U.S. patent application number 11/245867 was filed with the patent office on 2007-04-12 for carrier head with multiple chambers.
This patent application is currently assigned to Applied Materials, Inc.. Invention is credited to Thomas Brezoczky, Hung Chih Chen, Steven T. Mear, Steven M. Zuniga.
Application Number | 20070082589 11/245867 |
Document ID | / |
Family ID | 37911540 |
Filed Date | 2007-04-12 |
United States Patent
Application |
20070082589 |
Kind Code |
A1 |
Zuniga; Steven M. ; et
al. |
April 12, 2007 |
CARRIER HEAD WITH MULTIPLE CHAMBERS
Abstract
A system for chemical mechanical polishing having a carrier head
with pressurizeable chambers that can be configured into pressure
zones is described. The system includes a carrier head with a
membrane for contacting a substrate during polishing.
Pressurizeable chambers behind the membrane are in communication
with pressure inputs. The pressure inputs can each supply a
different pressure to the pressurizeable chambers. Some of the
pressurizeable chambers can be in communication with more than one
pressure input. Zones of pressure can be arranged, where each zone
includes one or more pressurizeable chambers. The zones can be
configurable by altering the pressurizeable chambers that make up
each zone.
Inventors: |
Zuniga; Steven M.; (Soquel,
CA) ; Chen; Hung Chih; (Sunnyvale, CA) ;
Brezoczky; Thomas; (San Jose, CA) ; Mear; Steven
T.; (Austin, TX) |
Correspondence
Address: |
APPLIED MATERIALS, INC.;PATENT COUNSEL
Legal Affairs Department
P.O. BOX 450A
Santa Clara
CA
95052
US
|
Assignee: |
Applied Materials, Inc.
|
Family ID: |
37911540 |
Appl. No.: |
11/245867 |
Filed: |
October 6, 2005 |
Current U.S.
Class: |
451/288 |
Current CPC
Class: |
B24B 49/16 20130101;
B24B 37/30 20130101 |
Class at
Publication: |
451/288 |
International
Class: |
B24B 29/00 20060101
B24B029/00 |
Claims
1. A carrier head for chemical mechanical polishing of a substrate,
comprising: a first passage configured to be connected to a first
pressure input and a second passage configured to be connected to a
second pressure input; a base assembly including the first and
second passages; and a flexible membrane coupled to the base
assembly and having a generally circular main portion with a lower
surface that provides a substrate-mounting surface, the volume
between the base assembly and the flexible membrane forming a
plurality of pressurizable chambers, wherein the first passage is
in communication with a first chamber of the plurality of
pressurizable chambers and the second passage is in communication
with a second chamber of the plurality of pressurizable chambers
and there is a greater number of pressurizable chambers than number
of passages into the carrier head.
2. The carrier head of claim 1, further comprising an inner
membrane that forms at least one of the plurality of pressurizable
chambers.
3. The carrier head of claim 1, further comprising a pressure
routing assembly within the base assembly that determines which
input is in communication with the chamber, wherein the pressure
routing assembly includes a plurality of valves, wherein each of
the plurality of valves is associated with one of the plurality of
pressurizable chambers.
4. The carrier head of claim 3, wherein the plurality of valves
include valves that are electronically controlled.
5. The carrier head of claim 3, wherein the plurality of valves
include solenoid valves.
6. The carrier head of claim 3, wherein the plurality of valves
include MEMS valves.
7. The carrier head of claim 3, wherein the carrier head has an
equal number of valves as number of pressurizable chambers.
8. The carrier head of claim 3, wherein the carrier head has a
greater number of pressurizable chambers than number of valves.
9. The carrier head of claim 3, wherein the valves are controllable
to create a plurality of pressure zones, wherein each zone includes
one or more of the plurality of pressurizable chambers.
10. The carrier head of claim 3, wherein the pressure routing
assembly is configured to couple either of the first passage or the
second passage to each chamber of the plurality of pressurizable
chambers.
11. The carrier head of claim 3, further comprising a valve
controller, wherein the valve controller controls each of the
plurality of valves between a first position and a second
position.
12. The carrier head of claim 1, wherein the carrier head further
comprises sectioning portions that are secured to the base
assembly, wherein the sectioning portions delineate sides of each
of the plurality of pressurizable chambers.
13. The carrier head of claim 12, wherein: the sectioning portions
are annular walls; and the plurality of pressurizable chambers are
annularly shaped.
14. The carrier head of claim 1, wherein the plurality of
pressurizable chambers are configured in a sectional formation.
15. The carrier head of claim 1, wherein the base assembly includes
a plate body, which includes a manifold, the manifold fluidly
coupling the first and second passages to the plurality of
pressurizable chambers.
16. A carrier head for chemical mechanical polishing of a
substrate, comprising: a first passage configured to be connected
to a first pressure input and a second passage configured to be
connected to a second pressure input; a base assembly including the
first and second passages; a flexible membrane coupled to the base
assembly and having a generally circular main portion with a lower
surface that provides a substrate-mounting surface, the volume
between the base assembly and the flexible membrane forming a
plurality of pressurizable chambers, wherein the first passage is
in communication with a first chamber of the plurality of
pressurizable chambers and the second passage is in communication
with a second chamber of the plurality of pressurizable chambers
and there is a greater number of pressurizable chambers than number
of passages into the carrier head, and wherein the base assembly
includes a plate body, which includes a manifold, the manifold
fluidly coupling the first and second passages to the plurality of
pressurizable chambers, the manifold being reconfigurable, such
that a coupling between a first pressurizable chamber to the first
passage can be changed to a coupling between the first
pressurizable chamber and the second passage.
17. The carrier head of claim 15, wherein the plate body is
connected to a part of the base assembly with a fastener.
18-28. (canceled)
29. A system for chemical mechanical polishing, comprising: the
carrier head of claim 1; and a drive shaft connected to the carrier
head, wherein the drive shaft is configured to rotate the carrier
head during polishing.
30. The carrier head of claim 16, wherein changing the coupling of
the first pressurizable chamber includes changing a valve
position.
31. The carrier head of claim 16, wherein the manifold is part of
the plate body and changing the coupling of the first pressurizable
chamber includes exchanging the plate body for a plate body having
a desired configuration.
32. The carrier head of claim 16, wherein the manifold includes
fluid conduits and changing the coupling of the first pressurizable
chamber includes changing a connection of a fluid conduit within
the manifold.
Description
BACKGROUND
[0001] This invention relates to carrier heads for controlling the
pressure applied to a substrate during chemical mechanical
polishing.
[0002] An integrated circuit is typically formed on a substrate by
the sequential deposition of conductive, semiconductive or
insulative layers on a silicon substrate. One fabrication step
involves depositing a filler layer over a non-planar surface, and
planarizing the filler layer until the non-planar surface is
exposed. For example, a conductive filler layer can be deposited on
a patterned insulative layer to fill the trenches or holes in the
insulative layer. The filler layer is then polished until the
raised pattern of the insulative layer is exposed. After
planarization, the portions of the conductive layer remaining
between the raised pattern of the insulative layer form vias, plugs
and lines that provide conductive paths between thin film circuits
on the substrate. In addition, planarization is needed to planarize
the substrate surface for photolithography because of limited depth
of focus of a lithography instrument.
[0003] Chemical mechanical polishing (CMP) is one accepted method
of planarization. This planarization method typically requires that
the substrate be mounted on a carrier or polishing head of a CMP
apparatus. The exposed surface of the substrate is placed against a
rotating polishing disk pad or belt pad. The polishing pad can be
either a "standard" pad or a fixed-abrasive pad. A standard pad has
a durable roughened surface, whereas a fixed-abrasive pad has
abrasive particles held in a containment media. The carrier head
provides a controllable load on the substrate to push it against
the polishing pad. A polishing liquid, such as a slurry including
abrasive particles, is supplied to the surface of the polishing
pad.
SUMMARY
[0004] The invention provides techniques for increasing the number
of apparent pressure chambers in a carrier head without a
proportionate increase in the number of pressure inputs to the
carrier head.
[0005] In general, in one aspect, the invention features a carrier
head for chemical mechanical polishing of a substrate. The carrier
head includes a first passage configured to be connected to a first
pressure input and a second passage configured to be connected to a
second pressure input. The carrier head also includes a base
assembly that includes the first and second passages. A flexible
membrane is coupled to the base assembly. The membrane has a
generally circular main portion with a lower surface that provides
a substrate-mounting surface. The volume between the base assembly
and the flexible membrane forms a plurality of pressurizable
chambers. Each of the first and second passages are in
communication with at least one of the plurality of pressurizable
chambers and there is a greater number of pressurizable chambers
than number of pressure inputs.
[0006] The carrier head may also include an inner membrane that
forms at least one of the plurality of pressurizable chambers. The
carrier head may also include a plurality of valves, such as
solenoid or MEMS valves, wherein each of the plurality of valves is
associated with one of the plurality of pressurizable chambers. The
valves can be electronically controlled. The carrier head can have
an equal number of pressurizable chambers as number of valves or a
greater number of pressurizable chambers than number of valves. The
valves can be controllable to create a plurality of pressure zones,
wherein each zone includes one or more of the plurality of
pressurizable chambers. The first and second passages can be
coupled to each of the plurality of pressurizable chambers. The
carrier head may also include a valve controller, wherein the valve
controller controls each of the plurality of valves between a first
position and a second position. The carrier head may have
sectioning portions that are secured to the base assembly, wherein
the sectioning portions delineate sides of each of the plurality of
pressurizable chambers. The sectioning portions can be annular
walls, thereby forming pressurizable chambers that are annularly
shaped. Alternatively, the pressurizable chambers can be configured
in a sectional configuration. The base assembly can include a plate
body, which includes a manifold, the manifold fluidly coupling the
first and second passages to the plurality of pressurizable
chambers. The manifold may be reconfigured, such that a coupling
between a first pressurizable chamber to the first passage can be
changed to a coupling between the first pressurizable chamber and
the second passage. The plate body can be connected to a part of
the base assembly with a fastener.
[0007] In another aspect, the invention is directed to a component
for a carrier head having a plate body. The plate body has a
plurality of chamber areas along a bottom surface. A plurality of
passages extend through the plate body, each passage for connecting
a pressure input to at least one of the chamber areas, wherein a
number of pressure inputs connected through the plate body is less
than a number of chamber areas.
[0008] The plate body may have a manifold for connecting a passage
to a chamber area. The manifold may be configurable such that in
one configuration the manifold determines a first mapping between
passages and chamber areas and in a second configuration the
manifold determined a second mapping between passages and chamber
areas, such that the first mapping is different from the second
mapping.
[0009] In yet another aspect, the invention is directed to a method
of forming a carrier head. A base assembly with a first passage and
a second passage is provided, where the first passage is configured
to be in fluid communication with a first pressure source and a
second passage is configured to be in fluid communication with a
second pressure source. A substrate backing assembly with a
plurality of chambers is provided, wherein a number of chambers is
greater than a number of pressure sources. The first passage is
coupled to at least a first chamber and a second chamber where a
connection between the first passage and the first and second
chambers is configurable such that the first passage is in fluid
communication with one of the first chamber, the second chamber or
both chambers.
[0010] Coupling the first passage to at least a first chamber and a
second chamber may include coupling the first passage to a valve
that has an output in fluid communication with at least one of the
first or second chambers. Providing a substrate backing assembly
may include providing a substrate backing assembly having a desired
manifold design and coupling the first passage to at least a first
chamber and a second chamber may include coupling the substrate
backing assembly to the base.
[0011] In another aspect, the invention is directed to a method of
using a carrier head. A substrate is retained under a carrier head
so that a front side of the substrate is in contact with a
polishing surface. The carrier head includes a substrate backing
assembly that applies pressure to a backside of the substrate. The
substrate backing assembly includes a plurality of chambers,
wherein a chamber is in communication with a first pressure input.
Pressure is applied to the backside of the substrate, such that the
chamber is pressurized to a pressure applied by the first pressure
input. A relative motion is created between the substrate and the
polishing surface. The chamber is then caused to be in fluid
communication with a second pressure input and not in communication
with the first pressure input.
[0012] Causing the chamber to be in communication with a second
pressure input can include sending an electrical signal to a valve
to cause the valve to change. The method can include continuing to
polish the substrate after causing the chamber to be in
communication with a second pressure input. The substrate backing
assembly may include a first manifold and causing the chamber to be
in communication with a second pressure input may include changing
the first manifold for a second manifold.
[0013] In yet another aspect, the invention includes a method of
forming a component of a carrier head. A plate body is formed with
a plurality of passages for connecting to a plurality of pressure
inputs and a plurality of chamber areas. The chamber areas are on a
bottom surface of the plate body and a number of pressure inputs is
less than a number of chamber areas.
[0014] Implementations of this invention may include one or more of
the following advantages. As compared to a conventional
multi-chambered carrier head, the number of apparent pressure
chambers in a carrier head may be increased without a proportionate
increase in the number of pressure inputs to the carrier head.
Alternatively, the number of pressure inputs may be reduced while
maintaining the same number of chambers. By limiting the number of
pressure inputs that are required to make a configurable carrier
head system, the system may be simpler than a carrier head that
requires more pressure inputs. A simpler carrier head system may
require fewer parts and be easier to build and maintain. Chambers
may be grouped to form a set of chambers controlled by a common
pressure input, and the members of the set may be configurable. The
configuration may be selected by software, and may be changed
in-situ during polishing or between polishing operations. The
pressure distribution system may be used with many different
membrane configurations. The carrier head is adaptable to a variety
of polishing processes and parameters. Due to the improved
flexibility of being able to change configurations, polishing
uniformity may be increased, and yield may be improved. The ability
to have a selection of zone configurations and to change between
different zone configurations may result in better resolution on
polishing control. Greater control over the polishing process may
result in higher die yield. There may be a limit to the number of
zones that can be fit into a membrane assembly. There may be a
limit to the number of pneumatic ports in a drive shaft. For any
given number of input inputs, more control over the polishing
profile may be obtained by adding a chamber to a carrier head
assembly and without adding an additional pressure input. The
methods and assemblies described herein may be used with existing
carrier head structures.
[0015] The details of one or more embodiments of the invention are
set forth in the accompanying drawings and the description below.
Other features, objects, and advantages of the invention will be
apparent from the description and drawings, and from the
claims.
DESCRIPTION OF DRAWINGS
[0016] FIGS. 1A and 1B show a schematic of cross section of a
substrate carrier head.
[0017] FIG. 2 is a schematic of pressure chambers that are each
associated with a valve for digital control.
[0018] FIG. 3 is a schematic of configurable pressure zones.
[0019] FIG. 4 is a schematic of a carrier head having multiple
zones.
[0020] FIG. 5 is a perspective top view of a plate body.
[0021] FIG. 6 is a cross-sectional view of a portion of a plate
body.
[0022] FIG. 7 is a schematic of the pressure zones in the carrier
head of FIG. 4.
[0023] FIG. 8 is a schematic of a membrane with a segmented zone
structure.
[0024] Like reference symbols in the various drawings indicate like
elements.
DETAILED DESCRIPTION
[0025] Referring to FIGS. 1A and 1B, one embodiment of a carrier
head 100 is described.
[0026] The carrier head 100 includes a housing 102, a base assembly
104, a gimbal mechanism 106 (which may be considered part of the
base assembly), a loading chamber 108, a retaining ring 110, and a
substrate backing assembly 112 which includes pressurizable
chambers. A description of a similar carrier head may be found in
U.S. Pat. No. 6,183,354, filed May 21, 1997, U.S. Pat. No.
6,857,945, filed Nov. 13, 2000, and U.S. patent application No.
10/810,784, filed Mar. 26, 2004, U.S. Pat. No. 6,764,387, filed
Mar. 7, 2003, the entire disclosures of which are incorporated
herein by reference.
[0027] The housing 102 can be generally circular in shape and can
be connected to a drive shaft to rotate therewith during polishing.
A vertical bore 120 may be formed through the housing 102, and,
optionally, one or more additional passages 122 (only one is shown)
may extend through the vertical bore 120 for pneumatic control of
the carrier head. A cylindrical annular flange 125 can extend
downwardly from the housing 102, and a cylindrical portion 106a of
the gimbal 106 extends upward outside flange 125 to restrain the
base assembly 104 from lateral motion while permitting the base
assembly 104 to move vertically. O-rings 124 may be used to form
fluid-tight seals between the passages through the housing and
passages through the drive shaft. Electrical wires 204 can also
extend through the vertical bore 120, allowing electrical signals
to be transmitted to components within the base assembly 104.
Alternatively, the electrical wires 204 can extend into the base
assembly 104 through another part of the carrier head.
[0028] The base assembly 104 is a vertically movable assembly
located beneath the housing 102. The base assembly 104 includes a
plate body 130, an outer clamp ring 134, and the gimbal mechanism
106. An inner edge of a generally ring-shaped rolling diaphragm 126
may be clamped to the housing 102 by an inner clamp ring 128, and
an outer edge of the rolling diaphragm 126 may be clamped to the
base assembly 104 by the outer clamp ring 134 to form the loading
chamber 108 between the housing 102 and the base assembly 104 to
apply a load, i.e., a downward pressure, to the base assembly 104.
The vertical position of the base assembly 104 relative to the
polishing pad is also controlled by the loading chamber 108. A
pressurizable chamber 208 can apply pressure to the substrate
backing assembly 112.
[0029] The substrate backing assembly 112 includes a flexible
membrane 140 with a generally flat main portion 142. A lower
surface 144 of the main portion 142 provides a mounting surface for
a substrate. The volume between the main portion 142 of the
membrane and the base assembly 104 is divided into a plurality of
chambers. In the implementation shown, the volume is divided by
concentric annular walls 150, 152, 154, 156, 158, 160, 162, 164 and
166 that extend from the main portion 142 of the membrane 140. An
outermost wall 168 is clamped between the base assembly 104 and the
retaining ring 110. The other walls can be clamped to the base
assembly 104 with clamp rings. The walls can be an integral part of
the membrane, can be formed from a separate body and attached to
the backside of the membrane or not attached to the membrane.
Although ten annular walls are shown, there can be more or fewer
walls, as determined by the desired number of chambers. Other
carrier head configurations can be used to form the chambers, such
as a carrier head with additional membranes or bladders between the
membrane 140 and the base assembly 104. A description of a such
membrane configurations may be found in U.S. Pat. No. 6,722,965,
filed Jun. 10, 2001, and in U.S. Pat. No. 6,183,354, filed May 21,
1997, which are incorporated herein by reference.
[0030] The volume between the base assembly 104 and the membrane
140 that is sealed within the first wall 150 provides a first
circular chamber 172. The volume between the base assembly 104 and
the membrane 140 that is sealed between the first wall 150 and the
second wall 152 provides a second pressurizable annular chamber 174
surrounding the first chamber 172. Similarly, the volume between
the other adjacent pairs of walls provide additional annular
chambers 176-190. Each chamber can be wider, narrower or the same
width as an adjacent chamber. The annular chambers can each have a
consistent width, thus the annular configuration can create
polishing zones of uniform radial width around the substrate.
Although particular chamber configurations are described herein,
virtually any desired chamber configuration or zone configuration
can be used. A chamber is defined by the physical structure of a
membrane or membranes, the carrier head, or the substrate backing
assembly 112. A zone includes one or more chambers and can be
configurable, based on how many chambers are included in the zone
at any time.
[0031] As described further below, the chambers can be fluidly
coupled to multiple pressure sources (not shown), such as pneumatic
inputs, pumps, or pressure or vacuum lines. The coupling can be
adjustable so that the chamber is only open to one pressure source
at a time. If each chamber is separated from the other chambers,
fluid does not readily pass from one chamber to another. However,
sets of chambers can be fluidly coupled to one another, even
temporarily. The chambers can be pressurized to different
pressures. Each chamber or set of contiguous chambers that is at
the same pressure makes up a zone. A 1:1 mapping of pressure inputs
to chambers is not required. In fact, the carrier head can have
fewer inputs than chambers.
[0032] The base assembly 104 includes a pressure routing assembly
133 for controlling which chambers are fluidly coupled to which
pressure sources. The pressure routing assembly 133 can be mounted
on the plate body 130 or be within the plate body 130. The pressure
routing assembly 133 can be fluidly coupled to the pressure sources
by the vertical bore 120 or passages 122 through the housing 102.
Similarly, each chamber 172-190 is fluidly connected to the
pressure routing assembly 133 by an associated passage 131 through
the plate body 130. Any of the fluid couplings can include tubing,
such as flexible or rigid tubing, or simply be a channel through
the base assembly 104 or plate body 130.
[0033] The pressure routing assembly 133 can include a component
that has valves 216 or a manifold without valves that control the
connections between the passages 131 and the passages 122 so as
determine which chambers 172-190 are coupled to which pressure
sources. Only one valve 216 is shown in a valve supporting
component 212, although the valve supporting component 212 can
include many valves. The pressure routing assembly 133 can also
include a manifold with a fixed pressure routing and valves, that
is, a hybrid between the valve supporting component and a manifold.
The pressure routing assembly 133 can be configurable (i.e., the
connections of the passages 131 to the passages 122 can be
adjusted) or non-configurable (i.e., the connections are fixed). In
particular, for at least one pressure source, the pressure routing
assembly 133 can connect multiple chambers to the input for that
pressure source. Thus, the number of pressure inputs to the
pressure routing assembly 133 can be less than the number of
chambers.
[0034] Equivalently, at least two of the chambers can be connected
to a common pressure source.
[0035] The chambers need not be contiguous chambers. A housing 218
can cover each of the valves.
[0036] If the pressure routing assembly is configurable, in some
implementations the configuration can be changed without removing
the pressure routing assembly 133 from the carrier head (and in
some implementations the configuration can be changed during a
polishing operation), whereas in some implementations the pressure
routing assembly 133 may need to be removed to modify the
configuration. If the pressure routing assembly 133 is
configurable, then the set of chambers that are coupled to the
common pressure source can be changed.
[0037] With separate chambers or groups of chambers the
pressurization and load applied by the associated portion of the
flexible membrane 140 on the substrate can be independently
controlled. This permits different pressures to be applied to
different regions of the substrate during polishing, thereby
compensating for non-uniform polishing rates or for non-uniform
thickness of the incoming substrate.
[0038] During polishing, the pressure in the chambers can be
increased or decreased to change the amount of pressure applied to
a corresponding area of a substrate. The amount of pressure applied
can be changed by introducing fluid into or removing fluid from the
chamber. The chambers can be grouped into zones of pressure, such
that each zone includes one or more chambers. Thus, a substantially
uniform pressure can be applied across a particular zone. By
changing the setting of a valve or the routing of a manifold, the
specific chambers belonging to each zone can be changed. Because
any or all of the chambers can be pressurized to different
pressures, a mechanism for maintaining the overall pressure applied
to the substrate can be included in the carrier head. In one
implementation, changing the downward force applied by the
pressurizeable chamber 208 can keep the overall pressure applied to
a substrate constant and compensate for changes in pressure that
are applied at individual chambers.
[0039] In one implementation, the pressure routing assembly
includes valves to control which chamber belongs to which zone, and
the position of each valve can be changed by an input while the
carrier head remains secured to the drive shaft. For this
implementation, electrical wires 204 in the carrier head can carry
a signal from a controller to the valves. The controller can
include software, such as a software-implemented polishing recipe.
Such a recipe can include a set of polishing parameters, such as
time, speed, slurry rate and pressure, and can also include the
time at which each valve is switched to connect the desired
pressure source with at least one of the chambers. The controller
can be a part of or be in communication with a computer system,
such as a computer system including instructions operable to send
signals to open or close the valves. The computer system can be
programmed with the recipe for changing the state of the valves,
i.e., open to closed or closed to open. Alternatively, the computer
system can receive feedback from a monitoring system that measures
the film thickness or the amount of material removed by polishing.
The substrate measurements can be used to determine whether the
valves are to be opened or closed based on the feedback. The
controller can also accept commands, such as commands input by a
user, and transmit signals to the valve assembly that implements
the commands. The state of the valves can be changed during
polishing of a substrate or between polishing substrates.
[0040] In another implementation, the pressure routing assembly
includes valves to control which chamber belongs to which zone, but
the position of each valve must be modified mechanically. For
example, to adjust the valves the carrier head can be removed from
the drive shaft so that the pressure routing assembly can be
accessed, and the valves can be adjusted manually. In this
implementation, the zone can be changed by an input while the
pressure routing assembly remains secured to the plate 130.
[0041] Referring to FIG. 2, in one embodiment (which is applicable
to either implementation noted above), the carrier head can include
two passages, where one passage 122a is connected to a relatively
high pressure source 220 and the other passage 122b is connected to
a relatively low pressure source 210. The pressure routing assembly
133 includes valves 232-250, e.g., solenoid valves or MEMS valves,
for each chamber 172-190. Each chamber 172-190 can be alternately
coupled to one of the passages 122aor 122b by the associated valves
232-250. Thus, each valve 232-250 can be switched between allowing
fluid to pass from the high pressure source 220 to the associated
chamber and allowing fluid to pass from the low pressure source 210
to the associated chamber. At any given time, each chamber is at
one of the two pressures.
[0042] As many zones can be formed behind the substrate as there
are chambers. At the other extreme, the same pressure can be
applied across the back of the substrate, forming one large zone.
The chambers can be at any desired pressure, such as between about
0.1 psi (gauge) up to 6 psi (gauge) or even higher. In one
implementation, chambers connected to the high pressure input are
around 3.0 psi (gauge), while chambers connected to the low
pressure input are around 2.0 psi (gauge). In another
implementation, the difference between the pressure in the high and
low pressure inputs is between 10-20%. In some systems, a smaller
pressure differential between adjacent chambers, or adjacent zones,
causes the carrier head to perform better than when there is a
large pressure differential between chambers or zones. However, the
chambers can be adjusted to any desired pressure.
[0043] Referring to FIG. 3, in another embodiment (which is
applicable to any of the implementations noted above), not every
chamber has an associated valve. In this embodiment, chambers 176,
180, 184, 188 are connected to associated valves 284, 286, 288,
290, whereas chambers 172, 174, 178, 182, 186 and 190 are connected
directly to pressure sources 262, 264, 266, 268, 270 and 272,
respectively. Each valve can connect its associated chamber to one
of the two pressure sources. For example, chambers 174 and 178 are
connected to pressure sources 264 and 266, respectively, and
chamber 176 can be connected by valve 284 to either pressure source
264 or 266. The central chamber 172 may have a dedicated pressure
source 262. Thus, each zone may include one, two or three
chambers.
[0044] With four valves each having two inputs, sixteen
configurations are possible. Thus, with six inputs and four valves,
a carrier head with a membrane having ten chambers can be
configured as sixteen different six-chamber carrier heads. A few
examples of zone configurations possible with the implementation of
FIG. 3 are shown in table 1 below. TABLE-US-00001 TABLE 1 Inputs
262 264 266 268 270 272 Configuration 1 172 174 176, 180, 184, 188,
178 182 186 190 2 172 174, 178, 182, 186, 190 176 180 184 190 3 172
174 176, 182 184, 190 178, 186, 180 188 4 172 174, 178 180, 186
188, 176 182, 190 184
[0045] In general, the number of zones that can be configured is
determined by the number of valve positions (X) to the power of the
number of valves (Y), or X.sup.y. The valves can have two settings.
However, other types of valves, such as valves capable of routing
more than two inputs, can also be used.
[0046] FIG. 4 shows another implementation of a carrier head having
multiple zones. The carrier head can include many of the same or
similar components as the carrier head in FIG. 1, such as a housing
102, a base assembly 104, a gimbal mechanism 106, passages 122 and
a flexible membrane 140. However, the pressure routing assembly
does not includes valves, but instead includes a manifold 310 to
couple the chambers 172-190 to two or more pressure inputs (not
shown). The manifold 310 can be a part of the plate body 130. If
the manifold 310 is part of the plate body 130, the manifold 310
configuration can be changed by exchanging the plate body 130 for
another plate body with a manifold 310 having the desired
configuration. As shown, a portion of the plate body 130, a
membrane support 192, can be removed from the rest of the plate
body 130 and exchanged for a membrane support 192 with the desired
configuration. Alternatively, the manifold 310 can be removable
from or changeable within the plate body 130. The manifold 310 may
be changeable by changing the connection of a fluid conduit, such
as a tube, or by replacing the entire manifold 310. A manifold 310
coupling two or more pressure inputs to a single chamber can also
be changed by opening one of the connections to a pressure input
while closing the other connections off. With any type of manifold
310, the plate body 130 or a portion of the plate body 130 can be
removed from the carrier head to make any desired changes.
[0047] Referring to FIG. 5, in one implementation, the manifold 310
is formed in the plate body 130. The plate body 130 can have input
holes 135 leading to flexible tubing 103. The flexible tubing 103
leads inside the plate body 130 to the manifold 310 located inside
the body. The plate body 130 fits snug with the base 104, so that
passages 122 are in fluid communication with flexible tubing 103
through holes 135. The flexible tubing 103 leads to the manifold
310. The portion of the carrier head that is removed for changing
the hardware configuration can be attached to the carrier head with
a fastener, such as a screw or other fastener that allows for
replacement. The plate body 130 can include holes 137 for receiving
the fasteners.
[0048] Referring to FIG. 6, the flexible tubing 103 is in fluid
communication with a tube 260 of the manifold 310. The tube 260 is
in communication with a chamber 190. The tube 260 can lead to a
chamber area. The chamber 190 may not be a complete chamber without
a membrane or other substrate backing member covering the chamber
area.
[0049] In one embodiment of a carrier head having a manifold (and
thus applicable to the implementation described with reference to
FIGS. 4-6), the zones can be hardware configured, as shown in FIG.
7. Here, a manifold 310a determines the configuration of the
pressure zones rather than valves. A first pressure input 360 can
be connected to first 402 and second chambers 404. A second
pressure input 370 can be connected to the second 404, third 406
and fourth 408 pressure chambers. A third pressure input 380 can be
connected to the fourth 408, fifth 410 and sixth 412 pressure
chambers. A fourth pressure input 390 can be connected to the sixth
412 seventh 414 and eighth 416 pressure chambers. Of the chambers
404, 408, 412 that have two pressure inputs, the manifold design
can determine which pressure is routed to the chamber. By altering
the manifold, eight possible combinations are available with the
arrangement shown in FIG. 7.
[0050] Many different membranes can be used with the above
disclosed chamber control methods. For example, in the
implementations described above, the membrane is a single external
membrane with a single-flexure for attaching to the base assembly.
An inner membrane or bladder or other member of the substrate
backing assembly can form the chambers. The outer membrane is not
necessary for creating a carrier head with configurable zones. The
outer membrane can serve to keep the member that defines the
chambers from wearing out or becoming contaminated. The outer
membrane may be simpler to replace than multiple inner membranes, a
membrane with a complex attachment scheme or other types of
assemblies that form multiple chambers. In other implementations,
the carrier head includes a dual membrane, with an outer membrane
and one or more inner membranes that apply pressure to the inner
surface of the outer membrane. A similar carrier head is disclosed
in U.S. Pat. No. 6,722,965, filed Jun. 10, 2001, which is
incorporated herein by reference. In addition, the membrane can
have a dedicated edge-control zone. The rate of polishing tends to
be the most non-uniform at the edge of the substrate, making
edge-control useful in achieving a uniformly polished substrate.
The membranes can have walls, as described above, or separate
chambers can be formed by bladders.
[0051] As another example, in the implementations described above,
the chamber and thus the associated zones are radially symmetric.
However, the membrane can have a cellular zone structure for
asymmetric profile control. The asymmetric profile can be achieved
by applying more pressure in one chamber, but not applying the same
pressure in an annular zone. For example, as shown in FIG. 8, the
sectional structure 1000 can have a central chamber 1002 surrounded
by annular rings 1006, 1008 that are divided along the radii 1004
of the membrane to form chambers. A cellular configuration can
include a multitude of cells, similar to a honeycomb. Other
membrane configurations with different numbers of chambers can also
be used. A membrane with a sectional structure 1000 or a cellular
configuration can allow for adjusting asymmetry in the substrate
profile.
[0052] The ability to configure the zones of pressure applied to a
substrate during processing can improve the substrate planarizing
process. Because planarizing a substrate can cause portions of the
substrate to be polished away more quickly than other portions,
such as the center, controlling the planarizing process through
selectively applying pressure to different areas of the substrate
during polishing can assist in achieving a more planar substrate
surface. Polishing can occur at different rates across the surface
of the substrate. Also, as the characteristics of the carrier head
assembly change, such as due to wear, polishing rates at various
areas across the substrate can change from substrate to substrate,
even with a very stable polishing method. Changing the pressure
applied to one area or another of a substrate during polishing can
compensate for these changes. However, increasing the number of
areas to which pressure can be applied can increase the number of
pressure inputs required in the carrier head.
[0053] Adding a pressure routing assembly can increase the
flexibility of a carrier head with respect to applying pressure to
select portions of a substrate during polishing. The pressure
routing assembly can enable just a few pressure inputs to be used
with a greater number of chambers that are associated with a
membrane. The pressure routing assembly can also allow for changing
the association between a chamber and a pressure input, such as by
changing a valve or changing a connection, such as a tube or
manifold.
[0054] A pressure routing assembly that includes valves can be
changed during polishing. This can allow for software control of
the pressure applied to different areas of a substrate. Using a
valve to control the pressure input to any number of chambers can
allow for as few as two pressure inputs into a carrier head while
still providing the flexibility of applying a different pressure to
more than two different areas of the substrate during polishing.
Further, the size of a pressure zone can be changed during
polishing. Fewer pressure inputs than chambers can simplify the
carrier head. Almost any type of chamber structure, such as
annular, sectional or cellular, can be used in combination with a
valve controlled pressure routing assembly.
[0055] A combination of valves and dedicated passages leading to
chambers also decreases the number of pressure inputs versus to the
number of chambers when compared to a carrier head with a separate
pressure input for each chamber. That is, there can be more
chambers than pressure inputs. The combination of valves and
dedicated passages reduces the number of valves used in the
pressure routing assembly. Fewer valves decreases the number of
working parts that can potentially fail. Chambers of the same
pressure can be grouped into independently pressurizable zones. The
chambers in communication with a valve can be moved from one zone
to another zone, making the zones configurable. The zone
configurations can be changed during polishing or between polishing
substrates. The ability to configure the zones during polishing can
increase the control over the polishing process.
[0056] With a manifold system, no valves are between the pressure
input and the chambers. Therefore, there are no valves that can
potentially fail. Also, no electronics are required within the
carrier head, because there are no electrically controlled
components, such as valves, to control. The plate body can be
removed from the carrier head to change the configuration, such as
by changing connections between the chambers and the pressure
inputs, or exchanging one plate body for another plate body having
the desired manifold configuration.
[0057] The configurations of the various elements in the carrier
head, such as the relative sizes and spacings, the retaining ring,
the base assembly, or the walls in the flexible membrane are
illustrative and not limiting. The carrier head could be
constructed without a loading chamber, and the base assembly and
housing can be a single structure.
[0058] A carrier head, as described above, can be used to planarize
a substrate by controlling the motion of a substrate relative to a
polishing surface. During polishing, a substrate is in contact with
the lower surface of the membrane. The carrier head holds the
substrate against the polishing surface. The carrier head can move
the substrate with respect to the polishing surface, such as by
rotating and translating across the polishing surface. The relative
movement causes the polishing surface to wear away the uppermost
layer of the substrate. Because of the non-uniform rate of
polishing that can occur, and the potentially non-uniform surface
of the incoming substrate, different pressures can be applied in
each chamber to locally increase or decrease the rate of
polishing.
[0059] During polishing, at any areas that are being polished too
quickly the pressure can be reduced by switching to a lower
pressure input. Alternatively, the substrate can be measured
post-polishing at an in-line measuring station to determine whether
the polishing parameters need to be adjusted for continued
polishing of the substrate or for polishing of the subsequent
substrate. With in situ monitoring, the zones can be altered
throughout polishing. Concurrent with the pressure being altered in
the individual chambers, the overall pressure applied to the
substrate can be changed by applying a downward pressure on the
substrate backing assembly.
[0060] When the substrate is sufficiently planarized, the relative
movement is ceased, and the carrier head removes the substrate from
the polishing surface, such as by lifting the substrate away and
transferring the substrate to an load and unload station, a rinsing
tank or a subsequent polishing surface in a series.
[0061] With the techniques described above, as compared to a
conventional multi-chambered carrier head, the number of apparent
pressure chambers in a carrier head can be increased without a
proportionate increase in the number of pressure inputs to the
carrier head. Alternatively, the number of pressure inputs may be
reduced while maintaining the same number of chambers. Chambers may
be grouped to form a set of chambers controlled by a common
pressure input, and the members of the set may be configurable. The
configuration can be selected by software, and can be changed
in-situ during polishing or between polishing operations. The
pressure distribution system can be used with many different
membrane configurations. The carrier head is adaptable to a variety
of polishing processes and parameters. Even with methods that
result in relatively reproducible results from polishing one
substrate to a next substrate, the carrier head components can wear
and the polishing surface can wear. This wearing changes the
polishing characteristics across the substrate over time. Control
over the inputs at various zones across the substrate can
compensate for these changes. The ability to have a selection of
zone configurations and to change between different zone
configurations may result in better resolution on polishing
control. Greater control over the polishing process may result in
higher die yield. Uniform film thickness or uniform clearing of a
film, such as a copper film, in specific areas may be achieved. Due
to the improved flexibility of being able to change configurations,
polishing uniformity may be increased, and yield may be
improved.
[0062] There can be a limit to the number of pneumatic ports in a
drive shaft. For any given number of input inputs, more control
over the polishing profile may be obtained by adding a chamber to a
carrier head assembly and without adding an additional pressure
input. Also, the methods and assemblies described herein can be
used with existing carrier head structure can be used with some
existing carrier heads. By limiting the number of pressure inputs
that are required to make a configurable carrier head system, the
system may be simpler than a carrier head that requires more
pressure inputs. A simpler carrier head system can require fewer
parts and be easier to build and maintain.
[0063] A number of embodiments of the invention have been
described. Nevertheless, it will be understood that various
modifications may be made without departing from the spirit and
scope of the invention. For example, each of the pressure inputs
can supply a different pressure from one another, or the pressure
inputs can be adjusted to apply the same pressure. The carrier head
needs as few as three chambers, but can have as many chambers as
can fit in the span across the back of a substrate. In some
embodiments, the chambers can be delineated by o-rings, rather than
walls of a membrane. Accordingly, other embodiments are within the
scope of the following claims.
* * * * *