U.S. patent application number 11/900959 was filed with the patent office on 2008-01-17 for etchant and replenishment solution therefor, and etching method and method for producing wiring board using the same.
This patent application is currently assigned to MEC COMPANY, LTD.. Invention is credited to Daisaku Akiyama, Masayo Kuriyama, Ryo Ogushi, Kaoru Urushibata.
Application Number | 20080011981 11/900959 |
Document ID | / |
Family ID | 34567178 |
Filed Date | 2008-01-17 |
United States Patent
Application |
20080011981 |
Kind Code |
A1 |
Kuriyama; Masayo ; et
al. |
January 17, 2008 |
Etchant and replenishment solution therefor, and etching method and
method for producing wiring board using the same
Abstract
An etchant of the present invention includes an aqueous solution
containing hydrochloric acid, nitric acid, and a cupric ion source.
An etching method of the present invention includes bringing the
etchant into contact with at least one metal selected from nickel,
chromium, nickel-chromium alloys, and palladium. Another etching
method of the present invention includes bringing a first etchant
that includes an aqueous solution containing at least the following
components A to C (A. hydrochloric acid; B. at least one compound
selected from the following (a) to (c): (a) compounds with 7 or
less carbon atoms, containing a sulfur atom(s) and at least one
group selected from an amino group, an imino group, a carboxyl
group, a carbonyl group, and a hydroxyl group; (b) thiazole; and
(c) thiazole compounds; and C. a surfactant) into contact with a
surface of the metal, and then bringing a second solution that
includes an aqueous solution containing hydrochloric acid, nitric
acid, and a cupric ion source into contact with the surface of the
metal. According to the etchant and the etching methods of the
present invention, it is possible to etch at least one metal
selected from nickel, chromium, nickel-chromium alloys, and
palladium quickly and suppress excessive dissolution of copper.
Inventors: |
Kuriyama; Masayo;
(Amagasaki-shi, JP) ; Ogushi; Ryo; (Amagasaki-shi,
JP) ; Akiyama; Daisaku; (Amagasaki-shi, JP) ;
Urushibata; Kaoru; (Amagasaki-shi, JP) |
Correspondence
Address: |
HAMRE, SCHUMANN, MUELLER & LARSON, P.C.
P.O. BOX 2902
MINNEAPOLIS
MN
55402-0902
US
|
Assignee: |
MEC COMPANY, LTD.
AMAGASAKI-SHI
JP
|
Family ID: |
34567178 |
Appl. No.: |
11/900959 |
Filed: |
September 14, 2007 |
Related U.S. Patent Documents
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Application
Number |
Filing Date |
Patent Number |
|
|
10979267 |
Nov 2, 2004 |
7285229 |
|
|
11900959 |
Sep 14, 2007 |
|
|
|
Current U.S.
Class: |
252/79.4 ;
252/79.2 |
Current CPC
Class: |
C23F 1/30 20130101; H05K
2201/0761 20130101; H05K 3/181 20130101; H05K 2203/0789 20130101;
H05K 2203/124 20130101; C23F 1/28 20130101; H05K 3/26 20130101 |
Class at
Publication: |
252/079.4 ;
252/079.2 |
International
Class: |
C09K 13/04 20060101
C09K013/04; C09K 13/06 20060101 C09K013/06 |
Foreign Application Data
Date |
Code |
Application Number |
Nov 7, 2003 |
JP |
2003-378488 |
Claims
1. An etchant for at least one metal selected from nickel,
chromium, nickel-chromium alloys, and palladium, the etchant
comprising an aqueous solution comprising: hydrochloric acid;
nitric acid; and a cupric ion source.
2. The etchant according to claim 1, wherein the etchant is the
aqueous solution in which a concentration of the hydrochloric acid
is in a range from 0.1 to 35 mass %, a concentration of the nitric
acid is in a range from 0.1 to 20 mass %, and a concentration of a
material containing the cupric ion source, measured as a
concentration of copper, is in a range from 0.00001 to 0.1 mass %,
with the etchant being taken as 100 mass %.
3. The etchant according to claim 1, further comprising 1 to 60
mass % of sulfuric acid.
4. The etchant according to claim 1, further comprising 0.001 to 1
mass % of a surfactant.
5. A set of etchants comprising a first etchant and a second
etchant, wherein the first etchant comprises an aqueous solution
comprising at least the following components A to C: A.
hydrochloric acid; B. at least one compound selected from the
following (a) to (c): (a) compounds with 7 or less carbon atoms,
containing a sulfur atom and at least one group selected from an
amino group, an imino group, a carboxyl group, a carbonyl group,
and a hydroxyl group; (b) thiazole; and (c) thiazole compounds; and
C. a surfactant, and the second etchant comprises an aqueous
solution comprising: hydrochloric acid; nitric acid; and a cupric
ion source.
6. The etchant according to claim 5, wherein the compound with 7 or
less carbon atoms, containing a sulfur atom and at least one group
selected from an amino group, an imino group, a carboxyl group, a
carbonyl group, and a hydroxyl group is at least one selected from
thiourea, thioureadioxide, N-methylthiourea, 1,3-dimethylthiourea,
1,3-diethylthiourea, ethylene thiourea, 2-thiobarbituric acid,
thioglycolic acid, .beta.-mercaptopropionic acid,
2-mercaptopropionic acid, 2,2'-thiodiglycolic acid, thiomalic acid,
mercaptosuccinic acid, L-cysteine, L(-)-Cystine, and
thioglycol.
7. The etchant according to claim 5, wherein the thiazole compound
is 2-mercaptobenzothiazole.
8. The etchant according to claim 5, wherein a concentration of the
component B is in a range from 0.01 to 30 mass %.
9. The etchant according to claim 5, wherein a concentration of the
surfactant as the component C is in a range from 0.001 to 1 mass
%.
10-18. (canceled)
Description
CROSS-REFERENCE TO RELATED APPLICATIONS
[0001] This application is a Division of application Ser. No.
10/979,267, filed Nov. 2, 2004, which application is incorporated
herein by reference.
FIELD OF THE INVENTION
[0002] The present invention relates to an etchant for at least one
metal selected from nickel, chromium, nickel-chromium alloys, and
palladium, a replenishment solution for the etchant, and an etching
method and a method for producing a wiring board using the etchant
and the replenishment solution.
BACKGROUND OF THE INVENTION
[0003] Among various wiring boards used in electronic equipment,
there is an increasing demand for a flexible wiring board because
of its flexibility, small thickness, light weight, etc.
Furthermore, the use of the flexible wiring board as a base
material of a semiconductor package or a package for a
liquid-crystal module also is increasing. The flexible wiring board
includes a polyimide film as an electrically insulating base
material and a copper wiring formed on the polyimide film.
[0004] Among various methods for producing the flexible wiring
board, a sputtering-plating method is attracting attention because
minute wirings can be formed easily by this method, for example.
According to the sputtering-plating method, the flexible wiring
board is produced in the following manner. First, a thin layer of
chromium, a nickel-chromium alloy, or the like, which serves to
adhere polyimide and copper, is formed on the polyimide film as a
base material. Then, a copper layer is formed by electrolytic
plating on a portion where a wiring circuit is to be formed.
Thereafter, a portion of the thin layer that is not covered with
the copper layer is removed by etching, thus forming a copper
wiring (see JP 2000-252625 A).
[0005] The removal of the thin layer generally is carried out using
an aqueous solution that contains ferric chloride as a main
component.
[0006] However, the conventional aqueous solution that contains
ferric chloride as a main component has a problem in that it may
cause too much dissolution of copper.
SUMMARY OF THE INVENTION
[0007] Therefore, in order to solve the above-described problem in
the prior art, it is an object of the present invention to provide
an etchant that can etch at least one metal selected from nickel,
chromium, nickel-chromium alloys, and palladium quickly and can
suppress too much dissolution (also referred to as "excessive
dissolution") of copper, a replenishment solution for the etchant,
and an etching method and a method for producing a wiring board
using the etchant and the replenishment solution.
[0008] The present invention provides an etchant for at least one
metal selected from nickel, chromium, nickel-chromium alloys, and
palladium. The etchant includes an aqueous solution containing
hydrochloric acid, nitric acid, and a cupric ion source.
[0009] Also, the present invention provides a replenishment
solution to be added to the etchant of the present invention when
the etchant is used repeatedly. The replenishment solution is an
aqueous solution containing 0.1 to 35 mass % of hydrochloric acid
and 0.1 to 20 mass % of nitric acid, with the replenishment
solution being taken as 100 mass %.
[0010] Also, the present invention provides a method for etching at
least one metal selected from nickel, chromium, nickel-chromium
alloys, and palladium. The method includes: bringing an etchant
including an aqueous solution containing hydrochloric acid, nitric
acid, and a cupric ion source into contact with the metal.
[0011] Also, the present invention provides another method for
etching at least one metal selected from nickel, chromium,
nickel-chromium alloys, and palladium. The method includes:
bringing a first etchant into contact with a surface of the metal
and then bringing a second etchant into contact with the surface of
the metal. The first etchant includes an aqueous solution
containing at least the following components A to C, and the second
etchant includes an aqueous solution containing hydrochloric acid,
nitric acid, and a cupric ion source. [0012] A. hydrochloric acid
[0013] B. at least one compound selected from the following (a) to
(c): (a) compounds with 7 or less carbon atoms, containing a sulfur
atom(s) and at least one group selected from an amino group, an
imino group, a carboxyl group, a carbonyl group, and a hydroxyl
group; (b) thiazole; and (c) thiazole compounds [0014] C: a
surfactant
[0015] Also, the present invention provides a method for producing
a wiring board. The method includes: bringing a first etchant into
contact with a portion of a surface of nickel, chromium, or a
nickel-chromium alloy present on an electrically insulating base
material, the portion being not covered with a copper wiring; and
then bringing a second etchant into contact with the portion so as
to dissolve the nickel, chromium, or nickel-chromium alloy. The
first etchant includes an aqueous solution containing at least the
following components A to C, and the second etchant includes an
aqueous solution containing hydrochloric acid, nitric acid, and a
cupric ion source. [0016] A. hydrochloric acid [0017] B. at least
one compound selected from the following (a) to (c): (a) compounds
with 7 or less carbon atoms, containing a sulfur atom(s) and at
least one group selected from an amino group, an imino group, a
carboxyl group, a carbonyl group, and a hydroxyl group; (b)
thiazole; and (c) thiazole compounds [0018] C. a surfactant
[0019] Also, the present invention provides another method for
producing a wiring board. The method includes: bringing a first
etchant into contact with a palladium catalyst for electroless
copper plating present in a gap of a wiring on an electrically
insulating base material; and then bringing a second etchant into
contact with the palladium catalyst so as to dissolve the palladium
catalyst. The first etchant includes an aqueous solution containing
at least the following components A to C, and the second etchant
includes an aqueous solution containing hydrochloric acid, nitric
acid, and a cupric ion source. [0020] A. hydrochloric acid [0021]
B. at least one compound selected from the following (a) to (c):
(a) compounds with 7 or less carbon atoms, containing a sulfur
atom(s) and at least one group selected from an amino group, an
imino group, a carboxyl group, a carbonyl group, and a hydroxyl
group; (b) thiazole; and (c) thiazole compounds [0022] C. a
surfactant
[0023] These and other advantages of the present invention will
become apparent to those skilled in the art upon reading and
understanding the following detailed description.
DETAILED DESCRIPTION OF THE INVENTION
(1) Etchant
[0024] An etchant according to the present invention includes an
aqueous solution containing hydrochloric acid, nitric acid, and a
cupric ion source.
[0025] The etchant of the present invention can achieve a high
etching rate for nickel, chromium, nickel-chromium alloys, and
palladium, so that a material to be treated needs to be in contact
with the etchant only for a short time. Thus, when a material in
which copper is present with nickel, chromium, a nickel-chromium
alloy, or palladium is to be treated, only a small amount of copper
is dissolved because the copper is in contact with the etchant only
for a short time.
[0026] The concentration of the hydrochloric acid is 0.1% to 35%
("%" represents "mass %", hereinafter the same), preferably 5% to
20%, and more preferably 10% to 15%. When the concentration of the
hydrochloric acid is less than 0.1%, a sufficiently high etching
rate cannot be obtained. On the other hand, when the concentration
of the hydrochloric acid is more than 35%, the etchant has a strong
odor and thus is not preferable for the working environment.
[0027] The concentration of the nitric acid is 0.1% to 20%,
preferably 0.5% to 15%, and more preferably 1% to 10%. When the
concentration of the nitric acid is less than 0.1%, a sufficiently
high etching rate cannot be obtained. On the other hand, when the
concentration of the nitric acid is more than 20%, excessive
dissolution of copper may be caused.
[0028] Examples of the cupric ion source include cupric chloride,
cupric sulfate, and cupric oxide. The concentration of the cupric
ion source, measured as the concentration of copper, is 0.00001% to
0.1%, preferably 0.0001% to 0.05%, and more preferably 0.001% to
0.01%. When the concentration of the cupric ion source is less than
0.00001%, a sufficiently high etching rate cannot be obtained. On
the other hand, when the concentration of the cupric ion source is
more than 0.1%, excessive dissolution of copper may be caused when
nickel, chromium, a nickel-chromium alloy, or palladium is present
with the copper.
[0029] In the above-described etchant, the remainder may be
water.
[0030] Preferably, the etchant of the present invention further
contains sulfuric acid in order to further increase the etching
rate for nickel, chromium, a nickel-chromium alloy, or palladium.
The concentration of the sulfuric acid preferably is 1% to 60%,
more preferably 5% to 30%, and particularly preferably 10% to 15%.
When the concentration of the sulfuric acid is less than 1%, the
sulfuric acid cannot exhibit an effect of increasing the etching
rate sufficiently. On the other hand, when the concentration of the
sulfuric acid is more than 60%, the etchant has a strong odor and
thus is not preferable for the working environment.
[0031] Preferably, the etchant of the present invention further
contains a surfactant in order to prevent a copper surface from
being eroded. As the surfactant, generally-know surfactants such as
cationic surfactants, anionic surfactants, amphoteric surfactants,
and nonionic surfactants may be used. The concentration of the
surfactant preferably is 0.001% to 1%, more preferably 0.01% to
0.1%, and particularly preferably 0.01% to 0.05%. When the
concentration of the surfactant is less than 0.001%, the surfactant
cannot exhibit an effect of preventing a copper surface from being
eroded sufficiently. On the other hand, when the concentration of
the surfactant is more than 1%, considerable foaming occurs.
[0032] If necessary, the etchant of the present invention further
may contain other components as appropriate. Examples of other
components include an antifoaming agent for suppressing the foaming
and a rust-preventive agent for preventing copper from
discoloring.
[0033] The etchant can be prepared easily by dissolving the
above-described respective components in water. As the water, it is
preferable to use water from which ionic substances and impurities
have been removed, such as ion exchanged water, pure water, and
ultrapure water.
(2) Replenishment Solution
[0034] A replenishment solution according to the present invention
can be used suitably when the etchant of the present invention is
used repeatedly for etching nickel, chromium, a nickel-chromium
alloy, or palladium on a base material in which copper also is
present. By adding the replenishment solution to the etchant, the
ratio of the respective components in the etchant can be maintained
appropriately. Thus, it is possible to etch nickel, chromium, a
nickel-chromium alloy, or palladium stably while suppressing the
dissolution of copper. The replenishment solution is an aqueous
solution containing 0.1% to 35% of hydrochloric acid and 0.1% to
20% of nitric acid, with the replenishment solution being taken as
100%.
[0035] The replenishment solution also further may contain sulfuric
acid, a surfactant, an antifoaming agent, a rust-preventive agent
for copper, and the like, as in the case of the etchant.
(3) Etching Method
[0036] Examples of a method of using the etchant of the present
invention include an immersion method and a spray method. However,
when copper is present with nickel, chromium, a nickel-chromium
alloy, or palladium, the immersion method is preferable in terms of
ease of suppressing the dissolution of copper. In general, the
etchant is used at a temperature of 20.degree. C. to 50.degree.
C.
[0037] For example, the etchant of the present invention can
dissolve a 0.1 .mu.m thick chromium film on a base material in a
short time of about 3 to 5 minutes. Also, it can dissolve a 0.1
.mu.m thick nickel film on a base material in a short time of about
1 to 2 minutes, for example. Furthermore, it can dissolve a 0.1
.mu.m thick nickel-chromium alloy film (Ni 70-Cr 30) on a base
material in a short time of about 2 to 3 minutes, for example.
Still further, it can dissolve palladium that is present on a base
material as a catalyst for electroless copper plating in a short
time of about 5 to 20 seconds, for example.
(4) Etching Method using a First Etchant and a Second Etchant
[0038] An etching method using a first etchant and a second etchant
according to the present invention is for etching at least one
metal selected from nickel, chromium, nickel-chromium alloys, and
palladium. The method includes: bringing a first etchant that
includes an aqueous solution containing at least the following
components A to C into contact with a surface of the metal; and
then bringing a second etchant that includes an aqueous solution
containing hydrochloric acid, nitric acid, and a cupric ion source
with the surface of the metal. [0039] A. hydrochloric acid [0040]
B. at least one compound selected from the following (a) to (c):
(a) compounds with 7 or less carbon atoms, containing a sulfur
atom(s) and at least one group selected from an amino group, an
imino group, a carboxyl group, a carbonyl group, and a hydroxyl
group; (b) thiazole; and (c) thiazole compounds [0041] C. a
surfactant
[0042] When a passive film such as an oxide film is formed on a
surface of nickel, chromium, a nickel-chromium alloy, or palladium,
or when nickel, chromium, a nickel-chromium alloy, or palladium is
thick, a sufficiently high etching rate may not be attained only by
the use of the etchant of the present invention (the second
etchant). In such cases, by using the etching method that uses the
first and second etchants according to the present invention, it is
possible to etch nickel, chromium, a nickel-chromium alloy, or
palladium quickly.
(4-1) First Etchant
[0043] By using the first etchant, a passive film, such as an oxide
film, formed on a surface of nickel, chromium, a nickel-chromium
alloy, or palladium can be removed quickly. In particular, when a
material in which copper is present with nickel, chromium, a
nickel-chromium alloy, or palladium is to be treated, the first
etchant hardly dissolves the copper.
[0044] The concentration of the hydrochloric acid in the first
etchant is 0.1% to 35%, preferably 5% to 20%, and more preferably
10% to 15%. When the concentration of the hydrochloric acid is less
than 0.1%, a sufficiently high etching rate for a passive film,
such as an oxide film, formed on a surface of nickel, chromium, a
nickel-chromium alloy, or palladium cannot be obtained. On the
other hand, when the concentration of the hydrochloric acid is more
than 35%, the etchant has a strong odor and thus is not preferable
for the working environment.
[0045] The compound with 7 or less carbon atoms, containing a
sulfur atom and at least one group selected from an amino group, an
imino group, a carboxyl group, a carbonyl group, and a hydroxyl
group may be a urea compound containing a sulfur atom(s), such as
thiourea, thioureadioxide, N-methylthiourea, 1,3-dimethylthiourea,
1,3-diethylthiourea, ethylene thiourea, or 2-thiobarbituric acid;
carboxylic acid containing a sulfur atom(s), such as thioglycolic
acid, .beta.-mercaptopropionic acid, 2-mercaptopropionic acid,
2,2'-thiodiglycolic acid, thiomalic acid, mercaptosuccinic acid,
L-cysteine, or L(-)-Cystine; alcohol containing a sulfur atom(s),
such as thioglycol.
[0046] As the thiazole compound, those soluble in water are
preferable. Specific examples thereof include
2-mercaptobenzothiazole.
[0047] The concentration of the compound containing a sulfur
atom(s) is 0.01% to 30%, preferably 0.1% to 10%, and more
preferably 0.1% to 1%. When the concentration of the compound
containing a sulfur atom(s) is less than 0.01%, a sufficiently high
etching rate cannot be obtained. On the other hand, when the
concentration of the compound containing a sulfur atom(s) is more
than 30%, an effect commensurate with the increase in the added
amount of the compound cannot be obtained, resulting in high
cost.
[0048] The surfactant is not particularly limited. Examples thereof
include: cationic surfactants such as alkyldimethylbenzylammonium
chloride, alkyltrimethylammonium salts, and alkylpyridinium salts;
anionic surfactants such as alkylarylsulfonate, alpha olefin
sulfonate, and alkylbenzene sulfonate; amphoteric surfactants such
as amidopropyl betaine, aminoacetic acid betaine, and linear
alkylamino acid; and nonionic surfactants such as polyoxyethylene
lanolin ether, polyoxyethylene alkylphenol, polyoxyethylene fatty
acid ester, fatty acid diethanolamide, and isopropanolamide.
[0049] The concentration of the surfactant preferably is 0.001% to
1%, more preferably 0.01% to 0.1%, and particularly preferably
0.01% to 0.05%. When the concentration of the surfactant is less
than 0.001%, a sufficiently high etching rate for a passive film,
such as an oxide film, formed on a surface of nickel, chromium, a
nickel-chromium alloy, or palladium cannot be obtained. On the
other hand, when the concentration of the surfactant is more than
1%, considerable foaming occurs.
[0050] If necessary, the first etchant further may contain other
components as appropriate. Examples of other components include an
antifoaming agent for suppressing the foaming and a rust-preventive
agent for preventing copper from discoloring.
[0051] The first etchant can be prepared easily by dissolving the
above-described respective components in water. As the water, it is
preferable to use water from which ionic substances and impurities
have been removed, such as ion exchanged water, pure water, and
ultrapure water.
(4-2) Etching Method
[0052] The time period for which the first etchant is in contact
with nickel, chromium, a nickel-chromium alloy, or palladium may be
as short as about 1 to 60 seconds, preferably 5 to 10 seconds. When
the contact time is too short, a passive film, such as an oxide
film, formed on a surface of nickel, chromium, a nickel-chromium
alloy, or palladium cannot be dissolved sufficiently. A longer
contact time than is needed provides no advantages.
[0053] Examples of a method of using the first etchant include an
immersion method and a spray method. However, the immersion method
is preferable because the compound containing a sulfur atom(s) is
less liable to be decomposed by the immersion method.
[0054] In general, the first etchant is used at a temperature of
20.degree. C. to 50.degree. C.
[0055] Next, the second etchant is brought into contact with the
nickel, chromium, nickel-chromium alloy, or palladium. The time
period for which the second etchant is in contact with the nickel,
chromium, nickel-chromium alloy, or palladium may be determined as
appropriate depending on the thickness of the metal to be dissolved
or the like. For example, the contact time may be about 30 to 60
seconds when a 0.1 .mu.m thick chromium film is to be dissolved,
about 10 to 20 seconds when a 0.1 .mu.m thick nickel film is to be
dissolved, about 20 to 40 seconds when a 0.1 .mu.m thick
nickel-chromium alloy film (Ni 70-Cr 30) is to be dissolved, and
about 1 to 10 seconds when palladium that is applied on an
electrically insulating base material as a catalyst for electroless
copper plating is to be dissolved.
[0056] When etching nickel, chromium, a nickel-chromium alloy, or
palladium by the first and second etchants using an etching
apparatus, one of the following procedures may be employed, for
example: the first and second enchants may be prepared by mixing
all the components therefor so as to have predetermined
compositions, and then the thus-prepared first and second etchants
may be supplied to the etching apparatus; the respective components
for preparing the first and second etchants may be supplied to the
etching apparatus separately, and the first and second enchants may
be prepared in the etching apparatus by mixing the components so as
to have predetermined compositions; or alternatively, some of the
components for preparing the first and second etchants may be mixed
in advance and supplied to the etching apparatus, and then the
remaining components further may be supplied to the apparatus and
mixed with the previously supplied mixtures so as to have
predetermined compositions, thus preparing the first and second
enchants. When supplying the respective components for the first
and second etchants to the etching apparatus, the concentrations
thereof are not particularly limited. For example, the components
with higher concentrations may be supplied to the etching
apparatus, and then the components may be diluted with water in the
apparatus so as to adjust the concentrations thereof to desired
values.
[0057] An etchant and an etching method according to the present
invention are useful for producing a wiring board, for example. The
following (a) to (c) are examples of a method for producing a
wiring board.
[0058] (a) a method including: forming a layer of nickel, chromium,
or a nickel-chromium alloy on an electrically insulating base
material; forming a plating resist on this layer; then forming a
copper layer by electrolytic copper plating only on a portion where
a wiring circuit is to be formed; then removing the plating resist;
and bringing a first etchant and then a second etchant into contact
with the electrically insulating base material so as to dissolve a
portion of the nickel, chromium, or nickel-chromium alloy layer
that is not covered with the copper layer
[0059] (b) a method including: forming a layer of nickel, chromium,
or a nickel-chromium alloy on an electrically insulating base
material; forming a copper layer on this layer; then covering a
portion where a wiring circuit is to be formed with an etching
resist; then bringing a copper etchant into contact with the
electrically insulating base material so as to etch a portion of
the copper that is not covered with the etching resist; and
bringing a first etchant and then a second etchant into contact
with the electrically insulating base material so as to dissolve a
portion of the nickel, chromium, or nickel-chromium alloy layer
that is exposed by the etching of the copper
[0060] (c) a method including: applying a catalyst for electroless
plating to an electrically insulating base material; carrying out
electroless copper plating and then electrolytic copper plating;
covering a portion where a wiring circuit is to be formed with an
etching resist; bringing a copper etchant into contact with the
electrically insulating base material so as to etch a portion of
the copper (the copper layer formed by the electroless copper
plating and the copper layer formed by the electrolytic copper
plating) that is not covered with the etching resist; and bringing
a first etchant and then a second etchant into contact with the
electrically insulating base material so as to dissolve the
catalyst (palladium) for the electroless plating remaining on the
electrically insulating base material that is exposed by the
etching of the copper.
[0061] Examples of a material for the electrically insulating base
material include: thermoplastic resins such as AS resin, ABS resin,
fluorocarbon resins, polyamide, polyethylene, polyethylene
terephthalate, polyvinylidene chloride, polyvinyl chloride,
polycarbonate, polystyrene, polysulphone, polypropylene, and liquid
crystal polymers; and thermosetting resins such as epoxy resins,
phenol resins, polyimide, polyurethane, bismaleimide-triazine
resin, and modified polyphenylene ethers. These resins may be
reinforced with glass fibers, aramid fibers, or the like. Also,
ceramic, glass, or the like may be used as a material for the
electrically insulating base material.
[0062] The layer of nickel, chromium, or a nickel-chromium alloy is
formed by electroless plating, sputtering, vacuum evaporation, or
the like. The copper layer is formed by electroless plating,
electrolytic plating, or the like.
[0063] According to the etching method of the present invention,
even when the layer of nickel, chromium, or a nickel-chromium alloy
is as thick as 0.1 .mu.m, for example, the layer can be dissolved
quickly, while causing little change in the shape of the copper
layer formed by electrolytic copper plating. Also, palladium as a
catalyst for electroless plating remaining on the base material can
be dissolved quickly.
[0064] According to the etchant and the etching method of the
present invention, it is possible to etch nickel, chromium, or a
nickel-chromium alloy quickly.
[0065] Furthermore, according to the etchant and the etching method
of the present invention, palladium can be etched quickly.
Palladium is used as a catalyst for electroless copper plating in
the production of a wiring board. However, there have been problems
that palladium remaining on a surface of an electrically insulating
base material may deteriorate the insulation performance of the
base material and that it may cause gold to be deposited on an
undesired portion in a subsequent gold plating process. The present
invention also is useful for the removal of such palladium.
[0066] The etchant of the present invention can etch nickel,
chromium, nickel-chromium alloys, and palladium quickly, so that a
material to be treated needs to be in contact with the etchant only
for a short time. Thus, when a material in which copper is present
with nickel, chromium, a nickel-chromium alloy, or palladium is to
be treated, only a small amount of copper is dissolved because the
copper is in contact with the etchant only for a short time.
[0067] Furthermore, according to the etching method that uses a
first etchant and a second etchant according to the present
invention, nickel, chromium, a nickel-chromium alloy, or palladium
can be etched quickly even when a passive film such as an oxide
film is formed on a surface thereof In the present invention, the
atomic ratio of Ni to Cr in nickel-chromium alloys is not
particularly limited. For example, Ni and Cr may be present in the
ratio (weight ratio) of Ni: Cr=6:1, 7:1, or 1:3.
EXAMPLES
[0068] Hereinafter, the present invention will be described more
specifically by way of examples and comparative examples.
Examples 1 to 5 and Comparative Examples 1 and 2
[0069] Components shown in Table 1 were mixed to prepare etchants
of Examples 1 to 5 and Comparative Examples 1 and 2.
(1) Etching of Nickel-Cromium Alloy
[0070] Polyimide films, each including a 0.1 .mu.m thick
nickel-chromium alloy film (Ni 88-Cr 12) formed by sputtering, were
immersed in the respective etchants kept at 40.degree. C. so as to
dissolve the nickel-chromium alloy films. With regard to the
respective polyimide films, the time periods required until nickel
and chromium on their surfaces became no longer detectable with an
X-ray fluorescence spectrometer were determined. The results are
shown in Table 1.
[0071] On the other hand, copper foils (40 mm in length, 40 mm in
width, 35 .mu.m in thickness, 0.50 g in weight) were immersed in
the respective etchants kept at 40.degree. C. for the time periods
determined in the above, respectively. Then, with regard to the
respective copper foils, the amounts of copper dissolved were
determined from the change in their weight. The results are shown
in Table 1.
(2) Etching of Palladium
[0072] Glass fabric base materials impregnated with epoxy resin
were pretreated for electroless copper plating so as to attach a
palladium catalyst on their surfaces. The thus-treated base
materials then were immersed in the respective etchants kept at
40.degree. C. so as to dissolve the palladium catalysts. With
regard to the respective base materials, the time periods required
until palladium on their surfaces became no longer detectable by
ESCA (X-ray photoelectron spectroscopy) were determined. The
results are shown in Table 1. On the other hand, copper foils (40
mm in length, 40 mm in width, 35 .mu.m in thickness, 0.50 g in
weight) were immersed in the respective etchants kept at 40.degree.
C. for the time periods determined in the above, respectively.
Then, with regard to the respective copper foils, the amounts of
copper dissolved were determined from the change in their weight.
The results are shown in Table 1. TABLE-US-00001 TABLE 1
Composition (mass %) Ex. No. 1st etchant 2nd etchant * ** Ex. 1
none sulfuric acid 10 150 sec 20 sec hydrochloric acid 10 0.03 g
0.00 g nitric acid 5 cupric chloride 0.001 (as copper) sodium alpha
olefin 0.1 sulphonate ion exchanged water remainder Ex. 2 none
sulfuric acid 2 120 sec 10 sec hydrochloric acid 25 0.02 g 0.00 g
nitric acid 10 cupric sulfate 0.005 (as copper) ion exchanged water
remainder Ex. 3 none sulfuric acid 20 120 sec 20 sec hydrochloric
acid 5 0.02 g 0.00 g nitric acid 2 cupric nitrate 0.01 (as copper)
amidopropyl betaine .sup. 0.05 ion exchanged water remainder Ex. 4
none hydrochloric acid 10 150 sec 20 sec nitric acid 10 0.03 g 0.00
g cupric oxide 0.002 (as copper) propyl trimethylammonium 0.5 ion
exchanged water remainder Ex. 5 none hydrochloric acid 30 120 sec 5
sec nitric acid 1 0.02 g 0.00 g cupric oxide 0.00001 (as copper)
ion exchanged water remainder Comp. none hydrochloric acid 5 at
least at least Ex. 1 sulfuric acid 5 600 sec 600 sec ion exchanged
water remainder at least at least 0.70 g 0.70 g Comp. none
hydrochloric acid 5 180 sec 30 sec Ex. 2 ferric chloride 30 (as
iron) 0.48 g 0.08 g cupric chloride 1 (as copper) ion exchanged
water remainder * time required for nickel-chromium alloy
dissolution and weight loss of copper foil ** time required for
palladium dissolution and weight loss of copper foil
[0073] As can be seen from the results with regard to Examples 1 to
5 shown in Table 1, the etchants according to the present invention
could dissolve the nickel-chromium alloy of 0.1 .mu.m thickness in
a short time of 120 to 150 seconds, and could dissolve the
palladium catalyst in a short time of 10 to 20 seconds. Also,
according to the etchants of the present invention, the weight loss
of the copper foils was very small. For example, when the copper
foil was immersed in the etchant for 150 seconds, the weight loss
was only 0.03 g.
[0074] In contrast, as can be seen from Table 1, the
generally-known etchant containing ferric chloride as a main
component (Comparative Example 2) took 180 seconds to dissolve the
nickel-chromium alloy and 30 seconds to dissolve palladium.
Moreover, the weight loss of the copper foil was 0.48 g when the
copper foil was immersed in the etchant for 180 seconds.
[0075] These results demonstrate that an etchant according to the
present invention can achieve a high etching rate and dissolves
only a small amount of copper.
Examples 6 to 10
[0076] Components shown in Table 2 were mixed so as to prepare
etchants (a first etchant and a second etchant) of Examples 6 to
10.
(1) Etching of Nickel-Chromium Alloy
[0077] Polyimide films, each including a 0.1 .mu.m thick
nickel-chromium alloy film (Ni 88-Cr 12) formed by sputtering, were
immersed in the respective first etchants kept at 40.degree. C. for
5 seconds. Thereafter, the polyimide films were immersed in the
respective second etchants kept at 40.degree. C. so as to dissolve
the nickel-chromium alloy films. With regard to the respective
polyimide films, the time periods required until Ni and Cr on their
surfaces became no longer detectable with an X-ray fluorescence
spectrometer (i.e., the time periods for which the respective
polyimide films were immersed in the second etchants) were
determined. The results are shown in Table 2. Also, copper foils
(40 mm in length, 40 mm in width, 35 .mu.m in thickness, 0.50 g in
weight) were immersed in the respective first and second etchants
kept at the same temperature for the same time periods as in the
above, respectively. Then, with regard to the respective copper
foils, the amounts of copper dissolved were determined from the
change in their weight. The results are shown in Table 2.
(2) Etching of Palladium
[0078] Glass fabric base materials impregnated with epoxy resin
were pretreated for electroless copper plating so as to attach a
palladium catalyst on their surfaces. The thus-treated base
materials were then immersed in the respective first etchants kept
at 40.degree. C. for 5 seconds. Thereafter, the base materials were
immersed in the respective second etchants kept at 40.degree. C. so
as to dissolve the palladium catalysts. With regard to the
respective base materials, the time periods required until
palladium on their surfaces became no longer detectable by ESCA
(X-ray photoelectron spectroscopy) (i.e., the time periods for
which the respective base materials were immersed in the second
etchants) were determined. The results are shown in Table 2. On the
other hand, copper foils (40 mm in length, 40 mm in width, 35 .mu.m
in thickness, 0.50 g in weight) were immersed in the first etchants
kept at 40.degree. C. and then in the second etchants kept at
40.degree. C. for the same time periods as in the above,
respectively. Then, with regard to the respective copper foils, the
amounts of copper dissolved were determined from the change in
their weight. The results are shown in Table 2. TABLE-US-00002
TABLE 2 Composition (mass %) Ex. No. 1st etchant 2nd etchant * **
Ex. 6 sulfuric acid 3 sulfuric acid 10 30 sec 10 sec hydrochloric
acid 10 hydrochloric acid 10 0.00 g 0.00 g thiourea 1 nitric acid 5
sodium alpha olefin 0.1 cupric chloride 0.001 (as copper)
sulphonate ion exchanged water remainder sodium alpha olefin 0.1
sulphonate ion exchanged water remainder Ex. 7 sulfuric acid 20
sulfuric acid 2 20 sec 5 sec hydrochloric acid 7 hydrochloric acid
25 0.00 g 0.00 g N-methylthiourea 3 nitric acid 10 isopropanolamide
0.3 cupric sulfate 0.005 (as copper) ion exchanged water remainder
isopropanolamide 0.3 ion exchanged water remainder Ex. 8 sulfuric
acid 8 sulfuric acid 20 20 sec 5 sec hydrochloric acid 5
hydrochloric acid 5 0.00 g 0.00 g thioglycollic acid 0.2 nitric
acid 2 Lauryldimethylbenzyl 0.2 cupric nitrate 0.002 (as copper)
ammonium chloride ion exchanged water remainder
Lauryldimethylbenzyl 0.2 ammonium chloride ion exchanged water
remainder Ex. 9 hydrochloric acid 10 hydrochloric acid 10 30 sec 5
sec .beta.-mercaptopropionic acid 5 nitric acid 10 0.00 g 0.00 g
polyoxyethylene 0.05 cupric oxide 0.01 (as copper) fatty acid ester
ion exchanged water remainder polyoxyethylene .sup. 0.05 fatty acid
ester ion exchanged water remainder Ex. 10 sulfuric acid 3
hydrochloric acid 30 20 sec 5 sec hydrochloric acid 30 nitric acid
1 0.00 g 0.00 g 2-mercaptobenzothiazole 1 cupric oxide 0.00001 (as
copper) amidopropyl betaine 0.01 ion exchanged water remainder ion
exchanged water remainder * time required for nickel-chromium alloy
dissolution and weight loss of copper foil ** time required for
palladium dissolution and weight loss of copper foil
[0079] As can be seen from the results with regard to Examples 6 to
10 shown in Table 2, by the etching method that uses two types of
etchants according to the present invention, the nickel-chromium
alloy of 0.1 .mu.m thickness could be dissolved in a short time of
20 to 30 seconds and the palladium catalyst could be dissolved in a
short time of 5 to 10 seconds. Moreover, no weight loss of the
copper foils was observed.
[0080] The invention may be embodied in other forms without
departing from the spirit or essential characteristics thereof. The
embodiments disclosed in this application are to be considered in
all respects as illustrative and not limiting. The scope of the
invention is indicated by the appended claims rather than by the
foregoing description, and all changes which come within the
meaning and range of equivalency of the claims are intended to be
embraced therein.
* * * * *