at least one of the substrate edge and the notch.
[0009] In other aspects of the invention, a system for polishing a
substrate is provided. The system includes a substrate support
adapted to rotate a substrate; a polishing head adapted to apply a
polishing tape against at least one of a substrate edge and a notch
in the substrate edge. The polishing head includes a polishing pad
coupled to the polishing head, wherein the polishing pad has a
hollow portion and is adapted to conform to a shape of at least one
of the substrate edge and the notch. The system also includes a
controller adapted to operate the rotation of the substrate and the
polishing head.
[0010] In yet other aspects of the invention, a method for
polishing a substrate is provided. The method includes (1) securing
a substrate on a support; (2) pressing a polishing tape against at
least one of a substrate edge and a notch with a hollow polishing
pad; (3) advancing the polishing tape as the polishing tape is
pressed against the notch; and (4) monitoring the polishing
process.
[0011] Other features and aspects of the present invention will
become more fully apparent from the following detailed description,
the appended claim and the accompanying drawings.
BRIEF DESCRIPTION OF THE DRAWINGS
[0012] FIG. 1 is a schematic illustration of a cross-section of a
portion of a substrate.
[0013] FIG. 2 is a schematic plan view of an embodiment of a system
for polishing parts of a substrate, including major surfaces, edge,
bevel, and notch in accordance with the present invention.
[0014] FIG. 3 is a schematic perspective view of an embodiment of a
polishing apparatus for in accordance with the present
invention.
[0015] FIG. 4 is a schematic illustration of part of a substrate,
including a substrate notch.
[0016] FIG. 5 is a schematic perspective view of an example
embodiment of a polishing pad in accordance with the present
invention.
[0017] FIG. 6 is a block diagram of an example embodiment of a
system for polishing parts of a substrate in accordance with the
present invention.
[0018] FIG. 7 is a schematic perspective view of another example
embodiment of a polishing pad in accordance with the present
invention.
[0019] FIG. 8 is a flow chart describing an exemplary method for
polishing a substrate in accordance with the present invention.
DETAILED DESCRIPTION
[0020] Substrates used in semiconductor processing often have films
and/or surface defects which it is helpful to remove prior to
subsequent processing steps. These films and defects may occur on
the edge of a substrate, including notches formed thereon.
[0021] In some embodiments, the present invention provides
apparatus and methods that effectively adapt to various shapes and
profiles of different substrate edges and notches, ensuring good
contact of a polishing or abrasive film or tape with all sections
of a substrate edge and/or notch region. In one or more
embodiments, a hollow polisher is provided. The polisher may be
adapted to press a moving polishing tape against the substrate edge
and/or notch. The hollow portion or the polisher may be selectively
filled or inflated with a fluid, which may allow the polisher to
substantially conform to a desired shape, such as the shape of the
edge and/or notch of the substrate, such that the polishing tape
may contact and polish substantially all portions of the edge
and/or notch of the substrate.
[0022] Turning to FIG. 1, a substrate 100 may include two major
surfaces 102, 102' and an edge 104. Each major surface 102, 102' of
the substrate 100 may include a device region 106, 106' and an
exclusion region 108, 108'. (Typically however, only one of the two
major surfaces 102, 102' will include a device region and an
exclusion region.) The exclusion regions 108, 108' may serve as
buffers between the device regions 106, 106' and the edge 104. The
edge 104 of the substrate 100 may include an outer edge 110 and
bevels 112, 114. The bevels 112, 114 may be located between the
outer edge 110 and the exclusion regions 108, 108' of the two major
surfaces 102, 102'. A notch 116 may be located in the outer edge
110 of the substrate 100. In some embodiments, the present
invention may be adapted for use with a system adapted to clean
and/or polish the outer edge 110 and at least one bevel 112, 114 of
the substrate 100 without affecting the device regions 106, 106'.
In some embodiments, all or part of the exclusion regions 108, 108'
may be cleaned or polished as well.
[0023] FIG. 2 is a schematic plan view of an embodiment of a system
200 for polishing parts of the substrate 100, including the major
surfaces 102, 102', the edge 104, and the notch 116. The system 200
includes three polishing apparatuses 202, each including a
polishing head 204. However, any number and type of apparatus
202/heads 204 may be used in any practicable combination. In
addition, in such multi-head embodiments, each head 204 may use a
differently configured or type of a polishing tape (e.g., different
grits, materials, tensions, pressures, etc.) to contact and polish
the substrate edge 104 and/or notch 116. Any number of heads 204
may be used concurrently, individually, and/or in any sequence. The
heads 204 may be disposed in different positions and/or in
different orientations (e.g., aligned with the substrate edge 104
and/or notch 116, normal to the substrate edge 104 and/or notch
116, angled relative to the substrate edge 104 and/or notch 116,
etc.) to allow polishing tape, pushed by a polisher in some
embodiments (FIG. 3), to polish different portions of the substrate
edge 104 and/or notch 116.
[0024] In some embodiments, one or more of the heads 204 may be
adapted to be oscillated or moved (e.g., pivoted or angularly
translated about a tangential axis of the substrate 102 and/or
circumferentially relative to the substrate 102) around or along
the substrate edge 104 and/or notch 116 so as to polish different
portions of the substrate edge 104 and/or notch 116. In some
embodiments, one or more of the heads 204 may be adapted to
continuously or intermittently oscillate between the various
positions. Alternatively, one or more of the heads 204 may be fixed
and/or only adjusted while the substrate 102 is not being rotated.
In yet other embodiments, the substrate 102 may be held fixed while
one or more of the heads 204 oscillate (as described above) as well
as rotate circumferentially around the substrate 102. This movement
may be under the direction of a programmed or user operated
controller 206, described below. Different heads 204 may be used
for different substrates 102 or different types of substrates
102.
[0025] As described above, the system 200 may further include the
controller 206, (e.g., a programmed computer, a programmed
processor, a microcontroller, a gate array, a logic circuit, an
embedded real time processor, etc.), which may control the
driver(s) used to rotate the substrate 102 and/or the actuator(s)
used to push a polisher (FIG. 3) against the substrate edge 104
and/or notch 116. Note that the controller 206 may be coupled
(e.g., electrically, mechanically, pneumatically, hydraulically,
etc.) to each of a plurality of actuators. Likewise, the controller
206 may be adapted to receive feedback signals from one or more
drivers and/or actuators, that indicate the amount of energy being
exerted to rotate the substrate 102 (e.g., rotate a vacuum chuck
holding the substrate 102) and/or actuate the actuator(s) to push
the polisher against the substrate edge 104 and/or notch 116. As
described further below, these feedback signals may be employed to
determine when a particular layer of film has been removed from the
substrate edge 104 and/or notch 116 and/or whether a sufficient
amount of substrate polishing has occurred.
[0026] As mentioned above, substrate polishing may be performed
using one or more polishing apparatuses 202. In one or more
embodiments, a plurality of polishing apparatuses 202 may be
employed, in which each polishing apparatus 202 may have similar or
different characteristics and/or mechanisms. In the latter case,
particular polishing apparatuses 202 may be employed for specific
operations. For example, one or more polishing apparatuses 202 may
be adapted to perform relatively rough polishing and/or adjustments
while another one or more polishing apparatus 202 may be adapted to
perform relatively fine polishing and/or adjustments. Polishing
apparatuses 202 may be used in sequence so that, for example, a
rough polishing procedure may be performed initially and a fine
polishing procedure may be employed subsequently as needed or
according to a polishing recipe. The plurality of polishing
apparatuses 202 may be located in a single chamber or module, as
shown herein, or alternatively, one or more polishing apparatuses
202 may be located in separate chambers or modules. Where multiple
chambers are employed, a robot or another type of transfer
mechanism may be employed to move substrates between the chambers
so that polishing apparatuses 202 in the separate chambers may be
used in series or otherwise.
[0027] Substrate [edge/notch] polishing may be performed using one
or more polishing apparatuses 202. In one or more embodiments, a
plurality of polishing apparatuses 202 may be employed, in which
each polishing apparatus 202 may have similar or different
characteristics and/or mechanisms. In the latter case, particular
polishing apparatuses 202 may be employed for specific operations.
For example, one or more of a plurality of polishing apparatuses
202 may be adapted to perform relatively rough polishing and/or
adjustments while another one or more of the plurality of polishing
apparatus 202 may be adapted to perform relatively fine polishing
and/or adjustments. Polishing apparatuses 202 may be used in
sequence so that, for example, a rough polishing procedure may be
performed initially and a fine polishing procedure may be employed
subsequently to make adjustments to a relatively rough polish as
needed or according to a polishing recipe. The plurality of
polishing apparatuses 202 may be located in a single chamber or
module, as shown herein, or alternatively, one or more polishing
apparatuses 202 may be located in separate chambers or modules.
Where multiple chambers are employed, a robot or another type of
transfer mechanism may be employed to move substrates 100 between
the chambers so that polishing apparatuses 202 in the separate
chambers may be used in series or otherwise.
[0028] FIG. 3 is a schematic perspective view of an embodiment of a
polishing apparatus 300 for polishing a substrate edge 104 and/or
notch 116. The polishing apparatus 300 may include a substrate
driver 302 (e.g., a servomotor, gear, belt, chain, etc.), which may
be mounted on a pedestal 304. A support 306 (e.g., a vacuum chuck)
may be coupled (e.g., rigidly) to a shaft (not shown) of the
substrate driver 302. The support 306 may support the substrate
100, for example. The substrate driver 302 may rotate the substrate
100, via the support 306, about a center 308 of the substrate 100
or another suitable axis. The substrate driver 302 may be connected
to a substrate driver control unit, such as the controller 206
(FIG. 2), for example, which may control the angular displacement,
angular velocity, and angular acceleration of the substrate 100.
The polishing apparatus 300 may further include a polishing arm 310
aligned in the horizontal plane approximately tangential to the
substrate edge 104 and supported by a frame 312. The frame 312 may
be coupled at one end to a polishing head driver 309. In other
embodiments, the polishing arm 310 may be aligned differently, for
example, vertically or at an angle with respect to the horizontal
plane. The polishing arm 310 may include a polishing head section
314 (`head`). The polishing head 314 may include a polisher 316.
The polisher 316 may be selectively shaped to correspond to the
shape of the substrate edge 104 and/or notch 116, described further
below. The polisher 316 may be relatively or substantially planar
in shape, as shown herein, or the polisher 316 may be wheel or
roller-shaped, for example. Any other suitable shape may be used.
Polishing tape 318, may wrap around the polishing head 314, and
guide rollers 320, 322 and over the polisher 316, and be tensioned
between supply and take-up spools 324, 326. The supply and take-up
spools 324, 326 may be driven by supply and take-up spool drivers
328, 330 (e.g., servomotors), respectively. The supply and take-up
spool drivers 328, 330, may be moved continuously or indexed to
precisely control the amount of the polishing tape 318 that is
advanced over the polishing head 314 from, for example, the supply
and take-up spools 324, 326, in order to polish the substrate edge
104 and/or notch 116. The substrate 100 may rotate in the xy plane.
While the polishing tape 318 is shown to advance in a longitudinal
direction in the plus or minus z-direction, in other embodiments,
the polishing tape 318 may advance in a longitudinal direction the
plus or minus y-direction.
[0029] In one or more embodiments, the polishing tape 318 may be
made from many different materials, such as aluminum oxide, silicon
oxide, silicon carbide, etc. Other materials may also be used. In
some embodiments, abrasives used may range, for example, from about
0.1 micron up to about 10 microns in size or, for example, 0.5
microns to 3 microns in size, although other sizes may be used.
Different widths of polishing tape 318 ranging from about 0.55 inch
to about 1.5 inches may be used, although other polishing tape
widths may be used. In one or more embodiments, the polishing tape
318 may be about 0.002 to about 0.02 inches thick and withstand
about 1 to 5 lbs. in tension. Other polishing tapes having
different thicknesses and tensile strengths may be used. The supply
and take-up spools 324, 326 may have a diameter of approximately 3
inches and be capable of holding about 30,000 inches of polishing
tape 318, or may have a diameter of approximately 1 inch and be
capable of holding about 500 inches of polishing tape 318. Other
spool dimensions may be used. The supply and take-up spools 324,
326 may be constructed from materials such as nylon, polyurethane,
polyvinyl difluoride (PVDF), etc. Other materials may also be
used.
[0030] With reference to FIG. 4, a part of the substrate 100
containing the notch 116 is schematically illustrated, not to
scale. The notch 116 may include one or more notch sides 400. The
notch 116 may also include a first notch corner or node 402 and a
second notch corner or node 404. Each notch corner 402, 404 may be
positioned at the intersection of the notch side 400 and the outer
perimeter of the substrate 100. The notch 116 may further include a
notch center 406, positioned at the intersection of the one or more
notch sides 400. The notch center 406 may be used to align the
substrate 100 during processing. As is apparent from the figure,
the notch 116 may exhibit large changes in curvature as it is
traced from the first notch corner 402 to the second notch corner
404, via the notch sides 400 and notch center 406. For this reason,
it is advantageous to maintain consistent contact between the
polishing tape 318 and all regions of the notch 116 indicated above
during polishing.
[0031] Turning to FIGS. 5A and 5B, a schematic perspective view of
an example embodiment of a polisher 500 (FIG. 5A) and a cross
section of the polisher 500 (FIG. 5B) are provided in accordance
with the present invention. The polisher 500 may include a hollow
portion 502 therein, shown in FIG. 5B. The hollow portion 502 may
be selectively filled with a fluid, such as pressure controlled
air, N.sub.2, and deionized water, for example. Other suitable
fluids may be used. The polisher 500 may also include one or more
fluid ports 504 adapted to couple the hollow portion 502 to a fluid
supply 506 (FIG. 6). A valve 508 (FIG. 6) may be coupled to the
fluid port 504, and the valve 508 may be adapted to selectively
control the flow of fluid from the fluid supply 506 to the hollow
portion 502 of the polisher 500. The polisher 500 may be
selectively filled to conform itself (and the polishing tape 318)
to the substrate edge 104 and/or notch 116. For example, the
polisher 500 may be filled such that it remains pliable as the
polisher 500 presses the polishing tape 318 against the substrate
edge 104 and/or notch 116. The polisher 500, and hence the
polishing tape 318, may then conform to the shape of the substrate
edge 104 and/or notch 116 under the applied pressure. In this
manner, the polishing tape 318 may form a tight contact with the
substrate edge 104 and/or notch 116 and provide effective
polishing. In some embodiments, the polisher 500 may include a
notch portion 510 (not shown to scale) that may more easily conform
to the shape of the notch 116.
[0032] In some embodiments, a fluid monitor or sensor 512 may be
coupled to the valve 508. The fluid sensor 512 may sense pressure
applied by the polisher 500 caused by the force of the pressure of
the fluid in the hollow portion 502 of the polisher 500. The fluid
sensor 512 may be coupled to the controller 206, for example, such
that the controller 206 may receive feedback from the fluid sensor
512 indicative of the amount of pressure exerted by the fluid in
the hollow portion 502. The controller 206 may then change or
adjust the flow of fluid into/out of the polisher 500 during the
polishing process to adjust the pressure applied by the polisher
500, based on a desired polishing effect. This selectively
adjustable pressure may be useful because as the polishing head 314
pivots about the substrate edge 104 and/or notch 116, the amount of
film on the substrate edge 104 and/or notch 116 may change, due,
for example, to different locations and different film profiles. As
such, it may be desirable to adjust the amount of pressure applied
during the polishing process.
[0033] Additionally, filling the polisher pad 500 may have the
advantage of allowing precise control of the pressure applied to
the film deposited on the substrate edge 104 and/or notch 116. The
pressure measurement may also be helpful in tracking the film
removed from the substrate edge 104 and/or notch 116. For example,
if the applied pressure is set to a particular amount, as the film
is removed from the substrate edge 104 and/or notch 116, the
applied pressure may increase to maintain the pre-set level. The
change in pressure may be indicative that a pre-set amount of film
has been removed from the substrate edge 104 and/or notch 116.
[0034] In alternate embodiments, a wheel-shaped polisher 700 (FIG.
7) may be used. Any suitably shaped polisher may be used. The
wheel-shaped polisher 700 may be coupled to the polishing head 314
with a low friction bearing (not shown), for example. The low
friction bearing may allow the polisher 700 to rotate more easily
than if a low friction bearing had not been used. The relative ease
of rotation of the polisher 700 may provide less friction to
polishing tape 318 when the polishing tape 318 is advancing during
polishing processes. The decreased friction may provide for a more
consistent tension in the polishing tape 318. In embodiments with
higher or increased friction, more torque may be needed to advance
the polishing tape 318, which in turn may place a greater tension
on the polishing tape 318. The greater tension on the polishing
tape 318 may, for example, deform and/or stretch the polishing tape
318, which may negatively affect the polishing performance of the
polishing tape 318.
[0035] Turning to FIG. 8 a flow chart depicting an exemplary method
800 for polishing the substrate 100 is provided. In step S802, the
substrate 100 may be positioned and secured on the support. In some
embodiments, the substrate 100 may be rotated until the notch 116
is in alignment with the polishing head 314, e.g., in alignment
with the polisher 500. In step S804, the polisher 500 may be moved
in the direction of the substrate 100 by an actuator, until a
portion of the polisher 500 is in contact with the substrate edge
104 and/or notch 116 via the polishing tape 318, and presses the
polishing tape 318 against the substrate edge 104 and/or notch 116.
In step S806, the polishing tape 318 may advance via the supply and
take-up spool drivers 328, 330. In step S808, a polishing-head
driver or the controller 206 may rotate or pivot the polishing head
314 about the substrate edge 104 and/or notch 116 in a plane
approximately perpendicular to major surfaces 102, 102' of the
substrate 100, in order to effectively clean and polish parts of
the substrate edge 104 and/or notch 116 adjacent to major surfaces
102, 102' of the substrate 100. The speed, direction, tension,
pressing force, etc. of the polishing tape 318 may be adjustable,
as may be the rotational displacement, speed, and/or acceleration
of the polishing head 314 about the substrate 100. For instance,
the polishing tape 318 may be advanced at one speed for a certain
length, and then another speed for another length. In addition, the
polishing tape 318 may be translated or oscillated, or both, with
constant or variable tensions and pressing forces.
[0036] Further with respect to the method 800 for cleaning and
polishing the substrate edge 104 and/or notch 116, the substrate
polishing process may be monitored in step S810. For example, the
pressure with which the polishing tape 318 is pressed into contact
with, and against, the substrate edge 104 and/or notch 116 may be
determined by the force or pressure applied by the fluid in the
inflatable polisher 500, the pressure applied by the actuator,
and/or the resilience of the polisher 500 and the polishing tape
318. In some embodiments, the fluid sensor 512 may send a signal to
the controller 206 indicative of the amount of pressure applied by
the fluid in the inflatable polisher 500. As the polishing tape 318
is advanced over the substrate edge 104 and/or notch 116, films and
imperfections on the substrate edge 104 and/or notch 116 may be
removed and eliminated by abrasion. The force or pressure applied
by the polisher 500 due to the pressure of the fluid in the
polisher 500, may be adjusted by controller 206, as needed. As
described above, the adjustments to the pressure may account for
changes in the amount of film removed from the substrate, and the
portion of the substrate 100 being polished (i.e. notch, top bevel,
bottom bevel, outer edge), for example. Any other suitable
parameters may result in changes to the applied pressure. For
example, as a layer of film is removed from the substrate edge 104
and/or notch 116, the pressure applied by the polisher 500 may
decrease, and therefore, to maintain a pre-set applied pressure,
the polisher 500 may be further inflated such that the polisher 500
applies the pre-set pressure to the substrate edge 104 and/or notch
116. In another example the amount and/or type of film deposited in
the notch 116 may be different than the amount/type of film
deposited on the substrate edge 104. Additionally, the geometries
of the substrate edge 104 and notch 116 may be different. As such,
the amount of pressure applied by the polisher 500 to polish the
notch 116 may be different than the amount of pressure applied by
the polisher 500 to polish the substrate edge 104.
[0037] The foregoing description discloses only exemplary
embodiments of the invention. Modifications of the above disclosed
apparatus and methods which fall within the scope of the invention
will be readily apparent to those of ordinary skill in the art.
[0038] Accordingly, while the present invention has been disclosed
in connection with exemplary embodiments thereof, it should be
understood that other embodiments may fall within the spirit and
scope of the invention, as defined by the following claim.
* * * * *