U.S. patent application number 11/115853 was filed with the patent office on 2005-10-20 for semiconductor constructions.
Invention is credited to Boettiger, Ulrich C., Light, Scott L..
Application Number | 20050233588 11/115853 |
Document ID | / |
Family ID | 33552638 |
Filed Date | 2005-10-20 |
United States Patent
Application |
20050233588 |
Kind Code |
A1 |
Boettiger, Ulrich C. ; et
al. |
October 20, 2005 |
Semiconductor constructions
Abstract
The invention includes methods by which the size and shape of
photoresist-containing masking compositions can be selectively
controlled after development of the photoresist. For instance,
photoresist features can be formed over a substrate utilizing a
photolithographic process. Subsequently, at least some of the
photoresist features can be exposed to actinic radiation to cause
release of a substance from the photoresist. A layer of material is
formed over the photoresist features and over gaps between the
features. The material has a solubility in a solvent which is
reduced when the material interacts with the substance released
from the photoresist. The solvent is utilized to remove portions of
the material which are not sufficiently proximate to the
photoresist to receive the substance, selectively relative to
portions which are sufficiently proximate to the photoresist. The
photoresist features can be exposed to the actinic radiation either
before or after forming the layer of material.
Inventors: |
Boettiger, Ulrich C.;
(Boise, ID) ; Light, Scott L.; (Boise,
ID) |
Correspondence
Address: |
WELLS ST. JOHN P.S.
601 W. FIRST AVENUE, SUITE 1300
SPOKANE
WA
99201
US
|
Family ID: |
33552638 |
Appl. No.: |
11/115853 |
Filed: |
April 25, 2005 |
Related U.S. Patent Documents
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Application
Number |
Filing Date |
Patent Number |
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11115853 |
Apr 25, 2005 |
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10613193 |
Jul 3, 2003 |
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6905975 |
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Current U.S.
Class: |
438/689 ;
438/717 |
Current CPC
Class: |
G03F 7/0045 20130101;
G03F 7/40 20130101; G03F 7/2024 20130101 |
Class at
Publication: |
438/689 ;
438/717 |
International
Class: |
H01L 021/76 |
Claims
1-44. (canceled)
45. A semiconductor construction, comprising: a semiconductor
substrate; a plurality of first material lines over the substrate;
and second material shells around the first material lines, some of
the second material shells having a first thickness and others
having a second thickness different than the first thickness; the
shells and lines together forming a plurality of spaced-apart
horizontally-elongated structures over the substrate.
46. The construction of claim 45 wherein the first material
consists of photoresist and the second material consists of one or
more compositions cross-linked by one or more substances released
from the photoresist.
47. The construction of claim 45 wherein a single line has a first
thickness shell along one segment and a second thickness shell
along another segment adjacent the first segment.
48. The construction of claim 45 wherein the second thickness is
greater than the first thickness, and wherein a single line has a
second thickness shell along a segment that is between a pair of
segments that have first thickness shells along them.
49. The construction of claim 45 wherein: the lines have uppermost
surfaces and sidewall surfaces extending from the uppermost
surfaces to the substrate; the shells extend along the sidewall
surfaces and over the uppermost surfaces; the second thickness is
greater than the first thickness; and the shells having said second
thickness have a bread loaf appearance in at least one
cross-sectional view whereby the shells are thicker proximate the
uppermost surfaces of the lines than proximate the substrate.
50. The construction of claim 49 wherein the first material
consists of photoresist and the second material consists of one or
more compositions cross-linked by one or more substances released
from the photoresist.
51. A semiconductor construction, comprising: a semiconductor
substrate; a plurality of photoresist lines over the substrate, the
lines having uppermost surfaces and sidewall surfaces extending
from the uppermost surfaces to the substrate; second material
layers around the uppermost surfaces and sidewall surfaces of the
photoresist lines, some of the second material layers having a
first thickness and others having a second thickness greater than
the first thickness; the second material consisting of one or more
compositions cross-linked by one or more substances released from
the photoresist; and the layers and lines together forming a
plurality of spaced-apart horizontally-elongated structures over
the substrate; distances between adjacent spaced-apart
horizontally-elongated structures having the second thickness
second material layers being less than the distances between
adjacent spaced apart horizontally-elongated structures having the
first thickness second material layers.
52. The construction of claim 51 wherein the layers having said
second thickness have a bread loaf appearance in at least one
cross-sectional view whereby the layers are thicker proximate the
uppermost surfaces of the lines than proximate the substrate.
53. The construction of claim 51 wherein the first thickness is
greater than about 5 .ANG..
54. The construction of claim 51 wherein the first thickness is
greater than about 50 .ANG..
55. The construction of claim 51 wherein a single line has a first
thickness second material layer along one segment and a second
thickness second material layer along another segment adjacent the
first segment.
56. The construction of claim 51 wherein a single line has a second
thickness second material layer along a segment that is between a
pair of segments that have first thickness second material layers
along them.
Description
TECHNICAL FIELD
[0001] The invention pertains to methods of forming patterned
compositions, and in particular aspects pertains to methods of
forming photoresist-containing patterns over semiconductor
materials.
BACKGROUND OF THE INVENTION
[0002] A typical method of forming a pattern over a semiconductor
substrate is to utilize photolithographic processing to form a
patterned mask of photoresist over the substrate. FIG. 1 shows a
prior art construction 10 comprising a substrate 12 and several
patterned blocks 14 of photoresist formed over substrate 12. The
patterned blocks are separated from one another by gaps 15.
[0003] Substrate 12 can comprise, for example, a monocrystalline
silicon wafer. To aid in interpretation of this disclosure and the
claims that follow, the terms "semiconductive substrate" and
"semiconductor substrate" are defined to mean any construction
comprising semiconductive material, including, but not limited to,
bulk semiconductive materials such as a semiconductive wafer
(either alone or in assemblies comprising other materials thereon),
and semiconductive material layers (either alone or in assemblies
comprising other materials). The term "substrate" refers to any
supporting structure, including, but not limited to, the
semiconductive substrates described above.
[0004] Patterned blocks 14 can be formed by first providing a layer
of photoresist across an entirety of an upper surface of substrate
12, exposing the photoresist to patterned actinic radiation which
renders some portions of the photoresist more soluble in a
developing solvent than other portions, and subsequently utilizing
the developing solvent to remove portions of the photoresist and
leave the blocks 14 of the resist remaining over substrate 12. The
actinic radiation can be, for example, ultraviolet light. The
developing solvent can be any appropriate fluid (typically liquid)
utilized for developing a pattern in the photoresist after exposure
of the photoresist to actinic radiation. The term "developing
solvent" thus encompasses any developer solution, including
dissolving agents, organic solvents, etc.
[0005] Photoresist blocks 14 define a mask, and such mask can be
utilized for patterning underlying substrate 12. Specifically, the
substrate 12 can be subjected to an etch while the patterned mask
comprising blocks 14 protects various regions of substrate 12, and
accordingly openings will be formed selectively in regions of
substrate 12 which are not protected by one of the patterned blocks
14.
[0006] A continuing goal in semiconductor device processing is to
decrease dimensions of devices, and thereby conserve valuable
semiconductor substrate real estate. A minimum distance between
adjacent blocks 14 is constrained by parameters utilized in the
photolithographic process. Accordingly, various procedures have
been developed which can reduce a dimension of a gap between
adjacent features of a photoresist mask, and which can thereby be
utilized to reduce the size of features patterned utilizing the
mask. An exemplary process which can be utilized to reduce the size
of a gap between adjacent features of a photoresist mask is
described with reference to FIGS. 2 and 3.
[0007] Referring to FIG. 2, a material 16 is provided over and
between the discrete blocks 14 of the patterned photoresist mask.
Material 16 can comprise an AZ R composition available from
Clariant International, Ltd, such as, for example, the compositions
designated as AZ R200.TM., AZ R500.TM., and AZ R600.TM.. Such
composition can be spin coated across an entirety of the upper
surface of a semiconductor wafer, and is shown coated across the
entirety of fragment 10. The material is utilized with
chemically-amplified resist, and specifically is utilized with
resist having a photogenerated acid therein. The semiconductor
wafer having material 16 thereover is baked at a temperature from
about 100.degree. C. to about 120.degree. C. Such baking diffuses
acid from resist 14 into the material 16, to form chemical
crosslinks within portions of the material 16 that are proximate to
the various masses 14. Such causes portions of material 16 in
contact with resist blocks 14 to be selectively hardened relative
to other portions of material 16 that are not sufficiently
proximate to the resist blocks.
[0008] Referring to FIG. 3, material 16 is subjected to conditions
which selectively remove the portions of the material which have
not had chemical crosslinks formed therein, while leaving the
material that is in contact with photoresist masses 14 (i.e., the
portions which have had chemical crosslinks formed therein). Such
removal can be accomplished by exposing fragment 10 to an
appropriate solvent, such as, for example, 10% isopropyl alcohol in
deionized water, or a solution marketed as "SOLUTION C.TM. by
Clariant International, Ltd.
[0009] In applications in which AZ R200.TM., AZ R500.TM., or AZ
R600.TM. is utilized, fragment 10 can be subjected to a so-called
hard bake at a temperature of from about 100.degree. C. to about
140.degree. C. after removal of the non-crosslinked material. Such
hard bake can fully dry and further crosslink the portions of
material 16 remaining associated with photoresist blocks 14.
[0010] The material 16 remaining around blocks 14 increases a size
of the features of the patterned mask. In other words, photoresist
blocks 14 together with crosslinked material 16 form a patterned
composition over substrate 12, with such composition having
discrete masking features 18 separated by gaps 20. The gaps 20 are
smaller than the gaps 15 that had originally been present between
blocks 14 of FIG. 1. The smaller gaps 20 can enable smaller
openings to be patterned into substrate 12 than could be patterned
with the photoresist blocks 14 alone, which can enable fabrication
of smaller circuit device components relative to the size of the
components which would be formed utilizing photoresist blocks 14
alone.
[0011] The processing of FIGS. 2 and 3 can provide a significant
improvement relative to processes which utilize photoresist alone.
It would be desirable to develop further improvements of
methodologies for forming patterned masking compositions, and in
particular it would be desirable to develop improvements enabling
selective control of the thickness associated with the features of
a patterned masking composition.
SUMMARY OF THE INVENTION
[0012] In one aspect, the invention encompasses a method in which a
substrate is provided having photoresist thereover. The photoresist
is in a pattern comprising a pair of physically separate features.
A region of the photoresist is exposed to actinic radiation to
alter at least one property of the photoresist. A layer of material
is formed over the features and over a gap between the features.
The material has a solubility in a developing solvent which is
reduced when the material is proximate the altered photoresist. The
layer of material is subsequently exposed to the solvent to
selectively remove a portion of the material which is not proximate
the region of altered photoresist relative to a portion of the
material which is proximate the altered photoresist.
[0013] In one aspect, the invention encompasses a method wherein
photoresist is formed over a substrate and subjected to first
actinic radiation to render a first region of the photoresist more
soluble in a first solvent than a second region. The first solvent
is subsequently utilized to remove the first region of the
photoresist while leaving the second region. The second region of
the photoresist is then exposed to second actinic radiation, and
the photoresist of the second region releases a substance in
response to the exposure to the second actinic radiation. A
material is formed over the second region of the photoresist. The
material is rendered less soluble in a second solvent through
interaction with the substance released from the photoresist. The
second solvent is then utilized to selectively remove a portion of
the material which is not proximate the photoresist relative to a
portion of material which is proximate the photoresist.
BRIEF DESCRIPTION OF THE DRAWINGS
[0014] Preferred embodiments of the invention are described below
with reference to the following accompanying drawings.
[0015] FIG. 1 is a diagrammatic, cross-sectional view of a
semiconductor wafer fragment at a preliminary processing stage of a
prior art method.
[0016] FIG. 2 is a view of the FIG. 1 wafer fragment shown at a
prior art processing stage subsequent to that of FIG. 1.
[0017] FIG. 3 is a view of the FIG. 1 wafer fragment shown at a
prior art processing stage subsequent to that of FIG. 2.
[0018] FIG. 4 is a view of a semiconductor wafer fragment shown at
a preliminary processing stage in accordance with an exemplary
method of the present invention.
[0019] FIG. 5 is a top view of a portion of the semiconductor wafer
substrate comprising the fragment of FIG. 4 along the line 4-4.
[0020] FIG. 6 is a view along the cross section of FIG. 4, showing
the FIG. 4 wafer fragment at a processing stage subsequent to that
of FIG. 4.
[0021] FIG. 7 is a top view of a portion of the semiconductor wafer
comprising the fragment of FIG. 6 along the line 6-6.
[0022] FIG. 8 is a view along the cross section of FIG. 4, showing
the FIG. 4 wafer fragment at a processing stage subsequent to that
of FIG. 6.
[0023] FIG. 9 is a top view of a portion of the semiconductor wafer
comprising the fragment of FIG. 8 along the line 8-8.
[0024] FIG. 10 is a view along the cross section of FIG. 4 showing
the FIG. 4 wafer fragment at a processing stage subsequent to that
of FIG. 8.
[0025] FIG. 11 is a top view showing a portion of the semiconductor
wafer comprising the fragment of FIG. 10 along the line 10-10.
[0026] FIG. 12 is a view along the cross section of FIG. 4 showing
the FIG. 4 wafer fragment at a processing stage subsequent to that
of FIG. 10.
[0027] FIG. 13 is a top view of a portion of the semiconductor
wafer comprising the FIG. 12 wafer fragment along the line
12-12.
[0028] FIG. 14 is a view along the cross-section of FIG. 4 showing
the FIG. 4 wafer fragment at a processing stage subsequent to that
of FIG. 6 in accordance with a second aspect of the invention.
[0029] FIG. 15 is a view of the FIG. 4 wafer fragment shown at a
processing stage subsequent to that of FIG. 14 in accordance with
the second aspect of the invention.
[0030] FIG. 16 is the view of the FIG. 4 wafer fragment shown at a
processing stage subsequent to that of FIG. 15 in accordance with
the second aspect of the invention.
[0031] FIG. 17 is an expanded view of a portion of the FIG. 4 wafer
fragment shown at a processing stage subsequent to that of FIG. 15
in accordance with a third aspect of the invention.
[0032] FIG. 18 is a view of the FIG. 4 wafer fragment shown at a
processing stage similar to that of FIG. 12, in accordance with a
fourth aspect of the invention.
DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS
[0033] This disclosure of the invention is submitted in furtherance
of the constitutional purposes of the U.S. Patent Laws "to promote
the progress of science and useful arts" (Article 1, Section
8).
[0034] In particular aspects, the present invention enables
selective control of the size and shape of resist-containing
features after development of the resist. The resist feature
manipulations can be incorporated into improvements in
semiconductor fabrication processes. Such improvements can include,
for example, locally selectable control of the growth size of
resist features or feature parts, even when such parts have roughly
the minimum feature size available at the maximum resolution
achievable with a particular photolithographic tool and process;
control of the size of particular features with nanometer accuracy;
adjustment of feature critical dimensions in a feed forward
process, which can utilize, for example, critical dimension
measurement after photoresist development, and subsequent
modification of the critical dimension across part of a wafer, or
alternatively all of a wafer, utilizing methodology of the present
invention; and selective formation of variable overhang structures,
such as can be used in, for example, lift-off processes or
self-aligned implants with tapered dose profiles. If methodology of
the present invention is utilized to adjust feature critical
dimensions in a feed forward process, such dimensions can be
adjusted uniformly across a wafer, uniformly across a particular
die associated with the wafer, and/or in specifically selected
local areas to compensate for particular non-uniformities, such as,
for example, to compensate for wafer and/or die
non-uniformities.
[0035] An exemplary process of the present invention is described
with reference to FIGS. 4-13. Referring initially to FIG. 4, such
illustrates a semiconductor wafer fragment 50 comprising a
substrate 52 having a layer of photoresist 54 formed thereover.
Substrate 52 can comprise, for example, a semiconductor substrate
similar to the substrate 12 described previously with reference to
the prior art. In particular aspects, substrate 52 can comprise a
monocrystalline silicon wafer having various materials or layers
supported thereover (not shown) which ultimately are to be
patterned with a mask derived from photoresist layer 54.
[0036] A pattern of actinic radiation 56 is shown directed toward
photoresist 54. The patterned actinic radiation can be formed by
passing suitable radiation through a photomask. The patterned
radiation divides the photoresist into first regions 60 and second
regions 62. Specifically, the actinic radiation strikes the second
regions 62, and does not impact the first regions 60, and such
alters the relative solubility of first regions 60 and second
regions 62 in a developing solution. The radiation can render
second region 62 to be more soluble in a developing solution, or
less soluble, depending on whether the photoresist is a positive or
negative resist.
[0037] Regardless of whether the resist is a positive or negative
resist, the resist will typically be a chemically amplified resist.
Accordingly, the resist will release a substance (i.e., the
chemical utilized for the chemical amplification) in response to
the exposure to the actinic radiation, and such substance will
amplify the effect of the actinic radiation. In particular aspects,
the substance released by the radiation can be a photogenerated
acid, and a proton from such acid can be the chemical which
amplifies the effect of the radiation. The chemical amplification
may occur for a period of time after the exposure to the actinic
radiation, and in some aspects the temperature of the resist can be
increased for a period of time following the exposure to the
radiation (a so-called "bake") to enhance the chemical
amplification.
[0038] FIG. 5 is a top view of the FIG. 4 structure, and shows the
regions 60 and 62 alternating across an upper surface of the
structure. The actinic radiation 56 is not shown in the top view of
FIG. 5 to simplify the illustration. Although regions 60 are shown
with narrower widths than regions 62, it is to be understood that
regions 60 can be wider than regions 62, or about the same width as
regions 62 in other embodiments (not shown).
[0039] Referring to FIG. 6, second regions 62 (FIG. 4) are
selectively removed relative to first regions 60 utilizing a
developer solution, and such forms a patterned mask of photoresist
material 54 over an upper surface of substrate 52. Although the
regions exposed to the actinic radiation (second regions 62 of FIG.
4) have been selectively removed relative to the regions which were
not exposed to the radiation (first regions 60), it is to be
understood that the first regions could alternatively have been
selectively removed, depending on whether the resist is a positive
resist or a negative resist.
[0040] The first regions 60 remaining in FIG. 6 correspond to a
plurality of physically separate features 70, 72, 74, 76, 78, 80,
82, 84, 86, 88 and 90. The physically separate resist features can
be considered to be discrete relative to one another, and are
separated by gaps 92. Various of the features can be considered to
be paired adjacent features. For instance, features 70 and 72 can
be considered to be paired adjacent features, as can features 72
and 74, etc.
[0041] FIG. 7 is a top view of the FIG. 6 structure, and shows the
features 70, 72, 74, 76, 78, 80, 82, 84, 86, 88 and 90 extending
across an upper surface of substrate 52 as lines. It is to be
understood that the features can comprise other shapes (not shown)
in various aspects of the invention.
[0042] FIGS. 8 and 9 show construction 50 at a processing stage
subsequent to that of FIGS. 6 and 7. Specifically, features 78, 80
and 82 are exposed to actinic radiation 100 to release one or more
substances from the photoresist of the features. Actinic radiation
100 can be referred to as second actinic radiation to distinguish
it from the first actinic radiation 56 utilized in FIG. 4. The
second actinic radiation and the first actinic radiation can be
light, and in particular aspects can be identical in dose and
primary wavelength relative to one another. In other aspects, the
first and second actinic radiation can differ in dose and/or
primary wavelength relative to one another. The term "primary
wavelength" is utilized to refer to the predominant wavelength of
the radiation.
[0043] One exemplary reason for having the second actinic radiation
different from the first actinic radiation is to enable the profile
of the second actinic radiation to be tailored to be different than
the first actinic radiation. Such tailoring can, for example,
enable strong absorption of the second actinic radiation to occur
only at selected regions of photoresist (to form, for example, the
structure described below with reference to FIG. 17). Another
exemplary reason for having the second actinic radiation different
from the first actinic radiation is to enable a selective response
of the photoresist to the first and second radiations. For
instance, the photoresist could be formulated to contain a
substance which responds only to the second radiation, in addition
to the substance which responds to the first radiation. The
photoresist could then be patterned with the first radiation, and
then be very specifically and selectively further patterned with
the second radiation. There can, of course, also be advantages to
having the second actinic radiation be identical to the first
actinic radiation, such as, for example, that both the first and
second actinic radiation can then activate the same amplification
materials in a photoresist.
[0044] Either or both of the first and second actinic radiations
can comprise a constant dose or a variable dose. It can be
advantageous to utilize a variable dose of the second actinic
radiation to enable controlled adjustment of the amount of material
formed over the exposed photoresist regions in the subsequent
processing described below with reference to FIGS. 10-13.
[0045] In aspects in which the second actinic radiation 100 has a
suitable wavelength to activate unused chemical amplification
materials remaining within the photoresist after the exposure of
FIG. 4, the one or more substances released in the photoresist
during the exposure to the second actinic radiation 100 will
typically include chemicals associated with chemical amplification
of the resist. In particular aspects, such substances will
comprise, consist essentially, or consist of photogenerated acids
released by exposure of the resist features to the second actinic
radiation. It is to be understood that the exposure to second
actinic radiation 100 can be generally considered to alter at least
one property of the photoresist exposed to such actinic
radiation.
[0046] FIG. 9 schematically illustrates actinic radiation 100 as a
block covering only portions of the exposed photoresist features
78, 80 and 82.
[0047] The amount of substance released from the photoresist at the
processing of FIGS. 8 and 9 (for example, the amount of
photogenerated acid formed) can be controlled by controlling the
dose of second actinic radiation, and/or controlling the
temperature of the photoresist during and/or after exposure to the
second actinic radiation (for example, subjecting the photoresist
to a bake of controlled temperature and duration after the exposure
of the photoresist to the second actinic radiation).
[0048] Referring to FIG. 10, a material 110 is provided over
features 70, 72, 74, 76, 78, 80, 82, 84, 86, 88 and 90; and also
within gaps 92. FIG. 11 shows material 110 entirely covering the
illustrated portion of construction 50. Material 110 has a
solubility in a solvent which is reduced when the material
interacts with the one or more substances released from the
photoresist during exposure to second actinic radiation 100. For
instance, material 110 can correspond to one of the compositions
designated as AZ R200.TM., AZ R500.TM. and AZ R600.TM. by Clariant
International, Ltd. In such aspect, the substance released by
exposure to the second actinic radiation can be a photogenerated
acid, and a component of such acid (such as, for example, a proton)
can diffuse into the material 110 to induce crosslinking within
portions of material 110 which are proximate the photoresist that
had been exposed to second actinic radiation 100. If material 110
corresponds to the composition designated as AZ R200.TM., AZ
R500.TM. or AZ R600.TM., construction 50 can be subjected to a bake
at a temperature of from about 100.degree. C. to about 120.degree.
C. to diffuse released photogenerated acid, or a component thereof,
from the photoresist into material 110.
[0049] Referring to FIGS. 12 and 13, construction 50 is illustrated
after being exposed to an appropriate solvent to remove portions of
material 110 (FIGS. 10 and 11) which are not proximate photoresist,
and which therefore have not had substances released from the
photoresist diffused therein (or otherwise been affected by altered
properties of photoresist exposed to actinic radiation), relative
to portions of material 110 that are sufficiently proximate the
photoresist to be influenced by substances released from the
photoresist. If material 110 comprises one of the compositions
designated as AZ R200, AZ R500.TM. or AZ R600.TM. by Clariant
International, Ltd., the solvent can comprise, for example,
"SOLUTION C.TM.", or diluted isopropyl alcohol, for example. The
portions of material 110 remaining in FIG. 12 are in the form of
layers 112, 114, 116, 118, 120, 122, 124, 126, 128, 130 and 132
formed over features 70, 72, 74, 76, 78, 80, 82, 84, 86, 88 and 90,
respectively. The features comprising photoresist 60 in combination
with the remaining portions of material (i.e., the layers of
material shown in FIG. 12) can be considered to correspond to a
patterned composition extending over substrate 52.
[0050] The layers 112, 114, 116, 126, 128, 130 and 132 are
relatively thin compared to layers 120, 122 and 124; and are formed
from substances remaining in the photoresist from the exposure to
the first actinic radiation 56. Accordingly, layers 112, 114, 116,
118, 126, 128, 130 and 132 correspond essentially to layers which
can be formed by the prior art processing of FIGS. 2 and 3. In
contrast, layers 120, 122 and 124 are thickened by the selective
exposure of features 78, 80 and 82 to the second actinic radiation
100 (FIGS. 8 and 9). Such is a significant deviation from the prior
art, in that the photoresist features have been subjected to
actinic radiation after the initial patterning of the features, and
such exposure has been utilized to selectively thicken a material
subsequently crosslinked over the photoresist. The gaps 92 between
layers 120, 122 and 124 (i.e., the gaps between adjacent features
78 and 80, and between adjacent features 80 and 82) are
significantly smaller than the gaps between other layers, such as,
for example, the gaps between layers 112 and 144 or layers 130 and
132. Further, the gap 92 between adjacent features 76 and 78 has an
intermediate size relative to the large gap between adjacent
features 70 and 72, and the small gap between adjacent features 78
and 80. The intermediate sized gap results from the exposure of
only one of the adjacent features 76 and 78 to the second actinic
radiation 100.
[0051] It is noted that the invention encompasses aspects (not
shown) in which the first actinic radiation does not lead to
formation of any layers from material 110, and in such aspects the
only layers of material present at the processing stage of FIG. 12
would be layers 120, 122 and 124. It is more typical, however, for
the photoresist exposed only to the first actinic radiation to form
the shown narrow layers (layer 112, etc.). The narrow layers would
have a measurable thickness, which can be, in particular aspects, a
thickness greater than about 5 .ANG., and in some aspects can be a
thickness greater than 50 .ANG..
[0052] FIG. 13 shows that the widened portions associated with
features 78, 80 and 82 are only over the regions exposed to second
actinic radiation 100 (FIG. 9).
[0053] Although the processing of FIGS. 4-13 comprises exposure to
the second actinic radiation 100 (FIGS. 8 and 9) occurring before
provision of the material 110 (FIGS. 10 and 11), it is to be
understood that the order can be reversed if material 110 is
suitably transparent to the actinic radiation 100. Such is
illustrated in FIGS. 14-16. In referring to FIGS. 14-16, similar
numbering will be utilized as was used above in describing FIGS.
4-13, where appropriate.
[0054] Referring to FIG. 14, construction 50 is shown at a
processing stage subsequent to that of FIG. 6, and is shown with
material 110 formed over features 72, 74, 76, 78, 80, 82, 84, 86,
88 and 90 of resist 60.
[0055] Referring to FIG. 15, features 78, 80 and 82 are exposed to
actinic radiation 100 passing through material 110. It is noted
that if material 110 comprises AZ R200.TM., AZ R500.TM. or AZ
R600.TM., the above-described bake of the material at from about
100.degree. C. to 120.degree. C. can occur before exposure to
actinic radiation 100 as well as during or after the exposure; or
can occur only during and/or after the exposure to actinic
radiation 100.
[0056] Referring to FIG. 16, construction 50 is illustrated after
utilization of an appropriate solvent to remove portions of
material 110 which were not sufficiently proximate to photoresist
60 to be crosslinked or otherwise altered by substances diffusing
from the photoresist. Remaining portions of material 110 form
layers 112, 114, 116, 118, 120, 124, 126, 128, 130, 132 and 134
around the photoresist of features 70, 72, 74, 76, 78, 80, 82, 84,
86, 88 and 90.
[0057] The construction of FIG. 16 (i.e., the construction formed
in accordance with a second embodiment of the invention) is shown
to be identical to the construction of FIG. 12 (i.e., the
construction formed in accordance with the first embodiment of the
invention). However, it is to be understood that the processing of
the second embodiment can lead to structures other than those
accomplished by the processing of the first embodiment, and vice
versa.
[0058] Although the first and second embodiments are shown forming
layers which are uniform in thickness around the entirety of a
block, such can be modified by choosing a dose of radiation which
treats a block of photoresist differently along its elevational
thickness. FIG. 17 shows an expanded view of construction 50 at a
processing stage analogous to that of FIG. 16, but in accordance
with an embodiment of the invention for forming a layer with a
differing thickness at differing locations of the elevational
height of the layer. The expanded view shows only features 78, 80
and 82.
[0059] The photoresist blocks 60 comprise top surfaces 61 and
sidewall surfaces 63 extending from the top surfaces to the
substrate 52. The sidewall surfaces have upper portions 65
proximate the top surfaces 61 and lower portions 67 below the upper
portions (only some of the upper portions and lower portions are
labeled). The exposure to the second actinic radiation 100 (FIGS.
8, 9 and 15) can be conducted so that upper portions of the
photoresist blocks are exposed to more of the actinic radiation
than are lower portions of the blocks (with the upper portions
being elevationally coextensive with the upper portions of the
sidewall surfaces, and the lower portions of blocks being
elevationally coextensive with the lower portions of the sidewall
surfaces). In particular aspects, the lower portions of the blocks
are not exposed to any of the second actinic radiation.
[0060] In an exemplary aspect of the invention, the processing of
FIG. 15 can be utilized, material 110 can comprise a composition
which absorbs some of the actinic radiation 100, and the dose and
wavelength of the actinic radiation can be chosen such that the
radiation substantially only penetrates to the upper portions of
the exposed photoresist features. The layers 120, 122 and 124
formed from material 110 are thicker over the upper portions of
photoresist blocks 60 (i.e. are thicker over the portions which
have been exposed to the actinic radiation 100) than over the lower
portions of the photoresist blocks. In some aspects, the layer can
be substantially nonexistent over the lower portions of the blocks,
and in other aspects the layer can have a measurable thickness over
the lower portions of the blocks (as shown). A measurable thickness
can be, for example, a thickness of at least about 5 .ANG., and
typically is at least about 50 .ANG..
[0061] The shown layers 120, 122 and 124 of FIG. 17 have a "bread
loaf" appearance, which can significantly restrict the width of
gaps 92 between adjacent structures 78 and 80, and between adjacent
structures 80 and 82. Such can be desired in particular aspects of
the invention, and can be particularly desired in aspects in which
the layers 120, 122 and 124 are to be utilized in a lift-off
process.
[0062] The processing described above with reference to FIGS. 4-16
shows that only some of the photoresist features over a substrate
are exposed to the second dose of actinic radiation, and further,
that an exposed feature can have only a portion exposed to the
second actinic radiation while other portions of the feature are
not exposed. It is to be understood, however, that the invention
includes other aspects in which an entirety of a photoresist
feature is exposed to second actinic radiation, as well as aspects
in which all of the photoresist features over a semiconductor wafer
substrate are exposed to the second actinic radiation. FIG. 18
shows construction 50 at a processing step similar to that of FIG.
12 or 16, but in which all of the features 70, 72, 74, 76, 78, 80,
82, 84, 86, 88 and 90 have been exposed to the second actinic
radiation, so that all of the layers 112, 114, 116, 118, 120, 122,
124, 126, 128, 130 and 132 are uniformly thick.
[0063] In compliance with the statute, the invention has been
described in language more or less specific as to structural and
methodical features. It is to be understood, however, that the
invention is not limited to the specific features shown and
described, since the means herein disclosed comprise preferred
forms of putting the invention into effect. The invention is,
therefore, claimed in any of its forms or modifications within the
proper scope of the appended claims appropriately interpreted in
accordance with the doctrine of equivalents.
* * * * *