U.S. patent application number 11/216395 was filed with the patent office on 2007-03-01 for semiconductor structures with body contacts and fabrication methods thereof.
This patent application is currently assigned to International Business Machines Corporation. Invention is credited to Kangguo Cheng, Ramachandra Divakaruni, Jack Allan Mandelman.
Application Number | 20070045698 11/216395 |
Document ID | / |
Family ID | 37802847 |
Filed Date | 2007-03-01 |
United States Patent
Application |
20070045698 |
Kind Code |
A1 |
Cheng; Kangguo ; et
al. |
March 1, 2007 |
Semiconductor structures with body contacts and fabrication methods
thereof
Abstract
A semiconductor structure for a dynamic random access memory
(DRAM) cell array that includes a plurality of vertical memory
cells built on a semiconductor-on-insulator (SOI) wafer and a body
contact electrically coupling a semiconductor body and a
semiconductor substrate of the SOI wafer. The semiconductor body
includes a channel region for the access device of one of the
vertical memory cells. The body contact, which extends through a
buried dielectric layer of the SOI wafer, provides a current
leakage path that reduces the impact of floating body effects upon
the vertical memory cell. The body contact may be formed by etching
a via that extends through the semiconductor body and buried
dielectric layer of the SOI wafer and extends into the substrate
and partially filling the via with a conductive material that
electrically couples the semiconductor body with the substrate.
Inventors: |
Cheng; Kangguo; (Beacon,
NY) ; Divakaruni; Ramachandra; (Ossining, NY)
; Mandelman; Jack Allan; (Flat Rock, NC) |
Correspondence
Address: |
WOOD, HERRON & EVANS, L.L.P. (IBM)
2700 CAREW TOWER
441 VINE STREET
CINCINNATI
OH
45202
US
|
Assignee: |
International Business Machines
Corporation
Armonk
NY
|
Family ID: |
37802847 |
Appl. No.: |
11/216395 |
Filed: |
August 31, 2005 |
Current U.S.
Class: |
257/301 |
Current CPC
Class: |
H01L 27/10864 20130101;
H01L 27/1203 20130101; H01L 27/10841 20130101; H01L 27/10891
20130101; H01L 27/0218 20130101 |
Class at
Publication: |
257/301 |
International
Class: |
H01L 27/108 20060101
H01L027/108 |
Claims
1. A semiconductor structure comprising: a semiconductor wafer
including a semiconductor substrate, a semiconductor layer with a
plurality of semiconductor bodies, and a buried dielectric layer
separating said semiconductor substrate from said semiconductor
layer; a plurality of memory cells built in an array on said
semiconductor wafer, each of said memory cells including a storage
capacitor and an access device, and said access device including a
vertical channel region defined in one of the semiconductor bodies
and a gate configured to switch current flow through said vertical
channel region to said storage capacitor; and a body contact of an
electrically conductive material extending through said buried
dielectric layer, said body contact having a first end electrically
connected with one of said semiconductor bodies and a second end
electrically connected with said semiconductor substrate.
2. The semiconductor structure of claim 1 further comprising: an
insulator-filled trench electrically isolating a pair of said
memory cells from adjacent memory cells in said array, said body
contact extending substantially through said dielectric layer
between said pair of said memory cells.
3. The semiconductor structure of claim 2 further comprising: a
first word line electrically coupled with said gate of one of said
pair of said memory cells; and a second word line positioned
between said pair of said memory cells, said body contact being
aligned vertically with said second word line.
4. The semiconductor structure of claim 1 further comprising: a via
extending through said semiconductor body and said buried
dielectric layer and into said semiconductor substrate, said via
being partially filled by said body contact; and a sidewall spacer
with said via and separating said body contact from the
corresponding one of said semiconductor bodies.
5. The semiconductor structure of claim 4 wherein said access
device of each of said memory cells further includes a source/drain
region electrically coupled with said storage capacitor, and said
sidewall spacer is positioned between said source/drain region and
said body contact.
6. The semiconductor structure of claim 5 wherein said sidewall
spacer comprises an isolation collar of an insulating material.
7. The semiconductor structure of claim 6 wherein said body contact
includes a first region and a second region spaced within said via
by said isolation collar from said first region.
8. The semiconductor structure of claim 7 wherein said body contact
includes a third region electrically coupling said first and second
regions and positioned within said via inside said isolation
collar.
9. The semiconductor structure of claim 1 wherein said
semiconductor body is formed from a semiconductor material, and
further comprising: a via extending through the corresponding one
of said semiconductor bodies and the buried dielectric layer and
extending into the semiconductor substrate, said body contact being
positioned within said via; an insulating layer within said via and
overlying said body contact; and a plug of said semiconductor
material within said via and separated from said body contact by
said insulating layer, said plug filling said via such that said
semiconductor body has an interface with the semiconductor
body.
10. The semiconductor structure of claim 9 wherein said access
device of each of said memory cells further includes a source/drain
region electrically coupled by said vertical channel region with
said storage capacitor when said gate is switched to permit current
flow through said vertical channel region to said storage
capacitor, said source/drain region extending into said
semiconductor body and into said plug.
11. The semiconductor structure of claim 1 wherein each of said
memory cells comprises an eight square feature dynamic random
access memory (DRAM) memory cell.
12. A method for forming a semiconductor structure in a
semiconductor wafer including a semiconductor substrate, a
semiconductor layer with a plurality of semiconductor bodies, and a
buried dielectric layer separating the semiconductor substrate from
the semiconductor layer, the method comprising: building a
plurality of vertical memory cells each in a corresponding one of a
plurality of trenches in the semiconductor wafer; forming a via
extending through one of the semiconductor bodies and the buried
dielectric layer and extending into the semiconductor substrate;
and at least partially filling the via with a plug of an
electrically conductive material that extends through the buried
dielectric layer to define a body contact having a first end
electrically connected with the semiconductor body and a second end
electrically connected with the semiconductor substrate.
13. The method of claim 12 wherein the vertical memory cells
further include a first vertical memory cell and a second vertical
memory cell adjacent to the first vertical memory cell, and further
comprising: forming an insulating layer on the semiconductor body;
and building a plurality of word lines on the semiconductor wafer
including a first word line on the insulating layer between the
first and second memory cells and electrically isolated from the
first and second memory cells, the first word line aligned
vertically with the body contact.
14. The method of claim 13 wherein the plurality of word lines
further includes a second word line connected with an access device
of the first vertical memory cell and a third word line connected
with an access device of the second vertical memory cell, the
second and third word lines electrically isolated from the first
word line.
15. The method of claim 12 further comprising: forming a sidewall
spacer within the via that separates the body contact from the
semiconductor body.
16. The method of claim 15 wherein forming the sidewall spacer
further comprises: forming an epitaxial layer on a portion of the
semiconductor body bordering the via.
17. The method of claim 15 wherein forming the sidewall spacer
further comprises: forming an isolation collar of an insulating
material on a portion of the semiconductor body bordering the via
and surrounding a portion of the body contact.
18. The method of claim 12 further comprising: forming an
insulating layer in the via above the body contact; and forming a
plug of semiconductor material within the via and on the insulating
layer, the plug having an interface within said via with the
semiconductor body.
19. The method of claim 18 wherein each of the vertical memory
cells includes an access device with a first source/drain region
and a storage capacitor electrically coupled by the first
source/drain region with the access device, and further comprising:
introducing a dopant into the semiconductor body and the plug of
semiconductor material to define a second source/drain region for
the access device of each of the vertical memory cells.
20. The method of claim 18 wherein the body contact is doped with a
concentration of a p-type dopant and the semiconductor material in
the plug is doped with a concentration of an n-type dopant.
21. The method of claim 12 wherein each of the vertical memory
cells includes a storage capacitor and an access device with a
vertical channel region defined in one of the semiconductor bodies
and a gate configured to switch current flow through the vertical
channel region to the storage capacitor.
22. The method of claim 12 wherein forming the via further
comprises: etching the via into the semiconductor wafer.
Description
CROSS-REFERENCE TO RELATED APPLICATIONS
[0001] This application is related to commonly-assigned application
Ser. No. ______ filed on even date herewith, entitled
"BODY-CONTACTED SEMICONDUCTOR STRUCTURES AND METHODS OF FABRICATING
SUCH BODY-CONTACTED SEMICONDUCTOR STRUCTURES" and bearing Attorney
Docket No. ROC920050179US1, which is hereby incorporated by
reference herein in its entirety.
FIELD OF THE INVENTION
[0002] The invention relates generally to semiconductor structures
and, in particular, to semiconductor structures with multiple
vertical memory cells arranged to form a memory array and methods
of forming such semiconductor structures.
BACKGROUND OF THE INVENTION
[0003] Dynamic random access memory (DRAM) devices are the most
commonly used type of semiconductor memory and, thus, are found in
many integrated circuit designs. DRAM devices are also frequently
embedded into application specific integrated circuits, such as
processors and logic devices. A generic DRAM device includes a
plurality of substantially identical semiconductor memory cell
arrays, a plurality of bit lines, and a plurality of word lines
that intersect the bit lines. Each memory cell array includes a
plurality of memory cells arranged in rows and columns. Each
individual memory cell in the array is located at the intersection
of one of the word lines and one of the bit lines.
[0004] Each individual memory cell includes a storage capacitor for
storing data and an access device, such as a planar or vertical
metal oxide semiconductor field-effect transistor (MOSFET), for
allowing the transfer of data charges to and from the storage
capacitor during reading and writing operations. Either the source
or drain of the access device is connected to a corresponding bit
line and the gate of the access device is connected to a
corresponding word line. In certain DRAM device designs, memory
cells are arranged in pairs to allow sharing of a bit line contact,
which significantly reduces the overall memory cell size.
[0005] When the access device of one of the memory cells is
activated by a signal on the word line, a data signal is
transferred from the storage capacitor of the memory cell to the
bit line connected to the memory cell or from the bit line
connected to the memory cell to the storage capacitor of the memory
cell. Because DRAM devices are a type of volatile memory that leaks
stored charge, the data charge on the storage capacitor
(corresponding to a "1" or "0") is periodically refreshed during a
refresh operation.
[0006] When data stored in one of the memory cells is read onto one
of the bit lines, a potential difference is generated between the
bit line of the respective memory cell and the bit line of another
memory cell, which form a bit line pair. A bit line sense amplifier
connected to the data line pair senses and amplifies the potential
difference and transfers the data from the selected memory cells to
a data line pair.
[0007] One goal of memory device designers is to pack more memory
cells more densely into a smaller integrated circuit. Vertical
memory cells feature an architecture in which the storage capacitor
and access device are stacked vertically in a common trench.
Vertical memory cells afford increased packing densities and other
advantages in comparison to planar memory cells, in which size
reduction was realized in the past primarily by reduction of the
linear dimensions (i.e., the minimum lithographic feature size, F).
For example, the packing density of vertical memory cells in a DRAM
device is increased because the length of the vertical access
device channel region is decoupled from the minimum lithographic
feature size. Consequently, vertical memory cells lack the scaling
problems with, for example, reducing the gate-oxide thickness and
increasing the channel doping concentration encountered when
scaling planar access devices to smaller sizes. The vertical memory
cell architecture also allows longer channel lengths without a
proportional decrease in memory density, as is true in planar
memory cells. Channel length may also be properly scaled in
vertical memory cells relative to gate oxide thickness and relative
to junction depth to reduce channel doping, minimize junction
leakage, and increase data retention times.
[0008] Constructing DRAM devices using semiconductor-on-insulator
(SOI) technology offers many advantages over counterpart devices
built in bulk semiconductor substrates including, but not limited
to, higher performance, absence of latch-up, higher packing
density, and low voltage applications. In SOI technology, a thin
semiconductor layer, often referred to as an SOI layer, is
electrically isolated from a thicker semiconductor substrate by an
insulating or dielectric material, e.g., a buried oxide or BOX
layer. The access devices for the memory cells are built in an SOI
body defined as an electrically-isolated section of the SOI
layer.
[0009] Floating body effects occur in vertical memory cells built
using SOI technology. SOI technology eliminates junction
capacitance problems observed in comparable bulk devices by
electrically isolating the SOI body of transistor-type access
devices from the underlying semiconductor material of the
substrate. However, the SOI body may float at a potential that
varies according to various conditions in which the transistor-type
access device is operated.
[0010] Floating body effects are known to significantly degrade
cell data retention time, which is most evident in long data
retention time memory cells. Floating body effects originate from
the accumulation of charge carriers in the channel region of the
access device defined in the SOI body. A resultant leakage current
is established via a parasitic bipolar transistor structure arising
from the accumulated charge carriers. If uncompensated, the leakage
current gradually discharges the storage capacitor. Floating body
effects also cause fluctuations in the threshold voltage for the
memory cell arising from the charge build up, which is extremely
detrimental to the operation of transistor-type access devices.
[0011] What is needed, therefore, is a semiconductor structure for
an SOI DRAM cell array and a DRAM device with improved cell data
retention times and methods of fabricating such semiconductor
structures that overcome the disadvantages of conventional
semiconductor structures and conventional methods of manufacturing
such semiconductor structures, respectively.
SUMMARY OF THE INVENTION
[0012] The present invention is generally directed to a
semiconductor-on-insulator (SOI) structure that incorporates a body
contact extending through the buried dielectric layer and, thereby,
coupling an SOI body with an underlying semiconductor substrate and
methods of forming such body contacts. The structure improves the
cell data retention time for a vertical memory cell in an SOI
dynamic random access memory (DRAM) device by reducing floating
body effects that, if uncompensated, may affect the memory cell
access device and result in charge loss from the associated storage
capacitor in the vertical memory cell. Specifically, charge
carriers that would otherwise accumulate in the channel region of
the access device are drained or discharged through a leakage path,
which may be high electrical resistance, defined by the body
contact that extends to the underlying semiconductor substrate.
[0013] In accordance with one aspect of the present invention, a
semiconductor structure comprises a semiconductor wafer including a
semiconductor substrate, a semiconductor layer with a plurality of
semiconductor bodies, a buried dielectric layer separating the
semiconductor substrate from the semiconductor layer, and a
plurality of memory cells built in an array on the semiconductor
wafer. Each of the memory cells includes a storage capacitor and an
access device. The access device has a vertical channel region
defined in one of the semiconductor bodies and a gate configured to
switch current flow through the vertical channel region to the
storage capacitor. The structure further comprises a body contact
of an electrically conductive material extending through the buried
dielectric layer. The body contact has a first end electrically
connected with one of the semiconductor bodies and a second end
electrically connected with the semiconductor substrate.
[0014] In accordance with another aspect of the invention, a method
is provided for forming a semiconductor structure in a
semiconductor wafer including a semiconductor substrate, a
semiconductor layer with a plurality of semiconductor bodies, a
buried dielectric layer separating the semiconductor substrate from
the semiconductor layer, and a plurality of memory cells built in
an array on the semiconductor wafer. A plurality of trenches are
etched in the semiconductor wafer and a vertical memory cell is
built in each trench. The method further includes forming a via
extending through one of the semiconductor bodies and the buried
dielectric layer and extending into the semiconductor substrate.
The method further includes at least partially filling the via with
a plug of an electrically conductive material that extends through
the buried dielectric layer to define a body contact having a first
end electrically connected with the semiconductor body and a second
end electrically connected with the semiconductor substrate.
BRIEF DESCRIPTION OF THE DRAWINGS
[0015] The accompanying drawings, which are incorporated in and
constitute a part of this specification, illustrate embodiments of
the invention and, together with a general description of the
invention given above and the detailed description of the
embodiments given below, serve to explain the principles of the
invention.
[0016] FIG. 1 is a top plan view of an array of vertical memory
cells built on a portion of a semiconductor-on-insulator substrate
in accordance with an embodiment of the invention.
[0017] FIG. 2 is a diagrammatic cross-sectional view of the
substrate portion of FIG. 1 taken generally along lines 2-2.
[0018] FIGS. 3-12 are diagrammatic cross-sectional views similar to
FIG. 2 of the substrate portion at various subsequent fabrication
stages.
[0019] FIG. 13 is a diagrammatic cross-sectional view similar to
FIG. 4 in accordance with an alternative embodiment of the
invention.
[0020] FIGS. 14-16 are diagrammatic cross-sectional views
subsequent to the fabrication stage of FIG. 3 of the substrate
portion at various subsequent fabrication stages in accordance with
an alternative embodiment of the invention.
[0021] FIGS. 17-19 are diagrammatic cross-sectional views
subsequent to the fabrication stage of FIG. 3 of the substrate
portion at various subsequent fabrication stages in accordance with
an alternative embodiment of the invention.
DETAILED DESCRIPTION
[0022] The present invention provides a semiconductor structure
including an array of vertical memory cells built using
semiconductor-on-insulator (SOI) technology, as well as methods of
making such semiconductor structures. Specifically, the access
device for at least one vertical memory cell and, typically, every
vertical memory cell in the memory cell array has an associated
body contact, which may be high electrical resistance. Each body
contact is established through the buried insulating or dielectric
layer separating the floating SOI body of an SOI wafer, in which
the access device is built, from the underlying semiconductor
substrate. Although the invention is not so limited, the present
invention may be particularly applicable and beneficial for merged
isolation and node trench (MINT) memory cells. The present
invention will now be described in greater detail by referring to
the drawings that accompany the present application.
[0023] With reference to FIGS. 1 and 2, a portion of a
semiconductor wafer 10 is shown that includes multiple
substantially identical vertical memory cells, generally indicated
by reference numeral 12, that are arranged in electrically-isolated
pairs of a considerably larger DRAM device built on semiconductor
wafer 10. The larger DRAM device may constitute, but is not limited
to, a plurality of substantially identical memory cells 12 each
having a known eight square feature or 8F2 DRAM cell, as depicted
in FIG. 1, and a plurality of substantially identical 8F2 DRAM
cells arranged in a larger array across the semiconductor wafer 10.
A bit of data can be stored as a data charge in each of the
individual 8F2 DRAM cells.
[0024] Before building the vertical memory cells 12, SOI
semiconductor wafer 10 comprises a semiconductor substrate 14,
which is typically a single crystal or monocrystalline bulk silicon
substrate, a buried insulating or dielectric layer, illustrated as
buried oxide (BOX) layer 18, and a semiconductor or SOI body 16 of
a larger SOI layer separated from the semiconductor substrate 14 by
the intervening BOX layer 18. The substrate 14 is doped with, for
example, a p-type dopant across a layer or region 25 adjacent to
the BOX layer 18. The SOI body 16, which is considerably thinner
than the semiconductor substrate 14 and is also typically single
crystal or monocrystalline silicon, is electrically isolated from
the semiconductor substrate 14 by the BOX layer 18. The
semiconductor wafer 10 may be fabricated by any suitable
conventional technique, such as a wafer bonding technique or a
separation by implantation of oxygen (SIMOX) technique, familiar to
persons of ordinary skill in the art.
[0025] Device isolation regions 20 (FIG. 1) are defined between
adjacent rows of vertical memory cells 12 in the cell array, such
that the memory cells 12 are paired together. One specific pair of
electrically-isolated memory cells 12 is shown in FIG. 2. These
device isolation regions 20 may be formed by, for example, a
shallow trench isolation (STI) technique that includes a
conventional lithography and dry etching process to create trenches
followed by filling the trenches with a dielectric material, such
as an oxide anisotropically deposited by a high density plasma
(HDP) chemical vapor deposition (CVD) process, and then
planarization with a conventional chemical mechanical planarization
(CMP) process. The device isolation regions 20 partition the SOI
body 16 into isolated active area regions or islands 15 on the BOX
layer 18 and, thereby, assist in preventing carrier migration
between adjacent memory cells 12. Each of the islands 15 may be
considered to be used in the construction of a pair of memory cells
12 and, as a result, adjacent pairs of memory cells 12 do not share
a common SOI body 16.
[0026] A relatively thin pad oxide layer 22 covers an upper
horizontal surface of the SOI body 16. The pad oxide layer 22 may
be oxide (SiO.sub.2) deposited by a conventional thermal CVD
process. A relatively thick pad nitride layer 24 covers the pad
oxide layer 22. The pad nitride layer 24 may be composed of silicon
nitride (Si.sub.3N.sub.4) formed by a conventional deposition
process, such as CVD or plasma-assisted CVD.
[0027] Each of the vertical memory cells 12 is fabricated in a
corresponding one of a plurality of trenches 26. Each of the
trenches 26 extends through the pad oxide and pad nitride layers
22, 24 and into the semiconductor wafer 10 at locations dispersed
across the surface of wafer 10. More specifically, each trench 26,
which is formed by a conventional lithography and etching process
familiar to a person having ordinary skill in the art, extends
through the SOI body 16 and the BOX layer 18 and continues for a
depth into region 25 of the semiconductor substrate 14 underlying
the BOX layer 18.
[0028] Each memory cell 12 includes a storage capacitor 28,
typically having the form of a deep trench (DT) capacitor, and an
access device 30, typically having the form of a vertical metal
oxide semiconductor field-effect transistor, that are disposed
within the trench 26 with a vertically stacked arrangement. The
access device 30 is electrically coupled with the storage capacitor
28 for allowing the transfer of data charges to and from the
storage capacitor 28 during reading and writing operations of the
DRAM device. because the memory cells 12 are substantially
identical, the constituent features of one pair of memory cells 12
will be described with the understanding that this description
applies to all equivalent pairs of memory cells 12 in the memory
cell array and DRAM device.
[0029] The storage capacitor 28 of each vertical memory cell 12 is
located in a bottom or lower portion of the trench 26. The storage
capacitor 28 includes a capacitor node or plate 32 constituted by a
conductor, such as doped polycrystalline silicon (i.e.,
polysilicon). The capacitor plate 32, which includes a portion that
projects vertically into the BOX layer 18, is electrically isolated
from the SOI body 16 by the BOX layer 18. The capacitor plate 32
may be a heavily n-type doped region defined in the p-type region
25 of the semiconductor substrate 14. Alternatively, the capacitor
plate 32 may be doped with a p-type dopant if region 25 is doped
with an n-type dopant.
[0030] A buried capacitor plate 34 is present in the material of
the semiconductor substrate 14 bordering a lower portion of the
trench 26. The buried capacitor plate 34 may be heavily doped with,
for example, an n-type dopant within the p-type region 25 of the
semiconductor substrate 14. Alternatively, the buried capacitor
plate 34 may be heavily doped with a p-type dopant if region 25 is
doped with an n-type dopant. Buried plate doping may be formed by
conventional processes such as out-diffusing a dopant, such as the
n-type dopant arsenic, from a layer of doped silicate glass on the
sidewall of trench 26, gas phase doping, plasma doping, plasma
immersion ion implantation, or any combination of these processes
that are well known to a person having ordinary skill in the prior
art. Typically, the capacitor plates 32, 34 will be doped with the
same type of dopant.
[0031] A thin node dielectric 36, which lines the lower portion of
trench 26, separates and electrically isolates the buried capacitor
plate 34 from capacitor plate 32. The node dielectric 36 may be any
suitable dielectric material, including but not limited to silicon
oxide, silicon nitride, silicon oxynitride, aluminum oxide,
combinations of these dielectric materials, or another high-k
material.
[0032] With continued reference to FIGS. 1 and 2, the access device
30 of each vertical memory cell 12 is situated in a top or upper
portion of the trench 26 and, generally, is stacked vertically
above the storage capacitor 28. A trench-top insulator 38, which
typically has the form of a trench-top oxide, overlies the
capacitor plate 32 vertically and electrically isolates a vertical
gate 40 of the access device 30 from the capacitor plate 32. Oxide
for the trench-top insulator 38 may be formed in trench 26 above
capacitor plate 32 by a suitable conventional process, such as a
HDP-CVD process. The vertical gate 40 is constituted by an
electrically conductive material, such as polysilicon deposited in
the upper portion of trench 26 using low-pressure CVD (LPCVD).
[0033] A buried deep strap connection 42 is provided in the BOX
layer 18 vertically between the vertical gate 40 and the capacitor
plate 32. A lower source/drain region 44 of the access device 30 is
defined by dopant outdiffusion from buried deep strap connection 42
that extends into the SOI body 16. The dopant in the lower
source/drain region 44 will be, for example, n-type if the dopant
in the buried deep strap connection 42 is n-type (e.g., arsenic,
phosphorous, or antimony). The source/drain region 44 may operate
either as the access device source or as the access device drain
contingent upon the operation of access device 30. Capacitor plate
32 of the storage capacitor 28 is tied to the lower source/drain
region 44 of the access device 30 and buried capacitor plate 34 is
tied to a reference potential or voltage. The buried deep strap
connection 42 electrically connects the capacitor plate 32 of the
storage capacitor 28 through the lower source/drain region 44 to a
vertical channel region 64 (FIG. 9) of the access device 30 when
the vertical gate 40 is activated. A thin gate oxide 46, which is
formed in a conventional manner, is disposed on the vertical
sidewall of trench 26 between the confronting sidewall of the
vertical gate 40 and the SOI body 16.
[0034] With reference to FIG. 3 in which like reference numerals
refer to like features in FIG. 2 and at a subsequent fabrication
stage, a hard mask layer 48 is applied to the pad nitride layer 24
and patterned with body contact vias 50 by any conventional
lithography and etching technique that applies a resist layer (not
shown), exposes the resist layer to a pattern of radiation defined
by a mask, develops the transferred pattern in the exposed resist,
and transfers the developed pattern to the hard mask layer 48 with
a conventional anisotropic dry etching process, such as
reactive-ion etching (RIE) or plasma etching, that stops on the pad
nitride layer 24. The hard mask layer 48 may be oxide (SiO.sub.2)
deposited by a conventional thermal CVD process. An optional etch
stop layer (not shown) of, for example, nitride may be provided
between the hard mask layer 48 and the pad nitride layer 24 if the
hard mask layer 48 is susceptible to removal during subsequent
etching processes, as described below. In this instance, the
optional etch stop layer would mask the vertical gate 40 during the
etching process.
[0035] Each of the body contact vias 50 is extended vertically
through the pad nitride layer 24 with a conventional anisotropic
dry etching process that stops on the pad oxide layer 22, through
the pad oxide layer 22 with another anisotropic dry etching process
that stops on the SOI body 16, through the SOI body 16 with another
conventional anisotropic dry etching process that stops on the BOX
layer 18, through the BOX layer 18 with another conventional
anisotropic dry etching process that stops on the substrate 14, and
into the wafer 10 with a final conventional anisotropic etching
process. The chemistry of each etching process, which may be
conducted in a single etching step or multiple steps, is chosen
according to the material selectivity required. Each of the etch
processes relies on the hard mask layer 48 as an etch mask.
[0036] With reference to FIG. 4 in which like reference numerals
refer to like features in FIG. 3 and at a subsequent fabrication
stage, a spacer 52 of a suitable semiconductor material, like
silicon, is selectively formed within each of the body contact vias
50. The spacer 52, which is optional, does not completely cover the
entire sidewall of each via 50 but is formed only on the exposed
surfaces of the SOI body 16 and the substrate 14 that border each
body contact via 50. These exposed surfaces of the substrate 14 and
the SOI body 16 operate as seeds for epitaxial growth of the
optional spacer 52. The semiconductor material forming the spacer
52 preferably does not form with an appreciable thickness on the
vertical surfaces of the BOX layer 18, the pad oxide layer 22, and
the pad nitride layer 24 bordering each via 50.
[0037] With reference to FIG. 5 in which like reference numerals
refer to like features in FIG. 4 and at a subsequent fabrication
stage, a layer (not shown) of an electrically conductive fill
material is deposited by a conventional process on hard mask layer
48. A body contact 54 is defined by a portion or plug of the
deposited conductive fill material that fills each via 50. An
optional conventional planarization process, such as chemical
mechanical polishing (CMP), may be used to remove excess conductive
fill material from hard mask layer 48, which re-exposes the hard
mask layer 48. The planarization process stops vertically on the
upper horizontal surface of hard mask layer 48. The body contact 54
may be constituted by intrinsic polysilicon or n-type doped
polysilicon formed within the p-type region 25 of the semiconductor
substrate 14. Alternatively, the buried capacitor plate 34 may
consist of p-type doped polysilicon if region 25 is doped with an
n-type dopant.
[0038] The upper surface of the body contact 54 is recessed below
the horizontal level of the hard mask layer 48 by, for example, an
anisotropic dry etch process that removes the constituent
conductive fill material selective to the constituent material of
the hard mask layer 48. In particular, the etch process recesses
the body contact 54 to a depth vertically above the depth of the
BOX layer 18.
[0039] The presence of the spacer 52 effectively increases the
spacing between the body contact 54 and the buried deep strap
connection 42 of the access device 30 by locally thickening the
sidewall of trench 26. This distances body contact 54 further away
from the lower source/drain region 44, which advantageously reduces
the transfer of leakage current to and from the buried deep strap
connection 42 that is directly connected to capacitor plate 32 of
the storage capacitor 28. If not abated, such leakage current may
be detrimental to the operation of the vertical memory cell 12.
Spacer 52 may be omitted if the proximity of the body contact 54 to
the lower source/drain region 44 is not a concern in the device
design.
[0040] Each body contact 54 electrically couples the SOI body 16 of
the access device 30 with the semiconductor substrate 14 to define
a leaky current path therebetween. Each body contact 54 serves a
pair of access devices 30 in a contiguous island 15 of the
monocrystalline semiconductor defined by the SOI body 16 on SOI
wafer 10. If the body contact 54 is formed from doped polysilicon,
the dopant type of the body contact 54 should be the same as the
dopant type in the SOI body 16 and the substrate 14 contacted by
the body contact 54.
[0041] With reference to FIG. 6 in which like reference numerals
refer to like features in FIG. 5 and at a subsequent fabrication
stage, an insulating layer 56 is formed on the body contact 54. The
insulating layer 56 may be, for example, oxide deposited by a
conventional HDP CVD oxide process, which deposits oxide on
horizontal surfaces preferentially to vertical surfaces like trench
sidewalls. Portions of the insulating layer 56 also cover the
horizontal surface of hard mask layer 48. Any portions of
insulating layer 56 resident on the vertical sidewall of the body
contact via 50 above the body contact 54 are stripped by a
directional etch back process.
[0042] With reference to FIG. 7 in which like reference numerals
refer to like features in FIG. 6 and at a subsequent fabrication
stage, a layer of a fill material, such as intrinsic polysilicon or
polysilicon doped oppositely to the material (e.g., silicon)
constituting the SOI body 16, is deposited by a conventional
process on insulating layer 56. The dopant type in plug 58 differs
from the dopant type in body contact 54. For example, plug 58 may
be polysilicon doped with a n-type dopant or intrinsic polysilicon
if the body contact 54 is doped with a p-type dopant and the region
25 is also p-type.
[0043] A portion of the fill material fills each body contact via
50 with a plug 58 above the portion of the insulating layer 56 in
via 50. A conventional planarization process, such as CMP, is used
to remove excess fill material from the insulating layer 56 on the
hard mask layer 48, which re-exposes the insulating layer 56. The
planarization process stops vertically on the upper horizontal
surface of insulating layer 56. The upper surface of the plug 58 in
each body contact via 50 is recessed by, for example, an
anisotropic dry etch process that removes the constituent fill
material of plug 58 selective to the material constituting the hard
mask layer 48. In particular, the etch process recesses the plug 58
vertically to a depth within each body contact via 50 approximately
level with the pad oxide layer 22.
[0044] With reference to FIG. 8 in which like reference numerals
refer to like features in FIG. 7 and at a subsequent fabrication
stage, the hard mask layer 48 and the insulating layer 56 are
removed by a conventional planarization process, such as one or
more CMP processes, that stops vertically on the pad nitride layer
24. As a result, the respective upper surfaces of each vertical
gate 40 and the pad nitride layer 24 are exposed.
[0045] With reference to FIG. 9 in which like reference numerals
refer to like features in FIG. 8 and at a subsequent fabrication
stage, the pad nitride layer 24 is stripped by an etch process that
removes the material of the pad nitride layer 24 selective to the
material constituting pad oxide layer 22. For example, a wet
isotropic etch process using hot acid, such as phosphoric acid, may
be employed to remove Si.sub.3N.sub.4 relative to oxide. An upper
horizontal surface 60 of the pad oxide layer 22 is exposed after
the pad nitride layer 24 is removed. The upper end of each
conductive plug 58 projects vertically above the horizontal level
of surface 60.
[0046] An upper source/drain region 62 is defined by a doped region
in an upper region of the SOI body 16. For example, the upper
source/drain region 62 may be formed by implantation or diffusion
of an n-type dopant, such as arsenic or phosphorous, into the SOI
body 16 and plugs 58, if these regions are doped with a p-type
dopant. The upper source/drain region 62 operates as either a
source or a drain of the access device 30, contingent upon the
operation of access device 30. The plug 58 in each body contact via
50 and portions of spacer 52 between each plug 58 and the adjacent
SOI body 16 participate, when doped, along with the SOI body 16 to
make the source/drain region 62 laterally continuous and unbroken.
In particular, the interface between the doped plug 58 and the SOI
body 16 make the source/drain region 62 continuous across the body
contact 54 by bridging the body contact via 50.
[0047] A vertical channel region 64 is defined in the SOI body 16
near the vertical gate 40 and generally between the source/drain
regions 44, 62 of the access device 30. Current flowing through
channel region 64 between the source/drain regions 44, 62 is
controlled or switched by potential or voltage applied to the
vertical gate 40. When the access device 30 is switched "on" by
application of a suitable voltage to the vertical gate 40, channel
region 64 becomes electrically conductive to allow current flow
between the source/drain regions 44, 62. The access device 30 is
considered by a person having ordinary skill in the art to
constitute a vertical device structure because of the
three-dimensional vertical arrangement of the vertical gate 40, the
channel region 64, and the source/drain regions 44, 62.
[0048] With reference to FIG. 10 in which like reference numerals
refer to like features in FIG. 9 and at a subsequent fabrication
stage, the remnants of pad oxide layer 22 are stripped utilizing a
conventional etching process that removes the material of layer 22
with a high selectively to the material constituting the SOI body
16 (e.g., silicon). An array top insulator 66 is formed on the
source/drain region 62. The array top insulator 66 may be formed,
for example, by depositing oxide using a conventional HDP CVD oxide
process and optionally planarizing with a conventional
planarization process, such as a CMP process, that stops vertically
on the vertical gate 40. The body contact 54 is buried by the
material of the array top insulator 66.
[0049] With reference to FIG. 11 in which like reference numerals
refer to like features in FIG. 10 and at a subsequent fabrication
stage, a plurality of word lines, including word lines 68, 70, 72
visible in FIG. 10, are formed by a series of processes familiar to
a person having ordinary skill in the art. The array top insulator
66 operates to electrically isolate the source/drain region 62 from
word lines 68, 70, 72. Each of the word lines 68, 70, 72 consists
of one or more conducting layers constituted by a conductor, such
as polysilicon, tungsten nitride (WN), tungsten (W), tungsten
silicide (WSi), or layered combinations of these materials. Each of
the word lines 68, 70, 72 includes an electrically-insulating cap
74 of, for example, nitride stationed atop the conducting layer(s),
and electrically-insulating sidewall spacers 76 of, for example,
nitride flanking the conducting layer(s).
[0050] Word line 68 is electrically coupled with the storage
capacitor 28 of one vertical memory cell 12 visible in FIG. 11 by
the underlying access device 30. A potential applied from word line
68 to vertical gate 40 controls the data charge on the storage
capacitor 28 by selectively transferring current between the
source/drain regions 44, 62 through the corresponding channel
region 64 in the SOI body 16. Similarly, word line 72 is
electrically coupled with the storage capacitor 28 of the other
memory cell 12 visible in FIG. 11 by the underlying access device
30. A potential applied from word line 72 to the vertical gate 40
of the access device 30 of this memory cell 12 likewise controls
the data charge on the corresponding storage capacitor 28 by
selectively transferring current between the source/drain regions
44, 62 through the corresponding channel region 64 in the SOI body
16.
[0051] To provide the electrical coupling, the vertical gate 40 of
each access device 30 for the exemplary pair of vertical memory
cells 12 visible in FIG. 11 is contacted by one of the word lines
68, 72. As a consequence, these word lines 68, 72 are referred to
as active word lines. The other word line 70 does not contact
either of the memory cells 12 visible in FIG. 11 and is referred to
as a passing word line. This word line 70, which is passing in FIG.
11, is connected with the access device 30 in other memory cells 12
in the memory cell array (FIG. 1) and in the DRAM device.
Similarly, word lines 68, 72, which are active in FIG. 11, are not
connected with the access device 30 of certain other memory cells
12 in the memory cell array (FIG. 1) and in the DRAM device.
Consequently, as appreciated by a person having ordinary skill in
the art, ascribing the terms active and passing to the word lines
68, 70, 72 depends upon which specific pair of word lines 68, 70,
72 is coupled with each electrically-isolated pair of memory cells
12 in the memory cell array and DRAM device. The body contact via
50 and body contact 54 are formed in a region of the SOI
semiconductor wafer 10 that directly underlies the passing word
line 70.
[0052] With reference to FIG. 12 in which like reference numerals
refer to like features in FIG. 11 and at a subsequent fabrication
stage, a layer 78 of a suitable gap fill material, such as oxide or
borophosphosilicate glass (BPSG) is deposited and planarized to
fill gaps between adjacent pairs of word lines 68, 70, 72. The
material of the gap fill layer 78 is planarized by a conventional
planarization process, such as a CMP process, to establish an upper
horizontal surface by relying on caps 74 as a polish stop.
[0053] Bit line contacts 80, each consisting of a conductive
material like metal or polysilicon, are then formed using
conventional bit line formation techniques. Each bit line contact
80 extends through the gap fill layer 78 to establish an electrical
contact with the corresponding source/drain region 62. For example,
the bit line contacts 80 may be formed by depositing a resist layer
on gap fill layer 78, patterning the resist layer to form a bit
line contact pattern, etching the unmasked regions of the gap fill
layer 78 by an etching process that removes the constituent
material of layer 78 selective to the constituent material of SOI
body 16 to form bit line contact vias to the source/drain region
62, removing the resist layer, depositing a blanket layer of a
conductive material suitable for forming contacts 80, and
planarizing with a conventional process, like a CMP process, to the
top of the gap fill layer 78.
[0054] Normal processing is used to complete the DRAM integrated
circuit, as understood by a person having ordinary skill in the
art. Normal processing may include, but is not limited to,
deposition of an interlayer dielectric (not shown) such as BPSG or
another suitable insulator, formation of bit lines (not shown) that
contact the bit line contacts 80, and formation of higher level
metallizations (not shown) and insulating layers (not shown).
[0055] With reference to FIG. 13 in which like reference numerals
refer to like features in FIG. 5 and at a subsequent fabrication
stage in accordance with an alternative embodiment of the present
invention, the insulating layer 56 is formed on the body contact 54
by a conventional thermal CVD process, such as an oxide CVD
process. Portions of the insulating layer 56 also cover the
horizontal surface of hard mask layer 48. The insulating layer 56
overlying the body contact 54 is recessed by an appropriate process
to a depth approximately level with pad oxide layer 22. For
example, the insulating layer 56 may be recessed using an oxide wet
(HF-based) etch or a dry RIE process appropriate to etch an oxide
constituting insulating layer 56. The process that recesses the
insulating layer 56 covering the body contact 54 also removes the
residue of layer 56 on the hard mask layer 48 (FIG. 5) and also
removes the remnants of the hard mask layer 48.
[0056] Processing continues with the fabrication stage of FIG. 8 by
depositing a fill material, such as intrinsic polysilicon or doped
polysilicon (e.g., n.sup.+ polysilicon), similar to the material
constituting the SOI body 16 on pad nitride layer 24 and
planarizing with a conventional planarization process, such as a
CMP process, that stops vertically on the upper horizontal surface
of pad nitride layer 24, to form plugs 58. The upper surface of
each plug 58 is recessed by, for example, an anisotropic dry etch
process that removes the constituent fill material of plug 58
selective to the constituent material of the hard mask layer 48. In
particular, the etch process recesses the plug 58 vertically to a
depth approximately level with the pad oxide layer 22.
[0057] With reference to FIG. 14 in which like reference numerals
refer to like features in FIG. 3 and at a subsequent fabrication
stage in accordance with another alternative embodiment of the
present invention, a region or plug 82 of a material, such as
intrinsic polysilicon or polysilicon doped similar to the material
(e.g., silicon) constituting the substrate 14, is formed in each of
the body contact vias 50. For example, plug 82 may be heavily doped
with a p-type dopant if region 25 of the substrate 14 has a p-type
conductivity. The plug 82 may be formed in each body contact via 50
by depositing a blanket layer of the constituent material,
planarizing with a conventional process, such as CMP, that stops
vertically on the hard mask layer 48, and etching with, for
example, an anisotropic dry etch process that removes the material
constituting plug 82 selective to the constituent material of hard
mask layer 48. The etching process recesses the upper surface of
the plug 82 inside each body contact via 50 vertically to a depth
below the interface between the SOI body 16 and the BOX layer
18.
[0058] With reference to FIG. 15 in which like reference numerals
refer to like features in FIG. 14 and at a subsequent fabrication
stage, the spacer 52 is selectively formed within each of the body
contact vias 50 and covers the exposed sidewalls of the SOI body
16. However, instead of lining the body contact via 50 at a level
below the interface between the substrate 14 and BOX layer 18, a
portion of the spacer 52 nucleates on the upper surface of plug 82
and covers plug 82 with an overlying relationship.
[0059] With reference to FIG. 16 in which like reference numerals
refer to like features in FIG. 15 and at a subsequent fabrication
stage, another region or plug 84 is formed in each of the body
contact vias 50 above the portion of the spacer 52 covering plug
82. Plug 84 may be formed from the same material and by a similar
process as plug 82. For example, the plug 84 may be intrinsic
polysilicon or polysilicon heavily doped with a p-type dopant if
plug 82 is intrinsic polysilicon or polysilicon heavily doped with
a p-type dopant. The plug 84 may be formed in each of the body
contact vias 50 by depositing a blanket layer of the constituent
material, planarizing with a conventional process, such as CMP,
that stops vertically on the hard mask layer 48, and etching with,
for example, an anisotropic dry etch process that removes the
constituent material of plug 84 selective to the constituent
material of hard mask layer 48. The upper surface of the plug 84 in
each body contact via 50 is recessed vertically by the etching
process such that the upper surface of plug 84 is at a depth above
the interface between the SOI body 16 and the BOX layer 18 and
below the interface between the SOI body 16 and the pad oxide layer
22.
[0060] The plugs 82, 84 in each of the body contact vias 50 and the
portion of the spacer 52 between the plugs 82, 84 collectively
constitute a conductive structure that operates as a body contact
equivalent functionally to the body contact 54 (FIG. 5). Processing
continues in this alternative embodiment beginning at the
fabrication stage shown in FIG. 6.
[0061] With reference to FIG. 17 in which like reference numerals
refer to like features in FIG. 3 and at a subsequent fabrication
stage in accordance with yet another alternative embodiment of the
present invention, a region or plug 86 of a material, such as
intrinsic polysilicon or polysilicon doped similar to the material
(e.g., silicon) constituting the substrate 14, is formed in each of
the body contact vias 50. For example, the plug 86 may be heavily
doped with a p-type dopant if region 25 of the substrate 14 has a
p-type conductivity. The plugs 86 may be formed by depositing a
blanket layer of the constituent material, planarizing with a
conventional process, such as a CMP process, that stops vertically
on the hard mask layer 48, and etching with, for example, an
anisotropic dry etch process that removes the constituent material
of plug 86 selective to the constituent material of hard mask layer
48. The upper surface of each plug 86 is recessed vertically by the
etch process such that the upper surface of plug 86 is at a depth
below the interface between the SOI body 16 and the BOX layer
18.
[0062] Next, an isolation spacer or collar 88 of an insulating or
dielectric material is formed on the exposed sidewall of each body
contact via 50 by a conventional process. For example, isolation
collar 88 may be formed from oxide deposited by a conformal CVD
process and etched using a dry etching process, such as an RIE,
that removes the constituent material of the isolation collar 88
selective to the material constituting the plug 86.
[0063] With reference to FIG. 18 in which like reference numerals
refer to like features in FIG. 17 and at a subsequent fabrication
stage, a region or plug 90 of a material similar or identical to
the material constituting plug 86 is formed in each body contact
via 50 to define a cap above plug 86. For example, the plug 90 may
be polysilicon heavily doped with a p-type dopant if plug 86 is
polysilicon also heavily doped with a p-type dopant. Similar to
plug 86, plug 90 may be formed in each body contact via 50 by
deposited by depositing a blanket layer of the constituent
material, planarizing with a conventional process, such as CMP,
that stops vertically on the hard mask layer 48, and etching with,
for example, an anisotropic dry etch process that removes the
constituent material of plug 90 selective to the constituent
material of hard mask layer 48. The upper surface of the plug 90 in
each of the body contact vias 50 is recessed vertically by the
etching process such that the upper surface of plug 90 is at a
depth above the interface between the SOI body 16 and the BOX layer
18.
[0064] A portion of the isolation collar 88 projecting vertically
above the plug 90 is removed by an etch process, such as a wet
isotropic etch process, that removes the material of isolation
collar 88 selective to the material constituting plug 90. The
etching process is continued to recess the isolation collar 88
vertically below the upper surface of plug 90. Plug 90 lies within
the body contact via 50 at a location radially inside of the
isolation collar 88.
[0065] With reference to FIG. 19 in which like reference numerals
refer to like features in FIG. 18 and at a subsequent fabrication
stage, a region or plug 92 of a material similar to the material
constituting plugs 86 and 90 is formed in each body contact via 50
above plug 90. For example, plug 92 may be heavily doped with a
p-type dopant if plugs 86 and 90 are polysilicon heavily doped with
a p-type dopant. Similar to plugs 86 and 90, plug 92 may be formed
in each body contact via 50 by depositing a blanket layer of the
constituent material, planarizing with a conventional process, such
as CMP, that stops vertically on the hard mask layer 48, and
etching with, for example, an anisotropic dry etch process that
removes the constituent material of plug 92 selective to the
constituent material of hard mask layer 48. The upper surface of
plug 92 is recessed vertically by the etch process such that the
upper surface of plug 92 is at a depth below the interface between
the SOI body 16 and the pad oxide layer 22.
[0066] The plugs 86, 90, 92 collectively constitute a body contact
that is structurally equivalent functionally to the body contact 54
(FIG. 5). Specifically, plug 86 is electrically coupled with the
substrate 14, plug 92 is electrically coupled with the SOI body 16,
and plug 90 electrically couples plug 86 with plug 92 to
structurally comprise the body contact 54. Processing continues in
this alternative embodiment beginning at the fabrication stage
shown in FIG. 6.
[0067] The isolation collar 88 provides an intervening structure
that prevents any interactions between the material of the SOI body
16 and the body contact 54 defined by plugs 86, 90, 92 and
effectively provides a buffer region so that the SOI body 16 and
the body contact 54 lack an interface. This is particularly
beneficial in situations in which the SOI body 16 is single crystal
silicon and the plugs 86, 90, 92 are constituted by polysilicon
because defects in the polysilicon tend to propagate into the
single crystal silicon. The isolation collar 88 also operates to
distance the plugs 86, 90, 92 from the buried deep strap connection
42.
[0068] It should be noted that embodiments of the present invention
are described herein with semiconductor structures being doped for
a particular device type, i.e. n-type FET's (N-channel FET's).
However, the invention is not so limited as a person having
ordinary skill would understand how to replace N-channel FET's with
p-type FET's (P-channel FET's) and n-type dopant with p-type dopant
(e.g., boron or indium) where appropriate without departing from
the spirit or scope of the invention.
[0069] The present invention provides various advantages in
comparison with the construction of conventional DRAM cell arrays.
In particular, the present invention provides for ultra-scalable
and high performance SOI vertical array DRAM device having a
high-resistance body contact to potentially eliminate and, at the
least, significantly reduce the floating body effect by providing a
conduction or leakage path through the BOX layer 18 from the SOI
body 16 to the semiconductor substrate 14. The beneficial result is
that the leakage current from storage capacitor 28, arising from
diffusion of charge carriers to this interface, is significantly
reduced. The present invention is compatible with the current DRAM
and enhanced dynamic random access memory (eDRAM) processes. The
present invention is easy to implement in a circuit design and
cost-effective, which is beneficial for purposes of
manufacturability.
[0070] References herein to terms such as "vertical", "horizontal",
etc. are made by way of example, and not by way of limitation, to
establish a frame of reference. The term "horizontal" as used
herein is defined as a plane parallel to the conventional plane or
surface of semiconductor wafer 10, before processing and regardless
of the actual spatial orientation of semiconductor wafer 10. The
term "vertical" refers to a direction perpendicular to the
horizontal, as just defined. Terms, such as "on", "above", "below",
"side" (as in "sidewall"), "higher", "lower", "over", "beneath" and
"under", are defined with respect to the horizontal plane. It is
understood that various other frames of reference may be employed
for describing the present invention without departing from the
spirit and scope of the present invention.
[0071] The fabrication of the semiconductor structure herein has
been described by a specific order of fabrication stages and steps.
However, it is understood that the order may differ from that
described. For example, the order of two or more fabrication steps
may be switched relative to the order shown. Moreover, two or more
fabrication steps may be conducted either concurrently or with
partial concurrence. In addition, various fabrication steps may be
omitted and other fabrication steps may be added. It is understood
that all such variations are within the scope of the present
invention. It is also understood that features of the present
invention are not necessarily shown to scale in the drawings.
[0072] While the present invention has been illustrated by a
description of various embodiments and while these embodiments have
been described in considerable detail, it is not the intention of
the applicants to restrict or in any way limit the scope of the
appended claims to such detail. Additional advantages and
modifications will readily appear to those skilled in the art.
Thus, the invention in its broader aspects is therefore not limited
to the specific details, representative apparatus and methods, and
illustrative examples shown and described. Accordingly, departures
may be made from such details without departing from the spirit or
scope of applicants' general inventive concept.
* * * * *