| Patent | Date |
|---|
Processing of Semiconductors Using Vaporized Solvents
App 20220223405 - Meng; Shuang ; et al. | 2022-07-14 |
Silicon mandrel etch after native oxide punch-through
Grant 11,387,115 - Yan , et al. July 12, 2 | 2022-07-12 |
Processing of workpieces with reactive species generated using alkyl halide
Grant 11,387,111 - Yang , et al. July 12, 2 | 2022-07-12 |
Arc Lamp With Forming Gas For Thermal Processing Systems
App 20220165561 - Yang; Michael X. ; et al. | 2022-05-26 |
Processing of workpieces using ozone gas and hydrogen radicals
Grant 11,315,801 - Zhang , et al. April 26, 2 | 2022-04-26 |
Processing of semiconductors using vaporized solvents
Grant 11,289,323 - Meng , et al. March 29, 2 | 2022-03-29 |
Selective Etch Process Using Hydrofluoric Acid and Ozone Gases
App 20220084839 - Zhang; Qi ; et al. | 2022-03-17 |
Spacer etching process
Grant 11,276,560 - Sung , et al. March 15, 2 | 2022-03-15 |
Generation of Hydrogen Reactive Species For Processing of Workpieces
App 20220059321 - Zhang; Qi ; et al. | 2022-02-24 |
Spacer open process by dual plasma
Grant 11,195,718 - Sung , et al. December 7, 2 | 2021-12-07 |
Processing of Workpieces Using Ozone Gas and Hydrogen Radicals
App 20210366727 - Zhang; Qi ; et al. | 2021-11-25 |
Selective etch process using hydrofluoric acid and ozone gases
Grant 11,183,397 - Zhang , et al. November 23, 2 | 2021-11-23 |
Processing of workpieces using hydrogen radicals and ozone gas
Grant 11,164,727 - Xie , et al. November 2, 2 | 2021-11-02 |
Selective deposition using methylation treatment
Grant 11,164,742 - Yang , et al. November 2, 2 | 2021-11-02 |
Generation of hydrogen reactive species for processing of workpieces
Grant 11,164,725 - Zhang , et al. November 2, 2 | 2021-11-02 |
Plasma Processing Apparatus and Methods
App 20210257196 - Ma; Shawming ; et al. | 2021-08-19 |
Surface treatment of substrates using passivation layers
Grant 11,094,528 - Gao , et al. August 17, 2 | 2021-08-17 |
Surface treatment of silicon or silicon germanium surfaces using organic radicals
Grant 11,062,910 - Yang , et al. July 13, 2 | 2021-07-13 |
Ozone treatment for selective silicon nitride etch over silicon
Grant 11,043,393 - Wang , et al. June 22, 2 | 2021-06-22 |
Control System For Adaptive Control Of A Thermal Processing System
App 20210132592 - Yang; Michael X. ; et al. | 2021-05-06 |
Selective Etch Process Using Hydrofluoric Acid and Ozone Gases
App 20210118694 - Zhang; Qi ; et al. | 2021-04-22 |
Integration of materials removal and surface treatment in semiconductor device fabrication
Grant 10,964,528 - Yang , et al. March 30, 2 | 2021-03-30 |
Methods For The Treatment Of Workpieces
App 20210082724 - Xie; Ting ; et al. | 2021-03-18 |
Method for processing a workpiece
Grant 10,950,428 - Xie , et al. March 16, 2 | 2021-03-16 |
Spacer Etching Process
App 20210066047 - Sung; Tsai Wen ; et al. | 2021-03-04 |
Method for Processing a Workpiece
App 20210066074 - Xie; Ting ; et al. | 2021-03-04 |
Surface treatment of carbon containing films using organic radicals
Grant 10,910,228 - Yang , et al. February 2, 2 | 2021-02-02 |
Processing Of Workpieces Using Deposition Process And Etch Process
App 20210020445 - Wang; Shanyu ; et al. | 2021-01-21 |
Processing Of Workpieces Using Hydrogen Radicals And Ozone Gas
App 20210020413 - Xie; Ting ; et al. | 2021-01-21 |
Spacer Open Process By Dual Plasma
App 20210005456 - Sung; Tsai Wen ; et al. | 2021-01-07 |
Thermal Processing System With Transmission Switch Plate
App 20200396798 - Yang; Michael X. ; et al. | 2020-12-17 |
Surface Pretreatment Process To Improve Quality Of Oxide Films Produced By Remote Plasma
App 20200373129 - Xie; Ting ; et al. | 2020-11-26 |
Systems And Methods For Transportation Of Replaceable Parts In a Vacuum Processing Apparatus
App 20200365381 - Zucker; Martin L. ; et al. | 2020-11-19 |
Selective Deposition Using Methylation Treatment
App 20200350161 - Yang; Michael X. ; et al. | 2020-11-05 |
Hydrogen Assisted Atmospheric Radical Oxidation
App 20200350158 - Yang; Michael X. ; et al. | 2020-11-05 |
Surface treatment of silicon and carbon containing films by remote plasma with organic precursors
Grant 10,804,109 - Yang , et al. October 13, 2 | 2020-10-13 |
Thermal Processing System With Temperature Non-Uniformity Control
App 20200294826 - Yang; Michael X. ; et al. | 2020-09-17 |
Thermal imaging of heat sources in thermal processing systems
Grant 10,760,976 - Yang Sep | 2020-09-01 |
Post Plasma Gas Injection In A Separation Grid
App 20200243305 - Zeng; Weimin ; et al. | 2020-07-30 |
Method for Processing a Workpiece Using a Multi-Cycle Thermal Treatment Process
App 20200234983 - Yang; Michael X. ; et al. | 2020-07-23 |
Ozone Treatment for Selective Silicon Nitride Etch Over Silicon
App 20200234969 - Wang; Shanyu ; et al. | 2020-07-23 |
Silicon Mandrel Etch After Native Oxide Punch-through
App 20200203182 - Yan; Chun ; et al. | 2020-06-25 |
Integration Of Materials Removal And Surface Treatment In Semiconductor Device Fabrication
App 20200185216 - Yang; Michael X. ; et al. | 2020-06-11 |
Systems And Methods For Workpiece Processing
App 20200161162 - Yang; Michael X. ; et al. | 2020-05-21 |
Ozone for Selective Hydrophilic Surface Treatment
App 20200118813 - Xie; Ting ; et al. | 2020-04-16 |
Systems And Methods For Thermal Processing And Temperature Measurement Of A Workpiece At Low Temperatures
App 20200064198 - Bremensdorfer; Rolf ; et al. | 2020-02-27 |
Method for processing a workpiece using a multi-cycle thermal treatment process
Grant 10,573,532 - Yang , et al. Feb | 2020-02-25 |
Methods And Apparatus For Post Exposure Bake Processing Of A Workpiece
App 20190384178 - Yang; Michael X. | 2019-12-19 |
Method for Processing a Workpiece Using a Multi-Cycle Thermal Treatment Process
App 20190385862 - Yang; Michael X. ; et al. | 2019-12-19 |
Generation of Hydrogen Reactive Species For Processing of Workpieces
App 20190378692 - Zhang; Qi ; et al. | 2019-12-12 |
Processing Of Workpieces With Reactive Species Generated Using Alkyl Halide
App 20190318937 - Yang; Michael X. ; et al. | 2019-10-17 |
Thermal Imaging Of Heat Sources In Thermal Processing Systems
App 20190316972 - Yang; Michael X. | 2019-10-17 |
Surface Treatment Of Silicon Or Silicon Germanium Surfaces Using Organic Radicals
App 20190304793 - Yang; Michael X. ; et al. | 2019-10-03 |
Support Plate for Localized Heating in Thermal Processing Systems
App 20190295869 - Bremensdorfer; Rolf ; et al. | 2019-09-26 |
Integration of materials removal and surface treatment in semiconductor device fabrication
Grant 10,403,492 - Yang , et al. Sep | 2019-09-03 |
Surface treatment of silicon or silicon germanium surfaces using organic radicals
Grant 10,354,883 - Yang , et al. July 16, 2 | 2019-07-16 |
Surface Treatment Of Carbon Containing Films Using Organic Radicals
App 20190214262 - Yang; Michael X. ; et al. | 2019-07-11 |
Plasma Processing Apparatus and Methods
App 20190198301 - Ma; Shawming ; et al. | 2019-06-27 |
Processing of Semiconductors Using Vaporized Solvents
App 20190189479 - Meng; Shuang ; et al. | 2019-06-20 |
Surface Treatment of Substrates Using Passivation Layers
App 20190189420 - Gao; Tongchuan ; et al. | 2019-06-20 |
Methods and systems for disrupting calcified walls of biological conduits and calcified lesions therein
Grant 10,299,820 - Kohler , et al. | 2019-05-28 |
Surface treatment of carbon containing films using organic radicals
Grant 10,269,574 - Yang , et al. | 2019-04-23 |
Surface Treatment Of Carbon Containing Films Using Organic Radicals
App 20190103280 - Yang; Michael X. ; et al. | 2019-04-04 |
Surface Treatment Of Silicon Or Silicon Germanium Surfaces Using Organic Radicals
App 20190103279 - Yang; Michael X. ; et al. | 2019-04-04 |
Surface Treatment Of Silicon And Carbon Containing Films By Remote Plasma With Organic Precursors
App 20190103270 - Yang; Michael X. ; et al. | 2019-04-04 |
Surface treatment of substrates using passivation layers
Grant 10,217,626 - Gao , et al. Feb | 2019-02-26 |
Methods And Systems For Disrupting Calcified Walls Of Biological Conduits And Calcified Lesions Therein
App 20160242805 - Kohler; Robert E. ; et al. | 2016-08-25 |
Formation of a tantalum-nitride layer
Grant 9,012,334 - Seutter , et al. April 21, 2 | 2015-04-21 |
Formation Of A Tantalum-nitride Layer
App 20120178256 - Seutter; Sean M. ; et al. | 2012-07-12 |
Die-to-robot alignment for die-to-substrate bonding
Grant 8,123,881 - Cox , et al. February 28, 2 | 2012-02-28 |
Formation of a tantalum-nitride layer
Grant 8,114,789 - Seutter , et al. February 14, 2 | 2012-02-14 |
Dual Heating For Precise Wafer Temperature Control
App 20110185969 - Yang; Michael X. | 2011-08-04 |
Formation Of A Tantalum-nitride Layer
App 20100311237 - Seutter; Sean M. ; et al. | 2010-12-09 |
Method to deposit organic grafted film on barrier layer
Grant 7,820,026 - Hafezi , et al. October 26, 2 | 2010-10-26 |
Apparatus and method for plasma assisted deposition
Grant 7,779,784 - Chen , et al. August 24, 2 | 2010-08-24 |
Formation of a tantalum-nitride layer
Grant 7,781,326 - Seutter , et al. August 24, 2 | 2010-08-24 |
Methods for depositing tungsten layers employing atomic layer deposition techniques
Grant 7,745,333 - Lai , et al. June 29, 2 | 2010-06-29 |
Plasma-enhanced cyclic layer deposition process for barrier layers
Grant 7,732,325 - Yang , et al. June 8, 2 | 2010-06-08 |
Anolyte for copper plating
Grant 7,670,465 - Yang , et al. March 2, 2 | 2010-03-02 |
Formation of composite tungsten films
Grant 7,605,083 - Lai , et al. October 20, 2 | 2009-10-20 |
Material Modification In Solar Cell Fabrication With Ion Doping
App 20090162970 - Yang; Michael X. | 2009-06-25 |
Die-to-robot Alignment For Die-to-substrate Bonding
App 20090126851 - Cox; Damon K. ; et al. | 2009-05-21 |
Three Dimensional Packaging With Wafer-level Bonding And Chip-level Repair
App 20090130821 - Cox; Damon K. ; et al. | 2009-05-21 |
Multiple-step Electrodeposition Process For Direct Copper Plating On Barrier Metals
App 20090120799 - Sun; Zhi-Wen ; et al. | 2009-05-14 |
Plasma-enhanced Cyclic Layer Deposition Process For Barrier Layers
App 20090111264 - YANG; MICHAEL X. ; et al. | 2009-04-30 |
Contact metallization scheme using a barrier layer over a silicide layer
Grant 7,514,353 - Weidman , et al. April 7, 2 | 2009-04-07 |
Slim cell platform plumbing
Grant 7,473,339 - D'Ambra , et al. January 6, 2 | 2009-01-06 |
Plasma-enhanced cyclic layer deposition process for barrier layers
Grant 7,473,638 - Yang , et al. January 6, 2 | 2009-01-06 |
Methods For Depositing Tungsten Layers Employing Atomic Layer Deposition Techniques
App 20080280438 - Lai; Ken Kaung ; et al. | 2008-11-13 |
Formation Of Composite Tungsten Films
App 20080227291 - LAI; KEN K. ; et al. | 2008-09-18 |
Methods for depositing tungsten layers employing atomic layer deposition techniques
Grant 7,405,158 - Lai , et al. July 29, 2 | 2008-07-29 |
Formation of composite tungsten films
Grant 7,384,867 - Lai , et al. June 10, 2 | 2008-06-10 |
Anolyte For Copper Plating
App 20070175752 - Yang; Michael X. ; et al. | 2007-08-02 |
Method For Planarization During Plating
App 20070170066 - BEAUDRY; CHRISTOPHER LAURENT ; et al. | 2007-07-26 |
Electrochemical processing cell
Grant 7,247,222 - Yang , et al. July 24, 2 | 2007-07-24 |
Reliability Barrier Integration For Cu Application
App 20070151861 - XI; MING ; et al. | 2007-07-05 |
Multi-chemistry plating system
Grant 7,223,323 - Yang , et al. May 29, 2 | 2007-05-29 |
Integrated Electroless Deposition System
App 20070111519 - Lubomirsky; Dmitry ; et al. | 2007-05-17 |
Integration Process Of Tungsten Atomic Layer Deposition For Metallization Application
App 20070099415 - Chen; Ling ; et al. | 2007-05-03 |
Valve control system for atomic layer deposition chamber
Grant 7,201,803 - Lu , et al. April 10, 2 | 2007-04-10 |
Plasma-enhanced Cyclic Layer Deposition Process For Barrier Layers
App 20060292864 - Yang; Michael X. ; et al. | 2006-12-28 |
Method to deposit organic grafted film on barrier layer
App 20060269658 - Hafezi; Hooman ; et al. | 2006-11-30 |
Multiple Chemistry Electrochemical Plating Method
App 20060266655 - SUN; ZHI-WEN ; et al. | 2006-11-30 |
Contact metallization scheme using a barrier layer over a silicide layer
App 20060251800 - Weidman; Timothy W. ; et al. | 2006-11-09 |
Anolyte for copper plating
Grant 7,128,823 - Yang , et al. October 31, 2 | 2006-10-31 |
Electrochemical processing cell
App 20060237307 - Yang; Michael X. ; et al. | 2006-10-26 |
Cu Ecp Planarization By Insertion Of Polymer Treatment Step Between Gap Fill And Bulk Fill Steps
App 20060237325 - YANG; MICHAEL X. | 2006-10-26 |
Formation of a tantalum-nitride layer
Grant 7,094,680 - Seutter , et al. August 22, 2 | 2006-08-22 |
Integration of titanium and titanium nitride layers
Grant 7,094,685 - Yang , et al. August 22, 2 | 2006-08-22 |
Apparatus and method for plasma assisted deposition
App 20060075966 - Chen; Chen-An ; et al. | 2006-04-13 |
Reliability barrier integration for Cu application
Grant 7,026,238 - Xi , et al. April 11, 2 | 2006-04-11 |
Methods for depositing tungsten layers employing atomic layer deposition techniques
App 20060040052 - Fang; Hongbin ; et al. | 2006-02-23 |
Integrated electroless deposition system
App 20060033678 - Lubomirsky; Dmitry ; et al. | 2006-02-16 |
Apparatus and method for plasma assisted deposition
Grant 6,998,014 - Chen , et al. February 14, 2 | 2006-02-14 |
Formation of a tantalum-nitride layer
App 20060030148 - Seutter; Sean M. ; et al. | 2006-02-09 |
Methods for depositing tungsten layers employing atomic layer deposition techniques
App 20060009034 - Lai; Ken Kaung ; et al. | 2006-01-12 |
Formation of composite tungsten films
App 20050287807 - Lai, Ken K. ; et al. | 2005-12-29 |
Integration of titanium and titanium nitride layers
App 20050277290 - Yang, Michael X. ; et al. | 2005-12-15 |
Formation of a tantalum-nitride layer
Grant 6,951,804 - Seutter , et al. October 4, 2 | 2005-10-04 |
Formation of composite tungsten films
Grant 6,939,804 - Lai , et al. September 6, 2 | 2005-09-06 |
Selective deposition of a barrier layer on a dielectric material
Grant 6,939,801 - Chung , et al. September 6, 2 | 2005-09-06 |
Formation of a tantalum-nitride layer
App 20050164487 - Seutter, Sean M. ; et al. | 2005-07-28 |
Integration of titanium and titanium nitride layers
Grant 6,911,391 - Yang , et al. June 28, 2 | 2005-06-28 |
Methods and chemistry for providing initial conformal electrochemical deposition of copper in sub-micron features
App 20050109627 - Sun, Zhi-Wen ; et al. | 2005-05-26 |
Method for removing electrolyte from electrical contacts and wafer touching areas
Grant 6,869,516 - Lubomirsky , et al. March 22, 2 | 2005-03-22 |
Multiple-step electrodeposition process for direct copper plating on barrier metals
App 20050006245 - Sun, Zhi-Wen ; et al. | 2005-01-13 |
Method for depositing refractory metal layers employing sequential deposition techniques
App 20040247788 - Fang, Hongbin ; et al. | 2004-12-09 |
Deposition of tungsten films
Grant 6,827,978 - Yoon , et al. December 7, 2 | 2004-12-07 |
Selective deposition of a barrier layer on a metal film
Grant 6,809,026 - Yoon , et al. October 26, 2 | 2004-10-26 |
Slim cell platform plumbing
App 20040206623 - D'Ambra, Allen L. ; et al. | 2004-10-21 |
Reliability barrier integration for Cu application
App 20040209460 - Xi, Ming ; et al. | 2004-10-21 |
Method for immersing a substrate
App 20040192066 - Lubomirsky, Dmitry ; et al. | 2004-09-30 |
Method for depositing refractory metal layers employing sequential deposition techniques
Grant 6,797,340 - Fang , et al. September 28, 2 | 2004-09-28 |
Modular electrochemical processing system
App 20040154535 - Chen, Guan-Shian ; et al. | 2004-08-12 |
Multiple chemistry electrochemical plating method
App 20040154926 - Sun, Zhi-Wen ; et al. | 2004-08-12 |
Valve control system for atomic layer deposition chamber
App 20040143370 - Lu, Siqing ; et al. | 2004-07-22 |
Electrochemical processing cell
App 20040134775 - Yang, Michael X. ; et al. | 2004-07-15 |
Multi-chemistry electrochemical processing system
App 20040118694 - Yang, Michael X. ; et al. | 2004-06-24 |
Valve control system for atomic layer deposition chamber
Grant 6,734,020 - Lu , et al. May 11, 2 | 2004-05-11 |
Method for removing electrolyte from electrical contacts and wafer touching areas
App 20040074777 - Lubomirsky, Dmitry ; et al. | 2004-04-22 |
Cyclical deposition of a variable content titanium silicon nitride layer
Grant 6,720,027 - Yang , et al. April 13, 2 | 2004-04-13 |
Cyclical layer deposition system
App 20040065255 - Yang, Michael X. ; et al. | 2004-04-08 |
Wafer backside electrical contact for electrochemical deposition and electrochemical mechanical polishing
App 20040055893 - Lubomirsky, Dmitry ; et al. | 2004-03-25 |
Modular electrochemical processing system
Grant 6,699,380 - Chen , et al. March 2, 2 | 2004-03-02 |
Insoluble anode loop in copper electrodeposition cell for interconnect formation
App 20040026255 - Kovarsky, Nicolay Y. ; et al. | 2004-02-12 |
Multi-chemistry plating system
App 20040016637 - Yang, Michael X. ; et al. | 2004-01-29 |
Anolyte for copper plating
App 20040016647 - Yang, Michael X. ; et al. | 2004-01-29 |
Electrochemical processing cell
App 20040016636 - Yang, Michael X. ; et al. | 2004-01-29 |
Formation of composite tungsten films
App 20040014315 - Lai, Ken K. ; et al. | 2004-01-22 |
Formation of titanium nitride films using a cyclical deposition process
App 20040013803 - Chung, Hua ; et al. | 2004-01-22 |
Electrolyte/organic additive separation in electroplating processes
App 20040007473 - Yang, Michael X. | 2004-01-15 |
CU ECP planarization by insertion of polymer treatment step between gap fill and bulk fill steps
App 20040000488 - Yang, Michael X. | 2004-01-01 |
Lid assembly for a processing system to facilitate sequential deposition techniques
Grant 6,660,126 - Nguyen , et al. December 9, 2 | 2003-12-09 |
Selective deposition of a barrier layer on a dielectric material
App 20030224578 - Chung, Hua ; et al. | 2003-12-04 |
Method of forming a silicon nitride layer on a substrate
Grant 6,645,884 - Yang , et al. November 11, 2 | 2003-11-11 |
Multi-zone resistive heater
Grant 6,646,235 - Chen , et al. November 11, 2 | 2003-11-11 |
Cyclical deposition of a variable content titanium silicon nitride layer
App 20030190497 - Yang, Michael X. ; et al. | 2003-10-09 |
Selective deposition of abarrier layer on a metal film
App 20030181035 - Yoon, Hyungsuk Alexander ; et al. | 2003-09-25 |
Deposition of tungsten films for dynamic random access memory (DRAM) applications
App 20030157760 - Xi, Ming ; et al. | 2003-08-21 |
Deposition of tungsten films
App 20030153181 - Yoon, Hyungsuk A. ; et al. | 2003-08-14 |
Integration of titanium and titanium nitride layers
App 20030143841 - Yang, Michael X. ; et al. | 2003-07-31 |
Apparatus and method for plasma assisted deposition
App 20030143328 - Chen, Chen-An ; et al. | 2003-07-31 |
Integration of ALD tantalum nitride and alpha-phase tantalum for copper metallization application
App 20030124262 - Chen, Ling ; et al. | 2003-07-03 |
Deposition of tungsten for the formation of conformal tungsten silicide
App 20030123216 - Yoon, Hyungsuk A. ; et al. | 2003-07-03 |
Chamber hardware design for titanium nitride atomic layer deposition
App 20030116087 - Nguyen, Anh N. ; et al. | 2003-06-26 |
Method for depositing refractory metal layers employing sequential deposition techniques
App 20030104126 - Fang, Hongbin ; et al. | 2003-06-05 |
Method of forming a film in a chamber and positioning a substitute in a chamber
Grant 6,530,992 - Yang , et al. March 11, 2 | 2003-03-11 |
Low-resistivity tungsten from high-pressure chemical vapor deposition using metal-organic precursor
App 20030008070 - Seutter, Sean Michael ; et al. | 2003-01-09 |
Plasma treatment of tantalum nitride compound films formed by chemical vapor deposition
App 20020192952 - Itoh, Toshio ; et al. | 2002-12-19 |
Integrated barrier layer structure for copper contact level metallization
App 20020192948 - Chen, Fusen ; et al. | 2002-12-19 |
Plasma treatment of tantalum nitride compound films formed by chemical vapor deposition
Grant 6,455,421 - Itoh , et al. September 24, 2 | 2002-09-24 |
Valve control system for atomic layer deposition chamber
App 20020127745 - Lu, Siqing ; et al. | 2002-09-12 |
Multi-zone resistive heater
App 20020125239 - Chen, Steven Aihua ; et al. | 2002-09-12 |
Processing chamber and method of distributing process fluids therein to facilitate sequential deposition of films
App 20020121241 - Nguyen, Anh N. ; et al. | 2002-09-05 |
Lid assembly for a processing system to facilitate sequential deposition techniques
App 20020121342 - Nguyen, Anh N. ; et al. | 2002-09-05 |
Formation of a tantalum-nitride layer
App 20020106846 - Seutter, Sean M. ; et al. | 2002-08-08 |
Multi-zone resistive heater
Grant 6,423,949 - Chen , et al. July 23, 2 | 2002-07-23 |
Reliability barrier integration for Cu application
App 20020060363 - Xi, Ming ; et al. | 2002-05-23 |
Method of forming a silicon nitride layer on a semiconductor wafer
App 20020045362 - Yang, Michael X. ; et al. | 2002-04-18 |
| 