Volksen; Willi

Patent Applications and Registrations

Patent applications and USPTO patent grants for Volksen; Willi.The latest application filed is for "implementing the post-porosity plasma protection (p4) process using i-cvd".

Company Profile

7.80.65

Volksen; Willi - Alpine UT
Volksen; Willi - San Jose CA
Volksen; Willi - Armonk NY
Volksen; Willi - Pasadena CA

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Implementing the post-porosity plasma protection (P4) process using I-CVD Grant 11,371,143 - Lionti , et al. June 28, 2	2022-06-28
Surface modification by polymer anchoring on porous substrates Grant 11,174,412 - Dubois , et al. November 16, 2	2021-11-16
Enhanced adhesive materials and processes for 3D applications Grant 11,168,234 - Hedrick , et al. November 9, 2	2021-11-09
Implementing The Post-porosity Plasma Protection (p4) Process Using I-cvd App 20200378001 - Lionti; Krystelle ; et al.	2020-12-03
Enhanced adhesive materials and processes for 3D applications Grant 10,767,084 - Hedrick , et al. Sep	2020-09-08
Enhanced Adhesive Materials And Processes For 3d Applications App 20200165494 - Hedrick; James L. ; et al.	2020-05-28
Selectively Functionalized Porous Material App 20200030784 - Dubois; Geraud J. ; et al.	2020-01-30
Enhanced Adhesive Materials And Processes For 3d Applications App 20190378781 - Hedrick; James L. ; et al.	2019-12-12
Selectively functionalized porous material Grant 10,471,418 - Dubois , et al. Nov	2019-11-12
Surface Modification By Polymer Anchoring On Porous Substrates App 20190322891 - Dubois; Geraud J.M. ; et al.	2019-10-24
Surface modification by polymer anchoring on porous substrates Grant 10,370,556 - Dubois , et al.	2019-08-06
Enhanced via fill material and processing for dual damscene integration Grant 10,340,182 - Doyle , et al.	2019-07-02
Nitrogen Heterocycle-containing Monolayers On Metal Oxides For Binding Biopolymers App 20190137879 - Han; Shu-Jen ; et al.	2019-05-09
Articles including ultra low dielectric layers Grant 10,217,661 - Bruce , et al. Feb	2019-02-26
Enhanced Adhesive Materials And Processes For 3d Applications App 20180340100 - Hedrick; James L. ; et al.	2018-11-29
Surface Modification By Polymer Anchoring On Porous Substrates App 20180163076 - Dubois; Geraud J.M. ; et al.	2018-06-14
Enhanced adhesive materials and processes for 3D applications Grant 9,994,741 - Hedrick , et al. June 12, 2	2018-06-12
Articles Including Ultra Low Dielectric Layers App 20170365511 - Bruce; Robert L. ; et al.	2017-12-21
Method of manufacturing an ultra low dielectric layer Grant 9,773,698 - Bruce , et al. September 26, 2	2017-09-26
Determination of young'S modulus of porous thin films using ultra-low load nano-indentation Grant 9,766,170 - Dubois , et al. September 19, 2	2017-09-19
Enhanced Adhesive Materials And Processes For 3d Applications App 20170166784 - Hedrick; James L. ; et al.	2017-06-15
Enhanced Via Fill Material And Processing For Dual Damscene Integration App 20170154812 - DOYLE; James P. ; et al.	2017-06-01
Selectively Functionalized Porous Material App 20170106362 - Dubois; Geraud J. ; et al.	2017-04-20
Ultra Low Dielectric Layer App 20170092534 - Bruce; Robert L. ; et al.	2017-03-30
Self-forming metal barriers Grant 9,564,356 - Deline , et al. February 7, 2	2017-02-07
Dielectric filling materials with ionic compounds Grant 9,514,929 - Dubois , et al. December 6, 2	2016-12-06
Self-forming Metal Barriers App 20160307794 - Deline; Vaughn R. ; et al.	2016-10-20
Dielectric Filling Materials With Ionic Compounds App 20160293407 - Dubois; Geraud J. ; et al.	2016-10-06
Surface plasma modification of porous thin-films to optimize pore filling Grant 9,214,335 - Bruce , et al. December 15, 2	2015-12-15
Surface Plasma Modification Of Porous Thin-films To Optimize Pore Filling App 20150311066 - Bruce; Robert L. ; et al.	2015-10-29
In-situ hardmask generation Grant 9,058,983 - Dubois , et al. June 16, 2	2015-06-16
Structure including a material having a predefined morphology Grant 8,986,824 - Cha , et al. March 24, 2	2015-03-24
Overburden removal for pore fill integration approach Grant 8,927,430 - Bruce , et al. January 6, 2	2015-01-06
In-situ Hardmask Generation App 20140367356 - Dubois; Geraud Jean-Michel ; et al.	2014-12-18
Reduction of pore fill material dewetting Grant 8,871,632 - Dubois , et al. October 28, 2	2014-10-28
Homogeneous modification of porous films Grant 8,828,489 - Dubois , et al. September 9, 2	2014-09-09
Method of forming a material having a predefined morphology Grant 8,784,966 - Cha , et al. July 22, 2	2014-07-22
Homogeneous porous low dielectric constant materials Grant 8,623,741 - Purushothaman , et al. January 7, 2	2014-01-07
Structure Including A Material Having A Predefined Morphology App 20130309466 - Cha; Jennifer N. ; et al.	2013-11-21
Reduction of pore fill material dewetting Grant 8,541,301 - Dubois , et al. September 24, 2	2013-09-24
Homogeneous porous low dielectric constant materials Grant 8,492,239 - Bruce , et al. July 23, 2	2013-07-23
Materials having predefined morphologies and methods of formation thereof Grant 8,481,164 - Cha , et al. July 9, 2	2013-07-09
Methods to mitigate plasma damage in organosilicate dielectrics Grant 8,481,423 - Arnold , et al. July 9, 2	2013-07-09
Methods to mitigate plasma damage in organosilicate dielectrics Grant 8,470,706 - Arnold , et al. June 25, 2	2013-06-25
Nanoporous media templated from unsymmetrical amphiphilic porogens Grant 8,436,062 - Cha , et al. May 7, 2	2013-05-07
Protection of intermetal dielectric layers in multilevel wiring structures App 20130056874 - Darnon; Maxime ; et al.	2013-03-07
Nanoporous media with lamellar structures Grant 8,389,589 - Cha , et al. March 5, 2	2013-03-05
Reduction Of Pore Fill Material Dewetting App 20130045608 - Dubois; Geraud Jean-Michel ; et al.	2013-02-21
Homogeneous Modification Of Porous Films App 20130045337 - DUBOIS; GERAUD JEAN-MICHEL ; et al.	2013-02-21
Overburden Removal For Pore Fill Integration Approach App 20130017682 - Bruce; Robert L. ; et al.	2013-01-17
Reduction Of Pore Fill Material Dewetting App 20130017688 - Dubois; Geraud Jean-Michel ; et al.	2013-01-17
Methods To Mitigate Plasma Damage In Organosilicate Dielectrics App 20120329269 - Arnold; John C. ; et al.	2012-12-27
Homogeneous Porous Low Dielectric Constant Materials App 20120329273 - Bruce; Robert L. ; et al.	2012-12-27
Homogeneous porous low dielectric constant materials Grant 8,314,005 - Purushothaman , et al. November 20, 2	2012-11-20
Homogeneous Porous Low Dielectric Constant Materials App 20120282784 - Purushothaman; Sampath ; et al.	2012-11-08
Nanoporous media templated from unsymmetrical amphiphilic porogens Grant 8,268,903 - Dubois , et al. September 18, 2	2012-09-18
Nanoporous Media Templated from Unsymmetrical Amphiphilic Porogens App 20110245433 - Cha; Jennifer Nam ; et al.	2011-10-06
Nanoporous Media Templated from Unsymmetrical Amphiphilic Porogens App 20110245418 - Dubois; Geraud Jean-Michel ; et al.	2011-10-06
Homogeneous Porous Low Dielectric Constant Materials App 20110183525 - Purushothaman; Sampath ; et al.	2011-07-28
Nanoporous media templated from unsymmetrical amphiphilic porogens Grant 7,960,442 - Cha , et al. June 14, 2	2011-06-14
Low-K interlevel dielectric materials and method of forming low-K interlevel dielectric layers and structures Grant 7,931,829 - Dubois , et al. April 26, 2	2011-04-26
Precursors for porous low-dielectric constant materials for use in electronic devices Grant 7,892,635 - Hawker , et al. February 22, 2	2011-02-22
Low-k Interlevel Dielectric Materials And Method Of Forming Low-k Interlevel Dielectric Layers And Structures App 20100311895 - Dubois; Geraud Jean-Michel ; et al.	2010-12-09
Low-K interlevel dielectric materials and method of forming low-K interlevel dielectric layers and structures Grant 7,820,242 - Dubois , et al. October 26, 2	2010-10-26
Nanoporous Media with Lamellar Structures App 20100055307 - Cha; Jennifer Nam ; et al.	2010-03-04
Methods To Mitigate Plasma Damage In Organosilicate Dielectrics App 20090075472 - Arnold; John C. ; et al.	2009-03-19
Nanoporous media with lamellar structures Grant 7,482,389 - Cha , et al. January 27, 2	2009-01-27
Method of forming low-K interlevel dielectric layers and structures Grant 7,459,183 - Dubois , et al. December 2, 2	2008-12-02
Materials Having Predefined Morphologies And Methods Of Formation Thereof App 20080213556 - Cha; Jennifer Nam ; et al.	2008-09-04
Precursors for Porous Low-Dielectric Constant Materials for Use in Electronic Devices App 20080188578 - Hawker; Craig Jon ; et al.	2008-08-07
Low-k Interlevel Dielectric Materials And Method Of Forming Low-k Interlevel Dielectric Layers And Structures App 20080171136 - Dubois; Geraud Jean-Michel ; et al.	2008-07-17
Porous Composition Of Matter, And Method Of Making Same App 20080142930 - Connor; Eric ; et al.	2008-06-19
Materials Having Predefined Morphologies And Methods Of Formation Thereof App 20080113169 - Cha; Jennifer Nam ; et al.	2008-05-15
Porous composition of matter, and method of making same Grant 7,368,483 - Connor , et al. May 6, 2	2008-05-06
Materials having predefined morphologies and methods of formation thereof Grant 7,341,788 - Cha , et al. March 11, 2	2008-03-11
Stable encapsulant fluid capable of undergoing reversible Diels-Alder polymerization Grant 7,309,754 - Brock , et al. December 18, 2	2007-12-18
Porous organosilicates with improved mechanical properties Grant 7,229,934 - Dubois , et al. June 12, 2	2007-06-12
Sliders bonded by a debondable encapsulant containing styrene and butadiene polymers Grant 7,209,324 - Brock , et al. April 24, 2	2007-04-24
Sliders bonded by a debondable encapsulant comprising different polymers formed via in situ polymerization Grant 7,196,872 - Chaw , et al. March 27, 2	2007-03-27
Low-K interlevel dielectric materials and method of forming low-K interlevel dielectric layers and structures App 20070023870 - Dubois; Geraud Jean-Michel ; et al.	2007-02-01
Nanoporous media with lamellar structures App 20060240240 - Cha; Jennifer Nam ; et al.	2006-10-26
Nanoporous media templated from unsymmetrical amphiphilic porogens App 20060241194 - Cha; Jennifer Nam ; et al.	2006-10-26
Slider processing system utilizing polyvinyl alcohol release layer Grant 7,125,467 - Brock , et al. October 24, 2	2006-10-24
Materials having predefined morphologies and methods of formation thereof App 20060205875 - Cha; Jennifer Num ; et al.	2006-09-14
Nitrogen-containing polymers as porogens in the preparation of highly porous, low dielectric constant materials Grant 7,087,982 - Huang , et al. August 8, 2	2006-08-08
Sliders bonded by a debondable nonstoichiometric encapsulant Grant 7,077,970 - Buchan , et al. July 18, 2	2006-07-18
Sliders bonded by a debondable encapsulant containing styrene and acrylate polymers Grant 7,064,929 - McKean , et al. June 20, 2	2006-06-20
Direct photo-patterning of nanoporous organosilicates, and method of use Grant 7,056,840 - Miller , et al. June 6, 2	2006-06-06
Porous organosilicates with improved mechanical properties App 20060084282 - Dubois; Geraud ; et al.	2006-04-20
Sliders bonded by a debondable encapsulant comprising different polymers formed via in situ polymerization App 20050243469 - Chaw, Michael W. ; et al.	2005-11-03
Process for planarizing patterned metal structures for magnetic thin film heads Grant 6,934,121 - Miller , et al. August 23, 2	2005-08-23
Stable encapsulant fluid capable of undergoing reversible diels-alder polymerization App 20050067373 - Brock, Phillip Joe ; et al.	2005-03-31
Sliders bonded by a debondable nonstoichiometric encapsulant App 20050068680 - Buchan, Nicholas I. ; et al.	2005-03-31
Direct photo-patterning of nanoporous organosilicates, and method of use App 20050070124 - Miller, Robert Dennis ; et al.	2005-03-31
Sliders bonded by a debondable encapsulant containing styrene and acrylate polymers App 20040265545 - McKean, Dennis R. ; et al.	2004-12-30
Sliders bonded by a debondable encapsulant containing styrene and butadiene polymers App 20040264050 - Brock, Phillip J. ; et al.	2004-12-30
Slider processing system utilizing polyvinyl alcohol release layer App 20040266186 - Brock, Phillip Joe ; et al.	2004-12-30
Sliders bonded by a debondable silicon-based encapsulant App 20040265531 - McKean, Dennis R. ; et al.	2004-12-30
Defect-free dielectric coatings and preparation thereof using polymeric nitrogenous porogens Grant 6,812,551 - Hawker , et al. November 2, 2	2004-11-02
Porous composition of matter, and method of making same App 20040198850 - Connor, Eric ; et al.	2004-10-07
Process for planarizing patterned metal structures for magnetic thin film heads App 20040070877 - Miller, Robert Dennis ; et al.	2004-04-15
Defect-free dielectric coatings and preparation thereof using polymeric nitrogenous porogens Grant 6,685,983 - Hawker , et al. February 3, 2	2004-02-03
Porous low-dielectric constant materials for use in electronic devices App 20040012076 - Hawker, Craig Jon ; et al.	2004-01-22
Nitrogen-containing polymers as porogens in the preparation of highly porous, low dielectric constant materials Grant 6,670,285 - Hawker , et al. December 30, 2	2003-12-30
Process for planarizing patterned metal structures for magnetic thin film heads Grant 6,660,640 - Miller , et al. December 9, 2	2003-12-09
Defect-free dielectric coatings and preparation thereof using polymeric nitrogenous porogens App 20030152706 - Hawker, Craig Jon ; et al.	2003-08-14
Nitrogen-containing polymers as porogens in the preparation of highly porous, low dielectric constant materials App 20030146451 - Huang, Elbert Emin ; et al.	2003-08-07
Porous dielectric material and electronic devices fabricated therewith Grant 6,541,865 - Hawker , et al. April 1, 2	2003-04-01
Nitrogen-containing polymers as porogens in the preparation of highly porous, low dielectric constant materials App 20020130396 - Hawker, Craig Jon ; et al.	2002-09-19
Defect-free dielectric coatings and preparation thereof using polymeric nitrogenous porogens App 20020131246 - Hawker, Craig Jon ; et al.	2002-09-19
Electronic devices with dielectric compositions and method for their manufacture Grant 6,342,454 - Hawker , et al. January 29, 2	2002-01-29
Porous dielectric material and electronic devices fabricated therewith App 20010040294 - Hawker, Craig Jon ; et al.	2001-11-15
Process for manufacture of integrated circuit device Grant 6,177,360 - Carter , et al. January 23, 2	2001-01-23
Process for manufacture of integrated circuit device using organosilicate insulative matrices Grant 6,143,643 - Carter , et al. November 7, 2	2000-11-07
Dielectric compositions and method for their manufacture Grant 6,107,357 - Hawker , et al. August 22, 2	2000-08-22
Process for manufacture of integrated circuit device using a matrix comprising porous high temperature thermosets Grant 6,093,636 - Carter , et al. July 25, 2	2000-07-25
Process for manufacture of integrated circuit device Grant 5,953,627 - Carter , et al. September 14, 1	1999-09-14
Process for forming a circuit assembly Grant 5,633,034 - Carter , et al. May 27, 1	1997-05-27
Process for forming negative tone images of polyimides using base treatment of crosslinked polyamic ester Grant 5,310,625 - Angelopoulos , et al. May 10, 1	1994-05-10
Circuit assembly with polyimide insulator Grant 5,302,851 - Ree , et al. April 12, 1	1994-04-12
Photosensitive polyamic alkyl ester composition and process for its use Grant 5,206,117 - Labadie , et al. April 27, 1	1993-04-27
Process for coating a substrate with polyimide Grant 4,467,000 - Economy , et al. August 21, 1	1984-08-21
Impregnated metal-polymeric functional beads Grant 4,197,220 - Rembaum , et al. April 8, 1	1980-04-08
Polyvinyl pyridine microspheres Grant 4,170,685 - Rembaum , et al. October 9, 1	1979-10-09
Impregnated metal-polymeric functional beads Grant 4,123,396 - Rembaum , et al. October 31, 1	1978-10-31

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