U.S. patent application number 10/417263 was filed with the patent office on 2004-10-21 for modularized probe card with coaxial transmitters.
Invention is credited to Cheng, S. J., Lee, Y. J., Liu, An-Hong, Tseng, Yuan-Ping, Wang, Yeong-Her.
Application Number | 20040207420 10/417263 |
Document ID | / |
Family ID | 33158859 |
Filed Date | 2004-10-21 |
United States Patent
Application |
20040207420 |
Kind Code |
A1 |
Cheng, S. J. ; et
al. |
October 21, 2004 |
MODULARIZED PROBE CARD WITH COAXIAL TRANSMITTERS
Abstract
A modularized probe card with coaxial transmitter is disclosed.
At least a coaxial transmitter is modularized and installed between
a first printed circuit board and a second printed circuit board.
The coaxial transmitter has a first connector and a second
connector correspondingly connecting two ends of each coaxial cable
of the coaxial transmitter for electrically connecting
corresponding in location to first printed circuit board and second
printed circuit board. A probe head is bonded on second printed
circuit board. The second connector of the coaxial transmitter is
connected with the second printed circuit board in a plug-in and
pull-away type.
Inventors: |
Cheng, S. J.; (Hsinchu,
TW) ; Liu, An-Hong; (Tainan, TW) ; Wang,
Yeong-Her; (Tainan, TW) ; Tseng, Yuan-Ping;
(Hsinchu, TW) ; Lee, Y. J.; (Tainan, TW) |
Correspondence
Address: |
DENNISON, SCHULTZ, DOUGHERTY & MACDONALD
1727 KING STREET
SUITE 105
ALEXANDRIA
VA
22314
US
|
Family ID: |
33158859 |
Appl. No.: |
10/417263 |
Filed: |
April 17, 2003 |
Current U.S.
Class: |
324/754.07 |
Current CPC
Class: |
G01R 31/2889
20130101 |
Class at
Publication: |
324/755 |
International
Class: |
G01R 031/02 |
Claims
1. A modularized probe card with coaxial transmitter comprising: a
first printed circuit board having a plurality of first connecting
devices; a second printed circuit board having a plurality of
second connecting devices; a probe head combining and electrical
connecting to the second printed circuit board, and mounting with a
plurality of probing points on one surface for probing
semiconductor wafers; and at least a coaxial transmitter comprising
a first connector, a second connector and a plurality of coaxial
cables, wherein the first connector is fastened and combined with
one ends of the coaxial cables for connecting the first connecting
devices of the first printed circuit board, and the second
connector is fastened and combined with the other ends of the
coaxial cables for connecting the second connecting devices of the
second printed circuit board in a plug-in and pull-away type.
2. The modularized probe card with coaxial transmitter according to
claim 1, wherein the coaxial transmitter is installed between the
first and the second printed circuit board.
3. The modularized probe card with coaxial transmitter according to
claim 2, further comprising a shell fastening the first printed
circuit board and the second printed circuit board for
accommodating the coaxial transmitter.
4. The modularized probe card with coaxial transmitter according to
claim 1, wherein the arrangement density of the second connecting
devices of the second printed circuit board is higher than that of
the first connecting devices of the first printed circuit
board.
5. The modularized probe card with coaxial transmitter according to
claim 1, wherein the first connector of the second connector is
plug connector.
6. The modularized probe card with coaxial transmitter according to
claim 5, wherein the first connector or the second connector
comprises pins.
7. The modularized probe card with coaxial transmitter according to
claim 6, wherein the pins are arrayed in zigzag format.
8. The modularized probe card with coaxial transmitter according to
claim 1, wherein the second printed circuit board has a slot to
connect with a probe head.
9. The modularized probe card with coaxial transmitter according to
claim 1, wherein the probe head electrically connects to the second
printed circuit board via flexible printed circuits.
10. The modularized probe card with coaxial transmitter according
to claim 1, wherein the probe head is a silicon substrate or a
ceramic wiring board.
11. The modularized probe card with coaxial transmitter according
to claim 1, wherein the probing point are pins or bumps.
Description
FIELD OF THE INVENTION
[0001] The present invention relates to a probe card for testing
semiconductor wafers and, more specifically, to a modularized probe
card with coaxial transmitters.
BACKGROUND OF THE INVENTION
[0002] After fabrication, semiconductor devices will need to pass
functional test to verify their electrical performance within
design specification. The test apparatus for chip probing usually
comprises a probe card with a plurality of probe needles for
contacting with electrodes, such as bond pads or bumps, of a
wafer.
[0003] A conventional improved probe card mainly comprises a
substrate with a top and a bottom side. Both sides of the substrate
are formed with a large ground plane and a plurality of contact
points, wherein the ground plane is soldering with outer shields of
coaxial cables to provide ground and shielding. The contact points
provide electrical connections with a tester. The top side of the
substrate is formed with a plurality of soldering points to solder
a plurality of probe needles. A plurality of coaxial cables provide
electrical connections between probe soldering points and contact
points. The coaxial cable provides electrical connection
respectively, therefore, it not only acquires more time in
manufacturing rectangular probe card, but also comes up with the
problem of improper connections or miss wiring between coaxial
cables.
[0004] Furthermore, in U.S. Pat. No. 4,731,577 entitled "COAXIAL
PROBE CARD", a multipoint microwave coaxial probe card is
disclosed. A printed circuit board has edge connectors and a
mounting ring attached to the surface. The mounting ring has a
plurality of holes, and each is assembled with a microwave
connector. These microwave connectors electrically connect to probe
needles by coaxial cables. A portion of the probe needles are
joined to the edge connector by insulated wires allowing both high
and low frequency signals to be utilized simultaneously.
Furthermore, a shield in the form of a flat plate, with a cover,
encloses the ring and provides RFI and EMI shielding, and allows
the coaxial probe card to test the microwave semiconductor wafers.
However, non-modularized coaxial probe card is not easily to be
detached and assembled, and therefore it is difficult to repair
once malfunction occurs.
SUMMARY OF THE INVENTION
[0005] A main purpose of the present invention is to supply a
modularized probe card with coaxial transmitters. At least a
coaxial transmitter is modularized and installed between a first
printed circuit board and a second printed circuit board. When it
requires to test another semiconductor devices with same electrical
function yet different pad distribution, the whole probe card can
be reused except the probe head. A new probe head corresponding to
the semiconductor devices manufactured and assembled to the second
printed circuit board to save the cost of manufacturing a new probe
card.
[0006] A second purpose of the present invention is to supply a
modularized probe card with coaxial transmitters with both ends of
each coaxial cable connecting to plug-in and pull-away type
connectors. These connectors are used to collect and fasten coaxial
cables of coaxial transmitters, and to electrically connect with
the first and second printed circuit boards. This will eliminate
the problem of improper connections for individual coaxial cables,
and reduce the assembly time of a probe card.
[0007] A third purpose of the present invention is to supply a
modularized probe card with coaxial transmitters installing at
least a coaxial cable. The coaxial cable is easily to be replaced
with new one and thus to ensure that coaxial cable is always in
good electrical function. Furthermore, miss wiring could be
eliminated and it is easy to repair the probe card once malfunction
occurs.
[0008] The modularized probe card with coaxial transmitters
according to the present invention comprises at least a coaxial
transmitter, a first printed circuit board, a second printed
circuit board, and a probe head. Wherein the coaxial transmitter is
composed of a first connector, a second connector and a plurality
of coaxial cables. It is modularized and installed between the
first and the second printed circuit board, as a transmitting route
for probing wafers. One ends of the coaxial cables are connected to
the first connector, and correspondingly connected to the first
connecting devices of first printed circuit board. The other ends
of the coaxial cables are connected to the second connector, and
correspondingly connected to the second connecting devices of
second printed circuit board in a plug-in and pull-away type. The
probe head is mounted and electrically connected to the second
printed circuit board, and forming with a plurality of probes for
contacting semiconductor wafers.
DESCRIPTION OF THE DRAWINGS
[0009] FIG. 1 is a cross-sectional view of a modularized probe card
with coaxial transmitters in accordance with the first embodiment
of the present invention.
[0010] FIG. 2 is a three-dimensional view of the coaxial
transmitters in accordance with the first embodiment of the present
invention.
[0011] FIG. 3 is a partial amplification of the cross-sectional
view of the probe card in accordance with the first embodiment of
the present invention.
[0012] FIG. 4 is a cross-sectional view of a modularized probe card
with coaxial transmitters in accordance with the second embodiment
of the present invention.
[0013] FIG. 5 is a three-dimensional view of the coaxial
transmitters in accordance with the second embodiment of the
present invention.
DETAIL DESCRIPTION OF THE INVENTION
[0014] Please refer to the drawings attached, the present invention
will be described by means of an embodiment below.
[0015] As shown in FIG. 1, in the first embodiment in accordance
with present invention a modularized probe card 100 is used for
installing on a test head 170, and electrically connects to a
tester 180, for electrical contact with semiconductor wafers under
test. The probe card 100 comprises a first printed circuit board
110, a second printed circuit board 120, a probe head 130, and at
least a coaxial transmitter 140. Wherein the first printed circuit
board 110 is functioned as a connection interface between the test
head 170 and the probe card 100, and is able to connect to the
tester 180. A plurality of first connecting devices 111, such as
vias and connecting sockets, are mounted on the first printed
circuit board 110 to plug in the first connector 141 of coaxial
transmitter 140. The inner portion of first printed circuit board
110 has a plurality of circuits (not shown in figure) to provide
electrical connections between the first connecting devices 111 and
test head 170. The second printed circuit board 120 is functioned
as a transmission interface between probe head 130 and the first
printed circuit board 110. The second printed circuit board 120 has
a plurality of second connecting devices 121, such as vias and
sockets, to plug in the second connector 143 of coaxial transmitter
140. In this embodiment, the second connecting devices 121 are
vias. The arrangement density of the second connecting devices 121
on second printed circuit board 120 is higher than that of the
first connecting devices 111 on first printed circuit board 110.
Furthermore, second connecting devices 121 are installed around the
edge of probe head 130, which connects to the second printed
circuit board 120. It is preferable that the second printed circuit
board 120 be arranged with a slot 122 to place and fasten probe
head 130, which may be a silicon substrate or multi-layer ceramic
substrate with a plurality of probing points 132, such as probe
needles or bumps, arranging on the surface 131 to contact with bond
pads of semiconductor wafers. (not shown in figure). In this
embodiment, as shown in FIG. 3, a plurality of contact pads 133,
which electrically connecting to corresponding probing points 132,
are arranging on the edge of surface 131 of probe head 130.
Furthermore, the contact pads 133 are electrically connecting to
the second connection devices 121 of second printed circuit board
120 with electrical connecting devices 150. The electrical
connecting devices 150 could be bonding wires or flexible printed
circuit. In this embodiment, the electrical connecting device 150
is a flexible printed circuit, mainly comprising a flexible
insulation layer 151, such as polyimide. A plurality of metal
traces 152 are formed on one surface of the flexible insulation
layer 151 for electrically connecting with contact pads 133 of
probe head 130 and the second connecting devices 121 of the second
printed circuit board 120. Besides, the traces 152 on the flexible
insulation layer 151 are shielded with a cover layer 153 to
strengthen the structure of electrical connecting device 150.
[0016] In this embodiment, as shown in FIGS. 1 and 2, a plurality
of coaxial transmitters 140 are installed between the first printed
circuit board 110 and the second printed circuit board 120 as a
transmission route for probe card 100 while proceeding electrical
testing. Each of coaxial transmitter 140 comprises a first
connector 141, a second connector 143 and a plurality of coaxial
cables 145. The first connector 141 or second connector 143 could
be a plug-in connector. The coaxial cables 145 effectively prevent
the signal interferences producing according to the Faraday's law,
and completely obstructs cross-talk causing by over-density of
circuits or high frequency testing. In this embodiment, the first
connector 141 and the second connector 143 are shaping as curves,
wherein one surface of first connector 141 is formed with a
plurality of pins 142, which correspondingly connect to coaxial
cables 145 with one end fasten to the first connector 141. The
second connector 143 also has a plurality of pins 144, which
correspondingly connect to coaxial cables 145 with the other end
fasten to the second connector 143. It is preferable that pins 142
or pins 144 be arrayed in zigzag format to allow more of pins 142
and pins 144 be formed on surfaces of the first connector 141 and
second connector 143, and furthermore, the second connector 143 be
connected to the second connecting devices 121 of second printed
circuit board 120 in a plug-in and pull-away type (not connecting
by soldering). When probe card 100 is assembled, first pins 142 of
coaxial transmitters 140 are corresponding in location to the first
connecting devices 111 of first printed circuit board 110, and the
second connector 143 is corresponding in location to the second
connecting devices 121, of second printed circuit board 120; It is
preferable that the first and second printed circuit board 110,120
be fastened by a shell 160 while testing semi-conductor wafers.
[0017] Probe card 100 is assembled to have dual functions for
testing semi-conductor wafers which have same electrical function
yet with different pad distribution. The first printed circuit
board 110 the second printed circuit board 120 and coaxial
transmitters 140 are reusable, and only the probe head 130
corresponding in location to different semi-conductor wafers under
test needs to be manufactured. The probe head 130 can be pulled
away and plugged into the second printed circuit board 120, and
assembled with the first printed circuit board 110 and coaxial
transmitter 140 as mentioned above, to produce a probe card for
different semi-conductor wafers under test. Therefore, its
assembling parts are interchangeable and more flexible in
assemble., Furthermore, the second connector 143 of coaxial
transmitter 140 can be repeatedly pulled away and plugged into the
second printed circuit board 120 which makes it more convenient in
changing and repairing parts. Also, it does not need to connect
coaxial cables one by one, which makes it more easily to assemble,
and thus ensures that the coaxial transmitter 140 in correct
electrical connection and no miss wiring. The coaxial transmitter
140 is modularly installed between the first and second printed
circuit board 110,120, and the first connector 141 and second
connector 143 are utilized so as to acquire fast assembling. It
also makes the repairing and assembling of probe card 100 more
easily and quickly because it does not require to assemble
individual coaxial cables 145 between the first printed circuit
board 110 and second printed circuit board 120. Furthermore,
coaxial cables 145 are positioned by the first connector 141 and
second connector 143, therefore, improper connections or miss
wiring between coaxial cables 145 will not occur.
[0018] The second embodiment in accordance with the present
invention, as shown in FIG. 4, a modularized probe card 200 is
installed on a test head 260 and electrically connecting to a
tester 270 for electrically probing a semi-conductor wafer under
test. Probe card 200 comprises a first printed circuit board 210, a
second printed circuit board 220, a probe head 230 and at least a
coaxial transmitter 240. Wherein the first printed circuit board
210 is formed with a plurality of first connecting devices 211 for
pluging into the first connector 241 of coaxial transmitter 240,
such as PTH type socket connectors. The second printed circuit
board 220 is formed with a plurality of second connecting devices
221, such as slots, for plugging into the second connector 243 of
coaxial transmitter 240. In this embodiment, probe head 230 is a
multi-layer ceramic wiring board connecting to the second printed
circuit board through connecting pads 233. A plurality of probing
points 232 are arranged on a surface 231 of probe head 230 for
probing bonding pads of a semiconductor wafer.
[0019] In this embodiment, as shown in FIGS. 4 and 5, a coaxial
transmitter 240 is installed between the first printed circuit
board 210 and second printed circuit board 220, as an internal
transmitting route for probe card 200. The coaxial transmitter 240
comprises a first connector 241, a second connector 243 and a
plurality of coaxial cables 245. In this embodiment, the first
connector 241 and second connector 243 are shaping as curves,
wherein two ends of each coaxial cable 245 are combined with the
first connector 241 and second connector 243. The second connector
243 is configured for connecting with the second connecting device
221 of the second printed circuit board 220 in plug-in and
pull-away type. While assembling probe card 200, it is to install
the first: connector 241 of coaxial transmitter 240 with the first
connecting device 211 of first printed circuit board 210, and to
install the second connector 243 with the second connecting device
221 of second printed circuit board 220. It is preferable that the
first printed circuit board 210 and second printed circuit board
220 are fastened by a shell 250, and then proceed to test
semiconductor wafers. When probe card 200 needs to test different
semiconductor wafers with same electrical function yet different
pad distribution, its first printed circuit board 210 and the
second printed circuit board 220 and coaxial transmitter 240 are
interchangeable, and only a probe head 230 corresponding in
location to the semiconductor wafer under test needs to be
assembled on the second printed circuit board 220. Therefore, the
parts of a modularized probe card are interchangeable and more
flexible in assembling probe cards and can be reuse for probing
different semiconductor wafers under test.
[0020] Furthermore, coaxial transmitter 240 can be positioning and
assembling quickly by the alignment of the first connector 241 and
second connector 243. Therefore, signal disturbances will not
happen between electrical connections of the first printed circuit
board 210 with second printed circuit board 220, and neither will
improper connections between coaxial cables 245 happen.
[0021] The above description of embodiments of this invention is
intended to be illustrative and not limiting. Other embodiments of
this invention will be obvious to those skilled in the art in view
of the above disclosure.
* * * * *