U.S. patent application number 12/626799 was filed with the patent office on 2010-03-18 for component supply head device and component mounting head device.
Invention is credited to Shuichi HIRATA, Hironori KOBAYASHI, Makoto MORIKAWA, Shoriki NARITA, Satoshi SHIDA, Yasuharu UENO.
Application Number | 20100064510 12/626799 |
Document ID | / |
Family ID | 35394559 |
Filed Date | 2010-03-18 |
United States Patent
Application |
20100064510 |
Kind Code |
A1 |
NARITA; Shoriki ; et
al. |
March 18, 2010 |
COMPONENT SUPPLY HEAD DEVICE AND COMPONENT MOUNTING HEAD DEVICE
Abstract
A suction nozzle (65) of a reversing head device (22) has a
distal end surface (65a) with a suction hole (65b) opened therein,
and a suction passage (65c) communicated with the suction hole
(65b) at one end thereof. A portion of the distal end surface (65a)
outside of the suction hole (65b) abuts against bumps (39) of an
electronic component (12). The suction hole (65b) is opposed with a
gap to a portion of a mounting side surface (12a) where no bumps
(39) are present. A vacuum pump (65) creates an air flow that flows
from the gap between the suction hole (65b) and the mounting side
surface (12a) into the suction passage (65c) through the suction
hole (65b). The electronic component (12) is held at the distal end
surface (65a) by a negative pressure generated by the air flow.
Inventors: |
NARITA; Shoriki; (Osaka,
JP) ; SHIDA; Satoshi; (Osaka, JP) ; UENO;
Yasuharu; (Osaka, JP) ; MORIKAWA; Makoto;
(Osaka, JP) ; KOBAYASHI; Hironori; (Osaka, JP)
; HIRATA; Shuichi; (Osaka, JP) |
Correspondence
Address: |
WENDEROTH, LIND & PONACK L.L.P.
1030 15th Street, N.W., Suite 400 East
Washington
DC
20005-1503
US
|
Family ID: |
35394559 |
Appl. No.: |
12/626799 |
Filed: |
November 27, 2009 |
Related U.S. Patent Documents
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Application
Number |
Filing Date |
Patent Number |
|
|
11596577 |
Apr 16, 2007 |
7650691 |
|
|
PCT/JP2005/008902 |
May 16, 2005 |
|
|
|
12626799 |
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|
Current U.S.
Class: |
29/739 |
Current CPC
Class: |
Y10T 29/53191 20150115;
H01L 21/67144 20130101; Y10T 29/49128 20150115; Y10T 29/53178
20150115; Y10T 29/53174 20150115; H01L 2924/01087 20130101; H01L
2224/75 20130101; H01L 2224/75743 20130101; H01L 21/6838 20130101;
Y10T 29/4913 20150115; H01L 21/67132 20130101 |
Class at
Publication: |
29/739 |
International
Class: |
B23P 19/00 20060101
B23P019/00 |
Foreign Application Data
Date |
Code |
Application Number |
May 17, 2004 |
JP |
2004-146075 |
Jun 4, 2004 |
JP |
2004-167117 |
Claims
1. A component supply head device for holding a component at a
mounting side surface with protruding electrodes to be mounted on a
substrate, and reversing an orientation of the mounting side
surface of the component to transfer the component to a component
mounting head device so that the component mounting head device
mounts the component onto the substrate, comprising: a suction
nozzle provided with a distal end surface where a suction hole is
opened and a suction passage communicated with the suction hole at
one end thereof, wherein a portion of the distal end surface
outside the suction hole abuts against the protruding electrodes of
the component, wherein the suction holes is opposed with a gap to a
portion of the mounding side surface on which the protruding
electrodes are not provided, and wherein an air flow is generated
by vacuum suction force acting from the other end of the suction
passage, the air flow flowing from the gap between the suction hole
and the mounting side surface into the suction passage through the
suction hole and generating a negative pressure to hold the
component at the distal end surface.
2. The component supply head device according to claim 1, wherein
the suction hole comprises a center section communicated with the
suction passage and a plurality of branch sections extending
radially from the center section.
3. The component supply head device according to claim 1, wherein
an outer dimension of the distal end surface is set so that an
outer peripheral edge of the distal end surface is positioned
inside a peripheral edge of the component held by the suction
nozzle and outside the protruding electrodes.
4. A component supply apparatus, comprising: the component supply
head device according to claim 1; a component disposing section
where a plurality of components are disposed so that they can be
taken out by the suction nozzle; and a component supply and
accommodation section for accommodating the components so that they
can be disposed in the component disposing section.
5. A component mounting apparatus, comprising: the component supply
apparatus according to claim 4; the component mounting head device
for releasably holding the component; a substrate holding section
for releasably holding the substrate; and a alignment device for
aligning the substrate held by the substrate holding section and
the component held by the component mounting head device.
6. A component mounting head device for holding a component at a
non-mounting side surface opposite to a mounting side surface where
a plurality of protruding electrodes are provided, and joining the
protruding electrodes to corresponding substrate electrodes formed
on a substrate to mount the component on the substrate, comprising:
a heater for heating the component; and a suction nozzle comprising
a distal end surface where a suction hole is opened and a suction
groove communicated with the suction hole is formed in an entire
area corresponding to a joining area of the mounting side surface
of the component where the protruding electrodes are provided, a
proximal end surface opposite to the distal end surface abutting
against the heater, and a suction passage communicated with the
suction hole at one end thereof, wherein the component is held at
the distal end surface by a vacuum suction force acting from the
other end of the suction passage.
7. The component mounting head device according to claim 6, wherein
the suction groove comprises: a closed pattern section disposed
along a peripheral edge of the distal end surface; a plurality of
first line sections disposed inside the closed pattern section so
as to extend in a first direction and communicated with the closed
pattern section at both ends thereof; and a plurality of second
line sections disposed inside the closed pattern so as to extend in
a direction crossing the first direction, communicated with the
closed pattern section at both ends thereof, and communicated with
the first line sections intersecting therewith.
8. The component mounting head device according to claim 6, wherein
the suction groove comprises: a plurality of first line sections
disposed so as to extend in a first direction; and a plurality of
second sections disposed so as to extend in a second direction
crossing the first direction and communicated with the first line
sections intersecting therewith.
9. The component mounting head device according to claim 6, wherein
the suction groove comprises: at least one closed pattern section
disposed so as to surround a center of the area of the distal end
surface corresponding to the joining area; and a plurality of line
sections extending radially from the center of the area of the
distal end surface corresponding to the joining area and
communicated with the closed pattern section intersecting
therewith.
10. The component mounting head device according to claim 9,
wherein the suction groove comprises a plurality of the closed
pattern sections disposed concentrically with respect to the center
of the area of the distal end surface corresponding to the joining
area.
11. The component mounting head device according to claim 6,
wherein the suction groove has a form of a single continuous
line.
12. The component mounting head device according to claim 11,
wherein the suction groove has a form of a spiral constituted by
joining a plurality of line sections respectively extending in
substantially the same directions to respective portions of the
peripheral edge of the distal end surface.
13. The component mounting head device according to claim 11,
wherein the suction groove has a rectangular wave-like shape
comprising alternately connected first straight line sections
extending in a first direction and second straight line sections
extending in a direction crossing the first direction.
14. The component mounting head device according to claim 6,
wherein the suction nozzle further comprises a recess formed in the
distal end surface and separated from the suction hole.
15. The component mounting head device according to claim 14,
wherein the recess is disposed between the suction groove and the
peripheral edge of the distal end surface.
16. The component mounting head device according to claim 15,
wherein the recess has a form of a closed pattern.
17. A component mounting apparatus comprising: the component
mounting head device according to claim 6; a component supply
apparatus for supplying the component to the component mounting
head device; a substrate holding section for releasably holding the
substrate; and a alignment device for aligning the substrate held
by the substrate holding section and the component held by the
component mounting head device.
Description
[0001] This is a divisional application of Ser. No. 11/596,577,
which is the National Stage of International Application No.
PCT/JP2005/008902, filed May 16, 2005.
BACKGROUND OF THE INVENTION
[0002] 1. Technical Field
[0003] The present invention relates to a component supply head
device for holding a component at a mounting side surface to be
mounted on a substrate at a take-out position, moving to a transfer
position, and transferring the component to a mounting head device
at the transfer position after reversing an orientation of the
mounting side surface. Further, the present invention relates to a
component mounting head device for holding a component at a
non-mounting surface opposite to a mounting side surface to be
mounted on a substrate, mounting the mounting side surface onto the
substrate.
[0004] 2. Description of the Related Art
[0005] As disclosed in Japanese Patent Application Laid-open
Publication No. 8-37395, the above-described component supply head
device comprises a suction nozzle for holding a component. The
suction nozzle of the conventional component supply head device
will be described with reference to FIGS. 25A and 25B. As shown in
FIGS. 25A and 25B, bumps 2 are formed on a mounting side surface 1a
of an electronic component 1. A suction nozzle shown 3 in FIG. 25A
has a profile of a distal end surface 3a set smaller than a space
between the bumps 2. A distal end surface 3a of the suction nozzle
3 tightly contacts with an area of the mounting side surface 1a
where the bumps 2 are not arranged, and the electronic component 1
is held at the distal end surface 3a of the suction nozzle 3 by a
suction force (negative pressure) of a vacuum source (not shown)
acting on a suction hole 3c through a suction passage 3b. On the
other hand, the suction nozzle 4 shown in FIG. 25B comprises a
pyramidal suction hole 4b on a distal end surface 4a, and walls of
the suction hole 4b contacts with a peripheral edge of the
electronic component 1. While the mounting side surface 1a and
bumps 2 are not in direct contact with the walls of the suction
hole 4b, the electronic component 1 is held at the distal end of
the suction nozzle 4 by a suction force of a vacuum source (not
shown).
[0006] However, in the suction nozzle 3 shown in FIG. 25A,
deformation such as warping occurs in the electronic component 1
under the effect of excess suction force acting on a portion (which
is in contact with the distal end surface 3a) of the mounting side
surface 1a, resulting in that the accuracy of holding the
electronic component 1 by the suction nozzle 3 is decreased. The
low accuracy of holding the electronic component by the suction
nozzle 3 decreases the accuracy of transferring the electronic
component 1 from the component supply head device to the mounting
head device, and thereby causes a decrease in the component
mounting accuracy. Further, in the suction nozzle 4 shown in FIG.
25B, because the walls of the suction hole 4b are brought into
contact with the peripheral edge of the electronic component 1, an
outer size of the distal end surface 4a has to be set larger than
the outer size of the electronic component 1. Thus, in the case
where the electronic components 1 are supplied in a state of being
accommodated in concave sections formed in a tray, the distal end
surface 4a of the suction nozzle 4 may interfere with the concave
sections. This interference also decreases the accuracy of holding
the electronic component 1 by the suction nozzle 4.
[0007] As disclosed in Japanese Patent Application Laid-open
Publication No. 2003-297878, the above-described component mounting
head device also comprises a suction nozzle for sucking and holding
a component. An example of the suction nozzle of the conventional
component mounting head device will be described below with
reference to FIG. 26. A suction hole 218b is formed in a distal end
surface 218a of the suction nozzle 218. The distal end surface 218a
of the suction nozzle 218 tightly contacts with a surface
(non-mounting side surface 1b) opposite to a mounting side surface
1a of the electronic component 1, and the electronic component 1 is
held at the distal end surface 218a of the suction nozzle 218 by a
suction forte (static pressure) of a vacuum source (not shown)
acting in the suction hole 218b through a suction passage 218c. A
temperature-adjustable heater 217 is attached to a rear side of the
suction nozzle 218. According to a flip chip method such as a
solder bump local reflow, C4 (Controlled Collapse Chip Connection),
joining using an ACF (Anisotropic Conductive Film), or joining
using a NCP (Non Conductive Paste), the electronic component 1 held
by the suction nozzle 218 is mounted onto substrate 219 generally
by following process. First, the suction nozzle 118 is moved above
the substrate 219 and aligned with respect to the substrate 219 so
that substrate electrodes 220 formed on the substrate 219 and the
bumps 2 of the electronic component 1 correspond to each other.
Then, the suction nozzle 118 is lowered so that the bumps 2 are
pressed against the substrate electrodes 220. Further, heat
generated by the heater 117 is transferred to the electronic
component 1 through the suction nozzle 118, thereby heating the
bumps 2. The bumps 2 and substrate electrodes 220 are joined by the
pressing and heating, and the electronic component 1 is mounted
onto the substrate 219.
[0008] In the above-described mounting process, the electronic
component 1 has to be heated so as to obtain a uniform temperature
distribution in the area of the mounting side surface 1a of the
electronic component 1 where the bumps 2 are formed (joining area).
The nonuniform temperature distribution in the joining area causes
non-uniform heating of the plurality of bumps 2, resulting in that
the joining state of respective bumps 2 and substrate electrodes
220 corresponding thereto becomes random or nonuniform. As a
result, joining defects occur between the electronic component 1
and the substrate 219. In the suction nozzle 118 shown in FIG. 26,
the suction force from the suction hole 118c acts only upon a part
of the joining area. In other words, the entire non-mounting
surface 1b of the electronic component 1 is not attached tightly
and uniformly to the suction nozzle 118. As a result, relatively
large warping occurs in the electronic component 1 held by the
suction nozzle 118. For example, in the case of an electronic
component of square shape with a side of about 10 mm and a
thickness of about 0.1 mm, the warping is about 14 .mu.m. Because
of the relatively large warping, the temperature distribution in
the joining area becomes nonuniform, causing joining defects
between the electronic component 1 and substrate 219.
SUMMARY OF THE INVENTION
[0009] It is an object of the present invention to provide a
component supply head device capable of holding a component
reliably and with a high degree of accuracy. It is another object
of the present invention to provide a component mounting head
device capable of heating the element so as to obtain a uniform
temperature distribution in the joining area.
[0010] A first aspect of the invention relates to a component
supply head device for holding a component at a mounting side
surface with protruding electrodes to be mounted on a substrate,
and reversing an orientation of the mounting side surface of the
component to transfer the component to a component mounting head
device so that the component mounting head device mounts the
component onto the substrate. The component supply head device
comprises a suction nozzle provided with a distal end surface where
a suction hole is opened and a suction passage communicated with
the suction hole at one end thereof. A portion of the distal end
surface outside the suction hole abuts against the protruding
electrode of the component. The suction hole is opposed with a gap
to a portion of the mounting side surface on which the protruding
electrodes are not provided. An air flow is generated by vacuum
suction force acting from the other end of the suction passage. The
air flow flows from the gap between the suction hole and the
mounting side surface into the suction passage through the suction
hole and generates a negative pressure to hold the component at the
distal end surface.
[0011] The portion of the distal end surface of the suction nozzle
outside the suction holes abuts against bumps, and the suction hole
is opposed to the portion of mounting side surface on which the
bumps do not exist. The air flow flowing into the suction passage
from the gap through the suction hole is generated. The negative
pressure (dynamic pressure) generated by the air flow holds the
component at the suction nozzle. In other words, the suction nozzle
of the component supply head device holds the component in a state
where the distal end surface of the suction nozzle is not in
contact with the mounting side surface. Therefore, a suction force
uniformly acts upon the entire mounting side surface and the
component can be held at the suction nozzle with a high degree of
accuracy, without causing deformation of the component, such as
warping, by an excess suction force. As a result, the accuracy of
transferring the component from the component supply head device to
the mounting head unit can be enhanced.
[0012] The suction hole comprises a center section communicated
with the suction passage and a plurality of branch sections
extending radially from the center section. The shape of the
suction hole increases the uniformity of the suction force created
by the negative pressure generated in the gap between the suction
hole and the mounting side surface, thereby enhancing the accuracy
of holding the component with the suction nozzle.
[0013] An outer dimension of the distal end surface is preferably
set so that an outer peripheral edge of the distal end surface is
positioned inside a peripheral edge of the component held by the
suction nozzle and outside the protruding electrodes. Because the
outer peripheral edge of the distal end surface of the suction
nozzle is positioned on the inside of the peripheral edge of the
component, when a component accommodated in a concave section of a
tray is sucked and held, the suction nozzle can be prevented from
interfering with wall surfaces constituting the concavity. Further,
because the outer peripheral edge of the distal end surface of the
suction nozzle is positioned outside the bumps, the bumps can be
reliably abutted against the distal end surface in the portion
outside the suction hole. Therefore, the component can be reliably
held at the suction nozzle by the negative pressure generated in
the gap between the suction hole and the mounting side surface.
[0014] A second aspect of the invention relates to a component
mounting head device for holding a component at a non-mounting side
surface opposite to a mounting side surface where a plurality of
protruding electrodes are provided, and joining the protruding
electrodes to corresponding substrate electrodes formed on a
substrate to mount the component on the substrate. The component
mounting head device comprises a heater for heating the component
and a suction nozzle. The suction nozzle comprises a distal end
surface where a suction hole is opened and a suction groove
communicated with the suction hole is formed in an entire area
corresponding to a joining area of the mounting side surface of the
component where the protruding electrodes are provided, a proximal
end surface opposite to the distal end surface abutting against the
heater, and a suction passage communicated with the suction hole at
one end thereof. The component is held at the distal end surface by
a vacuum suction force acting from the other end of the suction
passage.
[0015] Because the suction groove connected to the suction hole is
formed in the entire area corresponding to the joining area of the
component, the entire area of the non-mounting side surface of the
component corresponding to the joining area is lightly sucked and
held to the distal end surface of the suction nozzle by the suction
force acting in the suction hole and suction groove. In other
words, the component is sucked and held by the suction nozzle in a
state where the component has a high degree of flatness, and
warping of the component is substantially reduced. For example, in
the case of a component of square shape with a size of about 10 mm
and a thickness of about 0.1 mm, the warping is only about 5 .mu.m.
Because the component is tightly sucked and held to the suction
nozzle in a state where the component has a high degree of
flatness, the heat generated by the heater is uniformly transferred
to the entire joining area of the component. As a result, the
temperature distribution in the joining area becomes more uniform
and the protruding electrodes are heated uniformly. Therefore, the
plurality of protruding electrodes can be joined to the substrate
electrodes in a uniform joining state.
[0016] The suction groove may be provided, in addition to the area
corresponding to the joining area, outside the area corresponding
to the joining area, that is, between the area and the peripheral
edge of the suction nozzle.
[0017] The arrangement, dimensions, and shape of the suction groove
are set so that a non-mounting side surface of the component is
sucked and held to the distal end surface of the suction nozzle
with a high degree of flatness according to such factors as the
shape, dimensions including thickness, and material of the
component.
[0018] The suction groove may be a combination of frame portions
and lattice-like portions. More specifically, the suction groove
comprises one closed pattern section disposed along the peripheral
edge of the distal end surface, a plurality of first line sections
disposed inside the closed pattern section so as to extend in a
first direction and be communicated with the closed pattern section
at both ends thereof, and a plurality of second line sections
disposed inside the closed pattern to as to extend in a direction
crossing the first direction and communicated with the first line
sections intersecting therewith. The closed pattern section may be
polygonal, e.g., quadrangular. Further, the closed pattern section
may be in the form of a closed curve such as a circle or an
ellipse. The first and second line sections may be straight lines,
curved lines such as wavy lines, or polygonal lines.
[0019] As an alternative, the suction groove as a whole may have a
lattice-like shape. Specifically, the suction groove comprises a
plurality of first line sections disposed so as to extend in a
first direction, and a plurality of second sections disposed so as
to extend in a second direction crossing the first direction and
communicated with the first line sections intersecting
therewith.
[0020] As another alternative, the suction groove may comprise at
least one closed pattern section disposed so as to surround a
center of the area of the distal end surface corresponding to the
joining area, and a plurality of line sections extending radially
from the center of the area of the distal end surface corresponding
to the joining area and communicated with the closed pattern
section intersecting therewith. As described above, the closed
pattern section may be polygonal, e.g., quadrangular. Further, the
closed pattern section may be in a form of a closed curve such as a
circle or an ellipse. The first and second line sections may be
straight lines, curved lines such as wavy lines, or polygonal
lines.
[0021] As yet another alternative, the suction groove can have the
form of a single continuous line. Specifically the suction groove
may be in the form of a spiral line or may have a rectangular
wave-like shape.
[0022] The suction nozzle may comprise a recess formed in the
distal end surface and separated from the suction hole. The recess
is preferably disposed between the suction groove and the
peripheral edge of the distal end surface. Even if the air is
introduced from a very minute gap between the peripheral edge of
the distal end surface of the suction nozzle and the electronic
component sucked and held by the suction nozzle, the introduced air
is heated while passing through the recess. As a result, the region
of the distal end surface of the suction nozzle corresponding to
the joining surface is prevented from being cooled by the air
introduced from the gap. Therefore, providing the recess further
improves the uniformity of temperature distribution in the joining
area of the component held by the suction nozzle.
[0023] According to the suction nozzle of the component supply head
device of the first aspect of the invention, the portion of the
distal end surface outside the suction hole abuts against the bumps
of the component, whereas the suction hole is opposed to the
portion of the mounting side face of the component on which the
protruding electrodes are not formed with the gap. This arrangement
enables the suction nozzle to hold the component without causing
deformation such as warping. Further, when the outer dimension of
the distal end surface is set so that the outer peripheral edge of
the distal end surface is positioned inside the peripheral edge of
the component and outside the protruding electrodes, the distal end
of the suction nozzle can be prevented from interfering with the
wall surfaces constituting the concavity of the tray in which the
component is accommodated. Therefore, the holding accuracy of the
component by the suction nozzle is increased and the accuracy of
transferring the component to the mounting head device and the
component mounting accuracy can be increased. Therefore, accuracy
of holding the component by the suction nozzle is enhanced,
resulting in increased accuracies of transferring the component to
the mounting head device and of mounting the component.
[0024] According to the second aspect of the invention, the suction
groove connected to the suction hole is formed in the entire area
corresponding to the joining area of the component in the distal
end surface of the suction nozzle of the component mounting head
device. This arrangement assures that the entire area of the
non-mounting side surface of the component corresponding to the
joining area is tightly sucked and held to the distal end surface
of the suction nozzle and the component is sucked and held by the
suction nozzle with a high degree of flatness. This results in the
uniform temperature distribution in the joining area of the
component, which causes the protruding electrodes to be heated
uniformly. Therefore, the plurality of protruding electrodes can be
joined to the substrate electrodes in the uniform joining
state.
BRIEF DESCRIPTION OF THE DRAWINGS
[0025] FIG. 1 is a perspective view illustrating a component
mounting apparatus of an embodiment of the present invention;
[0026] FIG. 2 is a schematic partial perspective view of the
component mounting apparatus shown in FIG. 1;
[0027] FIG. 3 is a schematic partial front view of the component
mounting apparatus shown in FIG. 1;
[0028] FIG. 4 is a semitransparent perspective view illustrating a
component supply apparatus in the component mounting apparatus
shown in FIG. 1;
[0029] FIG. 5 is a perspective view illustrating a wafer supply
plate;
[0030] FIG. 6 is a perspective view illustrating a tray supply
plate;
[0031] FIG. 7 is a partially enlarged perspective view of the tray
shown in FIG. 6;
[0032] FIG. 8 is a schematic cross-sectional view illustrating a
plate disposing device in the component mounting apparatus shown in
FIG. 1;
[0033] FIG. 9 is a schematic cross-sectional view illustrating a
plate disposing device in the component mounting apparatus shown in
FIG. 1;
[0034] FIG. 10 is a perspective view illustrating a component
ejecting device in the component mounting apparatus shown in FIG.
1;
[0035] FIG. 11 is an exploded perspective view illustrating the
component ejecting device in the component mounting apparatus shown
in FIG. 1;
[0036] FIG. 12 is a partial perspective view illustrating an
ejecting head of the component ejecting device in the component
mounting apparatus shown in FIG. 1;
[0037] FIG. 13 is a partial perspective view illustrating an
internal structure of the ejecting head shown in FIG. 12;
[0038] FIG. 14 is a schematic cross-sectional view illustrating the
plate disposing device and the component ejecting device in the
component mounting apparatus shown in FIG. 1;
[0039] FIG. 15 is a perspective view illustrating a reversing head
device in the component mounting apparatus shown in FIG. 1;
[0040] FIG. 16A is a schematic longitudinal sectional view of a
suction nozzle in the reversing head device;
[0041] FIG. 16B is a schematic bottom view of the suction nozzle
shown in FIG. 16A;
[0042] FIG. 16C is a schematic longitudinal sectional view
illustrating a relationship between a concavity of a tray and the
suction nozzle shown in FIG. 16A;
[0043] FIG. 17A is a schematic cross-sectional view of an
alternative suction nozzle for the reversing head device;
[0044] FIG. 17B is a schematic bottom view of the suction nozzle
shown in FIG. 17A;
[0045] FIG. 17C is a schematic longitudinal sectional view
illustrating a relationship between the concavity of the tray and
the suction nozzle shown in FIG. 17A;
[0046] FIG. 18 is a schematic front view of a component mounting
head device;
[0047] FIG. 19 is a schematic cross-sectional view of a suction
nozzle in the component mounting head device;
[0048] FIG. 20A is a schematic bottom view of the suction nozzle
shown in FIG. 19;
[0049] FIG. 20B is a cross-sectional view along a line XX-XX in
FIG. 20A;
[0050] FIG. 20C is a schematic plan view of the suction nozzle
shown in FIG. 19;
[0051] FIG. 21A is a bottom view of a first alternative suction
nozzle for the component mounting head device;
[0052] FIG. 21B is a cross-sectional view along a line XXI-XXI in
FIG. 21A;
[0053] FIG. 21C is a schematic plan view of the suction nozzle
shown in FIG. 21A;
[0054] FIG. 22A is a schematic bottom view of a second alternative
suction nozzle for the component mounting head device;
[0055] FIG. 22B is a schematic side view of the suction nozzle
shown in FIG. 22A;
[0056] FIG. 23A is a schematic bottom view of an alternative
suction nozzle in the component mounting head device;
[0057] FIG. 23B is a schematic bottom view of an alternative
suction nozzle in the component mounting head device;
[0058] FIG. 23C is a schematic bottom view of an alternative
suction nozzle in the component mounting head device;
[0059] FIG. 23D is a schematic bottom view of an alternative
suction nozzle in the component mounting head device;
[0060] FIG. 23E is a schematic bottom view of an alternative
suction nozzle in the component mounting head device;
[0061] FIG. 24A is a schematic explanatory drawing illustrating a
relationship between the reversing head device and component
mounting head device;
[0062] FIG. 24B is a schematic explanatory drawing illustrating the
relationship between the reversing head device and component
mounting head device;
[0063] FIG. 24C is a schematic explanatory drawing illustrating the
relationship between the reversing head device and component
mounting head device;
[0064] FIG. 24D is a schematic explanatory drawing illustrating the
relationship between the reversing head device and component
mounting head device;
[0065] FIG. 25A is a schematic cross-sectional view illustrating a
suction nozzle of a conventional component supply head device;
[0066] FIG. 25B is a schematic cross-sectional view illustrating a
suction nozzle of a conventional component supply head device;
and
[0067] FIG. 26 is a schematic cross-sectional view illustrating a
suction nozzle of the conventional component mounting head
device.
DETAILED DESCRIPTION OF THE INVENTION
[0068] FIGS. 1 to 3 show an electronic component mounting device 11
according to an embodiment of the present invention which comprises
a component supply head device and a component mounting head
device.
[0069] An entire configuration and operation of the electronic
component mounting apparatus 11 will be described. The electronic
component mounting apparatus 11 is an apparatus for performing a
mounting operation of mounting electronic components 12 including,
for example, chip components or bare IC chips onto a substrate 13.
The electronic component mounting apparatus generally comprises a
component supply section 14 which is an example of a component
supply apparatus for accommodating a plurality of electronic
components 12 so that they can be supplied and a mounting section
15 for performing a mounting operation of mounting the electronic
components 12 supplied from the component supply section 14 on the
substrate 13. Further, the electronic component mounting apparatus
11 comprises a control unit or controller 16 for controlling the
operation of the component supply section 14 and mounting section
15.
[0070] Referring to FIG. 4, the component supply section (component
supply apparatus) 14 is provided with a lifter (component supplying
and accommodating section) 17, plate translating device 18, plate
disposing device (component disposing unit) 19, component ejecting
device 20, recognition camera 21, and a reversing head device
(component supply head device) 22. On the other hand, the mounting
section 15 is provided with a component mounting head device 24, an
XY table (alignment device) 25, and a recognition camera with two
fields 26.
[0071] Further, the component supply section 14 will be described.
Referring to FIG. 4, the lifter 17 of the component supply section
14 comprises a magazine 28 that can be moved upward and downward.
The magazine 28 accommodates wafer supply plates 29 for supplying
electronic components 12 in the form of wafers and tray supply
plates 30 for supplying the electronic components 12 contained in
trays 31 so that they can be selectively supplied. As shown in FIG.
5, the wafer supply plate 29 generally has a disk-like shape and
comprises a wafer sheet 34 and wafer ring 35. The wafer sheet 34 is
a stretchable sheet on which wafer 32 that have been subject to
dicing. The wafer ring 35 holds the wafer sheet 34 in the vicinity
of the outer peripheral edge thereof. The arrangement of the wafer
supply plate 29 allows the wafer sheet 34 to be radially extended
so that lattice-like arranging positions of the electronic
components 12 can be radially extended, resulting in that the
so-called "expand" can be conducted. On the other hand, as shown in
FIG. 6, the tray supply plate 30 has an outer shape similar to that
of the wafer supply plate 29 and comprises a tray ring 36, a tray
placing section 37, and a plurality of trays 31. The tray ring 36
is an annular plate having an inner peripheral hole section of
generally square shape. The tray placing section 37 is attached to
the inner peripheral hole section of the tray ring 36. The trays 31
are detachably placed on the tray placing section 37 for component
supply. As shown in the enlarged view of FIG. 7, concave sections
31a for accommodating the electronic components 12 are formed in
the component supply trays 31.
[0072] The plate translating device 18 shown only in FIG. 4 can
move in the Y axis direction and carries the wafer supply plate 29
or tray supply plate 30 that was taken out from the magazine 28 of
the lifter 17 to the plate disposing device 19. Both the wafer
supply plate 29 and tray supply plate 30 are held by the plate
disposing device 19 in a posture such that a mounting side surface
12a of the electronic component 12, on which bumps (protruding
electrodes) 39 are formed, is oriented vertically upward and a
non-mounting side surface 12b, opposite to the mounting side
surface 12a, is oriented vertically downward (see FIG. 7).
[0073] Referring to FIGS. 2, 4, 8, and 9, the plate disposing
device 19 comprises plate support pins 41 for supporting a lower
surface of the wafer supply plate 29 or tray supply plate 30 and
plate push sheets 42 positioned on upper surface sides of those
plates. The plate support pins 41 can move in the direction
perpendicular to an attachment member 43 having a ring-like shape
in the plan view thereof. Further, provided on the plate support
pins 41 are coil springs 44, which elastically urge the support
pins 41 vertically upward. On the other hand, the plate push sheets
42 can be moved upward and downward by a cylinder 45. Further, an
inner side of the attachment member 43 is provided with a
cylindrical expand member 46, a distal end of which abuts against a
lower surface of the wafer sheet 34. As shown in FIG. 8, the wafer
supply plate 29 is sandwiched between distal end portions of the
plate support pins 41 and the plate push sheets 42. When the plate
push sheets 42 are lowered by the cylinder 45 from the position
shown in FIG. 8, the wafer sheet 34 will extend radially, with the
distal end of the expand member 46 serving as a support point, as
shown in FIG. 9. As a result of this so-called "expand" operation,
spaces between adjacent electronic components 12 are enlarged. The
tray supply plate 30 is held by the plate disposing device 19 in a
similar manner. As clearly shown in FIG. 2, the plate disposing
device 19 can be moved in the Y axis direction by the Y axis robot
48 having a driving motor 47.
[0074] Referring to FIGS. 2, and 10 to 14, the component ejecting
device 20 can be moved in the X axis direction by an X axis robot
52 having a driving motor 51. Further, the component ejecting
device 20 comprises an ejecting head 54 at a distal end of an arm
53. Ejecting needles or ejecting pins 56 are accommodated in a
holder 55 of the ejecting head 54 so that the ejecting pins 56 can
be moved upward and downward. The ejecting pins 56 push up the
electronic components 12 adhered to the wafer sheet 34 from the
lower surface of the electronic components 12, thereby peeling the
electronic components 12 off the wafer sheet 34. Further, the
ejecting head 54 can be rotated about the Z axis. The structure and
operation of the component ejecting device 20 will be described
later in detail.
[0075] Referring to FIGS. 1 and 2, an X axis robot 59 with a
driving motor 58 is equipped with a recognition camera 21, and thus
the recognition camera 21 is movable in the X axis direction. The
recognition camera 21 optically recognizes the position of the
electronic components 12 in the wafer supply plate 29 or tray
supply plate 30 held in the plate disposing device 19.
[0076] Referring to FIGS. 2 and 15, the reversing head device 22
can be moved in the X axis direction by an X axis robot 62 having a
driving motor 61. The reversing head device 22 comprises a suction
nozzle 65 for removably sucking and holding the mounting side
surface 12a of the electronic component 12 by a suction force of a
vacuum pump 63 (see FIG. 16A). The suction nozzle 65 can be moved
upward and downward and rotated about the Z axis. Further, an
orientation in the vertical direction of the suction nozzle 65 can
be reversed. The structure and operation of the reversing head
device 22 will be described below in detail.
[0077] Referring to FIGS. 1, 2, and 18, the component mounting head
device 24 can be moved in the direction of the X axis by an X axis
robot 67 actuated by a driving motor 66. The component mounting
head device 24 comprises a suction nozzle 118 for removably sucking
and holding the non-mounting side surface 12b of the electronic
component 12 by a suction force of a vacuum pump 125 (see FIG. 19).
The suction nozzle 118 can be moved upward and downward and rotated
about the Z axis. The structure and operation of the component
mounting head device 24 will be described below in detail.
[0078] Referring to FIG. 2, a substrate holder (substrate holding
section) 72 for releasably holding and fixing the substrate 13 is
arranged on an upper surface of the XY table 25. This substrate
holder stand 72 holds the substrate 13 that has been supplied from
a substrate carrying device 73 (FIG. 1) that carries the substrate
13 leftward in the direction of X axis. The XY table 25 comprises
motors 74, 75 for driving in the X and Y axis directions and can
move the substrate 13 held by the substrate holder 72 in the X and
Y axis directions. This movement can align the electronic component
12 held by the component mounting head device 24 with respect to
the substrate 13.
[0079] The recognition camera 26 with two fields (see FIG. 1)
optically recognizes both the electronic component 12 held by the
component mounting head device 24 and the substrate 13.
[0080] The overall operation of the component supply section 14 and
mounting section 15 will be generally described below. The plate
translating device 18 takes the wafer supply plate 29 out of the
magazine 28 of the lifter 17, moves the plate in the Y axis
direction, and supplies it to the plate disposing device 19. After
the holding of the wafer supply plate 29 by the plate disposing
device 19 (FIG. 8) and the expand operation (FIG. 9) have been
completed, the ejecting head 54 is aligned with respect to any one
of the electronic components 12 according to the recognition
results of the recognition camera 21. The alignment is achieved by
the movement of the plate disposing device 19 in the Y axis
direction performed by the Y axis robot 48 and the movement of the
component ejecting device 20 in the X axis direction performed by
the X axis robot 52. Further, the reversing head device 22 is
aligned with respect to the same electronic component 12 by the
movement of the reversing head device 22 in the X axis direction
performed by the X axis robot 62. Synchronously with the suction
operation performed by the suction nozzle 65 of the reversing head
device 22, the electronic component 12 is pushed up from the lower
surface side of the wafer sheet 34 by the ejecting pins 56 of the
component ejecting device 20, and thereby the electronic component
12 is peeled off from the wafer sheet 34 and held by the suction
nozzle 65.
[0081] The reversing head device 22 holding the electronic
component 12 with the suction nozzle 65 moves in the X axis
direction as far as a transfer position P2 (see FIG. 24) of the
electronic component 12 and reverses the orientation of the suction
nozzle 65. The component mounting head device 24 is also moved in
the X axis direction as far as the transfer position P2 by the X
axis robot 67. After the electronic component 12 has been sucked
and held by the suction nozzle 118 of the component mounting head
device 24, the suction by the suction nozzle 65 of the reversing
head device 22 is released. As a result, the electronic component
12 is transferred from the reversing head device 22 to the mounting
head device 24.
[0082] The mounting head device 24 to which the electronic
component 12 has been transferred moves above the substrate 13 on
the XY table 25. The substrate 13 is aligned with respect to the
electronic component 12 held by the suction nozzle 118 of the
mounting head device 24 according to the recognition results by the
recognition camera with two fields 26. The alignment is achieved by
the movement of the substrate 13 in the X and Y axis directions
performed by the XY table 25. After this alignment, the mounting
head device 24 mounts the electronic component 12 onto the
substrate 13. Similar operations are executed with respect to the
tray supply plate 30.
[0083] The component ejecting device 20 will be described below in
greater detail with reference to FIGS. 1, 2, and 10 to 14. As shown
in FIGS. 2, 10, and 11, the component ejecting device 20 comprises
a base unit 80 installed on the X axis robot 52 having the drive
motor 51. A proximal end side of the arm 53 extending in the Y axis
direction is connected to the base unit 80. The proximal end side
of the arm 53 is connected to the base unit 80 through an LM guide
or linear motion guide 81 extending in the Z axis direction so that
the entire arm 53 is moved upward and downward by a cylinder 82
supported by the base unit 80.
[0084] As shown in FIGS. 12 to 14, the arm 53 has at the distal end
thereof the ejecting head 54. As most clearly shown in FIG. 14, the
ejecting head 54 is positioned below the wafer supply plate 29 held
by the plate disposing device 19. The ejecting head 54 has a casing
83 fixed to the distal end of the arm 53. A ball spline 84 is
attached to the casing 83 so that a spline shaft 85 of the ball
spline 84 extends in the vertical direction, and a pin fixing
member 87, to which proximal end sides of the plurality of ejecting
pins 56 is fixed, is connected to a distal end side of the spline
shaft 85. A rotation unit 86 of the ball spline 84 is attached to
the casing so as to be rotatable with respect to the casing 83, and
a pulley 89 is fixed on the outer periphery thereof. As shown in
FIGS. 11 and 12, a driving belt 93 is arranged between the pulley
89 and a pulley 92 fixed to an output shaft of a motor 91 disposed
at the proximal end side of the arm 53. Therefore, the rotation of
the motor 91 is converted into the rotation of the spline shaft 85
about the Z axis direction through the pulleys 89 and 92, drive
belt 93, and rotation unit 86.
[0085] Referring to FIGS. 12 and 13, the component ejecting device
20 comprises a lift driving mechanism 95 for moving the spline
shaft 85 upward and downward. Specifically, a cam follower 98
abutting against a cam 97 fixed to the output shaft of the motor 96
is attached to an upper end of a lever 99. The lever 99 can be
advanced in the vertical direction by an advance guide 100
supported by the casing 83. Further, a protrusion 101 provided at
an L-shaped lower end of the lever 99 abuts against a lower end of
the spline shaft 85. Furthermore, a coil spring 102 is fitted onto
the spline shaft 85. The spline shaft 85 is elastically urged
downward in the vertical direction by the coil spring 102. As a
result, the lower end of the spline shaft 85 constantly abuts
against the protrusion 101. The rotation of the motor 96 is
converted into linear motion by the cam 97 and the cam follower 98,
and the linear motion is transmitted to the spline shaft 85 by the
lever 99.
[0086] An upper end side of the spline shaft 85 is inserted into a
hollow holder 55 fixed to the casing 83. As shown in FIG. 14, a
distal end surface of the holder 55 abuts against the lower surface
of the wafer sheet 34. Further, a plurality of sheet suction holes
55a are provided in the distal end surface of the holder 55, and
the lower surface of the wafer sheet 34 is sucked to and held at
the distal end surface 55b of the holder 55 by the suction force of
a vacuum pump 63 (shown only in FIG. 14) acting through the sheet
suction holes. The pin fixing member 87 is fixed to the upper end
of the spline shaft 85 positioned inside the holder 55. The
plurality of ejecting pins 56 are fixed to the pin fixing member
87.
[0087] The operation of the component ejecting device 20 will be
described below. As already described with reference to FIGS. 8 and
9, the expand operation of the wafer sheet 34 is executed by the
plate disposing device 19. Then, after the arm 53 is moved upward
so that the distal end surface of the holder 55 is abutted against
the lower surface of the wafer sheet 34, the vacuum pump 63 is
actuated and the lower surface of the wafer sheet 34 is sucked and
held to the sheet suction holes 55a (see FIG. 14). In a case where
the type of electronic components 12 is changed, the angular
position of the pin fixing member 87 around the Z axis can be
adjusted by rotating the spline shaft 85 by the motor 91, thereby
the arrangement position in the plan view of the plurality of
ejecting pins 56 can be adjusted according to the type of the
electronic components 12. Then, the recognition camera 21
recognizes the position of the electronic component 12 which is to
be ejected. The reversing head device 22 moves according to the
recognition results of the recognition camera 21, the suction
nozzle 65 is thereafter lowered and the suction of the electronic
component 12 is started. Synchronously with the upward movement of
the suction nozzle 65, the ejecting operation of the electronic
component 12 by the ejecting pins 56 is executed. The suction
nozzle 65 moves upward as well as sucks and holds the electronic
component 12 peeled off from the wafer sheet 34 by the ejecting
operation.
[0088] The reversing head device 22 will be described below in
detail. Referring to FIGS. 2 and 15, the reversing head device 22
comprises a reversing head 103 having the suction nozzle 65 for
releasably sucking and holding the electronic component 2 and a
rotation driving device 102 for rotating the suction nozzle 65
about the Z axis. Further, the head reversing device 22 comprises a
head lifting device 104 and a reversing device 105. The head
reversing device 22 moves the reversing head 103 upward and
downward for achieving the upward and downward movement of the
suction nozzle 65. The reversing device 105 supports the reversing
head 103 movably upward and downward and rotates the reversing head
103 about a reversing center extending along the Y axis direction
for achieving reversing of the orientation of the suction nozzle 65
in the vertical direction. Further, the head reversing device 22
comprises a head frame 106 for supporting a head lifting device 104
and reversing device 105. The head frame 106 is installed on the X
axis robot 62 having the driver motor 61. Therefore, the reverse
head 103 moves back and forth in the X axis direction between a
take-out position P1 of the electronic component 12 (see FIG. 24A)
and the transfer position P2 of the electronic component 12 (see
FIG. 24B).
[0089] Referring to FIGS. 16A and 16B, the suction nozzle 65
comprises a suction hole 65b opened at a flat distal end surface
65a and a suction passage 65c communicated with the suction hole
65b at one end thereof. The vacuum pump 63 is connected to the
other end of the suction passage 65c. The suction hole 65b
comprises a center section 65d communicated with the suction
passage 65c and a plurality of branch sections 65e extending
radially from the center section 65d. In the present embodiment,
four branch sections 65e disposed with angular spaces of 90 degrees
in the plan view or bottom view thereof are provided. The shape and
size of the suction hole 65b and distal end surface 65a are set so
that the portion of the distal end surface 65a outside of the
suction hole 65b abuts against the bumps 39 of the electronic
component 12 and also so that the suction hole 65b is opposed, with
a gap, to a portion of the mounting side surface 12a on which the
bumps 39 are not provided. For this reason, a suction operation of
the vacuum pump 63 generates an air flow flowing from the gap
between the distal end surface 65a of the suction nozzle 65 and the
mounting side surface 12a into the suction passage 65c through the
suction hole 65b. The negative pressure (dynamic pressure)
generated by the air flow holds the component 12 at the distal end
surface 65a. In other words, the distal end surface 65a of the
suction nozzle 65 of the reversing head device 22 sucks and holds
the electronic component 12 in a state where the distal end surface
65a is not in contact with the mounting side surface 12a.
Therefore, the suction force uniformly acts on the entire mounting
side surface 12a and the electronic component 12 can be held on the
suction nozzle 65 with high accuracy, without causing deformation,
such as warping, by an excess suction force.
[0090] Further, as shown by a reference symbol t1 in FIG. 16A, the
outer dimensions of the distal end surface 65a of the suction
nozzle 65 are set so that the outer peripheral edge of the distal
end surface 65a is positioned inside the peripheral edge of the
electronic component 12 for example by 25-50 .mu.m. Therefore, as
shown in FIG. 16C, even when the electronic component 12
accommodated in the concave section 31a of the tray 31 abuts
against a wall surface constituting the concave section 31a, a gap
of about 25-50 .mu.m shown by a reference symbol t2 is ensured
between the distal end surface 65a of the suction nozzle 65 and the
wall surface of the concave section 31a, and the suction nozzle 65
can be prevented from interfering with the wall surface of the
concave section 31a. Further, the outer dimensions of the distal
end surface 65a of the suction nozzle 65 are set so that the outer
peripheral edge of the distal end surface 65a is located outside
the bump 39. Therefore, because the bump 39 can be reliably abutted
against the distal end surface 65a in the portion outside the
suction hole 65b, the electronic component 12 can be reliably held
at the suction nozzle 65 by the negative pressure generated in the
aforementioned gap between the suction hole 65b and mounting side
surface 12a.
[0091] The shapes of the suction nozzle 65 and suction hole 65b are
not limited to those shown in FIGS. 16A to 16C. For example, as
shown in FIG. 17A through FIG. 17C, eight branch sections 65e
arranged with angular spaces of 45 degrees in the plan view or
bottom view thereof can be provided.
[0092] The component mounting head device 24 will be described
below in detail. Referring to FIGS. 1, 2, and 18, the component
mounting head device 24 comprises a base unit 111 installed on the
X axis robot 67 actuated by the motor 66 and can move along the X
axis direction. A holder 112 is attached to the base unit 111. The
holder 112 can move in the vertical direction with respect to the
base unit 111 by a linear guide 113. A ball threaded shaft 114
extending in the vertical direction is rotatably supported by the
base unit 111. An internal threaded section 115 fixed to the holder
112 is engaged to the ball threaded shaft 114. When the ball
threaded shaft 114 is rotated by a motor 68, the holder 112 is
moved upward or downward according to a rotation direction
thereof.
[0093] A rotary shaft mechanism 116 extending in the vertical
direction is rotatably supported by the holder 112. A heater 117
for heating the electronic component 12 is fixed to a lower end
side of the rotary shaft mechanism 116. Further, the suction nozzle
118 is attached in a replaceable manner to a lower side of the
heater 117. In the present embodiment, the heater 117 is a pulse
ceramic heater as a surface heater. However, the type of the heater
is not specifically limited as long as it is adapted to heat the
electronic component 12 held by the suction nozzle 118.
[0094] A pulley 120 is fixed to an upper end side of the rotary
shaft mechanism 116. A motor 69 is fixed to the holder 112 so that
the output shaft of the motor 69 is oriented vertically upward. A
pulley 121 is fixed to an output shaft of the motor 69. A drive
belt 122 is arranged between the pulleys 120, 121. Therefore, the
rotation of the motor 69 is transmitted to the rotary shaft
mechanism 116 through the pulleys 120, 121 and drive belt 122.
[0095] Referring to FIGS. 19 to 20C, the suction nozzle 118
comprises a flat distal end section 118a for sucking and holding
the non-mounting side surface 12b of the electronic component 12
and a proximal end surface 118b opposite to the distal end surface
118a and abutting against the heater 117.
[0096] Four suction holes 118c are opened in the distal end surface
118a. Four suction passages 118d each of which is communicated with
respective suction holes 118c at one end thereof are formed in the
suction nozzle 118. The other ends of the suction passages 118d are
communicated with a cross-shaped aggregation groove 118e formed in
the proximal end surface 118b. A suction passage 117a communicated
with the aggregation groove 118e at one end thereof is formed in
the heater 117. The other end of the suction passage 117a is
connected to the vacuum pump 125 (shown only in FIG. 19) through a
suction passage 116a formed in the rotary shaft mechanism 116.
Therefore, the suction holes 118c are communicated with the vacuum
pump 125 through the suction passages 118d, 117a, and 116a.
[0097] Further, a suction groove 126 communicated with the suction
passage 118c are formed in the distal end surface 118a. As shown in
FIG. 20A, in the distal end surface 118a of the suction nozzle, the
suction grooves 126 are formed so as to extend in an entire area
corresponding to the area of the mounting side surface 12a of the
electronic component 12 where the bump 39 was formed (joining area
127). Furthermore, the suction grooves 126 are formed with a
uniform pitch in the area of the distal end surface 118a
corresponding to the joining area 127.
[0098] In the present embodiment, the suction groove 126 comprises
one rectangular section (closed pattern section) 131 and a
lattice-shaped section 132 disposed inside the rectangular section
131. The rectangular section 131 is formed along the peripheral
edge of the distal end surface 118a. The lattice-shaped section 132
comprises three longitudinal straight line sections 133 and three
lateral straight line sections 134. The longitudinal straight line
sections 133 are disposed so as to extend in the up-down direction
in FIG. 20A, and are parallel to each other. Both ends of each
longitudinal straight line section 133 are communicated with the
rectangular section 131. The lateral straight line sections 134 are
disposed so as to extend in the left-right direction in FIG. 20A,
that is, in the direction perpendicular to the longitudinal
straight line sections 133, and are parallel to each other.
Similarly to the longitudinal straight line sections 133, both ends
of the lateral straight line sections 134 are communicated with the
rectangular section 131. Further, each lateral straight line
section 134 is communicated with the intersecting longitudinal
straight line section 133. Two suction holes 118c are opened in the
longitudinal straight line section 133 located in the center.
Further, two suction holes 118c are opened in the lateral straight
line section 134 located in the center.
[0099] The electronic component 12 is sucked and held by the
suction nozzle 118 at the non-mounting side surface 12b. A suction
force (negative pressure) of the vacuum pump 125 is transferred to
the suction holes 118c and suction grooves 126 through the suction
passages 116a, 117a, and 118d, and the suction force acts on the
non-mounting side surface 12b of the electronic component 12 from
both the suction holes 118c and the suction grooves 126. Because
the suction force acts on the non-mounting side surface 12b of the
electronic component 12 not only from the suction holes 118c, but
also from the suction grooves 126, the entire area of the
non-mounting side surface 12b corresponding to the joining area 127
is tightly sucked and held to the distal end surface 118a of the
suction nozzle 118. In other words, the electronic component 12 is
sucked and held to the suction nozzle 118 in a state with a high
degree of flatness and warping of the electronic component 12 is
substantially reduced. Because the electronic component 12 is
tightly sucked and held to the suction nozzle 118 with a high
degree of flatness, the heat generated by the heater 117 is
uniformly transmitted to the entire joining area 127 of the
electronic component 12. As a result, the uniformity of temperature
distribution in the joining area 127 is enhanced, and thus the
bumps 39 are heated uniformly. Therefore, the bumps 39 can be
joined to the substrate electrodes 135 in a uniform joining
state.
[0100] In order for the suction nozzle 118 to suck and hold the
electronic component 12 tightly and with the high degree of
flatness, it is preferred that the suction grooves 126 be densely
and uniformly disposed at least in the center region of the distal
end surface 118a corresponding to the joining area 127. Referring
to FIG. 20A, it is preferred that a width "w" and pitch "p" of the
suction grooves 126 is smaller and that that a large number of
grooves is present in the joining area 127. For example, in a case
where an electronic component 12 in the form of a square with a
side of about 10 mm and a thickness of about 0.1 mm is sucked and
held by the suction nozzle having the suction groove 126, the width
"w" set at 0.2 mm and the pitch "p" set at 1 mm, the warping of the
electronic component 12 is reduced to about 5 .mu.m.
[0101] FIGS. 21A to FIG. 21C illustrate a first alternative of the
suction nozzle 118 of the component mounting head device 24. A
rectangular recess 137 is formed in the distal end surface 118a of
the suction nozzle 118 between the rectangular section 131 of the
suction groove 126 and the peripheral edge of the distal end
surface 118a. Unlike the suction groove 126, this recess 137 is not
communicated with the suction holes 118c and is not affected by the
suction force of the vacuum pump 125.
[0102] Even if the air is introduced from a very minute gap between
the peripheral edge of the distal end surface 118a of the suction
nozzle 118 and the electronic component 12 sucked and held by the
suction nozzle 118, the introduced air is heated while passing
through the recess 137 and then passes to the center area of the
distal end surface 118a. As a result, the region of the distal end
surface 118a of the suction nozzle 118 corresponding to the joining
surface 127 is prevented from being cooled by the air introduced
from the gap. Therefore, providing the recess 137 in addition to
the suction grooves 126 in the distal end surface 118a further
improves the uniformity of temperature distribution in the joining
area 127 of the electronic component 12 held by the suction nozzle
118. Other structures and operations of the alternative shown in
FIGS. 21A to FIG. 21C are identical to those of the suction nozzle
118 shown in FIGS. 19 to 20C.
[0103] FIG. 22A to FIG. 22C illustrate a second alternative of the
suction nozzle 118 of the component mounting head device 24. In
this alternative, the suction groove 126 formed in the distal end
surface 118a of the suction nozzle 118 comprises the lattice-shaped
section including three longitudinal straight line sections 133 and
three lateral straight line sections 134, but has no rectangular
section 131 (see FIG. 20A). Further, the suction nozzle 118 is
formed with one suction hole 118c communicated with a center
portion of the lattice-shaped section 132 at one end thereof.
[0104] FIG. 23A to FIG. 23E illustrate other various alternatives
of the suction nozzle 118. In the alternative suction nozzle shown
in FIG. 23A, the suction groove 126 comprises three rectangular
sections 131 disposed concentrically so as to surround a center 138
of the area of the distal end surface 118a corresponding to the
joining area 127. Further, the suction groove 126 comprises four
straight line sections 139 extending radially from the center 138
of the area of the distal end surface 118a corresponding to the
joining area 127. Each of the straight line sections 139 is
communicated with the rectangular section 131 at an inner side at
one end thereof as well as the rectangular section 131 at an outer
side at the other end thereof. Furthermore, the straight line
sections 139 cross the rectangular frame-shaped section 131 at an
intermediate position. The suction nozzle 118 comprises four
suction holes 118c each of which is communicated with the suction
groove 126 in intersection positions of the straight line sections
139 and the inner rectangular section 131.
[0105] In the alternative shown in FIG. 23B, the suction groove 126
comprises three circular sections 140 disposed concentrically so as
to surround the center 138 of the area corresponding to the joining
area 127. Further, the suction groove 126 comprises four straight
line sections 139 extending radially from the center 138. Each
straight line section 139 is communicated with the circular section
140 at an inner side. Further, each straight line section 139
crosses the circular sections 140 at an intermediate position and
an outer side and is communicated with thereto. The suction groove
126 comprises four circular arc sections 141 between the outer
circular section 140 and the peripheral edge of the distal end
surface 118a. The other end of each straight line sections 139
extending beyond the outer circular section 140 to the peripheral
edge side of the distal end surface 118a is communicated with the
circular arc section 141. The suction nozzle 118 comprises four
suction holes 118c each of which is communicated with the suction
groove 126 in intersection positions of the straight line sections
139 and the inner circular section 140.
[0106] In the alternative shown in FIG. 23C, the suction groove 126
has a single line-like shape. Specifically, the suction groove 126
has a spiral shape formed by connecting together a plurality of
straight line sections 143 extending parallel to lateral sides in
FIG. 23C of four sides defining the peripheral edge of the distal
end surface 118a of the suction nozzle 118 and a plurality of
straight line sections 144 extending parallel to longitudinal sides
of the peripheral edge of the distal end surface 118a. The suction
nozzle 118 comprises two suction holes 118c. One of suction holes
118c is communicated with the suction groove 126 in the inner end
section of the suction groove, and the other suction hole 118c is
communicated with the suction groove 126 between the inner end
section and an outer end section of the suction groove 126.
[0107] The alternative suction groove 126 shown in FIG. 23D also
has a single line-like shape. Specifically, the suction groove 126
has a rectangular wave-like shape formed by connecting a plurality
of straight line sections 145 extending parallel to lateral sides
of the distal end surface 118a of the suction nozzle 118 and a
plurality of straight line sections 146 extending parallel to
longitudinal sides. The suction nozzle 118 comprises two suction
holes 118c that are communicated with the suction groove 126 at the
longitudinal straight line sections 146.
[0108] In the alternative shown in FIG. 23E, the suction groove 126
comprises one rectangular section 131 surrounding the center 138 of
the area of the distal end surface 118a corresponding to the
joining area 127. Further, the suction groove 126 comprises four
straight line sections 147 and four polygonal line sections 148
between the rectangular section 131 and the peripheral edge of the
distal end surface 118a. Those straight line sections 147 and
polygonal line sections 148 are disposed on a virtual rectangle
concentric with the rectangular section 131 and larger in size than
the rectangular section 131. Further, the suction groove 126
comprises eight straight line sections 149 extending radially with
respect to the center 138. One end of each straight line section
149 is communicated with the rectangular section 131 and the other
end is communicated with the straight line sections 147 or
polygonal line sections 148. The suction nozzle 118 comprises four
suction holes 118c that are communicated with the suction groove
126 at corners of the rectangular section 131.
[0109] The shape, size, number, and arrangement position of the
suction hole, suction grooves and recesses formed in the distal end
surface of the suction nozzle 118 of the component mounting head
device 24 are not limited to the above-described examples and can
be easily set according to the size, and shape of the electronic
components 12 and the number of bumps 39 so that the area of the
non-mounting side surface 12b of the electronic component 12
corresponding to the joining area 127 is brought into tight contact
with the distal end surface 118a of the suction nozzle 118.
[0110] Referring to FIGS. 24A to 24D, the operations of taking the
electronic component 12 out of the plate disposing device 19 by the
reversing head device 22 and mounting on the substrate 13 by the
mounting head device 24 will be described below. First, as shown in
FIG. 24A, at the supply position P1 of the electronic component 12
corresponding to the plate disposing device 19, the suction nozzle
65 of the reversing head device 22 sucks and holds the electronic
component 12 from the wafer supply plate 29 or tray supply plate
30. At this operation the suction nozzle 65 holds the mounting side
surface 12a of the electronic component 12 oriented upward in the
vertical direction.
[0111] As shown in FIG. 24B, the suction nozzle 65 rises and the
mounting head device 24 moves to the transfer position P2. Then,
the reversing head device 22 holding the electronic component 12 by
the suction nozzle 65 moves to the transfer position P2 and is
positioned below the mounting head device 24. The orientation of
the reverse head 103 is then reversed. As a result, the
non-mounting side surface 12b of the electronic component 12
opposite to the mounting side surface 12a is oriented upward in the
vertical direction. Then, as shown in FIG. 24C, the suction nozzle
118 of the mounting head device 24 is lowered so as to suck and
hold the electronic component 12. The electronic component 12 is
held by the holding section 70 in a posture where the mounting side
surface 12a faces down in the vertical direction (posture in which
the non-mounting side surface 12b faces up in the vertical
direction).
[0112] As shown in FIG. 24D, the mounting head device 24 moves
above the substrate 13 and the electronic component 12 is aligned
with respect to the substrate 13 so that the substrate electrodes
135 and bumps 39 are corresponded to each other. Then, the suction
nozzle 118 is lowered so that the bumps 39 are pressed against the
substrate electrodes 135. Further, the electronic component 12 is
heated by the heater 117. The bump 39 and substrate electrode 135
are joined by the pressing and heating, and the electronic
component 12 is mounted onto the substrate 13.
[0113] As described, the suction nozzle 65 of the reversing head
device 22 holds the electronic component 12 in the state where the
distal end surface 65a of the suction nozzle is not in contact with
the mounting side surface 12a. Therefore, the suction force acts
uniformly on the entire mounting side surface 12a and the
electronic component 12 can be held by the suction nozzle 65 with
high accuracy, without causing deformation such as warping due to
the excess suction force. As a result, the accuracy of transferring
the component from the reversing head device 22 to the component
mounting head device 24 is enhanced. Further, suction grooves 126
communicated with the suction holes 118c are formed over the entire
area corresponding to the joining area 127 of the electronic
component 12 in the distal end surface 118a of the suction nozzle
118 of the component mounting head device 24. Therefore, the area
of the non-mounting side surface 12b of the electronic component 12
corresponding to the joining area 127 is tightly sucked and held to
the distal end surface 118a of the suction nozzle 118 with a high
degree of flatness. As a result, the uniformity of temperature
distribution in the joining area 127 is enhanced and the bumps 39
are heated uniformly. Therefore, the bumps 39 can be joined to the
substrate electrodes 135 in a uniform joining state.
[0114] Although the present invention has been fully described with
reference to the accompanying drawings, various changes and
modifications will be apparent to those skilled in the art.
Therefore, such changes and modifications should be construed as
included in the present invention, unless they depart from the
scope and spirit of the present invention.
* * * * *