U.S. patent application number 11/413501 was filed with the patent office on 2006-08-24 for etchant and method of use.
Invention is credited to David S. Becker, Kevin G. Donohoe.
Application Number | 20060186087 11/413501 |
Document ID | / |
Family ID | 33490804 |
Filed Date | 2006-08-24 |
United States Patent
Application |
20060186087 |
Kind Code |
A1 |
Donohoe; Kevin G. ; et
al. |
August 24, 2006 |
Etchant and method of use
Abstract
A method of anisotropically etching a semiconductive substrate
uses a hydrofluorocarbon etch gas with an etch selectivity
fluorocarbon gas. The fluorocarbon gas is used under conditions
that enhance selectivity of the etch to an etch stop layer with
respect to a bulk dielectric material such as doped or undoped
silicon dioxide. In one method, a silicon dioxide dielectric layer
is provided upon an etch stop layer, wherein the etch stop layer
comprises silicon dioxide that is doped differently from the
silicon dioxide dielectric layer. A gaseous etchant including a
hydrofluorocarbon etch gas and a fluorocarbon selectivity compound
is provided, and the silicon dioxide dielectric layer is exposed to
the gaseous etchant.
Inventors: |
Donohoe; Kevin G.; (Boise,
ID) ; Becker; David S.; (Boise, ID) |
Correspondence
Address: |
TRASK BRITT
P.O. BOX 2550
SALT LAKE CITY
UT
84110
US
|
Family ID: |
33490804 |
Appl. No.: |
11/413501 |
Filed: |
April 28, 2006 |
Related U.S. Patent Documents
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Application
Number |
Filing Date |
Patent Number |
|
|
10888255 |
Jul 9, 2004 |
7074724 |
|
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11413501 |
Apr 28, 2006 |
|
|
|
09559504 |
Apr 27, 2000 |
6890863 |
|
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10888255 |
Jul 9, 2004 |
|
|
|
Current U.S.
Class: |
216/79 ;
257/E21.252; 257/E21.507; 257/E21.577 |
Current CPC
Class: |
C09K 13/08 20130101;
H01L 21/31116 20130101; H01L 21/76897 20130101; H01L 21/76802
20130101 |
Class at
Publication: |
216/079 |
International
Class: |
B44C 1/22 20060101
B44C001/22 |
Claims
1. A method of removing silicon dioxide upon an etch stop layer,
comprising: providing a silicon dioxide dielectric layer upon an
etch stop layer, wherein the etch stop layer comprises silicon
dioxide that is doped differently from the silicon dioxide
dielectric layer; providing a gaseous etchant comprising a
hydrofluorocarbon etch gas and a fluorocarbon selectivity compound;
and exposing the silicon dioxide dielectric layer to the gaseous
etchant.
2. The method of claim 1, wherein the fluorocarbon selectivity
compound is selected from the group consisting of CF.sub.4,
C.sub.2F.sub.6, C.sub.4F.sub.8, C.sub.5F.sub.6, C.sub.5F.sub.8, and
combinations thereof.
3. The method of claim 1, wherein the hydrofluorocarbon etch gas is
provided in a first quantity, the fluorocarbon selectivity compound
is provided in a second quantity, and the first quantity is at
least twice the second quantity.
4. The method of claim 1, further comprising etching the silicon
dioxide dielectric layer in the gaseous etchant until the etch stop
layer is exposed.
5. The method of claim 1, wherein providing a gaseous etchant
further comprises providing a gaseous etchant comprising about 30
parts to about 50 parts of a hydrofluorocarbon etch gas comprising
CHF.sub.3 and about less than one part to about 15 parts of a
fluorocarbon selectivity compound.
6. The method of claim 1, wherein providing a gaseous etchant
further comprises providing a gaseous etchant comprising about 44
parts to about 45 parts of a hydrofluorocarbon etch gas comprising
CHF.sub.3 and about 0.5 parts to about 4 parts of a fluorocarbon
selectivity compound.
7. A method of removing silicon dioxide upon an etch stop layer,
comprising: providing a silicon dioxide dielectric layer upon an
etch stop layer, wherein the etch stop layer comprises silicon
dioxide that is doped differently from the silicon dioxide
dielectric layer; providing a first gaseous etchant comprising a
hydrofluorocarbon etch gas; providing a second gaseous etchant
comprising a fluorocarbon selectivity compound; and exposing the
silicon dioxide dielectric layer to the first gaseous etchant and
the second gaseous etchant.
8. The method of claim 7, wherein the fluorocarbon selectivity
compound of the second gaseous etchant is selected from the group
consisting of CF.sub.4, C.sub.2F.sub.6, C.sub.4F.sub.8,
C.sub.5F.sub.6, C.sub.5F.sub.8, and combinations thereof.
9. The method of claim 7, wherein the first gaseous etchant is
provided in a first quantity, the second gaseous etchant is
provided in a second quantity, and the first quantity is at least
twice the second quantity.
10. The method of claim 7, further comprising etching the silicon
dioxide dielectric layer in a mixture of the first gaseous etchant
and the second gaseous etchant.
11. The method of claim 7, wherein exposing the silicon dioxide
dielectric layer to the first gaseous etchant and the second
gaseous etchant comprises exposing the silicon dioxide dielectric
layer to the first gaseous etchant and the second gaseous etchant
simultaneously.
12. The method of claim 7, wherein: providing a first gaseous
etchant further comprises providing a first gaseous etchant
comprising about 30 parts to about 50 parts of a hydrofluorocarbon
etch gas comprising CHF.sub.3; and wherein providing a second
gaseous etchant further comprises providing a second gaseous
etchant comprising about less than one part to about 15 parts of a
fluorocarbon selectivity compound.
13. The method of claim 7, wherein: providing a first gaseous
etchant further comprises providing a first gaseous etchant
comprising about 44 parts to about 45 parts of a hydrofluorocarbon
etch gas comprising CHF.sub.3; and wherein providing a second
gaseous etchant further comprises providing a second gaseous
etchant comprising about 0.5 parts to about 4 parts of a
fluorocarbon selectivity compound.
14. The method of claim 7, wherein exposing the silicon dioxide
dielectric layer to the first gaseous etchant and the second
gaseous etchant further comprises: exposing the silicon dioxide
dielectric layer to a constant supply of the first gaseous etchant;
and intermittently exposing the silicon dioxide dielectric layer to
the second gaseous etchant wherein the second gaseous etchant is
intermittently blended with the first gaseous etchant.
15. A method of removing silicon dioxide upon an etch stop layer,
comprising: providing a silicon dioxide dielectric layer upon an
etch stop layer, wherein the etch stop layer comprises silicon
dioxide that is doped differently from the silicon dioxide
dielectric layer; providing a first gaseous etchant comprising a
hydrofluorocarbon etch gas; providing a second gaseous etchant
comprising a fluorocarbon selectivity compound; exposing the
silicon dioxide dielectric layer to the first gaseous etchant; and
pulsing the second gaseous etchant into the first gaseous etchant
during the exposing of the silicon dioxide dielectric layer to the
first gaseous etchant to expose the silicon dioxide dielectric
layer to a mixture of the first gaseous etchant and the second
gaseous etchant.
16. The method of claim 15, wherein the fluorocarbon selectivity
compound of the second gaseous etchant is selected from the group
consisting of CF.sub.4, C.sub.2F.sub.6, C.sub.4F.sub.8,
C.sub.5F.sub.6, C.sub.5F.sub.8, and combinations thereof.
17. The method of claim 15, wherein the first gaseous etchant is
provided in a first quantity, the second gaseous etchant is
provided in a second quantity, and the first quantity is at least
twice the second quantity.
18. The method of claim 15, further comprising etching the silicon
dioxide dielectric layer in a mixture of the first gaseous etchant
and the second gaseous etchant until the etch stop layer is
exposed.
19. The method of claim 15, wherein providing a first gaseous
etchant further comprises providing a first gaseous etchant
comprising about 30 parts to about 50 parts of a hydrofluorocarbon
etch gas comprising CHF.sub.3.
20. The method of claim 15, wherein providing a first gaseous
etchant further comprises providing a first gaseous etchant
comprising about 44 parts to about 45 parts of a hydrofluorocarbon
etch gas comprising CHF.sub.3.
21. The method of claim 15, wherein providing a second gaseous
etchant further comprises providing a second gaseous etchant
comprising about less than one part to about 15 parts of a
fluorocarbon selectivity compound.
22. The method of claim 15, wherein providing a second gaseous
etchant further comprises providing a second gaseous etchant
comprising about 0.5 parts to about 4 parts of a fluorocarbon
selectivity compound.
Description
CROSS-REFERENCE TO RELATED APPLICATIONS
[0001] This application is a continuation of U.S. patent
application Ser. No. 10/888,255, filed Jul. 9, 2004, pending, which
application is a divisional of U.S. patent application Ser. No.
09/559,504, filed on Apr. 27, 2000, now U.S. Pat. No. 6,890,863,
issued May 10, 2005, the disclosures of which are incorporated
herein by reference.
BACKGROUND OF THE INVENTION
[0002] 1. The Field of the Invention
[0003] The present invention relates to semiconductor device
fabrication. More particularly, the present invention relates to
etch processing of semiconductor structures. In particular, the
present invention relates to a contact hole etch and process
therefore that operates in the subhalf-micron range, where the
etchant includes a compound that is used as a selectivity
enhancer.
[0004] 2. State of the Art
[0005] In the microelectronics industry, a "substrate" refers to
one or more semiconductor layers or structures which includes
active or operable portions of semiconductor devices. In the
context of this document, the term "semiconductive substrate" is
defined to mean any construction comprising semiconductive material
including, but not limited to, bulk semiconductive material such as
a semiconductive substrate, either alone or in assemblies
comprising other materials thereon, and semiconductive material
layers, either alone or in assemblies comprising other materials.
The term "substrate" refers to any supporting structure including,
but not limited to, the semiconductive substrates described
above.
[0006] Miniaturization is the process of crowding an
ever-increasing number of microelectronic devices into the same
amount of semiconductive substrate real estate while maintaining
and/or improving the quality of each microelectronic device.
Miniaturization also requires improving and/or maintaining the
integrity of interconnects and vias. The pressure to fabricate
ever-smaller microelectronic devices on the active surface of
semiconductive substrates consequently requires the formation of
smaller topographical features that define the components of the
microelectronic devices. One feature is the contact corridor, also
known as the contact hole or channel (hereinafter "contact") which
typically comprises a circular depression that extends through a
dielectric layer to an underlying structure that is electrically
conductive or electrically semiconductive.
[0007] As the miniaturization process progresses into the
subhalf-micron range, structural dimension tolerances become
increasingly important such that processing sensitivity must be
correspondingly improved. As an example, a contact in the
subhalf-micron range preferably retains a critical dimension (CD)
within a defined tolerance during a high-aspect ratio anisotropic
etch through a dielectric layer. The contact, therefore, must
retain its initial circular cross section and constant diameter
cylindrical shape within the dielectric layer in order to avoid
cutting into an underlying structure outside of the CD.
Additionally, the CD cannot become so small that an open circuit is
created due to the inability to fill the contact, or a
destructively high resistance created by too narrow of a
contact.
[0008] As used herein, the term "high-aspect ratio" refers to
depth-to-bottom CD ratio of about five to one or more. In addition
to contacts, high-aspect ratio subhalf-micron width lines or
trenches within a dielectric layer must be fabricated under
conditions that require similar etch tolerances.
[0009] A dry, or plasma etch in an etch tool is the preferred
process for etching a subhalf-micron contact. Inductively coupled,
or high density etch systems are commonly referred to as etch
tools. It would be desirable to etch a high-aspect ratio contact
through a layer of dielectric in an etch tool while retaining the
preferred CD.
[0010] Dielectrics may be materials such as borophosphosilicate
glass (BPSG) or other materials such as oxides, nitrides, or
dielectric anti-reflective coatings (DARC) that are placed between
the mask and the substrate silicon. Processing parameters for the
etching of a contact require the ability to maintain a CD for about
a 2.2 microns deep feature, overetched by 0.4 microns and to
generate a contact profile that is preferably only slightly tapered
or more preferably substantially cylindrical. At the subhalf-micron
geometry, an increase in the radius of the contact caused by a
re-entrant profile may be sustained up to about 0.025 microns.
Contacts with a depth of about 2.2 microns and between 0.2 and 0.45
microns for a CD would be considered to have achieved the required
CD profile control.
[0011] Because the etching process typically involves a silicon
oxide such as BPSG and an etch stop layer such as silicon nitride
or other materials including doped or undoped silicon oxide,
enhanced selectivity to the etch stop layer is required as
fabrication proceeds into the subhalf-micron regime.
[0012] Another problem that exists in the prior art is that
different etch types require different chamber wall temperatures.
Where a high chamber wall temperature etch must be followed by a
lower chamber wall temperature etch, transfer of the semiconductive
substrate from the high chamber wall temperature etch to a low
chamber wall temperature etch is required because of the inability
to cool the high-temperature etch chamber rapidly enough.
Attempting to conduct a lower temperature etch in a hot,
high-temperature etch chamber may cause the lower temperature etch
to malfunction and to consequently damage or destroy the
semiconductor device being fabricated. It is therefore necessary to
transfer the semiconductive substrate out of the high-temperature
etch chamber into a lower temperature etch chamber. Such a transfer
is both time consuming and technically difficult where the
necessity of maintaining the clean environment requires a transfer
to an etch chamber that may be remote and thermally insulated from
the high-temperature etch chamber. It would therefore be an
improvement in the art to discover a method of etching for two
traditionally different temperature etches with a closer
temperature range or the same temperature range.
[0013] Applied Materials, Inc. of Santa Clara, Calif. currently
offers an inductively-coupled plasma etcher identified as the
Dielectric Etch IPS Centura.RTM. system (the "IPS system") for
etching high-aspect ratio contacts, among other uses. The IPS
system uses an inductively-coupled, parallel plate technology that
employs temperature controlled Si surfaces within the etch chamber
in combination with fluorine-substituted hydrocarbon etch gases to
achieve an oxide etch having a selectivity to silicon nitride in
excess of ten to one. U.S. Pat. No. 5,423,945, assigned to Applied
Materials, Inc., discloses the structure of operation of a
predecessor apparatus to the IPS system, a schematic of which is
shown in FIG. 1. The disclosure thereof is incorporated herein by
specific reference.
[0014] An IPS system 10 as depicted in FIG. 1 includes an etch
chamber 12 primarily defined between a grounded silicon roof 14, an
RF powered (bias) semiconductive substrate support 16 and a silicon
ring 18 surrounding semiconductive substrate support 16, on which a
semiconductive substrate 100 is disposed for processing. A plasma
20 generated over semiconductive substrate 100 is confined by
magnetic fields as seen at reference numerals 22 and 24. Gases are
supplied to chamber 12 through a valved manifold 26 which is
connected to a plurality of gas sources (not shown). Evacuation of
etch chamber 12 may be effected as desired through a valve 28, as
is known in the art.
[0015] An RF source power is supplied to an inner antenna 30 and an
outer antenna 32 by an RF generator 34. The inner and outer
antennae 30 and 32 are tuned for resonance in order to provide an
efficient inductive coupling with plasma 20. Inner antenna 30,
outer antenna 32, RF generator 34 and associated circuitry comprise
a source network 36. Bias power is also supplied to semiconductive
substrate support 16 by RF generator 34. RF generator 34, supplying
power to semiconductive substrate support 16, comprises a bias
network 38 with associated circuitry as shown. RF bias power is
delivered at 1.7.+-.0.2 MHz, RF outer antenna power at 2.0.+-.0.1
MHz, and RF inner antenna power at 2.3.+-.0.1 MHz. Other details of
IPS system 10 being entirely conventional, no further discussion
thereof is required. Semiconductive substrate 100 is attached to a
monopolar electrostatic chuck as a semiconductive substrate support
16.
[0016] A plasma etch process that was initially developed for use
with the IPS system employs a gas flow of a relatively high rate
and somewhat complex chemistry, relatively high process
temperatures and, most notably, CO (carbon monoxide) in the gas
mixture. Specifically, the process employs 300-400 (and preferably
358) standard cubic centimeters per minute (sccm) Ar (argon), 55
sccm CO, 82 sccm CHF.sub.3 (trifluoromethane), and 26 sccm
CH.sub.2F.sub.2 (difluoromethane) with a process pressure of 50
mTorr. Source power input is about 1650 watts, apportioned as 1400
watts to the outer antenna and 250 watts to the inner antenna. Bias
power is about 800 watts. According to the IPS system manufacturer,
the high volume of Ar is required, or at least desirable, to
maintain a plasma state within the etch chamber.
[0017] The IPS system employs the adjustable, dual-antenna
inductive source and bias power control to adjust etch results. All
high density oxide etch tools such as the IPS system can deposit
from about 2,000 to about 4,000 angstroms per minute of
fluorocarbon polymers on the semiconductive substrate under
conditions if the bias power is set to zero. In other words, any
surface that is not powered is exposed to a flux of pre-polymer
material that will deposit on the surface unless conditions are
altered to prevent its deposition.
[0018] Capacitative coupling is often a source of difficulty during
etching. The common assignee of the present invention has filed
several patent applications regarding the control of this
capacitative coupling, including U.S. application Ser. No.
09/012,155, now U.S. Pat. No. 6,095,159, entitled "Method of
Modifying an RF Circuit of a Plasma Chamber to Increase Chamber
Life and Process Capabilities"; U.S. application Ser. No.
09/031,400, now U.S. Pat. No. 6,516,742, entitled "Apparatus for
Improved Low Pressure Inductively Coupled High Density Plasma
Reactor"; and U.S. application Ser. No. 09/020,696, now U.S. Pat.
No. 5,998,931, entitled "Method and Apparatus for Controlling
Electrostatic Coupling to Plasmas." The disclosures of the
aforementioned three patents are incorporated herein by
reference.
[0019] Some of the high density oxide etch tools have virtually no
capacitative coupling between the source coil and the plasma. For
example, the IPS system, as identified hereinabove has virtually no
such coupling. The conducting silicon roof on the IPS system acts
as an electrostatic shield which eliminates electrostatic coupling
between the source coil and the plasma. Thus, roof temperature may
be used to control the amount of deposition that occurs on the roof
of the IPS system. Additionally, the IPS system uses a reactive
surface to line the chamber walls or parts of the walls. The IPS
system uses silicon which it heats to temperatures that are too
high to permit deposition but that are sufficiently high to
scavenge free fluorine from the etch plasma.
[0020] It would be advantageous to develop a process for use with
the IPS system or an equivalent system that would be simple and
easy to control and optimize while still meeting manufacturing
specifications for the high-aspect ratio contacts and other
apertures, such as lines or trenches which may be formed in a
substrate. Such a process would be expected to yield similar
results in any inductively-coupled plasma etcher which employs
silicon surfaces at elevated temperatures within the etch
chamber.
[0021] It would also be advantageous to develop a process for use
with the IPS system which would be versatile enough to allow
different etch types to be conducted on the same semiconductive
substrate without requiring a transfer of the semiconductive
substrate from one etch tool to another due to disparate
temperature differences between the two etch types.
SUMMARY OF THE INVENTION
[0022] The present invention relates to a process for
anisotropically etching through silicon dioxide and stopping on an
underlying layer. The present invention provides a process that is
suitable for use in a high density etch tool, such as the Applied
Materials IPS Centura.RTM. system, for etching silicon dioxide by
employing an inventive gas mixture and delivering the gas mixture
at a low flow rate and at relatively low process temperatures.
Under these conditions, the low temperatures used in the inventive
method allow the use of an etch gas mixture that etches the silicon
dioxide dielectric layer substantially anisotropically and which
stops etching on an underlying layer that is compositionally
dissimilar to the silicon dioxide dielectric layer. The underlying
layer can be composed of a nitride compound such as a refractory
metal nitride or silicon nitride, or it may be a silicon dioxide
underlying layer with different doping from the silicon dioxide
dielectric layer. Alternatively, the underlying layer may be a
silicon material such as a monocrystalline silicon substrate or it
may be polysilicon.
[0023] The inventive process employs a mixture of two preferred
etchant gases: a hydrofluorocarbon and a selectivity compound
consisting of carbon and fluorine, wherein the latter is a
selectivity enhancing gas that is preferably one of CF.sub.4,
C.sub.2F.sub.6, C.sub.4F.sub.8, C.sub.5F.sub.6, C.sub.5F.sub.8, and
combinations of these. The etch gas flow rates are extremely low.
The etch gas flow rates are on the order of about 30 to about 50
sccm of hydrofluorocarbon, preferably CHF.sub.3. The selectivity
enhancing gas flow rate is from about zero to about 25 sccm of the
selectivity compound, preferably CF.sub.4.
[0024] Etch selectivity fluorocarbon gases, intended herein to mean
CF.sub.4, C.sub.2F.sub.6, C.sub.4F.sub.8, C.sub.5F.sub.6,
C.sub.5F.sub.8, and the like and combinations of these, have been
used in previous applications as etch gases, but not as a
selectivity enhancing etch gas for nitride or silicon compounds
while etching oxides on semiconductive substrates. During
development of the present invention, it was discovered that under
the operating conditions set forth herein, increased etch
selectivity fluorocarbon etch gas in addition to the
hydrofluorocarbon etch gas such as CHF.sub.3 etch gas, caused an
increased etch selectivity for a nitride compound, or a silicon
dioxide underlying layer doped differently from the silicon dioxide
dielectric layer.
[0025] The present invention is also useful for processing
different types of etches such as a mask-aligned contact etch at an
etch chamber roof surface temperature in a range below about
200.degree. C. and a self-aligned contact etch in the same etch
chamber in the same temperature range. Thereby, etching may be
carried out within the same etch chamber where previously
self-aligned contact etching needed to be carried out in a
high-temperature etch chamber, or the high-aspect ratio
mask-aligned contact etch chamber could be used but a significant
amount of time was needed to allow the etch chamber to cool.
[0026] These and other features of the present invention will
become more fully apparent from the following description and
appended claims, or may be learned by the practice of the invention
as set forth hereinafter.
BRIEF DESCRIPTION OF THE DRAWINGS
[0027] In order to illustrate the manner in which the above-recited
and other advantages and features of the invention are obtained, a
more particular description of the invention briefly described
above will be rendered by reference to specific embodiments thereof
which are illustrated in the appended drawings. Understanding that
these drawings depict only typical embodiments of the invention and
are not therefore to be considered limiting of its scope, the
invention will be described and explained with additional
specificity and detail through the use of the accompanying drawings
in which:
[0028] FIG. 1 is a cross-sectional and wiring schematic of the
Applied Materials, Incorporated Dielectric Etch IPS Centura.RTM.
system, suitable for use with the process of the present invention
and together therewith comprising an embodiment of an inventive
etch system;
[0029] FIG. 2A is an elevational cross-sectional view of a
semiconductive substrate that has been patterned with a mask in
preparation for a self-aligned contact etch;
[0030] FIG. 2B is an elevational cross-sectional view of the
semiconductive substrate depicted in FIG. 2A, taken along the line
B-B;
[0031] FIG. 3 is an elevational cross-sectional view of the
semiconductive substrate seen in FIG. 2A under etch conditions
disclosed herein without the presence of CF.sub.4;
[0032] FIG. 4 is an elevational cross-sectional view of the
semiconductive substrate seen in FIG. 2A under etch conditions
containing about a 10% gas presence of CF.sub.4;
[0033] FIG. 5 is an elevational cross-sectional view of the
semiconductive substrate depicted in FIG. 2A under etch conditions
containing about a 25% gas presence of CF.sub.4; and
[0034] FIG. 6 is an elevational cross-sectional view of a
semiconductive substrate with a high-aspect ratio contact formed
therein.
DETAILED DESCRIPTION OF THE INVENTION
[0035] The present invention employs two etchant gases: a
hydrofluorocarbon etch gas and an etch selectivity fluorocarbon
gas. The gas flow rates are extremely low, on the order of from
about 30 to about 50 sccm (standard cubic centimeters per minute)
for the hydrofluorocarbon gas and from about zero to about 25 sccm
for the etch selectivity fluorocarbon gases. The hydrofluorocarbon
etch gas may include CHF.sub.3, CH.sub.2F.sub.2, CH.sub.3F,
C.sub.2HF.sub.5 and the like, and combinations of these. The etch
selectivity fluorocarbon gases may include CF.sub.4 or quantities
of the higher carbon fluorocarbons such as C.sub.2F.sub.6,
C.sub.4F.sub.8, C.sub.5F.sub.6, C.sub.5F.sub.8, and the like and
combinations of these. The etch selectivity fluorocarbon gases
provide enhanced selectivity under the inventive process conditions
instead of their usual behavior as selectivity reducers.
[0036] Under relatively low pressure processes in the range from
about 10 to about 40 mTorr, the above-mentioned flow rates are
preferred. For higher pressure processes in the range of from about
40 to about 100 mTorr, higher proportional flow rates may be used.
For example, CHF.sub.3 and CF.sub.4 flows may be in the range from
about 60 to about 100 sccm.
[0037] The inventive etch method is carried out in dielectric
materials, by way of example in the form of boron phosphorus
silicate glass (BPSG) and other doped and undoped dielectric films
used in semiconductive microelectronic device fabrication. Such
doped and undoped dielectric films may include SiO.sub.2,
tetraethyl orthosilicate (TEOS), and phosphorous silicate glass
(PSG).
[0038] A variant of the inventive process employs only a
hydrofluorocarbon such as CHF.sub.3 during the initial portion of
the etch process and adds an etch selectivity fluorocarbon gas in
the final portion of the etch process to increase the etch
selectivity to the underlying layer such as a silicon nitride layer
(Si.sub.3N.sub.4 and the like) or other compositionally dissimilar
dielectric layers, such as a silicon dioxide underlying layer with
different doping from the silicon dioxide dielectric layer.
[0039] Another variant of the inventive process employs the
injection of a hydrofluorocarbon gas such as CHF.sub.3 during the
etch process and pulses an etch selectivity hydrofluorocarbon gas
such as CF.sub.4 over a concentration range and for a pulse time
period to improve the etch selectivity to the underlying layer.
[0040] Reference will now be made to the figures wherein like
structures will be provided with like reference designations. It is
to be understood that the drawings are diagrammatic and schematic
representations of some embodiments of the present invention and
are not limiting of the present invention nor are they necessarily
drawn to scale.
[0041] The system chamber, referring to FIG. 1, is defined and
controlled at roof 14 over semiconductive substrate end ring 18
surrounding semiconductive substrate 100. Roof 14 also has
sidewalls as depicted and is held to a roof surface temperature
within a range from about 100.degree. C. to about 190.degree. C.,
more preferably from about 100.degree. C. to less than about
150.degree. C., and most preferably from about 100.degree. C. to
less than about 140.degree. C. Ring 18 is held within a range from
about 180.degree. C. to about 300.degree. C., preferably from about
190.degree. C. to about 250.degree. C., and most preferably about
200.degree. C. A preferred temperature comprises the lowest at
which the IPS system is operable under continuous semiconductive
substrate processing conditions. Further, a roof temperature below
about 140.degree. C. is the preferred temperature which may be
employed with the inventive gas mixture to conduct the selective
etch process of the invention without experiencing over-etching of
the silicon nitride or silicon structures which are present in a
microelectronic device beneath a compositionally different bulk
dielectric. A roof temperature of about 200.degree. C. is also
acceptable.
[0042] The temperature of semiconductive substrate support 16 is
contained in a range from between about -20.degree. C. to about
+80.degree. C. and most preferably about +40.degree. C. The
pressure of etch chamber 12 is maintained at greater than about 1
mTorr, more preferably greater than about 15 mTorr, and most
preferably greater than about 20 mTorr.
[0043] Source power to etch chamber 12 is preferably maintained
between about 750 and about 1250 Watts, at a ratio of about four to
one between outer antenna 32 and inner antenna 30, and most
preferably about 1000 Watts with about 875 Watts to outer antenna
32 and about 125 watts to inner antenna 30. Bias power at
semiconductive substrate support 16 is preferably maintained at
about 400 to about 800 Watts, preferably from about 500 to about
700 Watts, and most preferably about 600 Watts.
[0044] The process parameters disclosed herein have been used to
produce high-aspect ratio CD features. The CD features were defined
through BPSG using an I-line photoresist as well as deep
ultraviolet (DUV) photoresist. Specifically, the CD features formed
using I-line photoresist where in a range from about 0.2 microns to
about 0.6 microns, and from about 0.2 microns to about 0.4 microns.
For a DUV photoresist, the CD features formed greater than or equal
to about 0.1 microns to about 0.5 microns, from about 0.2 microns
to about 0.4 microns, and about 0.3 microns. A suitable example of
an I-line resist is the Sumitomo PFI-66A7 resist, offered by
Sumitomo of Osaka, Japan while a suitable DUV resist is the
TOK-TOUR-P024 resist, offered by TOK of Sagami, Japan.
Two-Stage Gas Etching
[0045] A first embodiment of the present invention includes
providing a semiconductive substrate 100 in an etch tool such as
the Applied Materials IPS system. Referring to FIG. 2A, etching is
carried out by patterning a mask 40 upon a bulk dielectric 42 that
is disposed about spacers 44. Spacers 44 may cover structures such
as a gate stack 46. Gate stack 46 is disposed upon a gate oxide
layer 48 that is ultimately disposed upon a semiconductive material
50.
[0046] Dielectric 42 is composed of silicon dioxide (SiO.sub.2)
which can be described as being either undoped or doped glass. In
the semiconductor industry, the term oxide is generally used
instead of glass. Generally, an undoped oxide is either a field
oxide or gate oxide which is usually grown in a furnace. Doped
oxides include BPSG, PSG, etc. which are generally formed on
silicon semiconductive substrate 100 with a dopant gas(es) during a
deposition process. Dielectric 42 is deposited onto adjacent,
spaced apart gate stacks 46 as well as other surfaces on
semiconductive substrate 100. Gate stacks 46 include spacers 44 and
are fabricated by a spacer etch process from an etch stop layer
composed of silicon nitride or a silicon oxide material that is
compositionally different from dielectric 42.
[0047] Mask 40 comprises a photoresist layer having an opening 56
for forming a predetermined pattern. Typically, this is
accomplished using a semiconductor photomask and known conventional
etch mask patterning techniques.
[0048] FIG. 2B is an elevational cross-sectional view of
semiconductive substrate 100 depicted in FIG. 2A, taken along the
section line B-B to depict a perpendicular view thereof. The etch
is also useful for stopping on structures such as a shallow trench
isolation 60 as depicted in FIG. 2B. An etch profile 62 is
contemplated with the present invention that may cause a slight
taper shape as the contact is formed beginning at opening 56.
Additionally, the etch will stop at and/or pass beyond spacers 44,
depicted in FIG. 2B as a phantom line as spacers 44 are not
intersected by section line B-B.
[0049] The gas plasma etch technique employed herein typically has
an etching area in a plasma and is generated under vacuum within
the confines of an RF discharge unit. The preferred plasma etch
technique employed herein may include the use of Electron Cyclotron
Resonance (ECR), reactive ion etch (RIE), magnetically enhanced
reactive ion etch (MERIE), Plasma etching (PE) reactive ion, point
plasma etching, magnetically confined helicon and helical
resonator, PE, or magnetron PE. In plasma dry etchers, typically
the upper electrode is powered while the lower electrode is
grounded. In RIE etching, the lower electrode is powered while the
upper electrode is grounded. In triode dry etchers, the upper and
lower electrodes can be powered as well as the sidewall. In MERIE
etching, magnets are used to increase the ion density of the
plasma. In ECR etching, the plasma is generated upstream from the
main reaction chamber. This produces a low ion energy to reduce
damage to the semiconductive substrate.
[0050] A semiconductor device is located in a desired etcher within
an etching area and is etched with a fluorinated chemical etchant
system to form a predetermined pattern therein. The fluorinated
chemical etchant system may comprise a chemical etchant composition
of the type described above such as CHF.sub.3, CF.sub.4, Ar, and
optionally a CH.sub.2F.sub.2 additive material. The fluorinated
chemical etchant system is substantially in a gas phase during the
etching of the multilayer structure.
[0051] Referring again to FIG. 2A, the exposed dielectric 42,
composed of SiO.sub.2, is etched anisotropically at a relatively
high etch rate down to spacers 44, composed of Si.sub.3N.sub.4 or a
differently doped SiO.sub.2 compared to dielectric 42, and serving
as an etch stop layer. Portions of dielectric 42 are selectively
removed by chemically enhanced ionic bombardment. Some areas of
semiconductive substrate 100 continue to have the SiO.sub.2 of
dielectric 42 available to be etched while other areas of
semiconductive substrate 100 are not etched in that the etch has
already exposed spacer 44 where the etching process effectively
stops because of polymer formation on the surface of spacer 44. In
this way, the etching process can provide for the formation of the
upright sidewalls in etched layers which are substantially
conformal to the remaining surface while providing etch selectively
to the etch stop layer.
[0052] When RF energy is applied to the chamber, at least to the
upper electrode, the gas fed into the chamber via the gas
distribution plate is converted to plasma. The plasma contains
reactive chemical species which will etch selected unmasked
portions of the semiconductive substrate electrostatically clamped
to the lower electrode. A throttle valve located between the plasma
etching chamber regulates the pressure of the chamber to processing
values, generally in the range of about 10-350 mTorr.
[0053] IPS system 10 is governed by a programmable computer that is
programmed to prompt the machine to evacuate and vent the load
locks, transfer semiconductive substrates to and from the
cassettes, elevator, and etch chamber, control the delivery of
process gas, RF power, and magnetic field to the plasma etching
chamber, and maintain the temperature of the semiconductive
substrate in the plasma etching chamber, all at appropriate times
and in appropriate sequence.
[0054] Given the foregoing environment, a multilayer structure,
such as a semiconductor substrate, is located within the plasma
etching chamber and is etched with a fluorinated chemical etchant
system to form a predetermined pattern therein.
[0055] In the case of the chemical etchant composition including
CHF.sub.3, CF.sub.4 and Ar, the exposed SiO.sub.2 layer may be
selectively etched at a relatively high etch rate and high
selectivity down to the Si.sub.3N.sub.4 etch stop layer by removing
predetermined portions of the SiO.sub.2 layer using chemically
enhanced ionic bombardment of the gas phase etchant material.
[0056] Etching is carried out by the formation of a self-aligned
contact hole through mask 40 and dielectric 42 that uses a first
etch gas, namely the hydrofluorocarbon gas CHF.sub.3 in a first
etch gas recipe to a first etch depth. The CHF.sub.3 has a first
nitride etch selectivity. Etching continues with an etch
selectivity fluorocarbon gas that is blended with the CHF.sub.3 to
form a second etch gas recipe. The etch selectivity fluorocarbon
gas may include any or all of CF.sub.4, C.sub.2F.sub.6,
C.sub.4F.sub.8, C.sub.5F.sub.6, C.sub.5F.sub.8, and the like. The
etch selectivity fluorocarbon gas is used in etching the oxide
layer as a continuation of the CHF.sub.3 first etch gas. The etch
selectivity fluorocarbon gas when blended with the CHF.sub.3 first
etch gas has a second nitride selectivity that is greater than the
first nitride etch selectivity. Under the inventive conditions, the
method of etching the semiconductive substrate stops the
self-aligned contact hole upon a nitride layer or upon
semiconductive material 50.
[0057] As one alternative of this embodiment, the hydrofluorocarbon
gas CHF.sub.3 as the first etch gas may be used in connection with
CH.sub.2F.sub.2 gas. The ratio of CHF.sub.3 to CH.sub.2F.sub.2 may
be from about 10:1 to about 1:10, preferably about 1:1, and most
preferably about 5:1.
[0058] In another alternative of this embodiment, the
hydrofluorocarbon gas CHF.sub.3 is used with the fluorocarbon gas
C.sub.2F.sub.6 and may be provided in ratios from about 10:1 to
about 5:1, preferably about 10:1.
[0059] Preferably for this embodiment, the nitride etch selectivity
enhancing gas is the etch selectivity fluorocarbon gas. In a
preferred embodiment, the etch selectivity fluorocarbon gas is
CF.sub.4. In another embodiment the etch selectivity fluorocarbon
gas is provided with CF.sub.4 and C.sub.4F.sub.8. The ratio of
CF.sub.4 to C.sub.4F.sub.8 may be in a range from about 10:1 to
about 1:10, preferably about 1:1 and most preferably about 5:1. The
etch selectivity fluorocarbon gas may also be a combination of
CF.sub.4 and C.sub.5F.sub.8. Additionally, it may be the
combination of CF.sub.4 and C.sub.5F.sub.6. The relative
proportions of CF.sub.4 to its other etch selectivity fluorocarbon
gas for the above two examples are in a range from about 10:1 to
about 1:10, preferably about 1:1, and most preferably about
5:1.
[0060] The relative proportions of the hydrofluorocarbon etch gas
to the etch selectivity fluorocarbon gas include the etch gas,
particularly CHF.sub.3 in a range from about 30 to about 50 parts
in comparison with the etch selectivity fluorocarbon gas in a range
from about less than one part to about 25 parts. Preferably, the
etch selectivity fluorocarbon gas is supplied in about 15 parts and
the first etch gas, particularly CHF.sub.3, is applied in about 44
to about 45 parts.
[0061] Where the etch selectivity fluorocarbon gas includes higher
carbon number gases including at least one of C.sub.2F.sub.6,
C.sub.4F.sub.8, C.sub.5F.sub.6, and C.sub.5F.sub.8, the preferred
proportion of the etch selectivity fluorocarbon gas is in a range
from about 0.5 to about 4 parts, most preferably from about one
part to about 2 parts, in comparison with the first etch gas,
particularly CHF.sub.3 which will be in a range from about 30 to
about 50 parts, and preferably about 44 to about 45 parts.
Pulsed Fluorocarbon Gas Etching
[0062] Another embodiment of the present invention includes
providing semiconductive substrate 100 in an etch tool such as the
Applied Materials IPS system. Referring again to FIG. 2A, etching
is carried out by patterning mask 40 upon bulk dielectric 42 that
is disposed about spacers 44. Spacers 44 may cover other structures
such as gate stack 46. Gate stack 46 is disposed upon gate oxide
layer 48 that is ultimately disposed upon semiconductive material
50.
[0063] The pulsed fluorocarbon gas etch technique of this
embodiment is carried out under conditions similar to the 2-stage
gas etching set forth above. A semiconductor device is located in a
desired etcher with an etching area and is etched with the
inventive fluorinated chemical etchant system to form a
predetermined pattern therein. The fluorinated chemical etchant
system may comprise a chemical etchant composition of the type
described above such as CHF.sub.3, CF.sub.3, Ar, and optionally a
CH.sub.2F.sub.2 additive material. The fluorinated chemical etch
system is substantially in a gas phase during the etching of the
multi-layer structure.
[0064] Exposed dielectric 42, composed of SiO.sub.2, is selectively
and anisotropically etched at a relatively high etch rate, and the
etch rate is moderated by the pulsing of fluorocarbon gas into the
etch recipe.
[0065] Etching is carried out by formation of a self-aligned
contact hole through mask 40 and dielectric 42 that uses a first
etch gas, namely the hydrofluorocarbon gas CHF.sub.3 or the like as
a constant etch gas source. Etching is carried out further with the
pulsing of an etch selectivity fluorocarbon gas that is
intermittently blended with the hydrofluorocarbon gas during the
etch process. Pulsing of the fluorocarbon gas is carried out in a
range from about 0 sccm to about 25 sccm, preferably from about 15
to about 23 sccm, and most preferably from about 18 to about 22
sccm.
[0066] The time period of an overall gas pulsing cycle is in a
range from about 10 to about 60 seconds, preferably from about 15
to about 30 seconds. The cycle of the fluorocarbon gas pulse has a
period in a range from about 1 second to about 30 seconds,
preferably from about 10 seconds to about 20 seconds, and most
preferably about 15 seconds.
Determination of a Specific Etch Recipe
[0067] In another embodiment of the present invention, a method is
provided for etching an oxide disposed upon a nitride with etch
selectivity to the nitride layer. This inventive method uses the
discovery that a fluorocarbon gas is an etch selectivity enhancer
under the inventive conditions, and illustrates a method of finding
a preferred etchant gas recipe based upon the inventive
discovery.
[0068] The method of the second embodiment includes providing an
oxide disposed upon a nitride layer that is exposed to a first
etching process using CHF.sub.3 with an etch selectivity
fluorocarbon gas under the inventive conditions in which the etch
selectivity fluorocarbon gas makes the first etching process
selective to the nitride layer as set forth above. The inventive
method continues by incrementally increasing the etch selectivity
fluorocarbon gas and initiating a second etching process for the
oxide using the CHF.sub.3 and the increased etch selectivity
fluorocarbon gas under conditions which the increased etch
selectivity fluorocarbon gas makes the second etching process more
selective to the nitride layer than the first etching process. The
inventive method may optionally continue by repeating incrementally
increasing the etch selectivity fluorocarbon gas and etching the
oxide with the CHF.sub.3 and the incrementally increased amount of
etch selectivity fluorocarbon gas under the inventive conditions.
Accordingly, an increased amount of etch selectivity fluorocarbon
gas makes the etch more selective to the nitride layer than the
second etching process.
[0069] As the degree of etch selectivity is noted in this inventive
method, one can then choose a preferred amount of etch selectivity
fluorocarbon gas in relation to the CHF.sub.3 to achieve a chosen
etch selectivity-to-nitride based upon the first etching process,
the second etching process, and the optional etching(s) thereafter.
Accordingly, etching may then be carried out on a single
semiconductive substrate or upon a batch of semiconductive
substrates by etching the oxide to stop on the nitride layer under
the chosen etch selectivity-to-nitride conditions.
[0070] The etch selectivity fluorocarbon gas may include those
gases set forth above and in the ratios among themselves and the
proportions to the CHF.sub.3 as set forth above. Preferably, the
present invention will be carried out under etching conditions
where the roof surface temperature is below about 200.degree. C.,
preferably below about 160.degree. C., more preferably below about
150.degree. C., and most preferably about 140.degree. C.
[0071] In a series of tests, a method was provided for etching a
dielectric as depicted in FIG. 2A in order to determine a preferred
mixture for a preferred etch recipe that is selective to a nitride
etch stop layer. The dielectric 42 is patterned with a mask 40.
Dielectric 42 is disposed upon semiconductive material 50 which may
be protected by gate oxide layer 48. Upon gate oxide layer 48 gate
stacks 46 are disposed, each having spacers 44 made of a material
preferably different in composition from dielectric 42. Besides
spacer 44 being a silicon nitride, it may also be made from
refractory metal nitrides such as cobalt nitride, titanium nitride,
tungsten nitride, hafnium nitride, and the like.
[0072] In the first test, a self-aligned contact anisotropic etch
is carried out as depicted in FIG. 3. In this example, spacer 44 is
a nitride layer or a silicon dioxide layer that is doped
differently from dielectric 42 and etching is carried out with
CHF.sub.3 under the inventive conditions. A contact 52 is formed in
dielectric 42 and the first etching process using CHF.sub.3 cuts
into gate stack 46 by not being significantly selective to spacer
44 as it is exposed during the formation of contact 52. FIG. 3
illustrates damage to gate stack 46 due to the lack of selectivity
to spacer 44 over dielectric 42 which is an oxide such as
SiO.sub.2, BPSG, TEOS, and PSG. Additionally, spacer 44 may be
undoped oxide such as TEOS, or it may be an oxide with different
doping from dielectric 42 including where dielectric 42 is undoped
oxide.
[0073] In the test, semiconductive substrate 100 is etched using
CHF.sub.3 and CF.sub.4 in a ratio of about 45 parts CHF.sub.3 and 5
parts CF.sub.4. Under equivalent etch conditions as those depicted
in FIG. 3, FIG. 4 illustrates the formation of contact 52 down to
the level of semiconductive material 50 where spacer 44 within
contact 52 has been etched to a degree that is less than that
depicted in FIG. 3, to form an eroded spacer 54. Where the etch
conditions were similar to the first test, it is concluded that the
presence of CF.sub.4 has made the etch recipe more selective to the
nitride of spacer 44 in order to form contact 52 and eroded spacer
54 to the degree where eroded spacer 54 may or may not be entirely
laterally breached to expose electrically conductive elements such
as polysilicon lines 58 within gate stack 46. Where it is
preferable not to form eroded spacer 54, even where eroded spacer
54 is not entirely breached, it is instructive to conduct another
example by increasing the amount of CF.sub.4 gas in the etch
recipe.
[0074] FIG. 5 illustrates a third test under the inventive
conditions in which CF.sub.4 has been increased to 15 parts in
order to significantly increase selectivity to nitride. In other
words, selectivity to spacer 44 during the formation of contact 52
has been enhanced to the point that spacer 44 disposed within
contact 52 is substantially intact after the self-aligned
anisotropic contact etch. Operating conditions for this example
include CHF.sub.3 in about 44 parts and CF.sub.4 in about 13 to
about 17 parts.
[0075] FIGS. 3-5 illustrate the enhanced selectivity to nitride of
spacer 44 as a function of incrementally increasing the CF.sub.4
gas. As thus illustrated in FIGS. 3-5, the degree of etch
selectivity to spacer 44 is noted and the etch recipe may be
adjusted until a preferred selectivity to spacer 44 has been
determined.
[0076] Preferred processing conditions for the formation of contact
52 depicted in FIGS. 3-5, include power at outer antenna 32 in a
range from about 700 watts to about 1,050 watts, preferably from
about 775 watts to about 975 watts, and most preferably about 875
watts. Inner antenna 30 is operated under conditions in a range
from about 100 watts to about 150 watts, preferably from about 115
watts to about 135 watts. Most preferably, when outer antenna 32 is
operated at 875 watts, inner antenna 30 is operated at 125 watts.
Bottom power applied to semiconductive substrate support 16 is
operated in a range from about 500 watts to about 700 watts,
preferably from about 550 watts to about 650 watts, and most
preferably about 600 watts.
[0077] The temperature of semiconductive substrate support 16 is
operated in a range from about -30.degree. C. to about +80.degree.
C., preferably from about -20.degree. C. to about +70.degree. C.,
and most preferably about +40.degree. C.
Performing Two Etches Within a Low Temperature Range
[0078] In another embodiment of the present invention, a
combination of a mask-aligned, high-aspect ratio contact
anisotropic etch and a self-aligned contact etch is carried out by
using the inventive etch recipe and conditions. The inventive
method proceeds by etching a contact under mask-aligned contact
etch conditions that include a roof surface temperature in the etch
chamber at or below about 200.degree. C. Without changing the etch
temperature range of the etch chamber, a second, high-aspect ratio
etching of a self-aligned contact is carried out with CHF.sub.3 and
an etch selectivity fluorocarbon gas. The self-aligned contact etch
is carried out at a roof surface temperature at or below about
190.degree. C. in any of the above-mentioned preferred temperature
ranges. This method of etching mask-aligned contacts and
self-aligned contacts allows for the etch selectivity fluorocarbon
gas to make the etch recipe more selective to the nitride layer.
The above-mentioned ratios of etch selectivity fluorocarbon gases
and proportions to the CHF.sub.3 gases are also preferable for this
embodiment. In particular, the etch selectivity fluorocarbon gas is
preferably CF.sub.4 and is supplied in a range from about 1 to
about 15 parts and a hydrofluorocarbon gas, preferably CHF.sub.3 is
supplied in about 44 to about 45 parts.
[0079] In the present embodiment, the etch selectivity fluorocarbon
gas preferably includes CF.sub.4 as the only component, or as a
major component in a range from about 1/4 to about 9/1 of the etch
selectivity fluorocarbon gas.
High-Aspect Ratio Etching
[0080] In another embodiment of the present invention, an etching
method is provided for forming a high-aspect ratio contact in a
semiconductive substrate. The method includes providing an IPS
system 10 such as the Applied Materials IPS etch chamber. IPS
system 10 has grounded silicon roof 14, semiconductive substrate
supports 16, silicon ring 18, and other equipment as depicted in
FIG. 1. Silicon roof 14 is operated at a roof surface temperature
range from about 135.degree. C. to about 190.degree. C.
Semiconductive substrate support 16 has a temperature range from
about -30.degree. C. to about +80.degree. C., preferably from about
-20.degree. C. to about +70.degree. C., and most preferably about
+40.degree. C. Silicon ring 18 is operated in a temperature range
from about 180.degree. C. to about 300.degree. C., preferably from
about 190.degree. C. to about 250.degree. C., and most preferably
about 200.degree. C.
[0081] The inventive method continues as illustrated in FIG. 6 by
providing semiconductive substrate 200, having bulk dielectric 242
disposed upon an optional etch stop layer 248. Additionally, an
etch stop layer may include semiconductive material 250, or any
material that is compositionally different from bulk dielectric
242. Preferably bulk dielectric 242 is BPSG and etch stop layer 248
is a gate oxide, or generally silicon nitride, or Si.sub.3N.sub.4,
or monocrystalline silicon with etch stop layer 248 optionally
absent. Mask 240 overlies the bulk dielectric 242. The inventive
method continues by anisotropiocally etching contact 252 as
depicted in FIG. 6 with a hydrofluorocarbon such as CHF.sub.3 etch
gas and an etch selectivity fluorocarbon gas etch recipe, wherein
the CHF.sub.3 is flowed in a range from about 30 to about 50 sccm
and the etch selectivity fluorocarbon gas is flowed in a range from
about 1 to about 15 sccm.
[0082] Under the foregoing conditions, selectivity to etch stop
layer 248 is increased as the proportion of fluorocarbon gas
increases. Bulk dielectric 242 can be composed of BPSG, TEOS, and
the like, and can also be a thermal silicon dioxide formed from
either monocrystalline silicon or polycrystalline silicon. Etch
stop layer 248 can be silicon nitride and may also be a thermally
converted refractory metal nitride such as cobalt nitride, titanium
nitride, tungsten nitride, hafnium nitride, and the like.
Etching with an Etch Selectivity Fluorocarbon Gas in an Etch
System
[0083] In another embodiment in the present invention, a system of
etching a semiconductive substrate is provided. The system includes
an etcher such as an Applied Materials IPS chamber. IPS system 10
is operated under the temperature control conditions set forth
herein for roof 14, semiconductive substrate support 16, and
silicon ring 18. Other conditions include the above-mentioned flow
rates, and pressures. The inventive system includes
anisotropiocally etching the material of dielectric 42 in
semiconductive substrate with a first etch recipe comprising
CHF.sub.3 and CF.sub.4 in a first CF.sub.4 proportion. Etching
continues by etching the material of bulk dielectric 42 with a
second etch recipe comprising CHF.sub.3 in the same relative amount
and CF.sub.4 in a second, increased or decreased proportion,
wherein etch selectivity is directly proportional to its increased
amount or decreased amount of CF.sub.4.
[0084] The present invention may be embodied in other specific
forms without departing from its spirit or essential
characteristics. The described embodiments are to be considered in
all respects only as illustrative and not restrictive. The scope of
the invention is, therefore, indicated by the appended claims
rather than by the foregoing description. All changes which come
within the meaning and range of equivalency of the claims are to be
embraced within their scope.
* * * * *