Ko; Cheng-Ta

Patent Applications and Registrations

Patent applications and USPTO patent grants for Ko; Cheng-Ta.The latest application filed is for "light emitting diode package structure and manufacturing method thereof and manufacturing method of display device".

Company Profile

28.34.53

Ko; Cheng-Ta - Taoyuan TW
Ko; Cheng-Ta - Taipei City TW
Ko; Cheng-Ta - Taipei TW
Ko; Cheng-Ta - Hsinchu N/A TW
KO; CHENG-TA - HSINCHU CITY TW
Ko; Cheng-Ta - Chu-Tung TW

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Package structure and manufacturing method thereof Grant 11,445,617 - Yang , et al. September 13, 2	2022-09-13
Light Emitting Diode Package Structure And Manufacturing Method Thereof And Manufacturing Method Of Display Device App 20220271208 - Li; Jeng-Ting ; et al.	2022-08-25
Electronic device bonding structure and fabrication method thereof Grant 11,424,216 - Hsu , et al. August 23, 2	2022-08-23
Circuit Board Structure And Manufacturing Method Thereof App 20220256717 - Lau; John Hon-Shing ; et al.	2022-08-11
Package structure and manufacturing method thereof Grant 11,410,933 - Lau , et al. August 9, 2	2022-08-09
Chip package structure Grant 11,410,971 - Tseng , et al. August 9, 2	2022-08-09
Package structure with structure reinforcing element and manufacturing method thereof Grant 11,410,940 - Lin , et al. August 9, 2	2022-08-09
Package Structure And Manufacturing Method Thereof App 20220246810 - Tseng; Tzyy-Jang ; et al.	2022-08-04
Chip Package Structure And Manufacturing Method Thereof App 20220208631 - Lin; Pu-Ju ; et al.	2022-06-30
Chip Packaging Structure And Manufacturing Method Thereof App 20220208630 - Yang; Kai-Ming ; et al.	2022-06-30
Mask structure and manufacturing method thereof Grant 11,366,381 - Lin , et al. June 21, 2	2022-06-21
Chip package structure and manufacturing method thereof Grant 11,362,057 - Lin , et al. June 14, 2	2022-06-14
Vapor Chamber Device And Manufacturing Method Thereof App 20220146207 - LIN; Pu-Ju ; et al.	2022-05-12
Circuit Substrate Structure And Manufacturing Method Thereof App 20220130781 - Tseng; Tzyy-Jang ; et al.	2022-04-28
Package Structure And Manufacturing Method Thereof App 20220108953 - Lau; John Hon-Shing ; et al.	2022-04-07
Chip Package And Method Of Manufacturing The Same App 20220068742 - WU; Cheng-Hui ; et al.	2022-03-03
Circuit Board Structure And Manufacturing Method Thereof App 20220069489 - Lau; John Hon-Shing ; et al.	2022-03-03
Electronic Device Bonding Structure And Fabrication Method Thereof App 20220068872 - Hsu; Chia-Fu ; et al.	2022-03-03
Circuit Board Structure And Manufacturing Method Thereof App 20220071010 - TSENG; Tzyy-Jang ; et al.	2022-03-03
Chip Package Structure App 20220059498 - Tseng; Tzyy-Jang ; et al.	2022-02-24
Chip Package Structure And Manufacturing Method Thereof App 20210296291 - Lin; Pu-Ju ; et al.	2021-09-23
Vapor Chamber Structure And Manufacturing Method Thereof App 20210251107 - Tain; Ra-Min ; et al.	2021-08-12
Vapor Chamber Structure And Manufacturing Method Thereof App 20210247147 - Tain; Ra-Min ; et al.	2021-08-12
Manufacturing Method Of Package Structure App 20210195761 - YANG; Kai-Ming ; et al.	2021-06-24
Package Structure With Structure Reinforcing Element And Manufacturing Method Thereof App 20210159191 - LIN; Pu-Ju ; et al.	2021-05-27
Manufacturing Method Of Carrier Structure App 20210136931 - Tseng; Tzyy-Jang ; et al.	2021-05-06
Chip Package Structure And Manufacturing Method Thereof App 20210118839 - Lin; Pu-Ju ; et al.	2021-04-22
Package structure with structure reinforcing element and manufacturing method thereof Grant 10,957,658 - Lin , et al. March 23, 2	2021-03-23
Package structure and method of manufacturing the same Grant 10,950,535 - Wang , et al. March 16, 2	2021-03-16
Carrier structure and manufacturing method thereof Grant 10,925,172 - Tseng , et al. February 16, 2	2021-02-16
Circuit board, package structure and method of manufacturing the same Grant 10,897,823 - Tseng , et al. January 19, 2	2021-01-19
Manufacturing method of light emitting device package structure with circuit redistribution structure Grant 10,854,803 - Wang , et al. December 1, 2	2020-12-01
Touch-sensing display panel and method of manufacturing the same Grant 10,802,637 - Wang , et al. October 13, 2	2020-10-13
Package structure and bonding method thereof Grant 10,756,050 - Tseng , et al. A	2020-08-25
Package Structure With Structure Reinforcing Element And Manufacturing Method Thereof App 20200266155 - LIN; Pu-Ju ; et al.	2020-08-20
Manufacturing Method Of Light Emitting Device Package Structure With Circuit Redistribution Structure App 20200235272 - WANG; Pei-Wei ; et al.	2020-07-23
Package structure with structure reinforcing element and manufacturing method thereof Grant 10,685,922 - Lin , et al.	2020-06-16
Package Structure And Method Of Manufacturing The Same App 20200176369 - WANG; Chun-Min ; et al.	2020-06-04
Package substrate structure and bonding method thereof Grant 10,658,282 - Ko , et al.	2020-05-19
Light emitting device package structure with circuit redistribution structure and manufacturing method thereof Grant 10,651,358 - Wang , et al.	2020-05-12
Light Emitting Device Package Structure And Manufacturing Method Thereof App 20200118989 - WANG; Pei-Wei ; et al.	2020-04-16
Stacked structure and method for manufacturing the same Grant 10,588,214 - Tseng , et al.	2020-03-10
Package Structure And Manufacturing Method Thereof App 20200068721 - YANG; Kai-Ming ; et al.	2020-02-27
Package Substrate Structure And Bonding Method Thereof App 20200043839 - Ko; Cheng-Ta ; et al.	2020-02-06
Package Structure And Bonding Method Thereof App 20200043890 - Tseng; Tzyy-Jang ; et al.	2020-02-06
Light Emitting Device Package Structure And Manufacturing Method Thereof App 20200006610 - WANG; Pei-Wei ; et al.	2020-01-02
Stacked Structure And Method For Manufacturing The Same App 20190373713 - TSENG; Tzyy-Jang ; et al.	2019-12-05
Miniaturized particulate matter detector and manufacturing method of a filter Grant 10,458,893 - Chiang , et al. Oc	2019-10-29
Circuit Board, Package Structure And Method Of Manufacturing The Same App 20190306987 - Tseng; Tzyy-Jang ; et al.	2019-10-03
Mask Structure And Manufacturing Method Thereof App 20190250502 - Lin; Pu-Ju ; et al.	2019-08-15
Package Structure And Manufacturing Method Thereof App 20190239362 - YANG; Kai-Ming ; et al.	2019-08-01
Manufacturing method of circuit substrate and mask structure and manufacturing method thereof Grant 10,324,370 - Lin , et al.	2019-06-18
Package Structure And Manufacturing Method Thereof App 20190139907 - LIN; Pu-Ju ; et al.	2019-05-09
Miniaturize particulate matter detector and manufacturing method of a filter Grant 10,121,673 - Chiang , et al. November 6, 2	2018-11-06
Method for manufacturing circuit redistribution structure Grant 10,083,901 - Chen , et al. September 25, 2	2018-09-25
Method For Manufacturing Circuit Redistribution Structure App 20180122733 - CHEN; Yu-Hua ; et al.	2018-05-03
Bonding structure and method of fabricating the same Grant 9,931,813 - Chen , et al. April 3, 2	2018-04-03
Manufacturing Method Of Circuit Substrate And Mask Structure And Manufacturing Method Thereof App 20180070452 - Lin; Pu-Ju ; et al.	2018-03-08
Circuit redistribution structure unit and method for manufacturing circuit redistribution structure Grant 9,887,153 - Chen , et al. February 6, 2	2018-02-06
Circuit Redistribution Structure Unit And Method For Manufacturing Circuit Redistribution Structure App 20180005931 - CHEN; Yu-Hua ; et al.	2018-01-04
Package Structure And Manufacturing Method Thereof App 20170374748 - YANG; Kai-Ming ; et al.	2017-12-28
Optical Sensing Module App 20170153214 - Wang; Chin-Hung ; et al.	2017-06-01
Miniaturized Particulate Matter Detector And Manufacturing Method Of A Filter App 20170052103 - Chiang; Chia-Wen ; et al.	2017-02-23
Miniaturize Particulate Matter Detector And Manufacturing Method Of A Filter App 20170052102 - Chiang; Chia-Wen ; et al.	2017-02-23
Semiconductor device, manufacturing method and stacking structure thereof Grant 9,373,564 - Shen , et al. June 21, 2	2016-06-21
Semicondcutor Device, Manufacturing Method And Stacking Structure Thereof App 20160043018 - Shen; Wen-Wei ; et al.	2016-02-11
Package Structure App 20160043239 - Chang; Hsiang-Hung ; et al.	2016-02-11
Encapsulation of backside illumination photosensitive device Grant 9,130,080 - Hsiao , et al. September 8, 2	2015-09-08
Conductive Via Structure, Package Structure, And Package Of Photosensitive Device App 20150097259 - CHANG; Hsiang-Hung ; et al.	2015-04-09
Encapsulation Of Backside Illumination Photosensitive Device App 20140291790 - Hsiao; Zhi-Cheng ; et al.	2014-10-02
Heterostructure containing IC and LED and method for fabricating the same Grant 8,679,891 - Chen , et al. March 25, 2	2014-03-25
Heterostructure Containing Ic And Led And Method For Fabricating The Same App 20140004630 - CHEN; KUAN-NENG ; et al.	2014-01-02
Heterostructure containing IC and LED and method for fabricating the same Grant 8,536,613 - Chen , et al. September 17, 2	2013-09-17
Heterostructure Containing Ic And Led And Method For Fabricating The Same App 20120313133 - CHEN; KUAN-NENG ; et al.	2012-12-13
Structure of multiple coaxial leads within single via in substrate and manufacturing method thereof Grant 8,304,666 - Ko , et al. November 6, 2	2012-11-06
Flexible circuit structure Grant 8,269,112 - Lee , et al. September 18, 2	2012-09-18
Structure of embedded active components and manufacturing method thereof Grant 8,048,716 - Chen , et al. November 1, 2	2011-11-01
Integrated package structure having solar cell and thermoelectric element and method of fabricating the same Grant 8,008,573 - Dai , et al. August 30, 2	2011-08-30
Bonding Structure And Method Of Fabricating The Same App 20110195273 - Chen; Kuan-Neng ; et al.	2011-08-11
Structure Of Multiple Coaxial Leads Within Single Via In Substrate And Manufacturing Method Thereof App 20100163296 - Ko; Cheng-Ta ; et al.	2010-07-01
Structure of embedded active components and manufacturing method thereof App 20090179347 - Chen; Shou-Lung ; et al.	2009-07-16
Circuit Structure And Fabrication Method Thereof App 20090173529 - Lee; Yuan-Chang ; et al.	2009-07-09
Three-dimensional chip-stack package and active component on a substrate App 20090008792 - Ko; Cheng-Ta ; et al.	2009-01-08
Integrated Package Structure Having Solar Cell And Thermoelectric Element And Method Of Fabricating The Same App 20080295878 - Dai; Ming-Ji ; et al.	2008-12-04
Structure of embedded active components and manufacturing method thereof App 20060110853 - Chen; Shou-Lung ; et al.	2006-05-25

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