U.S. patent application number 11/422184 was filed with the patent office on 2006-10-12 for method of making a heat dissipating microdevice.
This patent application is currently assigned to SENTELIC CORPORATION. Invention is credited to Pei-Pei Ding, Chang-Chi Lee, Jao-Ching Lin.
Application Number | 20060225908 11/422184 |
Document ID | / |
Family ID | 33563279 |
Filed Date | 2006-10-12 |
United States Patent
Application |
20060225908 |
Kind Code |
A1 |
Ding; Pei-Pei ; et
al. |
October 12, 2006 |
METHOD OF MAKING A HEAT DISSIPATING MICRODEVICE
Abstract
A heat dissipating microdevice is made from comprising the steps
of: a board including an insulator layer having a first and facing
second surfaces and a conductor layer on the first surface by
forming in the layer a hole that extends between the surfaces to
form a fluid microsystem including: first and second micro-channel
structures disposed respectively in first and second areas of the
board and bounded by the layer, and first and second micro-conduit
structures that permit fluid communication between the
micro-channel structures. The first micro-conduit structure has a
first end in fluid communication with the second micro-channel
structure and a second end section in fluid communication with the
first micro-channel structure. The second micro-conduit structure
has a first end section in fluid communication with the first
micro-channel structure and a second end section in fluid
communication with the second micro-channel structure. A cover is
put on the second surface.
Inventors: |
Ding; Pei-Pei; (Hsin-Chuang
City, Taipei Hsien, TW) ; Lee; Chang-Chi; (Taipei
City, TW) ; Lin; Jao-Ching; (Hsin-Chuang City, Taipei
Hsien, TW) |
Correspondence
Address: |
LOWE HAUPTMAN BERNER, LLP
1700 DIAGONAL ROAD
SUITE 300
ALEXANDRIA
VA
22314
US
|
Assignee: |
SENTELIC CORPORATION
No. 6, Lane 279, Sec. 1, Chien-Kuo S. Rd. Ta-An Dist.
Taipei City
TW
|
Family ID: |
33563279 |
Appl. No.: |
11/422184 |
Filed: |
June 5, 2006 |
Related U.S. Patent Documents
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Application
Number |
Filing Date |
Patent Number |
|
|
10740496 |
Dec 22, 2003 |
|
|
|
11422184 |
Jun 5, 2006 |
|
|
|
Current U.S.
Class: |
174/15.6 ;
257/E23.098 |
Current CPC
Class: |
H01L 23/473 20130101;
F28D 2015/0225 20130101; F28F 2210/02 20130101; H01L 2924/0002
20130101; H01L 2924/0002 20130101; H01L 2924/00 20130101; F28D
15/0266 20130101; H05K 1/0272 20130101 |
Class at
Publication: |
174/015.6 |
International
Class: |
H01B 7/42 20060101
H01B007/42 |
Foreign Application Data
Date |
Code |
Application Number |
Jul 4, 2003 |
TW |
092118323 |
Claims
1.-20. (canceled)
21. A method of making a heat dissipating microdevice, the device
being made from a board that includes an insulator layer having a
first surface and a second surface facing the first surface, and a
conductor layer formed on the first surface of the insulator layer;
comprising the steps of: (a) forming a hole unit in said insulator
layer, so the hole unit extends from the first surface to the
second surface of the insulator layer to result in a fluid
microsystem including: first and second micro-channel structures
disposed respectively in first and second areas of the board and
bounded by the conductor layer, and first and second micro-conduit
structures that permit fluid communication between the first and
second micro-channel structures, the first micro-conduit structure
including a first end section in fluid communication with the
second micro-channel structure and a second end section extending
to and in fluid communication with the first micro-channel
structure, the second micro-conduit structure including a first end
section in fluid communication with the first micro-channel
structure and a second end section extending to and in fluid
communication with the second micro-channel structure; and (b)
disposing a cover member on the second surface of the insulator
layer.
22. The method of claim 21, further comprising the step of filling
the fluid microsystem with a coolant.
23. The method of claim 21, wherein the board further includes a
photo-resist layer coated on the second surface of the insulator
layer, and step (a) includes: (a1) patterning the photo-resist
layer to expose portions of the second surface of the insulator
layer, and (a2) forming the hole unit in the exposed portions of
the second surface of the insulator layer.
24. The method of claim 21, further comprising the step of
disposing a metallic grid microstructure in the hole unit prior to
step (b).
25. The method of claim 21, further comprising the step of mounting
of a micro-driving member on said board after step (b) so the
micro-driving member is in fluid communication with the fluid
microsystem.
26. The method of claim 21, wherein the hole unit is formed in the
insulator layer by laser ablation.
27. The method of claim 22, wherein the coolant is one of air,
methanol, acetone, and water.
Description
CROSS-REFERENCE TO RELATED APPLICATION
[0001] This application is a divisional of U.S. application Ser.
No. 10/740,496 filed Dec. 22, 2003 and claims priority of Taiwanese
application no. 092118323, filed on Jul. 4, 2003, the disclosures
of which are hereby incorporated by reference herein in their
entirety.
BACKGROUND OF THE INVENTION
[0002] 1. Field of the Invention
[0003] The invention relates to a method of making a heat
dissipating microdevice, more particularly to a method of making a
heat dissipating microdevice including a fluid microsystem formed
in a insulator layer of aboard.
[0004] 2. Description of the Related Art
[0005] In German Patent Nos. DE19739719 and DE19739722, there is
disclosed a conventional method of making a hollow microstructure
using first and second circuit boards. Each of the first and second
circuit boards includes an insulator layer that has first and
second surfaces, and a conductor layer formed on the first surface
of the insulator layer. The method comprises the steps of forming
recesses in the conductor layer of the first circuit board and
bonding the second surface of the insulator layer of the second
circuit board on the conductor layer of the first circuit board to
form the hollow microstructure. Although the method proposed
therein permits hollow microstructure fabrication, since the
resulting hollow microstructure is disposed in between the
insulator layers, it is not suitable for heat dissipating
applications.
SUMMARY OF THE INVENTION
[0006] An object of the present invention is to provide a method of
making the inventive heat dissipating midrodevice.
[0007] According to an aspect of the present invention, a heat
dissipating microdevice is made from a board that includes an
insulator layer having a first surface and a second surface
opposite to the first surface, and a conductor layer formed on the
first surface of the insulator layer; the method comprises forming
a hole unit in the insulator layer that extends from the first
surface to the second surface of the insulator layer to result in a
fluid microsystem; and disposing a cover member on the second
surface of the insulator layer. The fluid microsystem includes
first and second micro-channel structures disposed respectively in
first and second areas of the board and bounded by the conductor
layer, and first and second micro-conduit structures that permit
fluid communication between the first and second micro-channel
structures. The first micro-conduit structure includes a first end
section that is in fluid communication with the second
micro-channel structure, and a second end section that extends to
and that is in fluid communication with the first micro-channel
structure. The second micro-conduit structure includes a first end
section that is in fluid communication with the first micro-channel
structure, and a second end section that extends to and that is in
fluid communication with the second micro-channel structure.
BRIEF DESCRIPTION OF THE DRAWINGS
[0008] Other features and advantages of the present invention will
become apparent in the following detailed description of the
preferred embodiments with reference to the accompanying drawings,
of which:
[0009] FIG. 1 is a schematic view of a first preferred embodiment
of a heat dissipating microdevice made according to this
invention;
[0010] FIG. 2 is a schematic view to illustrate a board used to
make the microdevice of FIG. 1;
[0011] FIG. 3 is a schematic view of the second preferred
embodiment of a heat dissipating microdevice made according to this
invention;
[0012] FIG. 4 is a schematic view of the third preferred embodiment
of a heat dissipating microdevice made according to this
invention;
[0013] FIG. 5 is a fragmentary sectional view to illustrate a
metallic grid microstructure disposed in a first micro-channel
structure;
[0014] FIG. 6 is a fragmentary sectional view to illustrate a
plurality of capillary protrusions formed in the first
micro-channel structure;
[0015] FIG. 7 is a fragmentary sectional view of a fourth preferred
embodiment of a heat dissipating microdevice made according to this
invention;
[0016] FIG. 8 is a flowchart of the first preferred embodiment of a
method of making the heat dissipating microdevice according to the
present invention;
[0017] FIG. 9 is a fragmentary sectional view to illustrate a board
having an insulator layer, and a conductor layer prepared according
to the method of the first preferred embodiment;
[0018] FIG. 10 is a fragmentary sectional view to illustrate how
the insulator layer of the board of FIG. 9 is patterned in the
method of the first preferred embodiment;
[0019] FIG. 11 is a fragmentary sectional view to illustrate how a
hole unit is formed in the insulator layer of the board of FIG. 10
according to the method of the first preferred embodiment;
[0020] FIG. 12 is a fragmentary sectional view to illustrate how a
cover member is disposed on the insulator layer of the board of
FIG. 11 according to the method of the first preferred
embodiment;
[0021] FIG. 13 is a flowchart of the second preferred embodiment of
a method of making the heat dissipating microdevice according to
the present invention;
[0022] FIG. 14 is a fragmentary sectional view to illustrate a
board having an insulator layer, and a conductor layer prepared
according to the method of the second preferred embodiment;
[0023] FIG. 15 is a fragmentary sectional view to illustrate how
the insulator layer of the board of FIG. 14 is patterned in the
method of the second preferred embodiment;
[0024] FIG. 16 is a fragmentary sectional view to illustrate how a
first hole unit is formed in the insulator layer of the board of
FIG. 15 according to the method of the second preferred
embodiment;
[0025] FIG. 17 is a fragmentary sectional view to illustrate how a
cover member is disposed on the insulator layer of the board of
FIG. 16 according to the method of the second preferred
embodiment;
[0026] FIG. 18 is a fragmentary sectional view to illustrate how a
communicating hole unit is formed in the cover member of FIG. 17
according to the method of the second preferred embodiment;
[0027] FIG. 19 is a fragmentary sectional view to illustrate an
insulator layer disposed on the cover member of FIG. 18 according
to the method of the second preferred embodiment;
[0028] FIG. 20 is a fragmentary sectional view to illustrate how
the insulator layer of FIG. 19 is patterned in the method of the
second preferred embodiment;
[0029] FIG. 21 is a fragmentary sectional view to illustrate how a
second hole unit is formed in the insulator layer of FIG. 20
according to the method of the second preferred embodiment;
[0030] FIG. 22 is a fragmentary sectional view to illustrate how a
metallic grid microstructure is disposed in a first micro-channel
structure according to the method of the second preferred
embodiment; and
[0031] FIG. 23 is a fragmentary sectional view to illustrate a
cover member disposed on the insulator layer to cover the first
micro-channel structure of FIG. 22 according to the method of the
second preferred embodiment.
DETAILED DESCRIPTION OF THE DRAWINGS
[0032] Before the present invention is described in greater detail,
it should be noted that like elements are denoted by the same
reference numerals throughout the disclosure.
[0033] Referring to FIGS. 1 and 2, a first preferred embodiment of
a heat dissipating microdevice made according to this invention is
shown to include a board 1, a fluid microsystem 10, and a
coolant.
[0034] The board 1 includes a first insulator layer 11 that has a
first surface and a second surface opposite to the first surface in
a first direction, a first conductor layer 12 formed on the first
surface, and a cover member 2 disposed on the second surface. The
board 1 has a first area 82 and a second area 83 opposite to the
first area 82 in a second direction transverse to the first
direction. The first area 82 is adapted to be placed in thermal
contact with a heat source (not shown). Preferably, the first
insulator layer 11 is made from epoxy resin. Moreover, the cover
member 2 is preferably made of a material the same as that of the
first conductor layer 12. Alternatively, the cover member 2 may be
made of a material the same as that of the first insulator layer 11
or glass. Further, the heat source is preferably an electronic
component, such as an integrated circuit (IC).
[0035] The fluid microsystem 10 includes first and second
micro-channel structures 101, 102 that are disposed respectively in
the first and second areas 82, 83 of the board 1, and first and
second micro-conduit structures 103, 104 that permit fluid
communication between the first and second micro-channel structures
101, 102.
[0036] The coolant is contained in the fluid microsystem 10. As
indicated by arrow 35, the coolant flows from the second
micro-channel structure 102 to the first micro-channel structure
101 through the first micro-conduit structure 103, and, as
indicated by arrow 36, from the first micro-channel structure 101
back to the second micro-channel structure 102 through the second
micro-conduit structure 104. Preferably, the coolant is distilled
water. Alternatively, the coolant can be one of de-ionized water,
air, methanol, and acetone.
[0037] The preferred configuration of the fluid microsystem 10 will
be described in greater detail in the succeeding paragraphs.
[0038] Each of the first and second micro-channel structures 101,
102 includes a plurality of parallel channels 1011, 1021, each of
which includes first and second end portions (e), (a), (f), (b)
[0039] Each of the first and second micro-conduit structures 103,
104 includes first and second end sections (c), (g), (d), (h). The
first end section (c) of the first micro-conduit structure 103 is
in fluid communication with the second end portions (b) of the
channels 1021 of the second micro-channel structure 102. The second
end section (d) of the first micro-conduit structure 103 extends to
and is in fluid communication with the first end portions (e) of
the channels 1011 of the first micro-channel structure 101. The
first end section (g) of the second micro-conduit structure 104
includes a plurality of parallel first conduits 1041, each of which
has first and second end portions (g1), (g2). The first end portion
(g1) of each of the first conduits 1041 is in fluid communication
with the channels 1011 of the first micro-channel structure 101.
The second end portion (g2) of each of the first conduits 1041 is
bifurcated to form a pair of branches. The second end section (h)
of the second micro-conduit structure 104 includes a plurality of
parallel second conduits 1042, each of which has first and second
end portions (h1), (h2). The first end portion (h1) of each of the
second conduits 1042 extends from one of the branches of a
respective one of the first conduits 1041. The second end portion
(h2) of the second conduits 1042 extends to and is in fluid
communication with the first end portion (a) of a respective one of
the channels 1021 of the second micro-channel structure 102.
[0040] The fluid microsystem 10 further includes a receiving
microstructure 105 that is disposed between and that permits fluid
communication between the first micro-channel structure 101 and the
second micro-conduit structure 104, and that includes first and
second end portions (i), (j). In this embodiment, the receiving
microstructure 105 has a diverging section that serves as the first
end portion (i), and a converging section that serves as the second
end portion (j). The first end portion (i) of the receiving
microstructure 105 extends to and is in fluid communication with
the first micro-channel structure 101, i.e., the second end
portions (f) of the channels 1011 of the first micro-channel
structure 101 extend to the first end portion (i) of the receiving
microstructure 105.
[0041] The fluid microsystem 10 further includes a mixing
microstructure 106 that is disposed between and that permits fluid
communication between the receiving microstructure 105 and the
second micro-conduit structure 104, and that includes first and
second end portions (k), (p). In this embodiment, the first end
portion (k) of the mixing microstructure 106 includes a pair of
micro-passage structures 1061 that extend to and that are in fluid
communication with the second end portion (j) of the receiving
microstructure 105. The second end portion (p) of the mixing
microstructure 106 extends to and is in fluid communication with
the first end section (g) of the second micro-conduit structure
104, i.e., the first end portions (g1) of the first conduits 1041
of the first end section (g) of the second micro-conduit structure
104 extend to and are in fluid communication with the second end
portion (p) of the mixing microstructure 106.
[0042] The fluid microsystem 10 further includes a third
micro-conduit structure 107 that is disposed between and that
permits fluid communication between the first micro-conduit
structure 103 and the mixing microstructure 106, and that includes
first and second end portions (m), (n). In this embodiment, the
first end portion (m) of the third micro-conduit structure 107
extends to the first end section (c) of the first micro-conduit
structure 103. The second end portion (n) of the third
micro-conduit structure 107 extends to one of the micro-passage
structures 1061 of the first end portion (k) of the mixing
microstructure 106. The construction as such permits the coolant to
flow from the second micro-channel structure 102 to the mixing
microstructure 106 through the third micro-conduit structure 107
without passing through the first micro-channel structure 101. In
an alternative embodiment, the fluid microsystem 10 is dispensed
with both the mixing microstructure 106 and the third micro-conduit
structure 107. The fluid microsystem 10 further includes a
micro-reservoir structure 108 that is disposed between and that is
in fluid communication with the second micro-channel structure 102
and the first micro-conduit structure 103. In this embodiment, the
channels 1021 of the second micro-channel structure 102 extend
between the micro-reservoir structure 108 and a respective one of
the second end portions (h2) of the second conduits 1042 of the
second section (h) of the second micro-conduit structure 104. The
first end portion (c) of the first micro-conduit structure 103
extends to and is in fluid communication with the micro-reservoir
structure 108.
[0043] It is noted that each of the first conduits 1041 has a
cross-section larger than that of each of the second conduits 1042.
As such, the second end section (h) of the second micro-conduit
structure 104 has a capillary effect that is greater than that of
the first end section (g) of the second micro-conduit structure
104. Moreover, the micro-reservoir structure 108 has a
cross-section larger than those of each of the channels 1021 of the
second micro-channel structure 102 and the first micro-conduit
structure 103. As such, the coolant flowing from the second
micro-channel structure 102 to the first micro-channel structure
101 through the first micro-conduit structure 103 is first
accumulated in the micro-reservoir structure 108. Further, the
receiving microstructure 105 has a largest cross-section larger
than those of each of the channels 1011 of the first micro-channel
structure 101, each of the first and second conduits 1041, 1042 of
the second micro-conduit structure 104, and that of the mixing
microstructure 106.
[0044] In the preferred embodiment, the fluid microsystem 10 is
bounded by both the first conductor layer 12 and the cover member
2. This will become apparent in the succeeding paragraphs.
[0045] It is further noted that the number of channels 1011 of the
first micro-channel structure 101 can be made as many as possible
so as to maximize contact area between the first micro-channel
structure 101 and the first conductor layer 12.
[0046] In use, when the heat dissipating microdevice is disposed
such that the first area 82 is in thermal contact with the heat
source, the coolant in the first micro-channel structure 101
absorbs heat generated by the heat source. Once the coolant in the
first micro-channel structure 101 reaches its boiling point, it
quickly vaporizes. As soon as the coolant vaporizes, the vaporized
coolant starts flowing to the receiving microstructure 105.
Consequently, the coolant in the first micro-conduit structure 103
flows to the first micro-channel structure 101, the coolant in the
micro-reservoir structure 108 flows to the first micro-conduit
structure 103, and the coolant in the second micro-channel
structure 102 flows to the micro-reservoir structure 108. At this
time, the vaporized coolant flows through the receiving
microstructure 105 at an increasing speed. By the time the
vaporized coolant reaches the mixing microstructure 106, the
vaporized coolant flows substantially a very high speed, thus
creating a low pressure level in the mixing microstructure 106.
Accordingly, the coolant in the third micro-conduit structure 107
is drawn into the mixing microstructure 106. Subsequently, the
vaporized coolant mixes and exchanges heat with the coolant from
the third micro-conduit structure 107 by convection, is cooled
considerably, and condenses. The mixed coolant then flows to the
second micro-conduit structure 104 and, finally, to the second
micro-channel structure 102. By this time, the absorbed heat is
completely dissipated.
[0047] FIG. 3 illustrates a second preferred embodiment of a heat
dissipating microdevice made according to the present invention.
When compared with the previous preferred embodiment, the heat
dissipating microdevice further comprises a flow controller 4. In
this embodiment, the flow controller 4 includes a micro-driving
member 41, such as a micro-pump, that is mounted on the board 1,
that is in fluid communication with the first end section (c) of
the first micro-conduit structure 103, and that is operable so as
to induce flow of the coolant in the fluid microsystem 10. The
construction as such permits flow of the coolant even before the
coolant in the first micro-channel structure 101 is vaporized.
[0048] FIGS. 4 and 5 illustrate the third preferred embodiment of a
heat dissipating microdevice made according to the present
invention. When compared with the previous preferred embodiment,
the heat dissipating microdevice further comprises a
micro-capillary member 5. The first micro-channel structure 101
includes only one channel 1011'. In this embodiment, the
micro-capillary member 5 includes a metallic grid microstructure 51
that is disposed in the channel 1011' of the first micro-channel
structure 101 and that provides a capillary action. As such, the
flow of the coolant from the second micro-channel structure 102 to
the first micro-channel structure 101 through the first
micro-conduit structure 103 can be enhanced. In an alternative
embodiment, with further reference to FIG. 6, the micro-capillary
member 5 includes a plurality of capillary protrusions 14 formed on
the cover member 2, the first conductor layer 12, and the wall
defining the channel 1011' of the first micro-channel structure
101.
[0049] With further reference to FIG. 7, the fourth preferred
embodiment of a heat dissipating microdevice made according to the
present invention is shown. When compared with the previous
preferred embodiment, the board 1 further includes a second
insulator layer 31 and a second conductor layer 32. The second
insulator layer 31 has first and second surfaces, and is disposed
on the cover member 2 such that the first surface of the second
insulator layer 31 abuts against the cover member 2. The second
conductor layer 32 is disposed on the second surface of the second
insulator layer 31. In this embodiment, a part of the fluid
microsystem 10, which is herein referred to as a primary fluid
microsystem member 10' is formed in the first insulator layer 11,
whereas another part of the fluid microsystem 10, which is herein
referred to as a secondary fluid microsystem member 10'', is formed
in the second insulator layer 31. In this embodiment, with
reference to FIG. 1, the primary fluid microsystem member 10'
includes the first micro-channel structure 101, the receiving
microstructure 105, the mixing microstructure 106, and the second
micro-conduit structure 104, whereas the secondary fluid
microsystem member 10'' includes the second micro-channel structure
102, the micro-reservoir structure 108, the first micro-conduit
structure 103, and the third micro-conduit structure 107. The cover
member 2 is formed with a communicating hole unit 200 so as to
permit fluid communication between the first micro-channel
structure 101 and the first micro-conduit structure 103, and
between the second micro-channel structure 102 and the second
micro-conduit structure 104. Circuit traces 320 are formed on the
first conductor layer 12. The integrated circuit 81 is electrically
connected, such as by soldering, to the circuit traces 320.
[0050] The preferred embodiment of a method for making the heat
dissipating microdevice of FIG. 3 includes the steps shown in FIG.
8.
[0051] In step 300, with further reference to FIG. 9, the board 1
is provided. The board 1 includes the insulator layer 11 that has
the first surface and the second surface opposite to the first
surface, the conductor layer 12 formed on the first surface of the
insulator layer 11, and a photo-resist layer 8 coated on the second
surface of the insulator layer 11.
[0052] In step 302, with further reference to FIG. 10, the
photo-resist layer 8 is patterned to expose portions 11' of the
second surface of the insulator layer 11. In this step, a
photo-mask 6 is formed with a pattern 60 corresponding to the fluid
microsystem 10 (see FIG. 3) described hereinabove in connection
with the second embodiment. The board 1 is subsequently exposed to
radiation for transferring the pattern 60 on the photo-mask 6 to
the photo-resist layer 8. A developing solution is used to form
recesses in the photo-resist layer 8 corresponding to the pattern
60.
[0053] In step 304, with further reference to FIG. 11, a hole unit
1001 is formed in the exposed portions 11' (see FIG. 10) of the
second surface of the insulator layer 11. The hole unit 1001
extends from the first surface to the second surface of the
insulator layer 11 so as to result in the fluid microsystem bounded
by the conductor layer 12. Preferably, the hole unit 1001 is formed
by dry etching. Alternatively, the hole unit 1001 can be formed by
wet etching or laser ablation.
[0054] In step 306, with further reference to FIG. 12, the cover
member 2 is disposed on the second surface of the insulator layer
11 to seal the fluid microsystem 10.
[0055] In step 308, the micro-driving member 41 (see FIG. 3) is
mounted on the board 1.
[0056] In step 310, the fluid microsystem 10 is filled with the
coolant. The coolant is injected into the fluid microsystem 10
through the micro-driving member 41. It is noted that if the
coolant is air, this step may be skipped.
[0057] The preferred embodiment of a method for making the heat
dissipating microdevice of FIG. 7 includes the steps shown in FIG.
13.
[0058] In step 400, with further reference to FIG. 14, the board 1
is provided. The board 1 includes the first and second insulator
layers 11, 31, the first and second conductor layers 12, 32, and
the cover member 2. Each of first and second insulator layers 11,
31 has the first surface and the second surface opposite to the
first surface. The second conductor layer 32 is formed on the
second surface of the second insulator layer 31, and a photo-resist
layer 8 is coated on the first surface of the second insulator
layer 31.
[0059] In step 402, with further reference to FIG. 15, the
photo-resist layer 8 is patterned to expose portions 31' of the
first surface of the second insulator layer 31. In this step, a
photo-mask 6 is formed with a pattern 60 corresponding to the
secondary fluid microsystem 10'' (see FIG. 7) described hereinabove
in connection with the fourth preferred embodiment. The board 1 is
subsequently exposed to radiation for transferring the pattern 60
on the photo-mask 6 to the photo-resist layer 8. A developing
solution is used to form recesses in the photo-resist layer 8
corresponding to the pattern 60.
[0060] In step 404, with further reference to FIG. 16, a first hole
unit 1001 is formed in the exposed portions 31' (see FIG. 15) of
the first surface of the second insulator layer 31. The first hole
unit 1001 extends from the first surface to the second surface of
the second insulator layer 31 so as to result in the secondary
fluid microsystem bounded by the second conductor layer 32.
Preferably, the first hole unit 1001 is formed by dry etching.
Alternatively, the first hole unit 1001 can be formed by wet
etching or laser ablation.
[0061] In step 406, with further reference to FIG. 17, the cover
member 2 is disposed on the first surface of the second insulator
layer 31.
[0062] In step 408, with further reference to FIG. 18, the
communicating hole unit 200 is formed in the cover member 2.
[0063] In step 410, with further reference to FIG. 19, the first
insulator layer 11 is disposed on the cover member 2 such that the
second surface of the first insulator layer 11 lies on the cover
member 2. A photo-resist layer 8' is coated on the first surface of
the first insulator layer 11.
[0064] In step 412, with further reference to FIG. 20, the
photo-resist layer 8' is patterned to expose portions 11' of the
first surface of the first insulator layer 11. In this step, a
photo-mask 6' is formed with a pattern 60' that corresponds to the
primary fluid microsystem 10' (see FIG. 7) described hereinabove in
connection with the fourth preferred embodiment. The board 1 is
subsequently exposed to radiation for transferring the pattern 60'
on the photo-mask 6' to the photo-resist layer 8'. A developing
solution is used to form recesses in the photo-resist layer 8'
corresponding to the pattern 60'.
[0065] In step 414, with further reference to FIG. 21, a second
hole unit 1002 is formed in the exposed portions 11' (see FIG. 20)
of the first surface of the first insulator layer 11. The second
hole unit 1002 extends from the first surface to the second surface
of the first insulator layer 11 so as to result in the primary
fluid microsystem that is bounded by the cover member 2.
Preferably, the second hole unit 1002 is formed by dry etching.
Alternatively, the second hole unit 1002 can be formed by wet
etching or laser ablation.
[0066] In step 416, with further reference to FIG. 22, the metallic
grid microstructure 51 is disposed in the channel 1011' of the
first micro-channel structure 101. It is noted that, in the
alternative embodiment, the capillary protrusions 14 (see FIG. 5)
are formed, such as by sintering, on the cover member 2 and the
wall defining the channel 1011' of the first micro-channel
structure 101.
[0067] In step 418, with further reference to FIG. 23, the first
conductor layer 12 is disposed on the first surface of the first
insulator layer 11 to seal the fluid microsystem. In the
alternative embodiment, the capillary protrusions 14 are formed on
the first conductor layer 12 before disposing the latter on the
first surface of the first insulator layer 11.
[0068] In step 420, a micro-driving member 41 (see FIG. 3) is
mounted on the board 1.
[0069] In step 422, the primary and secondary fluid Microsystems
10', 10'' are filled with a coolant. The coolant is injected into
the primary and secondary fluid microsystems 10', 10'' through the
micro-driving member 41.
[0070] While the present invention has been described in connection
with what is considered the most practical and preferred
embodiments, it is understood that this invention is not limited to
the disclosed embodiments but is intended to cover various
arrangements included within the spirit and scope of the broadest
interpretation so as to encompass all such modifications and
equivalent arrangements.
* * * * *