loadpatents
Patent applications and USPTO patent grants for Lee; Chang-Chi.The latest application filed is for "semiconductor device package and method of manufacturing the same".
Patent | Date |
---|---|
Snivel suction apparatus Grant 11,426,508 - Lee August 30, 2 | 2022-08-30 |
Semiconductor device package including thermal dissipation element and method of manufacturing the same Grant 11,127,650 - Chang Chien , et al. September 21, 2 | 2021-09-21 |
Semiconductor Device Package And Method Of Manufacturing The Same App 20210265273 - CHANG CHIEN; Chien Lin ;   et al. | 2021-08-26 |
Semiconductor Device Package Including Thermal Dissipation Element And Method Of Manufacturing The Same App 20210265231 - CHANG CHIEN; Chien Lin ;   et al. | 2021-08-26 |
Snivel Suction Apparatus App 20200108187 - LEE; Chang-Chi | 2020-04-09 |
Semiconductor package device and method of manufacturing the same Grant 10,541,198 - Chang Chien , et al. Ja | 2020-01-21 |
Electronic Apparatus And Method For Manufacturing The Same App 20190378963 - LIU; Ming-Te ;   et al. | 2019-12-12 |
Semiconductor Package Device And Method Of Manufacturing The Same App 20180337130 - CHANG CHIEN; Chien Lin ;   et al. | 2018-11-22 |
Semiconductor package device and method of manufacturing the same Grant 10,134,677 - Chang Chien , et al. November 20, 2 | 2018-11-20 |
Semiconductor package having a trench penetrating a main body Grant 10,056,325 - Kao , et al. August 21, 2 | 2018-08-21 |
Semiconductor device package and method of manufacturing the same Grant 10,037,974 - Chang Chien , et al. July 31, 2 | 2018-07-31 |
Semiconductor Package Device And Method Of Manufacturing The Same App 20180158766 - CHANG CHIEN; Chien Lin ;   et al. | 2018-06-07 |
Semiconductor package device and method of manufacturing the same Grant 9,917,043 - Chang Chien , et al. March 13, 2 | 2018-03-13 |
Semiconductor Device Package And Method Of Manufacturing The Same App 20170263589 - CHANG CHIEN; Chien Lin ;   et al. | 2017-09-14 |
Bump structures, semiconductor device and semiconductor device package having the same Grant 9,741,675 - Chen , et al. August 22, 2 | 2017-08-22 |
Semiconductor Package Device And Method Of Manufacturing The Same App 20170207153 - CHANG CHIEN; Chien Lin ;   et al. | 2017-07-20 |
Semiconductor Package And Manufacturing Method Thereof App 20170133311 - KAO; Chin-Li ;   et al. | 2017-05-11 |
Semiconductor package and manufacturing method thereof Grant 9,589,840 - Kao , et al. March 7, 2 | 2017-03-07 |
Reeling Device App 20160380395 - LEE; Chang-Chi | 2016-12-29 |
Transmission cable for electrical devices Grant 9,426,910 - Lee August 23, 2 | 2016-08-23 |
Transmission Cable For Electrical Devices App 20160227659 - Lee; Chang-Chi | 2016-08-04 |
Bump Structures, Semiconductor Device And Semiconductor Device Package Having The Same App 20160211235 - CHEN; Dao-Long ;   et al. | 2016-07-21 |
Case of connector adapter Grant D742,827 - Lee November 10, 2 | 2015-11-10 |
Stylus App 20150270667 - LEE; Chang-Chi | 2015-09-24 |
Semiconductor Package And Manufacturing Method Thereof App 20140332957 - KAO; Chin-Li ;   et al. | 2014-11-13 |
USB connector module Grant 8,870,601 - Lee October 28, 2 | 2014-10-28 |
Signal Connector Module App 20140220828 - Lee; Chang-Chi | 2014-08-07 |
Signal connector module Grant 8,790,125 - Lee July 29, 2 | 2014-07-29 |
Usb Connector Module App 20140179166 - Lee; Chang-Chi | 2014-06-26 |
USB cable Grant D702,691 - Lee April 15, 2 | 2014-04-15 |
Semiconductor package with integrated metal pillars and manufacturing methods thereof Grant 8,698,307 - Shih , et al. April 15, 2 | 2014-04-15 |
Ion concentration measurement system and methods thereof Grant 8,333,876 - Chou , et al. December 18, 2 | 2012-12-18 |
Semiconductor Package With Integrated Metal Pillars And Manufacturing Methods Thereof App 20120074532 - SHIH; MENG-KAI ;   et al. | 2012-03-29 |
Sun-tracking solar energy collector apparatus Grant 8,136,518 - Lee March 20, 2 | 2012-03-20 |
Chip package structure and method of manufacturing the same Grant 8,035,213 - Lee , et al. October 11, 2 | 2011-10-11 |
Semiconductor package using an active type heat-spreading element Grant 8,022,534 - Wang , et al. September 20, 2 | 2011-09-20 |
Sun-tracking Solar Energy Collector Apparatus App 20110132352 - LEE; Chang Chi | 2011-06-09 |
Ion Concentration Measurement System And Methods Thereof App 20110056847 - Chou; Jung-Chuan ;   et al. | 2011-03-10 |
Cleaning Apparatus For Solar Panels App 20100293729 - LEE; Chang Chi | 2010-11-25 |
Method of producing bicycle ratchet bushing Grant 7,833,364 - Lee November 16, 2 | 2010-11-16 |
Method of Producing Bicycle Ratchet Bushing App 20100126641 - LEE; Chang Chi | 2010-05-27 |
Semiconductor Package Using An Active Type Heat-spreading Element App 20090250806 - WANG; Tong Hong ;   et al. | 2009-10-08 |
Separative extended gate field effect transistor based vitamin C sensor and forming method thereof Grant 7,598,546 - Chou , et al. October 6, 2 | 2009-10-06 |
Heat Sink Structure And Semiconductor Package As Well As Method For Configuring Heat Sinks On A Semiconductor Package App 20090230544 - WANG; Tong Hong ;   et al. | 2009-09-17 |
Chip package structure and method of manufacturing the same App 20090102066 - Lee; Chang-Chi ;   et al. | 2009-04-23 |
Fixing Frame For A Solar Energy Module App 20080223432 - LEE; Chang Chi | 2008-09-18 |
Integrated Fixing Frame For A Solar Energy Module App 20080222988 - LEE; CHANG CHI | 2008-09-18 |
Electrical box assembly for a solar energy module Grant 7,288,717 - Lee October 30, 2 | 2007-10-30 |
Internet automatic electric data system Grant 7,222,124 - Lin , et al. May 22, 2 | 2007-05-22 |
Upright heat dispensing fins of cylinder body App 20070034173 - Lee; Chang Chi | 2007-02-15 |
Horizontal heat dispensing fins of cylinder body App 20070034174 - Lee; Chang Chi | 2007-02-15 |
Audio cable structure App 20060289196 - Lee; Chang-Chi ;   et al. | 2006-12-28 |
Method Of Making A Heat Dissipating Microdevice App 20060225908 - Ding; Pei-Pei ;   et al. | 2006-10-12 |
Heat dissipating microdevice Grant 7,110,258 - Ding , et al. September 19, 2 | 2006-09-19 |
Heat Sink And Package Structure App 20060197219 - Lee; Chang-Chi ;   et al. | 2006-09-07 |
Audio cable structure Grant 7,091,420 - Lee , et al. August 15, 2 | 2006-08-15 |
Audio cable structure App 20060076156 - Lee; Chang-Chi ;   et al. | 2006-04-13 |
Luminous A/V cable assembly App 20060050508 - Lee; Chang-Chi ;   et al. | 2006-03-09 |
Structure of audio signal cable Grant 6,969,805 - Lee , et al. November 29, 2 | 2005-11-29 |
Audio and video signal cable App 20050121222 - Lee, Chang-Chi | 2005-06-09 |
Conduction state indicating connector App 20050099812 - Lee, Chang-Chi | 2005-05-12 |
Structure of a cable App 20050011664 - Lee, Chang-Chi | 2005-01-20 |
Structure of audio signal cable App 20050011667 - Lee, Chang-Chi ;   et al. | 2005-01-20 |
Heat dissipating microdevice and method of making the same App 20050006115 - Ding, Pei-Pei ;   et al. | 2005-01-13 |
Online entrusting system App 20040138960 - Lin, I-Linag ;   et al. | 2004-07-15 |
Internet automatic electric data system App 20040059715 - Lin, I-Linag ;   et al. | 2004-03-25 |
Thermal enhanced ball grid array package Grant 6,528,882 - Ding , et al. March 4, 2 | 2003-03-04 |
Signal cable connector Grant 6,476,318 - Lee November 5, 2 | 2002-11-05 |
Substrate having specific pad distribution Grant 6,403,896 - Ma , et al. June 11, 2 | 2002-06-11 |
Thermal enhanced ball grid array package App 20020038908 - Ding, Yi-Chuan ;   et al. | 2002-04-04 |
Structure of a connector for a microphone Grant 5,989,050 - Lee November 23, 1 | 1999-11-23 |
Connector for a microphone Grant D415,469 - Lee October 19, 1 | 1999-10-19 |
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