Morikawa; Makoto

Patent Applications and Registrations

Patent applications and USPTO patent grants for Morikawa; Makoto.The latest application filed is for "lamp and lighting apparatus".

Company Profile

0.26.18

Morikawa; Makoto - Nara N/A JP
Morikawa; Makoto - Ikoma JP
MORIKAWA; Makoto - Osaka JP
Morikawa; Makoto - Chiba JP
Morikawa; Makoto - Kadoma JP
Morikawa; Makoto - Ikoma-shi JP
Morikawa; Makoto - Tokyo JP
Morikawa; Makoto - Kyoto JP

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Light-emitting module, light source device, liquid crystal display device, and method of manufacturing light-emitting module Grant 9,261,246 - Ogata , et al. February 16, 2	2016-02-16
Lamp and lighting apparatus Grant 8,950,890 - Seki , et al. February 10, 2	2015-02-10
Lamp And Lighting Apparatus App 20130182425 - Seki; Katsushi ; et al.	2013-07-18
Light source of light emitting diode Grant D662,067 - Morikawa , et al. June 19, 2	2012-06-19
Light source of light emitting diode Grant D661,666 - Morikawa , et al. June 12, 2	2012-06-12
Light source of light emitting diode Grant D657,758 - Morikawa , et al. April 17, 2	2012-04-17
Light source of light emitting diode Grant D657,757 - Morikawa , et al. April 17, 2	2012-04-17
Light-emitting Module, Light Source Device, Liquid Crystal Display Device, And Method Of Manufacturing Light-emitting Module App 20120044669 - Ogata; Toshifumi ; et al.	2012-02-23
Light source of light emitting diode Grant D645,418 - Morikawa , et al. September 20, 2	2011-09-20
Light source of light emitting diode Grant D642,997 - Morikawa , et al. August 9, 2	2011-08-09
Apparatus for forming phosphor layer and method for forming phosphor layer using the apparatus Grant 7,992,516 - Shida , et al. August 9, 2	2011-08-09
Substrate for light source of light emitting diode Grant D638,810 - Morikawa , et al. May 31, 2	2011-05-31
Substrate for light source of light emitting diode Grant D638,809 - Morikawa , et al. May 31, 2	2011-05-31
Light-emitting module with plural light emitters and conductor pattern Grant 7,902,568 - Morikawa , et al. March 8, 2	2011-03-08
Component mounting method, component mounting apparatus, and ultrasonic bonding head Grant 7,861,908 - Minamitani , et al. January 4, 2	2011-01-04
Light-emitting Device And Display Unit And Lighting Unit Using The Same App 20100309646 - Morikawa; Makoto ; et al.	2010-12-09
Component mounting apparatus and component mounting method Grant 7,748,112 - Hirata , et al. July 6, 2	2010-07-06
Apparatus For Forming Phosphor Layer And Method For Forming Phosphor Layer Using The Apparatus App 20100129525 - Shida; Satoshi ; et al.	2010-05-27
Light-emitting Module And Mounting Board Used Therefor App 20100079997 - Morikawa; Makoto ; et al.	2010-04-01
Component Supply Head Device And Component Mounting Head Device App 20100064510 - NARITA; Shoriki ; et al.	2010-03-18
Component supply head device and component mounting head device Grant 7,650,691 - Narita , et al. January 26, 2	2010-01-26
Method Of Producing Film App 20090273115 - Morikawa; Makoto ; et al.	2009-11-05
Semiconductor device bonding apparatus and method for bonding semiconductor device using the same Grant 7,591,409 - Naito , et al. September 22, 2	2009-09-22
Method Of Controlling Contact Load In Electronic Component Mounting Apparatus App 20090151149 - HIRATA; Shuichi ; et al.	2009-06-18
Method of controlling contact load in electronic component mounting apparatus Grant 7,513,036 - Hirata , et al. April 7, 2	2009-04-07
Light source of light emitting diode Grant D588,077 - Shida , et al. March 10, 2	2009-03-10
Semiconductor Device Bonding Apparatus And Method For Bonding Semiconductor Device Using The Same App 20090020586 - Naito; Hiroyuki ; et al.	2009-01-22
Light source of light emitting diode Grant D581,886 - Shida , et al. December 2, 2	2008-12-02
Light source of light emitting diode Grant D577,690 - Shida , et al. September 30, 2	2008-09-30
Light source of light emitting diode Grant D576,576 - Shida , et al. September 9, 2	2008-09-09
Component Mounting Apparatus And Component Mounting Method App 20080127486 - Hirata; Shuichi ; et al.	2008-06-05
Component Supply Head Device And Component Mounting Head Device App 20080040917 - Narita; Shoriki ; et al.	2008-02-21
Component mounting method, component mounting apparatus, and ultrasonic bonding head App 20070187457 - Minamitani; Shozo ; et al.	2007-08-16
Component mounting method and component mounting apparatus App 20070181644 - Ueno; Yasuharu ; et al.	2007-08-09
Electronic component mounting method and apparatus and ultrasonic bonding head Grant 7,229,854 - Minamitani , et al. June 12, 2	2007-06-12
Method of controlling contact load in electronic component mounting apparatus App 20070056157 - Hirata; Shuichi ; et al.	2007-03-15
Arithmetic processing apparatus Grant 7,191,201 - Morikawa , et al. March 13, 2	2007-03-13
Electronic component mounting method and apparatus and ultrasondic bonding head App 20050227429 - Minamitani, Shozo ; et al.	2005-10-13
Method for mounting semiconductor chip and semiconductor chip-mounted board App 20050110161 - Naito, Hiroyuki ; et al.	2005-05-26
Arithmetic processing apparatus App 20040019621 - Morikawa, Makoto ; et al.	2004-01-29
Logic-circuit layout pattern inspection method and logical simulation Grant 5,381,345 - Takegami , et al. January 10, 1	1995-01-10

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