U.S. patent application number 12/035047 was filed with the patent office on 2008-06-19 for porous composition of matter, and method of making same.
This patent application is currently assigned to INTERNATIONAL BUSINESS MACHINES CORPORATION. Invention is credited to Eric Connor, James P. Godschalx, Craig J. Hawker, James L. Hedrick, Victor Yee-Way Lee, Teddie P. Magbitang, Robert D. Miller, Q. Jason Niu, Willi Volksen.
Application Number | 20080142930 12/035047 |
Document ID | / |
Family ID | 39526119 |
Filed Date | 2008-06-19 |
United States Patent
Application |
20080142930 |
Kind Code |
A1 |
Connor; Eric ; et
al. |
June 19, 2008 |
POROUS COMPOSITION OF MATTER, AND METHOD OF MAKING SAME
Abstract
A low-k organic dielectric material having stable nano-sized
porous is provided as well as a method of fabricating the same. The
porous low-k organic dielectric material is made from a composition
of matter having a vitrification temperature (Tv-comp) which
includes a b-staged thermosetting resin having a vitrification
temperate (Tv-resin), a pore generating material, and a reactive
additive. The reactive additive lowers Tv-comp below Tv-resin.
Inventors: |
Connor; Eric; (Los Gatos,
CA) ; Godschalx; James P.; (Midland, MI) ;
Hawker; Craig J.; (Los Gatos, CA) ; Hedrick; James
L.; (Pleasanton, CA) ; Lee; Victor Yee-Way;
(San Jose, CA) ; Magbitang; Teddie P.; (San Jose,
CA) ; Miller; Robert D.; (San Jose, CA) ; Niu;
Q. Jason; (Midland, MI) ; Volksen; Willi; (San
Jose, CA) |
Correspondence
Address: |
SCULLY, SCOTT, MURPHY & PRESSER, P.C.
400 GARDEN CITY PLAZA, SUITE 300
GARDEN CITY
NY
11530
US
|
Assignee: |
INTERNATIONAL BUSINESS MACHINES
CORPORATION
Armonk
NY
DOW GLOBAL TECHNOLOGIES, INC.
Midland
MI
|
Family ID: |
39526119 |
Appl. No.: |
12/035047 |
Filed: |
February 21, 2008 |
Related U.S. Patent Documents
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Application
Number |
Filing Date |
Patent Number |
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10827694 |
Apr 19, 2004 |
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12035047 |
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10334438 |
Dec 31, 2002 |
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10827694 |
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Current U.S.
Class: |
257/632 ;
257/E23.002; 264/46.4 |
Current CPC
Class: |
H01L 21/02118 20130101;
C08J 9/0014 20130101; C08J 9/26 20130101; H01L 21/31695 20130101;
B29C 67/202 20130101; H01L 21/02203 20130101; C08J 2365/00
20130101; C08J 2201/046 20130101; H01L 21/312 20130101 |
Class at
Publication: |
257/632 ;
264/46.4; 257/E23.002 |
International
Class: |
H01L 23/58 20060101
H01L023/58; B29C 67/00 20060101 B29C067/00 |
Goverment Interests
[0003] The U.S. Government has a paid-up license in this invention
and the right in limited circumstances to require the patent owner
to license others on reasonable terms as provided for by the terms
of Cooperative Agreement No. 70NANB8H4013 awarded by NIST (Advanced
Technology Program).
[0004] This invention was made with the U.S. Government support
under the above-referenced Cooperative Agreement awarded by NIST.
The U.S. Government has certain rights in this invention.
Claims
1. A method of forming a porous material comprising: applying a
composition of matter having a vitrification temperature (Tv-comp)
onto a surface of a substrate, said composition of matter
comprising a b-staged thermosetting resin having a vitrification
temperature (Tv-resin), a pore generating material, and a reactive
additive selected to lower the Tv-comp below that of the Tv-resin;
heating the composition of matter to vitrify the resin and the
reactive additive; and decomposing the pore generating material
providing a porous layer of cured material on the surface of the
substrate.
2. The method of claim 1 wherein said decomposing comprises
heating.
3. The method of claim 1 wherein said decomposing comprises
radiation treatment.
4. The method of claim 1 wherein said composition of matter further
comprises a solvent.
5. The method of claim 1 wherein said reactive additive is selected
to increase solubility of said pore generating material
6. The method of claim 1 wherein: the b-staged thermosetting resin
comprises a polyarylene material; the pore generating material
comprises a thermally labile polymer material; and the reactive
additive comprises a triacetylene material that includes a
centrally located uniformly 1,3,5-trisubstituted phenyl moiety.
7. The method of claim 1 wherein the substrate includes an
interconnect structure.
8. An interconnect structure comprising at least a porous low-k
dielectric material which comprises a vitrified and decomposed
composition of matter having a vitrification temperature (Tv-comp),
said composition of matter comprising a b-staged thermosetting
resin having a vitrification temperature (Tv-resin), a pore
generating material, and a reactive additive selected to lower the
Tv-comp below that of the Tv-resin
9. The interconnect structure of claim 8 wherein said porous low-k
dielectric material has stable and nano-sized pores.
10. The interconnect structure of claim 8 wherein said porous low-k
dielectric has a dielectric constant of less than about 3.9.
11. The interconnect structure of claim 8 further comprising an
underlying substrate selected from the group consisting of a
semiconducting material, an insulating material, a conductive
material, and multilayers thereof.
12. The interconnect structure of claim 8 wherein: the b-staged
thermosetting resin comprises a polyarylene material; the pore
generating material comprises a thermally labile polymer material;
and the reactive additive comprises a triacetylene material that
includes a centrally located uniformly 1,3,5-trisubstituted phenyl
moiety.
13. The interconnect structure of claim 8 wherein the vitrified and
decomposed composition of matter results from the method of claim
1.
Description
[0001] This application is a divisional of U.S. patent application
Ser. No. 10/827,694, filed Apr. 19, 2004 which is a
continuation-in-part of, and claims priority to, U.S. application
Ser. No. 10/334,438, filed Dec. 31, 2002, which is hereby
incorporated by reference in its entirety.
RELATED APPLICATION
[0002] This application is related to co-assigned U.S. application
Ser. No. 10/334,413, which was filed concurrently with U.S.
application Ser. No. 10/334,438.
FIELD OF THE INVENTION
[0005] The present invention relates to compositions of matter that
can be employed as a low dielectric constant (low-k) insulating
layer in various microelectronic devices, and more particularly to
porous low-k dielectric compositions. The present invention also
relates to a method of introducing stable nano-sized pores into
thermosetting resins by using a porogen and a reactive
additive.
BACKGROUND OF THE INVENTION
[0006] The semiconductor industry's drive to continually improve
performance and density has forced the use of advanced materials
and interconnect structures. High interconnect performance requires
the reduction of resistance and capacitance. Copper metallization
was introduced in 1998 to reduce the resistance of interconnect
wiring. Capacitance reduction or the introduction of low dielectric
constant insulators, herein referred to as low-k dielectrics, are
needed for future performance enhancements.
[0007] For over 25 years, silicon dioxide has been the dielectric
insulator of choice for the semiconductor industry. Silicon dioxide
possesses excellent dielectric breakdown strength, a high modulus,
good thermal conductivity, a low coefficient of thermal expansion,
and excellent adhesion to metallic liners, plasma enhanced chemical
vapor deposited (PECVD) barrier cap layers, and other like
materials. However, with reduced ground rule dimensions and the
need for improved performance, silicon dioxide is slowly being
phased out and replaced with materials possessing lower
permittivity to achieve reduced capacitance. For example, at the
180 nm technology node, fluorosilicate glass is replacing silicon
dioxide in many applications.
[0008] At the 130 nm technology generation, "true" low-k
dielectrics are being implemented into semiconductor products.
There are several candidate materials but the industry has focused
primarily on two material classes: spin-on polymers and
carbon-doped PECVD silicon dioxide dielectrics.
[0009] Polymer dielectrics may be used as insulating layers between
various circuits as well as layers within circuits in
microelectronic devices, such as integrated circuits, multichip
modules, and laminated circuit boards. The microelectronics
fabrication industry is moving toward smaller geometries in its
devices to enable lower power and faster speeds. As the conductor
lines become finer and more closely packed, the requirements of the
dielectrics between such conductors become more stringent.
[0010] While polymer dielectrics often provide lower dielectric
constants than inorganic dielectrics, such as silicon dioxide,
polymer dielectrics often present challenges to process integration
during fabrication. For example, to replace silicon dioxide as a
dielectric in integrated circuits, the polymer dielectric must be
able to withstand processing temperatures during metallization and
annealing steps of the process. Preferably, the dielectric material
should have a glass transition temperature greater than the
processing temperature. The dielectric must also retain the
desirable properties under device use conditions. For example, the
dielectric should not absorb water which may cause an increase in
the dielectric constant and dielectric loss and which may
potentially lead to corrosion of metal conductors.
[0011] Porous thermoplastic polymers, particularly thermally stable
polymers, such as polyimides, have also been investigated for use
as low-k alternatives to silicon dioxide. Although such porous
thermoplastic materials can be made to have acceptable dielectric
constants and are relatively tough, being able to withstand the
mechanical processing steps necessary to fabricate microelectronic
devices, the pores tend to collapse during subsequent high
temperature processing thereby precluding porous thermoplastic
polymers for applications of interest.
[0012] Another class of low-k polymers that are attracting
considerable interest in the microelectronics industry is
thermosetting resins, particularly polyarylene resins. Such
thermosetting resins are disclosed, for example, in WO 98/11149.
Specifically, WO 98/11149 discloses dielectric polymers, which are
the reaction products of a cyclopentadienone functional compound
and an acetylene functional compound.
[0013] Although thermosetting resins are available, it has been
determined that such resin formulations may suffer from pore
collapse when attempting to form a porous structure from the resin
by introducing a porogen into the b-staged formulation, thereby
rendering such porous thermosetting resins also unsuitable for use
in many microelectronic applications.
[0014] The prior art literature in this field may be divided into a
number of different classes. The first is the formation of bloomers
that are functionalized with acetylenic substituents that are
capable of inducing chain extension or crosslinking during
processing. The crosslinking may be thermal or promoted by a
catalyst. These prior art references are characterized by
oligomeric materials containing acetylenic substituents bound to
the oligomers. The prior art falling into this group include, for
example, U.S. Pat. Nos. 4,587,315, 5,493,002, 5,426,234, 5,446,204,
6,265,753, 5,268,444 and 5,312,994.
[0015] There are a number of patents such as, for example, U.S.
Pat. Nos. 6,288,188, 6,252,001 and 6,121,495, that describe the
preparation of b-staged solutions of polyarylenes prepared from
different intermediates and subsequent thermosetting after
processing. While the matrix materials are similar, the reactive
functionality (type and number) is determined by monomer
stoichiometry before b-staging.
[0016] U.S. Pat. No. 6,093,636 describes the preparation of porous
organic thermosets including polyarylene compositions by the
thermal labile porogen approach. These porous organic thermosets
may suffer from pore collapse.
[0017] U.S. Pat. Nos. 5,426,234, 5,446,204, 5,268,444 and 5,312,994
describe the use of various acetylenic reactive diluents which
react with functionalized oligomers. In these prior art references
the goal was to lower viscosity for polymer melt processing and to
increase the crosslinking density after curing. This technique was
applied to the formation of dense thermosetting polymers with no
mention of porosity.
[0018] U.S. Pat. No. 6,359,091 describes a polyarylene composition
in which the thermosetting resin does not undergo a significant
drop of modulus at temperatures above 300.degree. C. during curing.
That feature reportedly enabled one to form porous films by
avoiding pore collapse. Specifically, the '091 patent discloses
that by modifying the formulations so that the resins do not
undergo a significant drop in modulus during cure or alternatively
shifting the temperature at which the minimum modulus occurs to a
lower temperature enables one to avoid pore collapse. Thus, in the
'091 patent the modulus-temperature profile is modified such that
the modulus drop of the b-staged resin prior to network formation
is minimized. In the '091 patent, a crosslinker is added to a
polyarylene oligomer solution.
[0019] U.S. Pat. No. 6,468,589 describe a composition for film
formation which comprises a poly(arylene ether) polymer having
repeating structural units represented by formula (1) mentioned at
Col. 2, lines 25-34. The poly(arylene ether) polymer is made by
heating a bisphenol compound and a dihalogenated compound in a
solvent in the presence of a catalyst such as an alkali metal
compound. Crosslinking agents such as actylenes may be present in
this prior art composition.
[0020] In view of the state of the art mentioned hereinabove, there
is still a need for providing thermosetting polymer compositions
which are capable of providing a low-k dielectric material having
nano-sized pores which are substantially stable and do not collapse
during further high temperature processing
[0021] In the present invention, a low molecular weight compound
that plasticizes the resin and acts as a reactive additive is
employed in forming thermosetting polymer compositions. During the
thermal ramp to the cure temperature, one role of the additive of
the present invention is to create a situation where the glass
transition temperature of the materials advances to a temperature
above the actual cure temperature of the system, i.e., to modify
the classical Time Temperature Transformation profile for the
thermoset. This aspect of the present invention is not described in
any of the above mentioned references. A characteristic of many
organic thermosets is that the glass transition temperature of the
thermoset closely tracks the cure temperature. In the present
application, by using the inventive additive, the applicants have
unexpectedly determined that a condition is created where the glass
transition temperature of the thermoset increases to a temperature
above the cure temperature, provided a threshold temperature is
exceeded. This feature is not mentioned in any of the prior art
mentioned above.
SUMMARY OF THE INVENTION
[0022] The present invention provides a means to introduce pores
into a thermosetting resin matrix by the addition of a pore
generating material, preferably a polymer, i.e., porogen, that
degrades to leave behind its imprint in the resin. For the porogen
to leave behind a nanometer sized hole, the polymer matrix must be
able to support these small structures at the temperatures required
for its removal. Thermal studies of organic thermosetting resins
such as polyarylene resins that undergo a substantial degree of
crosslinking via acetylene-acetylene reactions have revealed that
the vitrification event occurs at temperatures above 400.degree. C.
Some porogens, which have tailored architectures, degrade before
these matrices are significantly cured. The implication of this is
that once the porogen has burned out, the resultant pore may
collapse thereby providing a dense dielectric film which is
unsuitable in many microelectronic applications.
[0023] In an attempt to address this, the applicants of the present
invention have carried out a study to make the matrix more rigid
(e.g., by increasing the crosslinking density), so as to support
small pores. The main focus of this approach was to add a low
molecular weight compound that plasticizes the resins and acts as a
reactive additive (or diluent). During thermal ramp to cure
temperature, one role of the reactive additive is to create a
situation where the glass transition temperature (Tg) of the
material advances to a temperature above the actual cure
temperature of the system, i.e., to alter the classic Time
Temperature Transformation (TTT) profile for the thermosetting
resin.
[0024] A characteristic of many organic thermosetting resins is
that the Tg of the thermoset closely tracks the cure temperature,
e.g., if a thermosetting resin was heated to 250.degree. C., the Tg
of the cured resin would also be near 250.degree. C. In the present
invention, the reactive additive (also termed "reactive diluent"),
creates a condition where the Tg of the thermoset increases to a
temperature above the cure temperature, provided a threshold
temperature is exceeded.
[0025] Specifically, the present invention provides a composition
of matter having a vitrification temperature (Tv-comp) comprising a
b-staged thermosetting resin having a vitrification temperature
(Tv-resin); a pore generating material; and a reactive additive
that is capable of lowering the Tv-comp below that of the
Tv-resin.
[0026] The term "thermosetting resin" denotes any polymer resin
which does not melt when heated but, at sufficiently high
temperatures, decomposes irreversibly. The thermosetting resins are
substantially crosslinked materials consisting generally of an
extensive three-dimensional network of covalent chemical
bonding.
[0027] The term "vitrification temperature" denotes the onset
temperature in a particular thermosetting polymer where the
viscosity begins to increase significantly. The term "vitrification
temperature" may be interchangeably used with the term "onset of
cure".
[0028] The term "b-staged thermosetting resin" denotes a stage of
forming a thermosetting resin wherein at least two monomers react
to provide a matrix material having an advanced molecular weight
wherein substantially no gelling occurs.
[0029] The reactive additive employed in the present invention may
also serve as a compatiblizer between the b-staged matrix material
and the pore generating material causing phase separation to be
delayed in nucleation and growth systems, while preventing
agglomeration in particle template approaches. The reactive
additive employed in the present invention also lowers the
vitrification temperature of the resin matrix such that
vitrification may occur below the thermal decomposition temperature
of the pore generating material. Finally, the reactive additive of
the present invention reacts to modify the matrix, allowing it to
resist pore collapse upon decomposition of the pore generating
material.
[0030] Specifically, the reactive additives employed in the present
invention are acetylene based monomers that soften or melt below a
certain temperature, and when a critical temperature is reached the
reactive additive reacts with the b-staged thermosetting resin to
form a rigid networked polymer.
[0031] The present invention also provides a method of forming a
porous, low-k dielectric material. Specifically, a preferred method
of the present invention includes: applying a composition of matter
having a vitrification temperature (Tv-comp) onto a surface of
substrate, said composition of matter comprising a b-staged
thermosetting resin having a vitrification temperature (Tv-resin),
a pore generating material, and a reactive additive that is
selected to lower the Tv-comp below that of the Tv-resin; heating
the composition of matter to vitrification; and decomposing, via
thermal treatment or radiation, the pore generating material
providing a porous layer of cured material on the surface of the
substrate.
BRIEF DESCRIPTION OF THE DRAWINGS
[0032] FIG. 1 is a modulated DSC (Differential Scanning
Calorimetry) curve for a polyarylene resin with additives.
[0033] FIG. 2 is a graph showing DMA Dynamic Mechanical Analysis)
curves of polyarylene resins with additives.
[0034] FIG. 3 is a graph showing DSC curves of polyarylene resins
with an additive.
[0035] FIG. 4 is a graph showing the altering of the TTT
(time-temperature-transformation) diagram of a polyarylene resin
with additives.
[0036] FIG. 5 is a graph monitoring the heat capacity, heat flow
and non-reversible heat flow occurring where a polyarylene resin
and 20 wt. % additive are heated isothermally at 325.degree. C.
[0037] FIG. 6 is a graph showing the DMA curves demonstrating how
reactive additives dissolve a polystyrene star porogen into a
polyarylene resin.
[0038] FIG. 7 is a graph showing the DSC curves of nanoparticles
containing varying amounts of additives.
[0039] FIG. 8 is a graph showing the DMA thermogram of two
partially cured polyarylene resins containing polystyrene
nanoparticles, one with additive and the other without
additive.
[0040] FIGS. 9A-C are SEMs (Scanning Electron Micrographs) of
polyarylene resins with crosslinked polystyrene nanoparticles.
[0041] FIGS. 10A-C are SEMs of polyarylene resins with crosslinked
polystyrene nanoparticles and additive.
[0042] FIG. 11 is a plot showing the thickness changes measured for
spun films of a polyarylene resin upon curing from 300.degree. C.
vs. 430.degree. C. with different wt. % of additive added.
[0043] FIG. 12 is a graph showing DMA curves of various polyarylene
resins with 25 wt. % additive.
[0044] FIGS. 13A-B are SEMs of polyarylene resins without and with
additive.
[0045] FIGS. 14A-D14D are FE-SEM's (Field Emission Scanning
Electron Micrographs) of porous polyarylenes generated with various
stoichiometries ranging from 1:1 to 1:0.7 all having 25% additive
and 40% wt. polystyrene nanoparticles.
DETAILED DESCRIPTION OF THE INVENTION
[0046] As stated above, the present invention provides a
composition of matter that is capable of forming a low-k dielectric
material having stable nano-sized pores within the dielectric
material. The composition of matter of the present invention
includes a b-staged thermosetting resin having a vitrification
temperature (Tv-resin); a pore generating material; and a reactive
additive. The reactive additive employed in the present invention
is selected so as to lower the vitrification temperature of the
composition below that of Tv-resin.
[0047] In the present invention, Tv-resin is from about 200.degree.
C. to about 450.degree. C., while Tv-comp is from about 180.degree.
C. to about 400.degree. C. Moreover preferably, Tv-resin is from
about 200.degree. C. to about 400.degree. C., while Tv-comp is from
about 160.degree. C. to about 350.degree. C., even more preferably,
Tv-resin is from about 200.degree. C. to about 350.degree. C.,
while Tv-comp is from about 160.degree. C. to about 350.degree.
C.
[0048] Based on 100 percent dry weight of the total composition,
the composition of matter comprises from about 20 to about 91
weight percent of b-staged thermosetting resin, from about 5 to
about 50 weight percent of pore generating material, and from about
4 to about 60 weight percent of reactive additive. More preferably,
the composition of matter of the present invention comprises from
about 30 to about 75 weight percent of b-staged thermosetting
resin, from about 10 to about 40 weight percent of pore generating
material, and from about 4 to about 50 weight percent of reactive
additive. Most preferably, the composition of matter of the present
invention comprises from about 60 to about 70 weight percent of
b-staged thermosetting resin, from about 25 to about 35 weight
percent of pore generating material, and from about 4 to about 30
weight percent of reactive additive.
[0049] The b-staged thermosetting resins employed in the present
invention contain functionality that is reactive with the reactive
additive. A preferred thermosetting resin is a polyarylene resin.
The term "polyarylene" is used herein to denote aryl moieties or
inertly substituted aryl moieties which are linked together by
bonds, fused rings, or inert linking groups such as oxygen, sulfur,
sulfone, sulfoxide, carbonyl, etc. The precursor composition may
comprise monomers, oligomers, or mixtures thereof. Preferably, the
precursor composition comprises cyclopentadienone functional groups
and acetylene functional aromatic compounds and/or partially
polymerized reaction products of such compounds.
[0050] The most preferred precursor compositions that can be
employed in the present invention comprise the following monomers
and/or partially polymerized reaction products of the following
monomers:
[0051] a biscyclopentadienone of the formula:
##STR00001##
(b) a polyfunctional acetylene of the formula:
##STR00002##
(c) and, optionally, a diacetylene of the formula:
##STR00003##
[0052] wherein R.sup.1 and R.sup.2 are independently H or an
unsubstituted or inertly-substituted aromatic moiety and Ar.sup.1,
Ar.sup.2 and Ar.sup.3 are independently an unsubstituted aromatic
moiety, or inertly-substituted aromatic moiety, and y is an integer
of three or more. Stated alternatively, the most preferred
precursor material comprises a curable of the formula:
[A].sub.w[B].sub.z[EG].sub.v
[0053] wherein A has the structure:
##STR00004##
[0054] and B has the structure:
##STR00005##
[0055] endgroups EG are independently represented by any one of the
formulas:
##STR00006##
[0056] wherein R.sup.1 and R.sup.2 are independently H or an
unsubstituted or inertly-substituted aromatic moiety and Ar.sup.1,
Ar.sup.2 and Ar.sup.3 are independently an unsubstituted aromatic
moiety or inertly-unsubstituted aromatic moiety and M is a bond, y
is an integer of three or more, p is the number of unreacted
acetylene groups in the given mer unit, r is one less than the
number of reacted acetylene groups in the given mer unit and
p+r=y-1, z is an integer from 1 to about 1000; w is an integer from
0 to about 1000 and v is an integer of two or more.
[0057] The definition of aromatic moiety includes phenyl,
polyaromatic and fused aromatic moieties. Inertly-substituted means
the substituent groups are essentially inert to the
cyclopentadienone and acetylene polymerization reactions and do not
readily react under the conditions of use of the cured polymer in
microelectronic devices with environmental species such as water.
Such substituent groups include, for example, F, Cl, Br,
--CF.sub.3, --OCH.sub.3, --OCF.sub.3, --O--Ph and alkyl of from one
to eight carbon atoms, cycloalkyl of from three to about eight
carbon atoms. For example, the moieties which can be unsubstituted
or inertly-substituted aromatic moieties include:
##STR00007## ##STR00008##
[0058] wherein Ar is an aromatic moiety as defined above and Z can
be: --O--, --S--, alkylene, --CF.sub.2--, --CH.sub.2--,
--O--CH.sub.2--, perfluoroalkyl, perfluoroalkoxy,
##STR00009##
[0059] wherein each R.sup.3 is independently --H, --CH.sub.3,
--CH.sub.2CH.sub.3, --(CH.sub.2).sub.2CH.sub.3 or Ph (phenyl). A
highly preferred thermosetting resin employed in the present
invention is a polyarylene resin sold under the tradename SiLK.RTM.
by the Dow Chemical Co. which is the resultant cured b-staged Diels
Alder reaction product of a biscyclopentadienone and a
polyfunctional acetylene. Commercially available examples of some
other preferred polyarylene resins include SiLK.RTM.-H, and
SiLK.RTM.-I dielectric resins from the Dow Chemical Company.
[0060] The reactive additive that is employed in the present
invention includes functionality that may become chemically
incorporated into the resin upon vitrification. Hence, the reactive
additive produces a structure that has sufficient mechanical
strength to withstand capillary collapsing forces produced upon
porogen decomposition. Moreover, the reactive additive employed in
the present invention may increase the solubility of the porogen in
the resin. Additionally, the reactive additive employed in the
present invention is capable of plasticizing the resin, thereby
lowering the glass transition temperature of the composition and
allowing vitrification to proceed at lower temperatures.
Furthermore, the reactive additive employed in the present
invention allows, during curing of the composition of matter, the
glass transition temperature of the matter to advance above the
curing temperature.
[0061] Specifically, the reactive additive employed in the present
invention is an acetylene based monomer that softens or melts above
a certain temperature and when a critical temperature is reached
the monomer reacts with the resin composition to form a rigid
networked polymer. The acetylene based monomers that can be
employed in the present invention are selected from one of the
following compounds:
##STR00010## ##STR00011## ##STR00012##
[0062] Of these acetylene based monomers, TRIS A, TRIS 2 and TRIS P
are highly referred. The acetylene based monomers can be prepared
using techniques that are well known to those skilled in the art.
See, for example, N. Miyaura and A. Suzuki, Chem. Rev., 1995, vol.
95, p. 2457.
[0063] The following reaction scheme illustrates the general
synthesis of Tris 2, Tris E, hexyl Tris starting from a
para-substituted benzyl ring that may be employed.
##STR00013## ##STR00014##
[0064] The pore generating material, i.e., porogen, that is present
in the composition of matter of the present invention is a
thermally labile polymer which is substantially dispersed within
the b-staged thermosetting resin. The porogen employed in the
present invention is preferably a pore generating polymer. The
porogen is removed from the composition of matter of the present
invention by decomposition, either by thermal means or by ionizing
radiation induced decomposition, leaving stable nano-sized pores
within the resultant low-dielectric film.
[0065] The porogens that may be employed in the present invention
include a block copolymer wherein one of the blocks is compatible
with the crosslinked matrix resin and the other block is
incompatible therewith. Useful polymer blocks include polystyrenes
such as polystyrene and poly-.alpha.-methylstyrene,
polyacrylonitriles, polyethylene oxides, polypropylene oxides,
polyethylenes, polyactic acids, polysiloxanes, polycaprolactones,
polyurethanes, polymetbacrylates, polyacrylates, polybutadienes,
polyisoprene, polyvinyl chlorides, and polyacetals, and
amine-capped alkylene oxides (commercially available as
Jeffamine.TM. polyether amines from Huntsman Corp.).
[0066] Other examples of porogens that may be employed in the
present invention include: thermoplastic homopolymers and random
(as opposed to block) copolymers. The term "homopolymer" denotes a
compound comprising repeating units from a single monomer. Suitable
thermoplastic materials include, but are not limited to:
polystyrenes, polyacrylates, polymethacrylates, polybutadienes,
polyisoprenes, polyphenylene oxides, polypropylene oxides,
polyethylene oxides, poly (dimethylsiloxanes), polytetrahydro
furans, polyethylenes, polycyclohexylethylenes,
polyethyloxazolines, polyvinylpyridines, polycaprolactones,
polyactic acids, copolymers of these materials and mixtures
thereof. The thermoplastic materials may be linear, branched,
hyperbranched, dendritic, or star like in nature.
[0067] The porogen may also be designed to react with the
crosslinkable matrix precursor during or subsequent to b-staging to
form blocks or pendant substitution of the polymer chain. For
example, thermoplastic polymers containing reactive groups such as
vinyl, acrylate, methacrylate, allyl, vinyl ether, maleimido,
styryl, acetylene, nitrile, furan, cyclopentadienone,
perfluoroethylene, oxytrifluorovinyl, pyrone, propiolate, phenyl
propriolate or orthrodiacetylene groups can form chemical bonds
with the crosslinkable matrix precursor, and then the thermoplastic
porogen can be removed to leave pores.
[0068] The porogen may also be a material that has an average
diameter of from about 1 to about 50 nm. Examples of such materials
include dendrimers (available through Dendritech, Inc.),
hyperbranched polymer systems, latex polymers, star shaped and
dendritic polymers. These materials may be non-reactive with the
crosslinkable matrix precursor, or reactive as described above. For
reactive incorporation, this may be due to functionality directly
incorporated into the porogen or alternatively via a linker capable
of reacting with both the resin and the porogen. P A highly
preferred porogen that may be employed in the present invention is
crosslinked polystyrene nanoparticles that are prepared by
microemulsion techniques.
[0069] In addition to the above components, the composition of
matter of the present invention may also include a solvent. The
solvent may be any known solvent that useful in processing
thermosetting resin compositions. The solvent may be a single
solvent or a mixture of solvents may be employed. Illustrative
examples of suitable solvents that may be employed in the present
invention include, but are not limited to: mesitylene, pyridine,
triethylamine, N-methylpyrrolidinone, methyl benzoate, ethyl
benzoate, butyl benzoate, ethyl lactate, cyclopentanone,
cyclohexanone, cycloheptanone, cyclooctanone,
cyclohexylpyrrolidinone, and ethers or hydroxy ethers such as
dibenzylethers, diglyme, triglyme, diethylene glycol ethyl ether,
diethylene glycol methyl ether, dipropylene glycol methyl ether,
toluene, xylene, benzene, dipropylene glycol monomethyl ether
actetate, dichlorobenzene, propylene carbonate, alkyl
alkoxypropionates, naphthalene, diphenyl ether,
.gamma.-butyrolactone, dimethylacetamide, dimethylformamide and
mixtures thereof. The solvent may also include a supercritical
fluid such as, for example, supercritical CO.sub.2. The pressure of
the solvent may range from atmospheric to supercritical, with
supercritical being preferred in some embodiments.
[0070] The composition of matter of the present invention described
hereinabove can be used to make low-k dielectric films and
interlayers dielectrics for integrated circuits in accordance with
known procedures. Specifically, the low-k dielectric films are
prepared by first applying the composition of matter of the present
invention onto a surface of a substrate utilizing known deposition
techniques such as chemical vapor deposition, plasma-assisted
chemical vapor deposition, evaporation, spin-on coating, dip
coating, brushing and the like. Preferably, the composition of
matter of the present invention is applied by spin-on coating.
[0071] The term `substrate` is used herein to denote any
semiconducting material, any conductive material, any insulating
material or any combination, including multilayers thereof.
Examples of semiconducting materials include, but are not limited
to: Si, SiGe, SiC, SiGeC, GaAs, InAs, InP and other III/V compound
semiconductors. The term "semiconducting" also includes
silicon-on-insulator materials.
[0072] Examples of conductive materials include, but are not
limited to: polysilicon, metals, metal alloys, and metal silicides.
Illustrative examples of insulating materials include oxides,
nitride and oxynitrides.
[0073] After applying the composition of matter of the present
invention to a suitable substrate, the resultant structure
containing the composition of matter of the present invention is
heated to a temperature that is sufficient to vitrify the
composition. Specifically, this heating step is performed at a
temperature of from about 200.degree. to about 350.degree. C. for a
time period of from about 60 to about 3600 seconds. More
preferably, this heating step is performed at a temperature of from
about 200.degree. to about 300.degree. C. for a time period from
about 60 to about 3600 seconds.
[0074] In accordance with the present invention, the presence of
the reactive additive in the composition of matter lowers Tv-comp
below that of Tv-resin due to plasticization.
[0075] Next, the pore generating material present in the
composition of matter is decomposed therefrom utilizing known heat
treatment steps or radiation-induced decomposition providing a
porous layer of cured material on the surface of the substrate. The
porous layer of cured material provided in the present invention is
characterized as a low-k material having a dielectric constant of
less than about 3.9, preferably less than about 3.0, most
preferably less than about 2.5. Moreover, the porous layer of cured
material has nano-sized pores that are stable and do not collapse
upon further high temperature heat steps. The term "nano-sized
pores" as used in conjunction with the porous layer of cured
material denotes a pore size of less than about 10 nm, with a pore
size of less than about 7 nm being more highly preferred.
[0076] When a heat treatment is used to decompose the porogen from
the material, the temperature of such treatment is from about
350.degree. to about 45.degree. C. and the decomposition time is
from about 60 seconds to about 4 hours. More preferably, porogen
decomposition occurs at a temperature of from about 350.degree. to
about 430.degree. C. for a time period of from about 60 seconds to
about 4 hours. When radiation-induced decomposition is employed, a
laser, such as an excimer laser, is employed. Alternatively,
ionizing radiation such as e-beams, .alpha.-rays, or X-rays may be
used.
[0077] The following examples are provided to illustrate the
present invention and to show the effects that the reactive
additive has on organic thermosetting resins. The resin was
prepared in accordance with the present invention, unless otherwise
stated.
[0078] In some examples, the nomenclature Matrix 3/2, Matrix 1/1,
Matrix 0.9, Matrix 0.8, Matrix 0.7 are employed. This nomenclature
denotes a polyarylene resin that is prepared by reacting compound 1
with compound 2
##STR00015##
[0079] where R.sup.2, Ar.sup.3, Ar.sup.1, and R.sup.1 are as
defined above, c is 0, 1, 2 or 3, a=3, and b=2 using the techniques
described for example, in U.S. Pat. Nos. 6,359,091, 6,288,188,
6,252,001, 6,121,495 and 5,965,679, the entire contents of each are
incorporated herein by reference. For Matrix 3/2 the equivalents of
compound 1 is one and the equivalents of compound 2 is 1.5; for
Matrix 1/1 the equivalents of compound 1 is one and the equivalents
of compound 2 is one; for Matrix 0.9 the equivalents of compound 1
is one and the equivalents of compound 2 is 0.9; for Matrix 0.8 the
equivalents of compound 1 is one and the equivalents of compound 2
is 0.8; and for Matrix 0.7 the equivalents of compound 1 is one and
the equivalents of compound 2 is 0.7.
EXAMPLE 1
[0080] Effect of the reactive additives on the matrix properties.
This example demonstrates that the additives of the present
invention are miscible in the polyarylene resin, that the presence
of the same significantly bolsters the crosslinking density in
acetylene poor formulations, and that the additives significantly
decrease the vitrification temperature of the polyarylene
system.
[0081] The non-reversible heat flow curves provided by the
modulated Differential Scanning Calorimetry (DSC) graph in FIG. 1
indicate when reactions occur within the resin. In this figure,
Curve 1 is Matrix 3/2 with TRIS A; Curve 2 is Matrix 3/2 with TRIS
P; Curve 3 is Matrix 3/2 powder; and Curve 4 is Matrix 3/2 with
TRIS 2. When the mixtures of Matrix-3/2 with TRIS A curve is
examined (curve 1), a broad exotherm from 200.degree. C. to
250.degree. C. was observed attributed to the Diels-Alder reaction
in which residual cyclopentadienone units from the MATRIX-3/2 in
the prepolymer react with acetylene units from the additive. It is
at this point that the additive was chemically incorporated into
the prepolymer. For TRIS 2 and TRIS P, the prepolymer becomes
functionalized with a more reactive acetylenic group. Continuing
along the curve, to increasing temperatures, the next thermal
transition from 310.degree.-360.degree. C. with peak maximum at
430.degree. C., was assigned to the thermal reaction of the
phenylacetylene from TRIS A and with other phenylacetylene units
contained on the Matrix-3/2 prepolymer. The heat capacity curve
(Cp) revealed an initial drop in heat capacity around 200.degree.
C. region (a loss of CO from the Diels Alder reaction of the
acetylene and cyclopentadiene) and another drop around 370.degree.
C. This second drop in Cp is a typical characteristic of
vitrification (or a stiffening) of the resin and its assignment was
confirmed with mechanical analysis. Relying on this interpretation
of the DSC curves, one can draw conclusions as to which additive
delivers properties favorable for the process. It appears from DSC,
that TRIS 2 causes vitrification to occur at a higher temperature
relative to that for TRIS A and TRIS P. Of the three additives
shown, TRIS P stiffens the matrix at the lowest temperature
(340.degree. C.). The DMA curves are now considered.
[0082] Dynamic Mechanical Analysis (DMA) shown in FIG. 2 supports
many of the thermal assignments based on the DSC data. It is noted
that the results in FIG. 2 were actually obtained on a Matrix 1:1
resin but the results are still informative, as similar reactions
occur in both resins. In FIG. 2, Curve 1 is for Matrix 1:1 with 20%
TRIS A; Curve 2 is for Matrix 1:1 with 20% TRIS P; Curve 3 is for
Matrix 1:1 with 20% TRIS 2; and Curve 4 is for Matrix 1:1. The DMA
results clearly show how the additives perform as a reactive
diluent. At a temperature of 300.degree. C., the Matrix 1:1 resin
containing no additive clearly had a higher drive signal compared
to the other resins which contain the additives. When the additives
themselves are compared, TRIS 2 relative to TRIS A and TRIS P
provides a stiffer material at 230.degree. C. In the presence of
the additives, the Matrix 1:1 resin in general, reaches a soft
rubbery region between 250.degree.-320.degree. C. Subsequent
vitrification of the resin is reflected by the increase of the
drive signal with temperature and it is apparent from the data in
FIG. 2 that the additives decrease the temperature at which this
stiffening occurs relative to the neat polyarylene resin. TRIS A
and TRIS 2 show an onset of stiffening at 350.degree. C. and
achieve a maximum drive signal between 440.degree.-450.degree. C.
It is apparent that TRIS P provides the earliest onset of
vitrification (.about.320.degree. C.) and reaches a maximum in
modulus at 410.degree. C.
[0083] The data provided above demonstrates that the addition of an
reactive additive such as TRIS 2 resulted in polyarylene resins
with a lower Tg, consistent with miscibility, and the additive
significantly lowered the vitrification temperature of the resin
system.
EXAMPLE 2
Evidence for Unexpected TTT Diagram Behavior
[0084] The proceeding section describes how the low molecular
weight acetylene monomers have a profound effect on the curing and
resulting modulus of a polyarylene resin. As described, during the
thermal ramp to the cure temperature, one role of the additive was
to create a situation where the Tg of the material went to a
temperature above the actual curing temperature of the system,
i.e., to alter the TTT diagram. To investigate this phenomenon,
additional DSC data are presented.
[0085] Curve 1 of FIG. 3 shows that when the resin is heated to
300.degree. C. and re-run, the measured Tg of the resin is roughly
270.degree. C. As the resin was heated at 5.degree. C./minute, the
Tg lagged behind by 20.degree.-30.degree. C. which is typical of
thermosets. When a temperature which corresponds to the reaction of
the reactive diluent was reached, in this case acetylene monomer
TRIS P, the crosslinking reaction occurs and the Tg of the resin
overtakes the cure temperature. For example, when the resin
containing TRIS P was heated to 350.degree. C. at 5.degree. C. per
minute, the Tg of the thermoset was at 350.degree. C., which is not
normal for thermosets.
[0086] FIG. 4: Altering the TTT diagram of Matrix 1:1 with
additives. In this experiment samples were heated to 325.degree. C.
and then held at this temperature for 1 hour. In this figure, Curve
1 is for Matrix 1:1 with 20% TRIS P; Curve 2 is for Matrix 1:1 with
10% TRIS P; Curve 3 is for Matrix 1:1; Curve 4 is for Matrix 1:1
with 10% TRIS 2; and Curve 5 is for Matrix 1:1 with 5% TRIS A. The
samples were then cooled and then the DSC curves showed an increase
in Tg of the resins associated with the different types of reactive
small molecules added to the polyarylene resin.
[0087] The experiment that is depicted in FIG. 4 shows clearly how
the Tg of the resins increase to and rise above the cure
temperature. For reference, curve 3 is similar to the Matrix 1:1
without an additive. When the polyarylene resins are held at
325.degree. C. for one hour and the samples re-run, the Tg of the
resins containing the additives (TRIS A, TRIS 2 and TRIS P)
increased above the cure temperature. In particular, when a sample
containing additive TRIS P (10 wt. % with respect to resin was
cured, the Tg of the resin increased to 355.degree. C., a value
30.degree. C. above the cure temperature. When 20 wt. % of reactive
TRIS P is put into the Matrix 1:1 resins, the polyarylene resin has
reached a vitrification state, and the Tg is not measurable under
these conditions (i.e., Tg .varies.).
[0088] FIG. 5 shows the various DSC curves as the polyarylene resin
was cured at 325.degree. C. Indicative of vitrification, the heat
capacity drops during the 325.degree. C. cure, similarly the
minimum point seen in the heat flow curve reflects the point of
vitrification.
[0089] Conclusions: The use of acetylenic based monomer structures
in polyarylene matrices provides a plasticization period which is
followed by a vitrification above a critical temperature (here
325.degree. C.). The additives lower the vitrification temperature
relative to the neat resin leading to an unusual TTT behavior that
enables porogen burnout in the glassy state with retention of
nano-sized pore.
EXAMPLE 3
Compatibilization of Pore Generating Molecules in a Polyarylene
Thermosetting Resin
The Process for Nucleation and Growth Phase Separation Process for
Porogen and Polyarylene Resin
[0090] Two general strategies have been developed for the
generation of porous polyarylenes: the first involves the tempting
of porosity by an arrested nucleation and growth (N/G) process of a
porogen with the polyarylene, while the second relies on a
performed template or nanoparticle to define the hybrid morphology
and ultimately the porous structure. Considerable work was directed
towards the preparation of star-shaped and related polymer
architectures, designed to be initially miscible with polyarylene
resins and the phase separates upon network formation via an
arrested N/G process. Defining the processing conditions is tedious
and stringent control of the chemistry (i.e., mol. Wt.,
functionality, architecture, etc.) must be carefully defined to
enable initial miscibility. Since the range of molecular weights to
facilitate is narrow, the use of additives significantly simplifies
this process.
[0091] The DMA curves show how the reactive diluents dissolve a
polystyrene star porogen into the polyarylene resin and then upon
thermal cure and advancement of the molecular weight of the resin,
the polystyrene star shaped macromolecule phase separates to create
nano-size polystyrene rich regions, which upon thermal
decomposition, leaves a nanometer sized hole. The DMA curves in
FIG. 6 show how a polyarylene thermosetting resin+reactive diluent
(TRIS 2) and a pore generating material (polystyrene star)
behave.
[0092] Curve 1 is where the resin was treated to 180.degree. C. for
one hour. No Tg at 120.degree. C. which would correspond to a
polystyrene rich phase, was evident in either the drive signal or
the tan delta for this measurement. This indicates that the
polystyrene was completely miscible/compatible with the
thermosetting resin+reactive diluent. Upon a cure to 275.degree.
C., a Tg at 120.degree. C. which corresponds to polystyrene was
evident in both the drive signal and the tan delta. This indicates
as stated above that upon advancement of the molecular weight of
the matrix a phase separation of the pore generating material had
occurred to give the polystyrene rich nano-sized domains
(characterized by FE-SEM for example), which then result in the
nanoporous material.
EXAMPLE 4
[0093] One of the main goals of generating a nano-particle with a
low volume swell factor (VSF) was to produce a material that does
not absorb the polyarylene resin into the particle interior. Under
these circumstances, it is reasonable that the true size of the
particle will be templated when used in a thermosetting resin.
[0094] Through extensive studies with the particles in polyarylene
thermosetting resins, one thing has experimentally become apparent:
the addition of TRIS 2, a reactive diluent, to the polyarylene
resins (monomer stoichiometries ranging from 1:1 to 0.7:1
acetylene/cyclopentadienone) results in better templating of the
particles than with the pure resins themselves. This approach was
more effective than adding an excess of TRIS A during the b-staging
reactions. Dielectric measurements; film thickness changes on
wafers and refractive index measurements indicated that the
presence of TRIS 2 results in a polyarylene film with better
dielectric properties than samples without the additive. One early
rationalization was that the solubility parameter of TRIS 2 was
such that it does not penetrate the polystyrene (PS) particles. To
test this hypothesis, studies were carried out to investigate the
solubility characteristics of TRIS 2 relative to TRIS A. However,
DSC Measurements showed that both of the reactive diluents TRIS 2
and TRIS A caused a significant Tg depression of the polystyrene
nanoparticles, consistent with the production of a mixed phase, but
this characteristic allows the particles to be compatibilized in
the resin.
[0095] When the solubility parameters for TRIS 2 and TRIS A were
calculated (for example Small's G solubility parameter for TRIS 2
was estimated to be 18.6 J.sup.1/2 cm.sup.3/2 while TRIS A was
calculated as 19.1 J.sup.1/2 cm.sup.3/2) the difference is
relatively small. This would be expected intuitively based on the
similarity of structure. Therefore the question remains, why is
TRIS 2 a more effective additive than TRIS A (vide-infra)? As both
molecules contain the same type and number of reactive functional
groups one can assume that the rate constant for polymerization and
or crosslinking should be similar. The main difference between the
TRIS A and TRIS 2 lies in their molecular weight with TRIS 2 having
a mass 1.8 times that of TRIS A. A general concept which is
described in Van Krevelens `Properties of Polymers` and in the
introduction of his chapter on solubility, "as a general rule, the
solubility decreases as the molecular weight of the solute
increases . . . this property can be used to fractionate polymers
according to molecular mass." From experiment, it was determined
that TRIS monomers (FIG. 7) are absorbed into the nanoparticles and
upon cure, due to the higher molecular weight of the TRIS 2
monomer, the precipitation point of the TRIS 2 polymer from
polystyrene is reached rapidly. It is believed that the
precipitation point from the nanoparticles is reached faster for
TRIS 2 than for TRIS A (i.e., the point, before precipitation where
.DELTA.G=0, and therefore .DELTA.H=T.DELTA.S, where .DELTA.S
reaches its minimum value).
[0096] Typically, 25 percent (dry weight) of TRIS 2 is added to the
various polyarylene formulations, this volume fraction of matrix
moving out from the particle helps create a greater phase purity
within the nanoparticle. It is theorized herein that this is a new
concept, as previous foaming strategies from matrices have focused
on the pore generating material phase separating from the matrix
and creating pore generating rich domains. The strategy of the
present invention focuses on the opposite direction, namely, low
molecular weight matrix monomers leaving the porogen through
molecular weight increase during cure, thus creating a pure
polystyrene nanoparticle template.
[0097] Tan delta measurements from DMA analysis of the particles in
the polyarylene resins (FIG. 8) indicate that the Tg of the
nanoparticle in the resin with the TRIS 2 was closer to that of the
pure porogen alone, suggesting that in a partially cured
polyarylene resin, the TRIS 2 monomer was already precipitating
from the polystyrene nanoparticle. The Tg of the polystyrene
nanoparticle in partially cured Matrix 0.8 without TRIS 2 showed a
higher mixed Tg, suggesting a higher content of the polyarylene
resin in the nanoparticle.
[0098] The incorporation of TRIS 2 into the nanoparticles appeared
to be reflected in some of the SEMs, (see FIGS. 9A-C and 10A-C). In
the Matrix 1:1 pictures without TRIS 2 (FIGS. 9A-C), the
polystyrene nano-particles can be seen more clearly than the series
of pictures with TRIS 2 added (FIGS. 10A-C). The particles appear
as white objects in FIGS. 9A and 10A. Refractive indices (RI) are
given for the samples through out the cycle, and after burnout the
lower RI of the resin in FIG. 10C is an indication of a relatively
more porous material for the sample shown in FIG. 9C. In FIG. 10B,
it is suggested that the TRIS 2 reactive diluent was masking the
particles and was thus more difficult to see by FE-SEM.
[0099] The improved foaming efficiency that TRIS 2 monomer provides
is reflected in the film thickness changes which were measured
(Filmetrics and Alpha Step). The procedure involves first the
curing of resins spun on wafers and then measuring the thickness
after a cure of 300.degree. C. (which corresponds to a hybrid film
before porogen burnout). Subsequent measurements were taken after
the films were cured to 430.degree. C. (at this temperature, the
porogen is thermally degraded and removed from the matrix). FIG. 11
compares thickness changes in three samples, Matrix 1:1, Matrix 1:1
with 10 wt. % and Matrix 1:1 with 25 wt. % TRIS 2 after porogen
burnout. At the porogen loadings of 10 wt. % polystyrene
nanoparticles a small thickness change was observed the resins
(0-5% film thickness change) which corresponds to a high porogen
foaming efficiency. When the porogen loading is high e.g., 40 wt. %
the initial porosity in the matrix is so large that the film
collapses. At moderate porogen loadings (e.g., 30 wt. %), the film
thickness change for the resin containing 25 wt. % TRIS 2 and
porogen was less than that for the pure Matrix 1:1 resin (17% vs.
25% film thickness change).
[0100] The addition of TRIS 2 created a resin rich with phenyl
acetylene functionality: Offsetting the Matrix stoichiometries to
0.9, 0.8, 0.7 of acetylene/cyclopentadienone respectively.
[0101] In the light of the promising results obtained from the
addition of TRIS 2 (i.e., lower refractive indices, reduced
thickness losses), resins were prepared such that during the
b-staging reaction, the molar ratio of TRIS A was greatly increased
relative to that of the bis-cyclopentadienone (BCPD) monomer. This
was due in order to mimic the final stoichiometries produces by the
addition of TRIS 2 to the b-staged Matrix 1:1 formulations.
[0102] DMA results (FIG. 12) showed that Matrix 0.8 resin had a
thermal cure profile that was similar to that of the Matrix 1:1
resin containing 20% of TRIS 2, i.e., in each case the onset of
vitrification occurred at 360.degree. C. with the inflection point
roughly around 360.degree. C. Further, comparing the DMA curves for
Matrix 0.8 and Matrix 0.8 containing 25 wt. % TRIS 2 shows that the
plasticizing effect of TRIS 2 was the most striking feature, with
the latter showing a softening point around 150.degree. C.
[0103] Dielectric measurements and refractive index results on the
resins enriched in TRIS A monomer also reflected the improved
foaming efficiency for the offset stoichiometries, with a steady
decrease in dielectric constant observed as one progresses from
Matrix 1:1 resin to a Matrix 0.8 resin.
[0104] Conclusions: From the studies with the additives (TRIS 2 in
particular), improvements in porogen foaming efficiencies using
polystyrene nanoparticles were achieved. These studies resulted in
dielectric constants as low as 2.0 for samples containing 30 wt. %
polystyrene particles and 25 wt. % TRIS 2 in current polyarylene
formulations. These results confirm the efficacy of additives in
formulations containing polystyrene nanoparticles as porogens
including crosslinked nanoparticles.
EXAMPLE 5
[0105] This example demonstrates the additives ability to increase
the crosslinking density in the matrix allowing the matrix to
resist pore collapse upon thermal decomposition. Specifically,
FIGS. 13A-13B show the modification of a polyarylene polymer
stoichiometry together with TRIS 2 addition, FIG. 13A represents
Matrix 1:1 with 30% (9 nm) polystyrene, without additive; and FIG.
13B represents Matrix 1: with 30% (9 nm) polystyrene and additive.
Matrix 1:1 30% PS nanoparticles has a refractive index of 1.58 and
a dielectric constant of 2.41 when heated to 430.degree. C.,
whereas Matrix 1:1 plus 25% TRIS 2 additive and 30% polystyrene
nanoparticles has a refractive index of 1.46 and a dielectric
constant of 2.15. Offset stoichiometry together with the addition
of TRIS 2 additive further improves foaming efficiency and by
FE-SEM produces smaller holes, unexpectedly. Offsetting the
stoichiometry towards acetylene rich functional polyarylene resins
coupled with the addition of TRIS 2 appears to have a pronounced
affect on the morphology.
[0106] Shown in FIGS. 14A-D14D are FE-SEM's of porous polyarylenes
generated with various stoichiometries ranging from 1:1 to 1:0.7
all having 25% TRIS 2 and 30% wt. polystyrene (PS) nanoparticles.
Specifically, FIG. 14A is the FE-SEM of Matrix 1:1; FIG. 14B is the
FE-SEM for Matrix 0.9; FIG. 14C is the FE-SEM for Matrix 0.8; and
FIG. 14D is the FE-SEM for Matrix 0.7. From these micrographs, it
is clear that smaller pores are obtained as the acetylene content
is increased. The refractive indices (RIs) and dielectric constant
(k) are essentially the same. Specifically, for the polyarylene
composition shown in FIG. 14A, the RI is 1.46 and k is 2.15; for
the polyarylene composition shown in FIG. 14B, the RI is 1.49; for
the polyarylene composition shown in FIG. 14C, the RI is 1.46 and
the k is 2.13; and for the polyarylene composition shown in FIG.
14D, the RI is 1.49.
[0107] In summary, this example demonstrates that higher crosslink
density has a pronounced affect on the morphology and foaming
efficiency. Increasing the crosslink density to the same extent by
either stoichiometry offset or through addition of TRIS 2 is
dramatically different, where TRIS 2 addition leads to smaller
pores.
[0108] While the present invention has been particularly shown and
described with respect to preferred embodiments thereof, it will be
understood by those skilled in the art that the foregoing and other
changes in forms and details made be made without departing from
the spirit and scope of the present invention. It is therefore
intended that the present invention not be limited to the exact
forms and details described and illustrated, but fall within the
scope of the appended claims.
* * * * *