Patent | Date |
---|
Surface modification by polymer anchoring on porous substrates Grant 11,174,412 - Dubois , et al. November 16, 2 | 2021-11-16 |
Interconnect structure including airgaps and substractively etched metal lines Grant 10,727,114 - Bruce , et al. | 2020-07-28 |
Surface Modification By Polymer Anchoring On Porous Substrates App 20190322891 - Dubois; Geraud J.M. ;   et al. | 2019-10-24 |
Surface modification by polymer anchoring on porous substrates Grant 10,370,556 - Dubois , et al. | 2019-08-06 |
Enhanced via fill material and processing for dual damscene integration Grant 10,340,182 - Doyle , et al. | 2019-07-02 |
Articles including ultra low dielectric layers Grant 10,217,661 - Bruce , et al. Feb | 2019-02-26 |
Interconnect Structure Including Airgaps And Substractively Etched Metal Lines App 20180204759 - BRUCE; ROBERT L. ;   et al. | 2018-07-19 |
Surface Modification By Polymer Anchoring On Porous Substrates App 20180163076 - Dubois; Geraud J.M. ;   et al. | 2018-06-14 |
Thin film self assembly of topcoat-free silicon-containing diblock copolymers Grant 9,982,097 - Arellano , et al. May 29, 2 | 2018-05-29 |
Enhanced Via Fill Material And Processing For Dual Damascene Integration App 20180138084 - Doyle; James P. ;   et al. | 2018-05-17 |
Block copolymers for directed self-assembly applications Grant 9,879,152 - Arellano , et al. January 30, 2 | 2018-01-30 |
Articles Including Ultra Low Dielectric Layers App 20170365511 - Bruce; Robert L. ;   et al. | 2017-12-21 |
High-chi Block Copolymers For Interconnect Structures By Directed Self-assembly App 20170294341 - Liu; Chi-Chun ;   et al. | 2017-10-12 |
Method of manufacturing an ultra low dielectric layer Grant 9,773,698 - Bruce , et al. September 26, 2 | 2017-09-26 |
High-chi block copolymers for interconnect structures by directed self-assembly Grant 9,768,059 - Liu , et al. September 19, 2 | 2017-09-19 |
Thin Film Self Assembly Of Topcoat-free Silicon-containing Diblock Copolymers App 20170233532 - Arellano; Noel ;   et al. | 2017-08-17 |
Enhanced Via Fill Material And Processing For Dual Damscene Integration App 20170154812 - DOYLE; James P. ;   et al. | 2017-06-01 |
Block Copolymers For Directed Self-assembly Applications App 20170114246 - Arellano; Noel ;   et al. | 2017-04-27 |
Ultra Low Dielectric Layer App 20170092534 - Bruce; Robert L. ;   et al. | 2017-03-30 |
Surface plasma modification of porous thin-films to optimize pore filling Grant 9,214,335 - Bruce , et al. December 15, 2 | 2015-12-15 |
Surface Plasma Modification Of Porous Thin-films To Optimize Pore Filling App 20150311066 - Bruce; Robert L. ;   et al. | 2015-10-29 |
In-situ hardmask generation Grant 9,058,983 - Dubois , et al. June 16, 2 | 2015-06-16 |
In-situ Hardmask Generation App 20140367356 - Dubois; Geraud Jean-Michel ;   et al. | 2014-12-18 |
Reduction of pore fill material dewetting Grant 8,871,632 - Dubois , et al. October 28, 2 | 2014-10-28 |
Homogeneous porous low dielectric constant materials Grant 8,623,741 - Purushothaman , et al. January 7, 2 | 2014-01-07 |
Reduction of pore fill material dewetting Grant 8,541,301 - Dubois , et al. September 24, 2 | 2013-09-24 |
Homogeneous porous low dielectric constant materials Grant 8,492,239 - Bruce , et al. July 23, 2 | 2013-07-23 |
Protection of intermetal dielectric layers in multilevel wiring structures App 20130056874 - Darnon; Maxime ;   et al. | 2013-03-07 |
Reduction Of Pore Fill Material Dewetting App 20130045608 - Dubois; Geraud Jean-Michel ;   et al. | 2013-02-21 |
Reduction Of Pore Fill Material Dewetting App 20130017688 - Dubois; Geraud Jean-Michel ;   et al. | 2013-01-17 |
Homogeneous Porous Low Dielectric Constant Materials App 20120329273 - Bruce; Robert L. ;   et al. | 2012-12-27 |
Homogeneous porous low dielectric constant materials Grant 8,314,005 - Purushothaman , et al. November 20, 2 | 2012-11-20 |
Homogeneous Porous Low Dielectric Constant Materials App 20120282784 - Purushothaman; Sampath ;   et al. | 2012-11-08 |
Homogeneous Porous Low Dielectric Constant Materials App 20110183525 - Purushothaman; Sampath ;   et al. | 2011-07-28 |
Porous Composition Of Matter, And Method Of Making Same App 20080142930 - Connor; Eric ;   et al. | 2008-06-19 |
Porous composition of matter, and method of making same Grant 7,368,483 - Connor , et al. May 6, 2 | 2008-05-06 |
Stable encapsulant fluid capable of undergoing reversible Diels-Alder polymerization Grant 7,309,754 - Brock , et al. December 18, 2 | 2007-12-18 |
Sliders bonded by a debondable encapsulant containing styrene and butadiene polymers Grant 7,209,324 - Brock , et al. April 24, 2 | 2007-04-24 |
Sliders bonded by a debondable encapsulant comprising different polymers formed via in situ polymerization Grant 7,196,872 - Chaw , et al. March 27, 2 | 2007-03-27 |
Slider processing system utilizing polyvinyl alcohol release layer Grant 7,125,467 - Brock , et al. October 24, 2 | 2006-10-24 |
Sliders bonded by a debondable nonstoichiometric encapsulant Grant 7,077,970 - Buchan , et al. July 18, 2 | 2006-07-18 |
Sliders bonded by a debondable encapsulant containing styrene and acrylate polymers Grant 7,064,929 - McKean , et al. June 20, 2 | 2006-06-20 |
Porous organosilicates with improved mechanical properties App 20060084282 - Dubois; Geraud ;   et al. | 2006-04-20 |
Sliders bonded by a debondable encapsulant comprising different polymers formed via in situ polymerization App 20050243469 - Chaw, Michael W. ;   et al. | 2005-11-03 |
Stable encapsulant fluid capable of undergoing reversible diels-alder polymerization App 20050067373 - Brock, Phillip Joe ;   et al. | 2005-03-31 |
Sliders bonded by a debondable nonstoichiometric encapsulant App 20050068680 - Buchan, Nicholas I. ;   et al. | 2005-03-31 |
Sliders bonded by a debondable encapsulant containing styrene and butadiene polymers App 20040264050 - Brock, Phillip J. ;   et al. | 2004-12-30 |
Sliders bonded by a debondable silicon-based encapsulant App 20040265531 - McKean, Dennis R. ;   et al. | 2004-12-30 |
Slider processing system utilizing polyvinyl alcohol release layer App 20040266186 - Brock, Phillip Joe ;   et al. | 2004-12-30 |
Sliders bonded by a debondable encapsulant containing styrene and acrylate polymers App 20040265545 - McKean, Dennis R. ;   et al. | 2004-12-30 |
Porous composition of matter, and method of making same App 20040198850 - Connor, Eric ;   et al. | 2004-10-07 |