U.S. patent application number 10/964032 was filed with the patent office on 2005-03-24 for via and metal line interface capable of reducing the incidence of electro-migration induced voids.
Invention is credited to Catabay, Wilbur G., May, Charles E..
Application Number | 20050064708 10/964032 |
Document ID | / |
Family ID | 34312065 |
Filed Date | 2005-03-24 |
United States Patent
Application |
20050064708 |
Kind Code |
A1 |
May, Charles E. ; et
al. |
March 24, 2005 |
Via and metal line interface capable of reducing the incidence of
electro-migration induced voids
Abstract
Embodiments of the invention include a method for forming copper
interconnect structure. The method involves providing a substrate
having a copper conductive layer formed thereon. An insulating
layer having openings is formed on the conductive layer so that the
openings expose portions of the underlying conductive layer at the
bottom of the openings. A barrier layer is formed on the surface of
the substrate. A portion of the barrier layer is removed at the
bottom of the opening to expose the underlying conductive layer. A
copper plug is formed in the opening such that the bottom of the
plug is in contact with the exposed conductive layer. The substrate
can be subjected to further processing if desired. The invention
also includes a copper interconnect structure having increased
resistance to electromigration.
Inventors: |
May, Charles E.; (Gresham,
OR) ; Catabay, Wilbur G.; (Saratoga, CA) |
Correspondence
Address: |
LSI LOGIC CORPORATION
1621 BARBER LANE
MS: D-106
MILPITAS
CA
95035
US
|
Family ID: |
34312065 |
Appl. No.: |
10/964032 |
Filed: |
October 12, 2004 |
Related U.S. Patent Documents
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Application
Number |
Filing Date |
Patent Number |
|
|
10964032 |
Oct 12, 2004 |
|
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10400297 |
Mar 26, 2003 |
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Current U.S.
Class: |
438/687 ;
438/629 |
Current CPC
Class: |
H01L 21/76844
20130101 |
Class at
Publication: |
438/687 ;
438/629 |
International
Class: |
H01L 021/4763 |
Claims
1-18. (Canceled).
19. A copper interconnect structure having increased resistance to
electromigration, the interconnect comprising: a semiconductor
substrate; a conductive layer formed of copper-containing material
formed on the substrate; an insulating layer formed on the at least
one conductive layer, the insulating layer having an opening that
exposes a portion of the underlying conductive layer at the bottom
of the opening the opening also including sidewalls; a barrier
layer formed on the sidewall of the opening, the barrier layer
being formed of a material that is resistant to copper diffusion
into the insulating layer; and a conductive plug comprised of
copper-containing material is formed in the opening such that the
bottom of the plug is in contact with the underlying exposed
conductive layer.
20. The copper interconnect of claim 19 wherein the insulating
layer is formed of low-K dielectric.
21. The barrier layer of claim 19 wherein the metal barrier layer
is formed of material including at least one of tantalum, tantalum
nitride, titanium, titanium nitride, palladium, chromium, tantalum,
magnesium, and molybdenum.
22. A semiconductor integrated circuit incorporating the structure
of claim 19.
Description
TECHNICAL FIELD
[0001] The invention described herein relates generally to
semiconductor devices and processing. In particular, the invention
relates to semiconductor devices and processes that incorporating
improved via and copper interconnect structures. And most
particularly, the invention relates forming an improved interface
between a copper interconnect and an associated copper-filled via
structure.
BACKGROUND
[0002] The semiconductor industry makes wide use of copper
conductive lines and interconnect structures in the construction of
semiconductor devices. Copper has proven to be a very useful
material for a number of reasons. For example, copper has a lower
resistivity than aluminum. As a result, copper circuitry suffers
less from resistance-capacitance (RC) delays. This makes copper
systems faster.
[0003] However, copper has the disadvantage of high diffusivity
through dielectric and silicon materials on which the copper is
deposited. This is especially problematic when used with so-called
low-K dielectric materials, which are coming into increasingly
common usage. Diffusion of copper into insulating layers comprised
of low-K dielectric materials can result in serious problems.
Diffusion of copper into low-K materials typically "poisons" the
materials so that semiconductor device failure is common. The
industry has adapted to this problem by implementing barrier layers
to prevent the diffusion of copper into the affected materials.
Typically, the barrier materials consist of thin layers of material
interposed between copper layers and low-K dielectric layers.
[0004] Although such barrier layers are effective at preventing the
diffusion of copper materials, such barrier layers come with their
own set of process difficulties. One such problem is that barrier
layers can contribute to electromigration induced voiding in copper
interconnect structures. Such voiding is a common source of circuit
failure in copper based semiconductor structures. Such voiding is
particularly problematic when it occurs in via structures. Research
has shown that electromagnetic voiding is particularly common at
the interface between the copper layer and the barrier layer.
[0005] This problem can be illustrated with reference to the
schematic cross-section views illustrated in FIG. 1(a) and FIG.
1(b). In FIG. 1(a), a conventional semiconductor substrate 100 is
depicted. A wafer surface 102 is depicted with a metal interconnect
line 104 formed therein. Such wafers 102 are commonly formed of
silicon or doped silicon. The metal interconnect line 104 is
typically formed using copper or copper-containing materials (e.g.,
copper alloys or copper laminates and the like). An insulating
layer 105 comprised of electrically insulating material (e.g.,
SiO.sub.2, low-K dielectrics, and other like materials) is formed
over the wafer surface 102. In order to make electrical connections
to overlying layers (not shown) openings 108 are formed in the
insulating layer 105 to expose the underlying metal interconnect
line 104. Such openings 108 are commonly formed using damascene or
dual-damascene fabrication processes. A barrier layer 106 is
commonly formed on the wafer surface 102 covering the insulating
layer 105 and also covering the bottom and sidewalls of the opening
108. Subsequently, a plug 107 is formed in the opening 108 to form
a via structure. The plug 107 is formed of a copper or
copper-containing material constructed using ordinary fabrication
techniques known to persons having ordinary skill in the art. The
barrier layer 106 prevents diffusion of the copper from the plug
107 into the insulating layer 103.
[0006] An additional feature of such structures are the presence of
minute voids 105 in the interconnect line 104. During the ordinary
operation of integrated circuit structures containing such copper
interconnects, copper atoms migrates within the interconnect lines
104. Additionally, it has been determined that one of the major
pathways for such copper migration is the interface 110 between the
interconnect line 104 and the barrier layer 106. Under certain
common operating conditions this copper migration causes the voids
105 to move. In the depicted embodiment, the voids 105 move in a
direction indicated by the arrow 111. Over time the migrating voids
105 tend to aggregate.
[0007] As depicted in FIG. 1(b) the aggregate voids 105' can become
quite sizable. In fact the aggregate voids 105' can be come so
large that they occlude the conduction pathways in the interconnect
lines 104. Also, the aggregate voids 105' can occlude the
connections between certain vias and the interconnect lines. FIG.
1(b) depicts this problem. The aggregate void 105' has migrated to
the interface between the plug 107 and the interconnect line 104.
Also, the aggregate void 105' has grown so large that it destroys
the current path between the plug 107 and the interconnect line
104. Current solutions to this problem require that a secondary via
be constructed so that when one via fails a conduction path can
still be achieved through the secondary via. Although such
solutions work well enough for their intended purpose, improved
solutions are desirable.
SUMMARY OF THE INVENTION
[0008] In accordance with the principles of the present invention,
an improved interconnection structure and method for its
fabrication are disclosed.
[0009] In general, the present invention is directed toward methods
and structures that formed interconnect structures having increased
electromigration lifetimes and a lower incidence of void induced
circuit failures. In one implementation of the invention, vias are
formed so that there is no barrier layer formed at the interface
between the bottom of a copper plug and the underlying copper line.
As desired, such structures can exhibit increased electromigration
lifetimes and a lower incidence of void induced circuit
failures.
[0010] One embodiment of the invention includes a method for
forming a copper interconnect structure. The method involves
providing a substrate configured in readiness for conductive via
formation. The substrate includes a conductive layer formed of
copper-containing material with an insulating layer formed thereon.
The insulating layer has an opening that exposes a portion of the
underlying conductive layer. A barrier layer is formed on the
insulating layer and on the surfaces of the opening as well as on
the exposed portion of the conductive layer. The portion of the
barrier layer at the bottom of the opening is removed to expose a
portion of the underlying conductive layer. A conductive plug is
formed with a copper-containing material in the opening such that
the bottom of the plug is in contact with the exposed conductive
layer. Thus, the interface between the plug and the underlying
conductive layer is formed without a barrier layer at the
interface.
[0011] In a related embodiment, the barrier layer is formed as a
non-uniform barrier layer having a greater thickness on the
insulating layer and on the sidewalls of the opening, whereas the
portion of the barrier layer formed on the bottom of the opening is
formed having a relatively thinner dimension.
[0012] Another embodiment comprises a copper interconnect
structure. The structure comprises a semiconductor substrate having
a conductive layer formed thereon. The conductive layer being
formed of copper-containing materials. An insulating layer is
formed on the conductive layer and includes openings that expose
portions of the underlying conductive layer at the bottom of the
openings. The openings include a layer(s) of barrier material
formed on the sidewalls of the openings. The barrier layer(s) is
formed of materials that are resistant to copper diffusion to
prevent copper from diffusing into the insulating layer. Conductive
plugs comprised of copper-containing material are formed in the
openings such that the bottom of the plugs are in contact with the
underlying exposed portions of the conductive layer.
[0013] Other aspects and advantages of the invention will become
apparent from the following detailed description and accompanying
drawings which illustrate, by way of example, the principles of the
invention.
BRIEF DESCRIPTION OF THE DRAWINGS
[0014] The following detailed description will be more readily
understood in conjunction with the accompanying drawings, in
which:
[0015] FIGS. 1(a) and 1(b) are simplified schematic cross-section
views of a conventional copper interconnect structure illustrating
the problem of voiding in conventional circuit structures.
[0016] FIGS. 2(a)-2(d) are simplified cross-sectional views of a
semiconductor substrate used to illustrate aspects of a method
embodiment used to construct an interconnect structure in
accordance with the principles of the invention.
[0017] FIGS. 3(a)-3(d) are simplified cross-sectional views of a
semiconductor substrate having an interconnect embodiment formed
thereon in accordance with the principles of the invention.
[0018] FIGS. 4(a)-4(d) are simplified cross-sectional views of a
semiconductor substrate illustrating yet another embodiment of an
interconnect structure formed thereon in accordance with the
principles of the invention.
[0019] FIG. 5 is a figurative depiction of a semiconductor wafer
formed having interconnect structures of the type described herein
comprising part of its circuitry in accordance with the principles
of the invention.
[0020] FIG. 6 is a flow diagram that describes a method embodiment
for implementing a process for constructing a copper interconnect
in accordance with the principles of the present invention.
[0021] It is to be understood that in the drawings like reference
numerals designate like structural elements. Also, it is understood
that the depictions in the Figures are not necessarily to
scale.
DETAILED DESCRIPTION OF THE DRAWINGS
[0022] The present invention has been particularly shown and
described with respect to certain embodiments and specific features
thereof. The embodiments set forth hereinbelow are to be taken as
illustrative rather than limiting. It should be readily apparent to
those of ordinary skill in the art that various changes and
modifications in form and detail may be made without departing from
the spirit and scope of the invention.
[0023] In the following detailed description, various method
embodiments for forming conducting structures in layers of
insulating materials will be disclosed. In particular, the depicted
structures show the formation of copper conducting structures that
are suitable for interconnecting copper lines of one layer in a
multi-layer semiconductor device to other underlying copper lines.
The inventors specifically contemplate that the principles of the
invention are not strictly confined to copper materials but that
they can also be applied to copper-containing materials as well.
Moreover, the inventors contemplate that the principles of the
invention are not limited to just interconnect and via structures,
but that they can also be applied to any interconnections between
conducting structures in a semiconductor substrate.
[0024] During ordinary course of operation, the via 107 of FIGS.
1(a) and 1(b) has a high density of copper (Cu) ion flux. The
presence of the barrier layer 106 in region 110 contributes
significantly to the formation of voids at the metal/via
interconnect. An aspect of the present invention is directed to
reducing the incidence of voiding and circuit failure at the
interface between the via and the underlying conducting layer by
removing the barrier layer at the interface.
[0025] FIGS. 2(a)-2(d) illustrate one method embodiment used for
constructing an improved via/interconnect structure. FIG. 2(a)
depicts a suitable substrate in readiness for the formation of such
an improved via/interconnect structure. The substrate 200 typically
comprises a semiconductor substrate having a conducting layer 204
formed thereon. Such conducting layers 204 are typically, formed of
copper-containing materials. One typical example is a conducting
layer 204 that is comprised substantially of copper. However, the
inventors point out that such copper containing conducting layers
204 can include, without limitation, copper alloy materials,
multi-layer structures containing copper, as well as other like
materials.
[0026] An insulating layer 203 is formed on the substrate surface.
The insulating layer 203 is formed over the conducting layer 204.
The insulating layer 203 is commonly referred to as an inter-layer
dielectric (ILD). Although in many implementations, a barrier
material is formed over the conducting layer 204 such that the ILD
203 lies over the barrier material. The barrier material is
intended to prevent copper diffusing from the conducting layer 204
into the ILD 203. For illustration purposes these drawings do not
include the aforementioned barrier material.
[0027] In continuation, for many embodiments the ILD 203 is formed
of low-K dielectric materials or other electrically isolating
materials. The principles of the present invention find particular
utility when applied to use with low-K dielectric materials.
Examples of such materials include spin-on and CVD polymeric
materials based on silicon or carbon, or based on combinations of
silicon and carbon. Particular low-K materials include, but are not
limited to: organic thermoplastic and thermosetting polymers such
as polyimides, polyarylethers, benzocyclobutenes,
polyphenylquinoxalines, polyquinolines; inorganic and spin-on glass
materials such as silsesquioxanes, silicates, and siloxanes; and,
mixtures, or blends, of organic polymers and spin-on glasses.
Further, examples of CVD low-K materials include SiCOH or polymers
of parylene and napthalene, copolymers of parylene with
polysiloxanes or teflon, and polymers of polysiloxane. Other ILD
203 materials include, but are not limited to, silicon dioxide or
combinations of silicon dioxide and other doped dielectrics (e.g.,
BPSG, PSG).
[0028] Openings 208 are formed in the ILD 203 to expose the
underlying conducting layers. Such openings 208 are typically
formed using methodologies well known to those having ordinary
skill in the art. Suitable techniques include, but are not limited
to, damascene and dual damascene fabrication processes. So far, the
structure 200 is formed in accordance with well-known convention
semiconductor fabrication processes. The openings expose a portion
of the underlying conducting layer 204.
[0029] In many applications, the substrate is now pre-cleaned to
remove native oxides. In particular, such pre-cleaning is employed
to remove a thin layer of copper oxide from the exposed portion of
the underlying conducting layer 204 at the bottom of the opening. A
typical approach for pre-cleaning involves sputtering the surface
with a plasma formed using argon, hydrogen, or carbon fluoride
(CF.sub.x) materials. Such sputtering should be conducted until
about 50 .ANG. of oxide are removed. Techniques for achieving such
pre-cleaning are known to persons having ordinary skill in the art.
At this point a copper diffusion barrier layer 206 can be
formed.
[0030] Such a barrier layer 206 is formed on the substrate. In
particular, the barrier layer 206 is formed so that it coats the
sidewalls and bottom of the opening 208. In the depicted
embodiment, the barrier layer 206 covers the underlying conducting
layer 204 to form a bottom barrier layer 206b. The disadvantages of
this bottom barrier layer 206b have already been discussed. The
barrier layer 206 is formed to prevent the diffusion of copper into
the ILD 203. Typical barrier materials include tantalum (Ta) or
titanium (Ti) based barrier materials (e.g., tantalum nitrides
(TaN), tantalum silicon nitrides (TaSiN), or titanium nitrides
(TiN)). Additionally, multi-layer barrier layers can be formed.
Also, graded layer barrier layers 206 can be used. Such layer can
be augmented with other layers that incorporate materials like
magnesium (Mg), palladium (Pd), chromium (Cr), and molybdenum (Mo),
vanadium (V), tungsten (W), or other related materials
Alternatively, barrier layers 206 comprised of silicon carbide
(SiC) and silicon carbon nitride (SiCN) or other like materials can
be used. Such barrier layers 206 can be formed using conventional
approaches. For example a TaN barrier layer 206 can be formed using
physical vapor deposition (PVD) or chemical vapor deposition (CVD)
techniques or even atomic layer deposition (ALD). Commonly, such
layers are formed in the range of about 5 .ANG. to 400 .ANG. thick
with a preferred thickness in the range of in the range of about
150-250 .ANG. thick.
[0031] One of the difficulties in the present art is that such
barrier layers 206 can not be formed without forming a thin barrier
layer 206b on the bottom of the opening 208. It is this bottom
barrier layer 206b that induces much of the voiding problem. Thus,
an advantageous aspect of the invention concerns removing the
bottom portion 206b of the barrier layer 206.
[0032] Typically, the bottom barrier layer 206b is removed by
anisotropically (directionally) etching the substrate. Such
anisotropic etching can be achieved in a number of ways known to
those having ordinary skill in the art. For example, plasma
etching, reactive ion etching (RIE), or ion milling can be used.
One preferred etch chemistry used to remove the bottom barrier
layer 206b includes etchants chosen from among the carbon fluoride
family of etchants (e.g., C.sub.xH.sub.yF.sub.z). For example,
CF.sub.3H and CF.sub.4 are suitable etchants. Additionally, sulfur
fluoride (SF.sub.x) etchants such as SF.sub.6 are also
satisfactory. Moreover, boron chloride etchants (e.g., BCl.sub.3 as
well as others) can be used in embodiments of the invention.
Additionally, chlorine gases can be used as etchants in accordance
with the principles of the invention. These etchants are flowed
into a suitable process chamber and then ignited to form an etchant
plasma. The substrate is exposed to the etchant plasma until the
bottom barrier layer 206b is removed. It is specifically, pointed
out that these disclosed etchants encompass a wide range of similar
etchants known to persons having ordinary skill in the art that are
suitable for removing the bottom barrier layer 206b.
[0033] Many different tools can be employed to accomplish the many
operations of the disclosed process. FIG. 2(b) illustrates the
application of an etchant plasma 207 being directed vertically onto
the substrate 200. Particularly, the etchant plasma 207 is directed
vertically onto the bottom barrier layer 206b. One example of a
suitable tool is an Endura 5500 PVD tool manufactured by Applied
Materials, Inc. of Santa Clara, Calif. In one implementation, the
following process parameters can be used to anisotropically remove
the bottom barrier layer 206b. Such a process operates in a plasma
operating at relatively low pressure. Such plasma is generated at a
power in the range of about 200-2000 W and a pressure of less than
75 mTorr, preferably less than about 20 mTorr and still more
preferably, operating in the range of about 0.05 mTorr to about 7
mTorr. Moreover, a relatively high wafer bias, in the range of
about 50 volts (V) to about 400 volts should be used to effectively
remove the material of the bottom barrier layer 206b. One preferred
implementation uses a power of about 200 W at about 7 mTorr with a
wafer bias of about 50V. Under such conditions a TaN bottom barrier
layer 206b of about 150 .ANG. thick can be removed in about 30 s
(seconds). The inventors point out that the aforementioned
parameters and specific applications are given merely as an example
that illustrates much wider principles of operation.
[0034] FIG. 2(c) the intended effect of the previously described
anisotropic etching. Such anisotropic etching removes the bottom
barrier layer 206b, exposing a portion of the underlying conducting
layer 204. The exposed conducting surface 204s is now in readiness
for copper interconnect formation.
[0035] Referring to FIG. 2(d) a copper-containing material is
formed in the opening to create a conductive plug 210. The
processes for forming such copper-containing plugs 210 are well
known. For example, a thin seed layer of copper material can be
formed on the barrier layer 206 in the opening 208. This is
followed by the bulk deposition of a much thicker copper layer of
copper material.
[0036] A suitable method for forming a copper seed layer is
disclosed in U.S. Pat. No. 6,037,258 to Liu, et al. entitled
"Method of Forming a Smooth Copper Seed Layer for a Copper
Damascene Structure", which is hereby incorporated by reference. In
one embodiment, the seed layer 202 can be formed by deposition
using PVD techniques. One suitable process employs a PVD machine
(e.g., the Endura 5500) at a power in the range of about 10-100 kW
at a pressure of about 0.05 mTorr to about 5 mTorr. This seed layer
is formed to a thickness of about 50-100 .ANG..
[0037] The bulk copper layer is formed over the copper seed layer.
The bulk copper layer is typically formed using bulk deposition
techniques like electroplating. One suitable embodiment for forming
the bulk copper barrier layer uses electroplating. An example
process employs an Applied Materials Electra ECP machine using a
copper sulfate solution having a plating current of about 10 A/cm
to 100 A/cm. The bulk copper layer 203 is plated until the opening
171 is filled.
[0038] Other copper deposition techniques can be used as well. The
final structure should demonstrate good electrical contact between
the plug 210 and the underlying conducting layer 204 at the
interface 211 between the plug 210 and the underlying conducting
layer 204. Moreover, there is no barrier layer at the interface 211
between the plug 210 and the underlying conducting layer 204.
Typically, once the plug 210 is formed it is subjected to chemical
mechanical planarization (CMP) to form the depicted structure
[0039] The structure depicted in FIG. 2(d) can be subjected to
further processing to create additional layers if desired. For
example, another barrier layer (or capping layer) can be formed
over the structure depicted in FIG. 2(d) and another ILD can be
formed. Further vias and conducting lines can also be formed. It
should be readily appreciated by those having ordinary skill in the
art that other conductive structures including, but not limited to:
interconnects, trenches, trenches overlying vias, contacts and the
like, can be constructed using the principles of the present
invention.
[0040] FIGS. 3(a)-3(d) depict a slightly different embodiment than
that depicted in FIGS. 2(a)-2(d). FIG. 3(a) depicts a suitable
substrate in readiness for the formation of an improved
via/interconnect structure. The substrate 300 is similar to that
depicted in FIG. 2(a). The substrate includes a conducting layer
204 formed thereon. Such conducting layers 204 are typically formed
of copper-containing materials as described hereinabove with
respect to FIGS. 2(a)-2(d). As above, an insulating layer 203 is
formed on the substrate surface. The insulating layer 203 is formed
over the conducting layer 204. As above, the insulating layer 203
can be formed of a wide range of electrically insulating materials
including low-K dielectric materials. Also as above, openings 308
are formed in the insulating layer 203 using methodologies well
known to those having ordinary skill in the art. The openings
expose a portion 304b of the underlying conducting layer 204. Also
as previously disclosed, in many applications, prior to the
formation of a barrier layer the substrate can be pre-cleaned to
remove native oxides. Such pre-cleaning is conducted as described
above.
[0041] With reference to FIG. 3(b), a non-uniform layer of barrier
layer 306 is formed on the surface of the substrate 300. In
particular, the non-uniform barrier layer 306 is formed on the
bottom surface of the opening 306b (i.e., on the exposed portion of
the conducting layer 204) and on the sidewalls 306s of the opening.
In particular, the non-uniform barrier layer 306 is formed having a
greater thickness on top of the substrate (e.g., on the insulating
layer 203, such layer not being shown here) than on the bottom
surface of the opening 306b. Also, the layer thickness on the
sidewalls 306s is greater than the thickness of the bottom surface
of the opening 306b. Heretofore, conventional processes expended
great effort to avoid this non-uniformity in barrier layers.
However, the prior art has not contemplated the advantages
obtainable using such a non-uniform barrier layer.
[0042] A non-uniform barrier layer 306 can be formed on the
substrate using a number of methodologies known to those having
ordinary skill in the art. A few suitable examples are now
disclosed. The barrier layer 306 is formed so that the bottom 306b
is thinner than the sidewalls 306s or the top surfaces (not shown
here). Typical barrier materials include tantalum (Ta) or titanium
(Ti) based barrier materials (e.g., tantalum nitrides (TaN),
tantalum silicon nitrides (TaSiN), or titanium nitrides (TiN)).
Additionally, multi-layer barrier layers can be formed. Also,
graded layer barrier layers 306 can be used. Such layer can be
augmented with other layers that incorporate materials like
magnesium (Mg), palladium (Pd), chromium (Cr), and molybdenum (Mo),
vanadium (V), tungsten (W), or other related materials
Alternatively, barrier layers 206 comprised of silicon carbide
(SiC) and silicon carbon nitride (SiCN) or other like materials can
be used. Such barrier layers 206 can be formed using conventional
approaches.
[0043] In one preferred embodiment, a tantalum based barrier layer
306 is formed using a uni-directional PVD process. A PVD tool such
as an Endura manufactured by Applied Materials, Inc. of Santa
Clara, Calif. can be used to obtain a suitable barrier layer 306.
For example, a tantalum barrier layer 306 can be formed by placing
a substrate in a process chamber and then flowing argon (Ar) into
the chamber. The Ar is igniting into plasma and used to sputter
tantalum off a tantalum target. The sputtered tantalum 350 is
directed by a bias voltage onto the substrate. In order to enhance
the non-uniform distribution of material onto the surfaces of the
opening 308, the tantalum is directed onto the substrate at a
deposition angle .theta. (which is other than perpendicular to the
surface). Although, many different deposition angles are possible,
preferred angles are in the range of about 10 degrees (.degree.) to
about 80.degree.. Such deposition angles .theta. can be achieved by
many different approaches known to persons having ordinary skill in
the art. For example, the magnetic fields of the deposition chamber
can be adjusted so that a desired deposition angle .theta. can be
achieved. Thus, a unidirectional deposition of tantalum (or other
selected barrier material) can be accomplished. To form a barrier
layer 306 on all sides of the opening 308 the substrate can be
rotated which the deposition angle .theta. remains constant. This
causes a relatively even axial deposition of tantalum. However, the
same process results in a non-uniform distribution of material
occurring such that barrier material at the bottom of the opening
(e.g., 306b) is relatively thinner than the barrier material formed
on the sidewalls (e.g., 306s). This non-uniform distribution of
barrier layer thickness is what is meant by a non-uniform barrier
layer 306. For example, in one implementation, the thickness of the
barrier layer 306 on the surface of the insulating layer 203 (not
shown here) can be about 1500 .ANG. thick and a corresponding
sidewall 306s thickness can be in the range of about 400-800 .ANG.
thick and a corresponding bottom layer 306b thickness can be in the
range of about 100-200 .ANG. thick. Thus, the bottom can be made
very thin while still forming an effective barrier layer on the
sidewalls 306s. Such a configuration can be achieved using an
Endura PVD tool operating a power range of about 1000-24,000 W
(target power). As Ar is flowed onto the chamber it is ignited into
a plasma which sputters a tantalum target. Such process occurs at a
pressure of less than about 20 mTorr, preferably operating in the
range of about 0.5 mTorr to about 5 mTorr. The substrate can be
lightly biased, in the range of about 50 W to about 500 W to direct
the tantalum onto the substrate. As explained, in some embodiments
magnetic fields can be used to achieve a desired deposition angle
for the tantalum. Additionally, N.sub.2 can be flowed into the
chamber to form a barrier layer that comprises tantalum nitride
material. Many other materials can be used and uni-directionally
deposited to achieve a non-uniform barrier layer 306 being thinner
of the sides and the top than on the bottom. One preferred
implementation deposits a tantalum barrier layer 306 using a power
of about 24,000 W at about 1.6 mTorr with a bias of about 300 W.
Under such conditions a 150 .ANG. thick TaN bottom barrier layer
306b can be formed in about 120 s (seconds). The inventors point
out that the aforementioned parameters and specific applications
are given merely as an example that illustrates much wider
principles of operation.
[0044] Referring to FIG. 3(c), the bottom portion of the
non-uniform barrier layer 306 is removed to expose the underlying
metal layer 304b. As previously disclosed, the preferred approach
for removing the bottom barrier layer 306b is by anisotropically
(directionally) etching the substrate. As explained above,
anisotropic etching can be achieved in a number of ways known to
those of ordinary skill in the art. For example, plasma etching,
reactive ion etching (RIE), or ion milling can be used. The same
etchants and process operations as disclosed hereinabove can be
used.
[0045] The substrate is exposed to a directional flow of etchants
307 until the bottom barrier layer 306b is removed. As before, the
intended effect of the anisotropic etching is to remove the bottom
barrier layer 306b, exposing a portion 304b of the underlying
conducting layer 204. This exposed conducting surface 304b is now
in readiness for copper interconnect formation.
[0046] Referring to FIG. 3(d) a copper-containing material is
formed in the opening to create a conductive plug 310. As explained
above, the processes for forming such copper-containing plugs 310
are well known. For example, a thin seed layer of copper material
can be formed inside the opening and then the seed layer is treated
to achieve the bulk deposition off copper materials to form the
plug 310 in the opening.
[0047] FIGS. 4(a)-4(d) illustrate another approach for
anisotropically etching away of a bottom portion of a barrier layer
and the subsequent formation of an improved copper interconnect.
Referring to FIG. 4(a), a substrate is formed similar to those
previously described (e.g., as in FIGS. 2(a) or 3(b)). The
substrate 400 includes a conducting layer 204 formed thereon. As
before, the conducting layers 204 are typically formed of
copper-containing materials as described hereinabove. Also as
above, an insulating layer 203 is formed on the substrate surface.
Also as above, openings 408 are formed in the insulating layer 203
using methodologies well known to those having ordinary skill in
the art. The openings expose a portion 404b of the underlying
conducting layer 204. Also as previously disclosed, a barrier layer
406 is formed on the substrate. Processes for forming such layers
are as described as in FIGS. 2(a)-2(d) or FIGS. 3(a)-3(d) can be
used. Also, as is known to persons having ordinary skill in the
art, many other methods of forming such barrier layers can be used.
A non-uniform barrier layer 406 is preferred (but not required) due
to the ability to form very thin bottom barrier layers.
[0048] Referring to FIG. 4(b), the barrier layer 406 of the
substrate 400 is then exposed to a flood ion beam 407 to
anisotropically remove the bottom layer 406b of the barrier layer.
Such a flood ion beam can be used to sputter material off the
bottom of the openings. Such a methodology can be achieved using,
for example, a High Density Plasma Flood System such as
manufactured by Applied Materials, Inc. of Santa Clara, Calif. For
example, such a system can use an energized argon (Ar) gas to
produce an Ar plasma which is directed onto the substrate. Using
ion densities in the range of about 1.times.10.sup.16 to about
2.times.10.sup.20 ions per m.sup.2 suitable barrier layer removal
can be achieved at the bottom of the opening to expose the
underlying conducting layer 204. Suitable plasma energies are in
the range of about 5 eV to about 50 eV for Ar plasma, and about 2
eV to about 50 eV for electrons.
[0049] Such a process can be used to produce a substrate similar to
that depicted in FIG. 4(c). Such substrate can be cleaned to remove
oxides and then treated to form an interconnect structure. As
explained above, the processes for forming such interconnect
structures are well known. For example, a thin seed layer of copper
material can be formed inside the opening and then the seed layer
is treated to achieve the bulk deposition off copper materials to
form the interconnect in the opening. This structure can be used to
form vias as well as many other structures. Reference to FIG. 4(d)
shows a copper plug 410 filling the opening to comprise an
interconnect via. No barrier material is present at the interface
412 between the interconnect plug 410 and the underlying conducting
layer 204. Such a structure has a superior electromigration
lifetime and improved resistance to void induced circuit
failure.
[0050] Referring to FIG. 5, a semiconductor wafer is depicted.
Typically, such wafers 501 having a multiplicity of integrated
circuits (chips) 502 formed thereon. Each chip has many different
types of circuit structures formed thereon. Accordingly, each chip
502 can include structures as depicted FIGS. 2, 3, and 4
(schematically depicted here as interconnect 503) as part of its
structure.
[0051] FIG. 6 shows a flow diagram that depicts one embodiment of
the above-described process. The method embodiment of FIG. 6 can be
used to construct copper interconnects that are resistant to void
induced failure and have longer electromigration lifetimes than
conventional interconnects. The method involves providing a
substrate having suitable substrate (Step 601). Such a substrate
includes a conductive layer comprising a copper-containing material
and having an insulating layer formed thereon. The insulating layer
has openings that expose portions of the underlying conductive
layer at the bottom of the openings. A barrier layer is then formed
on the substrate (Step 603). Such barrier layers cover the
insulating layer and the exposed portion of the conductive layer.
Methods of forming such barrier layers are well described herein.
Such layers include, but are not limited to, the non-uniform
barrier layers described herein. The barrier layer at the bottom of
the openings is then removed to expose the underlying conductive
layer (Step 605). Such barrier layer removal is typically
accomplished using anisotropic material removal processes (e.g.,
etch techniques) but is not limited to such. Conductive plugs are
formed in the opening such that the bottom of the plug is in
contact with the exposed conductive layer (Step 607). The present
invention further covers semiconductor devices formed by the above
method.
[0052] The present invention has been particularly shown and
described with respect to certain preferred embodiments and
specific features thereof. However, it should be noted that the
above-described embodiments are intended to describe the principles
of the invention, not limit its scope. Therefore, as is readily
apparent to those of ordinary skill in the art, various changes and
modifications in form and detail may be made without departing from
the spirit and scope of the invention as set forth in the appended
claims. Other embodiments and variations to the depicted
embodiments will be apparent to those skilled in the art and may be
made without departing from the spirit and scope of the invention
as defined in the following claims. In particular, it is
contemplated by the inventors that barrier layers in accordance
with the principles of the present invention can be practiced with
a number of different materials and formed by a wide variety of
methods. Further, reference in the claims to an element in the
singular is not intended to mean "one and only one" unless
explicitly stated, but rather, "one or more". Furthermore, the
embodiments illustratively disclosed herein can be practiced
without any element which is not specifically disclosed herein.
* * * * *