Patent | Date |
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Methods and apparatus for post-chemical mechanical planarization substrate cleaning Grant 9,711,381 - Ko , et al. July 18, 2 | 2017-07-18 |
Disk-brush cleaner module with fluid jet Grant 9,646,859 - Chen , et al. May 9, 2 | 2017-05-09 |
Design Of Disk/pad Clean With Wafer And Wafer Edge/bevel Clean Module For Chemical Mechanical Polishing App 20170040160 - CHEN; Hui ;   et al. | 2017-02-09 |
Disk/pad clean with wafer and wafer edge/bevel clean module for chemical mechanical polishing Grant 9,508,575 - Chen , et al. November 29, 2 | 2016-11-29 |
Apparatus And Methods For Brush And Pad Conditioning App 20140360976 - KO; Sen-Hou ;   et al. | 2014-12-11 |
Disk/pad Clean With Wafer And Wafer Edge/bevel Clean Module For Chemical Mechanical Polishing App 20140261539 - CHEN; Hui ;   et al. | 2014-09-18 |
Apparatus and methods for brush and pad conditioning Grant 8,813,293 - Ko , et al. August 26, 2 | 2014-08-26 |
Methods And Apparatus For Post-chemical Mechanical Planarization Substrate Cleaning App 20140209239 - Ko; Sen-Hou ;   et al. | 2014-07-31 |
Polishing pad conditioner Grant 8,550,879 - Chen , et al. October 8, 2 | 2013-10-08 |
Apparatus And Methods For Brush And Pad Conditioning App 20130247314 - KO; Sen-Hou ;   et al. | 2013-09-26 |
Conditioning A Pad In A Cleaning Module App 20130196572 - Ko; Sen-Hou ;   et al. | 2013-08-01 |
Cleaning Module And Process For Particle Reduction App 20130185884 - Ko; Sen-Hou ;   et al. | 2013-07-25 |
Apparatus and methods for brush and pad conditioning Grant 8,458,843 - Ko , et al. June 11, 2 | 2013-06-11 |
Semiconductor Substrate Cleaning Apparatus, Systems, And Methods App 20130098395 - Ding; Yunshuang ;   et al. | 2013-04-25 |
Methods and apparatus for removal of films and flakes from the edge of both sides of a substrate using backing pads Grant 8,142,260 - Kollata , et al. March 27, 2 | 2012-03-27 |
Methods and apparatus for measuring substrate edge thickness during polishing Grant 8,125,654 - Benvegnu , et al. February 28, 2 | 2012-02-28 |
Disk-brush Cleaner Module With Fluid Jet App 20110265816 - Chen; Hui ;   et al. | 2011-11-03 |
Methods and apparatus for processing a substrate Grant 7,993,485 - Wasinger , et al. August 9, 2 | 2011-08-09 |
Apparatus And Methods For Brush And Pad Conditioning App 20110094537 - Ko; Sen-Hou ;   et al. | 2011-04-28 |
Apparatus for conditioning processing pads Grant 7,828,626 - Butterfield , et al. November 9, 2 | 2010-11-09 |
Polishing pad conditioning process Grant 7,749,048 - Wang , et al. July 6, 2 | 2010-07-06 |
Polishing Pad Conditioner App 20100105302 - Chen; Hung Chih ;   et al. | 2010-04-29 |
Methods And Apparatus For Polishing A Notch Of A Substrate App 20100105291 - Ettinger; Gary C. ;   et al. | 2010-04-29 |
Methods And Apparatus For Polishing An Edge And/or Notch Of A Substrate App 20100105299 - Ettinger; Gary C. ;   et al. | 2010-04-29 |
Method for conditioning processing pads Grant 7,666,061 - Butterfield , et al. February 23, 2 | 2010-02-23 |
Methods And Apparatus For Measuring Substrate Edge Thickness During Polishing App 20090262353 - Benvegnu; Dominic J. ;   et al. | 2009-10-22 |
Apparatus For Conditioning Processing Pads App 20090036037 - Butterfield; Paul D. ;   et al. | 2009-02-05 |
Methods And Apparatus For Polishing An Edge Of A Substrate App 20090036042 - Shin; Ho Seon ;   et al. | 2009-02-05 |
Methods And Apparatus For Processing A Substrate App 20090036033 - Wasinger; Erik C. ;   et al. | 2009-02-05 |
Methods And Apparatus For Polishing An Edge Of A Substrate App 20090029629 - Shin; Ho Seon ;   et al. | 2009-01-29 |
Methods And Apparatus For Processing A Substrate App 20090017731 - Ettinger; Gary C. ;   et al. | 2009-01-15 |
Methods And Apparatus For Removal Of Films And Flakes From The Edge Of Both Sides Of A Substrate Using Backing Pads App 20080293340 - Kollata; Eashwer ;   et al. | 2008-11-27 |
Methods And Apparatus For Low Cost And High Performance Polishing Tape For Substrate Bevel And Edge Polishing In Seminconductor Manufacturing App 20080293331 - Chen; Yufei ;   et al. | 2008-11-27 |
Methods And Apparatus To Control Substrate Bevel And Edge Polishing Profiles Of Films App 20080293336 - Zhang; Zhenhua ;   et al. | 2008-11-27 |
Methods And Apparatus For Controlling The Size Of An Edge Exclusion Zone Of A Substrate App 20080293333 - Zhang; Zhenhua ;   et al. | 2008-11-27 |
Methods And Apparatus For Polishing A Notch Of A Substrate By Substrate Vibration App 20080293337 - Zhang; Zhenhua ;   et al. | 2008-11-27 |
Methods And Apparatus For Using A Rolling Backing Pad For Substrate Polishing App 20080293341 - Kollata; Eashwer ;   et al. | 2008-11-27 |
Methods And Apparatus For Using A Bevel Polishing Head With An Efficient Tape Routing Arrangement App 20080293334 - Kollata; Eashwer ;   et al. | 2008-11-27 |
Methods And Apparatus For Cleaning A Substrate Edge Using Chemical And Mechanical Polishing App 20080207093 - Ko; Sen-Hou ;   et al. | 2008-08-28 |
Polishing Pad Conditioning Process App 20070298689 - Wang; James C. ;   et al. | 2007-12-27 |
Methods And Apparatus For Polishing An Edge Of A Substrate App 20070238393 - Shin; Ho Seon ;   et al. | 2007-10-11 |
Methods and apparatus for processing a substrate App 20070131654 - Wasinger; Erik C. ;   et al. | 2007-06-14 |
Methods and apparatus for processing a substrate App 20070131653 - Ettinger; Gary C. ;   et al. | 2007-06-14 |
Method For Conditioning Processing Pads App 20070128992 - BUTTERFIELD; PAUL D. ;   et al. | 2007-06-07 |
Conductive polishing article for electrochemical mechanical polishing Grant 7,207,878 - Hu , et al. April 24, 2 | 2007-04-24 |
Low Cost And Low Dishing Slurry For Polysilicon Cmp App 20070082833 - Ko; Sen-Hou ;   et al. | 2007-04-12 |
Low cost and low dishing slurry for polysilicon CMP Grant 7,199,056 - Ko , et al. April 3, 2 | 2007-04-03 |
Apparatus for conditioning processing pads Grant 7,182,680 - Butterfield , et al. February 27, 2 | 2007-02-27 |
Method for adjusting substrate processing times in a substrate polishing system Grant 7,175,505 - Ko , et al. February 13, 2 | 2007-02-13 |
Profile control platen Grant 7,115,024 - Chen , et al. October 3, 2 | 2006-10-03 |
Planarized copper cleaning for reduced defects Grant 7,104,267 - Emami , et al. September 12, 2 | 2006-09-12 |
Carrier head with a flexible membrane Grant 7,040,971 - Zuniga , et al. May 9, 2 | 2006-05-09 |
Conductive polishing article for electrochemical mechanical polishing Grant 6,991,528 - Hu , et al. January 31, 2 | 2006-01-31 |
Apparatus for conditioning processing pads App 20050282477 - Butterfield, Paul D. ;   et al. | 2005-12-22 |
Profile control platen App 20050186892 - Chen, Hung Chih ;   et al. | 2005-08-25 |
Profile control platen Grant 6,913,518 - Chen , et al. July 5, 2 | 2005-07-05 |
Method of controlling carrier head with multiple chambers App 20050142995 - Perlov, Ilya ;   et al. | 2005-06-30 |
Conductive polishing article for electrochemical mechanical polishing App 20050133363 - Hu, Yongqi ;   et al. | 2005-06-23 |
Method of controlling carrier head with multiple chambers Grant 6,896,584 - Perlov , et al. May 24, 2 | 2005-05-24 |
Composite pad assembly for electrochemical mechanical processing (ECMP) App 20050092621 - Hu, Yongqi ;   et al. | 2005-05-05 |
Endpoint for electrochemical processing App 20050077188 - Mao, Daxin ;   et al. | 2005-04-14 |
Carrier head with a flexure Grant 6,857,946 - Zuniga , et al. February 22, 2 | 2005-02-22 |
Carrier head with a flexible membrane App 20050037698 - Zuniga, Steven M. ;   et al. | 2005-02-17 |
Polishing pad having a grooved pattern for use in a chemical mechanical polishing apparatus Grant 6,824,455 - Osterheld , et al. November 30, 2 | 2004-11-30 |
Profile control platen App 20040224615 - Chen, Hung Chih ;   et al. | 2004-11-11 |
Polishing pad having a grooved pattern for use in chemical mechanical polishing apparatus App 20040072516 - Osterheld, Thomas H. ;   et al. | 2004-04-15 |
Method of controlling carrier head with multiple chambers App 20040063385 - Perlov, Ilya ;   et al. | 2004-04-01 |
Polishing pad having a grooved pattern for use in a chemical mechanical polishing apparatus Grant 6,699,115 - Osterheld , et al. March 2, 2 | 2004-03-02 |
Carrier head with a flexible membrane for a chemical mechanical polishing system App 20040033769 - Zuniga, Steven M. ;   et al. | 2004-02-19 |
Conductive polishing article for electrochemical mechanical polishing App 20040023610 - Hu, Yongqi ;   et al. | 2004-02-05 |
Pad cleaning for a CMP system Grant 6,669,538 - Li , et al. December 30, 2 | 2003-12-30 |
Web pad design for chemical mechanical polishing App 20030224678 - Hsu, Wei-Yung ;   et al. | 2003-12-04 |
Barrier layer buffing after Cu CMP Grant 6,656,842 - Li , et al. December 2, 2 | 2003-12-02 |
Carrier head with a flexible membrane to form multiple chambers Grant 6,648,740 - Perlov , et al. November 18, 2 | 2003-11-18 |
Low cost and low dishing slurry for polysilicon CMP App 20030153189 - Ko, Sen-Hou ;   et al. | 2003-08-14 |
Polishing pad having a grooved pattern for use in a chemical mechanical polishing apparatus App 20030092371 - Osterheld, Thomas H. ;   et al. | 2003-05-15 |
Polishing pad having a grooved pattern for use in chemical mechanical polishing Grant 6,520,847 - Osterheld , et al. February 18, 2 | 2003-02-18 |
Carrier head with a flexible membrane to form multiple chambers App 20030022609 - Perlov, Ilya ;   et al. | 2003-01-30 |
Carrier head with a flexible membrane Grant 6,506,104 - Perlov , et al. January 14, 2 | 2003-01-14 |
Polishing pad having a grooved pattern for use in chemical mechanical polishing apparatus App 20020137450 - Osterheld, Thomas H. ;   et al. | 2002-09-26 |
Pad Cleaning for a CMP system App 20020090896 - Li, Shijian ;   et al. | 2002-07-11 |
Carrier head with a flexible membrane for a chemical mechanical polishing system App 20020086624 - Zuniga, Steven M. ;   et al. | 2002-07-04 |
Carrier head with local pressure control for a chemical mechanical polishing apparatus App 20020072313 - Zuniga, Steven M. ;   et al. | 2002-06-13 |
Barrier Layer Buffing After Cu Cmp App 20010055880 - LI, SHIJIAN ;   et al. | 2001-12-27 |
Carrier head with a flexible membrane for a chemical mechanical polishing system App 20010041526 - Perlov, Ilya ;   et al. | 2001-11-15 |
Planarized copper cleaning for reduced defects App 20010015345 - Emami, Ramin ;   et al. | 2001-08-23 |
Carrier head with a flexible membrane for a chemical mechanical polishing system App 20010000775 - Zuniga, Steven M. ;   et al. | 2001-05-03 |
Carrier head with a flexible membrane for a chemical mechanical polishing system Grant 6,183,354 - Zuniga , et al. February 6, 2 | 2001-02-06 |
Carrier head with local pressure control for a chemical mechanical polishing apparatus Grant 6,146,259 - Zuniga , et al. November 14, 2 | 2000-11-14 |
Carrier head with a flexible membrane for a chemical mechanical polishing system Grant 6,106,378 - Perlov , et al. August 22, 2 | 2000-08-22 |
Carrier head with a flexible membrane for a chemical mechanical polishing system Grant 5,964,653 - Perlov , et al. October 12, 1 | 1999-10-12 |
Linear conditioner apparatus for a chemical mechanical polishing system Grant 5,938,507 - Ko , et al. August 17, 1 | 1999-08-17 |
Polishing pad having a grooved pattern for use in a chemical mechanical polishing system Grant 5,921,855 - Osterheld , et al. July 13, 1 | 1999-07-13 |
Method and apparatus for using a retaining ring to control the edge effect Grant 5,795,215 - Guthrie , et al. August 18, 1 | 1998-08-18 |