loadpatents
Patent applications and USPTO patent grants for Osamura; Makoto.The latest application filed is for "component built-in device, rfid tag, and method for manufacturing component built-in device".
Patent | Date |
---|---|
Component built-in device Grant 10,467,516 - Osamura , et al. No | 2019-11-05 |
Component Built-in Device, Rfid Tag, And Method For Manufacturing Component Built-in Device App 20180293480 - OSAMURA; Makoto ;   et al. | 2018-10-11 |
Electronic component, method for manufacturing the electronic component, and circuit board Grant 9,854,685 - Ikemoto , et al. December 26, 2 | 2017-12-26 |
Electronic Component, Method For Manufacturing The Electronic Component, And Circuit Board App 20150373854 - IKEMOTO; Nobuo ;   et al. | 2015-12-24 |
RFIC chip mounting structure Grant 8,546,927 - Shiroki , et al. October 1, 2 | 2013-10-01 |
Radio frequency IC device and method of manufacturing the same Grant 8,381,997 - Osamura , et al. February 26, 2 | 2013-02-26 |
Packaging material with electromagnetic coupling module Grant 8,299,968 - Osamura , et al. October 30, 2 | 2012-10-30 |
Radio Frequency Ic Device And Method Of Manufacturing The Same App 20120074229 - OSAMURA; Makoto ;   et al. | 2012-03-29 |
Rfic Chip Mounting Structure App 20120056337 - SHIROKI; Koji ;   et al. | 2012-03-08 |
Packaging Material With Electromagnetic Coupling Module App 20090305635 - OSAMURA; Makoto ;   et al. | 2009-12-10 |
Packaging Material With Electromagnetic Coupling Module App 20090302972 - OSAMURA; Makoto ;   et al. | 2009-12-10 |
Method of drying honeycomb formed body App 20080115383 - Nate; Masayuki ;   et al. | 2008-05-22 |
Method of drying honeycomb formed body App 20050115101 - Nate, Masayuki ;   et al. | 2005-06-02 |
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