Patent | Date |
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Use of a plasma source to form a layer during the formation of a semiconductor device Grant 7,709,343 - Figura , et al. May 4, 2 | 2010-05-04 |
Method of forming high aspect ratio apertures Grant 7,608,196 - Donohoe , et al. October 27, 2 | 2009-10-27 |
Plasma etching system and method Grant 7,507,672 - Abatchev , et al. March 24, 2 | 2009-03-24 |
Use Of A Plasma Source To Form A Layer During The Formation Of A Semiconductor Device App 20090017634 - Figura; Thomas A. ;   et al. | 2009-01-15 |
Use of a plasma source to form a layer during the formation of a semiconductor device Grant 7,429,535 - Figura , et al. September 30, 2 | 2008-09-30 |
Semiconductor structures Grant 7,335,964 - Juengling , et al. February 26, 2 | 2008-02-26 |
Use of pulsed grounding source in a plasma reactor Grant 7,297,637 - Hedberg , et al. November 20, 2 | 2007-11-20 |
Use of a plasma source to form a layer during the formation of a semiconductor device Grant 7,294,578 - Figura , et al. November 13, 2 | 2007-11-13 |
Methods for use of pulsed voltage in a plasma reactor Grant 7,253,117 - Donohoe August 7, 2 | 2007-08-07 |
Use of a plasma source to form a layer during the formation of a semiconductor device App 20070123048 - Figura; Thomas A. ;   et al. | 2007-05-31 |
Method of forming high aspect ratio apertures App 20070084826 - Donohoe; Kevin G. ;   et al. | 2007-04-19 |
Etching Methods And Apparatus And Substrate Assemblies Produced Therewith App 20070077724 - Donohoe; Kevin G. ;   et al. | 2007-04-05 |
Plasma etching methods Grant 7,183,220 - Blalock , et al. February 27, 2 | 2007-02-27 |
Method of forming high aspect ratio apertures Grant 7,163,641 - Donohoe , et al. January 16, 2 | 2007-01-16 |
Etching methods and apparatus and substrate assemblies produced therewith Grant 7,125,804 - Donohoe , et al. October 24, 2 | 2006-10-24 |
Liner for use in processing chamber Grant 7,114,532 - Donohoe October 3, 2 | 2006-10-03 |
Plasma etching system and method Grant 7,112,533 - Abatchev , et al. September 26, 2 | 2006-09-26 |
Method of providing a structure using self-aligned features Grant 7,109,112 - Chopra , et al. September 19, 2 | 2006-09-19 |
Use of pulsed grounding source in a plasma reactor App 20060194437 - Hedberg; Chuck E. ;   et al. | 2006-08-31 |
Etchant and method of use App 20060186087 - Donohoe; Kevin G. ;   et al. | 2006-08-24 |
Method Of Providing A Structure Using Self-aligned Features App 20060154483 - Chopra; Dinesh ;   et al. | 2006-07-13 |
Etchant and method of use Grant 7,074,724 - Donohoe , et al. July 11, 2 | 2006-07-11 |
Use of pulsed grounding source in a plasma reactor Grant 7,059,267 - Hedberg , et al. June 13, 2 | 2006-06-13 |
Aspect ratio controlled etch selectivity using time modulated DC bias voltage App 20060105577 - Donohoe; Kevin G. ;   et al. | 2006-05-18 |
Etching of high aspect ration structures Grant 7,033,954 - Donohoe April 25, 2 | 2006-04-25 |
Method for controlling the temperature of a gas distribution plate in a process reactor App 20060021969 - Donohoe; Kevin G. ;   et al. | 2006-02-02 |
Method for controlling the temperature of a gas distribution plate in a process reactor Grant 6,960,534 - Donohoe , et al. November 1, 2 | 2005-11-01 |
Plasma etching methods Grant 6,958,297 - Becker , et al. October 25, 2 | 2005-10-25 |
Liner for use in processing chamber App 20050230048 - Donohoe, Kevin G. | 2005-10-20 |
Methods of forming materials over uneven surface topologies, and methods of forming insulative materials over and between conductive lines App 20050206003 - Juengling, Werner ;   et al. | 2005-09-22 |
Plasma reactor Grant 6,946,053 - Donohoe September 20, 2 | 2005-09-20 |
Apparatus for improved low pressure inductively coupled high density plasma reactor Grant 6,939,813 - Blalock , et al. September 6, 2 | 2005-09-06 |
Method for etching a wafer in a plasma etch reactor App 20050173376 - Donohoe, Kevin G. | 2005-08-11 |
Etching of high aspect ratio structures Grant 6,921,725 - Donohoe July 26, 2 | 2005-07-26 |
Three-dimensional photonic band structures in solid materials Grant 6,909,113 - Geusic , et al. June 21, 2 | 2005-06-21 |
Methods of forming materials over uneven surface topologies, and methods of forming insulative materials over and between conductive lines Grant 6,890,858 - Juengling , et al. May 10, 2 | 2005-05-10 |
Etchant and method of use Grant 6,890,863 - Donohoe , et al. May 10, 2 | 2005-05-10 |
Etching of high aspect ration structures App 20050032388 - Donohoe, Kevin G. | 2005-02-10 |
Apparatus for improved low pressure inductively coupled high density plasma reactor App 20050022935 - Blalock, Guy T. ;   et al. | 2005-02-03 |
Liner for use in processing chamber App 20050011454 - Donohoe, Kevin G. | 2005-01-20 |
Etching methods and apparatus and substrate assemblies produced therewith App 20040262263 - Donohoe, Kevin G. ;   et al. | 2004-12-30 |
Apparatus for controlling the temperature of a gas distribution plate in a process reactor Grant 6,833,049 - Donohoe , et al. December 21, 2 | 2004-12-21 |
Etchant and method of use App 20040248413 - Donohoe, Kevin G. ;   et al. | 2004-12-09 |
Method of providing a structure using self-aligned features App 20040219738 - Chopra, Dinesh ;   et al. | 2004-11-04 |
Plasma etching methods Grant 6,812,154 - Becker , et al. November 2, 2 | 2004-11-02 |
Etching methods and apparatus and substrate assemblies produced therewith Grant 6,784,111 - Donohoe , et al. August 31, 2 | 2004-08-31 |
Gas pulsing for etch profile control Grant 6,784,108 - Donohoe , et al. August 31, 2 | 2004-08-31 |
Aspect ratio controlled etch selectivity using time modulated DC bias voltage App 20040161941 - Donohoe, Kevin G. ;   et al. | 2004-08-19 |
Method of providing a structure using self-aligned features Grant 6,759,330 - Chopra , et al. July 6, 2 | 2004-07-06 |
Liner for use in processing chamber Grant 6,739,360 - Donohoe May 25, 2 | 2004-05-25 |
Method and apparatus for preventing plasma formation Grant 6,719,873 - Donohoe April 13, 2 | 2004-04-13 |
Aspect ratio controlled etch selectivity using time modulated DC bias voltage Grant 6,716,758 - Donohoe , et al. April 6, 2 | 2004-04-06 |
Use of a plasma source to form a layer during the formation of a semiconductor device Grant 6,716,769 - Figura , et al. April 6, 2 | 2004-04-06 |
Apparatus for reducing isolation stress in integrated circuits Grant 6,703,690 - Thakur , et al. March 9, 2 | 2004-03-09 |
Apparatus for controlling the temperature of a gas distribution plate in a process reactor App 20040035531 - Donohoe, Kevin G. ;   et al. | 2004-02-26 |
Method for controlling the temperature of a gas distribution plate in a process reactor App 20040038551 - Donohoe, Kevin G. ;   et al. | 2004-02-26 |
Plasma etching methods Grant 6,680,255 - Donohoe , et al. January 20, 2 | 2004-01-20 |
Plasma etching methods Grant 6,660,644 - Donohoe , et al. December 9, 2 | 2003-12-09 |
Methods for use of pulsed voltage in a plasma reactor App 20030211754 - Donohoe, Kevin G. | 2003-11-13 |
Plasma etching methods App 20030207581 - Becker, David S. ;   et al. | 2003-11-06 |
Etching methods and apparatus and substrate assemblies produced therewith Grant 6,635,335 - Donohoe , et al. October 21, 2 | 2003-10-21 |
Method of forming high aspect ratio apertures App 20030192858 - Donohoe, Kevin G. ;   et al. | 2003-10-16 |
Self-aligned PECVD etch mask Grant 6,630,410 - Trapp , et al. October 7, 2 | 2003-10-07 |
Use of pulsed voltage in a plasma reactor App 20030168010 - Donohoe, Kevin G. | 2003-09-11 |
Method for controlling the temperature of a gas distribution plate in a process reactor Grant 6,617,256 - Donohoe , et al. September 9, 2 | 2003-09-09 |
Apparatus for controlling the temperature of a gas distribution plate in a process reactor Grant 6,613,189 - Donohoe , et al. September 2, 2 | 2003-09-02 |
Method of forming high aspect ratio apertures Grant 6,610,212 - Donohoe , et al. August 26, 2 | 2003-08-26 |
Method for improving uniformity in batch processing of semiconductor wafers Grant 6,607,987 - Donohoe August 19, 2 | 2003-08-19 |
Method and apparatus for reducing isolation stress in integrated circuits Grant 6,602,798 - Thakur , et al. August 5, 2 | 2003-08-05 |
Method of forming three-dimensional photonic band structures in solid materials Grant 6,582,512 - Geusic , et al. June 24, 2 | 2003-06-24 |
Method of forming three-dimensional photonic band structures in solid materials App 20030111665 - Geusic, Joseph E. ;   et al. | 2003-06-19 |
Method of providing a structure using self-aligned features App 20030096498 - Chopra, Dinesh ;   et al. | 2003-05-22 |
Method of modifying an RF circuit of a plasma chamber to increase chamber life and process capabilities App 20030089681 - Blalock, Guy ;   et al. | 2003-05-15 |
Plasma reactor App 20030062127 - Donohoe, Kevin G. | 2003-04-03 |
Apparatus for improved low pressure inductively coupled high density plasma reactor App 20030041805 - Blalock, Guy T. ;   et al. | 2003-03-06 |
Methods of forming materials over uneven surface topologies, and methods of forming insulative materials over and between conductive lines App 20030040186 - Juengling, Werner ;   et al. | 2003-02-27 |
Plasma etching methods App 20030036283 - Becker, David S. ;   et al. | 2003-02-20 |
Plasma etching system and method App 20030024643 - Abatchev, Mirzafer K. ;   et al. | 2003-02-06 |
Method of forming a non-conformal layer over and exposing a trench Grant 6,511,912 - Chopra , et al. January 28, 2 | 2003-01-28 |
Method of modifying an RF circuit of a plasma chamber to increase chamber life and process capabilities Grant 6,503,410 - Blalock , et al. January 7, 2 | 2003-01-07 |
Etching of high aspect ratio structures App 20030003755 - Donohoe, Kevin G. | 2003-01-02 |
Method and apparatus for controlling the temperature of a gas distribution plate in a process reactor App 20020189759 - Donohoe, Kevin G. ;   et al. | 2002-12-19 |
Use of pulsed grounding source in a plasma reactor App 20020189544 - Hedberg, Chuck E. ;   et al. | 2002-12-19 |
Use of pulsed grounding source in a plasma reactor App 20020189761 - Hedberg, Chuck E. ;   et al. | 2002-12-19 |
Self-aligned PECVD etch mask App 20020192976 - Trapp, Shane J. ;   et al. | 2002-12-19 |
Plasma etching methods Grant 6,492,279 - Becker , et al. December 10, 2 | 2002-12-10 |
Method of forming three-dimensional photonic band structures in solid materials App 20020175330 - Geusic, Joseph E. ;   et al. | 2002-11-28 |
Method and apparatus for reducing isolation stress in integrated circuits App 20020163056 - Thakur, Randhir P.S. ;   et al. | 2002-11-07 |
Plasma etching method using low ionization potential gas Grant 6,475,920 - Coburn , et al. November 5, 2 | 2002-11-05 |
Method and apparatus for controlling the temperature of a gas distribution plate in a process reactor App 20020155644 - Donohoe, Kevin G. ;   et al. | 2002-10-24 |
Self-aligned PECVD etch mask Grant 6,451,705 - Trapp , et al. September 17, 2 | 2002-09-17 |
Plasma reactor App 20020121343 - Donohoe, Kevin G. | 2002-09-05 |
Liner for use in processing chamber App 20020096227 - Donohoe, Kevin G. | 2002-07-25 |
Method of forming high aspect ratio apertures App 20020084256 - Donohoe, Kevin G. ;   et al. | 2002-07-04 |
Method and apparatus for reducing isolation stress in integrated circuits Grant 6,414,376 - Thakur , et al. July 2, 2 | 2002-07-02 |
Plasma etching methods App 20020031878 - Donohoe, Kevin G. ;   et al. | 2002-03-14 |
Reduced power DRAM device and method Grant 6,356,500 - Cloud , et al. March 12, 2 | 2002-03-12 |
Method and apparatus for controlling the temperature of a gas distribution plate in a process reactor App 20020026983 - Donohoe, Kevin G. ;   et al. | 2002-03-07 |
Method and apparatus for controlling the temperature of a gas distribution plate in a process reactor App 20020014471 - Donohoe, Kevin G. ;   et al. | 2002-02-07 |
Method and apparatus for improving etch uniformity in remote source plasma reactors with powered wafer chucks App 20020000298 - Donohoe, Kevin G. | 2002-01-03 |
Etching methods and apparatus and substrate assemblies produced therewith App 20020000422 - Donohoe, Kevin G. ;   et al. | 2002-01-03 |
Plasma Etching Methods App 20010046779 - DONOHOE, KEVIN G. ;   et al. | 2001-11-29 |
Apparatus and method for improving uniformity in batch processing of semiconductor wafers Grant 6,315,859 - Donohoe November 13, 2 | 2001-11-13 |
Beat frequency modulation for plasma generation Grant 6,312,556 - Donohoe , et al. November 6, 2 | 2001-11-06 |
Beat frequency modulation for plasma generation Grant 6,309,978 - Donohoe , et al. October 30, 2 | 2001-10-30 |
Methods of forming materials over uneven surface topologies, and methods of forming insulative materials over and between conductive lines App 20010027022 - Juengling, Werner ;   et al. | 2001-10-04 |
Apparatus and method for improving uniformity in batch processing of semiconductor wafers App 20010022215 - Donohoe, Kevin G. | 2001-09-20 |
Plasma reactor Grant 6,290,806 - Donohoe September 18, 2 | 2001-09-18 |
Plasma etching methods Grant 6,277,759 - Blalock , et al. August 21, 2 | 2001-08-21 |
Plasma etching method using low ionization potential gas App 20010012694 - Coburn, John W. ;   et al. | 2001-08-09 |
Liner for use in processing chamber App 20010002601 - Donohoe, Kevin G. | 2001-06-07 |
Methods Of Forming Materials Over Uneven Surface Topologies, And Methods Of Forming Insulative Materials Over And Between Conductive Lines App 20010001731 - JUENGLING, WERNER ;   et al. | 2001-05-24 |
Method and apparatus for controlling electrostatic coupling to plasmas Grant 6,204,604 - Donohoe March 20, 2 | 2001-03-20 |
Plasma producing tools, dual-source plasma etchers, dual-source plasma etching methods, and method of forming planar coil dual-source plasma etchers Grant 6,184,146 - Donohoe , et al. February 6, 2 | 2001-02-06 |
Plasma processing tools dual-source plasma etchers, dual-source plasma etching methods, and methods of forming planar coil dual-source plasma etchers Grant 6,136,720 - Donohoe , et al. October 24, 2 | 2000-10-24 |
Method and apparatus for controlling the temperature of a gas distribution plate in a process reactor Grant 6,132,552 - Donohoe , et al. October 17, 2 | 2000-10-17 |
Beat frequency modulation for plasma generation Grant 6,126,778 - Donohoe , et al. October 3, 2 | 2000-10-03 |
Plasma etching methods Grant 6,093,655 - Donohoe , et al. July 25, 2 | 2000-07-25 |
Method of patterning substrates Grant 6,087,270 - Reinberg , et al. July 11, 2 | 2000-07-11 |
Dual-source plasma etchers, dual-source plasma etching methods, and methods of forming planar coil dual-source plasma etchers Grant 6,074,953 - Donohoe , et al. June 13, 2 | 2000-06-13 |
Apparatus and method for improving uniformity in batch processing of semiconductor wafers Grant 6,030,902 - Donohoe February 29, 2 | 2000-02-29 |
Semiconductor processing methods of forming substrate features, including contact openings Grant 6,025,276 - Donohoe , et al. February 15, 2 | 2000-02-15 |
Method and apparatus for controlling electrostatic coupling to plasmas Grant 5,998,931 - Donohoe December 7, 1 | 1999-12-07 |
Processing methods of forming contact openings and integrated circuitry Grant 5,976,985 - Donohoe , et al. November 2, 1 | 1999-11-02 |
Method and apparatus for improving etch uniformity in remote source plasma reactors with powered wafer chucks Grant 5,904,799 - Donohoe May 18, 1 | 1999-05-18 |
Method for forming a hole in a semiconductor device Grant 5,882,535 - Stocks , et al. March 16, 1 | 1999-03-16 |
Method and apparatus for improving etch uniformity in remote source plasma reactors with powered wafer chucks Grant 5,662,770 - Donohoe September 2, 1 | 1997-09-02 |
Selective etch process Grant 5,651,856 - Keller , et al. July 29, 1 | 1997-07-29 |
Use of a high density plasma source having an electrostatic shield for anisotropic polysilicon etching over topography Grant 5,449,433 - Donohoe September 12, 1 | 1995-09-12 |