Baek; Joong-Hyun

Patent Applications and Registrations

Patent applications and USPTO patent grants for Baek; Joong-Hyun.The latest application filed is for "integrated circuit packages having redistribution structures".

Company Profile

0.30.39

Baek; Joong-Hyun - Gyeonggi-do KR
Baek; Joong-Hyun - Suwon-si N/A KR
BAEK; Joong-Hyun - Hwasung-City KR
Baek; Joong-Hyun - Kyungki-do KR
Baek; Joong-Hyun - Gyeonggi-go KR
Baek; Joong-hyun - Suwon KR
Baek, Joong-hyun - Suwon-city KR

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Apparatus for amplifying nucleic acids Grant 9,023,639 - Kim , et al. May 5, 2	2015-05-05
Package on package having improved thermal characteristics Grant 8,796,835 - Kim , et al. August 5, 2	2014-08-05
Integrated circuit packages having redistribution structures Grant 8,791,580 - Park , et al. July 29, 2	2014-07-29
Method of manufacturing semiconductor package Grant 8,524,539 - Lee , et al. September 3, 2	2013-09-03
Integrated Circuit Packages Having Redistribution Structures App 20130168842 - PARK; Chul ; et al.	2013-07-04
Semiconductor module and an electronic system including the same Grant 8,456,000 - Baek June 4, 2	2013-06-04
Light emitting device Grant 8,344,601 - Baek , et al. January 1, 2	2013-01-01
Wafer stacked package waving bertical heat emission path and method of fabricating the same Grant 8,310,046 - Baek , et al. November 13, 2	2012-11-13
Semiconductor module Grant 8,184,439 - Baek , et al. May 22, 2	2012-05-22
Method Of Manufacturing Semiconductor Package App 20120045871 - LEE; Hee-Jin ; et al.	2012-02-23
Wafer Stacked Package Waving Bertical Heat Emission Path And Method Of Fabricating The Same App 20120001348 - BAEK; Joong-Hyun ; et al.	2012-01-05
Package On Package Having Improved Thermal Characteristics App 20110304035 - Kim; Yoon-hoon ; et al.	2011-12-15
Wafer stacked package waving bertical heat emission path and method of fabricating the same Grant 8,049,329 - Baek , et al. November 1, 2	2011-11-01
Semiconductor Module App 20110032679 - Baek; Joong-hyun ; et al.	2011-02-10
Integrated circuit package and integrated circuit module Grant 7,880,291 - Park , et al. February 1, 2	2011-02-01
Semiconductor memory module having an oblique memory chip Grant 7,812,445 - Baek , et al. October 12, 2	2010-10-12
Semiconductor device including thermally dissipating dummy pads Grant 7,800,138 - Baek , et al. September 21, 2	2010-09-21
Light Emitting Device App 20100181887 - BAEK; Joong-Hyun ; et al.	2010-07-22
Cooling apparatus for memory module Grant 7,705,449 - Baek , et al. April 27, 2	2010-04-27
Memory Module App 20100079966 - BAEK; Joong-Hyun	2010-04-01
Semiconductor Module And An Electronic System Including The Same App 20100059880 - BAEK; Joong-Hyun	2010-03-11
Wafer Stacked Package Waving Bertical Heat Emission Path And Method Of Fabricating The Same App 20100038769 - BAEK; Joong-Hyun ; et al.	2010-02-18
Wafer stacked package having vertical heat emission path and method of fabricating the same Grant 7,626,261 - Baek , et al. December 1, 2	2009-12-01
Integrated circuit package and integrated circuit module App 20090273905 - Park; Sang-Wook ; et al.	2009-11-05
Apparatus For Amplifying Nucleic Acids App 20090186404 - KIM; Jae-Young ; et al.	2009-07-23
Memory module, socket and mounting method providing improved heat dissipating characteristics App 20090130908 - Park; Sang-Wook ; et al.	2009-05-21
Heat sink for semiconductor device and semiconductor module assembly including the heat sink App 20090129026 - Baek; Joong-hyun ; et al.	2009-05-21
Semiconductor Device, Semiconductor Package, Stacked Module, Card, System And Method Of Manufacturing The Semiconductor Device App 20090057880 - BAEK; Joong-Hyun ; et al.	2009-03-05
Memory module, socket and mounting method providing improved heat dissipating characteristics Grant 7,485,006 - Park , et al. February 3, 2	2009-02-03
Semiconductor stack package and memory module with improved heat dissipation Grant 7,473,993 - Baek , et al. January 6, 2	2009-01-06
Semiconductor plating system for plating semiconductor object App 20080141933 - Jo; Cha-jea ; et al.	2008-06-19
Semiconductor module with heat sink and method thereof App 20080144292 - Lee; Hae-Hyung ; et al.	2008-06-19
Wafer Stacked Package Having Vertical Heat Emission Path And Method Of Fabricating The Same App 20080099909 - BAEK; Joong-Hyun ; et al.	2008-05-01
Semiconductor module with heat sink and method thereof Grant 7,345,882 - Lee , et al. March 18, 2	2008-03-18
Semiconductor chip package with thermoelectric cooler Grant 7,301,233 - Lee , et al. November 27, 2	2007-11-27
Semiconductor Memory Module Having An Oblique Memory Chip App 20070252271 - BAEK; Joong-Hyun ; et al.	2007-11-01
Semiconductor Package Structures Having Heat Dissipative Element Directly Connected To Internal Circuit And Methods Of Fabricating The Same App 20070252257 - BAEK; Joong-Hyun ; et al.	2007-11-01
Cooling apparatus for memory module App 20070170580 - Baek; Joong Hyun ; et al.	2007-07-26
Semiconductor package, method of manufacturing the same, stacked semiconductor package including the same and method of manufacturing the stacked semiconductor package App 20070069396 - Baek; Hyung-Gil ; et al.	2007-03-29
Integrated circuit package and integrated circuit module App 20060284309 - Park; Sang-Wook ; et al.	2006-12-21
Semiconductor package having thermal interface material (TIM) Grant 7,081,375 - Baek , et al. July 25, 2	2006-07-25
Semiconductor module with vertically mounted semiconductor chip packages Grant 7,050,303 - Park , et al. May 23, 2	2006-05-23
Heat pipe and heat pipe structure App 20060090884 - Park; Sang-wook ; et al.	2006-05-04
Multi-chip package having heat dissipating path App 20060006517 - Lee; Jin-Yang ; et al.	2006-01-12
Semiconductor chip package with thermoelectric cooler App 20060001140 - Lee; Hae-Hyung ; et al.	2006-01-05
Memory module, socket and mounting method providing improved heat dissipating characteristics App 20050245137 - Park, Sang-Wook ; et al.	2005-11-03
Semiconductor module with heat sink and method thereof App 20050201063 - Lee, Hae-Hyung ; et al.	2005-09-15
Semiconductor stack package and memory module with improved heat dissipation App 20050199992 - Baek, Joong-Hyun ; et al.	2005-09-15
Semiconductor module with vertically mounted semiconductor chip packages App 20050135067 - Park, Sang-Wook ; et al.	2005-06-23
Stack package with improved heat radiation and module having the stack package mounted thereon App 20050133897 - Baek, Joong-Hyun ; et al.	2005-06-23
Underfill system for semiconductor package Grant 6,895,666 - Hong , et al. May 24, 2	2005-05-24
Stacked semiconductor module and method of manufacturing the same Grant 6,835,598 - Baek , et al. December 28, 2	2004-12-28
Clothespin type heat dissipating apparatus for semiconductor module App 20040250989 - Im, Yun-hyeok ; et al.	2004-12-16
Semiconductor package having thermal interface material (TIM) App 20040197948 - Baek, Joong-Hyun ; et al.	2004-10-07
Multi-chip package having improved heat spread characteristics and method for manufacturing the same Grant 6,781,849 - Baek , et al. August 24, 2	2004-08-24
Semiconductor package having thermal interface material (TIM) Grant 6,756,668 - Baek , et al. June 29, 2	2004-06-29
Stacked semiconductor module and method of manufacturing the same App 20040018661 - Baek, Joong-Hyun ; et al.	2004-01-29
Multi-chip package having improved heat spread characteristics and method for manufacturing the same App 20030210533 - Baek, Joong-Hyun ; et al.	2003-11-13
Semiconductor package having thermal interface material (TIM) App 20030080411 - Baek, Joong-Hyun ; et al.	2003-05-01
Heat sink with cooling fins for semiconductor package Grant 6,498,395 - Baek , et al. December 24, 2	2002-12-24
Underfill system for semiconductor package App 20020090750 - Hong, Seong-Jae ; et al.	2002-07-11
Semiconductor module with improved solder joint reliability App 20020074639 - Kim, Min-Ha ; et al.	2002-06-20
Apparatus for cooling semiconductor package App 20020063328 - Baek, Joong-hyun ; et al.	2002-05-30