U.S. patent application number 12/536663 was filed with the patent office on 2009-12-10 for packaging material with electromagnetic coupling module.
This patent application is currently assigned to MURATA MANUFACTURING CO., LTD.. Invention is credited to Noboru KATO, Makoto OSAMURA, Norio SAKAI.
Application Number | 20090302972 12/536663 |
Document ID | / |
Family ID | 39681487 |
Filed Date | 2009-12-10 |
United States Patent
Application |
20090302972 |
Kind Code |
A1 |
OSAMURA; Makoto ; et
al. |
December 10, 2009 |
PACKAGING MATERIAL WITH ELECTROMAGNETIC COUPLING MODULE
Abstract
A packaging material includes an electromagnetic coupling module
for an RFID system, in which a radio IC chip is protected from
external shock and environmental change without affecting the
planarity of the packaging material, the assembly including an
electromagnetic coupling module is facilitated, and the radiation
characteristics are satisfactory. A packaging material includes a
liner and a wave-shaped core material, wherein an electromagnetic
coupling module is arranged inside of the packaging material. The
electromagnetic coupling module includes a radio IC chip and a
feeder circuit board, on which the radio IC chip is mounted, the
feeder circuit board including a resonant circuit that includes an
inductance element. The packaging material is made of a dielectric,
wherein the dielectric and the electromagnetic coupling module are
electromagnetically coupled to transmit/receive high frequency
signals.
Inventors: |
OSAMURA; Makoto; (Mukou-shi,
JP) ; SAKAI; Norio; (Moriyama-shi, JP) ; KATO;
Noboru; (Moriyama-shi, JP) |
Correspondence
Address: |
MURATA MANUFACTURING COMPANY, LTD.;C/O KEATING & BENNETT, LLP
1800 Alexander Bell Drive, SUITE 200
Reston
VA
20191
US
|
Assignee: |
MURATA MANUFACTURING CO.,
LTD.
Nagaokakyo-shi
JP
|
Family ID: |
39681487 |
Appl. No.: |
12/536663 |
Filed: |
August 6, 2009 |
Related U.S. Patent Documents
|
|
|
|
|
|
Application
Number |
Filing Date |
Patent Number |
|
|
PCT/JP2008/050358 |
Jan 15, 2008 |
|
|
|
12536663 |
|
|
|
|
Current U.S.
Class: |
333/175 |
Current CPC
Class: |
H01Q 1/2225 20130101;
B65D 2203/10 20130101; B65D 65/403 20130101; H01Q 1/2216 20130101;
H01L 2224/16225 20130101; H01Q 1/2208 20130101; G06K 19/07749
20130101; H01Q 1/12 20130101 |
Class at
Publication: |
333/175 |
International
Class: |
H03H 7/00 20060101
H03H007/00 |
Foreign Application Data
Date |
Code |
Application Number |
Feb 6, 2007 |
JP |
2007-026461 |
Claims
1. A packaging material with an electromagnetic coupling module
comprising: a packaging material including a liner, and a core
material connected to the liner; and an electromagnetic coupling
module including a radio IC chip and a feeder circuit board on
which the radio IC chip is mounted, the feeder circuit board
including a resonant circuit that includes an inductance element
and has a predetermined resonant frequency; wherein the
electromagnetic coupling module is arranged inside of the packaging
material; and at least one of the liner or the core material is a
dielectric, the feeder circuit board being electromagnetically
coupled with the at least one of the liner or the core material
which is the dielectric, and arranged to radiate a transmission
signal supplied from the resonant circuit through electromagnetic
coupling and/or to supply the resonant circuit with a received
reception signal through the electromagnetic coupling.
2. The packaging material with the electromagnetic coupling module
according to claim 1, wherein the electromagnetic coupling module
is arranged on the core material.
3. The packaging material with the electromagnetic coupling module
according to claim 1, wherein the electromagnetic coupling module
is arranged on the liner.
4. The packaging material with the electromagnetic coupling module
according to claim 1, wherein at least one of the liner and the
core material is made of paper.
5. The packaging material with the electromagnetic coupling module
according to claim 1, wherein the liner is sheet-shaped.
6. The packaging material with the electromagnetic coupling module
according to claim 1, wherein the core material is wave-shaped.
7. The packaging material with the electromagnetic coupling module
according to claim 1, wherein the packaging material further
includes another liner, and the core material is disposed between
the liner and the another liner.
Description
BACKGROUND OF THE INVENTION
[0001] 1. Field of the Invention
[0002] The present invention relates to packaging materials with
electromagnetic coupling modules, and more particularly, to a
packaging material with an electromagnetic coupling module having a
radio IC chip used in an RFID (Radio Frequency Identification)
system.
[0003] 2. Description of the Related Art
[0004] Recently, RFID systems, in which a reader/writer that
generates an induction field contactlessly communicates with an IC
chip (also referred to as an IC tag and a radio IC chip) that is
attached to an article or a container and stores predetermined
information to exchange information, have been developed as article
management systems. For example, Japanese Unexamined Patent
Application Publication No. 2003-26177 discloses a packaging body
having an antenna unit and an IC chip that are electrically
conductive and provided on an outer surface of a cardboard box.
Covering the IC chip with another surface to protect the IC chip is
also described.
[0005] However, attaching the antenna unit and the IC chip onto the
outer surface of the packaging body has a problem of being easily
influenced by an external environment, and furthermore, increased
thickness areas are provided because the attachment areas project
outwardly, whereby accurate stacking such as when stacking and
storing the packaging bodies is difficult. When another article
contacts the projecting IC chip, the IC chip may be damaged by the
shock. The antenna unit and the IC chip must be arranged to overlap
each other in an electrically conductive manner. Since the
displacement in the overlapping state causes trouble in
transmission and reception of signals, high accuracy is required
with this arrangement. Furthermore, the radiation characteristic
during transmission and reception may not be sufficient since the
antenna unit is relatively small.
SUMMARY OF THE INVENTION
[0006] To overcome the problems described above, preferred
embodiments of the present invention provide a packaging material
with an electromagnetic coupling module that is suitable for an
RFID system, in which the radio IC chip is protected from external
shock and environmental changes without affecting the planarity of
the packaging material, the arrangement of the electromagnetic
coupling module is facilitated, and the radiation characteristics
are satisfactory.
[0007] A packaging material with an electromagnetic coupling module
according to a preferred embodiment of the present invention
includes a packaging material including a sheet-shaped liner, and a
wave-shaped core material connected to the liner, and an
electromagnetic coupling module including a radio IC chip and a
feeder circuit board, on which the radio IC chip is mounted, the
feeder circuit board including a resonant circuit that includes an
inductance element and that has a predetermined resonant frequency,
wherein the electromagnetic coupling module is arranged inside of
the packaging material, and the liner or the core material is a
dielectric, the feeder circuit board being electromagnetically
coupled with the liner or the core material, which is the
dielectric, to radiate a transmission signal supplied from the
resonant circuit through electromagnetic coupling, and/or to supply
the resonant circuit with a received reception signal through
electromagnetic coupling.
[0008] In the packaging material with an electromagnetic coupling
module according to a preferred embodiment of the present
invention, the radio IC chip and the feeder circuit board
preferably define the electromagnetic coupling module, where an
electromagnetic wave is input to the dielectric and the dielectric
functions as an electromagnetic radiator by adjusting the
characteristic impedance of an input/output portion of the
electromagnetic coupling module to characteristic impedance around
an interface of the dielectric. Since the electromagnetic coupling
module and the dielectric are electromagnetically coupled without
being directly electrically coupled, the electromagnetic coupling
module also operates even if arranged in the vicinity of the
dielectric. Furthermore, since the electromagnetic coupling module
does not have to be highly accurately arranged with respect to the
dielectric, the arrangement process is significantly
simplified.
[0009] The radio IC chip is preferably protected from external
shock and environmental change without affecting the planarity of
the packaging material since the electromagnetic coupling module is
arranged inside of the packaging material. The frequency of the
transmission signal radiated from the dielectric and the frequency
of the reception signal supplied to the radio IC chip are
preferably substantially determined by the resonant frequency of
the resonant circuit in the feeder circuit board, various shapes of
the dielectric can be used and a stable frequency characteristic
can be obtained, whereby the radiation characteristic is
satisfactory.
[0010] Herein, the dielectric indicates a material having a
dielectric constant equal to or greater than about 1, and may
preferably be paper or resin (polyethylene, polypropylene,
polyamide, cellophane, and polyethylene terephthalate), for
example.
[0011] The radio IC chip may preferably store various kinds of
information regarding the contents of the packaging material
attached with the electromagnetic module. The information may be
rewritable. The radio IC chip may have an information processing
function other than that for the RFID system.
[0012] According to a preferred embodiment of the present
invention, a radio IC chip is protected from external shock and
environmental change without affecting the planarity of the
packaging material, high accuracy is not required when connecting
the radiator and the electromagnetic coupling module and the
assembly thereof is facilitated since the electromagnetic coupling
module is arranged inside of the packaging material. The
electromagnetic coupling module and the dielectric (liner or core
material) are preferably electromagnetically coupled, an arbitrary
shape of the dielectric (liner or core material) may be used, the
radiation characteristic is satisfactory, and a stable frequency
characteristic is obtained.
[0013] Other features, elements, steps, characteristics and
advantages of the present invention will become more apparent from
the following detailed description of preferred embodiments of the
present invention with reference to the attached drawings.
BRIEF DESCRIPTION OF THE DRAWINGS
[0014] FIG. 1 is a sectional view showing a first preferred
embodiment of a packaging material according to the present
invention.
[0015] FIG. 2 is a perspective view of the packaging material
according to the first preferred embodiment of the present
invention shown in FIG. 1.
[0016] FIG. 3 is a sectional view showing an electromagnetic
coupling module.
[0017] FIG. 4 is an equivalent circuit diagram of the
electromagnetic coupling module.
[0018] FIG. 5 is an exploded perspective view showing a feeder
circuit board.
[0019] FIGS. 6A and 6B are perspective views showing a connection
state of a radio IC chip and the feeder circuit board.
[0020] FIG. 7A is a sectional view showing a second preferred
embodiment of a packaging material according to the present
invention, and 7B is a sectional view showing a modified example
thereof.
[0021] FIG. 8 is a sectional view showing a third preferred
embodiment of a packaging material according to the present
invention.
[0022] FIG. 9 is a sectional view showing a fourth preferred
embodiment of a packaging material according to the present
invention.
DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS
[0023] Preferred embodiments of a packaging material including an
electromagnetic coupling module according to the present invention
will be described below with reference to the accompanying
drawings. In each figure, the same reference numerals are used to
denote common components and portions, and redundant description
will not be provided.
First Preferred Embodiment
[0024] FIGS. 1 and 2 show a first preferred embodiment of a
packaging material including an electromagnetic coupling module
according to the present invention, where a packaging material 20
is a cardboard box preferably made of paper, for example, and
includes front and back liners 21 and 22, and a core material 23,
which preferably has a wave shape (e.g., corrugated) cross-section,
disposed between the liners 21 and 22. The packaging material 20
may preferably include the liner 21 on the upper side and the core
material 23, as shown in FIGS. 1 and 2.
[0025] The electromagnetic coupling module 1 including a radio IC
chip 5 and a feeder circuit board 10, on which the radio IC chip 5
is mounted, is preferably adhered to a recessed portion of the core
material 23 with an adhesive 19 interposed therebetween. The
adhesive 19 preferably has an insulation property, and is
preferably made of a material having a high dielectric
constant.
[0026] The liners 21 and 22 and the core material 23 defining the
packaging material 20 are all preferably made of paper and are
dielectrics, in which the electromagnetic coupling module 1
electromagnetically couples with the adhesive 19, the core material
23, and the liner 21, which are dielectrics, radiates a
transmission signal supplied from a resonant circuit 16, to be
described below, through electromagnetic coupling, and supplies the
resonant circuit 16 with a received reception signal through
electromagnetic coupling. In this case, the liner 21 primarily
functions as the radiator of the electromagnetic wave.
Electromagnetic Coupling Module
[0027] As shown in FIG. 3, the electromagnetic coupling module 1
includes the radio IC chip 5, and the feeder circuit board 10 on
which the radio IC chip 5 is mounted. The radio IC chip 5
preferably includes a clock circuit, a logic circuit, a memory
circuit, and other suitable components, stores necessary
information, and is electrically connected to a resonant circuit 16
included in the feeder circuit board 10 with metal bumps 6
interposed therebetween. Au, solder, and other suitable materials
can preferably be used for the material of the metal bump 6.
[0028] The resonant circuit 16 is preferably arranged to supply the
dielectric (liner 21) with a transmission signal having a
predetermined frequency, and/or arranged to select a reception
signal having a predetermined frequency from signals received by
the radiator 25 and to supply the dielectric (liner 21) with the
selected signal, the resonant circuit 16 resonating at a
predetermined frequency. As shown in FIG. 3 and FIG. 4, the
resonant circuit 16 preferably includes a lumped-constant LC series
resonant circuit including a helical inductance element L and
capacitance elements C1 and C2.
[0029] Specifically, as shown in FIG. 5, the feeder circuit board
10 is preferably formed by stacking, pressure bonding, and firing
ceramic sheets 11A to 11G including a dielectric, and includes a
sheet 11A including a connection electrode 12 and a via hole
conductor 13a, a sheet 11B including a capacitor electrode 14a, a
sheet 11C including a capacitor electrode 14b and a via hole
conductor 13b, a sheet 11D including a via hole conductor 13c, a
sheet 11E including a conductor pattern 15a and a via hole
conductor 13d, a sheet 11f (one or more) including a via hole
conductor 13e, and a sheet 11G including a conductor pattern 15b.
Each ceramic sheet 11A to 11G may preferably be a sheet made of
ceramic material of a magnetic body, for example, and the feeder
circuit board 10 can preferably be easily obtained through a
multi-layer substrate fabricating step, such as a sheet stacking
method, a thick film printing method, for example.
[0030] When the sheets 11A to 11G are stacked, the inductance
element L in which a helical winding axis is parallel or
substantially parallel to the dielectric (liner 21), and the
capacitance elements C1 and C2 in which the capacitor electrode 14b
is connected to both ends of the inductance element L and the
capacitor electrode 14a is connected to the connection electrode 12
through the via conductor 13a are provided. The connection
electrode 12, which is a substrate side electrode pattern, is
preferably electrically connected with a terminal (see FIGS. 6A and
6B) of the radio IC chip 5 with the metal bump 6 interposed
therebetween.
[0031] In other words, of the elements defining the resonant
circuit, the transmission signal is supplied from the inductance
element L, which is preferably a coil-shaped electrode pattern, for
example, to the dielectric (liner 21) through the magnetic field,
and the reception signal is preferably supplied from the dielectric
(liner 21) to the inductance element L through the magnetic field.
Thus, in the feeder circuit board 10, the inductance element L is
preferably arranged so as to be close to the dielectric (liner 21)
of the inductance element L and the capacitance elements C1 and C2
defining the resonant circuit 16.
[0032] FIG. 6A shows a connection mode of the radio IC chip 5 and
the feeder circuit board 10. In FIG. 6A, a pair of antenna
(balance) terminals 7a and 17a is provided on the back surface of
the radio IC chip 5 and the front surface of the feeder circuit
board 10, respectively. FIG. 6B shows another connection mode, in
which ground terminals 7b and 17b are respectively provided on the
back surface of the radio IC chip 5 and the front surface of the
feeder circuit board 10, in addition to the pair of antenna
(balance) terminals 7a and 17a. The ground terminal 17b of the
feeder circuit board 10 is terminated, and is not connected to
other elements of the feeder circuit board 10.
[0033] FIG. 4 shows an equivalent circuit of the electromagnetic
coupling module 1. The electromagnetic coupling module 1 receives
the high frequency signal (e.g., UHF frequency band) radiated from
the reader/writer (not shown) with the dielectric (liner 21),
resonates the resonant circuit 16 (LC series resonant circuit
including inductance element L and capacitance elements C1 and C2)
that is primarily magnetically coupled with the dielectric (liner
21), and supplies the radio IC chip 5 with only the reception
signal of a predetermined frequency band. The predetermined energy
is output from such a reception signal, and the information stored
in the radio IC chip 5 is preferably adjusted to match a
predetermined frequency in the resonant circuit 16 with the energy
as a driving source, and thereafter, the transmission signal is
transmitted from the inductance element L to the dielectric (liner
21) through magnetic coupling and then transmitted and transferred
from the dielectric (liner 21) to the reader/writer.
[0034] The coupling of the resonant circuit 16 and the dielectric
is preferably primarily a coupling through a magnetic field, but
may be also include coupling through an electric field. In
preferred embodiments of the present invention, "electromagnetic
coupling" refers to the coupling through an electric field and/or a
magnetic field.
[0035] In the resonant circuit 16, the resonant frequency
characteristic is determined by the resonant circuit defined by the
inductance element L and the capacitance elements C1 and C2. The
resonant frequency of the signal radiated from the dielectric is
substantially determined by the self-resonant frequency of the
resonant circuit 16. Therefore, the dielectric having any suitable
shape can be used, and the relative position of the electromagnetic
coupling module 1 with respect to the dielectric is arbitrary.
Therefore, the attachment position of the electromagnetic coupling
module 1 does not need to be controlled with high accuracy.
[0036] Furthermore, the coil-shaped electrode pattern defining the
inductance element L is preferably configured such that the winding
axis is parallel or substantially parallel to the dielectric, and
thus, has an advantage in that the center frequency does not
substantially fluctuate. Since the capacitance elements C1 and C2
are preferably arranged at the post-stage of the radio IC chip 5,
the surge of low frequency can be cut with the elements C1 and C2,
and the radio IC chip 5 can be effectively protected from the
surge.
[0037] The resonant circuit 16 also preferably functions as a
matching circuit arranged to match the impedance of the radio IC
chip 5 and the impedance of the dielectric. The feeder circuit
board 10 may preferably include a matching circuit, defined by the
inductance element and the capacitance element, provided separately
from the resonant circuit 16. If the function of the matching
circuit is also provided by the resonant circuit 16, the design of
the resonant circuit 16 tends to become complicated. If the
matching circuit is provided separately from the resonant circuit
16, the resonant circuit and the matching circuit can be
independently designed.
[0038] According to the first preferred embodiment of the present
invention, since the electromagnetic coupling module 1 is arranged
inside of the packaging material 20, the radio IC chip 5 can be
protected from external shock and environmental changes without
affecting the planarity of the packaging material 20. Furthermore,
since the frequency of the transmission/reception signal is
substantially determined by the resonant frequency of the resonant
circuit 16 of the feeder circuit board 10, high accuracy is not
required when connecting the dielectric and the electromagnetic
coupling module 1 and the assembly thereof is facilitated.
Moreover, the electromagnetic coupling module 1 and the dielectric
are electromagnetically coupled, any suitable arbitrary shape of
the dielectric may be used, the radiation characteristics are
satisfactory, and a stable frequency characteristic is
obtained.
Second Preferred Embodiment
[0039] As shown in FIG. 7A, the second preferred embodiment of the
present invention describes the arrangement of the feeder circuit
board 10 of the electromagnetic module 1 on an inner surface side
of the liner 21 with the adhesive 19. The liner 21 is a dielectric
and functions as a radiator, as described in the first preferred
embodiment. The effects and advantages of the second preferred
embodiment are similar to the first preferred embodiment. The
packaging material 20 may preferably include the liner 21 on the
upper side and the core material 23, as shown in FIG. 7B.
Third Preferred Embodiment
[0040] As shown in FIG. 8, the third preferred embodiment of the
present invention describes the arrangement of the feeder circuit
board 10 of the electromagnetic coupling module 1 on an inclined
portion of the core material 23 with the adhesive 19. The core
material 23 is a dielectric and functions as a radiator. The
effects and advantages of the third preferred embodiment are
similar to the first preferred embodiment.
Fourth Preferred Embodiment
[0041] As shown in FIG. 9, the fourth preferred embodiment of the
present invention describes an arrangement in which a hole 22a is
provided in the liner 22 and the electromagnetic module 1 is fixed
in the hole 22a with the adhesive 19. In this case, the liner 22,
which is a dielectric, functions as the radiator of the
electromagnetic coupling module 1. The effects and advantages of
the fourth preferred embodiment are similar to the first preferred
embodiment.
[0042] The packaging material including the electromagnetic
coupling module according to the present invention is not limited
to the above-described preferred embodiments, and can be variously
changed within the scope of the invention.
[0043] In particular, a paper cardboard box is described for the
packaging material including the electromagnetic coupling module
and the radiator in each of the preferred embodiments described
above. However, the packaging material may preferably be made of
resin, for example. The details of the internal configuration of
the feeder circuit board and the detailed shape of the radiator can
be arbitrarily selected, and the feeder circuit board may
preferably be made of a flexible material, for example.
Furthermore, processes other than metal bump bonding may preferably
be used to connect the radio IC chip to the feeder circuit
board.
[0044] As described above, preferred embodiments of the present
invention are useful for the packaging material including the
electromagnetic coupling module, and are particularly advantageous
in that the radio IC chip is protected from external shock and
environmental changes without affecting the planarity of the
packaging material, the arrangement of the electromagnetic coupling
module is easy, and the radiation characteristic is
satisfactory.
[0045] While preferred embodiments of the present invention have
been described above, it is to be understood that variations and
modifications will be apparent to those skilled in the art without
departing the scope and spirit of the present invention. The scope
of the present invention, therefore, is to be determined solely by
the following claims.
* * * * *