U.S. patent application number 11/473295 was filed with the patent office on 2006-10-26 for electrochemical processing cell.
This patent application is currently assigned to APPLIED MATERIALS, INC.. Invention is credited to Yezdi Dord, Nicolay Kovarsky, Dmitry Lubomirsky, Saravjeet Singh, Sheshraj Tulshibagwale, Michael X. Yang.
Application Number | 20060237307 11/473295 |
Document ID | / |
Family ID | 30772615 |
Filed Date | 2006-10-26 |
United States Patent
Application |
20060237307 |
Kind Code |
A1 |
Yang; Michael X. ; et
al. |
October 26, 2006 |
Electrochemical processing cell
Abstract
Embodiments of the invention may generally provide a small
volume electrochemical plating cell. The plating cell generally
includes a fluid basin configured to contain a plating solution
therein, the fluid basin having a substantially horizontal weir.
The cell further includes an anode positioned in a lower portion of
the fluid basin, the anode having a plurality of parallel channels
formed therethrough, and a base member configured to receive the
anode, the base member having a plurality of groves formed into an
anode receiving surface, each of the plurality of grooves
terminating into an annular drain channel. A membrane support
assembly configured to position a membrane immediately above the
anode in a substantially planar orientation with respect to the
anode surface is provided, the membrane support assembly having a
plurality of channels and bores formed therein.
Inventors: |
Yang; Michael X.; (Palo
Alto, CA) ; Lubomirsky; Dmitry; (Cupertino, CA)
; Dord; Yezdi; (Palo Alto, CA) ; Singh;
Saravjeet; (Santa Clara, CA) ; Tulshibagwale;
Sheshraj; (Los Altos, CA) ; Kovarsky; Nicolay;
(Sunnyvale, CA) |
Correspondence
Address: |
PATTERSON & SHERIDAN, LLP
3040 POST OAK BOULEVARD, SUITE 1500
HOUSTON
TX
77056
US
|
Assignee: |
APPLIED MATERIALS, INC.
|
Family ID: |
30772615 |
Appl. No.: |
11/473295 |
Filed: |
June 22, 2006 |
Related U.S. Patent Documents
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Application
Number |
Filing Date |
Patent Number |
|
|
10268284 |
Oct 9, 2002 |
|
|
|
11473295 |
Jun 22, 2006 |
|
|
|
60398345 |
Jul 24, 2002 |
|
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|
Current U.S.
Class: |
204/284 ;
257/E21.175 |
Current CPC
Class: |
A23D 7/00 20130101; A23J
7/00 20130101; H01L 21/2885 20130101; A23D 7/005 20130101; C07F
9/103 20130101; C25D 7/123 20130101; C25D 17/001 20130101; A23D
7/01 20130101 |
Class at
Publication: |
204/284 |
International
Class: |
C25B 11/00 20060101
C25B011/00 |
Claims
1. An anode used to electrochemically plate a metal on a substrate,
comprising a substantially disk-shaped member having a plurality
slots formed therethrough.
2. The anode of claim 1, wherein substantially disk-shaped member
is manufactured from a metal that is to be plated in an
electrochemical plating process.
3. The anode of claim 1, wherein substantially disk-shaped member
is made of copper.
4. The anode of claim 1, wherein the plurality of slots comprise a
plurality of longer segments and a plurality of shorter segments,
each of the plurality of longer segments being positioned in
longitudinal abutment with a corresponding one of the plurality of
shorter segments and separated therefrom by a remaining portion of
the anode.
5. An anode used in an electrochemical plating cell, comprising: a
substantially disk-shaped member having a plurality slots formed
therethrough, wherein the plurality of slots are aligned parallel
to a first direction.
6. The anode of claim 5, wherein substantially disk-shaped member
is manufactured from a metal that is to be plated in an
electrochemical plating process.
7. The anode of claim 5, wherein substantially disk-shaped member
is made of copper.
8. The anode of claim 5, wherein the plurality of slots comprise
one or more slots that have a first length and one or more slots
that are a second length, wherein the first length is longer than
the second length.
9. An anode used in an electrochemical plating cell, comprising: a
substantially disk-shaped member having a plurality slots formed
therethrough, wherein the plurality of slots are aligned parallel
to a first direction and the plurality of slots comprise: a first
group of slots that includes at least a first slot that is a first
length and has a first end, and a second slot that is a second
length and has a second end, wherein the second slot and the first
slot are oriented so that they form a first space between the first
end and the second end; and a second group of slots that are
parallel to the first group of slots and the first direction,
wherein the second group of slots includes at least a third slot
that is a third length and has a third end, and a fourth slot that
is a fourth length and has a fourth end, wherein the fourth slot
and the third slot are oriented so that they form a second space
between the third end and the fourth end.
10. The anode of claim 9, wherein the second slot and the first
slot are oriented so that they are collinear and the fourth slot
and the third slot are oriented so that they are collinear.
11. The anode of claim 9, wherein the first and second group of
slots are spaced a distance apart in a direction substantially
perpendicular to the first direction.
12. The anode of claim 9, wherein substantially disk-shaped member
is manufactured from a metal that is to be plated in an
electrochemical plating process.
13. The anode of claim 9, wherein substantially disk-shaped member
is made of copper.
Description
CROSS-REFERENCE TO RELATED APPLICATIONS
[0001] This application is a divisional of co-pending U.S. patent
application Ser. No. 10/268,284, filed Oct. 9, 2002, which claims
benefit of U.S. provisional patent application Ser. No. 60/398,345,
filed Jul. 24, 2002. Each of the aforementioned related patent
applications is herein incorporated by reference.
BACKGROUND OF THE INVENTION
[0002] 1. Field of the Invention
[0003] Embodiments of the present invention generally relate to a
low volume electrochemical processing cell and methods for
electrochemically depositing a conductive material on a
substrate.
[0004] 2. Description of the Related Art
[0005] Metallization of sub-quarter micron sized features is a
foundational technology for present and future generations of
integrated circuit manufacturing processes. More particularly, in
devices such as ultra large scale integration-type devices, i.e.,
devices having integrated circuits with more than a million logic
gates, the multilevel interconnects that lie at the heart of these
devices are generally formed by filling high aspect ratio, i.e.,
greater than about 4:1, interconnect features with a conductive
material, such as copper or aluminum. Conventionally, deposition
techniques such as chemical vapor deposition (CVD) and physical
vapor deposition (PVD) have been used to fill these interconnect
features. However, as the interconnect sizes decrease and aspect
ratios increase, void-free interconnect feature fill via
conventional metallization techniques becomes increasingly
difficult. Therefore, plating techniques, i.e., electrochemical
plating (ECP) and electroless plating, have emerged as promising
processes for void free filling of sub-quarter micron sized high
aspect ratio interconnect features in integrated circuit
manufacturing processes.
[0006] In an ECP process, for example, sub-quarter micron sized
high aspect ratio features formed into the surface of a substrate
(or a layer deposited thereon) may be efficiently filled with a
conductive material, such as copper. ECP plating processes are
generally two stage processes, wherein a seed layer is first formed
over the surface features of the substrate, and then the surface
features of the substrate are exposed to an electrolyte solution,
while an electrical bias is applied between the seed layer and a
copper anode positioned within the electrolyte solution. The
electrolyte solution generally contains ions to be plated onto the
surface of the substrate, and therefore, the application of the
electrical bias causes these ions to be urged out of the
electrolyte solution and to be plated onto the biased seed
layer.
[0007] Conventional chemical plating cells generally utilize a
horizontally positioned plating cell and a pivot-type substrate
immersion process. However, pivotal immersion processes are known
to generate bubbles on the substrate surface as a result of the
varying immersion angle generated by the pivotal immersion
apparatuses. These bubbles are known to cause plating uniformity
problems, and therefore, minimization of bubbles is desirable.
Further, during the pivotal immersion process of conventional
plating cells the substrate surface is not parallel to the anode of
the plating cell, and therefore, the electric field across the
surface of the substrate is not constant, which also causes
uniformity problems.
[0008] Therefore, there is a need for an improved electrochemical
plating cell configured to provide for an immersion process that
includes maintaining the substrate at a constant immersion angle
during both the immersion and plating processes.
SUMMARY OF THE INVENTION
[0009] Embodiments of the invention may generally provide a small
volume electrochemical plating cell. The plating cell generally
includes a fluid basin configured to contain a plating solution
therein, the fluid basin having a substantially horizontal upper
weir. The cell further includes an anode positioned in a lower
portion of the fluid basin, the anode having a plurality of
parallel channels formed therethrough, and a base member configured
to receive the anode, the base member having a plurality of groves
formed into an anode receiving surface, each of the plurality of
grooves terminating into an annular drain channel. A membrane
support assembly configured to position a membrane immediately
above the anode in a substantially planar orientation with respect
to the anode surface is provided, the membrane support assembly
having a plurality of channels and bores formed therein.
[0010] Embodiments of the invention may further provide a membrane
support assembly having bores formed partially therethrough from an
upper surface and a plurality of channels formed partially
therethrough from a lower substrate support surface. The membrane
support assembly being configured to support a membrane immediately
above an anode in a substantially planar orientation, while the
membrane also is allowed to slightly deform into the channels so
that bubbles and other light fluids may be urged to the perimeter
of the membrane and drained from the anode chamber.
[0011] Embodiments of the invention may further provide a base
member for an anode assembly. The base member generally includes a
recessed portion configured to receive the anode. The walls of the
recessed portion include a plurality of fluid passage channels
formed therein. Further, the base of the recessed portion includes
an annular drain channel and a plurality of channels extending
across the base and terminating at both ends into the drain
channel.
[0012] Embodiments of the invention further provide an apparatus
for electrochemically plating a metal on a substrate. The apparatus
generally includes a fluid basin configured to contain a plating
solution, the fluid basin having a substantially horizontal upper
weir, a membrane positioned across an inner circumference of the
fluid basin, the membrane being configured to separate a cathode
chamber positioned in an upper portion of the fluid basin from an
anode chamber positioned in a lower portion of the fluid basin, a
first fluid inlet configured to supply a catholyte solution to the
cathode chamber and a second fluid inlet configured to supply an
anolyte solution to the anode chamber, the catholyte and anolyte
being different solutions, and an anode positioned in the anode
chamber, the anode having a substantially planar upper surface that
is positioned at an angle with respect to substantially planar
upper weir.
[0013] Embodiments of the invention further provide a small volume
electrochemical plating cell. The electrochemical plating cell
generally includes a fluid basin configured to contain a plating
solution, an anode positioned in the fluid basin, a membrane
positioned above the anode across the fluid basin, and a diffusion
plate positioned across the fluid basin above the membrane, the
diffusion plate and anode being positioned in parallel orientation
to each other and at a tilt angle with respect to an upper surface
of the plating solution.
BRIEF DESCRIPTION OF THE DRAWINGS
[0014] So that the manner in which the above recited features of
the present invention can be understood in detail, a more
particular description of the invention, briefly summarized above,
may be had by reference to embodiments, some of which are
illustrated in the appended drawings. It is to be noted, however,
that the appended drawings illustrate only typical embodiments of
this invention and are therefore not to be considered limiting of
its scope, for the invention may admit to other equally effective
embodiments.
[0015] FIG. 1 illustrates a partial sectional perspective view of
an exemplary electrochemical plating slim cell of the
invention.
[0016] FIG. 2 illustrates a perspective view of an anode base plate
of the invention.
[0017] FIG. 3 illustrates a perspective view of an exemplary anode
base plate of the invention having an anode positioned therein.
[0018] FIG. 4 illustrates an exploded perspective view of an
exemplary membrane support member of the invention.
[0019] FIG. 5 illustrates a partial sectional view of an edge of
the plating cell of the invention.
DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENT
[0020] The present invention generally provides an electrochemical
plating cell configured to plate metal onto semiconductor
substrates using a small volume cell, i.e., a cell weir volume that
houses less than about 4 liters of electrolyte in the cell itself,
preferably between about 1 and 3 liters, and potentially between
about 2 and about 8 liters of electrolyte solution in an adjacent
fluidly connected supply tank. These small volumes of fluid
required to operate the cell of the invention allow the
electroplating cell to be used for a predetermined range of
substrates, i.e., 100-200, and then the solution may be discarded
and replaced with new solution. The electrochemical plating cell is
generally configured to fluidly isolate an anode of the plating
cell from a cathode or plating electrode of the plating cell via a
cation membrane positioned between the substrate being plated and
the anode of the plating cell. Additionally, the plating cell of
the invention is generally configured to provide a first fluid
solution to an anode compartment, i.e., the volume between the
upper surface of the anode 105 and the lower surface of the
membrane 502, and a second fluid solution (a plating solution) to
the cathode compartment, i.e., the volume of fluid positioned above
the upper membrane surface. The anode 105 of the plating cell
generally includes a plurality of slots formed therein, the
plurality of slots being positioned parallel to each other and are
configured to remove a concentrated hydrodynamic Newtonian fluid
layer from the anode surface during plating processes. A membrane
support assembly 106 having a plurality of slots or channels formed
in a first side of the assembly, along with a plurality of bores
formed into a second side of the membrane support assembly, wherein
the plurality of bores are in fluid communication with the slots on
the opposing side of the membrane support assembly.
[0021] FIG. 1 illustrates a perspective and partial sectional view
of an exemplary electrochemical plating cell 100 of the invention.
Plating cell 100 generally includes an outer basin 101 and an inner
basin 102 positioned within outer basin 101. Inner basin 102 is
generally configured to contain a plating solution that is used to
plate a metal, e.g., copper, onto a substrate during an
electrochemical plating process. During the plating process, the
plating solution is generally continuously supplied to inner basin
102 (at about 1 gallon per minute for a 3-4 liter plating cell, for
example), and therefore, the plating solution continually overflows
the uppermost point of inner basin 102 and runs into outer basin
101. The overflow plating solution is then collected by outer basin
101 and drained therefrom for recirculation into basin 102. As
illustrated in FIG. 1, plating cell 100 is generally positioned at
a tilt angle, i.e., the frame portion 103 of plating cell 100 is
generally elevated on one side such that the components of plating
cell 100 are tilted between about 3.degree. and about 30.degree..
Therefore, in order to contain an adequate depth of plating
solution within inner basin 102 during plating operations, the
uppermost portion of basin 102 may be extended upward on one side
of plating cell 100, such that the uppermost point of inner basin
102 is generally horizontal and allows for contiguous overflow of
the plating solution supplied thereto around the perimeter of basin
102.
[0022] The frame member 103 of plating cell 100 generally includes
an annular base member 104 secured to frame member 103. Since frame
member 103 is elevated on one side, the upper surface of base
member 104 is generally tilted from horizontal at an angle that
corresponds to the angle of frame member 103 relative to a
horizontal position. Base member 104 includes an annular or disk
shaped recess formed therein, the annular recess being configured
to receive a disk shaped anode 105. Base member 104 further
includes a plurality of fluid inlets/drains 109 positioned on a
lower surface thereof. Each of the fluid inlets/drains 109 are
generally configured to individually supply or drain a fluid to or
from either the anode compartment or the cathode compartment of
plating cell 100. Anode 105 generally includes a plurality of slots
107 formed therethrough, wherein the slots 107 are generally
positioned in parallel orientation with each other across the
surface of the anode 105, as illustrated in FIG. 3. The parallel
orientation of the slots along with the tilt angle allows for dense
fluids generated at the anode surface to flow downwardly across the
anode surface and into one of the slots 107. Plating cell 100
further includes a membrane support assembly 106. Membrane support
assembly 106 is generally secured at an outer periphery thereof to
base member 104, and includes an interior region 108 configured to
allow fluids to pass therethrough via a sequence of oppositely
positioned slots and bores. The membrane support assembly 106 may
include an o-ring type seal positioned near a perimeter of the
membrane support assembly 106, wherein the seal is configured to
prevent fluids from traveling from one side of the membrane 502
secured on the membrane support 106 to the other side of the
membrane 502.
[0023] FIG. 2 illustrates a perspective view of base member 104.
The upper surface of base member 104 generally includes an recess
region 201 configured to receive a disk shaped anode 105 in the
recessed portion. Further, the surface of recess region 201
generally includes a plurality of channels 202 formed therein. Each
of channels 202 are generally positioned in parallel orientation
with each other and terminate at the periphery of recess region
201. Additionally, the periphery of recessed region 201 also
includes an annular drain channel 203 that extends around the
perimeter of recessed region 201. Each of the plurality of parallel
positioned channels 202 terminate at opposing ends into annular
drain channel 203. Therefore, channels 202 may receive dense fluids
from slots 302, as illustrated in FIG. 3, and transmit the dense
fluids to a drain channel 203 via base channels 202. The vertical
wall that defines recessed region 201 generally includes a
plurality of slots 204 formed into the wall. The slots 204 are
generally positioned in parallel orientation with each other, and
further, are generally positioned in parallel orientation with the
plurality of channels 202 formed into the lower surface of recessed
region 201. Base member 104 also includes at least one fluid supply
conduit 205 configured to dispense a fluid into the anode region of
plating cell 100, along with at least one plating solution supply
conduit 206 that is configured to dispense a plating solution into
the cathode compartment of plating cell 100. The respective supply
conduits 205 and 206 are generally in fluid communication with at
least one fluid inlets/drains 109 positioned on a lower surface of
base member 104, as illustrated in FIG. 1. Base member 104
generally includes a plurality of conduits formed therethrough (not
shown), wherein the conduits are configured to direct fluids
received by individual fluid inlets/drains 109 to the respective
cathode and anode chambers of plating cell 100 via conduits 205,
206.
[0024] FIG. 3 illustrates a perspective view of base member 104
having the disk shaped anode 105 positioned therein. Anode 105,
which is generally a disk shaped copper member, i.e., a
soluble-type copper anode generally used to support copper
electrochemical plating operations, generally includes a plurality
of slots 302 formed therein. The slots 302 generally extend through
the interior of anode 105 and are in fluid communication with both
the upper surface and lower surface of anode 105. As such, slots
302 allow fluids to travel through the interior of anode 105 from
the upper surface to the lower surface. Slots 302 are positioned in
parallel orientation with each other. However, when anode 105 is
positioned within recess region 201 of base member 104, the
parallel slots 302 of anode 105 are generally positioned orthogonal
to both slots 204 and channels 202 of base member 104, as
illustrated in FIG. 3. Additionally, slots 302 generally do not
continuously extend across the upper surface of anode 105. Rather,
slots 302 are broken into a longer segment 303 and a shorter
segment 304, with a space 305 between the two segments, which
operates to generate a longer current path through anode 105 from
one side to the other. Further, adjacently positioned slots 302
have the space 305 positioned on opposite sides of the anode upper
surface. The current path from the lower side of anode to the upper
side of anode generally includes a back and forth type path between
the respective slots 302 through the spaces 305. Further, the
positioning of spaces 305 and slots 302 provides for improved
concentrated Newtonian fluid removal from the surface of the anode
105, as the positioning of slots 302 provides a shortest possible
distance of travel for the dense fluids to be received in slots
302.
[0025] FIG. 4 illustrates an exploded perspective view of an
exemplary membrane support assembly 106 of the invention. Membrane
support assembly 106 generally includes an upper ring shaped
support member 401, an intermediate membrane support member 400,
and a lower support member 402. Upper and lower support member's
401 and 402 are generally configured to provide structural support
to intermediate membrane support member 400, i.e., upper support
member 401 operates to secure intermediate membrane support member
400 to lower support member 402, while lower support member 402
receives intermediate membrane support member 400. Intermediate
membrane support member 400 generally includes a substantially
planar upper surface having a plurality of bores partially formed
therethrough. A lower surface of intermediate membrane support
member 400 generally includes a tapered outer portion 403 and a
substantially planar inner membrane engaging surface 406. An upper
surface of lower support member 402 may include a corresponding
tapered portion configured to receive the tapered section 403 of
intermediate membrane support member 400 thereon. The membrane
engaging surface 406 generally includes a plurality of parallel
positioned/orientated channels 405. Each of the channels 405 formed
into the lower surface of intermediate membrane support member 400
are in fluid communication with at least one of the plurality of
bores (not shown) partially formed through the planar upper
surface. The channels 405 operate to allow a membrane (shown in
FIG. 5) positioned in the membrane support assembly 400 to deform
slightly upward in the region of the channels 405, which provides a
flow path for air bubbles and less dense fluids in the cathode
chamber to travel to the perimeter of the membrane and be evacuated
from the anode chamber.
[0026] In operation, the plating cell 100 of the invention provides
a small volume (electrolyte volume) processing cell that may be
used for copper electrochemical plating processes, for example.
Plating cell 100 may be horizontally positioned or positioned in a
tilted orientation, i.e., where one side of the cell is elevated
vertically higher than the opposing side of the cell, as
illustrated in FIG. 1. If plating cell 101 is implemented in a
tilted configuration, then a tilted head assembly and substrate
support member may be utilized to immerse the substrate at a
constant immersion angle, i.e., immerse the substrate such that the
angle between the substrate and the upper surface of the
electrolyte does not change during the immersion process. Further,
the immersion process may include a varying immersion velocity,
i.e., an increasing velocity as the substrate becomes immersed in
the electrolyte solution. The combination of the constant immersion
angle and the varying immersion velocity operates to eliminate air
bubbles on the substrate surface.
[0027] Assuming a tilted implementation is utilized, a substrate is
first immersed into a plating solution contained within inner basin
102. Once the substrate is immersed in the plating solution, which
generally contains copper sulfate, chlorine, and one or more of a
plurality of organic plating additives (levelers, suppressors,
accelerators, etc.) configured to control plating parameters, an
electrical plating bias is applied between a seed layer on the
substrate and the anode 105 positioned in a lower portion of
plating cell 100. The electrical plating bias generally operates to
cause metal ions in the plating solution to deposit on the cathodic
substrate surface. The plating solution supplied to inner basin 102
is continually circulated through inner basin 102 via fluid
inlets/drains 109 More particularly, the plating solution may be
introduced into plating cell 100 via a fluid inlets/drains 109. The
solution may travel across the lower surface of base member 104 and
upward through one of plating solution supply conduits 206. The
plating solution may then be introduced into the cathode chamber
via a channel formed into plating cell 100 that communicates with
the cathode chamber at a point above membrane support 106, as
illustrated and described with respect to FIG. 5. Similarly, the
plating solution may be removed from the cathode chamber via a
fluid drain positioned above membrane support 106, where the fluid
drain is in fluid communication with one of fluid inlets/drains 109
positioned on the lower surface of base member 104 via one of
plating solution supply conduits 206. For example, base member 104
may include first and second plating solution supply conduits 206
positioned on opposite sides of base member 104. The oppositely
positioned plating solution supply conduits 206 may operate to
individually introduce and drain the plating solution from the
cathode chamber in a predetermined direction, which also allows for
flow direction control. The flow control direction provides control
over removal of light fluids at the lower membrane surface, removal
of bubbles from the anode chamber, and assists in the removal of
dense or heavy fluids from the anode surface via the channels 202
formed into base 104.
[0028] Once the plating solution is introduced into the cathode
chamber, the plating solution travels upward through diffusion
plate 110. Diffusion plate 110, which is generally a ceramic or
other porous disk shaped member, generally operates as a fluid flow
restrictor to even out the flow pattern across the surface of the
substrate. Further, the diffusion plate 110 operates to resistively
damp electrical variations in the electrochemically active area
between the anode and the cation membrane surface, which is known
to reduce plating uniformities. Additionally, embodiments of the
invention contemplate that the ceramic diffusion plate 110 may be
replaced by a hydrophilic plastic member, i.e., a treated PE
member, an PVDF member, a PP member, or other material that is
known to be porous and provide the electrically resistive damping
characteristics provided by ceramics. However, the plating solution
introduced into the cathode chamber, which is generally a plating
catholyte solution, i.e., a plating solution with additives, is not
permitted to travel downward through the membrane 502 positioned on
the lower surface 404 of membrane support assembly 106 into the
anode chamber, as the anode chamber is fluidly isolated from the
cathode chamber by the membrane. The anode chamber includes
separate individual fluid supply and drain sources configured to
supply an anolyte solution to the anode chamber. The solution
supplied to the anode chamber, which may generally be copper
sulfate in a copper electrochemical plating system, circulates
exclusively through the anode chamber and does not diffuse or
otherwise travel into the cathode chamber, as the membrane
positioned on membrane support assembly 106 is not fluid permeable
in either direction.
[0029] Additionally, the flow of the fluid solution (anolyte, i.e.,
a plating solution without additives, which may be referred to as a
virgin solution) into the anode chamber is directionally controlled
in order to maximize plating parameters. For example, anolyte may
be communicated to the anode chamber via an individual fluid
inlets/drains 109. Fluid inlets/drains 109 is in fluid
communication with a fluid channel formed into a lower portion of
base member 104 and the fluid channel communicates the anolyte to
one of fluid supply conduits 205. A seal positioned radially
outward of fluid supply conduits 205, in conjunction with the
surrounding structure, directs the anolyte flowing out of fluid
supply conduits 205 upward and into slots 204. Thereafter, the
anolyte generally travels across the upper surface of the anode 105
towards the opposing side of base member 104, which in a tilted
configuration, is generally the side of plating cell 100. The
anolyte travels across the surface of the anode below the membrane
positioned immediately above. Once the anolyte reaches the opposing
side of anode 105, it is received into a corresponding fluid
channel 204 and drained from plating cell 100 for recirculation
thereafter.
[0030] During plating operations, the application of the electrical
plating bias between the anode and the cathode generally causes a
breakdown of the anolyte solution contained within the anode
chamber. More particularly, the application of the plating bias
operates to generate multiple hydrodynamic or Newtonian layers of
the copper sulfate solution within the anode chamber. The
hydrodynamic layers generally include a layer of concentrated
copper sulfate positioned proximate the anode, an intermediate
layer of normal copper sulfate, and a top layer of lighter and
depleted copper sulfate proximate the membrane. The depleted layer
is generally a less dense and lighter layer of copper sulfate than
the copper sulfate originally supplied to the anode compartment,
while the concentrated layer is generally a heavier and denser
layer of copper sulfate having a very viscous consistency. The
dense consistency of the concentrated layer proximate the anode
causes electrical conductivity problems (known as anode
passivation) in anodes formed without slots 302. However, slots
302, in conjunction with the tilted orientation of plating cell
100, operate to receive the concentrated viscous layer of copper
sulfate and remove the layer from the surface of the anode, which
eliminates conductivity variances. Further, plating cell 100
generally includes one side that is tilted upward or vertically
positioned above the other side, and therefore, the surface of
anode 105 is generally a plane that is also tilted. The tilt causes
the layer of concentrated copper sulfate generated at the surface
of the anode to generally flow downhill as a result of the
gravitational force acting thereon. As the concentrated copper
sulfate layer flows downhill, it is received within one of slots
302 and removed from the surface of the anode 105. As discussed
above, slots 302 are generally parallel to each other and are
orthogonal to the slots 204. Therefore, slots 302 are also
orthogonal to channels 202 and formed into the lower surface of
base member 104. As such, each of slots 302 finally intersects
several of channels 202. This configuration allows the concentrated
copper sulfate received within slots 302 to be communicated to one
or more of channels 202. Thereafter, the concentrated copper
sulfate may be communicated via channels 202 to the annular drain
channel 203 positioned within recess 201. The drain channel 203 in
communication with channels 202 may generally be communicated
through base plate 104 and back to a central anolyte supply tank,
where the concentrated copper sulfate removed from the anode
surface may be recombined with a volume of stored copper sulfate
used for the anolyte solution.
[0031] Similarly, the upper portion of anode chamber generates a
diluted layer of copper sulfate proximate the membrane. The diluted
layer of copper sulfate may be removed from the anode chamber via
an air vent/drain 501, as illustrated in FIG. 5. Air vent/drain
501, which may include multiple ports, is generally positioned on
the upper side of electrochemical plating cell 100, and therefore,
is positioned to receive both bubbles trapped within anode chamber,
as well as the diluted copper sulfate generated at the membrane
surface. Air vent/drain 501 are generally in fluid communication
with the anolyte tank discussed above, and therefore, communicates
the diluted copper sulfate received therein back to the anolyte
tank, where the diluted copper sulfate may combine with the
concentrated copper sulfate removed via slots 302 to form the
desired concentration of copper sulfate within the anolyte tank.
Any bubbles trapped by air vent/drain 501 may also be removed from
the cathode chamber vented to atmosphere or simply maintained
within the anolyte tank and not recirculated into the cathode
chamber.
[0032] While the foregoing is directed to embodiments of the
present invention, other and further embodiments of the invention
may be devised without departing from the basic scope thereof, and
the scope thereof is determined by the claims that follow
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