U.S. patent application number 11/250906 was filed with the patent office on 2006-03-09 for methods for packaging image sensitive electronic devices.
Invention is credited to Todd O. Bolken, Chad A. Cobbley.
Application Number | 20060051891 11/250906 |
Document ID | / |
Family ID | 29583697 |
Filed Date | 2006-03-09 |
United States Patent
Application |
20060051891 |
Kind Code |
A1 |
Bolken; Todd O. ; et
al. |
March 9, 2006 |
Methods for packaging image sensitive electronic devices
Abstract
The invention provides methods for packaging for electronic
devices that are light or other radiation-sensitive, such as image
sensors including CCD or CMOS chips. In one embodiment of the
invention, an image sensor package is assembled by surrounding a
chip with a barrier of transfer mold compound and covering the chip
with a transparent lid. In another embodiment of the invention, the
perimeter area of a chip, including interconnections, is
encapsulated with a liquid dispensed epoxy, and a transparent lid
is attached. In yet another embodiment of the invention, a unitary
shell of entirely transparent material is used. In yet another
embodiment of the invention, a substrate-mounted chip and a
transparent lid are loaded into a transfer mold that holds them in
optimal alignment. The transfer mold is then filled with molding
compound to encapsulate the chip and interconnections, and to
retain the transparent lid.
Inventors: |
Bolken; Todd O.; (Star,
ID) ; Cobbley; Chad A.; (Boise, ID) |
Correspondence
Address: |
TRASK BRITT
P.O. BOX 2550
SALT LAKE CITY
UT
84110
US
|
Family ID: |
29583697 |
Appl. No.: |
11/250906 |
Filed: |
October 15, 2005 |
Related U.S. Patent Documents
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Application
Number |
Filing Date |
Patent Number |
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10370674 |
Feb 21, 2003 |
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11250906 |
Oct 15, 2005 |
|
|
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10164077 |
Jun 4, 2002 |
6906403 |
|
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10370674 |
Feb 21, 2003 |
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Current U.S.
Class: |
438/106 ;
257/E31.117; 438/116; 438/127; 438/64; 438/69 |
Current CPC
Class: |
H01L 2924/00012
20130101; H01L 2924/00014 20130101; H01L 2224/73265 20130101; H01L
2924/00 20130101; H01L 2224/32225 20130101; H01L 2924/00 20130101;
H01L 2224/45099 20130101; H01L 2224/73265 20130101; H01L 2224/85399
20130101; H01L 2224/48227 20130101; H01L 2224/73265 20130101; H01L
2924/00012 20130101; H01L 2924/00012 20130101; H01L 2224/48145
20130101; H01L 2224/48227 20130101; H01L 2924/00 20130101; H01L
2924/00012 20130101; H01L 2224/73265 20130101; H01L 2924/00012
20130101; H01L 2224/48145 20130101; H01L 2224/48227 20130101; H01L
2924/15174 20130101; H01L 2924/15311 20130101; H01L 2224/484
20130101; H01L 25/0657 20130101; H01L 2224/85399 20130101; H01L
2924/00014 20130101; H01L 2224/73265 20130101; Y10S 257/924
20130101; H01L 2924/00014 20130101; H01L 2924/014 20130101; H01L
27/14625 20130101; H01L 2924/00014 20130101; H01L 2224/48227
20130101; H01L 2224/73265 20130101; H01L 2224/48091 20130101; H01L
2224/8592 20130101; H01L 2924/181 20130101; H01L 24/73 20130101;
H01L 2924/00014 20130101; H01L 2924/181 20130101; H01L 23/293
20130101; H01L 23/3128 20130101; H01L 2224/484 20130101; H01L
2224/32145 20130101; H01L 2224/48091 20130101; H01L 2224/48145
20130101; H01L 2224/92247 20130101; H01L 2224/92247 20130101; H01L
2224/92247 20130101; H01L 2224/92 20130101; H01L 2225/06555
20130101; H01L 24/48 20130101; H01L 2225/06506 20130101; H01L
2224/73265 20130101; H01L 2224/32225 20130101; H01L 2224/92247
20130101; H01L 2924/15311 20130101; H01L 2924/16152 20130101; H01L
2224/73265 20130101; H01L 2924/01013 20130101; H01L 2924/1815
20130101; B33Y 80/00 20141201; H01L 31/0203 20130101; H01L
2924/00014 20130101; H01L 2224/05599 20130101; H01L 27/14618
20130101; H01L 2224/73265 20130101; H01L 2224/85399 20130101; H01L
2924/01014 20130101; H01L 27/14683 20130101; H01L 2924/00014
20130101; H01L 27/14603 20130101; H01L 2924/00 20130101; H01L
2224/32145 20130101; H01L 2224/48227 20130101; H01L 2924/00011
20130101; H01L 2224/05599 20130101; H01L 2224/45099 20130101; H01L
2224/48145 20130101; H01L 2224/48227 20130101; H01L 2224/32145
20130101; H01L 2224/32145 20130101; H01L 2224/32225 20130101; H01L
2224/05599 20130101; H01L 2224/32225 20130101; H01L 2924/00014
20130101; H01L 2924/00012 20130101; H01L 2924/00014 20130101; H01L
2224/32225 20130101; H01L 2224/48227 20130101; H01L 2924/00012
20130101; H01L 2224/48227 20130101; H01L 2224/32145 20130101; H01L
2224/32145 20130101 |
Class at
Publication: |
438/106 ;
438/116; 438/127; 438/069; 438/064 |
International
Class: |
H01L 21/50 20060101
H01L021/50; H01L 21/44 20060101 H01L021/44; H01L 21/00 20060101
H01L021/00 |
Claims
1. A method for assembling a package containing an electronic
device sensitive to light or other radiation comprising: mounting
said electronic device on a carrier substrate having at least one
conductive trace thereon, said at least one conductive trace having
a first end and a second end; providing at least one electrical
interconnection between said electronic device and said first end
of said at least one conductive trace; loading a transparent lid
into a mold tooling element; loading said carrier substrate with
said electronic device and said at least one electrical
interconnection into said mold tooling element so that a surface of
said electronic device is aligned against said transparent lid;
filling said mold tooling element with molding compound; forming a
molded layer on said carrier substrate to encapsulate said at least
one electrical interconnection and a perimeter of said electronic
device; and retaining said transparent lid with said molded
layer.
2. The method according to claim 1, further comprising: applying a
layer of conformal film between an inside surface of said mold
tooling element and said transparent lid prior to said filling said
mold tooling element.
3. The method according to claim 1, further comprising selecting
said electronic device to be an image sensor.
4. The method according to claim 1, further comprising selecting
said electronic device to comprise a solid-state device selected
from a group consisting of a charge coupled device, a complementary
metal-oxide semiconductor and an erasable programmable read-only
memory.
5. The method according to claim 4, further comprising fabricating
said electronic device as a chip stack.
6. The method according to claim 1, further comprising forming said
carrier substrate of a material selected from a group consisting of
plastic, FR-4 and BT.
7. The method according to claim 6, further comprising: attaching
at least one discrete conductive element to said second end of said
at least one conductive trace of said carrier substrate.
8. The method according to claim 7, wherein a plurality of said
packages, each containing an electronic device, are formed onto a
single carrier substrate and further comprising: dividing said
single carrier substrate into separate pieces, each of said pieces
comprising one of said packages.
Description
CROSS-REFERENCE TO RELATED APPLICATIONS
[0001] This application is a divisional of application Ser. No.
10/370,674, filed Feb. 21, 2003, pending, which is a divisional of
application Ser. No. 10/164,077, filed Jun. 4, 2002, now U.S. Pat.
No. 6,906,403, dated Jun. 14, 2005.
BACKGROUND OF THE INVENTION
[0002] 1. Field of the Invention
[0003] The present invention relates generally to electronic
devices that are sensitive to light or other forms of radiation.
More particularly, the present invention relates to packages with
transparent coverings for enclosing image sensors and methods for
their assembly.
[0004] 2. State of the Art
[0005] Solid-state image sensors, for example, charge coupled
devices (CCDs) or complementary metal-oxide semiconductor (CMOS)
chips, are increasingly in demand for use with electronic devices
such as digital cameras. Conventionally, these sensors have been
packaged for use by mounting them to a substrate and enclosing them
within a housing assembly. The housing assembly incorporates a
transparent lid to allow light or other forms of radiation to be
received by the sensor. The lid may be a flat window or shaped as a
lens to provide optical properties. The substrate and housing are
often formed from a ceramic material, and the lid is glass or a
similar transparent substance attached to the housing by an
adhesive. Due to the materials and structure involved, this
packaging technique may be expensive and difficult to manufacture.
Further, growing desire for portable electronic devices that will
stand up to extreme environments raises concerns of durability and
size.
[0006] In order to better meet large-scale production requirements,
various methods have been developed in attempts to simplify the
construction of image sensors. Examples include U.S. Pat. No.
6,266,197 to Glenn et al., which discloses fabricating multiple
sensor housings at one time by molding window arrays. U.S. Pat. No.
6,072,232 to Li et al. discloses a plastic package with an embedded
frame for reducing material costs. U.S. Pat. No. 5,811,799 to Wu
discloses a simplified substrate that is a printed wiring frame
with a wall erected thereon. While these and other designs have
been of some benefit, they still involve a number of specialized
parts requiring multiple, sometimes precision, steps for assembly.
Issues concerning material costs and part complexity remain.
[0007] Accordingly, a need exists for improved image sensor
packaging that is simple to assemble and cost effective, while
being of durable and light construction.
BRIEF SUMMARY OF THE INVENTION
[0008] In accordance with the present invention, improved packages
for image sensors and methods for their assembly are disclosed.
Embodiments of the present invention are directed to image sensor
chips or similar light or other radiation-sensitive electronic
components mounted on a carrier substrate. The chips are mounted to
the carrier substrate in a conventional manner with epoxy or a tape
lamination process and electrically connected to substrate
conductive elements with wire bonds or other suitable
interconnections. The chips are enclosed within a protective
barrier including a transparent covering which acts as a window or
lens. If desired, an array of chips may be mounted on a single
large substrate and the substrate later sectioned to form
individual image sensor packages. Once assembled, the image sensor
packages may be incorporated into electronic devices by attachment
with electrical connections on the carrier substrate. The materials
used are inexpensive while providing durable, lightweight and
simple construction.
[0009] In one exemplary embodiment of the invention, an image
sensor package is assembled by surrounding a chip with a barrier of
transfer mold compound such that the chip and its interconnections
are left exposed. This exposed area coincides with the outer
perimeter of a transparent lid. An adhesive of a known, suitable
type is applied to the perimeter of the lid, which is then
positioned at an optimum distance from the chip within the exposed
area. If the adhesive requires curing, the adhesive may be
activated to secure the lid to the barrier of mold compound.
[0010] In another exemplary embodiment of the invention, the
perimeter area of a chip, including interconnections such as wire
bonds and bond pads, is encapsulated with a liquid dispensed epoxy
or other liquid dispensed nonconductive material. A transparent lid
placed on top of the chip is retained by adhesion with the epoxy
that encapsulates the chip perimeter. The lid may be placed
directly on the chip, or a gasket may be used, if necessary, to
prevent epoxy from seeping into the area beneath the lid due to
capillary action. Once the lid is attached, the assembly may be
further encapsulated by a transfer mold compound or a pot mold
compound for increased protection if desired.
[0011] In yet another exemplary embodiment of the invention, chip
encapsulation is accomplished with a unitary shell of entirely
transparent material. The shell may be formed by molding a
transparent compound directly around the chip or by attaching a
preformed shell to the carrier substrate with an adhesive. The
clearness or transmissivity of the shell surface may be improved by
using a very smooth mold surface or by polishing the shell after it
is molded.
[0012] In yet another exemplary embodiment of the invention, a
substrate-mounted chip and a transparent lid are loaded into a mold
tooling element, such as a transfer mold configured to hold them in
optimal alignment. The transfer mold is then filled with molding
compound to encapsulate the chip and interconnections, and to
secure the transparent lid in place. A conformal film may be
disposed between the surface of the mold cavity and the transparent
lid to act as a gasket for controlling mold compound flash on the
surface of the transparent lid.
[0013] As a further variation, any of the above-described exemplary
package embodiments may be used with one or more electronic
components of a stacked multi-chip module (MCM). The chips are
mounted to a carrier substrate and to each other in a conventional
manner with epoxy or a tape lamination process. The chips are
electrically interconnected to each other and to the substrate
conductive elements with wire bonds or other suitable
interconnections.
[0014] Other and further features and advantages will be apparent
from the following descriptions of the various embodiments of the
present invention when read in conjunction with the accompanying
drawings. It will be understood by one of ordinary skill in the art
that the following are provided for illustrative and exemplary
purposes only, and that numerous combinations of the elements of
the various embodiments of the present invention are possible.
BRIEF DESCRIPTION OF THE SEVERAL VIEWS OF THE DRAWINGS
[0015] In the drawings, which illustrate what is currently
considered to be the best mode for carrying out the invention:
[0016] FIGS. 1A-1E are schematic sectional side views showing an
exemplary method of formation of an image sensor package, wherein
encapsulation includes surrounding a chip with a barrier of
transfer mold compound and attaching a transparent lid to the
barrier with adhesive applied to the perimeter of the lid;
[0017] FIGS. 2A-2E are schematic sectional side views showing an
example of forming an image sensor package using the same method as
in FIGS. 1A-1E, except that the barrier of transfer mold compound
is formed on the carrier substrate prior to mounting the chip;
[0018] FIG. 3 is an alternative partial schematic sectional side
view of the image sensor package formed by the methods of FIGS.
1A-1E or FIGS. 2A-2E, wherein a ledge is formed on the inner
perimeter of the molded barrier to support the transparent lid;
[0019] FIGS. 4A-4F are schematic sectional side views showing an
exemplary method of forming an image sensor package, wherein
encapsulation includes covering the perimeter area of a chip,
including interconnections such as wire bonds and bond pads, with a
liquid dispensed epoxy;
[0020] FIG. 5 is an enlarged schematic sectional view of the region
II of FIG. 4F showing a layer of molding compound covering the
epoxy and the perimeter area of the chip, and further retaining the
edges of a transparent lid;
[0021] FIGS. 6A-6D are schematic sectional side views showing an
exemplary method of forming an image sensor package, wherein
encapsulation includes covering a chip with a unitary shell of
entirely transparent material;
[0022] FIG. 7 is an alternative schematic sectional side view of
the image sensor package formed by the method of FIGS. 6A-6D,
wherein a preformed shell is used to cover the chip;
[0023] FIGS. 8A-8E are schematic sectional side views showing an
exemplary method of forming an image sensor package, wherein
encapsulation includes molding a chip and transparent lid together
within a transfer mold;
[0024] FIGS. 9A-9E are schematic sectional side views showing a
method of forming an image sensor package as in FIGS. 8A-8E,
wherein multiple electronic components in the form of a chip stack
are encapsulated; and
[0025] FIG. 10 is an enlarged schematic sectional view of the
region IV of FIG. 9E showing a layer of molding compound covering
the perimeter area of the chip stack, and further retaining the
edges of the transparent lid.
DETAILED DESCRIPTION OF THE INVENTION
[0026] Generally, the present invention includes methods for
assembling packaged image sensors that include solid-state devices,
such as CCD or CMOS chips, to receive an image of reflected light
or other electromagnetic radiation from one or more objects. It
should be understood, however, that the packages and other methods
of the present invention would also work well for enclosing other
types of light or other radiation-sensitive electronic components
such as, for instance, erasable programmable read-only memory chips
(EPROMs).
[0027] Referring to the accompanying drawings, wherein similar
features and elements are identified by the same or similar
reference numerals, the various embodiments of the image sensor
packages are formed on a carrier substrate 2. Carrier substrate 2
includes conductive elements 1 (e.g., traces) having first ends
with terminal pads 5 for electrical connection with components,
such as a chip 4, on carrier substrate 2. Wire bonds 8 are shown as
the intermediate conductive elements 1 that electrically connect
bond pads 5' of chip 4 and corresponding terminal pads 5 on the
upper surface of carrier substrate 2, but other suitable
interconnections, including flip-chip or conductive tape-automated
bonding (TAB) elements carried by a dielectric, polymeric film, may
be used when compatible with the structures of chip 4 and carrier
substrate 2. The second ends of the conductive elements 1 terminate
in attachment pads 3 for connecting carrier substrate 2 to the
surface of a larger assembly, such as a printed circuit board.
Carrier substrate 2 may be constructed of plastic, such as
thermoplastic and thermosetting plastics, which is less expensive
and lighter than the ceramic substrates typically used for image
sensors. Other common substrate materials such as FR-4 or BT would
be suitable as well.
[0028] Turning to FIGS. 1A through 3, a first embodiment of the
present invention is illustrated. An optical sensor in the form of
a chip 4 is mounted on carrier substrate 2 with an adhesive layer 6
formed of epoxy or provided by an adhesive-coated tape in a
lamination process as known in the art. Chip 4 is then electrically
connected to carrier substrate 2 by wire bonds 8. Next, a
protective barrier 10 is formed around the chip, such as by known
transfer molding, pot molding, or injection molding processes, by
photolithographic processes, by stereolithographic processes, or as
otherwise known in the art. As shown in FIGS. 1A-1E, molded
protective barrier 10 is in the shape of a wall surrounding a
central exposed area containing chip 4 and its interconnections,
including wire bonds 8. Once protective barrier 10 is formed, a
transparent lid 12, having substantially the same size as the outer
perimeter of the central exposed area, is lowered into the
protective barrier 10. Transparent lid 12 is positioned at a
distance from the chip 4 that provides optimal performance. For
instance, if transparent lid 12 is shaped as a lens in order to
possess certain desired optical characteristics, the transparent
lid 12 may be located at a specific focal point to ensure optimal
image sensing. Positioning may be accomplished by contacting
electrical probes 14 to the attachment pads 3 on the lower surface
of the carrier substrate 2 to monitor for a desired sensor output
while lowering transparent lid 12 within protective barrier 10.
Alternatively, as shown in FIG. 3, if a set optimal distance for
placement of transparent lid 12 from chip 4 is known, a ledge 16
may be formed on the inner perimeter 11 of protective barrier 10 to
support transparent lid 12 at that distance. After transparent lid
12 has been located in the proper position, an adhesive coated on a
perimeter 13 of transparent lid 12 or at an appropriate location of
protective barrier 10 secures transparent lid 12 into place. The
adhesive may comprise a pressure-sensitive adhesive or a so-called
"activated adhesive." The term "activated adhesive" refers to
materials that do not completely adhere or cure until acted upon by
a specific initiating agency. Examples include UV curing,
thermosetting or chemically activated epoxy. Chip 4, bond pads 5'
thereof, and the intermediate conductive elements (e.g., wire bonds
8) that are secured to terminal pads 5, are effectively sealed in
an area surrounded by protective barrier 10 and under transparent
lid 12.
[0029] Protective barrier 10 is constructed of, for example,
molding compound or a similar encapsulant material formed onto
carrier substrate 2 using a transfer mold. As shown in FIGS. 2A-2E,
under certain circumstances it may be desirable to form protective
barrier 10 on carrier substrate 2 prior to mounting chip 4 to
carrier substrate 2. This may reduce possible contamination or
damage to chip 4 resulting from the process of forming protective
barrier 10. Further, it would allow the formation of protective
barrier 10 to be performed outside of a clean room environment
which might otherwise be required if chip 4, which is highly
sensitive to air-born contaminants, was already attached.
[0030] A second embodiment of the present invention is illustrated
in FIGS. 4A-4F and 5. Image sensor chip 4 is mounted to carrier
substrate 2 and connected by wire bonds 8 in the same manner as
described above. A liquid epoxy 18 or other nonconductive adhesive
material is then dispensed around the perimeter 7 of chip 4 to
encapsulate wire bonds 8 and corresponding bond pads 5' on chip 4
and terminal pads 5 on carrier substrate 2. Transparent lid 12 is
placed over chip 4, and contact of transparent lid 12 with liquid
epoxy 18 that encapsulates the chip perimeter 7 provides an
adhesive interface to retain transparent lid 12 in position over
chip 4. The liquid epoxy 18 is then cured to secure transparent lid
12 in place. Transparent lid 12 may be placed directly against the
surface of chip 4, or a gasket 9 may be inserted between the two,
if desired, to prevent liquid epoxy 18 from seeping into the area
beneath transparent lid 12 due to capillary action. In the case
where transparent lid 12 is formed as a lens, gasket 9 may also
support transparent lid 12 at an optimal distance from chip 4, much
like ledge 16 in FIG. 3 of the previously described embodiment.
[0031] After attachment of transparent lid 12, the assembly is
suitable for use as an image sensor package without any further
encapsulation. In some cases, however, it may be desirable to
reinforce the assembly with additional material in the form of
molding compound. FIGS. 4E-4F show a layer 20 of molding compound
applied to the assembly using a transfer molding process, although
other known and suitable techniques (e.g., pot molding, injection
molding, photolithography, stereolithograpy, etc.) may be used to
form layer 20. As can be seen in FIG. 5, layer 20 covers liquid
epoxy 18 that encapsulates wire bonds 8 and the perimeter 7 of chip
4 and, further, retains the position of transparent lid 12 relative
to chip 4.
[0032] FIGS. 6A-6D and 7 illustrate a third embodiment of the
present invention. Chip 4 is mounted and connected to carrier
substrate 2 as in the previously described embodiments. Next, a
shell 22, formed entirely of a transparent material, may be added
to the assembly for encapsulation of chip 4 and its associated
interconnections, which, in the example of FIGS. 6A-6D, are wire
bonds 8. The shell 22 may be formed by molding a transparent
compound directly around chip 4 or, as in FIG. 7, attaching a
preformed shell 22' to carrier substrate 2 with an adhesive.
[0033] In the case where shell 22 is formed directly around chip 4,
a clear compound will be molded onto carrier substrate 2. Clear
epoxy or other inexpensive resin-type materials, like polystyrene
and silicon, may be used for the clear compound so long as they
harden into a durable and highly transparent structure. Once
formed, shell 22 acts both as a protective encapsulant for chip 4
and its interconnections and as a transparent lid for image
sensing. An even, untextured surface improves the clearness or
transmissivity of shell 22, which is important for optimal image
sensing. This may be accomplished during the molding process by
using a mold cavity made with one or more very smooth surfaces
overlying the face of the chip 4. The mold cavity may also be used
to determine optical qualities by imparting lens shapes or focusing
surface features on the shell. Alternatively, the surface of shell
22 may be polished by known processes after molding to carrier
substrate 2. The option of molding shell 22 directly around chip 4
offers the advantage of securing all the connections within a
highly protective solid structure.
[0034] Turning to FIG. 7, when preformed shell 22' is used rather
than molding a shell 22 directly around chip 4, the shell 22' may
be spaced apart from chip 4, forming a cavity 24 thereover, instead
of comprising a solid structure on the surface of chip 4. An
adhesive layer 26, such as epoxy or tape, may also be required for
attachment at the interface between preformed shell 22' and carrier
substrate 2. Enclosing chip 4 in this manner advantageously allows
preformed shell 22' to later be removed if repair or replacement of
parts in the image sensor package is necessary. If removal is not a
concern, after preformed shell 22' is attached, cavity 24 may be
filled in with a clear compound 25 like that used for molding so as
to strengthen the package.
[0035] Another embodiment of the present invention is illustrated
in FIGS. 8A through 10. After mounting and connecting chip 4 to
carrier substrate 2, the assembly is loaded into a mold tooling 28.
Transparent lid 12 is also loaded into mold tooling 28 so that
transparent lid 12 and chip 4 are held into alignment and position
for proper image sensing. The cavity 29 (not shown) of mold tooling
28 is then filled with molding compound so as to create a layer 30
covering the area around the perimeter 7 of chip 4 and to retain
transparent lid 12 while leaving its upper surface exposed. The
encapsulation for the image sensor package is thereby completed. In
order to prevent molding compound flash onto the top surface of
transparent lid 12 during the molding process, a conformal film 32
may be applied between the interior surface of mold tooling 28 and
transparent lid 12. This produces a gasketing effect and prevents
molding compound intrusions.
[0036] FIGS. 9A-9E shows a variation of the fourth embodiment of
the present invention, wherein multiple electronic components 4,
4', 4'' in the form of a multi-chip module 34 are enclosed within
the package. Components 4, 4', 4'' may be mounted to carrier
substrate 2 and to each other with epoxy or adhesive-coated tape 6,
6', 6'', and interconnected with wire bonds 8, 8', 8'' or other
suitable interconnections. Of course, multi-chip module 34 may be
comprised of any number of components as long as the image sensor
chip 4 is on top of the chip stack or in a position to be clear of
obstruction. The encapsulation process then continues as previously
described, with carrier substrate 2 and attached multi-chip module
34 being loaded into mold tooling 28 for alignment and molding with
transparent lid 12. As can be seen in FIG. 10, layer 30
encapsulates the perimeter area and interconnections of multi-chip
module 34, and retains transparent lid 12. Although an example of
packaging multi-chip module 34 has been illustrated only in terms
of the present transfer mold tooling embodiment, it should be clear
that the first three encapsulating embodiments discussed above
would also work well for enclosing a multi-chip module 34.
[0037] In all of the embodiments, after the encapsulation step the
package may proceed through other conventional assembly steps. This
includes attachment of solder balls 36, or other discrete
conductive elements such as conductive or conductor-filled epoxy
pillars, columns or bumps, on the bottom of carrier substrate 2 to
form an easily mountable BGA package. Moreover, if the packaging
has been assembled as an array of chips attached to one large
substrate, it may be cut or otherwise divided into pieces that each
comprise a single image sensor package.
[0038] It is also within the scope of the present invention that
certain aspects of one of the described embodiments might be used
in the fabrication of another of the described embodiments. The
method of molding transparent shell 22 around image sensor chip 4
with clear compound, for instance, may be used for encapsulation in
other embodiments. In the first embodiment, rather than using
transparent lid 12 to cover the central exposed area of protective
barrier 10, a clear compound may simply be filled into the central
exposed area, with the upper surface of the clear compound being
formed into the desired window or lens shape. Further, in the
embodiments where transparent lid 12 is placed directly against the
sensing surface of chip 4, the focal point for image sensing is
constant and will be optimized based only on shaping when the form
of a lens is required. In any of those embodiments, a transparent
lid of clear compound directly molded onto chip 4 may be
advantageous.
[0039] All of the above-illustrated embodiments of the present
invention provide image sensor packages that are constructed of low
cost material and require simple methods of assembly. The packages
are also durable and lightweight, making them highly desirable for
use in increasingly demanding operating conditions. Although the
present invention has been depicted and described with respect to
the illustrated embodiments, various additions, deletions and
modifications are contemplated from its scope or essential
characteristics. Furthermore, while described in the context of
image sensor packaging, the invention has utility for packaging of
all components that are sensitive to light or other radiation and
require a transparent surface for exposure. The scope of the
invention is, therefore, indicated by the appended claims rather
than the foregoing description. All changes which come within the
meaning and range of equivalency of the claims are to be embraced
within their scope.
* * * * *