U.S. patent application number 12/427504 was filed with the patent office on 2009-10-22 for apparatus and methods for using a polishing tape cassette.
This patent application is currently assigned to APPLIED MATERIALS, INC.. Invention is credited to Paul D. Butterfield, Shou-Sung Chang, Gary C. Ettinger, Robert A. Ewald, Eashwer Kollata, Antoine P. Manens, Ricardo Martinez, Kuldip Sumbria.
Application Number | 20090264053 12/427504 |
Document ID | / |
Family ID | 41201494 |
Filed Date | 2009-10-22 |
United States Patent
Application |
20090264053 |
Kind Code |
A1 |
Manens; Antoine P. ; et
al. |
October 22, 2009 |
APPARATUS AND METHODS FOR USING A POLISHING TAPE CASSETTE
Abstract
Methods and apparatus are provided for housing a polishing tape
adapted to polish a substrate. The invention includes a cassette
comprising a body portion; and a head portion, wherein the head
portion includes: a pair of guide walls; one or more supply rollers
positioned between the guide walls in the head portion; and wherein
the guide walls are adapted to guide a polishing tape housed in the
body over the one or more supply rollers. Numerous other aspects
are provided.
Inventors: |
Manens; Antoine P.;
(Sunnyvale, CA) ; Ettinger; Gary C.; (Cupertino,
CA) ; Butterfield; Paul D.; (San Jose, CA) ;
Chang; Shou-Sung; (Stanford, CA) ; Martinez;
Ricardo; (Manteca, CA) ; Kollata; Eashwer;
(San Jose, CA) ; Ewald; Robert A.; (Aptos, CA)
; Sumbria; Kuldip; (Union City, CA) |
Correspondence
Address: |
DUGAN & DUGAN, PC
245 Saw Mill River Road, Suite 309
Hawthorne
NY
10532
US
|
Assignee: |
APPLIED MATERIALS, INC.
Santa Clara
CA
|
Family ID: |
41201494 |
Appl. No.: |
12/427504 |
Filed: |
April 21, 2009 |
Related U.S. Patent Documents
|
|
|
|
|
|
Application
Number |
Filing Date |
Patent Number |
|
|
61046453 |
Apr 21, 2008 |
|
|
|
Current U.S.
Class: |
451/59 ;
451/489 |
Current CPC
Class: |
B24B 21/004 20130101;
B24B 9/065 20130101 |
Class at
Publication: |
451/59 ;
451/489 |
International
Class: |
B24B 1/00 20060101
B24B001/00; B24D 17/00 20060101 B24D017/00 |
Claims
1. A cassette for housing a polishing tape adapted to polish a
substrate, the cassette comprising: a body portion; and a head
portion, wherein the head portion includes: a pair of guide walls,
and one or more supply rollers positioned between the guide walls
in the head portion, wherein the guide walls are adapted to guide a
polishing tape housed in the body over the one or more supply
rollers.
2. The cassette of claim 1 further comprising: at least one supply
spool positioned within the body portion and adapted to provide a
length of polishing tape to the head portion.
3. The cassette of claim 2 further comprising: at least one take-up
spool positioned within the body portion and adapted to receive a
length of polishing tape from the head portion.
4. The cassette of claim 1 wherein the one or more supply rollers
rotate relative to the guide walls.
5. The cassette of claim 1 wherein the one or more supply rollers
are flangeless.
6. The cassette of claim 1 wherein the one or more supply rollers
have a constant diameter.
7. The cassette of claim 1 wherein the head portion further
includes one or more take-up rollers.
8. The cassette of claim 1 wherein the guide walls are adapted to
align the polishing tape on the one or more supply rollers.
9. The cassette of claim 1 wherein a width of the one or more
supply spools is substantially the same as a width of the polishing
tape.
10. The cassette of claim 1 further comprising: a selectively
removable cassette body cover.
11. A system for polishing an edge of a substrate comprising: a
substrate support adapted to support a substrate; a polishing head
adapted to press a polishing tape against an edge of the substrate;
and a cassette for housing the polishing tape, the cassette
comprising: a body portion; and a head portion, wherein the head
portion includes: a pair of guide walls; one or more supply rollers
positioned between the guide walls in the head portion; and wherein
the guide walls are adapted to guide the polishing tape housed in
the body over the one or more supply rollers.
12. The system of claim 11 further comprising: at least one supply
spool positioned within the body portion and adapted to provide a
length of polishing tape to the head portion.
13. The system of claim 12 further comprising: at least one take-up
spool positioned within the body portion and adapted to receive a
length of polishing tape from the head portion.
14. The system of claim 13 wherein at lest one of the supply and
take-up spools are indexed to control the amount of polishing tape
advanced therefrom.
15. The system of claim 13 wherein the polishing tape continuously
advances.
16. The system of claim 11 wherein the one or more supply rollers
rotate relative to the guide walls.
17. The system of claim 11 wherein the one or more supply rollers
are flangeless.
18. The system of claim 11 wherein the one or more supply rollers
have a constant diameter.
19. The system of claim 11 further comprising one or more spool
drivers adapted to rotate the one or more supply and take-up
spools.
20. A method comprising: providing a supply spool including a
length of polishing tape; routing the length of polishing tape over
a supply roller positioned between two walls in a head portion of a
cassette; and providing a take-up spool adapted to receive the
length of polishing tape from the supply roller, wherein the supply
spool and take-up spool are housed in a body portion of the
cassette.
21. The method of claim 20 further comprising: disengaging a spent
supply spool from a spool driver before providing the supply spool
including the length of polishing tape.
22. The method of claim 21 further comprising: re-purposing the
spent supply spool as the take-up spool.
23. The method of claim 20 further comprising: adhering the length
of polishing tape to an end of spent polishing tape.
24. The method of claim 23 further comprising: advancing the
adhered length of polishing tape and spent polishing tape through
the head portion of the cassette and to the take-up spool.
25. The method of claim 20 further comprising: installing the
cassette on a polishing system.
Description
RELATED APPLICATIONS
[0001] The present application claims priority to U.S. Provisional
Patent Application No. 61/046,453, filed Apr. 21, 2008, and
entitled, "APPARATUS AND METHODS FOR USING A POLISHING TAPE
CASSETTE" (Attorney Docket No. 11533/L), which is hereby
incorporated herein by reference in its entirety for all
purposes.
CROSS-REFERENCE TO RELATED APPLICATIONS
[0002] The present application is also related to the following
commonly-assigned, co-pending U.S. patent applications, each of
which is hereby incorporated herein by reference in its entirety
for all purposes:
[0003] U.S. patent application Ser. No. 11/299,295 filed on Dec. 9,
2005 and entitled "METHODS AND APPARATUS FOR PROCESSING A
SUBSTRATE" (Attorney Docket No. 10121);
[0004] U.S. patent application Ser. No. 11/298,555 filed on Dec. 9,
2005 and entitled "METHODS AND APPARATUS FOR PROCESSING A
SUBSTRATE" (Attorney Docket No. 10414);
[0005] U.S. patent application Ser. No. 11/693,695 filed on Mar.
29, 2007 and entitled "METHODS AND APPARATUS FOR POLISHING AN EDGE
OF A SUBSTRATE" (Attorney Docket No. 10560);
[0006] U.S. Patent Application Ser. No. 60/939,351, filed May 21,
2007, entitled "METHODS AND APPARATUS FOR POLISHING A NOTCH OF A
SUBSTRATE USING AN INFLATABLE POLISHING WHEEL" (Attorney Docket No.
10674/L);
[0007] U.S. Patent Application Ser. No. 60/939,353, filed May 21,
2007, entitled "METHODS AND APPARATUS TO CONTROL SUBSTRATE BEVEL
AND EDGE POLISHING PROFILES OF EPITAXIAL FILMS" (Attorney Docket
No. 11417/L);
[0008] U.S. Patent Application Ser. No. 60/939,219, filed May 21,
2007, entitled "METHODS AND APPARATUS FOR POLISHING A NOTCH OF A
SUBSTRATE USING A SHAPED BACKING PAD" (Attorney Docket No.
11483/L);
[0009] U.S. Patent Application Ser. No. 60/939,342, filed May 21,
2007, entitled "METHODS AND APPARATUS FOR REMOVAL OF FILMS AND
FLAKES FROM THE EDGE OF BOTH SIDES OF A SUBSTRATE USING BACKING
PADS" (Attorney Docket No. 11564/L);
[0010] U.S. Patent Application Ser. No. 60/939,350, filed May 21,
2007, entitled "METHODS AND APPARATUS FOR USING A BEVEL POLISHING
HEAD WITH AN EFFICIENT TAPE ROUTING ARRANGEMENT" (Attorney Docket
No. 11565/L);
[0011] U.S. Patent Application Ser. No. 60/939,344, filed May 21,
2007, entitled "METHODS AND APPARATUS FOR USING A ROLLING BACKING
PAD FOR SUBSTRATE POLISHING" (Attorney Docket No. 11566/L);
[0012] U.S. Patent Application Ser. No. 60/939,333, filed May 21,
2007, entitled "METHODS AND APPARATUS FOR HIGH PERFORMANCE
SUBSTRATE BEVEL AND EDGE POLISHING IN SEMICONDUCTOR MANUFACTURE"
(Attorney Docket No. 11809/L);
[0013] U.S. Patent Application Ser. No. 60/939,212, filed May 21,
2007, entitled "METHODS AND APPARATUS FOR IDENTIFYING A SUBSTRATE
EDGE PROFILE AND ADJUSTING THE PROCESSING OF THE SUBSTRATE
ACCORDING TO THE IDENTIFIED EDGE PROFILE" (Attorney Docket No.
11695/L);
[0014] U.S. Patent Application Ser. No. 60/99,228, filed May 21,
2007, entitled "METHODS AND APPARATUS FOR POLISHING A NOTCH OF A
SUBSTRATE BY SUBSTRATE VIBRATION" (Attorney Docket No. 11952/L);
and
[0015] U.S. Patent Application Ser. No. 60/939,209, filed May 21,
2007, entitled "METHODS AND APPARATUS FOR CONTROLLING THE SIZE OF
AN EDGE EXCLUSION ZONE OF A SUBSTRATE" (Attorney Docket No.
11987/L).
FIELD OF THE INVENTION
[0016] The present invention relates generally to electronic device
processing, and more particularly to methods and apparatus for
using a polishing tape cassette.
BACKGROUND OF THE INVENTION
[0017] During electronic device manufacturing, undesirable
materials may build up on the edge of a substrate. The materials
may include dielectrics, photoresist and metals used in IC
manufacture. Therefore, it may be desirable to clean or polish the
bevel and outer edge of the substrate to remove these materials to
prepare the substrate for electronic (e.g. semiconductor) device
manufacturing. Typically an abrasive polishing tape is applied with
some degree of force to polish bevels on the edge of the substrate.
Generally contact between the abrasive polishing and portions of
the substrate reserved for device fabrication (`device region`) is
avoided. Typically, a buffer zone or `edge exclusion zone,` is
provided between the device region and the edge of the substrate to
protect the device region. Systems, methods and apparatus are
needed for efficiently routing and aligning the abrasive tape.
SUMMARY OF THE INVENTION
[0018] In some aspects of the invention, a cassette for housing a
polishing tape adapted to polish a substrate. The cassette includes
a body portion; and a head portion, wherein the head portion
includes: a pair of guide walls; one or more supply rollers
positioned between the guide walls in the head portion; and wherein
the guide walls are adapted to guide a polishing tape housed in the
body over the one or more supply rollers.
[0019] In another aspect of the invention, a system for polishing
an edge of a substrate is provided. The system includes a substrate
support adapted to support a substrate; a polishing head adapted to
press a polishing tape against an edge of the substrate; and a
cassette for housing the polishing tape, the cassette including: a
body portion; and
[0020] a head portion, wherein the head portion includes: a pair of
guide walls; one or more supply rollers positioned between the
guide walls in the head portion; and wherein the guide walls are
adapted to guide the polishing tape housed in the body over the one
or more supply rollers.
[0021] In another aspect of the invention, a method is provided.
The method includes providing a supply spool including a length of
polishing tape; routing the length of polishing tape over a supply
roller positioned between two walls in a head portion of a
cassette; and providing a take-up spool adapted to receive the
length of polishing tape from the supply roller, wherein the supply
spool and take-up spool are housed in a body portion of the
cassette.
[0022] Other features and aspects of the present invention will
become more fully apparent from the following detailed description,
the appended claims and the accompanying drawings.
BRIEF DESCRIPTION OF THE FIGURES
[0023] FIG. 1 is a schematic illustration depicting an example
embodiment of a substrate cleaning apparatus according to the
present invention.
[0024] FIG. 2 is a schematic illustration of a tape cassette
according to the present invention.
[0025] FIG. 3A is a schematic illustration of a tape cassette
according to the present invention.
[0026] FIG. 3B is a schematic illustration of a tape cassette
according to the present invention.
[0027] FIG. 4 is a flow chart depicting an example application
method of embodiments for replacing a tape cassette according to
the present invention.
[0028] FIG. 5A is a schematic illustration of a spool including a
length of polishing tape according to the present invention.
[0029] FIG. 5B is a schematic illustration of a spool according to
the present invention.
[0030] FIG. 6 is a schematic illustration of a cross-section of a
spool including a length of polishing tape according to the present
invention.
DETAILED DESCRIPTION
[0031] The present invention provides improved methods and
apparatus for cleaning and/or polishing an edge of a substrate, for
example, before fabrication processes (e.g. deposition and etching
processes), are performed. One method of cleaning and polishing a
substrate edge (or notch) includes applying an abrasive film or
tape ("polishing tape") to the substrate edge, and moving the
polishing tape relative to the substrate edge, while the substrate
is fixed in a particular position. The force, or pressure, applied
to the polishing tape while contacting the substrate edge, as well
as the degree of contact between the polishing tape and the
substrate edge, may contribute to polishing efficiency. Another
factor that may contribute to polishing efficiency is the degree of
movement of the polishing tape relative to the substrate edge. In
some embodiments, the relative movement may be provided by
advancing the polishing tape over a surface of the substrate edge.
However, the degree of relative movement between the polishing tape
and the substrate edge may be further increased by moving the
substrate as the polishing tape is advanced over the surface of the
substrate edge, thereby increasing the polishing efficiency and the
cost-effectiveness thereof.
[0032] In some embodiments the polishing tape may be supplied to
the substrate edge via a supply spool, while the used or worn
polishing tape may be routed to a take-up spool. Both the supply
spool and the take-up spool may be housed in a cassette. The
cassette may also include one or more rotatable rollers, positioned
between the supply and the take-up spools, to aide in routing or
guiding/aligning the polishing tape through the cassette. In
conventional tape routing systems, the rollers may be flange
rollers or crown rollers, for example. In conventional systems
using flange rollers, the flanges may prevent the polishing tape
from migrating off of the rollers. In conventional systems using
crown rollers, the crown roller is convex in shape and may have a
center diameter that is the largest diameter, and the crown roller
is symmetric from that center point. In conventional systems, the
polishing tape may tend to stay centered over the larger center
diameter of the crown rollers. However, the mechanical properties
of the polishing tape (e.g., high level of flexibility) may make
the use of crown and flange rollers problematic. For example, as
the flanged roller rotates, the polishing tape may migrate towards
one of the flanges. The migration may be due to the normal course
of rotation or may be due to a misalignment between the supply
spool and the supply roller, for example. When the polishing tape
contacts the rotating flange, the polishing tape may bunch up along
the rotating flange and subsequently, the polishing tape may fold
or roll over itself, thereby impeding the polishing process. Also,
the flexible nature of the polishing tape may cause the polishing
tape to migrate from the largest center of the crown roller.
[0033] Therefore, the present invention provides apparatus and
methods for effectively aligning and routing or guiding the
polishing tape. The present invention provides a smooth flangeless
supply roller having a constant diameter to aide in routing the
polishing tape through the cassette, wherein the cassette includes
a body portion and a head portion. The inventive supply roller may
be positioned in the cassette such that the fixed walls of the
cassette head act as guides to prevent the polishing tape from
migrating off of the roller. The supply roller may also be the same
width as the polishing tape to further prevent the migration of the
polishing tape to an end of the roller. The relative motion between
the supply roller and the fixed cassette walls may prevent the
polishing tape from bunching and folding, even when there is a
misalignment between the supply spool and the supply roller, for
example. Thus, the cassette head walls may control the location of
the polishing tape and allow a repeatable alignment of the
polishing head.
[0034] Additionally, the present invention provides a method for
replacing the used or worn polishing tape in the cassette. It may
be beneficial to provide a method for quickly replacing the supply
and take-up spools, to aide in efficient throughput while
minimizing polishing tool downtime. As described above, the
cassette may include two portions, the body which houses the
spools, and the head which interfaces with the polishing tool, for
example, and through which the polishing tape is routed. In some
embodiments, in a first step, the spools may be disengaged from the
motors. The motors may be used to index or advance the polishing
tape. Then the cassette may be removed from the polishing tool.
After removal, the cassette may be opened, and the polishing tape
may be disengaged from the rollers in the cassette head. The spools
and used polishing tape may then be removed from the cassette. The
new supply spool with unused polishing tape and the new take-up
spool may be installed in the cassette. The polishing tape may be
threaded or routed from the supply spool, through the head and
connected to the take-up spool. Then the cassette may be closed and
placed back into the tool. While the used or spent cassette is
being rebuilt, a fresh or new cassette having an unused polishing
tape supply may be inserted into the polishing tool, such that
downtime of the tool may be reduced. In another embodiment, the
cassette having the used polishing tape may remain in the polishing
tool, while the used spools may be replaced with new or unused
spools.
[0035] Turning to FIG. 1, a schematic perspective view of an
embodiment of a polishing apparatus 100 for polishing a substrate
102 is provided. The polishing apparatus 100 may include a
substrate driver 104 (e.g., a servomotor, gear, belt, chain, etc.),
which may be mounted on a pedestal 106. A support 108 (e.g., a
vacuum chuck) may be coupled (e.g., rigidly) to a shaft (not shown)
of the substrate driver 104. The support 108 may support the
substrate 102, for example. The substrate driver 104 may rotate the
substrate 102, via the support 108, about a center 110 of the
substrate 102 or another suitable axis. The substrate driver 104
may be connected to a substrate driver control unit (not shown),
which may control the angular displacement, angular velocity, and
angular acceleration of the substrate 102. The polishing apparatus
100 may further include a polishing arm 112 aligned in the
horizontal plane approximately tangential to an edge of the
substrate 102 and supported by a frame 114. In other embodiments,
the polishing arm 112 may be aligned differently, for example,
vertically or at an angle with respect to the horizontal plane. The
polishing arm 112 may include a polishing head section 116
(`head`). The polishing head 116 may include a backing pad 118,
which may be moved towards or away from the substrate 102 by an
actuator (e.g., hydraulic actuator, pneumatic actuator, servomotor,
etc.) (not shown). Polishing tape 120, may wrap around the
polishing head 116, and over the backing pad 118, and be tensioned
between spools housed in a cassette 200. In some embodiments, one
cassette may be supplied per polishing head 116. The spools may be
driven by spool drivers 122, 124 (e.g., servomotors), respectively.
The spool drivers 122, 124, may be indexed to precisely control the
amount of the polishing tape 120 that is advanced over the
polishing head 116 from, for example, the spools, in order to
polish the substrate 102.
[0036] In one or more embodiments, the polishing tape 120 may be
made from many different materials, such as aluminum oxide, silicon
oxide, silicon carbide, etc. Other materials may also be used. In
some embodiments, the abrasives used may range, for example, from
about 0.5 microns up to about 3 microns in size, or 0.1 microns to
10 microns in size, although other sizes may be used. Different
widths of polishing tape 120 ranging from about 0.55 inch to about
1.5 inches may be used, although other polishing tape widths may be
used. In one or more embodiments, the polishing tape 120 may be
about 0.002 to about 0.02 inches thick and withstand about 1 to 5
lbs. in tension. Other polishing tapes having different thicknesses
and tensile strengths may be used.
[0037] Turning to FIG. 2, an exemplary schematic illustration of
the cassette 200 is provided. The cassette 200 may include a body
portion 202 and a head portion 204. The cassette body 202 may house
a supply spool 206 and a take-up spool 208, shown in more detail in
FIGS. 5A, 5B and 6. While only one supply and take-up spool 206,
208 are shown herein, other numbers of supply and take-up spools
may be used. The supply spool 206 and take-up spool 208 may each
include a pair of flanges 500 (FIGS. 5A and 5B), coupled to a core
502. The length of polishing tape 120 may be wound around, or
unwound from, the core 502. The cassette body 202 may include a
selectively removable cover 201 (FIG. 1). The supply spool 206 may
store unused polishing tape 120 available to be unwound and pulled
into the polishing apparatus 100, positioned adjacent the substrate
102, while the take-up spool 208 may be adapted to receive used
and/or worn polishing tape 120. One or both of the supply and
take-up spools 206, 208 may be indexed to precisely control the
amount of polishing tape 120 that is advanced to the polishing
apparatus 100. In alternate embodiments, the polishing tape 120 may
be continuously moving. In some embodiments, the take-up spool 208
may advance at a particular speed, and the supply spool 206 may
create the tension. A tape loop 210 indicates the portion of
polishing tape 120 that is routed around the polishing head 116,
shown in FIG. 1. The cassette body 202 may also include a plurality
of rollers 212 to further guide and route the polishing tape 120
through the cassette 200.
[0038] The supply and take-up spools 206, 208 may have a diameter
of approximately 1 inch and be capable of holding about 500 inches
of polishing tape 120, or may be a diameter of approximately 3
inches and be capable of holding about 30,000 inches of polishing
tape 120. Other spool dimensions may be used. The spools 206, 208
may be constructed from materials such as polyurethane, polyvinyl
difluoride (PVDF), etc. Other materials may also be used. In some
embodiments the supply and take-up spools 206, 208 may be formed by
selectively coupling two flanges (not shown) to a core (not shown),
where the supply of polishing tape 120 is wound around the core,
and each of the two flanges is coupled to opposite ends of the
core.
[0039] Turning to FIGS. 3A and 3B, a schematic view of the cassette
head 204, with and without the polishing tape 120, respectively, is
provided. The cassette head 204 may include a supply roller 300 and
a take-up roller 302. Other suitable amounts of supply and take-up
rollers may be used. Similarly to the rollers 212 described above
with respect to FIG. 2, the supply and take-up rollers 300, 302 may
be used to guide the polishing tape 120. The supply roller 300 may
be smooth, flat and have a constant diameter, unlike conventional
crown rollers, for example. The supply roller 300 may be positioned
in the cassette head 204 such that a pair of walls 304 (shown in
FIG. 3B) of the cassette head 204 act as a guide adapted to align
the polishing tape 120 on the supply roller 300. Unlike the flanges
on the flange rollers that rotate with the roller, increasing the
polishing tape fold over, the cassette head walls 304 remain
relatively stationary with respect to the rotating supply roller
300, which may decrease the polishing tape fold over. Additionally,
the supply spool 300 may have a width substantially equal to the
width of the polishing tape 120, which may further prevent
polishing tape 120 migration. The take-up roller 302 may have a
larger width than the supply roller 300, as the take-up roller 302
may not be used to align the polishing tape 120.
[0040] Turning to FIG. 4, a flow chart depicting an exemplary
method 400 for replacing the used and/or worn/spent polishing tape,
after the supply has been exhausted, for example, may be provided.
As described above, each of the supply and take-up spools 206, 208
may be coupled to, and driven by, spool drivers 122, 124 (e.g.,
servomotors). In S102 the supply and take-up spools 206, 208 may be
disengaged from the respective spool drivers 122, 124 or motors. In
some embodiments the spools and motors may include male and female
connectors that are adapted to selectively matably engage the spool
to the motor. These male and female connectors may be cone shaped.
For example, a cone-shaped female connector 600 is shown in FIG. 6.
Other suitable shapes may be used. One of the benefits of a male
and female connector is that spools and motors are centered during
mating. In some embodiments, additional fastening devices 602
(e.g., a screw) may be used to further secure the spool driver and
spool. In some embodiments, the cassette 200 may be further secured
to the polishing apparatus 100 by a toggle clamp or cam, for
example. In such embodiments, these additional fastening and
securing devices may be removed. Then in S104, the cassette 200 may
be removed from the polishing apparatus 100. The cassette cover 201
may then be removed from the cassette body 202. In S106 the used
and/or worn polishing tape 120 may be removed from the cassette
head 204. In some embodiments the cassette head 204 may not include
a cover, and consequently, to remove the spent polishing tape
therefrom, the polishing tape 120 may be severed from the supply
spool 206 and pulled out of the cassette head 204. Then, the spent
or used supply and take-up spools 206, 208 may be removed from the
cassette body 202 in S108. Then new supply and take-up spools may
be inserted into the cassette body 202 in S110. In S112 the fresh
or new supply of polishing tape 120 may then be routed from the new
supply spool through the polishing head and fastened to the new
take-up spool, following the same path of the used polishing tape
120. The cassette cover 201, if one is provided, may then be
replaced in S114. In S116, the rebuilt cassette may be re-installed
on the polishing tool 100. Therefore, when the polishing tape
supply needs to be replaced, the cassette may be replaced with a
second unused or rebuilt cassette while the first original cassette
is being rebuilt, thereby reducing the downtime of the polishing
tool 100.
[0041] In an alternate embodiment, the cassette 200 may remain
coupled to the polishing tool 100 while the used polishing tape 120
is replaced with new polishing tape. For example, the cassette body
cover 201 may be removed from the cassette 200, and one or more
flanges 500, 502 (FIGS. 5A and 5B) coupled to a core 504 of the
used supply and take-up spools 206, 208 may be removed therefrom.
Then the used supply core may be replaced with a new supply core
including a supply of polishing tape, and the used take-up core
having the length of used tape may be replaced with a new empty
take-up core. In some embodiments the used supply core may be
re-purposed as the new take-up core. The new and unused polishing
tape may then be threaded through the cassette body and head, and
fastened to the new take-up spool. In some embodiments, the old
polishing tape 120 may be used to thread the new polishing tape
through the cassette head 204 by adhering a free end of the new
polishing tape to the old polishing tape and having the old
polishing tape "lead" or route the new polishing tape through the
cassette head. After the new polishing tape is threaded in the
cassette 200, the cassette cover 201 may be replaced.
[0042] It should be understood that the inventive edge polishing
apparatus described herein may be employed in apparatuses other
than those adapted for bevel and edge polishing and/or removal of
films on substrates. Further, as will be apparent to those of
ordinary skill in the art, the apparatus describe herein may be
employed to polish and/or remove films on an edge of a substrate
supported in any orientation (e.g., horizontal, vertical, diagonal,
etc).
[0043] Further, it should be understood that although only examples
of cleaning a round substrate are disclosed, the present invention
could be modified to clean substrates having other shapes (e.g., a
glass or polymer plate for flat panel displays). Further, although
processing of a single substrate by the apparatus is shown above,
in some embodiments, the apparatus may process a plurality of
substrates concurrently.
[0044] The foregoing description discloses only exemplary
embodiments of the invention. Modifications of the above disclosed
apparatus and methods which fall within the scope of the invention
will be readily apparent to those of ordinary skill in the art.
Accordingly, while the present invention has been disclosed in
connection with exemplary embodiments thereof, it should be
understood that other embodiments may fall within the spirit and
scope of the invention, as defined by the following claims.
* * * * *