U.S. patent application number 12/168062 was filed with the patent office on 2010-01-07 for cmos transistor and the method for manufacturing the same.
Invention is credited to Jei-Ming Chen, Yi-Wei Chen, Tsai-Fu Hsiao, Chien-Chung Huang, Teng-Chun Tsai.
Application Number | 20100001317 12/168062 |
Document ID | / |
Family ID | 41463691 |
Filed Date | 2010-01-07 |
United States Patent
Application |
20100001317 |
Kind Code |
A1 |
Chen; Yi-Wei ; et
al. |
January 7, 2010 |
CMOS TRANSISTOR AND THE METHOD FOR MANUFACTURING THE SAME
Abstract
A CMOS transistor and a method for manufacturing the same are
disclosed. A semiconductor substrate having at least a PMOS
transistor and an NMOS transistor is provided. The source/drain of
the PMOS transistor comprises SiGe epitaxial layer. A carbon
implantation process is performed to form a carbon-doped layer in
the top portion of the source/drain of the PMOS transistor. A
silicide layer is formed on the source/drain. A CESL is formed on
the PMOS transistor and the NMOS transistor. The formation of the
carbon-doped layer is capable of preventing Ge out-diffusion.
Inventors: |
Chen; Yi-Wei; (Tai-Chung
Hsien, TW) ; Tsai; Teng-Chun; (Tainan City, TW)
; Huang; Chien-Chung; (Tai-Chung Hsien, TW) ;
Chen; Jei-Ming; (Taipei Hsien, TW) ; Hsiao;
Tsai-Fu; (Tainan City, TW) |
Correspondence
Address: |
NORTH AMERICA INTELLECTUAL PROPERTY CORPORATION
P.O. BOX 506
MERRIFIELD
VA
22116
US
|
Family ID: |
41463691 |
Appl. No.: |
12/168062 |
Filed: |
July 3, 2008 |
Current U.S.
Class: |
257/192 ;
257/E21.634; 257/E27.062; 438/229 |
Current CPC
Class: |
H01L 21/823814 20130101;
H01L 29/165 20130101; H01L 29/66628 20130101; H01L 29/7843
20130101; H01L 21/26513 20130101; H01L 21/26506 20130101; H01L
21/823807 20130101 |
Class at
Publication: |
257/192 ;
438/229; 257/E21.634; 257/E27.062 |
International
Class: |
H01L 21/8238 20060101
H01L021/8238; H01L 27/092 20060101 H01L027/092 |
Claims
1. A method of forming a CMOS transistor, comprising: providing a
semiconductor substrate having at least an NMOS transistor and at
least a PMOS transistor thereon, and a source/drain of the PMOS
transistor comprising germanium (Ge); forming a carbon-doped layer
in the top portion of the source/drain of the PMOS transistor;
performing a self-aligned silicide process; forming at least a
tensile thin film covering the semiconductor substrate, the NMOS
transistor, and the PMOS transistor; and performing a surface
treatment on the tensile thin film.
2. The method of claim 1, wherein the carbon-doped layer is formed
by a carbon implantation process.
3. The method of claim 2, wherein the carbon implantation process
is performed with an implantation energy between 1 KeV and 5 KeV,
and with an implantation dosage between 10.sup.13 atom/cm.sup.2 and
10.sup.16 atom/cm.sup.2.
4. The method of claim 2, wherein the source/drain of the PMOS
transistor is formed comprising a step of a heavy doped
implantation process to implant P-type dopant into the
semiconductor substrate, and the carbon implantation process is
performed before the heavy doped implantation process.
5. The method of claim 2, wherein the source/drain of the PMOS
transistor is formed comprising a step of a heavy doped
implantation process to implant P-type dopant into the
semiconductor substrate, and the carbon implantation process is
performed after the heavy doped implantation process.
6. The method of claim 1, wherein the source/drain of the PMOS
transistor is formed comprising steps of: performing a etch process
to form at least a recess on the surface of the semiconductor
substrate in the PMOS transistor; and performing a selective
epitaxial growth process to form a SiGe epitaxial layer in the
recess, wherein the carbon-doped layer is formed during the
selective epitaxial growth process.
7. The method of claim 6, wherein the selective growth process
comprises carbon as material.
8. The method of claim 7, wherein the concentration of the carbon
is increased during the formation of the SiGe epitaxial layer.
9. The method of claim 1, wherein the surface treatment comprises a
rapid thermal process (RTP) or an UV curing process.
10. The method of claim 1, wherein the tensile thin film comprises
a multi-layered tensile thin film.
11. The method of claim 10, wherein the multi-layered tensile thin
film comprises a buffered tensile thin film and a high tensile thin
film, and the buffered tensile thin film has a lower tensile stress
than that of the high tensile thin film.
12. The method of claim 1, further comprising forming a high
compressive thin film covering the PMOS transistor after the
tensile thin film is formed.
13. A CMOS transistor, comprising: a semiconductor substrate; at
least an NMOS transistor disposed on the semiconductor substrate,
the NMOS transistor comprising a P well , a gate structure disposed
on a surface of the P well, and a source/drain beside the gate
structure; at least a PMOS transistor disposed on the semiconductor
substrate, the PMOS transistor comprising an N well, a gate
structure disposed on a surface of the N well, and a source/drain
beside the gate structure, wherein the source/drain of the PMOS
transistor comprises a carbon-doped layer in the top portion
thereof; and a contact hole etch stop layer (CESL) disposed on the
NMOS transistor and the PMOS transistor.
14. The CMOS transistor of claim 13, wherein the source/drain of
the PMOS transistor comprises Ge.
15. The CMOS transistor of claim 14, wherein the source/drain of
the PMOS transistor comprises a SiGe epitaxial layer.
16. The CMOS transistor of claim 13, wherein the carbon-doped layer
has a thickness between 100 angstrom (.ANG.) and 500 .ANG..
17. The CMOS transistor of claim 13, wherein a salicide layer is
disposed on each of the source/drain, and the silicide layer has a
thickness between 50 .ANG. and 500 .ANG..
18. The CMOS transistor of claim 10, wherein a portion of the CESL
disposed on the NMOS comprises a tensile thin film, and the other
portion of the CESL disposed on the PMOS comprises a high
compressive thin film.
19. The CMOS transistor of claim 18, wherein the tensile thin film
comprises a multi-layered tensile thin film.
20. The CMOS transistor of claim 19, wherein the multi-layered
tensile thin film comprises a buffered tensile thin film and a high
tensile thin film, and the buffered tensile thin film has a lower
tensile stress than that of the high tensile thin film.
Description
BACKGROUND OF THE INVENTION
[0001] 1. Field of the Invention
[0002] The present invention is related to a CMOS transistor and a
method for manufacturing the same, and particularly, to a CMOS
transistor capable of preventing Ge out-diffusion and a method for
manufacturing the same.
[0003] 2. Description of the Prior Art
[0004] Industrial circles are used to reducing device dimensions to
improve the performance of metal-oxide semiconductor (MOS)
transistors. However, this method has encountered difficulties with
high-expenses and technical bottlenecks in recent years. For these
reasons, the industrial circles seek other methods to improve MOS
transistor performance. And accordingly, a popular method is to
utilize the material characteristics to cause strain effect on MOS
transistors.
[0005] In order to increase the driving current of a complementary
metal-oxide semiconductor (CMOS) transistor including a p-type MOS
(PMOS) transistor and an n-type MOS (NMOS) transistor, the
industrial circles develop a strained-silicon technique, which uses
unique processes or lattice constant discrepancy to increase
driving current. The strained-silicon technique substantially
includes a substrate-strained based method and a process-induced
strain based method. The substrate-strained based system is
performed with a strained-silicon substrate or a selective
epitaxial growth process that results in lattice constant
discrepancy. The process-induced strain based method is performed
with several unique processes to form a strained thin film upon a
surface of the MOS transistor that exert tensile stress or
compressive stress upon the MOS transistor. Both of the
strained-silicon techniques introduce strain into the channel
region and reduce carrier mobile resistance thereby improving
carrier mobility and MOS transistor performance.
[0006] Please refer to FIG. 1, which is a schematic diagram
illustrating a conventional CMOS transistor 10. The CMOS transistor
10 includes a PMOS transistor 12 and an NMOS transistor 14 disposed
on a substrate 16. A plurality of shallow trench isolations (STI)
30 is disposed on the substrate 16 to prevent short-circuiting
between the PMOS transistor 12 and the NMOS transistor 14. The NMOS
transistor 14 having a source/drain 20A and a gate structure 22A is
disposed on a P well 18 formed in the substrate 16. The PMOS
transistor 12 having a source/drain 20B and a gate structure 22B is
disposed on an N well 24 formed in the substrate 16. The
source/drain 20B of the PMOS transistor 12 is a silicon germanium
(SiGe) epitaxial layer. A compressive strain resulting from the
lattice constant discrepancy of SiGe epitaxial layer is induced
into the channel region of the PMOS transistor 12. Nickel silicide
layers 26 are respectively formed on the surface of the
source/drain 20A, 20B for increasing the Ohmic contact capability
between metals and the silicon substrate. In order to enhance
carrier mobility of the channel region of the NMOS transistor 14, a
high tensile thin film 28 is formed on the CMOS transistor 10. The
high tensile thin film 28 is disposed covering the gate structure
22A, 22B and the source/drain 20A, 20B. Thereafter, an UV curing
process is performed by a UV radiation to enhance the tensile
strain of the high tensile thin film 28 that results in elongating
the distance of the lattice of the channel region positioned under
the gate structure 22A of the NMOS transistor 14. Therefore, the
NMOS transistor 14 has a higher driving current and a better
electron mobility in the channel region.
[0007] Tensile strain of the high tensile thin film 28 is adjusted
by the UV curing process for improving performance of NMOS
transistor 14. However, the tensile strain results in Ge-out
diffusion at the source/drain 20B of the PMOS transistor 12. As
shown in FIG. 2, which is a SEM photo of the CMOS transistor 10, a
plurality of black spots are formed on the surface of the nickel
silicide layer 26, in which is the evidence of the Ge-out
diffusion. Besides, Ge-out diffusion results in silicide
agglomeration that increases resistance, reduces the concentration
of the Ge in the SiGe epitaxial layer, and affects the accuracy of
the threshold voltage of the PMOS transistor 12.
SUMMARY OF THE INVENTION
[0008] In order to overcome the issue of Ge-out diffusion, the
present invention provides a method of manufacturing a CMOS
transistor, which is capable of preventing Ge-out diffusion.
Initially, a semiconductor substrate having at least a PMOS
transistor and an NMOS transistor is provided. The source/drain of
the PMOS transistor has Ge therein. A carbon-doped layer is formed
at the top portion of the source/drain of the PMOS transistor. A
self-aligned silicide process is performed. At least a tensile thin
film is formed covering the semiconductor substrate, the NMOS
transistor, and the PMOS transistor. A surface treatment is
performed upon the tensile thin film.
[0009] In addition, the present invention further discloses a CMOS
transistor. The CMOS transistor has a semiconductor substrate, at
least a NMOS transistor and at least a PMOS transistor disposed on
the semiconductor substrate, and a CESL disposed on the PMOS
transistor and the NMOS transistor. The PMOS transistor has a
source/drain, which includes Ge therein. A carbon-doped layer is
disposed in the top portion of the source/drain of the PMOS
transistor, and so that, the CMOS transistor of the present
invention is capable of preventing Ge-out diffusion.
[0010] The CMOS transistor formed by the method of the present
invention has a carbon-doped layer in the top portion of the
source/drain of the PMOS transistor. Therefore, the concentration
of the Ge dopant is maintained in the source/drain of the PMOS
transistor and the issue of Ge-out diffusion is solved.
[0011] These and other objectives of the present invention will no
doubt become obvious to those of ordinary skill in the art after
reading the following detailed description of the preferred
embodiment that is illustrated in the various figures and
drawings.
BRIEF DESCRIPTION OF THE DRAWINGS
[0012] FIG. 1 is a schematic diagram illustrating a conventional
CMOS transistor.
[0013] FIG. 2 is a SEM photo of the conventional CMOS
transistor.
[0014] FIG. 3 to FIG. 9 are schematic diagrams illustrating a
method for manufacturing a CMOS transistor according to a preferred
embodiment of the present invention.
[0015] FIG. 10 is a flow diagram of the method of the present
invention to manufacture the CMOS transistor for preventing Ge-out
diffusion.
[0016] FIG. 11 is a SEM photo of the CMOS transistor manufactured
by the method of the present invention.
DETAILED DESCRIPTION
[0017] Please refer to FIG. 3 through FIG. 10. FIG. 3 to FIG. 9 are
schematic diagrams illustrating a method for manufacturing a CMOS
transistor according to a preferred embodiment of the present
invention. FIG. 10 is a flow diagram of the method of the present
invention to manufacture the CMOS transistor for preventing Ge-out
diffusion. Please refer to FIG. 3. A semiconductor substrate 30 is
provided, in which the semiconductor substrate 30 has at least a
PMOS transistor 32 and an NMOS transistor 34 disposed thereon. The
NMOS transistor 34 is formed in a P well 36 disposed in the
semiconductor substrate 30. The NMOS transistor 34 includes a gate
structure 38A formed on the surface of the semiconductor substrate
30 and a source/drain 40 disposed beside the gate structure 38A.
The PMOS transistor 32 is formed in an N well 44. The PMOS
transistor 32 includes a gate structure 38B formed on the surface
of the semiconductor substrate 30 and a source/drain 46 disposed
beside the gate structure 38B.
[0018] Each of the gate structure 38A, 38B includes a gate
dielectric layer 50, a gate 52, and a cap layer 54. The gate
dielectric layer 50 may include dielectric materials including
silicon oxide, oxynitride, and silicon nitride; high-k dielectric
materials including metal oxide, metal silicate, metal aluminate,
and metal oxynitride; or combinations thereof. The gate dielectric
layer 50 may be formed by a thermal oxidation process, a
nitridation process, or a chemical vapor deposition (CVD) process.
The gate 52 may use polysilicon, SiGe, metal, silicide, metal
nitride, metal oxide, or combinations thereof as material. The
material of the cap layer 54 may include silicon oxide, oxynitride,
silicon nitride, or silicon carbide (SiC). A thermal oxide layer 56
and a spacer 58 are respectively formed on the sidewall of the gate
structure 38A, 38B. The spacers 58 may be a single-layered
structure or a multi-layered structure. The preferred material of
the first spacers 58 may use silicon oxide, silicon nitride,
oxynitride, or other adoptable dielectric material. In addition, a
plurality of isolation structures is disposed between the MOS
transistors to prevent short-circuiting, such as shallow trench
isolations 48 formed between the PMOS transistor 32 and the NMOS
transistor 34. The CMOS transistor 30 has lightly doped drain 50A,
50B respectively disposed beside the gate structure 38A, 38B to
prevent hot electron effect in the PMOS transistor 32 or the NMOS
transistor 34.
[0019] In order to enhance the carrier mobility of the channel
region of the PMOS transistor disposed under the gate structure 38,
the source/drain 46 of the PMOS transistor 32 has Ge therein. The
source/drain 46 of the PMOS transistor 32 of the present embodiment
is formed by several processes. A patterned photoresist (not shown)
is formed on the PMOS transistor 32, and an etch process is
performed to form at least a recess (not shown) on the surface of
the semiconductor substrate 30 beside the gate structure 38B of the
PMOS transistor 32. A selective epitaxial growth process is
performed to form a SiGe epitaxial layer in the recess, wherein the
SiGe epitaxial layer has a greater lattice constant than that of
the semiconductor substrate 30, and is slightly extended
approaching to the channel. Preferably, the SiGe epitaxial layer is
slightly projected from the top surface of the semiconductor
substrate 30 to compress the channel and to keep silicide formed in
the following steps from the interface between the source/drain in
a distance. The top surface of the SiGe epitaxial layer may be
substantially leveled with or lower than the top surface of
semiconductor substrate 30. A heavy doped (P.sup.+) implantation
process is performed to implant P-type dopant, such as boron (B),
into the SiGe epitaxial layer. Thus, the formation of the
source/drain 46 of the PMOS transistor 34 is accomplished.
[0020] As shown in FIG. 4, a mask (not shown) is formed covering
the NMOS transistor 34, and a carbon implantation process is
performed to implant carbon into the source/drain 46 of the PMOS
transistor 32. A carbon-doped layer 60 is formed in the top portion
of the source/drain 46, and the carbon-doped layer 60 has a
thickness between 100 angstrom (.ANG.) and 500 .ANG., preferably
between 200 .ANG. and 300 .ANG.. The implantation energy is
determined by the depth of the dopant. The preferred implantation
energy of the carbon implantation process is approximately between
1 KeV and 5 KeV, and the implantation dosage is approximately
between 10.sup.13 atom/cm.sup.2 and 10.sup.16 atom/cm.sup.2. The
preferred implantation energy of the present embodiment is about 2
KeV, and the preferred implantation dosage is about
1.05.times.10.sup.15 atom/cm.sup.2. In addition, the carbon
implantation of the present invention may also be performed on the
NMOS transistor 32 simultaneously. An annealing process is
optionally performed using a furnace or a rapid thermal process
(RTP) to activate the doped carbon and to repair the lattice
structure of the semiconductor substrate 30 at approximately
between 1000.degree. C. and 1050.degree. C. Thereafter, a
self-aligned silicide process (salicide process) is performed to
form silicide layer 62 on the surface of the source/drain 40, 46.
The silicide layer 62 may include nickel and platinum, and has a
thickness between 50 .ANG. and 500 .ANG., preferably between 100
.ANG. and 300 .ANG.. The steps of the salicide process are well
known, and will not be described in detail.
[0021] As shown in FIG. 5, a first liner 64 and a tensile thin film
65 are respectively formed covering the PMOS transistor 32, the
NMOS transistor 34 and the semiconductor substrate 30. The tensile
thin film 65 of the present invention is a multi-layered tensile
thin film, and includes a buffered tensile thin film 66 and a high
tensile thin film 68. The buffered tensile thin film has a lower
tensile stress than that of the high tensile thin film. A surface
treatment is optional performed, i.e. an RTP or an UV curing
process, to enhance the tensile strain of the tensile thin film 65.
Then, a second liner 70 is formed. In addition, the spacers 58
disposed on the sidewall of the PMOS transistor 32 and the NMOS
transistor 34 may be removed before the formation of the first
liner 64, the tensile thin film 65, and the second liner 70.
Accordingly, the tensile thin film 65 may induce tensile stress
into the channel region of the NMOS transistor 34 more
effectively.
[0022] Please refer to FIG. 6, in which a first patterned
photoresist 72 is formed on the NMOS transistor 34 after the second
liner 70 is formed. The formation of the first patterned
photoresist 72 includes steps of coating the photoresist, an
exposing process and a developing process to define the pattern. An
etch process is performed, such as an isotropic etch process, using
the first patterned photoresist 72 as an etch mask to remove the
buffered tensile thin film 66, the high tensile thin film 68, and
the second liner 70 formed on the PMOS transistor 32. The first
liner 64 acts as an etch stop layer and protects the PMOS
transistor 32 during the etch process. As shown in FIG. 7, the
first pattern photoresist 72 is removed and a high compressive thin
film 74 is formed covering the PMOS transistor 32 and the NMOS
transistor 34. The high compressive thin film 74 of the present
embodiment is formed by another PECVD process, and other methods
for depositing the high compressive thin film 74 are allowable.
[0023] As shown in FIG. 8, a second patterned photoresist 76 is
formed on the NMOS transistor 32. The formation of the second
patterned photoresist 76 includes steps of: coating the
photoresist, an exposing process and a developing process to define
the pattern. Another etch process is performed using the second
patterned photoresist 76 as an etch mask to remove the exposed thin
film, for instance, the high compressive thin film 74 and the
second liner 70 disposed on the NMOS transistor 34, and so that the
high compressive thin film 74 disposed on the gate structure 38B
and the surface of the source/drain 46 of the PMOS 74 is
protected.
[0024] As shown in FIG. 9, the second patterned photoresist 76
disposed on the PMOS transistor 32 is removed, and therefore, the
basic structure of a CMOS transistor 78 is formed by the method of
the present invention. The tensile thin film 65 disposed on the
NMOS 34 and the high compressive thin film 74 disposed on the PMOS
transistor 32 may act as a CESL of the CMOS transistor 78.
Furthermore, an inter-layer dielectric (ILD) layer (not shown) and
a patterned photoresist (not shown) are formed, and an anisotropic
etching process is performed using the patterned photoresist as an
etching mask to form a plurality of contact holes (not shown) in
the ILD layer and the CESL (the tensile thin film 65 and the high
compressive thin film 74). The contact holes are the connections
between the gate structures 38A, 38B or the sources/drains 40, 46
of the PMOS transistor 32 and the NMOS transistor 34 with other
electrical devices.
[0025] Please refer to FIG. 10, which is a flow diagram
illustrating the method of manufacturing the CMOS transistor of the
present invention. The steps of the present embodiment are
illustrated as follows.
[0026] Step 100: A semiconductor substrate is provided. The
semiconductor substrate has at least a PMOS transistor and at least
an NMOS transistor formed thereon. The source/drain of the PMOS
transistor is a SiGe epitaxial layer.
[0027] Step 102: A carbon implantation process is performed upon
the source/drain of the PMOS transistor. A carbon-doped layer is
formed in the top portion of the source/drain of the PMOS
transistor.
[0028] Step 104: A salicide process is performed to form a silicide
layer on the respective source/drain of the PMOS transistor and the
NMOS transistor.
[0029] Step 106: A tensile thin film is formed. The tensile thin
film includes a buffered tensile thin film and a high tensile thin
film. The high tensile thin film has a greater stress status than
that of the buffered tensile thin film.
[0030] Step 108: A surface treatment is performed, such as an RTP
or an UV curing process, to strengthen the stress status of the
tensile thin film.
[0031] Step 110: A portion of the tensile thin film disposed on the
PMOS transistor is removed.
[0032] Step 112: A high compressive thin film is formed covering
the PMOS transistor and the NMOS transistor.
[0033] Step 114: A portion of the high compressive thin film
disposed on the NMOS transistor is removed.
[0034] Additionally, the tensile thin film 65 disposed on the PMOS
transistor 78 may be preserved for simplifying steps of fabricating
the CMOS transistor 78 of the present invention. The formation of
the high compressive thin film 78 on the PMOS transistor 32 is
optional.
[0035] Please refer to FIG. 11, which is a SEM photo of the CMOS
transistor 78 manufactured by the method of the present invention.
Referring to FIG. 2 and FIG. 11, Ge-out diffusion occurs at the
conventional CMOS transistor 10 and forms a plurality of black
spots on the nickel silicide layer 26 shown in FIG. 2. In contrast,
no black spot is observed on the silicide 62 of the CMOS transistor
78 formed by the method of the present invention.
[0036] As described above, the present invention utilizing a carbon
implantation process prior to the formation of the silicide, to
implant carbon, which has a smaller radius than the silicon and is
neutral, into the source/drain 46 of the PMOS transistor 32, in
which the source drain 46 of the PMOS transistor 32 comprises SiGe
epitaxial layer. Additionally, the buffered tensile thin film 66 is
formed between the high tensile thin film 68 and the silicide layer
62. According to our experiment, the Ge-out diffusion is suppressed
in proportion to the thickness of the buffered tensile thin film
66. However, thickness increase of the buffered tensile thin film
66 reduces the ion gain effect of the CMOS transistor 78.
Therefore, the present invention using the carbon implantation
process to implant carbon as dopant into the lattice of the SiGe
epitaxial layer for stabilizing the Ge atom in the SiGe epitaxial
layer, reducing the thickness of the buffered tensile thin film 66
and maintaining the ion gain effect of the CMOS transistor 78. And
accordingly, the present invention combines the carbon-doped layer
60 formed by the carbon implantation process and the buffered
tensile thin film 66 to prevent Ge-out diffusion. However, other
amorphous dopants, i.e. Ar, Ge, In, which have a smaller radius
than the silicon and are neutral, are useless for preventing Ge-out
diffusion.
[0037] Furthermore, the formation of the carbon-doped layer in the
top portion of the source/drain 46 of the 32 is not limited to be
formed prior to the formation of the silicide, which are
illustrated in the preferred embodiment. The carbon-doped layer may
be formed during the formation of the source/drain 46 of the PMOS
transistor 32. For instance, a carbon implantation process is
performed prior to the heavy doped implantation process for
implanting P-type dopants into the semiconductor substrate 30. In
addition, the carbon implantation process may be performed after
the heavy doped implantation process. On the other hand, the
carbon-doped layer may be formed during the selective epitaxial
growth process for forming the SiGe epitaxial layer. For instance,
carbon may be added as material of the epitaxial layer during the
selective epitaxial growth process. The concentration of the carbon
may be increased during the formation of the SiGe epitaxial layer.
Therefore, a carbon-doped layer is formed, in which the
concentration of the carbon is higher in the later formed SiGe
epitaxial layer than in the prior formed SiGe epitaxial layer.
After the SiGe epitaxial layer having the carbon-doped layer is
formed, a buffered tensile thin film and a high tensile thin film
are formed on the CMOS transistor to prevent Ge-out diffusion. In
addition, another carbon implantation process may be performed on
the SiGe epitaxial layer having the carbon-doped layer thereof to
increase the concentration of the carbon in the top portion of the
source/drain of the PMOS transistor.
[0038] According to afore-mentioned embodiment, the present
invention utilizes a carbon implantation process to implant carbon
into the top portion of the source/drain of the PMOS transistor,
particularly to the portion approaching to the surface of the
source/drain of the PMOS transistor. The carbon implantation
process is performed before the salicide process. After that, a
silicide layer and a CESL having tensile strain or compressive
strain are formed on the NMOS transistor and the PMOS transistor.
Therefore, the CMOS transistor of the present invention is formed.
The carbon-doped layer may act as a barrier layer during several
high temperature processes, such as the salicide process, the
annealing process, and the RTP process. In addition, the CMOS
transistor is silicon cap-free, and therefore, the SiGe epitaxial
layer has a facet near the spacer for providing a better
compressive strain into the channel region of the PMOS for
increasing carrier mobility thereof.
[0039] Those skilled in the art will readily observe that numerous
modifications and alterations of the device and method may be made
while retaining the teachings of the invention.
* * * * *