Akiyama; Daisaku

Patent Applications and Registrations

Patent applications and USPTO patent grants for Akiyama; Daisaku.The latest application filed is for "adhesive composition, method for producing surface-treated metal member, and method for producing metal-resin composite body".

Company Profile

4.5.8

Akiyama; Daisaku - Amagasaki-shi Hyogo
Akiyama; Daisaku - Hyogo JP
Akiyama; Daisaku - Amagasaki JP

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Adhesive Composition, Method For Producing Surface-treated Metal Member, And Method For Producing Metal-resin Composite Body App 20220073793 - Hayashi; Tomoki ; et al.	2022-03-10
Composition for forming coating, production method for surface-treated metal member, and production method for metal-resin composite Grant 10,801,112 - Akiyama , et al. October 13, 2	2020-10-13
Composition For Forming Coating, Production Method For Surface-treated Metal Member, And Production Method For Metal-resin Compo App 20200040460 - AKIYAMA; Daisaku ; et al.	2020-02-06
Film-forming composition, method for producing surface-treated metal member, and method for producing metal-resin composite Grant 10,329,453 - Akiyama , et al.	2019-06-25
Film-forming Composition, Method For Producing Surface-treated Metal Member, And Method For Producing Metal-resin Composite App 20190127606 - AKIYAMA; Daisaku ; et al.	2019-05-02
Etching Agent And Replenishing Solution Therefor, Method For Roughening Surface Of Magnesium Component, And Method For Manufacturing Magnesium-resin Composite App 20170268112 - AKIYAMA; Daisaku ; et al.	2017-09-21
Etching Agent And Replenishing Liquid App 20170167033 - SENGOKU; Yoichi ; et al.	2017-06-15
Metal removing solution and metal removing method using the same App 20080073614 - Akiyama; Daisaku ; et al.	2008-03-27
Etchant and replenishment solution therefor, and etching method and method for producing wiring board using the same App 20080011981 - Kuriyama; Masayo ; et al.	2008-01-17
Etchant and replenishment solution therefor, and etching method and method for producing wiring board using the same Grant 7,285,229 - Kuriyama , et al. October 23, 2	2007-10-23
Etchant and replenishment solution therefor, and etching method and method for producing wiring board using the App 20050109734 - Kuriyama, Masayo ; et al.	2005-05-26
Composition for treating copper or copper alloy surfaces Grant 5,532,094 - Arimura , et al. July 2, 1	1996-07-02
Composition for treating copper or copper alloys Grant 5,439,783 - Akiyama , et al. August 8, 1	1995-08-08

uspto.report is an independent third-party trademark research tool that is not affiliated, endorsed, or sponsored by the United States Patent and Trademark Office (USPTO) or any other governmental organization. The information provided by uspto.report is based on publicly available data at the time of writing and is intended for informational purposes only.

While we strive to provide accurate and up-to-date information, we do not guarantee the accuracy, completeness, reliability, or suitability of the information displayed on this site. The use of this site is at your own risk. Any reliance you place on such information is therefore strictly at your own risk.

All official trademark data, including owner information, should be verified by visiting the official USPTO website at www.uspto.gov. This site is not intended to replace professional legal advice and should not be used as a substitute for consulting with a legal professional who is knowledgeable about trademark law.