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Methods Of Forming Semiconductor Structures
App 20100087060 - Yin; Zhiping ; et al. | 2010-04-08 |
Interconnect structures with interlayer dielectric
Grant 7,659,630 - Yin , et al. February 9, 2 | 2010-02-09 |
Dry etching process to form a conductive layer within an opening without use of a mask during the formation of a semiconductor device
Grant 7,326,647 - Schrinksy , et al. February 5, 2 | 2008-02-05 |
Interconnect Structures
App 20070278695 - Yin; Zhiping ; et al. | 2007-12-06 |
Dry etching process to form a conductive layer within an opening without use of a mask during the formation of a semiconductor device
App 20070049038 - Schrinksy; Alex J. ; et al. | 2007-03-01 |
Methods of etching a contact opening over a node location on a semiconductor substrate
App 20060024973 - Jost; Mark E. ; et al. | 2006-02-02 |
Methods of etching a contact opening over a node location on a semiconductor substrate
Grant 6,982,228 - Jost , et al. January 3, 2 | 2006-01-03 |
Method of etching a contact opening
Grant 6,828,252 - Jost , et al. December 7, 2 | 2004-12-07 |
Method of etching a contact opening
App 20040198061 - Jost, Mark E. ; et al. | 2004-10-07 |
Utilization of disappearing silicon hard mask for fabrication of semiconductor structures
Grant 6,787,472 - Givens , et al. September 7, 2 | 2004-09-07 |
Methods for utilization of disappearing silicon hard mask for fabrication of semiconductor structures
Grant 6,689,693 - Givens , et al. February 10, 2 | 2004-02-10 |
Methods of forming protective segments of material, and etch stops
Grant 6,653,241 - Jost , et al. November 25, 2 | 2003-11-25 |
Methods Of Forming Protective Seqments Of Material, And Etch Stops
App 20030176070 - Jost, Mark E. ; et al. | 2003-09-18 |
Methods Of Forming Protective Segments Of Material, And Etch Stops
App 20030176076 - Jost, Mark E. ; et al. | 2003-09-18 |
Methods of forming protective segments of material, and etch stops
Grant 6,620,734 - Jost , et al. September 16, 2 | 2003-09-16 |
Semiconductor wafer, wafer alignment patterns and method of forming wafer alignment patterns
Grant 6,605,516 - Jost , et al. August 12, 2 | 2003-08-12 |
Utilization of disappearing silicon hard mask for fabrication of semiconductor structures
App 20030143856 - Givens, John H. ; et al. | 2003-07-31 |
Chemical vapor deposition methods
Grant 6,596,641 - Jost , et al. July 22, 2 | 2003-07-22 |
Methods of etching a contact opening over a node location on a semiconductor substrate
App 20030045111 - Jost, Mark E. ; et al. | 2003-03-06 |
Utilization of disappearing silicon hard mask for fabrication of semiconductor structures
App 20030036271 - Givens, John H. ; et al. | 2003-02-20 |
Chemical vapor deposition methods and methods of etching a contact opening over a node location on a semiconductor substrate
App 20020123221 - Jost, Mark E. ; et al. | 2002-09-05 |
Utilization of disappearing silicon hard mask for fabrication of semiconductor structures
App 20020102854 - Givens, John H. ; et al. | 2002-08-01 |
Semiconductor wafer, wafer alignment patterns and method of forming wafer alignment patterns
App 20010007786 - Jost, Mark E. ; et al. | 2001-07-12 |
Semiconductor processing method of making electrical contact to a node received within a mass of insulating dielectric material
Grant 6,153,527 - Jost , et al. November 28, 2 | 2000-11-28 |
Semiconductor processing methods, and methods of forming capacitors
Grant 6,127,239 - Jost , et al. October 3, 2 | 2000-10-03 |
Method of forming wafer alignment patterns
Grant 6,046,094 - Jost , et al. April 4, 2 | 2000-04-04 |
Method of forming recessed container cells
Grant 5,888,877 - Dennison , et al. March 30, 1 | 1999-03-30 |
Semiconductor processing methods of forming a contact opening to a semiconductor substrate
Grant 5,869,403 - Becker , et al. February 9, 1 | 1999-02-09 |
Semiconductor processing method of making electrical contact to a node received within a mass of insulating dielectric material
Grant 5,739,068 - Jost , et al. April 14, 1 | 1998-04-14 |
Semiconductor wafer, wafer alignment patterns and method of forming wafer alignment patterns
Grant 5,700,732 - Jost , et al. December 23, 1 | 1997-12-23 |
Method of forming a BiCMOS SOI wafer having thin and thick SOI regions of silicon
Grant 5,258,318 - Buti , et al. November 2, 1 | 1993-11-02 |
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