U.S. patent application number 12/010133 was filed with the patent office on 2008-06-19 for semiconductor module with heat sink and method thereof.
Invention is credited to Joong-Hyun Baek, Hae-Hyung Lee, Jin-Yang Lee, Sang-Wook Park.
Application Number | 20080144292 12/010133 |
Document ID | / |
Family ID | 34918812 |
Filed Date | 2008-06-19 |
United States Patent
Application |
20080144292 |
Kind Code |
A1 |
Lee; Hae-Hyung ; et
al. |
June 19, 2008 |
Semiconductor module with heat sink and method thereof
Abstract
A semiconductor module, including a semiconductor device mounted
on a printed circuit board (PCB), the PCB having an electrical
connection to the semiconductor module, and a heat sink in direct
contact with the semiconductor device, the heat sink being formed
with a first end and a second end, the first end and the second end
being formed with different heights, wherein the semiconductor
module allows air flow to pass through the semiconductor module,
radiating heat away from the heat sink. Another semiconductor
module, including a semiconductor device mounted on a PCB, a heat
sink in direct contact with the semiconductor device, the heat sink
having a first portion and a second portion, wherein the first
portion has a flat shape and is in direct contact with the
semiconductor device and the second portion has a corrugated shape
and is not in contact with the semiconductor device, wherein the
semiconductor module allows air flow to pass through the
semiconductor module, radiating heat away from the heat sink.
Inventors: |
Lee; Hae-Hyung; (Suwon-si,
KR) ; Park; Sang-Wook; (Seongnam-si, KR) ;
Baek; Joong-Hyun; (Suwon-si, KR) ; Lee; Jin-Yang;
(Suwon-si, KR) |
Correspondence
Address: |
HARNESS, DICKEY & PIERCE, P.L.C.
P.O. BOX 8910
RESTON
VA
20195
US
|
Family ID: |
34918812 |
Appl. No.: |
12/010133 |
Filed: |
January 22, 2008 |
Related U.S. Patent Documents
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Application
Number |
Filing Date |
Patent Number |
|
|
10958392 |
Oct 6, 2004 |
7345882 |
|
|
12010133 |
|
|
|
|
Current U.S.
Class: |
361/720 |
Current CPC
Class: |
H05K 7/20509 20130101;
H01L 23/467 20130101; H01L 2924/0002 20130101; H01L 23/427
20130101; H01L 2924/00 20130101; H01L 23/3672 20130101; H01L
2924/0002 20130101 |
Class at
Publication: |
361/720 |
International
Class: |
H05K 7/20 20060101
H05K007/20 |
Foreign Application Data
Date |
Code |
Application Number |
Mar 15, 2004 |
KR |
2004-17425 |
Claims
1.-25. (canceled)
26. A semiconductor module, comprising: a semiconductor device
mounted on a printed circuit board (PCB); a heat sink in direct
contact with the semiconductor device, the heat sink having a first
portion and a second portion, wherein the first portion has a flat
shape and is in direct contact with the semiconductor device and
the second portion has a corrugated shape and is not in contact
with the semiconductor device.
27. The semiconductor module of claim 26, wherein the first portion
is a metal member.
28. The semiconductor module of claim 26, wherein the second
portion is a metal member.
29. The semiconductor module of claim 26, wherein the first and
second portions include at least one of copper and aluminum.
30. The semiconductor module of claim 26, wherein the heat sink
includes a heat pipe for radiating heat using a fluid.
31. The semiconductor module of claim 30, wherein the heat sink
includes an evaporation portion evaporating the fluid in the
contact region.
32. The semiconductor module of claim 31, wherein the evaporated
fluid is condensed in a condensation portion.
33. The semiconductor module of claim 26, wherein the first portion
and the second portion include a bent portion.
34. The semiconductor module of claim 33, wherein the bent portion
has an angle of 180.degree..
35. The semiconductor module of claim 33, wherein the heat sink
includes an overlapping portion, the overlapping portion being
formed by an increased thickness from the bent portion.
36. The semiconductor module of claim 35, wherein a first height of
the overlapping portion is equal to or smaller than a distance
obtained by subtracting a second height of the PCB from a third
height of the heat sink.
37. The semiconductor module of claim 30, wherein the boiling point
of the fluid is between 25 C.degree. and 100 C.degree..
38. The semiconductor module of claim 30, wherein the fluid
includes at least one of water and alcohol.
39. The semiconductor module of claim 26, wherein the first and
second portions include at least one of copper and aluminum.
40. The semiconductor module of claim 26, wherein the semiconductor
device includes a plurality of memory devices.
41. The semiconductor module of claim 40, wherein the plurality of
memory devices are mounted on at least one side of the printed
circuit board.
42. The semiconductor module of claim 26, wherein the semiconductor
module is a dual in-line memory module (DIMM).
Description
CROSS REFERENCE TO RELATED APPLICATIONS
[0001] This U.S. non-provisional application claims priority under
35 U.S.C. .sctn.119 of Korean Patent Application No. 2004-17425,
filed on Mar. 15, 2004, the entire contents of which are
incorporated herein by reference.
BACKGROUND OF THE INVENTION
[0002] 1. Field of the Invention
[0003] The present invention relates generally to a semiconductor
module, and more particularly, to a semiconductor module including
a heat sink and method thereof.
[0004] 2. Description of the Related Art
[0005] Recently, semiconductor products have generally become more
integrated. A semiconductor module may include a plurality of
semiconductor devices mounted on a printed circuit board (PCB). A
conventional semiconductor module may include a dual in-line memory
module (DIMM) which may include a plurality of semiconductor
devices. The conventional DIMM has been defined by the Joint
Electron Device Engineering Council (JEDEC).
[0006] FIG. 1 illustrates a cross-sectional view of a conventional
semiconductor module 10. Referring to FIG. 1, the semiconductor
module 10 may include a PCB 11, semiconductor devices 12 and heat
sinks 13.
[0007] The PCB 11 may include a plurality of semiconductor devices
12 mounted on both sides thereof. The PCB 11 may include a
connection terminal portion 11a at the lower end which may provide
an electrical connection with a module socket 2. The semiconductor
device 12 may be located adjacent to the center of the PCB 11. The
heat sink 13 may be in contact with the semiconductor device 12 and
may radiate heat generated by the semiconductor device 12. The
module socket 2 may be mounted on a motherboard 1.
[0008] In a conventional DIMM for a computer server, the height h11
of the PCB 11 may be 30.48 mm (i.e. 1.2 inches). The height of the
connection terminal portion 11a may be between about 2 mm and 2.5
mm. The height h12 between the center of the semiconductor device
12 and the lower end of the PCB 11 may be 17.24 mm.
[0009] In the conventional semiconductor module, a distance from
the center of the semiconductor device 12 to the motherboard 1 may
be 17 mm or more. This distance may prevent heat radiating from the
semiconductor device 12 to the motherboard 1 through the PCB 11, as
closer contact may be necessary for proper heat radiation. Further,
a first space S1 between the PCB 11 and the heat sink 13 may be
below a threshold distance, which may reduce the efficiency of heat
radiation.
SUMMARY OF THE INVENTION
[0010] An exemplary embodiment of the present invention is a
semiconductor module, including a semiconductor device mounted on a
printed circuit board (PCB), the PCB having an electrical
connection to the semiconductor module, and a heat sink in direct
contact with the semiconductor device, the heat sink being formed
with a first end and a second end, the first end and the second end
being formed with different heights.
[0011] Another exemplary embodiment of the present invention is a
method of radiating heat in a semiconductor module, including
mounting a semiconductor device on a PCB, and connecting a heat
sink to the semiconductor device, the heat sink being in direct
contact with the semiconductor device, the heat sink being formed
with a first end and a second end, the first end and the second end
being formed with different heights.
[0012] Another exemplary embodiment of the present invention is a
method of radiating heat in a semiconductor module, including
mounting a semiconductor device on a printed circuit board (PCB),
and connecting a heat sink to the semiconductor device, the heat
sink having a first portion and a second portion, wherein the first
portion has a flat shape and is in direct contact with the
semiconductor device and the second portion has a corrugated shape
and is not in contact with the semiconductor device.
[0013] Another exemplary embodiment of the present invention is a
semiconductor module, including a semiconductor device mounted on a
PCB, a heat sink in direct contact with the semiconductor device,
the heat sink having a first portion and a second portion, wherein
the first portion has a flat shape and is in direct contact with
the semiconductor device and the second portion has a corrugated
shape and is not in contact with the semiconductor device.
BRIEF DESCRIPTION OF THE DRAWINGS
[0014] The present invention will become more apparent by
describing in detail exemplary embodiments thereof with reference
to the attached drawings in which:
[0015] FIG. 1 illustrates a cross-sectional view of a semiconductor
module by conventional methods.
[0016] FIG. 2 illustrates a front-view of a printed circuit board
(PCB) according to an exemplary embodiment of the present
invention.
[0017] FIG. 3 illustrates a perspective view of a semiconductor
module according to an exemplary embodiment of the present
invention.
[0018] FIG. 4 illustrates a cross-sectional view taken along a line
of I-I of FIG. 3.
[0019] FIG. 5 illustrates a front-view of a semiconductor module
according to an exemplary embodiment of the present invention.
[0020] FIG. 6 illustrates a cross-sectional view of a semiconductor
module 50 according to another exemplary embodiment of the present
invention.
[0021] FIG. 7 illustrates a front view of a semiconductor module 60
according to another exemplary embodiment of the present
invention.
[0022] FIG. 8 illustrates a cross-sectional view taken along a line
of J-J of FIG. 7.
[0023] FIG. 9 illustrates a cross-sectional view of a semiconductor
module 70 according to another exemplary embodiment of the present
invention.
DETAILED DESCRIPTION OF THE EXEMPLARY EMBODIMENTS OF THE
INVENTION
[0024] Hereinafter, exemplary embodiments of the present invention
will be described in detail with reference to the accompanying
drawings.
[0025] In the Figures, the same reference numerals are used to
denote the same elements throughout the drawings.
[0026] FIG. 2 illustrates a front-view of a printed circuit board
(PCB) according to an exemplary embodiment of the present
invention.
[0027] In an exemplary embodiment of the present invention,
referring to FIG. 2, the PCB 31 may include semiconductor devices
32a within a semiconductor module 30. The semiconductor device 32
may be mounted on the PCB 31. The PCB 31 may include a connection
terminal portion 31a which may provide an electrical connection
with a module socket (not shown) at the lower end thereof. The
semiconductor device 32 may include a data storage element, for
example a memory device 32a, and a phase lock loop (PLL) circuit
32b. A condenser chip may be mounted on the PCB 31. Condenser chips
are well known in the art and will not be described further for the
sake of brevity.
[0028] In an exemplary embodiment of the present invention, a
substrate height h21 (i.e. a height of the PCB 31) may be between
1.5 times and 4 times greater than a device height h22 (i.e. a
distance between an upper end and lower end of the memory device
32a) when the memory device 32a is mounted on the PCB 31.
[0029] In another exemplary embodiment of the present invention,
the substrate height h21 may be between 21 mm and 24 mm.
[0030] In another exemplary embodiment of the present invention,
the device height h22 of the semiconductor device 32 may be between
10 mm and 12 mm.
[0031] In another exemplary embodiment of the present invention,
the connection terminal portion 31a may have a 168-pin
configuration and its height h23 may be between 2 mm and 2.5
mm.
[0032] In another exemplary embodiment of the present invention,
the height h24 (i.e. the distance from center line C1 of the memory
device 32a to the lower end of the PCB 31) may be between 7 mm and
14 mm.
[0033] In another exemplary embodiment of the present invention, a
distance between the center line of a semiconductor device and the
lower end of a PCB may be between 7 mm and 14 mm, in contrast to
conventional methods which may have the distance between the center
line of a semiconductor device, such as a memory device and the
lower end of a PCB, being between 11 mm and 21 mm. Accordingly, a
heat propagation distance from a semiconductor device 32 to a
motherboard through a PCB 31 may be reduced with this reduced
distance, thus increasing the amount of heat radiated in the
semiconductor device 32.
[0034] FIG. 3 illustrates a perspective view of a semiconductor
module according to an exemplary embodiment of the present
invention. Referring to FIG. 3, semiconductor module 30 may include
one or more heat sinks 33.
[0035] FIG. 4 illustrates a cross-sectional view taken along a line
of I-I of FIG. 3.
[0036] In another exemplary embodiment of the present invention,
referring to FIGS. 3 and 4, the semiconductor module 30 may include
a PCB 31, memory devices 32a and one or more heat sinks 33. The
memory devices 32a may be mounted on both sides of the PCB 31.
[0037] In another exemplary embodiment, the semiconductor module 30
may be a duel in-line memory module (DIMM).
[0038] In another exemplary embodiment, the one or more heat sinks
33 may have a flat shape and may be in contact with the memory
device 32a. A heat sink height h31 may be greater than a substrate
height h21. For example, the heat sink height h31 may be between
1.2 times and 3 times greater than the substrate height h21.
[0039] In an example of the exemplary embodiment of the present
invention, the heat sink height h31 may be between 23 mm and 43
mm.
[0040] In another exemplary embodiment of the present invention,
the substrate height h21 may be less than the heat sink height h31.
The difference between the substrate height h21 and the heat sink
height h31 may induce a second space S2 between the one or more
heat sinks 33. Further, air flow F1, which may be provided by a
ventilator (not shown), may pass through the second space S2
without an obstruction. Heat accumulated on the top end of the PCB
31 as well as heat deposited in the one or more heat sinks 33 may
be radiated by the air flow F1.
[0041] FIG. 5 illustrates a front-view of a semiconductor module
according to an exemplary embodiment of the present invention.
[0042] In another exemplary embodiment of the present invention,
referring to FIG. 5, the semiconductor module 40 may include a PCB
31, memory devices 32a and one or more heat sinks 43.
[0043] In another exemplary embodiment of the present invention,
the semiconductor module 40 may be a DIMM.
[0044] In another exemplary embodiment of the present invention, as
shown in FIG. 5, the one or more heat sinks 43 may have a height
h42 which increases in the direction Q1.
[0045] In another exemplary embodiment of the present invention, as
shown in FIG. 5, the one or more heat sink 43 may each have a
trapezoidal shape.
[0046] In another exemplary embodiment of the present invention,
the temperature of the air flow F2 may be higher at its out-flow as
compared to its in-flow through semiconductor module 40. As the air
flow F2 passes between the one or more heat sinks 43, heat from the
one or more heat sinks 43 may be transferred (i.e., radiated) to
the air flow F2. The heat sink height h42 at of the out-flow of air
flow F2 may be formed larger than the heat sink height h41 at the
in-flow of air flow F2. As illustrated in FIG. 5, a differential
between h41 and h42 may cause an incline in the one or more heat
sinks 43.
[0047] In an example of the exemplary embodiment of the present
invention, an inclination angle K1 may be between 5.degree. and
30.degree..
[0048] In another exemplary embodiment of the present invention, a
relatively constant low temperature of the DIMM 40 may be
maintained by the air flow F2 passing between the one or more heat
sinks 43 in the direction Q1. Maintaining a relatively constant low
temperature of the DIMM 40 may reduce a malfunction of the memory
device 32a due to heat and/or may improve the operational
reliability of the DIMM 40.
[0049] FIG. 6 illustrates a cross-sectional view of a semiconductor
module 50 according to another exemplary embodiment of the present
invention. The semiconductor module 50 may include a PCB 31, memory
devices 32a, and/or one or more heat sinks 53.
[0050] In another exemplary embodiment of the present invention,
the semiconductor module 50 may be a DIMM.
[0051] In another exemplary embodiment of the present invention,
the one or more heat sinks 53 may include a flat type contact
region G1. The flat type contact region G1 may be formed in direct
contact the memory device 32a, and/or a corrugated type remaining
region G2 which may contain irregularities.
[0052] In another exemplary embodiment of the present invention,
the irregularities may include concave, convex, saw-toothed,
squared-toothed and/or wavy shapes.
[0053] In another exemplary embodiment of the present invention,
the corrugated type remaining region G2 may be manufactured through
a press process.
[0054] In another exemplary embodiment of the present invention,
the corrugated type remaining region G2 may have an increased area
of air contact, allowing improved heat radiation effect.
[0055] FIG. 7 illustrates a front view of a semiconductor module 60
according to another exemplary embodiment of the present
invention.
[0056] FIG. 8 illustrates a cross-sectional view taken along a line
of J-J of FIG. 7.
[0057] In another exemplary embodiment of the present invention,
referring to FIGS. 7 and 8, the semiconductor module 60 may include
a PCB 31, memory devices 32a, and/or one or more heat sinks 63.
[0058] In another exemplary embodiment of the present invention,
the semiconductor module 60 may be a DIMM.
[0059] In another exemplary embodiment of the present invention,
the one or more heat sinks 63 may include a heat pipe which may
radiate heat using a fluid. The one or more heat sinks 63 may each
include a first metal member 63a and a second metal member 63b. The
second metal member 63b may be in contact with the first metal
member 63a.
[0060] In another exemplary embodiment of the present invention,
forming the one or more heat sinks 63 as a heat pipe may allow
greater thermal conductivity as compared to a copper pipe. The
thermal conductivity of the heat pipe (i.e., through a fluid
circulation within the heat pipe) may allow heat applied at one
portion of the heat pipe to be radiated across the entire heat pipe
at a higher rate.
[0061] In another exemplary embodiment of the present invention,
the one or more heat sinks 63 may include an evaporation portion
P1. The evaporation portion P1 may evaporate the fluid in a contact
region contacting the memory device 32a.
[0062] In another exemplary embodiment of the present invention,
the one or more heat sinks 63 may further include a condensation
portion P2. The condensation portion P2 may condense the fluid in
the remaining region. The condensed fluid may adhere to an inner
area of irregularities E1 of the condensation portion P2.
[0063] In another exemplary embodiment of the present invention,
the condensed fluid may be lowered by gravity to the evaporation
portion P1. The condensed fluid may be evaporated in the
evaporation portion P1. For example, similar to a refrigeration
process, the one or more heat sinks 63 may absorb heat at the
evaporation portion P1 and may radiate the heat at the condensation
portion P2.
[0064] In another exemplary embodiment of the present invention, a
third space S3 between the one or more heat sinks 63 may be formed
greater than according to conventional methods, which may improve
heat radiation.
[0065] FIG. 9 illustrates a cross-sectional view of a semiconductor
module 70 according to another exemplary embodiment of the present
invention.
[0066] In another exemplary embodiment of the present invention,
referring to FIG. 9, the semiconductor module 70 may include a PCB
31, memory devices 32a, and/or heat sinks 73.
[0067] In another exemplary embodiment of the present invention,
the semiconductor module 70 may be a DIMM.
[0068] In another exemplary embodiment of the present invention,
the heat sink 73 may be formed as a heat pipe. The heat sink 73 may
include a corrugated type first metal member 73a and a flat type
second metal member 73b. The heat sink 73 may further include a
bent portion B1 at the upper end of the flat type second metal
member 73b. The angle of the bend of the bent portion B1 may be
180.degree..
[0069] By conventional methods, a space between heat sinks may not
be great enough to bend the heat sinks. However, in another
exemplary embodiment of the present invention, the substrate height
h21 may be reduced relative to the heat sink height h71, thereby
forming a space between the heat sinks 73 in which the heat sink 73
may be bent, as illustrated with the bent portion B1 of the heat
sink 73.
[0070] In another exemplary embodiment of the present invention,
the heat sink 73 may include an overlapping portion. The
overlapping portion may be a region where the bent portion has
increased the thickness of the heat sink 73 with an overlap of the
bent portion B1 and a remaining unbent portion, as illustrated in
FIG. 9. The height of the overlapping portion may be equal to or
smaller than the height h72. The height h72 may be determined by
subtracting the substrate height h21 from the heat sink height
h71.
[0071] In another example of the exemplary embodiment of the
present invention, the heat sink height h71 may be between 28 mm
and 32 mm.
[0072] In another exemplary embodiment of the present invention, a
condensation portion P4 may be formed to be approximately twice as
large as the condensation portion P2 of FIG. 8.
[0073] In another exemplary embodiment of the present invention, a
substrate height relative to a heat sink height may be reduced,
thereby creating a heat radiation space between heat sinks. A heat
propagation distance from a semiconductor device to a motherboard
through a PCB may be reduced and convection may occur in the heat
radiation space. Thus, the efficiency of heat radiation may be
improved.
[0074] The exemplary embodiments of the present invention being
thus described, it will be obvious that the same may be varied in
many ways. For example, although above-described exemplary
embodiments of the present invention are described with the
condensed fluid including water and/or alcohol, the condensed fluid
may be selected from a plurality of fluids, wherein the plurality
of fluids have a boiling point which may be less than 100
C.degree.. Further, the above-described exemplary heat sinks may
include a plurality of metal materials having good thermal
conductivity. For example, copper and/or aluminum may be used as a
material of a heat sink in any of the above-described exemplary
heat sinks.
[0075] Further, above-described exemplary embodiments have been
described with respect to a DIMM. However, the above described
exemplary embodiments may be applied to any semiconductor device.
For example, embodiments of the above-described heat sinks may be
applied to a processor in a computer server.
[0076] Further, the bent portion in above-described embodiments has
been described as being 180 degrees. However, the bent portion may
have an any angle such that the bent portion indicates that the
portions of the heat sink are not straight.
[0077] Further, above-described exemplary embodiments have been
described with the substrate height h21 being 1.5 to 4 times
greater than the device height h22. However, multiples outside of
the above-defined range may be used with the exemplary embodiments
of the present invention.
[0078] Further, above-described substrate heights have been
described as being between 21 mm and 24 mm. However, it is
understood that substrates having heights outside of the
above-defined range may be used with the exemplary embodiments of
the present invention.
[0079] Further, the above-described connection terminal 31a has
been described as having a 168-pin configuration with a height
between 2 mm and 2.5 mm. However, it is understood that the
connection terminals in the above-described exemplary embodiments
may be configured for any pin configuration, and the connection
terminals may have heights outside of the above-defined range.
[0080] Further, above-described exemplary embodiments of a heat
sink having an inclination angle K1 has been described as having a
trapezoidal shape. However, it is understood that any inclined
shape may be used. For example, a triangular shape may be used.
[0081] Further, the inclination angle K1 has been described above
as being between 5.degree. and 30.degree.. However, the angle K1
may be any angle so as to induce a differential in the height
between the ends of a heat sink.
[0082] Further, the shape of the corrugated portion has been
described as including concave, convex, saw-toothed,
squared-toothed and/or wavy shapes. However, any shape allowing air
flow to pass the heat sink may be used.
[0083] Further, above-described embodiments of exemplary heat sinks
have been described in exclusion. For example, first the one or
more heat sinks 33 were described, then the one or more heat sinks
43 were described, and so on. However, it is understood that all of
the above-described heat sinks may be used alone or in any
combination with either other above-described heat sinks and/or
with conventional heat sinks.
[0084] Such variations are not to be regarded as departure from the
spirit and scope of the exemplary embodiments of the present
invention, and all such modifications as would be obvious to one
skilled in the art are intended to be included within the scope of
the following claims.
* * * * *