Kovarsky; Nicolay

Patent Applications and Registrations

Patent applications and USPTO patent grants for Kovarsky; Nicolay.The latest application filed is for "oxygen-doping for non-carbon radical-component cvd films".

Company Profile

0.8.14

Kovarsky; Nicolay - Sunnyvale CA US

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Oxygen-doping for non-carbon radical-component CVD films Grant 8,980,382 - Ingle , et al. March 17, 2	2015-03-17
Oxygen-doping For Non-carbon Radical-component Cvd Films App 20110129616 - Ingle; Nitin ; et al.	2011-06-02
Electrochemical processing cell Grant 7,247,222 - Yang , et al. July 24, 2	2007-07-24
Electrochemical processing cell App 20060237307 - Yang; Michael X. ; et al.	2006-10-26
Contact plating apparatus App 20060124468 - Kovarsky; Nicolay ; et al.	2006-06-15
Contact plating apparatus Grant 7,025,861 - Kovarsky , et al. April 11, 2	2006-04-11
Electrochemical plating cell with a counter electrode in an isolated anolyte compartment App 20050284751 - Kovarsky, Nicolay ; et al.	2005-12-29
Plating chemistry and method of single-step electroplating of copper on a barrier metal App 20050274622 - Sun, Zhi-Wen ; et al.	2005-12-15
Apparatus and method for removing contaminants from semiconductor copper electroplating baths Grant 6,878,258 - Kovarsky April 12, 2	2005-04-12
Insoluble electrode for electrochemical operations on substrates Grant 6,852,209 - Kovarsky February 8, 2	2005-02-08
Contact plating apparatus App 20040154915 - Kovarsky, Nicolay ; et al.	2004-08-12
Potential pulse-scan methods of analyzing organic additives in plating baths with multi-component additives Grant 6,773,569 - Sun , et al. August 10, 2	2004-08-10
Insoluble electrode for electrochemical operations on substrates App 20040065543 - Kovarsky, Nicolay	2004-04-08
Electroplating of semiconductor wafers Grant 6,685,815 - Kovarsky February 3, 2	2004-02-03
Electrochemical processing cell App 20040016636 - Yang, Michael X. ; et al.	2004-01-29
Electroplating cell with copper acid correction module for substrate interconnect formation App 20040000491 - Kovarsky, Nicolay ; et al.	2004-01-01
Potential pulse-scan methods of analyzing organic additives in plating baths with multi-component additives App 20030209440 - Sun, Zhi-Wen ; et al.	2003-11-13
Electrochemical method for direct organic additives analysis in copper baths App 20030201191 - Kovarsky, Nicolay ; et al.	2003-10-30
Apparatus and method for removing contaminants from semiconductor copper electroplating baths App 20030150736 - Kovarsky, Nicolay	2003-08-14
Electroplating of semiconductor wafers App 20030132118 - Kovarsky, Nicolay	2003-07-17
Apparatus and method of evaluating electroplating solutions and conditions App 20030029726 - Kovarsky, Nicolay ; et al.	2003-02-13

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