loadpatents
name:-0.078078985214233
name:-0.027997970581055
name:-0.016726970672607
Magbitang; Teddie P. Patent Filings

Magbitang; Teddie P.

Patent Applications and Registrations

Patent applications and USPTO patent grants for Magbitang; Teddie P..The latest application filed is for "surface modification by polymer anchoring on porous substrates".

Company Profile
6.26.30
  • Magbitang; Teddie P. - San Jose CA
  • Magbitang; Teddie P. - Armonk NY
  • Magbitang; Teddie P. - Sunnyvale CA
*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.
Patent Activity
PatentDate
Surface modification by polymer anchoring on porous substrates
Grant 11,174,412 - Dubois , et al. November 16, 2
2021-11-16
Interconnect structure including airgaps and substractively etched metal lines
Grant 10,727,114 - Bruce , et al.
2020-07-28
Surface Modification By Polymer Anchoring On Porous Substrates
App 20190322891 - Dubois; Geraud J.M. ;   et al.
2019-10-24
Surface modification by polymer anchoring on porous substrates
Grant 10,370,556 - Dubois , et al.
2019-08-06
Enhanced via fill material and processing for dual damscene integration
Grant 10,340,182 - Doyle , et al.
2019-07-02
Articles including ultra low dielectric layers
Grant 10,217,661 - Bruce , et al. Feb
2019-02-26
Interconnect Structure Including Airgaps And Substractively Etched Metal Lines
App 20180204759 - BRUCE; ROBERT L. ;   et al.
2018-07-19
Surface Modification By Polymer Anchoring On Porous Substrates
App 20180163076 - Dubois; Geraud J.M. ;   et al.
2018-06-14
Thin film self assembly of topcoat-free silicon-containing diblock copolymers
Grant 9,982,097 - Arellano , et al. May 29, 2
2018-05-29
Enhanced Via Fill Material And Processing For Dual Damascene Integration
App 20180138084 - Doyle; James P. ;   et al.
2018-05-17
Block copolymers for directed self-assembly applications
Grant 9,879,152 - Arellano , et al. January 30, 2
2018-01-30
Articles Including Ultra Low Dielectric Layers
App 20170365511 - Bruce; Robert L. ;   et al.
2017-12-21
High-chi Block Copolymers For Interconnect Structures By Directed Self-assembly
App 20170294341 - Liu; Chi-Chun ;   et al.
2017-10-12
Method of manufacturing an ultra low dielectric layer
Grant 9,773,698 - Bruce , et al. September 26, 2
2017-09-26
High-chi block copolymers for interconnect structures by directed self-assembly
Grant 9,768,059 - Liu , et al. September 19, 2
2017-09-19
Thin Film Self Assembly Of Topcoat-free Silicon-containing Diblock Copolymers
App 20170233532 - Arellano; Noel ;   et al.
2017-08-17
Enhanced Via Fill Material And Processing For Dual Damscene Integration
App 20170154812 - DOYLE; James P. ;   et al.
2017-06-01
Block Copolymers For Directed Self-assembly Applications
App 20170114246 - Arellano; Noel ;   et al.
2017-04-27
Ultra Low Dielectric Layer
App 20170092534 - Bruce; Robert L. ;   et al.
2017-03-30
Surface plasma modification of porous thin-films to optimize pore filling
Grant 9,214,335 - Bruce , et al. December 15, 2
2015-12-15
Surface Plasma Modification Of Porous Thin-films To Optimize Pore Filling
App 20150311066 - Bruce; Robert L. ;   et al.
2015-10-29
In-situ hardmask generation
Grant 9,058,983 - Dubois , et al. June 16, 2
2015-06-16
In-situ Hardmask Generation
App 20140367356 - Dubois; Geraud Jean-Michel ;   et al.
2014-12-18
Reduction of pore fill material dewetting
Grant 8,871,632 - Dubois , et al. October 28, 2
2014-10-28
Homogeneous porous low dielectric constant materials
Grant 8,623,741 - Purushothaman , et al. January 7, 2
2014-01-07
Reduction of pore fill material dewetting
Grant 8,541,301 - Dubois , et al. September 24, 2
2013-09-24
Homogeneous porous low dielectric constant materials
Grant 8,492,239 - Bruce , et al. July 23, 2
2013-07-23
Protection of intermetal dielectric layers in multilevel wiring structures
App 20130056874 - Darnon; Maxime ;   et al.
2013-03-07
Reduction Of Pore Fill Material Dewetting
App 20130045608 - Dubois; Geraud Jean-Michel ;   et al.
2013-02-21
Reduction Of Pore Fill Material Dewetting
App 20130017688 - Dubois; Geraud Jean-Michel ;   et al.
2013-01-17
Homogeneous Porous Low Dielectric Constant Materials
App 20120329273 - Bruce; Robert L. ;   et al.
2012-12-27
Homogeneous porous low dielectric constant materials
Grant 8,314,005 - Purushothaman , et al. November 20, 2
2012-11-20
Homogeneous Porous Low Dielectric Constant Materials
App 20120282784 - Purushothaman; Sampath ;   et al.
2012-11-08
Homogeneous Porous Low Dielectric Constant Materials
App 20110183525 - Purushothaman; Sampath ;   et al.
2011-07-28
Porous Composition Of Matter, And Method Of Making Same
App 20080142930 - Connor; Eric ;   et al.
2008-06-19
Porous composition of matter, and method of making same
Grant 7,368,483 - Connor , et al. May 6, 2
2008-05-06
Stable encapsulant fluid capable of undergoing reversible Diels-Alder polymerization
Grant 7,309,754 - Brock , et al. December 18, 2
2007-12-18
Sliders bonded by a debondable encapsulant containing styrene and butadiene polymers
Grant 7,209,324 - Brock , et al. April 24, 2
2007-04-24
Sliders bonded by a debondable encapsulant comprising different polymers formed via in situ polymerization
Grant 7,196,872 - Chaw , et al. March 27, 2
2007-03-27
Slider processing system utilizing polyvinyl alcohol release layer
Grant 7,125,467 - Brock , et al. October 24, 2
2006-10-24
Sliders bonded by a debondable nonstoichiometric encapsulant
Grant 7,077,970 - Buchan , et al. July 18, 2
2006-07-18
Sliders bonded by a debondable encapsulant containing styrene and acrylate polymers
Grant 7,064,929 - McKean , et al. June 20, 2
2006-06-20
Porous organosilicates with improved mechanical properties
App 20060084282 - Dubois; Geraud ;   et al.
2006-04-20
Sliders bonded by a debondable encapsulant comprising different polymers formed via in situ polymerization
App 20050243469 - Chaw, Michael W. ;   et al.
2005-11-03
Stable encapsulant fluid capable of undergoing reversible diels-alder polymerization
App 20050067373 - Brock, Phillip Joe ;   et al.
2005-03-31
Sliders bonded by a debondable nonstoichiometric encapsulant
App 20050068680 - Buchan, Nicholas I. ;   et al.
2005-03-31
Sliders bonded by a debondable encapsulant containing styrene and butadiene polymers
App 20040264050 - Brock, Phillip J. ;   et al.
2004-12-30
Sliders bonded by a debondable silicon-based encapsulant
App 20040265531 - McKean, Dennis R. ;   et al.
2004-12-30
Slider processing system utilizing polyvinyl alcohol release layer
App 20040266186 - Brock, Phillip Joe ;   et al.
2004-12-30
Sliders bonded by a debondable encapsulant containing styrene and acrylate polymers
App 20040265545 - McKean, Dennis R. ;   et al.
2004-12-30
Porous composition of matter, and method of making same
App 20040198850 - Connor, Eric ;   et al.
2004-10-07

uspto.report is an independent third-party trademark research tool that is not affiliated, endorsed, or sponsored by the United States Patent and Trademark Office (USPTO) or any other governmental organization. The information provided by uspto.report is based on publicly available data at the time of writing and is intended for informational purposes only.

While we strive to provide accurate and up-to-date information, we do not guarantee the accuracy, completeness, reliability, or suitability of the information displayed on this site. The use of this site is at your own risk. Any reliance you place on such information is therefore strictly at your own risk.

All official trademark data, including owner information, should be verified by visiting the official USPTO website at www.uspto.gov. This site is not intended to replace professional legal advice and should not be used as a substitute for consulting with a legal professional who is knowledgeable about trademark law.

© 2024 USPTO.report | Privacy Policy | Resources | RSS Feed of Trademarks | Trademark Filings Twitter Feed