Bolken; Todd O.

Patent Applications and Registrations

Patent applications and USPTO patent grants for Bolken; Todd O..The latest application filed is for "semiconductor device assembly with through-package interconnect and associated systems, devices, and methods".

Company Profile

1.84.90

Bolken; Todd O. - Eagle ID
Bolken; Todd O. - Eale ID
Bolken; Todd O. - Star ID
Bolken; Todd O. - Meridian ID

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Semiconductor device assembly with through-package interconnect and associated systems, devices, and methods Grant 11,456,286 - Yoo , et al. September 27, 2	2022-09-27
Semiconductor Device Assembly With Through-package Interconnect And Associated Systems, Devices, And Methods App 20200243493 - Yoo; Chan ; et al.	2020-07-30
Semiconductor device assembly with through-package interconnect and associated systems, devices, and methods Grant 10,615,154 - Yoo , et al.	2020-04-07
Semiconductor Device Assembly With Through-package Interconnect And Associated Systems, Devices, And Methods App 20180226387 - Yoo; Chan ; et al.	2018-08-09
Method of assembly semiconductor device with through-package interconnect Grant 9,978,730 - Yoo , et al. May 22, 2	2018-05-22
Semiconductor Device Assembly With Through-package Interconnect And Associated Systems, Devices, And Methods App 20170040303 - Yoo; Chan ; et al.	2017-02-09
Techniques for packaging multiple device components Grant 9,559,087 - Bolken , et al. January 31, 2	2017-01-31
Semiconductor device assembly with package interconnect extending into overlying spacer material, and associated systems, devices, and methods Grant 9,508,686 - Yoo , et al. November 29, 2	2016-11-29
Semiconductor Device Assembly With Through-package Interconnect And Associated Systems, Devices And Methods App 20150137365 - Yoo; Chan ; et al.	2015-05-21
Semiconductor device with molded casing and package interconnect extending therethrough, and associated systems, devices, and methods Grant 8,906,743 - Yoo , et al. December 9, 2	2014-12-09
Semiconductor Device Assembly With Through-package Interconnect And Associated Systems, Devices, And Methods App 20140197526 - Yoo; Chan ; et al.	2014-07-17
Techniques For Packaging Multiple Device Components App 20140099753 - Bolken; Todd O. ; et al.	2014-04-10
Techniques for packaging multiple device components Grant 8,629,558 - Bolken , et al. January 14, 2	2014-01-14
Methods of fabrication of package assemblies for optically interactive electronic devices and package assemblies therefor Grant 8,624,371 - Bolken , et al. January 7, 2	2014-01-07
Methods Of Fabrication Of Package Assemblies For Optically Interactive Electronic Devices And Package Assemblies Therefor App 20130234275 - Bolken; Todd O. ; et al.	2013-09-12
Electronic devices Grant 8,508,034 - Bolken , et al. August 13, 2	2013-08-13
Methods of fabrication of package assemblies for optically interactive electronic devices and package assemblies therefor Grant 8,426,954 - Bolken , et al. April 23, 2	2013-04-23
Techniques For Packaging Multiple Device Components App 20120241956 - Bolken; Todd O. ; et al.	2012-09-27
Techniques for packaging multiple device components Grant 8,212,348 - Bolken , et al. July 3, 2	2012-07-03
Electronic Devices App 20120126386 - Bolken; Todd O. ; et al.	2012-05-24
Electronic device package Grant 8,115,296 - Bolken , et al. February 14, 2	2012-02-14
Methods Of Fabrication Of Package Assemblies For Optically Interactive Electronic Devices And Package Assemblies Therefor App 20110298077 - Bolken; Todd O. ; et al.	2011-12-08
Methods of fabrication of package assemblies for optically interactive electronic devices and package assemblies therefor Grant 8,008,762 - Bolken , et al. August 30, 2	2011-08-30
Techniques For Packaging Multiple Device Components App 20100283151 - Bolken; Todd O. ; et al.	2010-11-11
Electronic Device Package App 20100264532 - Bolken; Todd O. ; et al.	2010-10-21
Techniques for packaging a multiple device component Grant 7,804,171 - Bolken , et al. September 28, 2	2010-09-28
Interposers for semiconductor die packages with standard ball grill array footprint Grant 7,791,205 - Bolken September 7, 2	2010-09-07
Techniques for packaging multiple device components Grant 7,781,875 - Bolken , et al. August 24, 2	2010-08-24
Overmolding encapsulation process and encapsulated article made therefrom Grant 7,655,508 - Johnson , et al. February 2, 2	2010-02-02
Apparatus for molding a semiconductor die package with enhanced thermal conductivity Grant 7,642,643 - Hall , et al. January 5, 2	2010-01-05
Imager wafer level module and method of fabrication and use App 20090206431 - Bolken; Todd O. ; et al.	2009-08-20
Assemblies with bond pads of two or more semiconductor devices electrically connected to the same surface of a plurality of leads Grant 7,557,454 - Bolken July 7, 2	2009-07-07
Methods for packaging image sensitive electronic devices Grant 7,553,688 - Bolken , et al. June 30, 2	2009-06-30
Stackable ball grid array Grant 7,459,773 - Bolken , et al. December 2, 2	2008-12-02
Methods for packaging image sensitive electronic devices Grant 7,419,854 - Bolken , et al. September 2, 2	2008-09-02
Ball grid array packages with thermally conductive containers Grant 7,399,657 - Bolken , et al. July 15, 2	2008-07-15
Methods for packaging image sensitive electronic devices Grant 7,387,902 - Bolken , et al. June 17, 2	2008-06-17
Spacers for separating components of semiconductor device assemblies, semiconductor device assemblies and systems including spacers and methods of making spacers App 20080054429 - Bolken; Todd O. ; et al.	2008-03-06
Method for two-stage transfer molding device to encapsulate MMC module Grant 7,288,441 - Bolken October 30, 2	2007-10-30
Method for assembling semiconductor die packages with standard ball grid array footprint Grant 7,279,366 - Bolken October 9, 2	2007-10-09
Two-stage transfer molding device to encapsulate MMC module Grant 7,279,781 - Bolken October 9, 2	2007-10-09
Semiconductor assembly encapsulation mold and method for forming same Grant 7,247,521 - Bolken July 24, 2	2007-07-24
Packages for semiconductor die Grant 7,239,029 - Bolken , et al. July 3, 2	2007-07-03
Techniques for packaging multiple device components App 20070145556 - Bolken; Todd O. ; et al.	2007-06-28
Semiconductor component having stacked, encapsulated dice and method of fabrication Grant 7,227,252 - Bolken , et al. June 5, 2	2007-06-05
Alternative method used to package multimedia card by transfer molding Grant 7,220,615 - Bolken May 22, 2	2007-05-22
Methods of fabrication of package assemblies for optically interactive electronic devices and package assemblies therefor App 20070108579 - Bolken; Todd O. ; et al.	2007-05-17
Methods for packaging image sensitive electronic devices Grant 7,195,940 - Bolken , et al. March 27, 2	2007-03-27
Techniques for packaging multiple device components Grant 7,179,681 - Bolken , et al. February 20, 2	2007-02-20
Methods of fabrication of package assemblies for optically interactive electronic devices Grant 7,169,645 - Bolken , et al. January 30, 2	2007-01-30
Apparatus for encapsulating a multi-chip substrate array Grant 7,156,633 - Bolken , et al. January 2, 2	2007-01-02
Packages for semiconductor die Grant 7,144,245 - Bolken , et al. December 5, 2	2006-12-05
Image sensitive electronic device packages App 20060267169 - Bolken; Todd O. ; et al.	2006-11-30
Techniques for packaging a multiple device component Grant 7,122,404 - Bolken , et al. October 17, 2	2006-10-17
Semiconductor component having encapsulated die stack Grant 7,109,576 - Bolken , et al. September 19, 2	2006-09-19
Method of manufacturing a stackable ball grid array Grant 7,101,730 - Bolken , et al. September 5, 2	2006-09-05
Circuit and substrate encapsulation methods Grant 7,091,060 - Bolken , et al. August 15, 2	2006-08-15
Molding tool and a method of forming an electronic device package App 20060169490 - Bolken; Todd O. ; et al.	2006-08-03
Multimedia card and transfer molding method App 20060157838 - Bolken; Todd O.	2006-07-20
Method for two-stage transfer molding device to encapsulate MMC module App 20060110850 - Bolken; Todd O.	2006-05-25
Moisture-resistant electronic device package and methods of assembly Grant 7,026,548 - Bolken , et al. April 11, 2	2006-04-11
Stackable ball grid array Grant 7,019,408 - Bolken , et al. March 28, 2	2006-03-28
Stackable ball grid array App 20060055020 - Bolken; Todd O. ; et al.	2006-03-16
Methods for packaging image sensitive electronic devices App 20060051891 - Bolken; Todd O. ; et al.	2006-03-09
Methods for packaging image sensitive electronic devices App 20060051890 - Bolken; Todd O. ; et al.	2006-03-09
Methods for packaging image sensitive electronic devices App 20060051892 - Bolken; Todd O. ; et al.	2006-03-09
Method for fabricating semiconductor component having stacked, encapsulated dice Grant 7,008,822 - Bolken , et al. March 7, 2	2006-03-07
Methods for packaging image sensitive electronic devices App 20060046351 - Bolken; Todd O. ; et al.	2006-03-02
Image sensor packages Grant 6,995,462 - Bolken , et al. February 7, 2	2006-02-07
Microelectronic imagers with optics supports having threadless interfaces and methods for manufacturing such microelectronic imagers App 20060023107 - Bolken; Todd O. ; et al.	2006-02-02
Semiconductor component having stacked, encapsulated dice and method of fabrication App 20060006518 - Bolken; Todd O. ; et al.	2006-01-12
Electronic device package App 20050287716 - Moden, Walter L. ; et al.	2005-12-29
Apparatus for molding a semiconductor die package with enhanced thermal conductivity App 20050280143 - Hall, Frank L. ; et al.	2005-12-22
Moisture-resistant Electronic Device Package And Methods Of Assembly App 20050263312 - Bolken, Todd O. ; et al.	2005-12-01
Method for assembling semiconductor die packages with standard ball grid array footprint App 20050255637 - Bolken, Todd O.	2005-11-17
Assemblies with bond pads of two or more semiconductor devices electrically connected to the same surface of a plurality of leads App 20050248013 - Bolken, Todd O.	2005-11-10
Flip chip integrated package mount support Grant 6,963,142 - Bolken November 8, 2	2005-11-08
Methods and apparatus for packaging semiconductor devices Grant 6,955,941 - Bolken October 18, 2	2005-10-18
Moisture-resistant electronic device package and methods of assembly Grant 6,953,891 - Bolken , et al. October 11, 2	2005-10-11
Asymmetric transfer molding method and an asymmetric encapsulation made therefrom Grant 6,951,981 - Johnson , et al. October 4, 2	2005-10-04
Method for assembling semiconductor die packages with standard ball grid array footprint Grant 6,939,746 - Bolken September 6, 2	2005-09-06
Apparatus for encapsulating a multi-chip substrate array App 20050189642 - Bolken, Todd O. ; et al.	2005-09-01
Methods of fabrication of package assemblies for optically interactive electronic devices App 20050191787 - Bolken, Todd O. ; et al.	2005-09-01
Methods of fabricating a molded ball grid array Grant 6,916,683 - Stephenson , et al. July 12, 2	2005-07-12
Apparatus for encapsulating a multi-chip substrate array Grant 6,910,874 - Bolken , et al. June 28, 2	2005-06-28
Sealed electronic device packages with transparent coverings Grant 6,906,403 - Bolken , et al. June 14, 2	2005-06-14
Packages for image sensitive electronic devices App 20050116355 - Bolken, Todd O. ; et al.	2005-06-02
Techniques for packaging multiple device components App 20050106779 - Bolken, Todd O. ; et al.	2005-05-19
Moisture-resistant electronic device package and methods of assembly App 20050057883 - Bolken, Todd O. ; et al.	2005-03-17
Image sensor packages and methods of fabrication App 20050059188 - Bolken, Todd O. ; et al.	2005-03-17
Techniques for packaging multiple device components Grant 6,856,009 - Bolken , et al. February 15, 2	2005-02-15
Molded ball grid array App 20050029554 - Stephenson, William R. ; et al.	2005-02-10
Semiconductor component having stacked, encapsulated dice Grant 6,853,064 - Bolken , et al. February 8, 2	2005-02-08
Techniques for packaging a multiple device component App 20050023662 - Bolken, Todd O. ; et al.	2005-02-03
Apparatus used to package multimedia card by transfer molding App 20050022378 - Bolken, Todd O.	2005-02-03
Multi media card formed by transfer molding App 20050023583 - Bolken, Todd O.	2005-02-03
Method of manufacturing a stackable ball grid array App 20050019983 - Bolken, Todd O. ; et al.	2005-01-27
Semiconductor assembly encapsulation mold and method for forming same App 20050012227 - Bolken, Todd O.	2005-01-20
Semiconductor assembly encapsulation mold and method for forming same Grant 6,841,424 - Bolken January 11, 2	2005-01-11
Overmolding encapsulation process and encapsulated article made therefrom App 20040266069 - Johnson, Mark S. ; et al.	2004-12-30
Methods for molding a semiconductor die package with enhanced thermal conductivity Grant 6,835,592 - Hall , et al. December 28, 2	2004-12-28
Semiconductor component having encapsulated die stack App 20040227240 - Bolken, Todd O. ; et al.	2004-11-18
Semiconductor Component Having Stacked, Encapsulated Dice App 20040227250 - Bolken, Todd O. ; et al.	2004-11-18
Method for fabricating semiconductor component having stacked, encapsulated dice App 20040229401 - Bolken, Todd O. ; et al.	2004-11-18
Apparatus and method for molding a semiconductor die package with enhanced thermal conductivity App 20040217389 - Hall, Frank L. ; et al.	2004-11-04
Techniques for packaging a multiple device component App 20040178482 - Bolken, Todd O. ; et al.	2004-09-16
Techniques for packaging multiple device components App 20040178488 - Bolken, Todd O. ; et al.	2004-09-16
Exposed die molding apparatus App 20040173941 - Bolken, Todd O.	2004-09-09
Two-stage transfer molding device to encapsulate MMC module App 20040169265 - Bolken, Todd O.	2004-09-02
Stackable ball grid array App 20040164412 - Bolken, Todd O. ; et al.	2004-08-26
Stackable ball grid array Grant 6,778,404 - Bolken , et al. August 17, 2	2004-08-17
Two-stage transfer molding method to encapsulate MMC module Grant 6,764,882 - Bolken July 20, 2	2004-07-20
Semiconductor assembly encapsulation mold App 20040126933 - Bolken, Todd O.	2004-07-01
Packages for semiconductor die App 20040119173 - Bolken, Todd O. ; et al.	2004-06-24
Method for encapsulating a multi-chip substrate array Grant 6,746,895 - Bolken , et al. June 8, 2	2004-06-08
Exposed die molding apparatus Grant 6,747,345 - Bolken June 8, 2	2004-06-08
Semiconductor assembly encapsulation mold Grant 6,734,571 - Bolken May 11, 2	2004-05-11
Methods and apparatus for a thin stacked ball-grid array package App 20040084771 - Bolken, Todd O. ; et al.	2004-05-06
Two-stage transfer molding device to encapsulate MMC module Grant 6,730,995 - Bolken May 4, 2	2004-05-04
Method and apparatus for packaging a microelectronic die Grant 6,683,388 - Bolken January 27, 2	2004-01-27
Microelectronic devices and microelectronic die packages Grant 6,677,675 - Bolken January 13, 2	2004-01-13
Methods for packaging image sensitive electronic devices App 20030232461 - Bolken, Todd O. ; et al.	2003-12-18
Method and apparatus for packaging a microelectronic die Grant 6,664,139 - Bolken December 16, 2	2003-12-16
Semiconductor package with molded flash Grant 6,660,558 - Bolken , et al. December 9, 2	2003-12-09
Electronic device package App 20030223181 - Moden, Walter L. ; et al.	2003-12-04
Sealed Electronic Device Packages With Transparent Coverings App 20030222333 - Bolken, Todd O. ; et al.	2003-12-04
Apparatus and method for molding a semiconductor die package with enhanced thermal conductivity App 20030218237 - Hall, Frank L. ; et al.	2003-11-27
Method and apparatus for packaging a microelectronic die Grant 6,653,173 - Bolken November 25, 2	2003-11-25
Apparatus for reduced flash encapsulation of microelectronic devices Grant 6,644,949 - Rumsey , et al. November 11, 2	2003-11-11
Packages for semiconductor die App 20030201526 - Bolken, Todd O. ; et al.	2003-10-30
Method and apparatus for reduced flash encapsulation of microelectronic devices Grant 6,638,595 - Rumsey , et al. October 28, 2	2003-10-28
Semiconductor die packages with standard ball grid array footprint and method for assembling the same App 20030183950 - Bolken, Todd O.	2003-10-02
Method for encapsulating a multi-chip substrate array App 20030178748 - Bolken, Todd O. ; et al.	2003-09-25
Methods and apparatus for packaging semiconductor devices App 20030170932 - Bolken, Todd O.	2003-09-11
Asymmetric transfer molding method and an asymmetric encapsulation made therefrom Grant 6,605,331 - Johnson , et al. August 12, 2	2003-08-12
Two-stage transfer molding method to encapsulate MMC module App 20030137060 - Bolken, Todd O.	2003-07-24
Packages for semiconductor die App 20030098514 - Bolken, Todd O. ; et al.	2003-05-29
Asymmetric transfer molding method and an asymmetric encapsulation made therefrom App 20030086994 - Johnson, Mark S. ; et al.	2003-05-08
Ball grid array packages with thermally conductive containers Grant 6,559,537 - Bolken , et al. May 6, 2	2003-05-06
Flip chip integrated package mount support App 20030080441 - Bolken, Todd O.	2003-05-01
Semiconductor die packages with standard ball grid array footprint and method for assembling the same App 20030038376 - Bolken, Todd O.	2003-02-27
Interposer Utilizing A Perimeter Wall To Underfill The Area Between A Flip Chip And The Interposer App 20030038381 - Bolken, Todd O.	2003-02-27
Controlling packaging encapsulant leakage Grant 6,521,980 - Tandy , et al. February 18, 2	2003-02-18
Packages for semiconductor die Grant 6,518,654 - Bolken , et al. February 11, 2	2003-02-11
Molded ball grid array App 20020195708 - Stephenson, William R. ; et al.	2002-12-26
Two-stage transfer molding method to encapsulate MMC module App 20020190429 - Bolken, Todd O.	2002-12-19
Alternative method used to package multi media card by transfer molding App 20020186549 - Bolken, Todd O.	2002-12-12
Two-stage Transfer Molding Method To Encapsulate Mmc Module App 20020187584 - Bolken, Todd O.	2002-12-12
Ball grid array packages with thermally conductive containers App 20020187590 - Bolken, Todd O. ; et al.	2002-12-12
Method and apparatus for encapsulating a multi-chip substrate array App 20020173070 - Bolken, Todd O. ; et al.	2002-11-21
Semiconductor card and method of fabrication Grant 6,462,273 - Corisis , et al. October 8, 2	2002-10-08
Semiconductor Card And Method Of Fabrication App 20020131251 - Corisis, David J. ; et al.	2002-09-19
Molded ball grid array App 20020121695 - Stephenson, William R. ; et al.	2002-09-05
Semiconductor assembly encapsulation mold App 20020096789 - Bolken, Todd O.	2002-07-25
Overmolding encapsulation process and encapsulated article made therefrom App 20020076859 - Johnson, Mark S. ; et al.	2002-06-20
Molded ball grid array Grant 6,400,574 - Stephenson , et al. June 4, 2	2002-06-04
Controlling packaging encapsulant leakage Grant 6,395,579 - Tandy , et al. May 28, 2	2002-05-28
Method and apparatus for packaging a microelectronic die App 20020050654 - Bolken, Todd O.	2002-05-02
Method and apparatus for packaging a microelectronic die App 20020052063 - Bolken, Todd O.	2002-05-02
Method and apparatus for packaging a microelectronic die App 20020048843 - Bolken, Todd O.	2002-04-25
Method and apparatus for packaging a microelectronic die App 20020016023 - Bolken, Todd O.	2002-02-07
Method and apparatus for reduced flash encapsulation of microelectronic devices App 20020000675 - Rumsey, Brad D. ; et al.	2002-01-03
Method and apparatus for reduced flash encapsulation of microelectronic devices App 20020001883 - Rumsey, Brad D. ; et al.	2002-01-03
Molded ball grid array App 20010046724 - Stephenson, William R. ; et al.	2001-11-29
Asymmetrical mold of multiple-part matrixes Grant 6,294,825 - Bolken , et al. September 25, 2	2001-09-25
Controlling packaging encapsulant leakage App 20010008780 - Tandy, Patrick W. ; et al.	2001-07-19
Controlling packaging encapsulant leakage Grant 6,210,992 - Tandy , et al. April 3, 2	2001-04-03
Asymmetric transfer molding method and an asymmetric encapsulation made therefrom Grant 6,143,581 - Johnson , et al. November 7, 2	2000-11-07
Manual pellet loader for Boschman automolds Grant 6,033,614 - Bolken , et al. March 7, 2	2000-03-07
Manual pellet loader for Boschman automolds Grant 5,925,384 - Bolken , et al. July 20, 1	1999-07-20

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