Sakai; Norio

Patent Applications and Registrations

Patent applications and USPTO patent grants for Sakai; Norio.The latest application filed is for "information output system and information output method".

Company Profile

7.85.84

Sakai; Norio - Kyoto JP
Sakai; Norio - Kanagawa N/A JP
Sakai; Norio - Nagaokakyo JP
SAKAI; Norio - Edogawa JP
SAKAI; Norio - Nagaokakyo-shi JP
Sakai; Norio - Kyoto-fu JP
Sakai; Norio - Moriyama JP
Sakai; Norio - Neyagawa N/A JP
SAKAI; NORIO - YOKOHAMA-SHI JP
SAKAI; Norio - Moriyama-shi JP
Sakai; Norio - Kanagawa-ken N/A JP
Sakai; Norio - Yokohama JP
Sakai; Norio - Shiga-ken JP

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Coil component Grant 11,430,601 - Otsubo , et al. August 30, 2	2022-08-30
Inductor component manufacturing method and inductor component Grant 11,239,022 - Otsubo , et al. February 1, 2	2022-02-01
Inductor component Grant 11,164,695 - Otsubo , et al. November 2, 2	2021-11-02
Coil component Grant 11,139,101 - Otsubo , et al. October 5, 2	2021-10-05
Coil module Grant 11,075,029 - Banba , et al. July 27, 2	2021-07-27
High-frequency component Grant 10,912,188 - Otsubo , et al. February 2, 2	2021-02-02
Coil component Grant 10,886,059 - Otsubo , et al. January 5, 2	2021-01-05
Inductor component Grant 10,734,156 - Otsubo , et al.	2020-08-04
Inductor device, inductor array, and multilayered substrate, and method for manufacturing inductor device Grant 10,734,150 - Otsubo , et al.	2020-08-04
Inductor component and manufacturing method for inductor component Grant 10,726,988 - Otsubo , et al.	2020-07-28
Inductor component and method for manufacturing the same Grant 10,672,554 - Sakai , et al.	2020-06-02
Information output system and information output method Grant 10,638,014 - Nagai , et al.	2020-04-28
High-frequency module and manufacturing method therefor Grant 10,559,535 - Otsubo , et al. Feb	2020-02-11
Coil component and module including the same Grant 10,553,341 - Otsubo , et al. Fe	2020-02-04
Module Grant 10,553,347 - Banba , et al. Fe	2020-02-04
Inductor component and method of manufacturing inductor component Grant 10,506,717 - Otsubo , et al. Dec	2019-12-10
Electrical element, mobile device, and method for manufacturing electrical element Grant 10,476,133 - Okamoto , et al. Nov	2019-11-12
Information Output System And Information Output Method App 20190306368 - NAGAI; Tasuku ; et al.	2019-10-03
Inductor and method for manufacturing the same Grant 10,418,168 - Otsubo , et al. Sept	2019-09-17
Coil module Grant 10,410,782 - Otsubo , et al. Sept	2019-09-10
Coil component, coil module, and method for manufacturing coil component Grant 10,403,431 - Banba , et al. Sep	2019-09-03
Transmission Device And Transmission Method App 20190158638 - YANAI; Koji ; et al.	2019-05-23
Inductor And Method For Manufacturing The Same App 20180366258 - Otsubo; Yoshihito ; et al.	2018-12-20
Image processing apparatus, information processing apparatus and image processing method Grant 10,136,015 - Komura , et al. November 20, 2	2018-11-20
Inductor Component And Method For Manufacturing The Same App 20180330870 - SAKAI; Norio ; et al.	2018-11-15
Inductor Component And Method Of Manufacturing Inductor Component App 20180332709 - Otsubo; Yoshihito ; et al.	2018-11-15
Resin multilayer substrate Grant 10,080,280 - Sakai , et al. September 18, 2	2018-09-18
Electronic circuit module Grant 10,056,311 - Otsubo , et al. August 21, 2	2018-08-21
High-frequency Module And Manufacturing Method Therefor App 20180166394 - OTSUBO; Yoshihito ; et al.	2018-06-14
Inductor Component App 20180090263 - Otsubo; Yoshihito ; et al.	2018-03-29
Image Processing Apparatus, Information Processing Apparatus And Image Processing Method App 20180069977 - KOMURA; Taro ; et al.	2018-03-08
Resin Multilayer Substrate App 20170347447 - Sakai; Norio ; et al.	2017-11-30
Electronic Circuit Module App 20170323838 - OTSUBO; Yoshihito ; et al.	2017-11-09
Coil Component App 20170301456 - OTSUBO; Yoshihito ; et al.	2017-10-19
Resin multilayer substrate Grant 9,769,917 - Sakai , et al. September 19, 2	2017-09-19
High-frequency Component App 20170231085 - Otsubo; Yoshihito ; et al.	2017-08-10
Coil Component App 20170221624 - OTSUBO; Yoshihito ; et al.	2017-08-03
Inductor Component App 20170213638 - Otsubo; Yoshihito ; et al.	2017-07-27
Inductor Component And Manufacturing Method For Inductor Component App 20170186528 - Otsubo; Yoshihito ; et al.	2017-06-29
Inductor Component Manufacturing Method And Inductor Component App 20170178796 - OTSUBO; Yoshihito ; et al.	2017-06-22
Coil Module App 20170092415 - BANBA; Shinichiro ; et al.	2017-03-30
Coil Component App 20170084384 - OTSUBO; Yoshihito ; et al.	2017-03-23
Coil Component And Module Including The Same App 20170062113 - Otsubo; Yoshihito ; et al.	2017-03-02
Coil Module App 20170018349 - OTSUBO; Yoshihito ; et al.	2017-01-19
Inductor Device, Inductor Array, And Multilayered Substrate, And Method For Manufacturing Inductor Device App 20160372246 - OTSUBO; Yoshihito ; et al.	2016-12-22
Electrical Element, Mobile Device, And Method For Manufacturing Electrical Element App 20160372819 - OKAMOTO; Bunta ; et al.	2016-12-22
Coil Component, Coil Module, And Method For Manufacturing Coil Component App 20160372259 - BANBA; Shinichiro ; et al.	2016-12-22
Component-embedded resin substrate Grant 9,526,176 - Sakai , et al. December 20, 2	2016-12-20
Module App 20160358707 - BANBA; Shinichiro ; et al.	2016-12-08
Multilayer wiring substrate, probe card, and method for manufacturing multilayer wiring substrate Grant 9,456,494 - Sakai , et al. September 27, 2	2016-09-27
Image Processing Apparatus, Image Forming Apparatus, And Image Processing Method App 20160212305 - SAKAI; Norio	2016-07-21
Image processing apparatus, image processing method, and recording medium Grant 9,344,589 - Sakai May 17, 2	2016-05-17
Multilayer flexible substrate Grant 9,253,881 - Sakai , et al. February 2, 2	2016-02-02
Multilayer ceramic electronic device and method for manufacturing the same Grant 9,226,400 - Nomiya , et al. December 29, 2	2015-12-29
Pharmaceutical composition for treating lysosomal storage disease Grant 9,138,465 - Ozono , et al. September 22, 2	2015-09-22
Image Processing Apparatus, Image Processing Method, And Recording Medium App 20150222764 - SAKAI; Norio	2015-08-06
Reactor Oscillation Power Range Monitor, Reactor Oscillation Power Range Monitoring Method, And Recording Medium Containing Reactor Oscillation Power Range Monitoring Program App 20140355730 - SATO; SEIGO ; et al.	2014-12-04
Resin Multilayer Substrate App 20140321076 - Sakai; Norio ; et al.	2014-10-30
Module, Method For Manufacturing The Module, And Electronic Apparatus Including The Module App 20140251670 - SAKAI; Norio ; et al.	2014-09-11
Component-embedded Resin Substrate App 20140218884 - Sakai; Norio ; et al.	2014-08-07
Multilayer Wiring Substrate, Probe Card, And Method For Manufacturing Multilayer Wiring Substrate App 20140209356 - SAKAI; Norio ; et al.	2014-07-31
Method for manufacturing multilayer substrate with built-in chip-type electronic component Grant 8,720,050 - Chikagawa , et al. May 13, 2	2014-05-13
Pharmaceutical Composition For Treating Lysosomal Storage Disease App 20140044694 - Ozono; Keiichi ; et al.	2014-02-13
Multilayer Ceramic Electronic Device And Method For Manufacturing The Same App 20140016288 - NOMIYA; Masato ; et al.	2014-01-16
Multilayer substrate and manufacturing method thereof Grant 8,604,349 - Sakai December 10, 2	2013-12-10
Multilayer Flexible Substrate App 20130256001 - SAKAI; Norio ; et al.	2013-10-03
Steam turbine Grant 8,419,354 - Sakai , et al. April 16, 2	2013-04-16
Electronic Component Incorporating Board And Composite Module App 20130050957 - OGAWA; Nobuaki ; et al.	2013-02-28
Method for manufacturing multilayer ceramic electronic device Grant 8,371,026 - Nomiya , et al. February 12, 2	2013-02-12
Via hole forming method using electrophotographic printing method Grant 8,308,887 - Isebo , et al. November 13, 2	2012-11-13
Packaging material with electromagnetic coupling module Grant 8,299,968 - Osamura , et al. October 30, 2	2012-10-30
Image processing device, image processing method, and image forming apparatus Grant 8,248,668 - Sakai August 21, 2	2012-08-21
Multilayer Substrate And Manufacturing Method Thereof App 20120205145 - SAKAI; Norio	2012-08-16
Electronic Component Module And Manufacturing Method Therefor App 20120176751 - SAKAI; Norio ; et al.	2012-07-12
Steam Turbine App 20120099967 - SAKAI; Norio ; et al.	2012-04-26
Via Hole Forming Method Using Electrophotographic Printing Method App 20110265948 - ISEBO; Kazuhiro ; et al.	2011-11-03
Container with electromagnetic coupling module Grant 8,031,124 - Kato , et al. October 4, 2	2011-10-04
Via hole forming method using electrophotographic printing method Grant 8,012,287 - Isebo , et al. September 6, 2	2011-09-06
Composite substrate and method for manufacturing composite substrate Grant 7,851,708 - Sakai , et al. December 14, 2	2010-12-14
Multilayer Substrate With Built-in Chip-type Electronic Component And Method For Manufacturing The Same App 20100212152 - CHIKAGAWA; Osamu ; et al.	2010-08-26
Multilayer substrate with built-in-chip-type electronic component and method for manufacturing the same Grant 7,750,247 - Chikagawa , et al. July 6, 2	2010-07-06
Method for forming circuit pattern Grant 7,736,830 - Kamada , et al. June 15, 2	2010-06-15
Electronic component and method for producing the same Grant 7,701,053 - Nishizawa , et al. April 20, 2	2010-04-20
Multilayer electronic component and structure for mounting multilayer electronic component Grant 7,656,677 - Ogawa , et al. February 2, 2	2010-02-02
Ceramic multilayer substrate Grant 7,649,252 - Sakai , et al. January 19, 2	2010-01-19
Via Hole Forming Method Using Electrophotographic Printing Method App 20090320986 - ISEBO; Kazuhiro ; et al.	2009-12-31
Packaging Material With Electromagnetic Coupling Module App 20090302972 - OSAMURA; Makoto ; et al.	2009-12-10
Image processing device, image processing method, and image forming apparatus App 20090303549 - Sakai; Norio	2009-12-10
Packaging Material With Electromagnetic Coupling Module App 20090305635 - OSAMURA; Makoto ; et al.	2009-12-10
Multilayer ceramic electronic component, multilayer ceramic substrate, and method for manufacturing multilayer ceramic electronic component Grant 7,595,997 - Nomiya , et al. September 29, 2	2009-09-29
Container With Electromagnetic Coupling Module App 20090201117 - KATO; Noboru ; et al.	2009-08-13
Module with built-in component Grant 7,569,925 - Nishizawa , et al. August 4, 2	2009-08-04
Multilayer Ceramic Electronic Device And Method For Manufacturing The Same App 20090056987 - NOMIYA; Masato ; et al.	2009-03-05
Method For Forming Circuit Pattern App 20080305425 - Kamada; Akihiko ; et al.	2008-12-11
Composite Substrate And Method For Manufacturing Composite Substrate App 20080289853 - SAKAI; Norio ; et al.	2008-11-27
Circuit module and circuit device including circuit module Grant 7,450,395 - Sakai November 11, 2	2008-11-11
Laminated electronic component and method for producing the same Grant 7,446,262 - Ogawa , et al. November 4, 2	2008-11-04
Multilayer Ceramic Electronic Component, Multilayer Ceramic Substrate, And Method For Manufacturing Multilayer Ceramic Electronic Component App 20080261005 - Nomiya; Masato ; et al.	2008-10-23
Circuit Module And Circuit Device Including Circuit Module App 20080180926 - Sakai; Norio	2008-07-31
Multilayer substrate with built-in-chip-type electronic component and method for manufacturing the same App 20070158101 - Chikagawa; Osamu ; et al.	2007-07-12
Laminated electronic component and method for producing the same App 20070026196 - Ogawa; Nobuaki ; et al.	2007-02-01
Manufacturing method for multilayer ceramic elements Grant 7,162,794 - Sakai , et al. January 16, 2	2007-01-16
Module With Built-in Component And Method For Manufacturing Module App 20060284300 - NISHIZAWA; Yoshihiko ; et al.	2006-12-21
Multilayer electronic part and structure for mounting multilayer electronic part App 20060281297 - Ogawa; Nobuaki ; et al.	2006-12-14
Ceramic multilayer substrate App 20060081977 - Sakai; Norio ; et al.	2006-04-20
Laminated ceramic electronic component having via-hole conductors with different sectional sizes Grant 6,974,916 - Sakai December 13, 2	2005-12-13
Electronic component and method for producing the same App 20050184384 - Nishizawa, Yoshihiko ; et al.	2005-08-25
Monolithic ceramic substrate and method for making the same App 20050126682 - Nishide, Mitsuyoshi ; et al.	2005-06-16
Monolithic ceramic substrate and method for making the same Grant 6,891,109 - Nishide , et al. May 10, 2	2005-05-10
Laminated ceramic electronic component and method of producing the same Grant 6,861,588 - Sakai , et al. March 1, 2	2005-03-01
Method for manufacturing a monolithic ceramic electronic component Grant 6,860,006 - Sakai , et al. March 1, 2	2005-03-01
Multilayer ceramic electronic component, electronic component aggregate, and method for producing multilayer ceramic electronic component Grant 6,844,220 - Sakai , et al. January 18, 2	2005-01-18
Method of producing ceramic multilayer substrate Grant 6,815,046 - Mandai , et al. November 9, 2	2004-11-09
Multilayer ceramic electronic component and manufacturing method thereof Grant 6,760,227 - Sakai , et al. July 6, 2	2004-07-06
Multilayer electronic part and method of producing the same App 20040111880 - Sakai, Norio	2004-06-17
Electronic component and method of producing the same Grant 6,751,101 - Sakai June 15, 2	2004-06-15
Multilayer ceramic electronic component, electronic component aggregate, and method for producing multilayer ceramic electronic component App 20040045655 - Sakai, Norio ; et al.	2004-03-11
Laminated ceramic electronic component and method of producing the same App 20040022043 - Sakai, Norio ; et al.	2004-02-05
Method for making a mounting structure for an electronic component having an external terminal electrode Grant 6,682,953 - Sakai , et al. January 27, 2	2004-01-27
Method of producing ceramic multilayer substrate App 20030211302 - Mandai, Harufumi ; et al.	2003-11-13
Multilayer ceramic electronic component, electronic component aggregate, and method for producing multilayer ceramic electronic component Grant 6,639,311 - Sakai , et al. October 28, 2	2003-10-28
Multilayer integrated substrate and manufacturing method for multilayer ceramic element Grant 6,621,010 - Sakai , et al. September 16, 2	2003-09-16
Multilayer integrated substrate and manufacturing method for multilayer ceramic element App 20030167629 - Sakai, Norio ; et al.	2003-09-11
Electronic component, manufacturing method therefor, aggregate electronic component, mounting structure of electronic component, and electronic device App 20030157749 - Sakai, Norio ; et al.	2003-08-21
Multilayer ceramic electronic component and manufacturing method thereof App 20030128526 - Sakai, Norio ; et al.	2003-07-10
Multilayer ceramic electronic component, electronic component aggregate, and method for producing multilayer ceramic electronic component App 20030067068 - Sakai, Norio ; et al.	2003-04-10
Laminated ceramic electroni component, production method therefor, and electronic device App 20030030985 - Sakai, Norio	2003-02-13
Monolithic ceramic electronic component, method for manufacturing the same, and electronic device App 20030006065 - Sakai, Norio ; et al.	2003-01-09
Monolithic ceramic substrate and method for making the same App 20020166694 - Nishide, Mitsuyoshi ; et al.	2002-11-14
Method of producing ceramic multilayer substrate App 20020157760 - Mandai, Harufumi ; et al.	2002-10-31
Monolithic ceramic sunstrate, manufacturing and designing methods therefor, and electronic device App 20020155264 - Nishide, Mitsuyoshi ; et al.	2002-10-24
Electronic component and method of producing the same App 20020122301 - Sakai, Norio	2002-09-05
Monolithic ceramic substrate, manufacturing and designing methods therefor, and electronic device App 20020058131 - Nishide, Mitsuyoshi ; et al.	2002-05-16
Electronic component, manufacturing method therefor, aggregate electronic component, mounting structure of electronic component, and electronic device App 20020005567 - Sakai, Norio ; et al.	2002-01-17
Monolithic ceramic electronic component, method for manufacturing the same, and electronic device App 20010033474 - Sakai, Norio ; et al.	2001-10-25
Monolithic ceramic electronic component, method for manufacturing same, and electronic device including same App 20010026435 - Sakai, Norio	2001-10-04
Multilayer integrated substrate and manufacturing method for multilayer ceramic element App 20010018983 - Sakai, Norio ; et al.	2001-09-06
Circuit-forming charging powder and multilayer wiring board using the same App 20010006756 - Kamada, Akihiko ; et al.	2001-07-05
Multilayer electronic part and method of producing the same App 20010000987 - Sakai, Norio	2001-05-10
Mounting arrangement for multilayer electronic part App 20010000986 - Sakai, Norio	2001-05-10
Electrophotographic apparatus Grant 6,157,789 - Kamada , et al. December 5, 2	2000-12-05
Multilayer circuit board and method of producing the same Grant 6,151,775 - Sakai November 28, 2	2000-11-28
Method of manufacturing a multilayer electronic component Grant 5,644,107 - Kubota , et al. July 1, 1	1997-07-01
Multilayer electronic component Grant 5,635,670 - Kubota , et al. June 3, 1	1997-06-03
Multilayer electronic component Grant 5,635,669 - Kubota , et al. June 3, 1	1997-06-03
Multilayer electronic component Grant 5,604,328 - Kubota , et al. February 18, 1	1997-02-18
Multilayer electronic component and method of manufacturing the same Grant 5,600,101 - Sakai February 4, 1	1997-02-04
Electronic component chip holder including two adhesive surfaces having different adhesiveness Grant 5,571,594 - Minowa , et al. November 5, 1	1996-11-05
Method of manufacturing electronic component and measuring characteristics of same Grant 5,493,769 - Sakai , et al. February 27, 1	1996-02-27
Method of measuring characteristics of a multilayer electronic component Grant 5,488,765 - Kubota , et al. February 6, 1	1996-02-06
Method of manufacturing cavitied ceramic multilayer block Grant 5,435,875 - Saitoh , et al. July 25, 1	1995-07-25
Method of measuring characteristics of electronic parts Grant 5,262,729 - Kawabata , et al. November 16, 1	1993-11-16
Method of fabricating ceramic laminated electronic component Grant 5,261,986 - Kawabata , et al. November 16, 1	1993-11-16
Retainer for chip-type electronic parts Grant 5,007,534 - Tamaki , et al. April 16, 1	1991-04-16
Method of manufacturing ceramic laminate Grant 4,985,098 - Kohno , et al. January 15, 1	1991-01-15
Method of manufacturing ceramic laminate Grant 4,929,295 - Kohno , et al. May 29, 1	1990-05-29

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