Narita; Shoriki

Patent Applications and Registrations

Patent applications and USPTO patent grants for Narita; Shoriki.The latest application filed is for "component supply head device and component mounting head device".

Company Profile

0.21.22

Narita; Shoriki - Osaka JP
Narita; Shoriki - Hirakata JP
Narita; Shoriki - Hirakata-shi JP
Narita, Shoriki - Hirakata-shi Osaka JP
Narita, Shoriki - Osaka-fu JP
Narita; Shoriki - Kadoma JP

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Receiver for component feed plates and component feeder Grant 7,806,642 - Narita , et al. October 5, 2	2010-10-05
Component mounting apparatus Grant 7,797,820 - Shida , et al. September 21, 2	2010-09-21
Component feeder Grant 7,731,469 - Narita , et al. June 8, 2	2010-06-08
Component Supply Head Device And Component Mounting Head Device App 20100064510 - NARITA; Shoriki ; et al.	2010-03-18
Component supply head device and component mounting head device Grant 7,650,691 - Narita , et al. January 26, 2	2010-01-26
Wafer expanding device, component feeder, and expanding method for wafer sheet Grant 7,552,528 - Narita , et al. June 30, 2	2009-06-30
Bump formation method and bump forming apparatus for semiconductor wafer Grant 7,516,878 - Narita , et al. April 14, 2	2009-04-14
Tool exchange device and tool Grant 7,452,315 - Hata , et al. November 18, 2	2008-11-18
Method of forming bumps on a wafer utilizing a post-heating operation, and an apparatus therefore App 20080179378 - Imanishi; Makoto ; et al.	2008-07-31
Component mounting apparatus and component mounting method App 20080163481 - Shida; Satoshi ; et al.	2008-07-10
Method for moving a mounting head unit App 20080141526 - Narita; Shoriki ; et al.	2008-06-19
Method of forming bumps on a wafer utilizing a post-heating operation, and an apparatus therefore Grant 7,387,229 - Imanishi , et al. June 17, 2	2008-06-17
Component mounting method Grant 7,353,596 - Shida , et al. April 8, 2	2008-04-08
Component feeding head apparatus, for holding a component arrayed Grant 7,350,289 - Narita , et al. April 1, 2	2008-04-01
Apparatus and method for forming bump Grant 7,350,684 - Narita , et al. April 1, 2	2008-04-01
Tool Exchange Device And Tool App 20080058186 - HATA; Kanji ; et al.	2008-03-06
Component Supply Head Device And Component Mounting Head Device App 20080040917 - Narita; Shoriki ; et al.	2008-02-21
Wafer Expanding Device, Component Feeder, and Expanding Method for Wafer Sheet App 20080010818 - Narita; Shoriki ; et al.	2008-01-17
Tool exchange device and tool Grant 7,306,551 - Hata , et al. December 11, 2	2007-12-11
Receiver for Component Feed Plates and Component Feeder App 20070227941 - Narita; Shoriki ; et al.	2007-10-04
Tool exchange device and tool App 20060270539 - Hata; Kanji ; et al.	2006-11-30
Parts packaging device and parts packaging method App 20060185157 - Shida; Satoshi ; et al.	2006-08-24
Bump formation method and bump forming apparatus for semiconductor wafer Grant 7,052,984 - Narita , et al. May 30, 2	2006-05-30
Bump formation method and bump forming apparatus for semiconductor wafer App 20060102701 - Narita; Shoriki ; et al.	2006-05-18
Component feeding head apparatus, component feeding apparatus, component mounting apparatus and method for moving mounting head unit App 20060104754 - Narita; Shoriki ; et al.	2006-05-18
Method and apparatus for correcting inclination of IC on semiconductor wafer Grant 7,031,509 - Narita , et al. April 18, 2	2006-04-18
Bump forming apparatus for charge appearance semiconductor substrate, charge removal method for charge appearance semiconductor substrate, charge removing unit for charge appearance semiconductor substrate, and charge appearance semiconductor substrate Grant 7,014,092 - Narita , et al. March 21, 2	2006-03-21
Parts feeder App 20060054656 - Narita; Shoriki ; et al.	2006-03-16
Bump Forming Apparatus For Charge Appearance Semiconductor Substrate, Charge Removal Method For Charge Appearance Semiconductor Substrate, Charge Removing Unit For Charge Appearance Semiconductor Substrate, And Charge Appearance Semiconductor Substrate Grant 7,005,368 - Narita , et al. February 28, 2	2006-02-28
Apparatus and method for forming bump App 20050191838 - Narita, Shoriki ; et al.	2005-09-01
Device and method for forming bump Grant 6,910,613 - Narita , et al. June 28, 2	2005-06-28
Electric Charge Generating Semiconductor Substrate Bump Forming Device, Method Of Removing Electric Charge From Electric Charge Generating Semiconductor Substrate Device For Removing Electric Charge From Electric Charge Generating Semiconductor Substrate, And Electric Charge Generating Semiconductor Grant 6,818,975 - Narita , et al. November 16, 2	2004-11-16
Method of forming bumps on a wafer utilizing a post-heating operation, and apparatus therefor Grant 6,787,391 - Imanishi , et al. September 7, 2	2004-09-07
Method of forming bumps on a wafer utilizing a post-heating operation, and an apparatus therefore App 20040149803 - Imanishi, Makoto ; et al.	2004-08-05
Device and method for forming bump App 20040102030 - Narita, Shoriki ; et al.	2004-05-27
Bump forming apparatus for charge appearance semiconductor substrate, charge removal method for charge appearance semiconductor substrate, charge removing unit for charge appearance semiconductor substrate, and charge appearance semiconductor substrate App 20040035849 - Narita, Shoriki ; et al.	2004-02-26
Bump formation method and bump forming apparatus to semiconductor wafer App 20040020973 - Narita, Shoriki ; et al.	2004-02-05
Method and apparatus for correcting inclination of IC on semiconductor wafer App 20020061129 - Narita, Shoriki ; et al.	2002-05-23
Heating apparatus for bump bonding, bump bonding method and bump forming apparatus, and semiconductor wafer App 20020011479 - Narita, Shoriki ; et al.	2002-01-31
Bump bonding apparatus and method App 20010042771 - Narita, Shoriki ; et al.	2001-11-22
Bump bonding apparatus and method App 20010042772 - Narita, Shoriki ; et al.	2001-11-22
Bump forming method and bump bonder Grant 6,098,868 - Mae , et al. August 8, 2	2000-08-08
Board positioning apparatus Grant 5,955,876 - Yamauchi , et al. September 21, 1	1999-09-21

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