Ko; Sen-Hou

Patent Applications and Registrations

Patent applications and USPTO patent grants for Ko; Sen-Hou.The latest application filed is for "design of disk/pad clean with wafer and wafer edge/bevel clean module for chemical mechanical polishing".

Company Profile

0.41.60

Ko; Sen-Hou - Sunnyvale CA
Ko; Sen-Hou - Cupertino CA

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Methods and apparatus for post-chemical mechanical planarization substrate cleaning Grant 9,711,381 - Ko , et al. July 18, 2	2017-07-18
Disk-brush cleaner module with fluid jet Grant 9,646,859 - Chen , et al. May 9, 2	2017-05-09
Design Of Disk/pad Clean With Wafer And Wafer Edge/bevel Clean Module For Chemical Mechanical Polishing App 20170040160 - CHEN; Hui ; et al.	2017-02-09
Disk/pad clean with wafer and wafer edge/bevel clean module for chemical mechanical polishing Grant 9,508,575 - Chen , et al. November 29, 2	2016-11-29
Apparatus And Methods For Brush And Pad Conditioning App 20140360976 - KO; Sen-Hou ; et al.	2014-12-11
Disk/pad Clean With Wafer And Wafer Edge/bevel Clean Module For Chemical Mechanical Polishing App 20140261539 - CHEN; Hui ; et al.	2014-09-18
Apparatus and methods for brush and pad conditioning Grant 8,813,293 - Ko , et al. August 26, 2	2014-08-26
Methods And Apparatus For Post-chemical Mechanical Planarization Substrate Cleaning App 20140209239 - Ko; Sen-Hou ; et al.	2014-07-31
Polishing pad conditioner Grant 8,550,879 - Chen , et al. October 8, 2	2013-10-08
Apparatus And Methods For Brush And Pad Conditioning App 20130247314 - KO; Sen-Hou ; et al.	2013-09-26
Conditioning A Pad In A Cleaning Module App 20130196572 - Ko; Sen-Hou ; et al.	2013-08-01
Cleaning Module And Process For Particle Reduction App 20130185884 - Ko; Sen-Hou ; et al.	2013-07-25
Apparatus and methods for brush and pad conditioning Grant 8,458,843 - Ko , et al. June 11, 2	2013-06-11
Semiconductor Substrate Cleaning Apparatus, Systems, And Methods App 20130098395 - Ding; Yunshuang ; et al.	2013-04-25
Methods and apparatus for removal of films and flakes from the edge of both sides of a substrate using backing pads Grant 8,142,260 - Kollata , et al. March 27, 2	2012-03-27
Methods and apparatus for measuring substrate edge thickness during polishing Grant 8,125,654 - Benvegnu , et al. February 28, 2	2012-02-28
Disk-brush Cleaner Module With Fluid Jet App 20110265816 - Chen; Hui ; et al.	2011-11-03
Methods and apparatus for processing a substrate Grant 7,993,485 - Wasinger , et al. August 9, 2	2011-08-09
Apparatus And Methods For Brush And Pad Conditioning App 20110094537 - Ko; Sen-Hou ; et al.	2011-04-28
Apparatus for conditioning processing pads Grant 7,828,626 - Butterfield , et al. November 9, 2	2010-11-09
Polishing pad conditioning process Grant 7,749,048 - Wang , et al. July 6, 2	2010-07-06
Polishing Pad Conditioner App 20100105302 - Chen; Hung Chih ; et al.	2010-04-29
Methods And Apparatus For Polishing A Notch Of A Substrate App 20100105291 - Ettinger; Gary C. ; et al.	2010-04-29
Methods And Apparatus For Polishing An Edge And/or Notch Of A Substrate App 20100105299 - Ettinger; Gary C. ; et al.	2010-04-29
Method for conditioning processing pads Grant 7,666,061 - Butterfield , et al. February 23, 2	2010-02-23
Methods And Apparatus For Measuring Substrate Edge Thickness During Polishing App 20090262353 - Benvegnu; Dominic J. ; et al.	2009-10-22
Apparatus For Conditioning Processing Pads App 20090036037 - Butterfield; Paul D. ; et al.	2009-02-05
Methods And Apparatus For Polishing An Edge Of A Substrate App 20090036042 - Shin; Ho Seon ; et al.	2009-02-05
Methods And Apparatus For Processing A Substrate App 20090036033 - Wasinger; Erik C. ; et al.	2009-02-05
Methods And Apparatus For Polishing An Edge Of A Substrate App 20090029629 - Shin; Ho Seon ; et al.	2009-01-29
Methods And Apparatus For Processing A Substrate App 20090017731 - Ettinger; Gary C. ; et al.	2009-01-15
Methods And Apparatus For Removal Of Films And Flakes From The Edge Of Both Sides Of A Substrate Using Backing Pads App 20080293340 - Kollata; Eashwer ; et al.	2008-11-27
Methods And Apparatus For Low Cost And High Performance Polishing Tape For Substrate Bevel And Edge Polishing In Seminconductor Manufacturing App 20080293331 - Chen; Yufei ; et al.	2008-11-27
Methods And Apparatus To Control Substrate Bevel And Edge Polishing Profiles Of Films App 20080293336 - Zhang; Zhenhua ; et al.	2008-11-27
Methods And Apparatus For Controlling The Size Of An Edge Exclusion Zone Of A Substrate App 20080293333 - Zhang; Zhenhua ; et al.	2008-11-27
Methods And Apparatus For Polishing A Notch Of A Substrate By Substrate Vibration App 20080293337 - Zhang; Zhenhua ; et al.	2008-11-27
Methods And Apparatus For Using A Rolling Backing Pad For Substrate Polishing App 20080293341 - Kollata; Eashwer ; et al.	2008-11-27
Methods And Apparatus For Using A Bevel Polishing Head With An Efficient Tape Routing Arrangement App 20080293334 - Kollata; Eashwer ; et al.	2008-11-27
Methods And Apparatus For Cleaning A Substrate Edge Using Chemical And Mechanical Polishing App 20080207093 - Ko; Sen-Hou ; et al.	2008-08-28
Polishing Pad Conditioning Process App 20070298689 - Wang; James C. ; et al.	2007-12-27
Methods And Apparatus For Polishing An Edge Of A Substrate App 20070238393 - Shin; Ho Seon ; et al.	2007-10-11
Methods and apparatus for processing a substrate App 20070131654 - Wasinger; Erik C. ; et al.	2007-06-14
Methods and apparatus for processing a substrate App 20070131653 - Ettinger; Gary C. ; et al.	2007-06-14
Method For Conditioning Processing Pads App 20070128992 - BUTTERFIELD; PAUL D. ; et al.	2007-06-07
Conductive polishing article for electrochemical mechanical polishing Grant 7,207,878 - Hu , et al. April 24, 2	2007-04-24
Low Cost And Low Dishing Slurry For Polysilicon Cmp App 20070082833 - Ko; Sen-Hou ; et al.	2007-04-12
Low cost and low dishing slurry for polysilicon CMP Grant 7,199,056 - Ko , et al. April 3, 2	2007-04-03
Apparatus for conditioning processing pads Grant 7,182,680 - Butterfield , et al. February 27, 2	2007-02-27
Method for adjusting substrate processing times in a substrate polishing system Grant 7,175,505 - Ko , et al. February 13, 2	2007-02-13
Profile control platen Grant 7,115,024 - Chen , et al. October 3, 2	2006-10-03
Planarized copper cleaning for reduced defects Grant 7,104,267 - Emami , et al. September 12, 2	2006-09-12
Carrier head with a flexible membrane Grant 7,040,971 - Zuniga , et al. May 9, 2	2006-05-09
Conductive polishing article for electrochemical mechanical polishing Grant 6,991,528 - Hu , et al. January 31, 2	2006-01-31
Apparatus for conditioning processing pads App 20050282477 - Butterfield, Paul D. ; et al.	2005-12-22
Profile control platen App 20050186892 - Chen, Hung Chih ; et al.	2005-08-25
Profile control platen Grant 6,913,518 - Chen , et al. July 5, 2	2005-07-05
Method of controlling carrier head with multiple chambers App 20050142995 - Perlov, Ilya ; et al.	2005-06-30
Conductive polishing article for electrochemical mechanical polishing App 20050133363 - Hu, Yongqi ; et al.	2005-06-23
Method of controlling carrier head with multiple chambers Grant 6,896,584 - Perlov , et al. May 24, 2	2005-05-24
Composite pad assembly for electrochemical mechanical processing (ECMP) App 20050092621 - Hu, Yongqi ; et al.	2005-05-05
Endpoint for electrochemical processing App 20050077188 - Mao, Daxin ; et al.	2005-04-14
Carrier head with a flexure Grant 6,857,946 - Zuniga , et al. February 22, 2	2005-02-22
Carrier head with a flexible membrane App 20050037698 - Zuniga, Steven M. ; et al.	2005-02-17
Polishing pad having a grooved pattern for use in a chemical mechanical polishing apparatus Grant 6,824,455 - Osterheld , et al. November 30, 2	2004-11-30
Profile control platen App 20040224615 - Chen, Hung Chih ; et al.	2004-11-11
Polishing pad having a grooved pattern for use in chemical mechanical polishing apparatus App 20040072516 - Osterheld, Thomas H. ; et al.	2004-04-15
Method of controlling carrier head with multiple chambers App 20040063385 - Perlov, Ilya ; et al.	2004-04-01
Polishing pad having a grooved pattern for use in a chemical mechanical polishing apparatus Grant 6,699,115 - Osterheld , et al. March 2, 2	2004-03-02
Carrier head with a flexible membrane for a chemical mechanical polishing system App 20040033769 - Zuniga, Steven M. ; et al.	2004-02-19
Conductive polishing article for electrochemical mechanical polishing App 20040023610 - Hu, Yongqi ; et al.	2004-02-05
Pad cleaning for a CMP system Grant 6,669,538 - Li , et al. December 30, 2	2003-12-30
Web pad design for chemical mechanical polishing App 20030224678 - Hsu, Wei-Yung ; et al.	2003-12-04
Barrier layer buffing after Cu CMP Grant 6,656,842 - Li , et al. December 2, 2	2003-12-02
Carrier head with a flexible membrane to form multiple chambers Grant 6,648,740 - Perlov , et al. November 18, 2	2003-11-18
Low cost and low dishing slurry for polysilicon CMP App 20030153189 - Ko, Sen-Hou ; et al.	2003-08-14
Polishing pad having a grooved pattern for use in a chemical mechanical polishing apparatus App 20030092371 - Osterheld, Thomas H. ; et al.	2003-05-15
Polishing pad having a grooved pattern for use in chemical mechanical polishing Grant 6,520,847 - Osterheld , et al. February 18, 2	2003-02-18
Carrier head with a flexible membrane to form multiple chambers App 20030022609 - Perlov, Ilya ; et al.	2003-01-30
Carrier head with a flexible membrane Grant 6,506,104 - Perlov , et al. January 14, 2	2003-01-14
Polishing pad having a grooved pattern for use in chemical mechanical polishing apparatus App 20020137450 - Osterheld, Thomas H. ; et al.	2002-09-26
Pad Cleaning for a CMP system App 20020090896 - Li, Shijian ; et al.	2002-07-11
Carrier head with a flexible membrane for a chemical mechanical polishing system App 20020086624 - Zuniga, Steven M. ; et al.	2002-07-04
Carrier head with local pressure control for a chemical mechanical polishing apparatus App 20020072313 - Zuniga, Steven M. ; et al.	2002-06-13
Barrier Layer Buffing After Cu Cmp App 20010055880 - LI, SHIJIAN ; et al.	2001-12-27
Carrier head with a flexible membrane for a chemical mechanical polishing system App 20010041526 - Perlov, Ilya ; et al.	2001-11-15
Planarized copper cleaning for reduced defects App 20010015345 - Emami, Ramin ; et al.	2001-08-23
Carrier head with a flexible membrane for a chemical mechanical polishing system App 20010000775 - Zuniga, Steven M. ; et al.	2001-05-03
Carrier head with a flexible membrane for a chemical mechanical polishing system Grant 6,183,354 - Zuniga , et al. February 6, 2	2001-02-06
Carrier head with local pressure control for a chemical mechanical polishing apparatus Grant 6,146,259 - Zuniga , et al. November 14, 2	2000-11-14
Carrier head with a flexible membrane for a chemical mechanical polishing system Grant 6,106,378 - Perlov , et al. August 22, 2	2000-08-22
Carrier head with a flexible membrane for a chemical mechanical polishing system Grant 5,964,653 - Perlov , et al. October 12, 1	1999-10-12
Linear conditioner apparatus for a chemical mechanical polishing system Grant 5,938,507 - Ko , et al. August 17, 1	1999-08-17
Polishing pad having a grooved pattern for use in a chemical mechanical polishing system Grant 5,921,855 - Osterheld , et al. July 13, 1	1999-07-13
Method and apparatus for using a retaining ring to control the edge effect Grant 5,795,215 - Guthrie , et al. August 18, 1	1998-08-18

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