U.S. patent application number 11/237433 was filed with the patent office on 2006-02-02 for methods of etching a contact opening over a node location on a semiconductor substrate.
Invention is credited to Chris W. Hill, Mark E. Jost.
Application Number | 20060024973 11/237433 |
Document ID | / |
Family ID | 25172048 |
Filed Date | 2006-02-02 |
United States Patent
Application |
20060024973 |
Kind Code |
A1 |
Jost; Mark E. ; et
al. |
February 2, 2006 |
Methods of etching a contact opening over a node location on a
semiconductor substrate
Abstract
A chemical vapor deposition method includes providing a
semiconductor substrate within a chemical vapor deposition chamber.
At least one liquid deposition precursor is vaporized with a
vaporizer to form a flowing vaporized precursor stream. The flowing
vaporized precursor stream is initially bypassed from entering the
chamber for a first period of time while the substrate is in the
deposition chamber. After the first period of time, the flowing
vaporized precursor stream is directed to flow into the chamber
with the substrate therein under conditions effective to chemical
vapor deposit a layer over the substrate. A method of etching a
contact opening over a node location on a semiconductor substrate
is disclosed.
Inventors: |
Jost; Mark E.; (Boise,
ID) ; Hill; Chris W.; (Boise, ID) |
Correspondence
Address: |
WELLS ST. JOHN P.S.
601 W. FIRST AVENUE, SUITE 1300
SPOKANE
WA
99201
US
|
Family ID: |
25172048 |
Appl. No.: |
11/237433 |
Filed: |
September 28, 2005 |
Related U.S. Patent Documents
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Application
Number |
Filing Date |
Patent Number |
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10278530 |
Oct 22, 2002 |
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11237433 |
Sep 28, 2005 |
|
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09797898 |
Mar 1, 2001 |
6596641 |
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10278530 |
Oct 22, 2002 |
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Current U.S.
Class: |
438/738 ;
257/E21.275; 257/E21.576; 257/E21.577 |
Current CPC
Class: |
H01L 21/76897 20130101;
C23C 16/45523 20130101; H01L 21/02271 20130101; H01L 21/76834
20130101; H01L 21/31116 20130101; H01L 21/31625 20130101; C23C
16/401 20130101; H01L 21/022 20130101; C23C 16/4485 20130101; Y10S
438/935 20130101; H01L 21/76801 20130101; H01L 21/76802 20130101;
H01L 21/02129 20130101; H01L 21/76832 20130101 |
Class at
Publication: |
438/738 |
International
Class: |
H01L 21/302 20060101
H01L021/302; H01L 21/461 20060101 H01L021/461 |
Claims
1-3. (canceled)
4. A chemical vapor deposition method comprising: providing a
semiconductor substrate within a chemical vapor deposition chamber;
vaporizing a first liquid deposition precursor with a first
vaporizer forming a flowing first vaporized precursor; vaporizing a
second deposition precursor with a second vaporizer forming a
flowing second vaporized precursor; bypassing at least one of the
flowing first and the second precursors from entering the chamber
for a first period of time while the substrate is in the deposition
chamber; and after the first period of time, directing the at least
one bypassed flowing precursor to flow into the chamber with the
substrate therein.
5. The method of claim 4 comprising bypassing flowing both the
first and the second precursors from entering the chamber for the
first period of time while the substrate is in the deposition
chamber, the directing comprising directing both the first and
second precursors to flow into the chamber with the substrate
therein.
6. The method of claim 4 comprising bypassing the flowing first
precursor during the first period, and starting vaporizing of the
second deposition precursor after said bypassing.
7. The method of claim 4 wherein the directing comprises directing
the at least one bypassed flowing precursor to flow into the
chamber with the substrate therein effective to chemical vapor
deposit a layer on the substrate.
8. The method of claim 4 comprising bypass flowing both the first
and the second precursors from entering the chamber for the first
period of time while the substrate is in the deposition chamber,
the directing comprising directing both the first and second
precursors to flow into the chamber with the substrate therein
effective to chemical vapor deposit a layer on the substrate.
9. The method of claim 4 wherein the flowing of the at least one of
the first and second precursors during the first period of time is
not steady state during all of said first period.
10. The method of claim 4 wherein the period of time is effective
to achieve steady state flow of the at least one of the first and
second precursors at conclusion of said period.
11. A chemical vapor deposition method comprising: providing a
semiconductor substrate within a chemical vapor deposition chamber;
vaporizing a first liquid deposition precursor with a first
vaporizer forming a flowing first vaporized precursor; vaporizing a
second liquid deposition precursor with a second vaporizer forming
a flowing second vaporized precursor comprising a first dopant;
vaporizing a third deposition precursor with a third vaporizer
forming a flowing third vaporized precursor comprising a second
dopant different from the first dopant; directing the flowing first
vaporized precursor and the flowing second vaporized precursor to
flow into the chamber with the substrate therein under conditions
effective to chemical vapor deposit a first layer comprising the
first dopant over the substrate; and after depositing the first
layer, flowing the vaporized third precursor into the chamber while
flowing the first vaporized precursor and the second vaporized
precursor into the chamber with the substrate therein under
conditions effective to chemical vapor deposit a second layer over
the substrate comprising the first and second dopants, the second
layer comprising a greater concentration of the second dopant than
any concentration of the second dopant in the first layer.
12. The method of claim 11 comprising depositing the first layer to
a thickness of from about 50 Angstroms to about 500 Angstroms.
13. The method of claim 11 comprising depositing the first layer to
a thickness of from about 100 Angstroms to about 300 Angstroms.
14. The method of claim 11 wherein vaporizing of the third
precursor starts after depositing the first layer.
15. The method of claim 11 wherein no third vaporized precursor
flows to the chamber during the first layer depositing.
16. The method of claim 11 wherein no third vaporized precursor
flows to the chamber during the first layer depositing, with the
concentration of the second dopant in the first layer being
substantially zero.
17. The method of claim 11 wherein some third vaporized precursor
flows to the chamber during the first layer depositing, with the
concentration of the second dopant in the first layer being at some
desired measurable value.
18. The method of claim 11 comprising flowing another vapor
precursor to the chamber during depositing at least one of the
first and second layers.
19. The method of claim 11 comprising combining the vaporized first
and second precursors prior to flowing them to the chamber to
chemical vapor deposit the first layer.
20. The method of claim 11 comprising combining the vaporized
first, second, and third precursors prior to flowing them to the
chamber to chemical vapor deposit the second layer.
21. The method of claim 11 comprising stopping flow of the first
and second vaporized precursors to the chamber intermediate the
chemical vapor depositing of the first and second layers.
22. The method of claim 11 comprising continuing to vaporize the
first and second precursors while stopping flow of the first and
second vaporized precursors to the chamber intermediate the
chemical vapor depositing of the first and second layers.
23. The method of claim 11 comprising bypassing flow of the first
and second vaporized precursors to the chamber prior to the
directing.
24. The method of claim 11 comprising bypassing flow of the first
and second vaporized precursors to the chamber after depositing the
first layer prior to depositing the second layer.
25. A chemical vapor deposition method comprising: providing a
semiconductor substrate within a chemical vapor deposition chamber;
providing first, second and third liquid vaporizers having
respective first, second and third exiting vapor flowpaths which
combine to form a combined flowpath; vaporizing a first liquid
deposition precursor with the first vaporizer forming a flowing
first vaporized precursor within the combined flowpath; vaporizing
a second liquid deposition precursor with the second vaporizer
forming a flowing second vaporized precursor comprising a first
dopant within the combined flowpath with the flowing first
vaporized precursor; initially bypassing the flowing first and
second vaporized precursors within the combined flowpath from
entering the chamber for a first period of time while the substrate
is in the deposition chamber; after the first period of time,
directing the flowing first and second vaporized precursors within
the combined flowpath to flow into the chamber with the substrate
therein under conditions effective to chemical vapor deposit a
first layer comprising the first dopant over the substrate; after
depositing the first layer, second bypassing the flowing first and
second vaporized precursors within the combined flowpath from
entering the chamber while the substrate is in the deposition
chamber; vaporizing a third deposition precursor with the third
vaporizer forming a flowing third vaporized precursor comprising a
second dopant different from the first dopant, and combining the
flowing third vaporized precursor with the flowing second bypassed
first and second vaporized precursors in the combined flowpath and
bypassing the combined flowing first, second and third vaporized
precursors within the combined flowpath from entering the chamber
for a second period of time while the substrate is in the
deposition chamber; and after the second period of time, directing
the combined flowing first, second and third vaporized precursors
within the combined flowpath to flow into the chamber with the
substrate therein under conditions effective to chemical vapor
deposit a second layer comprising the first and second dopants over
the first layer, the second layer comprising a greater
concentration of the second dopant than any concentration of the
second dopant in the first layer.
26. The method of claim 25 flowing a fourth precursor to the
chamber separate from the combined flowpath during forming of each
of the first and second layers.
27. The method of claim 25 comprising chemical vapor depositing the
second layer onto the first layer.
28. The method of claim 25 wherein no third vaporized precursor
flows to the chamber during the first layer depositing.
29. The method of claim 25 wherein no third vaporized precursor
flows to the chamber during the first layer depositing, with the
concentration of the second dopant in the first layer being
substantially zero.
30. The method of claim 25 wherein some third vaporized precursor
flows to the chamber during the first layer depositing, with the
concentration of the second dopant in the first layer being at some
desired measurable value.
31. The method of claim 25 wherein the flowing of the vaporized
precursors during the first and second periods of time is not
steady state during all of said first and second periods.
32. The method of claim 25 wherein the first and second periods of
time are effective to achieve steady state flow of the vaporized
precursors at conclusion of said respective periods.
33. The method of claim 25 comprising depositing the first layer to
a thickness of from about 50 Angstroms to about 500 Angstroms.
34. The method of claim 25 comprising depositing the first layer to
a thickness of from about 100 Angstroms to about 300 Angstroms.
35-72. (canceled)
73. A chemical vapor deposition method comprising: providing a
semiconductor substrate within a chemical vapor deposition chamber;
providing first and second liquid vaporizers having respective
first and second flowpaths which combine to form a combined
flowpath; vaporizing a first liquid deposition precursor with the
first vaporizer forming a flowing first vaporized precursor within
the combined flowpath; vaporizing a second liquid deposition
precursor with the second vaporizer forming a flowing second
vaporized precursor within the combined flowpath with the flowing
first vaporized precursor; bypassing the flowing first and second
vaporized precursors within the combined flowpath from entering the
chamber for a first period of time while the substrate is in the
deposition chamber; and after the first period of time, directing
the flowing first and second vaporized precursors within the
combined flowpath to flow into the chamber with the substrate
therein under conditions effective to chemical vapor deposit a
layer over the substrate.
74. The method of claim 73 wherein the flowing of the first and
second vaporized precursors within the combined flowpath during the
first period of time is not steady state during all of said first
period.
75. The method of claim 73 wherein the period of time is effective
to achieve steady state flow of the first and second vaporized
precursors within the combined flowpath at conclusion of said
period.
76. A chemical vapor deposition method comprising: providing a
semiconductor substrate within a chemical vapor deposition chamber;
providing first and second liquid vaporizers having respective
first and second flowpaths which combine to form a combined
flowpath; vaporizing a first liquid deposition precursor with the
first vaporizer forming a flowing first vaporized precursor within
the combined flowpath; vaporizing a second liquid deposition
precursor with the second vaporizer forming a flowing second
vaporized precursor comprising a dopant within the combined
flowpath with the flowing first vaporized precursor; bypassing the
flowing first and second vaporized precursors within the combined
flowpath from entering the chamber for a first period of time while
the substrate is in the deposition chamber; and after the first
period of time, directing the flowing first and second vaporized
precursors within the combined flowpath to flow into the chamber
with the substrate therein under conditions effective to chemical
vapor deposit a layer comprising the dopant over the substrate.
77. The method of claim 76 wherein the flowing of the first and
second vaporized precursors within the combined flowpath during the
first period of time is not steady state during all of said first
period.
78. The method of claim 76 wherein the period of time is effective
to achieve steady state flow of the first and second vaporized
precursors within the combined flowpath at conclusion of said
period.
Description
RELATED PATENT DATA
[0001] This patent resulted from a continuation application of U.S.
patent application Ser. No. 10/278,530, filed Oct. 22, 2002,
entitled "Methods of Etching a Contact Opening Over a Node Location
on a Semiconductor Substrate", naming Mark E. Jost and Chris W.
Hill as inventors, the disclosure of which is incorporated by
reference; which patent resulted from a divisional application of
U.S. patent application Ser. No. 09/797,898, filed Mar. 1, 2001,
entitled "Chemical Vapor Deposition Methods", naming Mark E. Jost
and Chris W. Hill as inventors, now U.S. Pat. No. 6,596,641, issued
Jul. 22, 2003, the disclosure of which is incorporated by
reference.
TECHNICAL FIELD
[0002] This invention relates to chemical vapor deposition methods
and to methods of etching a contact opening over a node location on
a semiconductor substrate.
BACKGROUND OF THE INVENTION
[0003] The invention primarily grew out needs for making highly
reliable, high density dynamic random access memory (DRAM)
contacts, although the invention is in no way so limited. Advanced
semiconductor fabrication is employing increasing vertical circuit
integration as designers continue to strive for circuit density
maximization. Such typically includes multi-level metalization and
interconnect schemes.
[0004] Electrical interconnect techniques typically require
electrical connection between metals or other conductive layers, or
regions, which are present at different elevations within the
substrate. Such interconnecting is typically conducted, in part, by
etching a contact opening through insulating material to the lower
elevation of a desired node contact, for example of a conductive
layer or conductive region. The significant increase in density of
memory cells and vertical integration places very stringent
requirements for contact fabrication technology. The increase in
circuit density has resulted in narrower and deeper electrical
contact openings between layers within the substrate, something
commonly referred to as increasing aspect ratio, which is the ratio
of maximum opening height to minimum opening width. Increasing
aspect ratios make it difficult to complete etches to desired node
locations.
[0005] For example, one typical contact etch includes the etch to a
substrate diffusion region formed within a semiconductive material
which is received between a pair of field effect transistor gate
lines. The gate lines are typically encapsulated in a silicon
nitride and/or undoped silicon dioxide material. A planarized layer
of borophosphosilicate glass (BPSG) is typically provided over the
field effect transistors and through which a contact opening to the
substrate will be etched. Further, a very thin undoped silicon
dioxide layer is typically provided intermediate the BPSG layer and
the underlying substrate material to shield from diffusion of the
boron and phosphorus dopants from the BPSG layer into underlying
substrate material. Additionally or alternately, a thin silicon
nitride layer might also be provided. An antireflective layer might
also be provided over the BPSG. The layers are typically masked,
for example with photoresist, and a contact opening is formed
through the mask over the underlying layers over the diffusion
region to which contact is desired. The antireflective coating is
then etched, followed by an etch conducted through the BPSG which
is substantially selective to the silicon nitride layer, undoped
oxide and underlying silicon substrate such that the etch is
typically referred to as a substantially self-aligned contact etch.
An example dry anisotropic etching chemistry for the etch includes
a combination of CHF.sub.3, CF.sub.4, CH.sub.2F.sub.2 and Ar. The
typical intervening undoped silicon dioxide layer between the
underlying substrate and the BPSG will typically also be etched
through in spite of a poor etch rate compared to BPSG, principally
due to the extreme thinness of this layer. Further, if silicon
nitride is used in addition or in place of the undoped silicon
dioxide layer, it would typically be separately etched. At the
conclusion of the etch or etches, a native oxide might grow, which
could be stripped with a dilute HF solution prior to plugging the
contact opening with conductive material(s).
[0006] When the aspect ratio of the contact opening being etched
through the BPSG was sufficiently below 4:1, a single etch
chemistry for the BPSG was typically suitable to clear the BPSG and
a thin undoped silicon oxide layer all the way to the diffusion
region to outwardly expose the same, assuming silicon nitride was
not present. However, as the aspect ratio of the contact opening
through the BPSG approached and exceeded 4:1, it was discovered in
some instances that the subject chemistry, and other attempted
chemistries, were not sufficient to enable clearing the doped oxide
dielectric material utilizing a single chemistry and a single
etching step.
[0007] These are the circumstances which motivated the invention,
although the results and objectives are in no way to be perceived
as claim limitations unless such are specifically provided in the
accompanying claims. The invention also has applicability outside
of the problems from which it spawned, with the invention only
being limited by the accompanying claims as literally worded
without writing limitations or interpretations into the claims from
the specification or drawings, and as appropriately interpreted in
accordance with the doctrine of equivalents.
SUMMARY OF THE INVENTION
[0008] The invention comprises chemical vapor deposition methods
and methods of etching a contact opening over a node location on a
semiconductor substrate. In but one implementation, a chemical
vapor deposition method includes providing a semiconductor
substrate within a chemical vapor deposition chamber. At least one
liquid deposition precursor is vaporized with a vaporizer to form a
flowing vaporized precursor stream. The flowing vaporized precursor
stream is initially bypassed from entering the chamber for a first
period of time while the substrate is in the deposition chamber.
After the first period of time, the flowing vaporized precursor
stream is directed to flow into the chamber with the substrate
therein under conditions effective to chemical vapor deposit a
layer over the substrate.
[0009] In one implementation, a method of etching a contact opening
over a node location on a semiconductor substrate includes forming
a dielectric first layer over a node location. An oxide second
layer having plural dopants therein is formed over the dielectric
first layer. The oxide second layer has an innermost portion and an
outer portion. The outer portion has a higher concentration of one
of the dopants than any concentration of the one dopant in the
innermost portion. Using a single dry etching chemistry, a contact
opening is etched into the outer and innermost portions of the
oxide second layer to proximate the dielectric first layer over the
node location. Etching is conducted into the dielectric first layer
through the contact opening to proximate the node location.
[0010] In one implementation, a method of etching a contact opening
over a node location on a semiconductor substrate includes forming
a dielectric first layer over a node location. An oxide second
layer having plural dopants therein is formed over the dielectric
first layer. The oxide second layer has an innermost portion and an
outer portion. The innermost portion has a higher concentration of
one of the dopants than any concentration of the one dopant in the
outer portion. Using a single dry etching chemistry, a contact
opening is etched into the outer and innermost portions of the
oxide second layer to proximate the dielectric first layer over the
node location. Etching is conducted into the dielectric first layer
through the contact opening to proximate the node location.
[0011] Other implementations are contemplated.
BRIEF DESCRIPTION OF THE DRAWINGS
[0012] Preferred embodiments of the invention are described below
with reference to the following accompanying drawings.
[0013] FIG. 1 is a diagrammatic sectional view of a semiconductor
wafer fragment at one processing step in accordance with an aspect
of the invention.
[0014] FIG. 2 is a view of the FIG. 1 wafer fragment at a
processing step subsequent to that shown by FIG. 1.
[0015] FIG. 3 is a view of the FIG. 1 wafer fragment at a
processing step subsequent to that shown by FIG. 2.
[0016] FIG. 4 is a view of the FIG. 1 wafer fragment at a
processing step subsequent to that shown by FIG. 3.
[0017] FIG. 5 is a view of the FIG. 1 wafer fragment at a
processing step subsequent to that shown by FIG. 4.
[0018] FIG. 6 is a view of the FIG. 1 wafer fragment at a
processing step subsequent to that shown by FIG. 5.
[0019] FIG. 7 is a diagrammatic schematic view of exemplary
semiconductor wafer fabrication equipment usable in accordance with
aspects of the invention.
DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS
[0020] This disclosure of the invention is submitted in furtherance
of the constitutional purposes of the U.S. Patent Laws "to promote
the progress of science and useful arts" (Article 1, Section
8).
[0021] The invention comprises a chemical vapor deposition method.
The invention also comprises a method of etching a contact opening
over a node location on a semiconductor substrate. FIGS. 1-5
illustrate but one exemplary semiconductor substrate 10 for
processing in accordance with aspects of the invention.
Semiconductor substrate 10 comprises a bulk monocrystalline silicon
substrate 12. In the context of this document, the term
"semiconductor substrate" or "semiconductive substrate" is defined
to mean any construction comprising semiconductive material,
including, but not limited to, bulk semiconductive materials such
as a semiconductive wafer (either alone or in assemblies comprising
other materials thereon), and semiconductive material layers
(either alone or in assemblies comprising other materials). The
term "substrate" refers to any supporting structure, including, but
not limited to, the semiconductive substrates described above.
[0022] Substrate 12 comprises a pair of field effect transistor
gate constructions 14 and 16 having a diffusion region 18 formed
therebetween in semiconductive material of substrate 10/12. In this
example, diffusion region 18 constitutes a node location to which
electrical connection is ultimately desired. Various dielectric and
conductive layers of constructions 14 and 16 are not specifically
designated as not being particularly relevant to the invention. In
the preferred embodiments, gate constructions 14 and 16 include
outermost insulative dielectric regions whereby a substantially
self aligned contact etch can be made through an overlying
insulative layer to region 18 without exposing conductive material
of the gates in the event of some mask misalignment. Exemplary
materials are as described above where the overlying layer will be
BPSG.
[0023] Referring to FIG. 2, a dielectric first layer 20 is formed
over node location 18. By way of example only, exemplary materials
include silicon nitride, substantially undoped oxide, or
combinations thereof. In the context of this document,
"substantially undoped" means having essentially no measurable
dopants therein, which in this specific example would mean
essentially void of either boron or phosphorous. An exemplary
preferred deposition thickness for dielectric layer 20 is from 50
Angstroms to 300 Angstroms. Such is preferably conventionally
chemical vapor deposited in equipment which provides adequate
conformality. Exemplary equipment includes an ASM A4000 Furnace,
available from ASM International N.V. of The Netherlands.
[0024] Semiconductor substrate 10 is provided within a chemical
vapor deposition chamber for formation of a first dielectric layer
22 (FIG. 3). FIG. 7 diagrammatically illustrates but one exemplary
processing schematic usable for processing a semiconductor
substrate in accordance with methodical aspects of the invention.
Such comprises an exemplary chemical vapor deposition chamber 60
within which semiconductor substrate 10 would be received. FIG. 7
equipment comprises first, second and third liquid vaporizers 61,
62 and 63, which are also designated V1, V2 and V3, respectively.
Such vaporizers might constitute any existing or yet-to-be
developed vaporizers for liquid chemical vapor deposition
precursors. Examples include bubblers, liquid flow controllers and
other devices which result in vaporization of liquid material for
flowing vapor to a chemical vapor deposition reactor. In the
illustrated and preferred embodiment, chamber 60 is preferably a
subatmospheric chemical vapor deposition reactor, and preferably
not a plasma enhanced chemical vapor deposition reactor. The
invention was reduced-to-practice using liquid flow controllers as
the vaporizers and a Centura 5200 reactor available from Applied
Materials of Santa Clara, Calif. Vaporizers 61, 62 and 63 include
liquid precursor inlets 64, 65 and 66, respectively. Such
vaporizers also include exiting vapor flowpaths 67, 68 and 69,
respectively. Exiting streams 67, 68 and 69 join to form a combined
flowpath 70. Flowpath 70 branches into a path 72 which is directed
to chamber 60 and a path 74 which by-passes chamber 60. A control
valve 76 is associated with lines 70, 72, and 74. Such controls the
flow of vaporized precursors to the chamber and for bypassing the
chamber. An additional exemplary vapor input line for chamber 60 is
designated with numeral 80. An exit line 82 extends from chamber 60
and joins with bypass line 74, forming an exhaust line 84.
Pressure, temperature and other control devices are not shown, as
such are not particularly material to the invention disclosed
herein.
[0025] The description proceeds with that of only an exemplary
preferred embodiment of depositing a doped oxide layer over
substrate 10. In this but one exemplary preferred embodiment, the
outermost layer of the preferred dielectric mass being deposited
will comprise borophosphosilicate glass. Thereby, feed stream 64
feeds a first liquid deposition precursor, for example
tetraethylorthosilicate (TEOS). Line 65 feeds an exemplary second
liquid deposition precursor of triethylphosphate. The phosphorous
in such material constitutes an exemplary first dopant to at some
point be provided in the dielectric mass being formed. Line 66
feeds an exemplary third liquid deposition precursor of
triethylborate. The boron in such precursor constitutes an
exemplary second precursor different from the first for provision
at some point within the dielectric mass being fabricated. In this
example, line 80 constitutes an exemplary input line for a fourth
vapor precursor, here in this preferred embodiment to include one
or a combination of O.sub.2 and O.sub.3.
[0026] In a specific and preferred embodiment, the liquid precursor
flowing in stream 64 to vaporizer V1 is vaporized to form a flowing
vaporized precursor within stream 67 and stream 70. Valve 76 is
preferably initially totally closed to line 72 and is preferably
initially totally opened to line 74. Thereby, the flowing vaporized
precursor in stream 70 is initially bypassed from entering chamber
60 and allowed to flow out exhaust stream 84 for some first period
of time while substrate 10 is within deposition chamber 60. A
preferred reason for initially bypassing flow of the precursor to
chamber 60 is that the flow of the flowing precursor from the
vaporizer is typically not initially at a desired steady state.
Preferably, the period of time is selected to be effective to
achieve steady state flow of the vaporized precursor at the
conclusion of the period. Accordingly, in the typical embodiment,
flow of the vaporized precursor during the first period of time is
not steady state during all of such first period.
[0027] In conjunction with the above flowing first vaporized
precursor, the second liquid deposition precursor flowing in line
65 is preferably caused to be vaporized by vaporizer V2 to form a
flowing second vaporized precursor, in this example comprising the
phosphorous dopant, within line 68 and thereby also within combined
flowpath 70 with the flowing first vaporized precursor from line
67. The flowing first and second vaporized precursors are thereby
initially bypassed within combined flowpath 70 from entering
chamber 60 for a period of time while substrate 10 is within
deposition chamber 60. The preferred desire and effect is to
achieve steady state flow at the desired deposition conditions of
the first and second precursors within line 70 prior to flowing the
same to deposition chamber 60. The period of time to achieve
stabilization is typically less than 10 seconds. Preferably after
achieving a steady state flow, the first and second vaporized
precursors are directed within combined flowpath 70 to flow into
chamber 60 with the substrate therein under conditions effective to
chemical vapor deposit first dielectric layer 22 (FIG. 3)
comprising the first dopant, in this example phosphorous, over
substrate 10. Such can be accomplished by reversing the
opened/closed relationship of lines 72/74 with valve 76.
[0028] Such conditions in the illustrated preferred example also
include suitable flow of an oxygen/ozone mixture through line 80
into chamber 60. By way of example only, preferred flow rates from
line 64 to vaporizer V1 include a TEOS flow at 600 mg/min and a
flow within line 80 of 12% O.sub.3/88% O.sub.2 by weight at 3
standard liters/min. Such is considered in the context of a single
wafer chamber 60 having a volume of approximately 6 liters. An
exemplary pressure during deposition within chamber 60 is 200 Torr,
with the wafer chuck temperature within chamber 60 preferably being
maintained at about 530.quadrature.C. An exemplary period of time
to achieve steady state flow prior to directing the first vaporized
precursor to the chamber is 10 seconds or less. A specific
exemplary flow for triethylphosphate within line 65 is at 100
mg/min. A preferred result is to achieve approximately 4% to 12%
phosphorous doping within layer 22. An exemplary preferred
thickness for layer 22 is from about 50 Angstroms to about 500
Angstroms, with from about 100 Angstroms to about 300 Angstroms
being preferred, and from about 200 Angstroms to 275 Angstroms
being even more preferred.
[0029] At the conclusion of such processing, preferably any flow of
ozone within line 80 is ceased, and a pure oxygen or inert gas
caused to flow therethrough. Further preferably, valve 76 is
preferably totally closed to line 72 and valve 76 is preferably
totally opened to line 74, once again causing flowing vaporized
precursor from lines 67 and 68 into line 70, into line 74 and out
exhaust line 84.
[0030] In this embodiment, layer 22 is preferably as shown and
described directly deposited on underlying dielectric layer 20. In
this just described embodiment, no vaporized precursor flows from
vaporizer V3 to chamber 60 during deposition of layer 22. Further,
no other source of the second dopant is provided to chamber 60 in
the depicted preferred example. Further, the concentration of the
second dopant (in this example, boron) in first dielectric layer 22
is thereby substantially zero (meaning below detectable levels) at
least at this point in the preferred embodiment process.
Alternately, some third vaporized precursor might be caused to flow
to chamber 60 during the first dielectric depositing, with the
concentration of the second dopant in first dielectric layer 22 at
this point in the process being at some desired measurable level.
Typical prior art BPSG layers comprise from 2%-5% boron and from
4%-12% phosphorous, with the remainder constituting SiO.sub.2 (by
weight). In this particular example, where borophosphosilicate
glass is being formed either in FIG. 3 or ultimately, the preferred
concentration of boron within layer 22 is from 0%-4%. The preferred
concentration of phosphorus within layer 22 is from 6% to 24%. Time
for deposition of layer 22 will typically be from 2-4 seconds.
[0031] Preferably essentially simultaneously with the conclusion of
layer 22 formation, the flowing first and second vaporized
precursors within combined flowpath 70 are bypassed from entering
chamber 60 while substrate 10 is therewithin. Such preferably
occurs by switching valve 76 completely closed to line 72 and
completely opened to line 74, all while continuing operation of
vaporizers V1 and V2. Preferably essentially simultaneously
therewith, a third deposition precursor, in this example in the
form of triethylborate, flowing in line 66 is vaporized in
vaporizer V3 forming a flowing third vaporized precursor comprising
a second dopant (here, boron), different from the first dopant, in
line 69. The flowing third vaporized precursor in line 69 is
combined with the flowing bypassed first and second vaporized
precursors in combined flowpath 70, with the combined flowing
first, second and third vaporized precursors therewithin being
bypassed to exhaust 84 and thereby prevented from entering chamber
60 for a period of time while substrate 10 is within chamber 60. As
with the above-described processing, such period of time is
preferably suitable to achieve steady state flow of the combined
precursors, and will typically be less than 10 seconds. During the
time where deposition does not occur within chamber 60, the flow of
gasses from line 80 is preferably again changed to be pure O.sub.2
or an inert gas. In the preferred described embodiment, flows are
preferably as described above, with an exemplary flow of the
triethylborate in line 66 being at 100 mg/min.
[0032] Preferably after the steady state has been achieved, the
combined flowing first, second and third vaporized precursors
within combined flowpath 70 are directed to flow into chamber 60
with substrate 10 therein under conditions effective to chemical
vapor deposit a second dielectric layer 24 (FIG. 4) comprising the
first and second dopants over first dielectric layer 22, and
preferably directly thereon as shown. Second dielectric layer 24
preferably comprises a greater concentration of the second dopant
(here boron) than any concentration of the second dopant in first
dielectric layer 22. Further preferably, first dielectric layer 22
preferably comprises a greater concentration of the first dopant
(here phosphorus) than any concentration of the first dopant in
second dielectric layer 24. A preferred thickness for layer 24 is
from 3,000 Angstroms to 15,000 Angstroms, with approximately 10,000
Angstroms being a specific preferred example. In the described
example, an exemplary preferred concentration of boron and
phosphorous within layer 24 is 3.8% and 7.6% by weight,
respectively.
[0033] The illustrated FIG. 4 construction can also be considered
as constituting an oxide second layer 25 having plural dopants
therein, and which is formed over a dielectric first layer 20.
Oxide second layer 25 has an innermost portion 22 and an outer
portion 24, with the outer portion having a higher concentration of
one of the dopants than any concentration of the one dopant in
innermost portion 22. Additional portions or layers with respect to
oxide layer 25 might also be provided. Further as outlined above,
innermost portion 22 might be fabricated to contain no measurable
quantity of the one dopant (here, boron), which is preferred, or
alternately be formed to contain some measurable quantity of the
one dopant, which is not as preferred. Further, innermost portion
22 might also be fabricated to contain no measurable quantity of
any dopant.
[0034] The FIG. 4 construction can also be considered as innermost
portion 22 having a higher concentration of one of the dopants than
any concentration of the one dopant in outer portion 24. Further,
outer portion 24 might be fabricated to contain no measurable
quantity of the one dopant (here, phosphorus) or alternately and
preferred be formed to contain some measurable quantity of the one
dopant.
[0035] Referring to FIG. 5, substrate 10 has been removed from
chamber 60, has been planarized, and an antireflective coating 27
has been deposited. An exemplary material for layer 27 is a 400
Angstrom thick silicon rich oxynitride film, for example 54%
silicon, 36% oxygen and 10% nitrogen.
[0036] Referring to FIG. 6, masking has preferably been conducted
over layers 25 and 27, preferably using photolithography and
photoresist. An opening is then etched through layer 27 to expose
layer 25. An exemplary etch chemistry for the above silicon rich
oxynitride coating is 80 sccm CF.sub.4, 160 sccm Ar, and 20 sccm
O.sub.2 at 40 mTorr and 1400 Watts. Such is typically fairly
non-selective, and preferably also acts as a descum to remove any
residual photoresist at the base of the contact hole therein (not
shown). Then using a single dry etching chemistry, a contact
opening 30 is etched into outer portion 24 and innermost portion 22
to proximate dielectric layer 20 over node location 18. Reduction
of boron content within the innermost portion of a BPSG layer,
particularly when etching high aspect ratios of at least 4.0
through layer 25, has been determined to facilitate achieving
adequate removal in etching the exemplary contact opening,
preferably at least all the way to dielectric layer 20, and
depending on the composition of layer 20 all the way to region 18.
Further, increase in phosphorus content within the innermost
portion of a BPSG layer, particularly when etching high aspect
ratios, has been determined to facilitate achieving adequate
removal in etching the exemplary contact opening. Preferred is a
combination of more phosphorus in the innermost portion as compared
to the outer portion, and less boron in the innermost portion as
compared to the outer portion. An exemplary preferred chemistry is
the CHF.sub.3, CF.sub.4, CH.sub.2F.sub.2 and Ar chemistry described
above in a magnetically enhanced reactive ion plasma reactor.
[0037] When layer 20 comprises nitride or some other material which
is not sufficiently etched by the single etching chemistry for
layer 25, layer 20 can be suitably dry or wet etched to effectively
outwardly expose node location 18.
[0038] In compliance with the statute, the invention has been
described in language more or less specific as to structural and
methodical features. It is to be understood, however, that the
invention is not limited to the specific features shown and
described, since the means herein disclosed comprise preferred
forms of putting the invention into effect. The invention is,
therefore, claimed in any of its forms or modifications within the
proper scope of the appended claims appropriately interpreted in
accordance with the doctrine of equivalents.
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