U.S. patent application number 11/391607 was filed with the patent office on 2007-08-09 for package structure of a microphone.
Invention is credited to Chin-Ching Huang, Jiung-Yue Tien, Hsi-Chen Yang.
Application Number | 20070182002 11/391607 |
Document ID | / |
Family ID | 37056247 |
Filed Date | 2007-08-09 |
United States Patent
Application |
20070182002 |
Kind Code |
A1 |
Huang; Chin-Ching ; et
al. |
August 9, 2007 |
Package structure of a microphone
Abstract
A kind of microphone package structure is disclosed. It
comprises at least of a substrate, a sound processing unit, an
upper cap and other devices. There would be at least one trench set
on the substrate, and a separation gap between the trench and the
bounding pad of the substrate is maintained. After connective paste
is smeared on the surface of the substrate, the trench would be
assembled with other devices. This kind of package structure could
prevent a short circuit being caused by the overflowing of the
connective paste.
Inventors: |
Huang; Chin-Ching; (Taichung
City, TW) ; Tien; Jiung-Yue; (Tantzu, TW) ;
Yang; Hsi-Chen; (Houli Township, TW) |
Correspondence
Address: |
ROSENBERG, KLEIN & LEE
3458 ELLICOTT CENTER DRIVE-SUITE 101
ELLICOTT CITY
MD
21043
US
|
Family ID: |
37056247 |
Appl. No.: |
11/391607 |
Filed: |
March 29, 2006 |
Current U.S.
Class: |
257/734 |
Current CPC
Class: |
H01L 2224/49171
20130101; H01L 2924/16151 20130101; H01L 2224/48091 20130101; Y10S
257/924 20130101; H04R 19/00 20130101; H01L 2224/48091 20130101;
H01L 2924/00014 20130101; H01L 2224/48227 20130101; H01L 2924/16152
20130101 |
Class at
Publication: |
257/734 |
International
Class: |
H01L 23/48 20060101
H01L023/48; H01L 23/52 20060101 H01L023/52; H01L 29/40 20060101
H01L029/40 |
Foreign Application Data
Date |
Code |
Application Number |
Jan 24, 2006 |
TW |
95102675 |
Claims
1. A microphone package structure, comprising: a substrate,
including plural bounding pads and a connective area, and these
bounding pads and the connective area are located in the different
planes; besides, the connective area is smeared with a conductive
paste; a sound processing unit, set on the substrate, and
connecting with plural bounding pads by plural wires; and an upper
cap, located with the connective area of the substrate.
2. The microphone package structure of claim 1, wherein the
substrate and the upper cap are both rectangles.
3. The microphone package structure of claim 1, wherein the
substrate and the upper cap are both non-rectangles.
4. The microphone package structure of claim 1, wherein the
connective area of the substrate and the upper cap is an
interactive inclined plane.
5. The microphone package structure of claim 2, wherein the
connective area of the substrate and the upper cap is an
interactive inclined plane.
6. The microphone package structure of claim 3, wherein the
connective area of the substrate and the upper cap is an
interactive inclined plane.
7. The microphone package structure of claim 1, wherein the
connective area of the substrate is a concave inclined plane.
8. The microphone package structure of claim 2, wherein the
connective area of the substrate is a concave inclined plane.
9. The microphone package structure of claim 3, wherein the
connective area of the substrate is a concave inclined plane.
10. The microphone package structure of claim 1, wherein the
connective area of the substrate is a concave inclined plane, and
is an interactive inclined plane with the connective area of the
upper cap.
11. The microphone package structure of claim 2, wherein the
connective area of the substrate is a concave inclined plane, and
is an interactive inclined plane with the connective area of the
upper cap.
12. The microphone package structure of claim 3, wherein the
connective area of the substrate is a concave inclined plane, and
is an interactive inclined plane with the connective area of the
upper cap.
13. A microphone package structure, comprising: a substrate,
including plural bounding pads and a connective area, and these
bounding pads and the connective area are located in the different
planes; besides, the connective area is smeared with conductive
paste; a sound processing unit, set on the substrate, and
connecting with plural bounding pads by plural wires, and an upper
cap, located with the connective area of the substrate.
14. The microphone package structure of claim 13, wherein the
substrate and the upper cap are both rectangles.
15. The microphone package structure of claim 13, wherein the
substrate and the upper cap are both non-rectangles.
16. The microphone package structure of claim 13, wherein the
connective area of the substrate and the upper cap is an
interactive inclined plane.
17. The microphone package structure of claim 14, wherein the
connective area of the substrate and the upper cap is an
interactive inclined plane.
18. The microphone package structure of claim 15, wherein the
connective area of the substrate and the upper cap is an
interactive inclined plane.
19. The microphone package structure of claim 13, wherein the
connective area of the substrate is a concave inclined plane.
20. The microphone package structure of claim 14, wherein the
connective area of the substrate is a concave inclined plane.
21. The microphone package structure of claim 15, wherein the
connective area of the substrate is a concave inclined plane.
22. The microphone package structure of claim 13, wherein the
connective area of the substrate is a concave inclined plane, and
is an interactive inclined plane with the connective area of the
upper cap.
23. The microphone package structure of claim 14, wherein the
connective area of the substrate is a concave inclined plane, and
is an interactive inclined plane with the connective area of the
upper cap.
24. The microphone package structure of claim 15, wherein the
connective area of the substrate is a concave inclined plane, and
is an interactive inclined plane with the connective area of the
upper cap.
25. The microphone package structure of claim 13, wherein there is
a protrusion between the pair of the connective areas.
26. The microphone package structure of claim 25, wherein the
protrusion is a rectangle.
Description
RELATED APPLICATIONS
[0001] The present application is based on, and claims priority
from, Taiwan Application Serial Number b 95102675, filed Jan. 24,
2006, the disclosure of which is hereby incorporated by reference
herein in its entirety.
BACKGROUND
[0002] 1. Field of Invention
[0003] The present invention relates generally to the package
structure of microphone, and more particularly to the package
structure of microphone with avoiding the short circuit caused by
the overflowing of the conductive paste.
[0004] 2. Description of Related Art
[0005] Modern electromagnetic communication is frequently
facilitated by hand held and home based wireless communication
devices. Nowadays, dense signal transmissions in mobile telephones
cause serious interference in the amplifier circuit of the
microphone. This phenomenon usually happens between popular mobile
telephones and the microphones.
[0006] Reference is made to FIG. 1, which illustrates a stereo
assembly drawing of a related microphone package structure. The
package structure comprises the body 100, the substrate 110, sound
processing unit 120, bounding pad 130, conductive line 140 and the
upper cap 160.
[0007] The substrate 110 includes the circuit board and the sound
processing unit 120 is set on the circuit board with the conductive
line 140 and the bounding pad 130. The substrate connection 111 is
also prepared to connect to the connection 161 on the upper cap
160, and the acoustic hole 162 is on the upper cap 160.
[0008] Reference is made to FIG. 1 and FIG. 2, which illustrate
profiles of the package structure of the microphone. The bounding
pad 130 is on the same plate as the substrate connection 111,
moreover, these bounding pads 130 are separated by a short
distance. After smearing the conductive paste 150 on the substrate
connection 111, the upper cap 160 can be attached to the body 100.
The conductive paste 150 may make two bounding pads 130 conductive
when the upper cap 160 presses the conductive paste 150. This
unnecessary short circuit would disable the sound processing unit
120. (In order to illustrate the relative position between the
conductive paste 150 and the upper cap 160, there are only two
sides of the conductive paste 150 except for the front part, and so
are the other profiles.)
[0009] A good connection cannot be established between the body 100
and the upper cap 160. If this package structure were hit by a
foreign force, the middle of the body 100 and upper cap 160 would
slide so that the appearance and the reliability of the package
structure would be diminished.
[0010] The problems as mentioned about the known technology could
disable the sound gathering and processing functions; therefore,
the reliability and quality of the microphone would be diminished
and the maintenance cost of the microphone would increase, but all
these problems can be improved by the present invention.
SUMMARY
[0011] In order to not only solve the aforementioned and other
problems, but also achieve the technical benefits which this
invention advocates, the present invention provides a microphone
package structure that prevents the short circuit caused by the
conductive paste overflow.
[0012] It is the objective of the present invention to provide a
microphone package structure which forms at least one trench in the
connection between the substrate and the upper cap, and a gap
between this trench and the bounding pad is maintained.
[0013] It is another objective of the present invention to provide
a microphone package structure whose electromagnetic shelter is
more effective. The effectiveness of the electromagnetic shelter
around the sound processing unit can be improved by smearing
conductive paste on the substrate trench inside the microphone.
[0014] According to the aforementioned objectives of the present
invention, a microphone package structure with a trench is
provided. In one embodiment of the present invention, the substrate
connection is attached with one trench formed in the lower part of
the upper cap downward. This trench could be a circular trench, a
rectangular trench or a trench of another shape. The trench shape
depends on the shape of the substrate. These trenches could also be
plural trenches. For example, if the lower surface of the upper cap
is divided into discrete sections, a trench could be formed in each
of these discrete sections resulting in a plurality of trenches.
Through this method, the connective area between the substrate and
the upper cap would be increased, the connection boosted, and the
pressure from upper cap caused by the conductive paste smeared on
the surface of the trenches would prevent short circuits between
the bounding pads of the substrate.
[0015] According to the objective of the present invention, a
package structure which can increase the effectiveness of the
electromagnetic shelter of the microphone is provided. In one
embodiment of the present invention, it is necessary to smear a
layer of conductive paste on the trench surface next to the
substrate before the connection and between the substrate and upper
cap, which forms the package structure of microphone. As a result,
there would be a circular electromagnetic shelter effect in the
sound processing unit which is set on the substrate after the
connection between the substrate and upper cap.
[0016] The microphone package structure of the present invention
could not only eliminate the disabilities of the electronic units
using earlier technology, which commonly has conductive paste
overflowing, but also provide a package structure for the
electronic unit with a more effective electromagnetic shelter.
BRIEF DESCRIPTION OF THE DRAWINGS
[0017] The accompanying drawings are included to provide a further
understanding of the invention and are incorporated in and
constitute a part of this specification. The drawings illustrate
embodiments of the invention and, together with the description,
serve to explain the principles of the invention. In the
drawings,
[0018] FIG. 1 illustrates a stereo assembly drawing of a related
microphone package structure (the connective area of the substrate
is at the same height as the bounding pad);
[0019] FIG. 2 illustrates a profile of the related microphone
package structure (the connective area of the substrate is the same
altitude as the bounding pad);
[0020] FIG. 3 illustrates a stereo assembly drawing of the
microphone package structure of the preferred embodiment of the
present invention (the connective area of the substrate is an
outward inclined plane);
[0021] FIG. 4 illustrates a profile of a microphone package
structure of the preferred embodiment of the present invention (the
connective area of the substrate is an outward inclined plane);
[0022] FIG. 5 illustrates a stereo assembly drawing of the
microphone package structure of the preferred embodiment of the
present invention (the connective area of the substrate downward
forms a circular trench);
[0023] FIG. 6 illustrates a profile of the microphone package
structure of the preferred embodiment of the present invention (the
lower connective area of the substrate forms a circular
trench);
[0024] FIG. 7 illustrates a profile of the microphone package
structure of the preferred embodiment of the present invention (the
connective area of the lower substrate forms a circular trench, and
the bottom of the trench is an outward inclined plane);
[0025] FIG. 8 illustrates a top view of the microphone package
structure of the preferred embodiment of the present invention (the
connective area of the lower substrate forms four L-like
trenches);
[0026] FIG. 9 illustrates a stereo assembly drawing of the
microphone package structure of the preferred embodiment of the
present invention (the connective area of the substrate downward
forms four L-like trenches, and the bottom of the trench is an
outward inclined plane);
[0027] FIG. 10 illustrates a stereo assembly drawing of the
microphone package structure of the preferred embodiment of the
present invention (the connective area of the substrate downward
forms four L-like trenches);
[0028] FIG. 11 illustrates a profile of the microphone package
structure of the preferred embodiment of the present invention (the
connective area of the lower substrate forms four L-like trenches);
and
[0029] FIG. 12 illustrates a profile of the microphone package
structure of the preferred embodiment of the present invention (the
connective area of the substrate downward forms four L-like
trenches, and the bottom of the trench is an outward inclined
plane).
DESCRIPTION OF THE PREFERRED EMBODIMENTS
[0030] Reference will now be made in detail to the present
preferred embodiments of the invention, examples of which are
illustrated in the accompanying drawings. Wherever possible, the
same reference numbers are used in the drawings and the description
to refer to the same or like parts.
[0031] While the specification concludes with claims defining the
features of the invention that are regarded as novel, it is
believed that the invention will be better understood from a
consideration of the following description in conjunction with the
figures, in which like reference numerals are carried forward.
[0032] Reference is made to FIG. 3, which illustrates a stereo
assembly drawing of the microphone package structure of the
preferred embodiment of the present invention. A package structure
comprises a main body 200, a substrate 210, a sound processing unit
220, a bounding pad 230, a wire 240, and an upper cap 260
containing an acoustic hole 262.
[0033] The connective area 211 of the substrate 210 connects with
the connective area 261 of the upper cap (as the spotted area in
the FIG. 3) and is constituted by an outward inclined plane.
Moreover, the substrate 210 contains a circuit board with sound
processing unit 220, and the necessary electronic connection would
be done through the wire 240 and the bounding pad 230. The shape of
the connective area 211 of the substrate could be rectangular or
circular and both the connective area 211 and 261 of the upper cap
are interactive inclined planes. Besides, the substrate 210 and the
upper cap 260 could be rectangles or non-rectangles.
[0034] Reference is made to FIG. 4, which illustrates a profile of
the microphone package structure of the preferred embodiment of the
present invention. There is an angle between the connective area
211 of the rectangular substrate and the bounding pad 230, so it is
not easy for the conductive paste 250 smeared on the connective
area 211 of the substrate to be pressed to the located plane of the
bounding pad 230 when the connective area 211 of the substrate and
the connective area 261 of the upper cap connect. Consequently, the
extra conductive paste 250 would be pressed to the outside of the
substrate 210.
[0035] Reference is made to FIG. 5, which illustrates a stereo
assembly drawing of the microphone package structure of the
preferred embodiment of the present invention. The package
structure comprises the main body 200, the substrate 210, the sound
processing unit 220, the bounding pad 230, the wire 240, and an
upper cap 270 containing an acoustic hole 272.
[0036] The connective area of the substrate 210 connects to the
connective area 271 of the upper cap (as the spotted area in the
FIG. 5). The upper surface of the connective area 210 of the
substrate has a rectangular trench 212 formed in it. Moreover, the
substrate 210 contains a circuit board with sound processing unit
220, and the necessary electronic connection would be done through
the wire 240 and the bounding pad 230. The shape of the trench 212
could be rectangular or circular. Besides, the upper cap 270 could
be a rectangle or some other shape.
[0037] Reference is made to FIG. 6, which illustrates a profile of
the microphone package structure of the preferred embodiment of the
present invention. Because of the separation height between the
trench 212 and the bounding pad 230 is maintained, a bolt-connected
structure would be connected between the four corners of the trench
212 and the upper cap 270 after the connection of the substrate 210
and the upper cap 270. It could provide a secure, stable connection
before the conductive paste 250 completely hardens.
[0038] Reference is made to FIG. 7, which illustrates a profile of
the microphone package structure of the preferred embodiment of the
present invention. The bottom of the trench 212 in FIG. 6 would be
transformed into an inclined plane outward from the substrate 210;
therefore there would be a new trench 213. Besides, an upper cap
280 comprises an acoustic hole 281, and the upper cap could be a
rectangle or some other shape.
[0039] The trench 213 maintains altitude fixed separation
difference from the bounding pad 230, and the downward incline of
the bottom could prevent short circuits caused by the conductive
paste 250 which is pressed by the upper cap 280 on the bounding pad
230. Also, the extra conductive paste 250 would be pressed to the
outside of the substrate 210. The shape of the trench 213 could be
rectangular or circular and the trench 213 is a concave inclined
plane which is connected to each other with the connective area of
the upper cap 280.
[0040] Reference is made to FIG. 8, which illustrates a top view of
the microphone package structure of the preferred embodiment of the
present invention. A main body 300 comprises a substrate 310, a
sound processing unit 320, a bounding pad 330 and a wire 340.
[0041] Four L-like trenches 311 are formed beneath the four corners
of the substrate 310. Moreover, the substrate 310 contains a
circuit board with sound processing unit 320, and the necessary
electronic connection would be done through the wire 340 and the
bounding pad 330. The trench forms an interval between the pairs
and secured by a bolt structure that is more secure than the
aforementioned mono-circular trench form (like the trench 212 and
213). Besides, the substrate 310 could be rectangular or
non-rectangle.
[0042] Reference is made to FIG. 9, which illustrates a stereo
assembly drawing of the microphone package structure of the
preferred embodiment of the present invention. These L-like
trenches 312 in the Figure are formed by inclining the connective
area of the substrate surface 310 downwards, and a protrusion
between the pairs of the trenches 312 exists in order to form a
bolt-connective structure of rectangular serration after the
connection of the upper cap 360 and the main body 310. This
provides better ability to connect than the circular trench 212 in
FIG. 5. Both the connective area of the trench 312 and upper cap
360 are interactive inclined planes, and the upper cap 360 includes
an acoustic hole 361 that could be rectangle or non-rectangle.
[0043] Reference is made to FIGS. 10 and 11, which illustrate a
stereo assembly drawing and a profile of the microphone package
structure of the preferred embodiment of the present invention. As
shown in the Figure, the L-like trench maintains a separation
difference with the bounding pad 330. After the upper cap 370 is
connected to the substrate 310 by the conductive paste 350,
although the bottom of the trench 313 is flat, the separation
distance between the bounding pad 330 and the trench 313 is enough
to prevent the extra conductive past 350 from being pressed to the
plane of the bounding pad 330, which would make an unnecessary
short circuit. Therefore, the separation difference provides a
stronger bolt-connective structure than the trench 312 in the FIG.
9. The upper cap 370 includes an acoustic hole 371 that could be
rectangle or non-rectangle.
[0044] Reference is made to FIG. 12, which illustrates a profile of
the microphone package structure of the preferred embodiment of the
present invention. The trenches of the substrate 310 are four
L-like trenches, and they not only are concave but also have an
inclined plane that matches the connective area of the upper cap
380. The upper cap 380 including an acoustic hole 381 could be
rectangle or non-rectangle.
[0045] When the upper cap 380 connects to the substrate 310, the
inclined plane structure decreases the opportunity for the
conductive paste 350 to be pressed by the upper cap 280 onto the
sound processing unit 220 plane. Thus, extra connective paste 350
would be pressed to the outside of the package structure, making it
easy to erase.
[0046] The trench 314 excludes extra connective paste 350, as the
trench 312 in FIG. 9, and also allows for a stronger bolt-connected
structure than the botl-connected structure for the trench 313 in
FIG. 10.
[0047] According to the composition and the embodiments above,
there are many advantages of the present invention over the prior
art, such as:
[0048] 1. In the current invention, a gap between the substrate and
the connective paste is maintained so that the connective paste
smeared on the surface of the trench will not easily be pressed
onto the bounding pad by the upper cap and create a short circuit
between the bounding pads.
[0049] 2. Around the sound processing unit is the connective area
of the upper cap and the substrate in the microphone package
structure, and the connective area is smeared with the connective
paste. Therefore, the increased effectiveness of a circular
electromagnetic shelter could be established, and it could not only
raise the durability of a microphone but also decrease the
maintenance cost.
[0050] 3. The structures of the lower part of the upper cap and the
surface of the trench are designed as a combination of the inclined
and flat plane. This design prevents the connective paste from
overflowing to the outside of the package structure and prevent a
short circuit being caused by the overflowing of the connective
paste effectively; moreover, the bolt-connected structure of the
substrate and upper cap would be more stable and stronger.
[0051] It will be apparent to those skilled in the art that various
modifications and variations can be made to the structure of the
present invention without departing from the scope or spirit of the
invention. In view of the foregoing, it is intended that the
present invention cover modifications and variations of this
invention provided they fall within the scope of the following
claims and their equivalents.
* * * * *