Huang; Chin-Ching

Patent Applications and Registrations

Patent applications and USPTO patent grants for Huang; Chin-Ching.The latest application filed is for "polysaccharide carbon nanogels and anticoagulants and antioxidants comprising the same".

Company Profile

3.10.10

Huang; Chin-Ching - Keelung City TW
Huang; Chin-Ching - Zhudong Township TW
Huang; Chin-Ching - Taichung TW
Huang; Chin-Ching - Taichung County TW
Huang; Chin-Ching - Taichung City TW
Huang; Chin-Ching - San Jose CA

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Polysaccharide Carbon Nanogels And Anticoagulants And Antioxidants Comprising The Same App 20220249541 - Mao; Ju-Yi ; et al.	2022-08-11
Chip package and manufacturing method thereof Grant 10,714,528 - Kuan , et al.	2020-07-14
Chip package and manufacturing method thereof Grant 10,347,616 - Kuan , et al. July 9, 2	2019-07-09
Chip Package And Manufacturing Method Thereof App 20190140012 - KUAN; Hsin ; et al.	2019-05-09
Chip Package And Manufacturing Method Thereof App 20170330871 - KUAN; Hsin ; et al.	2017-11-16
Package structure of a microphone Grant 7,884,467 - Huang , et al. February 8, 2	2011-02-08
Cap package for micro electro-mechanical system Grant 7,511,373 - Tien , et al. March 31, 2	2009-03-31
Package structure of a microphone App 20080285784 - Huang; Chin-Ching ; et al.	2008-11-20
Chip Package Capable Of Minimizing Electro-magnetic Interference App 20080164583 - Tien; Jiung-Yue ; et al.	2008-07-10
Cap Package For Micro Electro-mechanical System App 20080164594 - TIEN; Jiung-Yue ; et al.	2008-07-10
Cap Package For Micro Electro-mechanical System Capable Of Minimizing Electro-magnetic Interference App 20080164602 - TIEN; Jiung-Yue ; et al.	2008-07-10
Micro Electro-mechanical System Module Package Capable Of Minimizing Interference Of Noises App 20080079141 - Tien; Jiung-Yue ; et al.	2008-04-03
Package structure of a microphone App 20070182002 - Huang; Chin-Ching ; et al.	2007-08-09
Acoustic head structure of a microphone App 20070165898 - Huang; Chin-Ching ; et al.	2007-07-19
Multi-layered, integrated circuit package having reduced parasitic noise characteristics Grant 5,641,988 - Huang , et al. June 24, 1	1997-06-24
Multi-layered, integrated circuit package having reduced parasitic noise characteristics Grant 5,625,225 - Huang , et al. April 29, 1	1997-04-29
High performance package using high dielectric constant materials for power/ground and low dielectric constant materials for signal lines Grant 5,371,403 - Huang , et al. December 6, 1	1994-12-06
Package structure and method for reducing bond wire inductance Grant 5,371,321 - Hamzehdoost , et al. December 6, 1	1994-12-06
Technique for measuring thermal resistance of semiconductor packages and materials Grant 5,302,022 - Huang , et al. April 12, 1	1994-04-12
Lead and socket structures with reduced self-inductance Grant 5,138,431 - Huang , et al. August 11, 1	1992-08-11

uspto.report is an independent third-party trademark research tool that is not affiliated, endorsed, or sponsored by the United States Patent and Trademark Office (USPTO) or any other governmental organization. The information provided by uspto.report is based on publicly available data at the time of writing and is intended for informational purposes only.

While we strive to provide accurate and up-to-date information, we do not guarantee the accuracy, completeness, reliability, or suitability of the information displayed on this site. The use of this site is at your own risk. Any reliance you place on such information is therefore strictly at your own risk.

All official trademark data, including owner information, should be verified by visiting the official USPTO website at www.uspto.gov. This site is not intended to replace professional legal advice and should not be used as a substitute for consulting with a legal professional who is knowledgeable about trademark law.