U.S. patent application number 11/252572 was filed with the patent office on 2006-05-25 for structure of embedded active components and manufacturing method thereof.
Invention is credited to Shou-Lung Chen, Cheng-Ta Ko.
Application Number | 20060110853 11/252572 |
Document ID | / |
Family ID | 36461421 |
Filed Date | 2006-05-25 |
United States Patent
Application |
20060110853 |
Kind Code |
A1 |
Chen; Shou-Lung ; et
al. |
May 25, 2006 |
Structure of embedded active components and manufacturing method
thereof
Abstract
A structure of embedded active components and the manufacturing
method thereof are provided. The manufacturing steps involve
providing a molding plate, and setting several active components on
the molding plate as first. A dielectric layer covers the molding
plate to cap the active components. An electric circuit is formed
on the dielectric layer, in contact with the active components.
Finally, the structure with embedded active components is released
from the molding plate.
Inventors: |
Chen; Shou-Lung; (Hsinchu,
TW) ; Ko; Cheng-Ta; (Hsinchu, TW) |
Correspondence
Address: |
HARNESS, DICKEY & PIERCE, P.L.C.
P.O. BOX 8910
RESTON
VA
20195
US
|
Family ID: |
36461421 |
Appl. No.: |
11/252572 |
Filed: |
October 19, 2005 |
Current U.S.
Class: |
438/110 ;
257/E23.069; 257/E23.178; 438/126; 438/455 |
Current CPC
Class: |
H01L 2924/19041
20130101; H01L 2924/15788 20130101; H01L 2224/12105 20130101; H01L
23/5389 20130101; H01L 2224/97 20130101; H01L 2224/211 20130101;
H01L 2924/01006 20130101; H01L 2224/97 20130101; H01L 23/49816
20130101; H01L 24/19 20130101; H01L 24/97 20130101; H01L 2924/01033
20130101; H01L 2924/15311 20130101; H01L 2224/82 20130101; H01L
2924/00 20130101; H01L 2924/01029 20130101; H01L 2224/0401
20130101; H01L 2924/15788 20130101; H01L 2224/8203 20130101; H01L
2924/15311 20130101; H01L 2224/20 20130101; H01L 21/568 20130101;
H01L 24/96 20130101; H01L 2221/68359 20130101; H01L 2224/97
20130101; H01L 2224/04105 20130101; H01L 21/561 20130101; H01L
2924/19042 20130101; H01L 2924/19043 20130101; H01L 2924/18162
20130101; H01L 2924/14 20130101 |
Class at
Publication: |
438/110 ;
438/126; 438/455 |
International
Class: |
H01L 21/50 20060101
H01L021/50; H01L 21/30 20060101 H01L021/30 |
Foreign Application Data
Date |
Code |
Application Number |
Nov 19, 2004 |
TW |
93135743 |
Claims
1. A method of making a structure of embedded active components,
comprising the steps of: providing a molding plate; disposing with
alignment a plurality of active components on the molding plate;
covering a dielectric layer on the molding plate to cap the active
components; forming an electrical circuit on the dielectric layer
to be in electrical communications with the active components; and
releasing the dielectric layer embedded with the active components
from the molding plate.
2. The method of claim 1, wherein the dielectric layer is a polymer
layer.
3. The method of claim 2, wherein the polymer layer is selected
from the group consisting of Ajinomoto build-up film (ABF) and
resin coated copper foil (RCC).
4. The method of claim 2 further comprising the step of embedding
the active components into the polymer layer by embossing.
5. The method of claim 2, wherein the step of covering a dielectric
layer on the molding plate contains the steps of: covering a
polymer solution on the active components; and curing the polymer
solution.
6. The method of claim 5, wherein the step of covering a polymer
solution on the active components is implemented using a method
selected from spraying, spin-coating, and printing.
7. The method of claim 1, wherein the step of forming an electrical
circuit on the dielectric layer includes: forming a plurality of
conductive holes connecting to the active components on the
dielectric layer; and forming an electrical circuit passing through
the conductive holes.
8. The method of claim 7, wherein the conductive holes are formed
by a method selected from laser drilling, exposure and developing,
and etching.
9. The method of claim 7, wherein the step of forming an electrical
circuit passing through the conductive holes includes the steps of:
depositing a metal layer on the dielectric layer; and employing
photolithography to transfer a required pattern to the metal layer
to form the electrical circuit.
10. The method of claim 7 further comprising the step of desmearing
the conductive holes.
11. The method of claim 1, wherein the material of the molding
plate if Teflon.
12. The method of claim 1, wherein the molding plate contains a
mold-separating layer.
13. The method of claim 12, wherein the mold-separating layer is a
metal mold-separating layer.
14. The method of claim 1 further comprising the step of implanting
soldering balls at contact points of the electrical circuit.
15. A structure of embedded active components, comprising: a
dielectric layer; a plurality of active components embedded in the
dielectric layer; and an electrical circuit installed on the
dielectric layer and in electrical communications with the active
components.
16. The structure of embedded active components as in claim 13,
wherein the dielectric layer is a polymer layer.
17. The structure of embedded active components as in claim 13,
wherein the dielectric layer has a plurality of conductive holes
for the electrical circuit to connect to the active components.
18. The structure of embedded active components as in claim 13
further comprising a plurality of soldering balls installed at
contact points of the electrical circuit.
Description
PRIORITY STATEMENT
[0001] This Non-provisional application claims priority under 35
U.S.C. .sctn. 119(a) on Patent Application No(s). 93135743 filed in
Taiwan on Nov. 19, 2004, the entire contents of which are hereby
incorporated by reference.
BACKGROUND
[0002] 1. Field of Invention
[0003] The invention relates to a package structure and the
manufacturing method thereof. In particular, it relates to a
structure of embedded active components and the method of making
the same.
[0004] 2. Related Art
[0005] In order to create larger space and to enhance the functions
of the module within a limited substrate area, shrunk or embedded
passive components are often used to minimize the circuit layout
and to reduce the signal transmission distance. Thus, more space is
left for installing active components and enhancing the overall
performance. Therefore, substrates with passive components such as
embedded resistors, capacitors, and inductors are developed.
[0006] In order to more effectively minimize the packaging of the
components, methods of embedding active components (such as IC
chips) on a substrate have been developed. The substrate with an
embedded IC module as disclosed in the U.S. Pat. No. 5,497,033 has
a plurality of chips installed thereon. A molding plate is first
used to enclose the chips to be the embedded components. A molding
material then covers the chips using the conventional molding
method. The chips are thud embedded in the molding material after
curing. However, this method completes the whole process of
embedding components on the substrate. It is likely to damage other
components not to be embedded. The finished substrate is not
flexible and has limited applications.
[0007] In the U.S. Pat. No. 6,027,958, a transferring manufacturing
method for the flexible IC components is teached. A semiconductor
substrate with silicon on insulator (SOI) structure is provided to
form the required IC thereon. An adhesive layer is used to attach
another flexible substrate on the IC. Finally, etching is employed
to remove the semiconductor substrate, thereby transferring the IC
onto the surface of the flexible substrate.
SUMMARY
[0008] In view of the foregoing, an objective of the invention is
to provide a structure of embedded active components and the method
of making the same. By forming an embedded structure with multiple
active components, the alignment problem in subsequent packaging
can be solved. Moreover, the active components are electrically
tested. Therefore, the invention can effectively increase the
product yield.
[0009] The disclosed method for making the structure of embedded
active components includes the steps of; providing a molding plate;
disposing with alignment a plurality of active components on the
molding plate; covering a dielectric layer on the molding plate to
cap the active components; making a circuit on the dielectric
layer, in contact with the active components; and releasing the
dielectric layer embedded with the active components from the
molding plate.
[0010] The dielectric layer may be a polymer layer. The step of
making a circuit on the dielectric layer can be performed by
forming a plurality of conductive holes connecting to the active
components on the dielectric layer and then forming the circuit
passing through the conductive hole.
[0011] The invention further discloses a structure of embedded
active components, which comprises a dielectric layer, a plurality
of active components, and a circuit. The active components are
embedded into the dielectric layer. The circuit is installed on the
dielectric layer and connected to the active components.
BRIEF DESCRIPTION OF THE DRAWINGS
[0012] The invention will become more fully understood from the
detailed description given hereinbelow illustration only, and thus
are not limitative of the present invention, and wherein:
[0013] FIG. 1 is a schematic view of the disclosed method;
[0014] FIGS. 2A to 2F are schematic cross-sectional views of the
manufacturing process according to an embodiment of the invention;
and
[0015] FIG. 3 is a schematic cross-sectional view of another
embodiment of the invention.
DETAILED DESCRIPTION
[0016] The steps of the disclosed method are shown in FIG. 1.
First, a molding plate is provided (step 110). Several active
components are disposed with alignment on the molding plate (step
120). A dielectric layer is deposited on the molding plate (step
130) to cover the active components. A circuit is made on the
dielectric layer (step 140), in contact with the active components.
Finally, the molding plate is removed (step 150), releasing the
dielectric layer with embedded active components from the molding
plate. One then obtains a structure of embedded active
components.
[0017] When the dielectric layer is a polymer layer, it can be a
preprocessed or existing polymer layer, such as the Ajinomoto
build-up film (ABF) or the resin coated copper foil (RCC). The
above process also includes the step of embossing to embed active
components into the polymer layer or the step of coating a polymer
solution followed by curing to form the dielectric layer. The
latter includes the steps of: covering a polymer solution on the
active components by spraying, spin-coating, or printing; and
curing the polymer solution to form a polymer layer.
[0018] Step 140 in FIG. 1 makes a circuit on the insulator. Several
conductive holes connecting to the active components are first
formed on the dielectric layer, followed by forming the circuit
passing through the conductive holes.
[0019] The process in an embodiment of the invention is further
described in detail with reference to FIGS. 2A to 2F.
[0020] As shown in FIG. 2A, a metal mold-departing layer 210 is
deposited on a molding plate 200. The molding material can be
Teflon that can be readily removed from the molding plate. The
mold-departing layer can be made of any other material with a
similar property.
[0021] As shown in FIG. 2B, the active components 220 are disposed
with alignment on the molding plate 200.
[0022] As shown in FIG. 2C, a polymer layer 300 is coated on the
molding plate 200 as a dielectric layer to cover the active
components. The polymer layer is cured according to the properties
of the selected polymer.
[0023] As shown in FIG. 2D, several conductive holes 310 connecting
to the active components 220 are formed on the polymer layer 300.
The conductive holes 310 can be formed using laser, etching, or
direct exposure. The conductive holes 310 are further processed by
desmearing.
[0024] As shown in FIG. 2E, a metal layer 230 is deposited on the
polymer layer 300.
[0025] Photolithography is employed to transfer the required
pattern onto the metal layer 230, forming the circuit with the
conductive holes thereon.
[0026] Finally, as shown in FIG. 2F, the molding plate is released
from the polymer layer 300 embedded with active components 220 to
form a structure of embedded active components.
[0027] The structure of embedded active components formed using the
process of the disclosed embodiment is shown in FIG. 2F to contain
the polymer layer 300, the active components 220, and the circuit.
The active components 220 are embedded in the polymer layer 300.
The circuit is formed on the polymer layer 300 and connected to the
active components 220 via the conductive holes.
[0028] FIG. 3 shows a cross-sectional view of another embodiment of
the invention. The above-mentioned structure of embedded active
components can be implanted with soldering balls 240 at the contact
points of the circuit for subsequent electrical connections.
[0029] The disclosed structure of embedded active components can be
installed with an arbitrary substrate, such as the semiconductor
substrate, flexible substrate, or glass substrate. Since the active
components have fixed relative positions, only one alignment is
required to fix the positions of all the active components. This
can greatly lower the difficulty in subsequent processes and
increase the product yield.
[0030] Certain variations would be apparent to those skilled in the
art, which variations are considered within the spirit and scope of
the claimed invention.
* * * * *