Cobbley; Chad A.

Patent Applications and Registrations

Patent applications and USPTO patent grants for Cobbley; Chad A..The latest application filed is for "techniques for packaging multiple device components".

Company Profile

0.101.102

Cobbley; Chad A. - Boise ID
Cobbley; Chad A - Boise ID

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Techniques for packaging multiple device components Grant 9,559,087 - Bolken , et al. January 31, 2	2017-01-31
Semiconductor device structures and electronic devices including hybrid conductive vias, and methods of fabrication Grant 8,872,310 - Cobbley , et al. October 28, 2	2014-10-28
Semiconductor device including one or more stiffening elements Grant 8,716,849 - Cobbley , et al. May 6, 2	2014-05-06
Techniques For Packaging Multiple Device Components App 20140099753 - Bolken; Todd O. ; et al.	2014-04-10
Techniques for packaging multiple device components Grant 8,629,558 - Bolken , et al. January 14, 2	2014-01-14
Methods of fabrication of package assemblies for optically interactive electronic devices and package assemblies therefor Grant 8,624,371 - Bolken , et al. January 7, 2	2014-01-07
Methods Of Fabrication Of Package Assemblies For Optically Interactive Electronic Devices And Package Assemblies Therefor App 20130234275 - Bolken; Todd O. ; et al.	2013-09-12
Electronic devices Grant 8,508,034 - Bolken , et al. August 13, 2	2013-08-13
Semiconductor Device Structures And Electronic Devices Including Same Hybrid Conductive Vias, And Methods Of Fabrication App 20130187289 - Cobbley; Chad A. ; et al.	2013-07-25
Methods of fabrication of package assemblies for optically interactive electronic devices and package assemblies therefor Grant 8,426,954 - Bolken , et al. April 23, 2	2013-04-23
Semiconductor device structures and electronic devices including same hybrid conductive vias Grant 8,344,514 - Cobbley , et al. January 1, 2	2013-01-01
Techniques For Packaging Multiple Device Components App 20120241956 - Bolken; Todd O. ; et al.	2012-09-27
Molded Stiffener for Thin Substrates App 20120187552 - Cobbley; Chad A. ; et al.	2012-07-26
Techniques for packaging multiple device components Grant 8,212,348 - Bolken , et al. July 3, 2	2012-07-03
Electronic Devices App 20120126386 - Bolken; Todd O. ; et al.	2012-05-24
Molded stiffener for thin substrates Grant 8,148,803 - Cobbley , et al. April 3, 2	2012-04-03
Electronic device package Grant 8,115,296 - Bolken , et al. February 14, 2	2012-02-14
Methods Of Fabrication Of Package Assemblies For Optically Interactive Electronic Devices And Package Assemblies Therefor App 20110298077 - Bolken; Todd O. ; et al.	2011-12-08
Methods of fabrication of package assemblies for optically interactive electronic devices and package assemblies therefor Grant 8,008,762 - Bolken , et al. August 30, 2	2011-08-30
Electrical interconnect using locally conductive adhesive Grant 7,998,305 - Cobbley , et al. August 16, 2	2011-08-16
Semiconductor Device Structures And Electronic Devices Including Same Hybrid Conductive Vias App 20110180936 - Cobbley; Chad A. ; et al.	2011-07-28
Methods of forming hybrid conductive vias including small dimension active surface ends and larger dimension back side ends Grant 7,939,449 - Cobbley , et al. May 10, 2	2011-05-10
Techniques For Packaging Multiple Device Components App 20100283151 - Bolken; Todd O. ; et al.	2010-11-11
Electrical interconnect using locally conductive adhesive Grant 7,829,190 - Cobbley , et al. November 9, 2	2010-11-09
Electronic Device Package App 20100264532 - Bolken; Todd O. ; et al.	2010-10-21
Techniques for packaging a multiple device component Grant 7,804,171 - Bolken , et al. September 28, 2	2010-09-28
Techniques for packaging multiple device components Grant 7,781,875 - Bolken , et al. August 24, 2	2010-08-24
Stacked die module including multiple adhesives that cure at different temperatures Grant 7,755,204 - Cobbley , et al. July 13, 2	2010-07-13
Apparatus for attaching solder balls to BGA package utilizing a tool to pick and dip the solder ball in flux Grant 7,644,853 - Cobbley , et al. January 12, 2	2010-01-12
System for locating conductive sphere utilizing screen and hopper of solder balls Grant 7,635,079 - Cobbley , et al. December 22, 2	2009-12-22
Hybrid Conductive Vias Including Small Dimension Active Surface Ends And Larger Dimension Back Side Ends, Semiconductor Devices Including The Same, And Associated Methods App 20090294983 - Cobbley; Chad A. ; et al.	2009-12-03
Methods for packaging image sensitive electronic devices Grant 7,553,688 - Bolken , et al. June 30, 2	2009-06-30
Apparatus for improving stencil/screen print quality Grant 7,476,277 - Jiang , et al. January 13, 2	2009-01-13
Stackable ball grid array Grant 7,459,773 - Bolken , et al. December 2, 2	2008-12-02
Molded stiffener for thin substrates Grant 7,423,331 - Cobbley , et al. September 9, 2	2008-09-09
Methods for packaging image sensitive electronic devices Grant 7,419,854 - Bolken , et al. September 2, 2	2008-09-02
Ball grid array packages with thermally conductive containers Grant 7,399,657 - Bolken , et al. July 15, 2	2008-07-15
Methods for packaging image sensitive electronic devices Grant 7,387,902 - Bolken , et al. June 17, 2	2008-06-17
Electrical Interconnect Using Locally Conductive Adhesive App 20080093019 - Cobbley; Chad A. ; et al.	2008-04-24
Method of encapsulating packaged microelectronic devices with a barrier Grant 7,332,376 - Cobbley February 19, 2	2008-02-19
Electrical interconnect using locally conductive adhesive Grant 7,326,316 - Cobbley , et al. February 5, 2	2008-02-05
Molded stiffener for thin substrates Grant 7,288,431 - Cobbley , et al. October 30, 2	2007-10-30
Apparatus for locating conductive spheres utilizing screen and hopper of solder balls Grant 7,275,676 - Cobbley , et al. October 2, 2	2007-10-02
Packages for semiconductor die Grant 7,239,029 - Bolken , et al. July 3, 2	2007-07-03
Techniques for packaging multiple device components App 20070145556 - Bolken; Todd O. ; et al.	2007-06-28
Semiconductor component having stacked, encapsulated dice and method of fabrication Grant 7,227,252 - Bolken , et al. June 5, 2	2007-06-05
Methods of fabrication of package assemblies for optically interactive electronic devices and package assemblies therefor App 20070108579 - Bolken; Todd O. ; et al.	2007-05-17
Stacked die module and techniques for forming a stacked die module Grant 7,217,596 - Cobbley , et al. May 15, 2	2007-05-15
Methods for packaging image sensitive electronic devices Grant 7,195,940 - Bolken , et al. March 27, 2	2007-03-27
Packaged microelectronic devices with interconnecting units and methods for manufacturing and using the interconnecting units App 20070063335 - Cobbley; Chad A.	2007-03-22
Stacked die module and techniques for forming a stacked die module Grant 7,186,576 - Cobbley , et al. March 6, 2	2007-03-06
Techniques for packaging multiple device components Grant 7,179,681 - Bolken , et al. February 20, 2	2007-02-20
Methods of fabrication of package assemblies for optically interactive electronic devices Grant 7,169,645 - Bolken , et al. January 30, 2	2007-01-30
Molded stiffener for thin substrates App 20060290011 - Cobbley; Chad A. ; et al.	2006-12-28
Packages for semiconductor die Grant 7,144,245 - Bolken , et al. December 5, 2	2006-12-05
Image sensitive electronic device packages App 20060267169 - Bolken; Todd O. ; et al.	2006-11-30
Techniques for packaging a multiple device component Grant 7,122,404 - Bolken , et al. October 17, 2	2006-10-17
Semiconductor component having encapsulated die stack Grant 7,109,576 - Bolken , et al. September 19, 2	2006-09-19
Method of locating conductive spheres utilizing screen and hopper of solder balls Grant 7,105,432 - Cobbley , et al. September 12, 2	2006-09-12
Method for in-line testing of flip-chip semiconductor assemblies Grant 7,105,366 - Cobbley , et al. September 12, 2	2006-09-12
Method of encapsulating interconnecting units in packaged microelectronic devices Grant 7,101,737 - Cobbley September 5, 2	2006-09-05
Method of manufacturing a stackable ball grid array Grant 7,101,730 - Bolken , et al. September 5, 2	2006-09-05
Packaged microelectronic devices with pressure release elements and methods for manufacturing and using such packaged microelectonic devices App 20060180907 - James; Stephen L. ; et al.	2006-08-17
Circuit and substrate encapsulation methods Grant 7,091,060 - Bolken , et al. August 15, 2	2006-08-15
Molding tool and a method of forming an electronic device package App 20060169490 - Bolken; Todd O. ; et al.	2006-08-03
Method for packaging flip-chip semiconductor assemblies Grant 7,074,648 - Cobbley , et al. July 11, 2	2006-07-11
Packaged microelectronic devices with pressure release elements and methods for manufacturing and using such packaged microelectronic devices Grant 7,049,685 - James , et al. May 23, 2	2006-05-23
Stacked die module and techniques for forming a stacked die module Grant 7,029,931 - Cobbley , et al. April 18, 2	2006-04-18
Moisture-resistant electronic device package and methods of assembly Grant 7,026,548 - Bolken , et al. April 11, 2	2006-04-11
Molded stiffener for thin substrates App 20060068527 - Cobbley; Chad A. ; et al.	2006-03-30
Stackable ball grid array Grant 7,019,408 - Bolken , et al. March 28, 2	2006-03-28
Stacked die module and techniques for forming a stacked die module App 20060063283 - Cobbley; Chad A. ; et al.	2006-03-23
Stackable ball grid array App 20060055020 - Bolken; Todd O. ; et al.	2006-03-16
Methods for packaging image sensitive electronic devices App 20060051891 - Bolken; Todd O. ; et al.	2006-03-09
Methods for packaging image sensitive electronic devices App 20060051892 - Bolken; Todd O. ; et al.	2006-03-09
Methods for packaging image sensitive electronic devices App 20060051890 - Bolken; Todd O. ; et al.	2006-03-09
Method for fabricating semiconductor component having stacked, encapsulated dice Grant 7,008,822 - Bolken , et al. March 7, 2	2006-03-07
Methods for packaging image sensitive electronic devices App 20060046351 - Bolken; Todd O. ; et al.	2006-03-02
Method for in-line testing of flip-chip semiconductor assemblies Grant 7,005,878 - Cobbley , et al. February 28, 2	2006-02-28
Apparatus for attaching solder balls to BGA package utilizing a tool to pick and dip the solder ball in flux App 20060027624 - Cobbley; Chad A. ; et al.	2006-02-09
Image sensor packages Grant 6,995,462 - Bolken , et al. February 7, 2	2006-02-07
Microelectronic imagers with optics supports having threadless interfaces and methods for manufacturing such microelectronic imagers App 20060023107 - Bolken; Todd O. ; et al.	2006-02-02
Semiconductor component having stacked, encapsulated dice and method of fabrication App 20060006518 - Bolken; Todd O. ; et al.	2006-01-12
Electrical interconnect using locally conductive adhesive App 20060003157 - Cobbley; Chad A. ; et al.	2006-01-05
Method for in-line testing of flip-chip semiconductor assemblies Grant 6,982,177 - Cobbley , et al. January 3, 2	2006-01-03
Packaged microelectronic devices with pressure release elements and methods for manufacturing and using such packaged microelectronic devices Grant 6,979,595 - James , et al. December 27, 2	2005-12-27
Method for manufacturing flip-chip semiconductor assembly Grant 6,972,200 - Cobbley , et al. December 6, 2	2005-12-06
Moisture-resistant Electronic Device Package And Methods Of Assembly App 20050263312 - Bolken, Todd O. ; et al.	2005-12-01
Method for in-line testing of flip-chip semiconductor assemblies Grant 6,967,113 - Cobbley , et al. November 22, 2	2005-11-22
Semiconductor dice packages employing at least one redistribution layer Grant 6,965,160 - Cobbley , et al. November 15, 2	2005-11-15
Method for in-line testing of flip-chip semiconductor assemblies Grant 6,962,826 - Cobbley , et al. November 8, 2	2005-11-08
Apparatus for attaching solder balls to BGA package utilizing a tool to pick and dip the solder ball in flux Grant 6,957,760 - Cobbley , et al. October 25, 2	2005-10-25
Moisture-resistant electronic device package and methods of assembly Grant 6,953,891 - Bolken , et al. October 11, 2	2005-10-11
Method for in-line testing of flip-chip semiconductor assemblies Grant 6,953,699 - Cobbley , et al. October 11, 2	2005-10-11
Method for in-line testing of flip-chip semiconductor assemblies Grant 6,953,700 - Cobbley , et al. October 11, 2	2005-10-11
Method for in-line testing of flip-chip semiconductor assemblies Grant 6,954,081 - Cobbley , et al. October 11, 2	2005-10-11
Electrical interconnect using locally conductive adhesive Grant 6,951,684 - Cobbley , et al. October 4, 2	2005-10-04
Method for in-line testing of flip-chip semiconductor assemblies Grant 6,949,943 - Cobbley , et al. September 27, 2	2005-09-27
Methods of fabrication of package assemblies for optically interactive electronic devices App 20050191787 - Bolken, Todd O. ; et al.	2005-09-01
Apparatus for improving stencil/screen print quality App 20050145169 - Jiang, Tongbi ; et al.	2005-07-07
Method of disposing conductive bumps onto a semiconductor device and semiconductor devices so formed App 20050142835 - Ball, Michael B. ; et al.	2005-06-30
Sealed electronic device packages with transparent coverings Grant 6,906,403 - Bolken , et al. June 14, 2	2005-06-14
Packages for image sensitive electronic devices App 20050116355 - Bolken, Todd O. ; et al.	2005-06-02
Method of packaging semiconductor dice employing at least one redistribution layer Grant 6,897,096 - Cobbley , et al. May 24, 2	2005-05-24
Techniques for packaging multiple device components App 20050106779 - Bolken, Todd O. ; et al.	2005-05-19
Moisture-resistant electronic device package and methods of assembly App 20050057883 - Bolken, Todd O. ; et al.	2005-03-17
Method of locating conductive spheres utilizing screen and hopper of solder balls App 20050056682 - Cobbley, Chad A. ; et al.	2005-03-17
Image sensor packages and methods of fabrication App 20050059188 - Bolken, Todd O. ; et al.	2005-03-17
Packaged microelectronic devices with interconnecting units and methods for manufacturing and using the interconnecting units App 20050056919 - Cobbley, Chad A.	2005-03-17
Method of locating conductive spheres utilizing screen and hopper of solder balls App 20050056681 - Cobbley, Chad A. ; et al.	2005-03-17
Method of disposing conductive bumps onto a semiconductor device Grant 6,861,345 - Ball , et al. March 1, 2	2005-03-01
Techniques for packaging multiple device components Grant 6,856,009 - Bolken , et al. February 15, 2	2005-02-15
Molded stiffener for thin substrates App 20050029549 - Cobbley, Chad A. ; et al.	2005-02-10
Semiconductor component having stacked, encapsulated dice Grant 6,853,064 - Bolken , et al. February 8, 2	2005-02-08
Method for in-line testing of flip-chip semiconductor assemblies App 20050024080 - Cobbley, Chad A. ; et al.	2005-02-03
Techniques for packaging a multiple device component App 20050023662 - Bolken, Todd O. ; et al.	2005-02-03
Method of manufacturing a stackable ball grid array App 20050019983 - Bolken, Todd O. ; et al.	2005-01-27
Method of attaching solder balls to BGA package utilizing a tool to pick and dip the solder ball in flux Grant 6,844,216 - Cobbley , et al. January 18, 2	2005-01-18
Method for in-line testing of flip-chip semiconductor assemblies App 20050007141 - Cobbley, Chad A. ; et al.	2005-01-13
Method for in-line testing of flip-chip semiconductor assemblies App 20050007142 - Cobbley, Chad A. ; et al.	2005-01-13
Packaged microelectronic devices with interconnecting units Grant 6,838,760 - Cobbley January 4, 2	2005-01-04
Method for in-line testing of flip-chip semiconductor assemblies App 20040263196 - Cobbley, Chad A. ; et al.	2004-12-30
Method for in-line testing of flip-chip semiconductor assemblies App 20040263197 - Cobbley, Chad A. ; et al.	2004-12-30
Method for in-line testing of flip-chip semiconductor assemblies App 20040263195 - Cobbley, Chad A. ; et al.	2004-12-30
Electrical interconnect using locally conductive adhesive App 20040232391 - Cobbley, Chad A. ; et al.	2004-11-25
Semiconductor component having encapsulated die stack App 20040227240 - Bolken, Todd O. ; et al.	2004-11-18
Semiconductor Component Having Stacked, Encapsulated Dice App 20040227250 - Bolken, Todd O. ; et al.	2004-11-18
Method for fabricating semiconductor component having stacked, encapsulated dice App 20040229401 - Bolken, Todd O. ; et al.	2004-11-18
Electrical interconnect using locally conductive adhesive App 20040229032 - Cobbley, Chad A. ; et al.	2004-11-18
Electrical interconnect using locally conductive adhesive App 20040209497 - Cobbley, Chad A. ; et al.	2004-10-21
Thin stacked ball-grid array package Grant 6,798,057 - Bolkin , et al. September 28, 2	2004-09-28
Automated method of attaching flip-chip devices to a substrate Grant 6,793,749 - Fogal , et al. September 21, 2	2004-09-21
Techniques for packaging a multiple device component App 20040178482 - Bolken, Todd O. ; et al.	2004-09-16
Techniques for packaging multiple device components App 20040178488 - Bolken, Todd O. ; et al.	2004-09-16
Stackable ball grid array App 20040164412 - Bolken, Todd O. ; et al.	2004-08-26
Electrical interconnect using locally conductive adhesive Grant 6,777,071 - Cobbley , et al. August 17, 2	2004-08-17
Stackable ball grid array Grant 6,778,404 - Bolken , et al. August 17, 2	2004-08-17
Stacked die module and techniques for forming a stacked die module App 20040154956 - Cobbley, Chad A. ; et al.	2004-08-12
Stacked die module and techniques for forming a stacked die module App 20040155327 - Cobbley, Chad A. ; et al.	2004-08-12
Stacked die module and techniques for forming a stacked die module App 20040157373 - Cobbley, Chad A. ; et al.	2004-08-12
Stacked die module and techniques for forming a stacked die module App 20040154722 - Cobbley, Chad A. ; et al.	2004-08-12
Automated method of attaching flip chip devices to a substrate Grant 6,773,523 - Fogal , et al. August 10, 2	2004-08-10
Packages for semiconductor die App 20040119173 - Bolken, Todd O. ; et al.	2004-06-24
Process for manufacturing flip-chip semiconductor assembly Grant 6,750,070 - Cobbley , et al. June 15, 2	2004-06-15
Stencil/screen print apparatus App 20040107902 - Jiang, Tongbi ; et al.	2004-06-10
Method for in-line testing of flip-chip semiconductor assemblies App 20040104741 - Cobbley, Chad A. ; et al.	2004-06-03
Method for packaging flip-chip semiconductor assemblies App 20040097009 - Cobbley, Chad A. ; et al.	2004-05-20
Apparatus for improving stencil/screen print quality App 20040089171 - Jiang, Tongbi ; et al.	2004-05-13
Methods and apparatus for a thin stacked ball-grid array package App 20040084771 - Bolken, Todd O. ; et al.	2004-05-06
Method for manufacturing flip-chip semiconductor assembly App 20040080332 - Cobbley, Chad A. ; et al.	2004-04-29
Stacked die module and techniques for forming a stacked die module App 20040056342 - Cobbley, Chad A. ; et al.	2004-03-25
Methods for use in packaging applications using an adhesive composition Grant 6,709,896 - Cobbley , et al. March 23, 2	2004-03-23
Adhesive composition for use in packaging applications Grant 6,699,928 - Cobbley , et al. March 2, 2	2004-03-02
Method of packaging semiconductor dice employing at least one redistribution layer App 20040033673 - Cobbley, Chad A. ; et al.	2004-02-19
Semiconductor dice packages employing at least one redistribution layer and methods of fabrication App 20040032013 - Cobbley, Chad A. ; et al.	2004-02-19
Stacked die module and techniques for forming a stacked die module Grant 6,682,955 - Cobbley , et al. January 27, 2	2004-01-27
Method and apparatus for improving stencil/screen print quality Grant 6,669,781 - Jiang , et al. December 30, 2	2003-12-30
Method and apparatus for packaging microelectronic substrates App 20030235663 - Williams, Vernon M. ; et al.	2003-12-25
Methods for packaging image sensitive electronic devices App 20030232461 - Bolken, Todd O. ; et al.	2003-12-18
Semiconductor package with molded flash Grant 6,660,558 - Bolken , et al. December 9, 2	2003-12-09
Sealed Electronic Device Packages With Transparent Coverings App 20030222333 - Bolken, Todd O. ; et al.	2003-12-04
Method and apparatus for packaging microelectronic substrates App 20030209831 - Williams, Vernon M. ; et al.	2003-11-13
Stacked die module and techniques for forming a stacked die module App 20030211655 - Cobbley, Chad A. ; et al.	2003-11-13
Adhesive composition and methods for use in packaging applications Grant 6,646,354 - Cobbley , et al. November 11, 2	2003-11-11
Method and apparatus for improving stencil/screen print quality Grant 6,641,669 - Jiang , et al. November 4, 2	2003-11-04
Electrical interconnect using locally conductive adhesive App 20030203668 - Cobbley, Chad A. ; et al.	2003-10-30
Packages for semiconductor die App 20030201526 - Bolken, Todd O. ; et al.	2003-10-30
Molded stiffener for thin substrates App 20030155636 - Cobbley, Chad A. ; et al.	2003-08-21
Apparatus for improving stencil/screen print quality Grant 6,607,599 - Jiang , et al. August 19, 2	2003-08-19
Method for in-line testing of flip-chip semiconductor assemblies App 20030141888 - Cobbley, Chad A. ; et al.	2003-07-31
Apparatus for improving stencil/screen print quality Grant 6,599,365 - Jiang , et al. July 29, 2	2003-07-29
Method for in-line testing of flip-chip semiconductor assemblies App 20030132776 - Cobbley, Chad A. ; et al.	2003-07-17
Method of attaching solder balls to BGA package utilizing a tool to pick and dip the solder ball in flux App 20030121957 - Cobbley, Chad A. ; et al.	2003-07-03
Method And Apparatus For Improving Stencil/screen Print Quality App 20030121473 - JIANG, TONGBI ; et al.	2003-07-03
Adhesive Composition For Use In Packaging Applications App 20030122226 - COBBLEY, CHAD A. ; et al.	2003-07-03
Automated method of attaching flip chip devices to a substrate App 20030111154 - Fogal, Rich ; et al.	2003-06-19
Method of locating conductive spheres utilizing screen and hopper of solder balls App 20030110626 - Cobbley, Chad A. ; et al.	2003-06-19
Apparatus for attaching solder balls to BGA package utilizing a tool to pick and dip the solder ball in flux App 20030111508 - Cobbley, Chad A. ; et al.	2003-06-19
Packages for semiconductor die App 20030098514 - Bolken, Todd O. ; et al.	2003-05-29
Ball grid array packages with thermally conductive containers Grant 6,559,537 - Bolken , et al. May 6, 2	2003-05-06
Method for manufacturing flip-chip semiconductor assembly App 20030054587 - Cobbley, Chad A. ; et al.	2003-03-20
Packages for semiconductor die Grant 6,518,654 - Bolken , et al. February 11, 2	2003-02-11
Ball grid array packages with thermally conductive containers App 20020187590 - Bolken, Todd O. ; et al.	2002-12-12
Packaged microelectronic devices with pressure release elements and methods for manufacturing and using such packaged microelectronic devices App 20020175399 - James, Stephen L. ; et al.	2002-11-28
Method of depositing a thermoplastic polymer in semiconductor fabrication Grant 6,440,777 - Cobbley , et al. August 27, 2	2002-08-27
Automated method of attaching flip chip devices to a substrate App 20020092595 - Fogal, Rich ; et al.	2002-07-18
Adhesive composition for use in packaging applications App 20020068379 - Cobbley, Chad A. ; et al.	2002-06-06
Method for manufactoring and using stencil/screen Grant 6,368,897 - Jiang , et al. April 9, 2	2002-04-09
Method for in-line testing of flip-chip semiconductor assemblies App 20020003434 - Cobbley, Chad A. ; et al.	2002-01-10
Method and apparatus for improving stencil/screen print quality App 20010053415 - Jiang, Tongbi ; et al.	2001-12-20
Method for in-line testing of flip-chip semiconductor assemblies Grant 6,329,832 - Cobbley , et al. December 11, 2	2001-12-11
Method for in-line testing of flip-chip semiconductor assemblies App 20010043077 - Cobbley, Chad A. ; et al.	2001-11-22
Method of locating conductive spheres utilizing screen and hopper of solder balls App 20010041437 - Cobbley, Chad A. ; et al.	2001-11-15
Method of depositing a thermoplastic polymer in semiconductor fabrication App 20010012680 - Cobbley, Chad A. ; et al.	2001-08-09
Method of locating conductive spheres utilizing screen and hopper of solder balls Grant 6,268,275 - Cobbley , et al. July 31, 2	2001-07-31
Method of disposing conductive bumps onto a semiconductor device and semiconductor devices so formed App 20010002044 - Ball, Michael B. ; et al.	2001-05-31
Method of depositing a thermoplastic polymer in semiconductor fabrication Grant 6,238,223 - Cobbley , et al. May 29, 2	2001-05-29
Semiconductor die back side surface and method of fabrication Grant 6,184,064 - Jiang , et al. February 6, 2	2001-02-06