Lee; Hae Hyung

Patent Applications and Registrations

Patent applications and USPTO patent grants for Lee; Hae Hyung.The latest application filed is for "backlight unit and display device including the same".

Company Profile

0.9.12

Lee; Hae Hyung - Seoul KR
Lee; Hae Hyung - Suwon-si KR
Lee; Hae-Hyung - Gyeonggi-do KR

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Backlight unit and display device including the same Grant 8,817,203 - Lee , et al. August 26, 2	2014-08-26
Backlight unit and display device having the same Grant 8,602,624 - Lee , et al. December 10, 2	2013-12-10
Backlight Unit And Display Device Including The Same App 20110304792 - LEE; Hae Hyung ; et al.	2011-12-15
Backlight Unit And Display Device Having The Same App 20110267837 - LEE; Sang Hoon ; et al.	2011-11-03
Cooling apparatus for memory module Grant 7,705,449 - Baek , et al. April 27, 2	2010-04-27
Memory module, socket and mounting method providing improved heat dissipating characteristics App 20090130908 - Park; Sang-Wook ; et al.	2009-05-21
Memory module, socket and mounting method providing improved heat dissipating characteristics Grant 7,485,006 - Park , et al. February 3, 2	2009-02-03
Semiconductor stack package and memory module with improved heat dissipation Grant 7,473,993 - Baek , et al. January 6, 2	2009-01-06
Semiconductor module with heat sink and method thereof App 20080144292 - Lee; Hae-Hyung ; et al.	2008-06-19
Semiconductor module with heat sink and method thereof Grant 7,345,882 - Lee , et al. March 18, 2	2008-03-18
Semiconductor chip package with thermoelectric cooler Grant 7,301,233 - Lee , et al. November 27, 2	2007-11-27
Semiconductor Package Structures Having Heat Dissipative Element Directly Connected To Internal Circuit And Methods Of Fabricating The Same App 20070252257 - BAEK; Joong-Hyun ; et al.	2007-11-01
Cooling apparatus for memory module App 20070170580 - Baek; Joong Hyun ; et al.	2007-07-26
Heat-dissipating Member, Method Of Manufacturing The Same, Semiconductor Module Having The Heat-dissipating Member, And Method Of Manufacturing The Semiconductor Module App 20070126114 - LEE; Hee-Jin ; et al.	2007-06-07
Multi-chip package having heat dissipating path App 20060006517 - Lee; Jin-Yang ; et al.	2006-01-12
Semiconductor chip package with thermoelectric cooler App 20060001140 - Lee; Hae-Hyung ; et al.	2006-01-05
Memory module, socket and mounting method providing improved heat dissipating characteristics App 20050245137 - Park, Sang-Wook ; et al.	2005-11-03
Semiconductor stack package and memory module with improved heat dissipation App 20050199992 - Baek, Joong-Hyun ; et al.	2005-09-15
Semiconductor module with heat sink and method thereof App 20050201063 - Lee, Hae-Hyung ; et al.	2005-09-15

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