Ding; Pei-Pei
Patent Applications and Registrations
Patent applications and USPTO patent grants for Ding; Pei-Pei.The latest application filed is for "flat type heat pipe device".
- Ding; Pei-Pei - Kaohsiung TW
- Ding; Pei-Pei - Hsin-Chuang TW
- Ding; Pei-Pei - Taipei Hsien TW
- Ding; Pei-Pei - Taipei TW
- Ding; Pei-Pei - Hsin-Chuang City Taipei Hsien
| Patent | Date |
|---|---|
| Flat Type Heat Pipe Device App 20110186268 - YANG; HSIU-WEI ; et al. | 2011-08-04 |
| Manufacturing system for making a heat dissipating device Grant 7,721,439 - Lin , et al. May 25, 2 | 2010-05-25 |
| Heat dissipating device Grant 7,469,740 - Lin , et al. December 30, 2 | 2008-12-30 |
| Method for making a heat dissipating device Grant 7,464,463 - Lin , et al. December 16, 2 | 2008-12-16 |
| Method for making a heat dissipating device Grant 7,461,450 - Lin , et al. December 9, 2 | 2008-12-09 |
| Flat Type Heat Pipe Device And Method Of Fabrication Thereof App 20080080133 - Yang; Hsiu-Wei ; et al. | 2008-04-03 |
| Method for making a plate type heat pipe App 20070294892 - Yang; Hsiuwei ; et al. | 2007-12-27 |
| Method For Making Plate Type Heat Pipe App 20070261243 - Yang; Hsiu-Wei ; et al. | 2007-11-15 |
| Method of making a microstructure using a circuit board Grant 7,267,755 - Lin , et al. September 11, 2 | 2007-09-11 |
| Method Of Making A Heat Dissipating Microdevice App 20060225908 - Ding; Pei-Pei ; et al. | 2006-10-12 |
| Heat dissipating device App 20060213647 - Lin; Jan-Ching ; et al. | 2006-09-28 |
| Method for making a heat dissipating device App 20060213062 - Lin; Jao-Ching ; et al. | 2006-09-28 |
| Manufacturing system for making a heat dissipating device App 20060213056 - Lin; Jao-Ching ; et al. | 2006-09-28 |
| Method for making a heat dissipating device App 20060213063 - Lin; Jao-Ching ; et al. | 2006-09-28 |
| Heat dissipating microdevice Grant 7,110,258 - Ding , et al. September 19, 2 | 2006-09-19 |
| Heat dissipating microdevice and method of making the same App 20050006115 - Ding, Pei-Pei ; et al. | 2005-01-13 |
| Method of making a microstructure using a circuit board App 20050000816 - Lin, Jao-Ching ; et al. | 2005-01-06 |
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