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Patent applications and USPTO patent grants for Urushibata; Kaoru.The latest application filed is for "microetching agent for copper, copper surface roughening method and wiring board production method".
Patent | Date |
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Microetching agent for copper, copper surface roughening method and wiring board production method Grant 11,208,726 - Ogino , et al. December 28, 2 | 2021-12-28 |
Microetching Agent For Copper, Copper Surface Roughening Method And Wiring Board Production Method App 20200263308 - OGINO; Yuki ;   et al. | 2020-08-20 |
Etchant and replenishment solution therefor, and etching method and method for producing wiring board using the same App 20080011981 - Kuriyama; Masayo ;   et al. | 2008-01-17 |
Etchant and replenishment solution therefor, and etching method and method for producing wiring board using the same Grant 7,285,229 - Kuriyama , et al. October 23, 2 | 2007-10-23 |
Etchant and replenishment solution therefor, and etching method and method for producing wiring board using the App 20050109734 - Kuriyama, Masayo ;   et al. | 2005-05-26 |
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