Tien; Jiung-Yue
Patent Applications and Registrations
Patent applications and USPTO patent grants for Tien; Jiung-Yue.The latest application filed is for "package for mems microphone".
- Tien; Jiung-Yue - Taichung TW
- TIEN; Jiung-Yue - Taichung County TW
- Tien; Jiung-Yue - Tantzu TW
| Patent | Date |
|---|---|
| Package structure of a microphone Grant 7,884,467 - Huang , et al. February 8, 2 | 2011-02-08 |
| Package For Mems Microphone App 20090180655 - TIEN; Jiung-Yue ; et al. | 2009-07-16 |
| Cap package for micro electro-mechanical system Grant 7,511,373 - Tien , et al. March 31, 2 | 2009-03-31 |
| Package structure of a microphone App 20080285784 - Huang; Chin-Ching ; et al. | 2008-11-20 |
| Cap Package For Micro Electro-mechanical System App 20080164594 - TIEN; Jiung-Yue ; et al. | 2008-07-10 |
| Chip Package Capable Of Minimizing Electro-magnetic Interference App 20080164583 - Tien; Jiung-Yue ; et al. | 2008-07-10 |
| Cap Package For Micro Electro-mechanical System Capable Of Minimizing Electro-magnetic Interference App 20080164602 - TIEN; Jiung-Yue ; et al. | 2008-07-10 |
| Micro Electro-mechanical System Module Package Capable Of Minimizing Interference Of Noises App 20080079141 - Tien; Jiung-Yue ; et al. | 2008-04-03 |
| Package structure of a microphone App 20070182002 - Huang; Chin-Ching ; et al. | 2007-08-09 |
| Acoustic head structure of a microphone App 20070165898 - Huang; Chin-Ching ; et al. | 2007-07-19 |
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