CHEN; Shou-Lung
Patent Applications and Registrations
Patent applications and USPTO patent grants for CHEN; Shou-Lung.The latest application filed is for "semiconductor laser".
Company Profile
9.36.60
- CHEN; Shou-Lung - Taipei City TW
- CHEN; Shou-Lung - Hsinchu TW
- Chen; Shou-Lung - Yangmei Township Taoyuan County TW
- Chen; Shou-Lung - Yangmei Township, Taoyuan County N/A TW
- Chen; Shou-Lung - Shatin N/A HK
- Chen; Shou-Lung - Hong Kong CN
- Chen; Shou Lung - Ma On Shan HK
- Chen; Shou-Lung - New Territories HK
- Chen; Shou-Lung - Troyuan TW
- Chen; Shou-Lung - Taoyuan County TW
- Chen; Shou-Lung - Yangnei Township TW
- Chen; Shou Lung - Hong Kong SAR CN
Patent Activity
| Patent | Date |
|---|---|
| Semiconductor Laser App 20220158413 - LIN; Bing-Cheng ; et al. | 2022-05-19 |
| Laser Element App 20220149589 - CHEN; Shou-Lung ; et al. | 2022-05-12 |
| Laser Package Structure App 20220085571 - Chen; Shou-Lung ; et al. | 2022-03-17 |
| Laser element Grant 11,271,365 - Chen , et al. March 8, 2 | 2022-03-08 |
| Semiconductor Device App 20210336079 - HSU; Tzu-Chieh ; et al. | 2021-10-28 |
| Package Structure App 20210273403 - YANG; Hsiu-Ju ; et al. | 2021-09-02 |
| Semiconductor device Grant 11,024,768 - Hsu , et al. June 1, 2 | 2021-06-01 |
| Laser Device App 20200350742 - CHUNG; Hsin-Chan ; et al. | 2020-11-05 |
| Light-emitting device Grant 10,756,960 - Lu , et al. A | 2020-08-25 |
| Laser Element App 20200153197 - CHEN; Shou-Lung ; et al. | 2020-05-14 |
| Semiconductor Device App 20200119225 - HSU; Tzu-Chieh ; et al. | 2020-04-16 |
| Semiconductor device Grant 10,535,799 - Hsu , et al. Ja | 2020-01-14 |
| Light-emitting device with metal bump Grant 10,340,431 - Kuo , et al. | 2019-07-02 |
| Light-emitting Device App 20190158352 - LU; Chih-Chiang ; et al. | 2019-05-23 |
| Light-emitting device Grant 10,236,411 - Lu , et al. | 2019-03-19 |
| Semiconductor Device App 20180331256 - HSU; Tzu-Chieh ; et al. | 2018-11-15 |
| Light-emitting Device App 20180130933 - Kuo; Jai-Tai ; et al. | 2018-05-10 |
| Light-emitting device Grant 9,876,153 - Kuo , et al. January 23, 2 | 2018-01-23 |
| Electrically stackable semiconductor wafer and chip packages Grant 9,601,474 - Chen , et al. March 21, 2 | 2017-03-21 |
| Light-emitting Device App 20170047478 - LU; Chih-Chiang ; et al. | 2017-02-16 |
| Method for making light-emitting device Grant 9,508,891 - Lu , et al. November 29, 2 | 2016-11-29 |
| Light-emitting device App 20160190409 - Kuo; Jai-Tai ; et al. | 2016-06-30 |
| Method For Making Light-emitting Device App 20160149072 - LU; Chih-Chiang ; et al. | 2016-05-26 |
| Wafer Leveled Chip Packaging Structure and Method Thereof App 20150364457 - Chen; Shou-Lung ; et al. | 2015-12-17 |
| Wafer leveled chip packaging structure and method thereof Grant 9,059,181 - Chen , et al. June 16, 2 | 2015-06-16 |
| Wafer Leveled Chip Packaging Structure and Method Thereof App 20140217587 - Chen; Shou-Lung ; et al. | 2014-08-07 |
| Wafer-leveled chip packaging structure and method thereof Grant 8,587,091 - Chen , et al. November 19, 2 | 2013-11-19 |
| Coordinate locating method, coordinate locating device, and display apparatus comprising the coordinate locating device Grant 8,427,443 - Feng , et al. April 23, 2 | 2013-04-23 |
| Semiconductor package device Grant 8,314,482 - Chen , et al. November 20, 2 | 2012-11-20 |
| Wafer-leveled Chip Packaging Structure And Method Thereof App 20120267765 - CHEN; Shou-Lung ; et al. | 2012-10-25 |
| LED light shaping device and illumination system Grant 8,061,857 - Liu , et al. November 22, 2 | 2011-11-22 |
| Structure of embedded active components and manufacturing method thereof Grant 8,048,716 - Chen , et al. November 1, 2 | 2011-11-01 |
| Methods and apparatus for backlight calibration Grant 8,044,899 - Ng , et al. October 25, 2 | 2011-10-25 |
| Coordinate Locating Method, Coordinate Locating Device, And Display Apparatus Comprising The Coordinate Locating Device App 20110157026 - Feng; Yaojun ; et al. | 2011-06-30 |
| Projection Led Module And Method Of Making A Projection Led Module App 20110057557 - Chi; Yong ; et al. | 2011-03-10 |
| Electronic device package and method of manufacturing the same Grant 7,838,333 - Chen , et al. November 23, 2 | 2010-11-23 |
| Sensing System for a Touch Sensitive Device App 20100277436 - Feng; Yaojun ; et al. | 2010-11-04 |
| Illumination module, and a display and general lighting apparatus using the same Grant 7,766,533 - Liu , et al. August 3, 2 | 2010-08-03 |
| Structure for reducing stress for vias and fabricating method thereof Grant 7,754,599 - Hsu , et al. July 13, 2 | 2010-07-13 |
| Thermal enhanced low profile package structure and method for fabricating the same Grant 7,754,530 - Wu , et al. July 13, 2 | 2010-07-13 |
| Touch Surface And System And Method Of Detecting Touch Input App 20100170725 - Au-Yeung; Amy Mei Sze ; et al. | 2010-07-08 |
| Structure for protecting electronic packaging contacts from stress Grant 7,732,928 - Chang , et al. June 8, 2 | 2010-06-08 |
| Led Light Shaping Device And Illumination System App 20100128233 - LIU; Ying ; et al. | 2010-05-27 |
| Electronic Device Package And Method Of Manufacturing The Same App 20100112757 - CHEN; Shou-Lung ; et al. | 2010-05-06 |
| Light guiding strip and double-sided planar light apparatus Grant 7,703,963 - Feng , et al. April 27, 2 | 2010-04-27 |
| Electronic device package and method of manufacturing the same Grant 7,632,707 - Chen , et al. December 15, 2 | 2009-12-15 |
| Illumination module, and a display and general lighting apparatus using the same App 20090273946 - Liu; Ying ; et al. | 2009-11-05 |
| Light-emitting devices and lens therefor Grant 7,607,792 - Liu , et al. October 27, 2 | 2009-10-27 |
| Backlighting apparatus and manufacturing process Grant 7,607,790 - Chen , et al. October 27, 2 | 2009-10-27 |
| Packaging structure and method of an image sensor module Grant 7,572,676 - Leu , et al. August 11, 2 | 2009-08-11 |
| Structure of embedded active components and manufacturing method thereof App 20090179347 - Chen; Shou-Lung ; et al. | 2009-07-16 |
| Thermal Enhanced Low Profile Package Structure And Method For Fabricating The Same App 20090155954 - WU; ENBOA ; et al. | 2009-06-18 |
| Structure for reducing stress for vias and fabricating method thereof App 20090156001 - Hsu; Yung-Yu ; et al. | 2009-06-18 |
| Image sensor packaging structure and method of manufacturing the same Grant 7,544,529 - Chen , et al. June 9, 2 | 2009-06-09 |
| Structure for reducing stress for vias and fabricating method thereof Grant 7,545,039 - Hsu , et al. June 9, 2 | 2009-06-09 |
| Wafer-leveled chip packaging structure and method thereof Grant 7,528,009 - Chen , et al. May 5, 2 | 2009-05-05 |
| Thermal enhanced low profile package structure Grant 7,511,365 - Wu , et al. March 31, 2 | 2009-03-31 |
| Light Guiding Strip And Double-sided Planar Light Apparatus App 20090073720 - Feng; Yaojun ; et al. | 2009-03-19 |
| Backlight assembly, method of driving the same and display system having the same thereof App 20090051642 - Huang; Danding ; et al. | 2009-02-26 |
| Image sensor package structure and method for fabricating the same App 20090026567 - Chen; Shou-Lung ; et al. | 2009-01-29 |
| Chip Package Process App 20090011545 - Chiang; Chia-Wen ; et al. | 2009-01-08 |
| Methods and apparatus for backlight calibration App 20090001251 - Ng; Pak Hong ; et al. | 2009-01-01 |
| Eave Light Guiding Device And Backlight Device Using The Same App 20080266903 - LIU; Ying ; et al. | 2008-10-30 |
| Optical Element And Projection System Using The Same App 20080239253 - LIU; Ying ; et al. | 2008-10-02 |
| Image sensor packaging structure Grant 7,417,293 - Chen , et al. August 26, 2 | 2008-08-26 |
| High Dynamic Range Image Recorder App 20080198235 - CHEN; Shou-Lung ; et al. | 2008-08-21 |
| Packaging structure and method of an image sensor module Grant 7,411,306 - Leu , et al. August 12, 2 | 2008-08-12 |
| Backlit Display and Backlight System Thereof App 20080186272 - Huang; Danding ; et al. | 2008-08-07 |
| Side-emitting backlight system and backlit display using the same App 20080186734 - Huang; Danding ; et al. | 2008-08-07 |
| Method And Light Emitting Diode Backlight System With Adjustable Color Gamut App 20080164823 - HUANG; Danding ; et al. | 2008-07-10 |
| Flat panel display and driving method thereof App 20080150881 - Chen; Shou Lung ; et al. | 2008-06-26 |
| Light-emitting devices and lens therefor App 20080151550 - Liu; Ying ; et al. | 2008-06-26 |
| Backlighting apparatus and manufacturing process App 20080144315 - Chen; Shou Lung ; et al. | 2008-06-19 |
| Image display apparatus App 20080122832 - Chen; Shou Lung ; et al. | 2008-05-29 |
| Wafer-leveled chip packaging structure and method thereof App 20080029870 - Chen; Shou-Lung ; et al. | 2008-02-07 |
| Wafer-leveled chip packaging structure and method thereof Grant 7,294,920 - Chen , et al. November 13, 2 | 2007-11-13 |
| Packaging structure and method of an image sensor module App 20070195188 - Leu; Fang-Jun ; et al. | 2007-08-23 |
| Wafer-leveled chip packaging structure and method thereof App 20070197018 - Chen; Shou-Lung ; et al. | 2007-08-23 |
| Image Sensor Packaging Structure And Method Of Manufacturing The Same App 20070190687 - CHEN; Shou-Lung ; et al. | 2007-08-16 |
| Structure And Process Of Chip Package App 20070152318 - Chiang; Chia-Wen ; et al. | 2007-07-05 |
| Structure for reducing stress for vias and fabricating method thereof App 20070108572 - Hsu; Yung-Yu ; et al. | 2007-05-17 |
| Protecting structure and manufacturing method for electronic packaging contacts App 20070096279 - Chang; Shyh-Ming ; et al. | 2007-05-03 |
| Thermal enhanced low profile package structure and method for fabricating the same App 20060237827 - Wu; Enboa ; et al. | 2006-10-26 |
| Stacked package for electronic elements App 20060220212 - Chen; Shou-Lung ; et al. | 2006-10-05 |
| Stacked package for electronic elements and packaging method thereof Grant 7,091,592 - Chen , et al. August 15, 2 | 2006-08-15 |
| Electronic device package and method of manufacturing the same App 20060157864 - Chen; Shou-Lung ; et al. | 2006-07-20 |
| Structure of electronic package and method for fabricating the same App 20060108146 - Wu; Enboa ; et al. | 2006-05-25 |
| Structure of embedded active components and manufacturing method thereof App 20060110853 - Chen; Shou-Lung ; et al. | 2006-05-25 |
| Packaging structure and method of an image sensor module App 20060030070 - Leu; Fang-Jun ; et al. | 2006-02-09 |
| Image sensor packaging structure and method of manufacturing the same App 20060022290 - Chen; Shou-Lung ; et al. | 2006-02-02 |
| Image sensor package structure and method for fabricating the same App 20060024857 - Chen; Shou-Lung ; et al. | 2006-02-02 |
| Wafer-leveled chip packaging structure and method thereof App 20060019484 - Chen; Shou-Lung ; et al. | 2006-01-26 |
| Image sensor packaging structure and method App 20050236684 - Chen, Shou-Lung ; et al. | 2005-10-27 |
| Stacked package for electronic elements and packaging method thereof App 20040238933 - Chen, Shou-Lung ; et al. | 2004-12-02 |
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